Microchip Technology A090667 Zigbit Amp 2.4GHz, Unbalanced Output User Manual 8228

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ZigBit™ 2.4 GHz Amplified Wireless Modules
...................................................................................................................
ATZB-A24-UFL/U0
Datasheet
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ZigBit™ 2.4 GHz Amplified Wireless Modules
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Table of Contents
Section 1
1.1
Summary............................................................................................................................ 1-1
1.2
Applications........................................................................................................................ 1-1
1.3
Key Features...................................................................................................................... 1-2
1.4
Benefits .............................................................................................................................. 1-2
1.5
Abbreviations and Acronyms ............................................................................................. 1-2
1.6
Related Documents ........................................................................................................... 1-4
Section 2
2.1
Overview ............................................................................................................................ 2-5
Section 3
3.1
Electrical Characteristics.................................................................................................... 3-7
3.1.1
Absolute Maximum Ratings ................................................................................. 3-7
3.1.2
Test Conditions.................................................................................................... 3-7
3.1.3
RF Characteristics ............................................................................................... 3-8
3.1.4
ATmega1281V Microcontroller Characteristics ................................................... 3-8
3.1.5
Module Interfaces characteristics ........................................................................ 3-8
3.2
Physical/Environmental Characteristics and Outline ......................................................... 3-9
3.3
Pin Configuration ............................................................................................................. 3-10
3.4
Mounting Information ....................................................................................................... 3-14
3.5
Soldering Profile............................................................................................................... 3-14
3.6
Antenna Reference Design.............................................................................................. 3-15
Section 4
4.1
Ordering Information ........................................................................................................ 4-16
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Section 1
Introduction
1.1
Summary
ZigBit™ Am p is an ultra-comp act, extended ran ge, low-power, hig h-sensitivity 2.4GHz
IEEE 802.15.4/ZigBee® OEM module from Atmel. Based on the innovative Atmel's mixed-signal hardware platform, this module is enhanced by an output power amplifier and an input low-noise amplifier,
and is designed for wireless sensing, monitoring & control and data acquisition applications. ZigBit Amp
modules eliminate the need for costly and time-consuming RF development, and shortens time to market for wireless applications with extended range requirements.
Two different versions of ZigBit 2.4 GHz Amplified modules are available: ATZB-A24-UFL with built-in
U.FL antenna connector and the ATZB-A24-U0 with unbalanced RF output. These modules are an addition to the ZigBit family represented by ATZB-24-A2 and ATZB-24-B0. In addition Atmel offer the ZigBit
900 MHz Wireless Module ATZB-900-B0 [2].
1.2
Applications
ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, selforganizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel
offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software
development platform supporting reliable, scalable, and secure wireless applications running on Atmel’s
ZigBit modules. SerialNet allows programming of the module via serial AT-command interface.
The applications include, but are not limited to:
• Building automation & monitoring
•
•
•
•
•
•
•
– Lighting controls
– Wireless smoke and CO detectors
– Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
– Machinery condition and performance monitoring
– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
Automated meter reading (AMR)
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Introduction
1.3
Key Features
•
•
•
•
•
•
•
•
•
•
•
1.4
Benefits
•
•
•
•
•
•
•
•
•
1.5
Ultra compact size (38.0 x 13.5 x 2.0 mm)
High RX sensitivity (-104 dBm)
Outperforming link budget (up to 124 dB)
Up to +20 dBm output power
Very low power consumption:
– < 6 µA in Sleep mode,
– 23 mA in RX mode,
– 50 mA in TX mode
Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)
Wide range of interfaces (both analog and digital):
– 9 spare GPIO, 2 spare IRQ lines
– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)
– UART with CTS/RTS control
– USART
– I2C
– SPI
– 1-Wire
– Up to 30 lines configurable as GPIO
Capability to use MAC address written into EEPROM
IEEE 802.15.4 compliant transceiver
2.4 GHz ISM band
BitCloud embedded software, including serial bootloader and AT command set
Extended range through additional PA and LNA
Ultra low power consumption combined with unprecedented range
Rapid design-in with built-in U.FL connector (ATZB-A24-UFL)
Flexibility in using a different external antenna for every application
Small physical footprint and low profile for optimum fit in even the smallest of devices
Mesh networking capability
Easy-to-use low cost Development Kit
Single source of support for HW and SW
Worldwide license-free operation
Abbreviations and Acronyms
ADC
Analog-to -Digital Converter
API
Application Programming Interface
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
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Introduction
GPIO
General Purpose Input/Output
HAF
High Frequency
HVAC
Heating, Ventilating and Air Conditioning
HW
Hardware
IC
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electrionics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
LNA
Low Noise Amplifier
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit
module
NRE
Network layer
OEM
Non-Recurring Engineering
OTA
Over-The-Air upgrade
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SPI
Serial Peripheral Interface
SW
Software
TTM
Time To Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ZDK
ZigBit Development Kit
ZigBee,
ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
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Introduction
1.6
Related Documents
[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-B0/A2. Product datasheet. Atmel’s doc8226.pdf
[2]. ZigBit™ 700/800/900 MHz Wireless Modules ATZB-900-B. Product datasheet. Atmel’s doc8227.pdf
[3] ZigBit™ Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~01
[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F
AVR 04/06
[5] Atmel Low-Power Transceiver for ZigBee Applications. AT86RF230 datasheet. doc5131.pdf
[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf
[7] ZigBit™ Amp Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~02
[8] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium
Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area
Networks (LR-WPANs)
[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[10] BitCloud™ IEEE 802.15.4/ZigBee Software. Product User Guide. Atmel’s doc8199.pdf
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Section 2
Zigbit™ Module Overview
2.1
Overview
ZigBit™ Amp is an extended-range, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module,
which occupies less than a square inch of space. Based on a solid combination of Atmel's latest MCU
Wireless hardware platform, power amplifier and low-noise amplifier, the ZigBit Amp offers an
unmatched combination of superior radio performance, ultra-low power consumption and exceptional
ease of integration.
Figure 2-1.
ATZB-A24-UFL/UN
0 Block Diagram
VCC (1.8 - 3.6V)
IRQ
UART
USART/SPI
I2C
JTAG
ANALOG
PA
AT86RF230
RF
Transceiver
ATmega1281
GPIO
Antenna
RF
I/O
SW
SW
LNA
SPI Bus
ZigBit Amp modules contains Atmel's ATmega1281V Microcontroller [4] and AT86RF230 RF Transceiver [5]. The module features 128K bytes flash memory and 8K bytes RAM.
The compact all-in-one-chip integration of output Power Amplifier and input Low-Noise Amplifier, along
with RF switches enables digital control of an external RF front-end to dramatically improve ZigBit's
range performance on signal transmission and increase its sensitivity. This ensures stable connectivity
with larger coverage area without significant increase in module size. The HF U.FL coaxial connector [6]
used in the ATZB-A24-UFL module enables the user to choose appropriate external antenna for every
type of application.
ZigBit Amp already contains a complete RF/MCU design with all the necessary passive components
included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. Compared to a custom RF/MCUsolution, a module-based solution offers considerable
savings in development time and NRE cost per unit during the design, prototyping, and mass production
phases of product development.
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Zigbit™ Module Overview
To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and development tools. The new ZigBit Amp Development Kit [7] (ATZB-DK-A24) comes with everything you need to
create custom applications featuring ZigBit Amp module.
The kit features MeshBean development boards with an easy-to-access extension connector for attaching third party sensors and other peripherals, and a JTAG connector for easy application uploading and
debugging.
The kit also includes reference applications to speed up application development, source code for hardware interface layer and reference drivers for the all the module interfaces, intuitive development
environment from Atmel, and comprehensive set of application notes and product tutorials.
ZigBit Amp modules comes bundled with BitCloud, a 2nd generation embedded software stack from
Atmel. BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [7], [8], [9], and it provides an augmented set of APIs which, while maintaining 100% compliance with
the standard, offer extended functionality designed with developer's convenience and ease-of-use in
mind.
Depending on end-user design requirements, ZigBit Amp can operate as a self-contained sensor node,
where it would function as a single MCU, or it can be paired with a host processor driving the module
over a serial interface. In the former case, a user application may be used with the BitCloud software
allowing customization of embedded applications through BitCloud's C API.
In the latter case, the host processor controls data transmission and manages module peripherals via an
extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful
module design-in. Additionally, third-party sensors can be connected directly to the module, thus
expanding the existing set of peripheral interfaces.
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Section 3
Specifications
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1. Absolute Maximum Ratings(1)(2)
Parameters
Min
Max
Voltage on any pin, except RESET with respect to Ground
-0.5V
VCC + 0.5V
DC Current per I/O Pin
40 mA
DC Current DVCC and DGND pins
300 mA
Input RF Level
+5 dBm
Notes:
1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond
those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Attention! ZigBit AMP is an ESD-sensitive device. Precaution should be taken when handling the
device in order to prevent permanent damage.
3.1.2
Test Conditions
Table 3-2. Test conditions (unless otherwise stated) F = 2.45 GHz, VCC = 3V, Tamb = 25°C
Parameters
Supply Voltage, VCC
Current Consumption: RX mode
(1)
Current Consumption: TX mode
Current Consumption: Power-save mode
Notes:
(1)
Range
Unit
3.0 to 3.6
23
mA
50
mA
<6
µA
1. The parameters are measured under the following conditions:
a) RMS, BitCloud Software is running at 4 MHz clock rate, DTR line management is turned off
b) All interfaces are set to the default state (see Pin Assignment Table)
c) Output TX power (when measuring consumption in TX mode) is +20dBm
d) JTAG is not connected
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Specifications
Current consumption actually depends on multiple factors, including but not limited to, the board design
and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on
MCU load and/or peripherals used by an application.
3.1.3
RF Characteristics
Table 3-3. RF Characteristics
Parameters
Condition
Frequency Band
Unit
2.4000 to 2.4835
GHz
Numbers of Channels
16
Channel Spacing
MHz
Adjusted in 16 steps
+10 to +20
dBm
PER = 1%
-104
dBm
250
kbps
Unbalanced output
50
Ω
With external 2.2 dBi
antenna
Up to 4000
Condition
Range
Unit
128K
bytes
On-chip RAM size
8K
bytes
On-chip EEPROM size
4K
bytes
MHz
Range
Unit
38.4
kbps
10/200
Bits/µs
>1
MΩ
1.0 to VCC - 3
0 - VREF
Transmitter Output Power
(1)
Receiver Sensitivity
On-Air Data Rate
TX Output/ RX Input Nominal Impedance
Range, outdoors
Note:
3.1.4
Range
1. Preliminary data
ATmega1281V Microcontroller Characteristics
Table 3-4. ATmega1281V Characteristics
Parameters
On-chip Flash Memory size
Operation Frequency
3.1.5
Module Interfaces characteristics
Table 3-5. Module Interfaces characteristics
Parameters
Condition
UART Maximum Baud Rate
ADC Resolution/ Conversion Time
ADC Input Resistance
ADC Reference Voltage (VREF)
ADC Input Voltage
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Specifications
Table 3-5. Module Interfaces characteristics
Parameters
Condition
I C Maximum Clock
GPIO Output Voltage (High/Low)
-10/ 5 mA
Real Time Oscillator Frequency
3.2
Range
Unit
222
kHz
2.3/ 0.5
32.768
kHz
Physical/Environmental Characteristics and Outline
Parameters
Size
Operating Temperature Range
Operating Relative Humidity Range
Note:
Value
Comments
38.0 x 13.5 x 2.0 mm
ATZB-A24-UFL/U0
-20°C to +70°C
-40°C to +85°C operational(1)
no more than 80%
1. Minor degration of clock stability may occur.
Figure 3-1.
ATZB-A24-UFL/U0 Mechanical drawing
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Specifications
3.3
Pin Configuration
Figure 3-2.
ATZB-A24-UFL Pinout
Figure 3-3.
ATZB-A24-U0 Pinout
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Specifications
Table 3-6. Pin descriptions
Connector
Pin
Pin Name
Description
SPI_CLK
SPI_MISO
SPI_MOSI
GPIO0
I/O
Reserved for stack operation
(4)
Reserved for stack operation
(4)
I/O
Reserved for stack operation
(4)
I/O
Default
State after
Power on
General Purpose digital Input/Output 0
(2)(3)(4)(7)
I/O
tri-state
(2)(3)(4)(7)
I/O
tri-state
tri-state
GPIO1
General Purpose digital Input/Output 1
GPIO2
General Purpose digital Input/Output 2(2)(3)(4)(7)
I/O
OSC32K_OUT
32.768 kHz clock output(4)(5)
(4)
RESET
9,22,23
DGND
Digital Ground
10
CPU_CLK
RF clock output. When module is in active state, 4
MHz signal is present on this line. While module is
in the sleeping state, clock generation is also
stopped(4).
11
I2C_CLK
I2C Serial clock output(2)(3)(4)(7)
tri-state
I/O
tri-state
tri-state
tri-state
12
I2C_DATA
13
UART_TXD
Reset input (active low)
I C Serial data input/output
(2)(3)(4)(7)
UART receive input(1)(2)(3)(4)(7)
14
UART_RXD
15
UART_RTS
RTS input (Request to send) for UART hardware
flow control. Active low(2)(3)(4)(7)
tri-state
16
UART_CTS
CTS output (Clear to send) for UART hardware
flow control. Active low(2)(3)(4)(7)(8)
tri-state
17
GPIO6
General Purpose digital Input/Output 6(2)(3)(4)(7)
I/O
tri-state
18
GPIO7
(2)(3)(4)(7)
General Purpose digital Input/Output 7
I/O
tri-state
19
GPIO3
General Purpose digital Input/Output 3(2)(3)(4)(7)
I/O
tri-state
20
GPIO4
General Purpose digital Input/Output 4(2)(3)(4)(7)
I/O
tri-state
GPIO5
(2)(3)(4)(7)
General Purpose digital Input/Output 5
I/O
tri-state
24,25
D_VCC
(9)
26
JTAG_TMS
21
27
28
29
30
31
JTAG_TDI
JTAG_TDO
JTAG_TCK
ADC_INPUT_3
ADC_INPUT_2
UART transmit output
(1)(2)(3)(4)(7)
Digital Supply Voltage (VCC)
JTAG Test Mode Select(2)(3)(4)(6)
(2)(3)(4)(6)
JTAG Test Data Input
JTAG Test Data Output
JTAG Test Clock
(2)(3)(4)(6)
(2)(3)(4)(6)
ADC Input Channel 3
(2)(3)(7)
tri-state
ADC Input Channel 2
(2)(3)(7)
tri-state
ADC Input Channel 1
(2)(3)(7)
tri-state
32
ADC_INPUT_1
33
BAT
ADC Input Channel 0, used for battery level
measurement. This pin equals VCC/3.(2)(3)(7)
tri-state
34
A_VREF
Input/Output reference voltage for ADC
I/O
tri-state
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Table 3-6. Pin descriptions
Default
State after
Power on
Connector
Pin
Pin Name
Description
35
AGND
Analog ground
36
GPIO9/1_WR
General Purpose digital input/output 9 /
1-wire interface(2)(3)(4)(7)
I/O
37
UART_DTR
DTR input (Data Terminal Ready) for UART.
Active low(2)(3)(4)(7)
tri-state
38
USART0_RXD
USART/SPI Receive pin(2)(3)(4)(7)
tri-state
39
USART0_TXD
(2)(3)(4)(7)
tri-state
40
USART0_EXTCLK
USART/SPI External Clock(2)(3)(4)(7)(11)
I/O
tri-state
41
GPIO8
General Purpose Digital Input/Output
42
IRQ_7
USART /SPI Transmit pin
I/O
I/O
tri-state
(2)(3)(4)(7)
tri-state
(2)(3)(4)(7)
tri-state
Digital Input Interrupt request 7
43
IRQ_6
44,45,51,52,
53,56,57
DGND
Digital ground
46,47
VRR
Receiver supply voltage(9)
48,50
RF GND
RF Analog Ground(2)(3)(4)(7)
49
RFP_IO
Differential RF Input/Output(10)
54,55
Notes:
VTT
Digital Input Interrupt request 6
Transmitter supply voltage
I/O
(9)
1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system
containing ZigBit Amp as its RF terminal unit), while UART_RXD pin, vice versa is for output.
2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in
details in the ATmega1281V Datasheet [3].
3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin
drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [3]).
4. All digital pins are provided with protection diodes to D_VCC and DGND
5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is
used by BitCloud. However, this signal can be used if another peripheral or host processor requires
32.768 kHz clock, otherwise this pin can be disconnected.
6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and
flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.
7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:
GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK, I2C_DATA,
UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1,
BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four
JTAG lines can be programmed with software as GPIO as well, but this requires changing the fuse bits
and will disable JTAG debugging.
8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus providing mechanism for power management of host processor. If this function is necessary, connection of
this pin to external pull-down resistor is recommended to prevent the undesirable transients during
module reset process.
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Specifications
9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as
shown below.
10. Pins 48, 49 and 50 are featured for ATZB-A24-U0 module only.
11. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or
output pin.
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Specifications
3.4
Mounting Information
The below diagrams show the PCB layout recommended for ZigBit Amp module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to pins thus minimizing
inductance and preventing both mismatch and losses.
Figure 3-4.
3.5
ATZB-A24-UFL/U0 PCB Recommended Layout, Top View
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.
Table 3-7. Soldering profile(1)
Note:
Profile Feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat tempearture 175°C ± 25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minuts max
1. The package is backward compatible with PB/Sn soldering profile.
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Specifications
3.6
Antenna Reference Design
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.
General Recommendations:
„
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
„
Placing high profile components next to antenna should be avoided.
„
Having holes punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
„
ZigBit Amp module should not be placed next to consumer electronics which might interfere with
ZigBit Amp's RF frequency band.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be
placed around the board's edges.
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Section 4
Ordering Information
4.1
Ordering Information
Part Number
ATZB-A24-UFLR
ATZB-A24-U0R
Note:
Description
2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with U.FL Antenna
Connector
2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with Unbalanced RF output
Tape&Reel quantity: 200
Section 5
5.1 UNITED STATES (FCC)
Agency Certifications
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM
manufacturer must comply with the following regulations:
1. The ATZB A24 UFL modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the
module is installed inside another device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: VW4A090668
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
Any similar wording that expresses the same meaning may be used.
2. Designs using the ATZB A24 U0 module must be labelled on an external visible area with the following information:
Contains FCC ID: VW4A090667
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own
FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below.
If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment
is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons
and must not be co located or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is
approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense (FCC section 15.105).
ZigBit™ 2.4 GHz Amplified Wireless Modules
4-16
8228B–MCU
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5.2. EUROPEAN UNION (ETSI)
The
ATZB A24 UFL, ATZB A24 U0 Modules
has been certified for use in European Union countries. If these modules are incorporated
Headquarters
International
into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and low voltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the
Atmel Japan
Atmel Europe
Atmel Asia
Atmel Corporation
R&TTE Directive.
9F, Tonetsu Shinkawa Bldg.
Le Krebs
Unit 1-5 & 16, 19/F
2325 Orchard Parkway
1-24-8 Shinkawa
8, Rue Jean-Pierre Timbaud
BEA Tower, Millennium City 5
San Jose, CA 95131
Furthermore,
the manufacturer must maintain
a copy of the modules' documentation
and ensure the finalChuo-ku,
productTokyo
does 104-0033
not exceed the
BP 309
418 Kwun Tong Road
USA
specified
power
ratings,
antenna
specifications,
and/or
installation
requirements
as
specified
in
the
user
manual.
If
any
of
these
Japan
78054 Saint-Quentin-enKwun Tong, Kowloon
Tel: 1(408) 441-0311
specifications
are exceeded in the finalHong
product,
a submission must be made
to a notified body for compliance
testing to all
Tel: (81) 3-3523-3551
Yvelines Cedex
Kong
Fax: 1(408) 487-2600
required standards.
Fax: (81) 3-3523-7581
France
Tel: (852) 2245-6100
Tel: (33) 1-30-60-70-00
Fax: (852) 2722-1369
IMPORTANT: The 'CE' marking must be affixed to a visible location on the
OEM product. The CE mark shall consist of the initials
Fax: (33) 1-30-60-71-11
"CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
Product Contact
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL" on 9 March 1999 at section 12.
Web Site
www.atmel.com
Technical Support
avr@atmel.com
Sales Contact
www.atmel.com/contacts
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2009 Atmel Corporation. All rights reserved. Atmel ®, Atmel logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
8228B–MCU
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