Microchip Technology A090667 Zigbit Amp 2.4GHz, Unbalanced Output User Manual 8228

Atmel Norway AS Zigbit Amp 2.4GHz, Unbalanced Output 8228

Contents

Manual

8228C–MCU Wireless–09/10
ZigBit™ 2.4 GHz Amplified Wireless Modules
...................................................................................................................
ATZB-A24-UFL/U0
Datasheet
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Table of Contents
Section 1
1.1 Summary............................................................................................................................ 1-1
1.2 Applications........................................................................................................................ 1-1
1.3 Key Features...................................................................................................................... 1-2
1.4 Benefits .............................................................................................................................. 1-2
1.5 Abbreviations and Acronyms ............................................................................................. 1-2
1.6 Related Documents ........................................................................................................... 1-4
Section 2
2.1 Overview ............................................................................................................................ 2-5
Section 3
3.1 Electrical Characteristics.................................................................................................... 3-7
3.1.1 Absolute Maximum Ratings ................................................................................. 3-7
3.1.2 Test Conditions.................................................................................................... 3-7
3.1.3 RF Characteristics ............................................................................................... 3-8
3.1.4 ATmega1281V Microcontroller Characteristics ................................................... 3-8
3.1.5 Module Interfaces characteristics ........................................................................ 3-8
3.2 Physical/Environmental Characteristics and Outline ......................................................... 3-9
3.3 Pin Configuration ............................................................................................................. 3-10
3.4 Mounting Information ....................................................................................................... 3-14
3.5 Soldering Profile............................................................................................................... 3-14
3.6 Antenna Reference Design.............................................................................................. 3-15
Section 4
4.1 Ordering Information ........................................................................................................ 4-16
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ZigBit™ 2.4 GHz Amplified Wireless Modules 1-1
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Section 1
Introduction
1.1 Summary
ZigBit™ Amp is an ultra-compact, extended range, low-power, high-sensitivity 2.4GHz
IEEE 802.15.4/ZigBee® OEM module from Atmel. Based on the innovative Atmel's mixed-signal hard-
ware platform, this module is enhanced by an output power amplifier and an input low-noise amplifier,
and is designed for wireless sensing, monitoring & control and data acquisition applications. ZigBit Amp
modules eliminate the need for costly and time-consuming RF development, and shortens time to mar-
ket for wireless applications with extended range requirements.
Two different versions of ZigBit 2.4 GHz Amplified modules are available: ATZB-A24-UFL with built-in
U.FL antenna connector and the ATZB-A24-U0 with unbalanced RF output. These modules are an addi-
tion to the ZigBit family represented by ATZB-24-A2 and ATZB-24-B0. In addition Atmel offer the ZigBit
900 MHz Wireless Module ATZB-900-B0 [2].
1.2 Applications
ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-
organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel
offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software
development platform supporting reliable, scalable, and secure wireless applications running on Atmel’s
ZigBit modules. SerialNet allows programming of the module via serial AT-command interface.
The applications include, but are not limited to:
•Building automation & monitoring
– Lighting controls
– Wireless smoke and CO detectors
– Structural integrity monitoring
•HVAC monitoring & control
•Inventory management
•Environmental monitoring
•Security
•Water metering
•Industrial monitoring
– Machinery condition and performance monitoring
– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
•Automated meter reading (AMR)
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1.3 Key Features
•Ultra compact size (38.0 x 13.5 x 2.0 mm)
•High RX sensitivity (-104 dBm)
•Outperforming link budget (up to 124 dB)
•Up to +20 dBm output power
•Very low power consumption:
– < 6 µA in Sleep mode,
– 23 mA in RX mode,
– 50 mA in TX mode
•Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)
•Wide range of interfaces (both analog and digital):
– 9 spare GPIO, 2 spare IRQ lines
– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)
– UART with CTS/RTS control
–USART
–I2C
– SPI
–1-Wire
– Up to 30 lines configurable as GPIO
•Capability to use MAC address written into EEPROM
•IEEE 802.15.4 compliant transceiver
•2.4 GHz ISM band
•BitCloud embedded software, including serial bootloader and AT command set
1.4 Benefits
•Extended range through additional PA and LNA
•Ultra low power consumption combined with unprecedented range
•Rapid design-in with built-in U.FL connector (ATZB-A24-UFL)
•Flexibility in using a different external antenna for every application
•Small physical footprint and low profile for optimum fit in even the smallest of devices
•Mesh networking capability
•Easy-to-use low cost Development Kit
•Single source of support for HW and SW
•Worldwide license-free operation
1.5 Abbreviations and Acronyms
ADC Analog-to -Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
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GPIO General Purpose Input/Output
HAF High Frequency
HVAC Heating, Ventilating and Air Conditioning
HW Hardware
I2C Inter-Integrated Circuit
IEEE Institute of Electrical and Electrionics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
LNA Low Noise Amplifier
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit
module
NRE Network layer
OEM Non-Recurring Engineering
OTA Over-The-Air upgrade
PA Power Amplifier
PCB Printed Circuit Board
PER Package Error Ratio
RAM Random Access Memory
RF Radio Frequency
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SPI Serial Peripheral Interface
SW Software
TTM Time To Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZDK ZigBit Development Kit
ZigBee,
ZigBee PRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
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1.6 Related Documents
[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-B0/A2. Product datasheet. Atmel’s doc8226.pdf
[2]. ZigBit™ 700/800/900 MHz Wireless Modules ATZB-900-B. Product datasheet. Atmel’s doc8227.pdf
[3] ZigBit™ Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~01
[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F
AVR 04/06
[5] Atmel Low-Power Transceiver for ZigBee Applications. AT86RF230 datasheet. doc5131.pdf
[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf
[7] ZigBit™ Amp Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~02
[8] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium
Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area
Networks (LR-WPANs)
[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[10] BitCloud™ IEEE 802.15.4/ZigBee Software. Product User Guide. Atmel’s doc8199.pdf
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Section 2
Zigbit™ Module Overview
2.1 Overview
ZigBit™ Amp is an extended-range, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module,
which occupies less than a square inch of space. Based on a solid combination of Atmel's latest MCU
Wireless hardware platform, power amplifier and low-noise amplifier, the ZigBit Amp offers an
unmatched combination of superior radio performance, ultra-low power consumption and exceptional
ease of integration.
Figure 2-1. ATZB-A24-UFL/UN Block Diagram
ZigBit Amp modules contains Atmel's ATmega1281V Microcontroller [4] and AT86RF230 RF Trans-
ceiver [5]. The module features 128K bytes flash memory and 8K bytes RAM.
The compact all-in-one-chip integration of output Power Amplifier and input Low-Noise Amplifier, along
with RF switches enables digital control of an external RF front-end to dramatically improve ZigBit's
range performance on signal transmission and increase its sensitivity. This ensures stable connectivity
with larger coverage area without significant increase in module size. The HF U.FL coaxial connector [6]
used in the ATZB-A24-UFL module enables the user to choose appropriate external antenna for every
type of application.
ZigBit Amp already contains a complete RF/MCU design with all the necessary passive components
included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required exter-
nal connection. Compared to a custom RF/MCUsolution, a module-based solution offers considerable
savings in development time and NRE cost per unit during the design, prototyping, and mass production
phases of product development.
ATmega1281
AT86RF230
RF
Transceiver
VCC (1.8 - 3.6V)
GPIO SPI Bus
IRQ
UART
USART/SPI
I2C
JTAG
ANALOG
SW SW
LNA
PA
RF
I/O
Antenna
0
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To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and develop-
ment tools. The new ZigBit Amp Development Kit [7] (ATZB-DK-A24) comes with everything you need to
create custom applications featuring ZigBit Amp module.
The kit features MeshBean development boards with an easy-to-access extension connector for attach-
ing third party sensors and other peripherals, and a JTAG connector for easy application uploading and
debugging.
The kit also includes reference applications to speed up application development, source code for hard-
ware interface layer and reference drivers for the all the module interfaces, intuitive development
environment from Atmel, and comprehensive set of application notes and product tutorials.
ZigBit Amp modules comes bundled with BitCloud, a 2nd generation embedded software stack from
Atmel. BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and con-
trol [7], [8], [9], and it provides an augmented set of APIs which, while maintaining 100% compliance with
the standard, offer extended functionality designed with developer's convenience and ease-of-use in
mind.
Depending on end-user design requirements, ZigBit Amp can operate as a self-contained sensor node,
where it would function as a single MCU, or it can be paired with a host processor driving the module
over a serial interface. In the former case, a user application may be used with the BitCloud software
allowing customization of embedded applications through BitCloud's C API.
In the latter case, the host processor controls data transmission and manages module peripherals via an
extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful
module design-in. Additionally, third-party sensors can be connected directly to the module, thus
expanding the existing set of peripheral interfaces.
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Section 3
Specifications
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond
those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Attention! ZigBit AMP is an ESD-sensitive device. Precaution should be taken when handling the
device in order to prevent permanent damage.
3.1.2 Test Conditions
,
Notes: 1. The parameters are measured under the following conditions:
a) RMS, BitCloud Software is running at 4 MHz clock rate, DTR line management is turned off
b) All interfaces are set to the default state (see Pin Assignment Table)
c) Output TX power (when measuring consumption in TX mode) is +20dBm
d) JTAG is not connected
Table 3-1. Absolute Maximum Ratings(1)(2)
Parameters Min Max
Voltage on any pin, except RESET with respect to Ground -0.5V VCC + 0.5V
DC Current per I/O Pin 40 mA
DC Current DVCC and DGND pins 300 mA
Input RF Level +5 dBm
Table 3-2. Test conditions (unless otherwise stated) F = 2.45 GHz, VCC =3V, T
amb =25°C
Parameters Range Unit
Supply Voltage, VCC 3.0 to 3.6 V
Current Consumption: RX mode 23 mA
Current Consumption: TX mode(1) 50 mA
Current Consumption: Power-save mode(1) < 6 µA
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Current consumption actually depends on multiple factors, including but not limited to, the board design
and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on
MCU load and/or peripherals used by an application.
3.1.3 RF Characteristics
Note: 1. Preliminary data
3.1.4 ATmega1281V Microcontroller Characteristics
3.1.5 Module Interfaces characteristics
Table 3-3. RF Characteristics
Parameters Condition Range Unit
Frequency Band 2.4000 to 2.4835 GHz
Numbers of Channels 16
Channel Spacing 5 MHz
Transmitter Output Power Adjusted in 16 steps +10 to +20 dBm
Receiver Sensitivity(1) PER = 1% -104 dBm
On-Air Data Rate 250 kbps
TX Output/ RX Input Nominal Impedance Unbalanced output 50 Ω
Range, outdoors With external 2.2 dBi
antenna Up to 4000 m
Table 3-4. ATmega1281V Characteristics
Parameters Condition Range Unit
On-chip Flash Memory size 128K bytes
On-chip RAM size 8K bytes
On-chip EEPROM size 4K bytes
Operation Frequency 4 MHz
Table 3-5. Module Interfaces characteristics
Parameters Condition Range Unit
UART Maximum Baud Rate 38.4 kbps
ADC Resolution/ Conversion Time In single conversion
mode 10/200 Bits/µs
ADC Input Resistance >1 MΩ
ADC Reference Voltage (VREF) 1.0 to VCC -3 V
ADC Input Voltage 0 - VREF V
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3.2 Physical/Environmental Characteristics and Outline
Note: 1. Minor degration of clock stability may occur.
Figure 3-1. ATZB-A24-UFL/U0 Mechanical drawing
I2C Maximum Clock 222 kHz
GPIO Output Voltage (High/Low) -10/ 5 mA 2.3/ 0.5 V
Real Time Oscillator Frequency 32.768 kHz
Table 3-5. Module Interfaces characteristics
Parameters Condition Range Unit
Parameters Value Comments
Size 38.0 x 13.5 x 2.0 mm ATZB-A24-UFL/U0
Operating Temperature Range -20°C to +70°C-40°C to +85°C operational(1)
Operating Relative Humidity Range no more than 80%
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3.3 Pin Configuration
Figure 3-2. ATZB-A24-UFL Pinout
Figure 3-3. ATZB-A24-U0 Pinout
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Table 3-6. Pin descriptions
Connector
Pin Pin Name Description I/O
Default
State after
Power on
1 SPI_CLK Reserved for stack operation(4) O
2 SPI_MISO Reserved for stack operation(4) I/O
3 SPI_MOSI Reserved for stack operation(4) I/O
4 GPIO0 General Purpose digital Input/Output 0(2)(3)(4)(7) I/O tri-state
5 GPIO1 General Purpose digital Input/Output 1(2)(3)(4)(7) I/O tri-state
6 GPIO2 General Purpose digital Input/Output 2(2)(3)(4)(7) I/O tri-state
7 OSC32K_OUT 32.768 kHz clock output(4)(5) O
8 RESET Reset input (active low)(4)
9,22,23 DGND Digital Ground
10 CPU_CLK
RF clock output. When module is in active state, 4
MHz signal is present on this line. While module is
in the sleeping state, clock generation is also
stopped(4).
O
11 I2C_CLK I2C Serial clock output(2)(3)(4)(7) O tri-state
12 I2C_DATA I2C Serial data input/output(2)(3)(4)(7) I/O tri-state
13 UART_TXD UART receive input(1)(2)(3)(4)(7) I tri-state
14 UART_RXD UART transmit output(1)(2)(3)(4)(7) O tri-state
15 UART_RTS RTS input (Request to send) for UART hardware
flow control. Active low(2)(3)(4)(7) I tri-state
16 UART_CTS CTS output (Clear to send) for UART hardware
flow control. Active low(2)(3)(4)(7)(8) O tri-state
17 GPIO6 General Purpose digital Input/Output 6(2)(3)(4)(7) I/O tri-state
18 GPIO7 General Purpose digital Input/Output 7(2)(3)(4)(7) I/O tri-state
19 GPIO3 General Purpose digital Input/Output 3(2)(3)(4)(7) I/O tri-state
20 GPIO4 General Purpose digital Input/Output 4(2)(3)(4)(7) I/O tri-state
21 GPIO5 General Purpose digital Input/Output 5(2)(3)(4)(7) I/O tri-state
24,25 D_VCC Digital Supply Voltage (VCC)(9)
26 JTAG_TMS JTAG Test Mode Select(2)(3)(4)(6) I
27 JTAG_TDI JTAG Test Data Input(2)(3)(4)(6) I
28 JTAG_TDO JTAG Test Data Output(2)(3)(4)(6) O
29 JTAG_TCK JTAG Test Clock(2)(3)(4)(6) I
30 ADC_INPUT_3 ADC Input Channel 3(2)(3)(7) I tri-state
31 ADC_INPUT_2 ADC Input Channel 2(2)(3)(7) I tri-state
32 ADC_INPUT_1 ADC Input Channel 1(2)(3)(7) I tri-state
33 BAT ADC Input Channel 0, used for battery level
measurement. This pin equals VCC/3.(2)(3)(7) I tri-state
34 A_VREF Input/Output reference voltage for ADC I/O tri-state
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Notes: 1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system
containing ZigBit Amp as its RF terminal unit), while UART_RXD pin, vice versa is for output.
2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in
details in the ATmega1281V Datasheet [3].
3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin
drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [3]).
4. All digital pins are provided with protection diodes to D_VCC and DGND
5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is
used by BitCloud. However, this signal can be used if another peripheral or host processor requires
32.768 kHz clock, otherwise this pin can be disconnected.
6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and
flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.
7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:
GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK, I2C_DATA,
UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1,
BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four
JTAG lines can be programmed with software as GPIO as well, but this requires changing the fuse bits
and will disable JTAG debugging.
8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus provid-
ing mechanism for power management of host processor. If this function is necessary, connection of
this pin to external pull-down resistor is recommended to prevent the undesirable transients during
module reset process.
35 AGND Analog ground
36 GPIO9/1_WR General Purpose digital input/output 9 /
1-wire interface(2)(3)(4)(7) I/O
37 UART_DTR DTR input (Data Terminal Ready) for UART.
Active low(2)(3)(4)(7) I tri-state
38 USART0_RXD USART/SPI Receive pin(2)(3)(4)(7) I tri-state
39 USART0_TXD USART /SPI Transmit pin(2)(3)(4)(7) O tri-state
40 USART0_EXTCLK USART/SPI External Clock(2)(3)(4)(7)(11) I/O tri-state
41 GPIO8 General Purpose Digital Input/Output I/O tri-state
42 IRQ_7 Digital Input Interrupt request 7(2)(3)(4)(7) I tri-state
43 IRQ_6 Digital Input Interrupt request 6(2)(3)(4)(7) I tri-state
44,45,51,52,
53,56,57 DGND Digital ground
46,47 VRR Receiver supply voltage(9)
48,50 RF GND RF Analog Ground(2)(3)(4)(7)
49 RFP_IO Differential RF Input/Output(10) I/O
54,55 VTT Transmitter supply voltage(9)
Table 3-6. Pin descriptions
Connector
Pin Pin Name Description I/O
Default
State after
Power on
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9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as
shown below.
10. Pins 48, 49 and 50 are featured for ATZB-A24-U0 module only.
11. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or
output pin.
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3.4 Mounting Information
The below diagrams show the PCB layout recommended for ZigBit Amp module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to pins thus minimizing
inductance and preventing both mismatch and losses.
Figure 3-4. ATZB-A24-UFL/U0 PCB Recommended Layout, Top View
3.5 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.
Note: 1. The package is backward compatible with PB/Sn soldering profile.
Table 3-7. Soldering profile(1)
Profile Feature Green package
Average ramp-up rate (217°C to peak) 3°C/s max
Preheat tempearture 175°C ± 25°C 180s max
Temperature maintained above 217°C 60s to 150s
Time within 5°C of actual peak temperature 20s to 40s
Peak temperature range 260°C
Ramp-down rate 6°C/s max
Time within 25°C to peak temperature 8 minuts max
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3.6 Antenna Reference Design
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.
General Recommendations:
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit Amp module should not be placed next to consumer electronics which might interfere with
ZigBit Amp's RF frequency band.
The board design should prevent propagation of microwave field inside the board material. Electromag-
netic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be
placed around the board's edges.
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Section 4
Ordering Information
4.1 Ordering Information
Note: Tape&Reel quantity: 200
Part Number Description
ATZB-A24-UFLR 2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with U.FL Antenna
Connector
ATZB-A24-U0R 2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with Unbalanced RF output
Section 5
Agency Certifications
5.1 UNITED STATES (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM
manufacturer must comply with the following regulations:
1. The ATZBA24UFL modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the
module is installed inside another device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: VW4A090668
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
Any similar wording that expresses the same meaning may be used.
2. Designs using the ATZBA24U0 module must be labelled on an external visible area with the following information:
Contains FCC ID: VW4A090667
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own
FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below.
If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment
is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons
and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is
approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense (FCC section 15.105).
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The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL" on 9 March 1999 at section 12.
5.2. EUROPEAN UNION (ETSI)
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