Microchip Technology A091731 ATZB-X0-256-3-0-C 2.4GHz ZigBee Module User Manual Manual
Atmel Norway AS ATZB-X0-256-3-0-C 2.4GHz ZigBee Module Manual
Manual
ZIGBIT 2.4GHZ WIRELESS MODULES
ATZB-X0-256-3-0-C
DATASHEET
Features
Compact size (33.0 x 20.0mm)
High RX sensitivity (- 96dBm)
Outperforming link budget (up to 99.6dB)
Up to +3.6dBm output power
Very low power consumption:
6.3mA in RX mode(1)
20.5mA in TX mode(1)
0.3µA in sleep mode(2)
Ample memory resources:
256KBytes in-system self-programmable Flash memory, 4KBytes EEPROM,
16KBytes SRAM
Wide range of interfaces (both analog and digital):
4- wire SPI, TWI
ISP, JTAG
Two analog comparator input
UART, USART
Timer, PWM
Four ADC lines
External clock input, internal clock output
Up to 32 lines configurable as GPIO
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant transceiver
2.4GHz ISM band
Serial bootloader
High performance, low power AVR® XMEGA® 8/16-bit Microcontroller
Rapid design-in with built-in chip antenna
RF test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
1. Measured in TX/RX mode with digital input pins pulled high; RX ON and RPC mode of TRX,
Power Down mode of MCU.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
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Table of Contents
1. Introduction ........................................................................................ 3
1.1 Summary ........................................................................................................... 3
1.2 Applications ....................................................................................................... 3
1.3 Abbreviations and Acronyms ............................................................................ 3
1.4 Related Documents ........................................................................................... 5
2. ZigBit Module Overview ..................................................................... 6
2.1 Overview ........................................................................................................... 6
3. Specification....................................................................................... 8
3.1 Electrical Characteristics ................................................................................... 8
3.1.1 Absolute Maximum Ratings ................................................................ 8
3.1.2 Power Supply ...................................................................................... 8
3.1.3 RF Characteristics .............................................................................. 9
3.1.4 ATXMEGA256A3U Microcontroller Characteristics .......................... 10
3.1.5 Module Interfaces Characteristics ..................................................... 10
3.2 Physical/Environmental Characteristics and Outline ....................................... 10
3.3 Pin Configuration ............................................................................................. 11
3.4 Mounting Information ...................................................................................... 12
3.5 Soldering Profile .............................................................................................. 14
3.6 Antenna Reference Designs ........................................................................... 15
4. Schematics ...................................................................................... 15
4.1 Handling Instructions ....................................................................................... 16
4.2 General Recommendations ............................................................................ 16
5. Persistence Memory ........................................................................ 16
6. Ordering Information ........................................................................ 17
7. Agency Certifications ....................................................................... 18
7.1 United States (FCC) ........................................................................................ 18
7.2 European Union (ETSI) ................................................................................... 19
7.3 Canada (IC) ...................................................... Error! Bookmark not defined.
8. Revision History ............................................................................... 21
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1. Introduction
1.1 Summary
ATZB-X0-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from
Atmel®. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]
Microcontroller and AT86RF233 [5] 2.4GHz ISM band transceiver. The radio transceiver provides high data rates from
250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very
robust wireless communication. The module is designed for wireless sensing, monitoring, control, data acquisition
applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF development,
and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2 Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed software support information, please visit http://www.atmel.com/products/wireless.
The application areas include, but are not limited to:
Building automation and monitoring
o Lighting controls
o Wireless smoke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
1.3 Abbreviations and Acronyms
ADC Analog-to-Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
GPIO General Purpose Input/Output
HAF High Frequency
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HVAC Heating, Ventilating, and Air Conditioning
HW Hardware
I2C Inter-Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE Network layer
OEM Original Equipment Manufacturer
OTA Over-The-Air upgrade
PA Power Amplifier
PCB Printed Circuit Board
PER Package Error Ratio
RAM Random Access Memory
RF Radio Frequency
RPC Reduced Power Consumption
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SoC System on Chip
SPI Serial Peripheral Interface
SW Software
TTM Time-To-Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
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1.4 Related Documents
[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/Images/Atmel-8386-8-and-16-bit-AVR-Microcontroller-
ATxmega64A3U-128A3U-192A3U-256A3U_datasheet.pdf
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[5] AT86RF233 Datasheet in http://www.atmel.com/Images/Atmel-8351-MCU_Wireless-AT86RF233_Datasheet.pdf
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2. ZigBit Module Overview
2.1 Overview
The ATZB-X0-256-3-0-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based on
a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and Atmel
Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power
consumption and exceptional ease of integration.
Figure 2-1. ATZB-X0-256-3-0-C Block diagram
.
This ZigBit module contains Atmel’s ATxmega256A3U Microcontroller and AT86RF233 2.4GHz ISM band Transceiver
for ZigBee and IEEE 802.15.4 [1]. The module features 256KB in-system self-programmable Flash memory, 16KB
SRAM and 4KB EEPROM.
The compact all-in-one board design of MCU and radio transceiver with very minimal components on the RF path to
Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its
sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller
footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
evaluation kit containing the ZigBit extension board for the Atmel Xplained PRO HW evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a bootloader when they are sold as modules, either in single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be
connected directly to the module, thus expanding the existing set of peripheral interfaces.
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3. Specification
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Table 3-1. Absolute Maximum Ratings (1)(2)
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+10 dBm
Current into Vcc pins
200 mA
Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed
under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated
in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to
prevent permanent damage.
3.1.2 Power Supply
Table 3-2. Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25°C.
Parameter
Range
Unit
Supply voltage, VDD
1.8 to 3.6
V
Active Current consumption: RX mode – BUSY_RX - Receive state
16.5
mA
Active Current consumption: RX mode - RX_ON with RPC, MCU Active
11.8
mA
Active Current consumption: RX mode - RX_ON, MCU Active
17.0
mA
Active Current consumption: RX mode - RX_ON with RPC, MCU Power_down
6.1
mA
Active Current consumption: RX mode - RX_ON, MCU Power_down
11.3
mA
Active Current consumption: TX mode (1) – BUSY_TX – Transmit state
20.5
mA
Active Current consumption: TX mode – PLL_ON
5.6
mA
Current consumption: TRX_OFF, MCU Active
5.5
mA
Current consumption: TRX_OFF, MCU Power_down
443
µA
Sleep Current consumption: TRX Sleep, MCU Power_down (2)
0.3
µA
Sleep Current consumption: TRX Sleep, MCU Power_save (2)
0.3
µA
Sleep Current consumption: TRX Sleep, MCU Standby (2)
380
µA
Sleep Current consumption: TRX Sleep, MCU Extended_Standby (2)
380
µA
Sleep Current consumption: TRX Deep_Sleep, MCU Power_down (2)
8.5
µA
Sleep Current consumption: TRX Deep_Sleep, MCU Power_save (2)
8.5
µA
Sleep Current consumption: TRX Deep_Sleep, MCU Standby (2)
388
µA
Sleep Current consumption: TRX Deep_Sleep, MCU Extended_Standby (2)
388
µA
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Note 1: Output TX power (when measuring consumption in TX mode) is +3 dBm.
Note 2:
a) All interfaces are set to the default state (see Pin Assignment Table).
b) JTAG is not connected.
c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down
modes
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol settings,
network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application.
3.1.3 RF Characteristics
Table 3-3. RF Characteristics (1).
Parameter
Condition
Range
Unit
Frequency band
2.4000 to 2.4835
GHz
Numbers of channels
16
Channel spacing
5
MHz
Transmitter output power
Adjusted in 16 steps
-17 to +4
dBm
Receiver sensitivity
PER = 1%
-96
dBm
On-air data rate
250, upto 2000
Kbps
TX output/ RX input nominal impedance
For balanced
50
Ω
Range
Open field, LoS, Elevated
178
m
Table 3-4. TX power settings
PHY_TX_PWR 3:0 Register value
Power register setting
[dBm]
Output power [dBm]
(typical values at RF connector)
0
+4
+3
1
+3.7
+2.9
2
+3.4
+2.7
3
+3
+2.6
4
+2.5
+2.5
5
+2
+0.4
6
+1
-0.3
7
0
-1
8
-1
-2
9
-2
-3.0
10
-3
-4.
11
-4
-5.7
12
-6
-7.5
13
-8
-9.8
14
-12
-13.0
15
-17
-17.9
Note 1: For detailed characteristics, refer to [2].
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3.1.4 ATXMEGA256A3U Microcontroller Characteristics
Table 3-5. ATXMEGA256A3U Characteristics.
Parameter
Range
Unit
On-chip flash memory size
256K
Bytes
On-chip RAM size
16K
Bytes
On-chip EEPROM size
4K
Bytes
Operation frequency
16
MHz
3.1.5 Module Interfaces Characteristics
Table 3-6. Module Interfaces Characteristics (1).
Parameters
Condition
Range
Unit
UART maximum baud rate
115.2
Kbps
ADC conversion time (latency)
(RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12
5-8
ClkADC cycles
ADC input resistance
Static load resistor of input signal
4.0
kΩ
ADC reference voltage (VREF)
1.0 to AVcc – 0.6
V
ADC input voltage
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
Vcc = 2.7-3.6V
2 to Vcc+0.3
V
GPIO Low level input voltage
Vcc = 2.7-3.6V
-0.3 to 0.3 VDD
V
GPIO High level output voltage VOH
Vcc = 3.0-3.6V
2.4 to 0.94Vcc
V
GPIO Low level output voltage VOL
Vcc = 3.0-3.6V
0.05Vcc typ
Max 0.4
V
Real-time oscillator frequency
32.768
kHz
Note 1: For detailed characteristics, refer to [1].
3.2 Physical/Environmental Characteristics and Outline
Table 3-7. Physical characteristics.
Parameters
Value
Comments
Size
33.0 x 20.0 mm
Operating temperature range
-40°C to +85°C
-40°C to +85°C operational
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3.3 Pin Configuration
Table 3-8. ATZB-X0-256-3-0-C Pinout description
Pin Out
Pin descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSET/PDI_CLOCK
RESET
6
PD4/SS
SPI
7
PD5/MOSI/XCK1
SPI
8
PD6/MISO/RXD1/D-
SPI
9
PD7/SCK/TXD1/D+
SPI
10
PA5
GPIO / ADC / Analog COMP+
11
PA4
GPIO/ADC/Analog Comp-
12
DVSS
Digital Ground
13
PD2/SYNC/ASYNC/OC0C/
UART
14
PD3/SYNC/TXD0/OC0D
UART
15
PD1/SCL/INT/OC0B
USART
16
PDI_DATA
PWM/TC
17
PA6
GPIO/ADC
18
PA7
GPIO/ADC
19
PB3
GPIO/ADC/DAC1
20
PB2
GPIO/ADC/DAC/intwkup
21
PF1/OC0B/INT/XCK0
INT/PWM/GPIO
22
PF2/OC0C/INT/RXD0
INT/PWM/GPIO
23
PF3/OC0D/INT/TXD0
INT/PWM/GPIO
24
PB0/IAREF/INT
Adc ref
25
PA0/ADC0/INT
ADC/ GPIO
26
PA1/ADC1/INT
ADC/ GPIO
27
PA2/ADC2/INT
ADC/ GPIO
28
PA3/ADC3/INT
ADC/ GPIO
29
DVSS
Digital Ground
30
PB6/TCK/INT
JTAG
31
PB4/TMS/INT
JTAG
32
PB7/TDO/INT
JTAG
33
PB5/TDI/INT
JTAG
34
PE3/TXD
GPIO/output counter
35
PE2/RXD
Wakeup INT
36
PE1/XCK
TWI/INT/GPIO
37
PE0
TWI/INT/GPIO
38
PE5/OC1B/INT
GPIO/TC
39
PE4/SYNC/OC1A
Master Clock out put
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Pin Out
Pin descriptions
Function
40
PF0
GPIO/Timer
41
DVSS
Digital Ground
42
DVSS
Digital Ground
NOTE: TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module
should follow straight connection for UART.
UART_TXD_external_device <-> UART_TXD
UART_RXD_external_device <-> UART_RXD
3.4 Mounting Information
The Figures below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
Figure 3-1. ATZB-X0-256-3-0-C Dimensions
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Figure 3-2. ATZB-X0-256-3-0-C Pinout
Figure 3-3. ATZB-X0-256-3-0-C Foot Print Dimensions
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Figure 3-4. ATZB-X0-256-3-0-C Mounting Information
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application
3.5 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering profile(1)
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note: 1. The package is backward compatible with PB/Sn soldering profile.
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3.6 Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
4. Schematics
The following schematic drawings for the ATZB-X0-256-3-0-C are in the following order:
Top level schematics
Connector schematics
ATxmega256A3BU schematics
AT86RF233 schematics
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4.1 Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design
4.2 General Recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
Placing high profile components next to antenna should be avoided
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit RF frequency
band
5. Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1. Persistence Memory
Data
Size
Structure Revision
2 bytes
MAC address(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number
10 bytes
Board information – PCBA Atmel Part Number
8 bytes
Board information – PCBA Revision
1 byte
XTAL Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
1 byte
Note: 1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.
User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The
MAC ID can be read from the ZigBit using the Performance Analyzer Application that is supplied through
Atmel Studio Gallery Extension.
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6. Ordering Information
Part number
Description
ATZB-X0-256-3-0-C
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233
Transceiver with MS-147 test connector and chip antenna, Single unit
ATZB-X0-256-3-0-CR(1)
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233
Transceiver with MS-147 test connector and chip antenna, Tape & Reel
Note: 1. Tape and reel quantity: 200.
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7. Agency Certifications
7.1 United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1. The ATZB-X0-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID
is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
Contains FCC ID: VW4A091731 The enclosed device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device
must accept any interference received, including interference that may cause undesired operation.
Any similar wording that expresses the same meaning may be used.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation (FCC 15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all
persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
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7.2 European Union (ETSI)
The ATZB-X0-256-3-0-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3 Industry Canada (IC) Compliance statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-091731”
OR
“Contains IC: 11019A-091731”
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Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091731”
OR
“Contains IC: 11019A-091731”
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8. Revision History
Doc. Rev.
Date
Comments
42172A
10/2013
Initial revision.
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© 2013 Atmel Corporation. All rights reserved. / Rev.: 42172AWIRELESS10/2013
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