Microchip Technology BM20SPKXYNBZ Bluetooth Module User Manual Stereo Module Data sheet 20150910 sm
Microchip Technology Inc. Bluetooth Module Stereo Module Data sheet 20150910 sm
Manual
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| Document ID | 2747428 |
| Application ID | 9f2ZL4gcaouadc5EJhXElg== |
| Document Description | Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 272.36kB (3404460 bits) |
| Date Submitted | 2015-09-14 00:00:00 |
| Date Available | 2015-09-15 00:00:00 |
| Creation Date | 2015-09-15 06:29:26 |
| Producing Software | AFPL Ghostscript 8.53 |
| Document Lastmod | 2015-09-15 06:29:26 |
| Document Title | Stereo Module Data sheet_20150910-sm |
| Document Creator | Adobe Acrobat 11.0.11 |
| Document Author: | chartonr |
Features : mplete, Fully ertified, Embedded Co 2.4 GHz Bluet C 4.1 th® V ersi oo on M dule Bluet th lassic (BDR/ EDR) oo C B uet th SIG ertified oo b ard embedded Bluet th Stack On o oo ra spare t UA R m de f r seamless serial T n nAR i T fo data er U ter ace ov Easy t c figure with Wi d ws GUI r direct o on n o by M U Firmware ca be fie ld upgradable ia UA R mpact surface m u t m dule: 29 x 15 x Co 2.5 mm astellated surface m u t pads f r easy C o n a d reliable h st P B m u ti g o n n E ir me tally frie dly, R HS c mplia t nv on Perfect f r P rtable Battery perated D i o o e ces I ter al Battery Regulat r ircuitry n ln i o C W r dw de regulat ry certificati s on A oi I / ud ut oa BM23 supp rt d ig ita l audi I S f rmat. utput. BM20 supp rt a al g aud i n o oo Ope rationa l: perati g ltage: 3.0V t 4.2V O n vo emperature ra ge: 20 t 0° T ® C o7 C Simple, UAR i terface T n I tegrated crystal, i ter al ltage n l n n vo regu at r, a d matchi g circuitry Multiple I/ pi s f r c n tr l a d status O n o on o n RF/A na log: Freque cy: 2.402 t 2.480 GHz R ece i e Se siti ity: 9 1 dBm (2Mbps EDR) ® n v P wer utput: class 2 / +4dBm max. Oi Dista ce: > 10m ect Conn on n i ( ree space a d ter ere ce n no n A udio process or Supp rt 64 kb/ s A aw r aw P M f rmat, r aLSl aLV io µ V SD t u us ar ab e pe Delta Con M dulati ) f r S cha el perati . on o CO nn o on ise suppressi No on Ech suppressi on SB a d pti al AA dec di g C n o on o n Packet l ss c cealme t on Bu ild i f ur la guages ( hi ese/ E glish/ an o C n 2015 Microchip Techn ology Inc . Spa ish/ Fre ch) ice pr mpts a d 20 e e ts f r each vo v n o e ( his fu cti ca be set up i IS20XXS UI” t l.) on T n on n“ oo Supp rt S MS aT A udio Codec 20 bit DA a d 16 bit A D c dec C n C o 98 dB S R DA playback Pe riphe ra ls ithium i battery charger (up t 350mA ) Bu ilt i an L a on I tegrate 3V , 1.8V c figurable switchi g regulat r a d nD on o n L O Bu ilt i A D f r battery m it r a d ltage se se. an C o on o n vo A li e i p rt f r e xter al aud i i put n an o o o n ED dri ers T oL Flex ible HCI inte rface High speed H I UAR (U i ersal A sy ch r us Ca T nv ono R ecei er ra sm itter) i terface (up t 921600bps) v T n MA C/Base band/ Highe r Laye r: Secure A ES128 e crypti on Bluet th pr files H oo 1. o FP a HS v 1. 1 a A 2D v 1.2 a AV R v 1.5 aS C v PP 1.0 PBA P 1.0 A nte nna : Pri ted A te a n nn Complia nce : Bluet th SIG QDID : 58996 M oo )a d dule certified f r th e U ited States (F CC ) n a ada ( , Eur pea Ec m c rea ( E , ono C ) K rea ) a d Japa (MI ( A ), aiwa ( LT n NCC n Preliminary Edition Page 1 FIGURE 1: This stereo module builtÒin LiÒIon charger and BM23 con tain a digital audio in terface. It supports HSP, HFP, SPP, A 2DP, and AV RCP profiles. Both AAC and SBC codecs are supported for A 2DP. Note that th e customer must connec t their own e xternal analog CODEC/ DSP/ amplifier and MCU for audio output. Gene ra l Desc ript ion: Stereo module is a fullyÒcertified Blue tooth® V ersion 4.1 (BDR/EDR) module for designers who want to add Blue tooth® wireless audio and voic e applications to their produc ts. Th is Bluetoo th SIG c ertified module provides a complete wireless solution with Blue tooth stack, integrated antenna , and worldwide radio certific ations in a compact surface mount package , 29x15x2 .5 mm . 5 Microchip Technology Inc . 201 Preliminary Ed ition A pplica t ions : Blue tooth sound bar B t th t lue oo s ereo speaker phone Page Table of Contents 1.0 DEV I E V ERV IEW .................................................................................................................................. 4 C O 2.0 A PP I A I I F RMA I ............................................................................................................... 10 L C T ON N O T ON 3.0 E E RI A HARA ERIS I S ....................................................................................................... 18 L CT C L C CT TC 4.0 PRI A I F RMA I ..................................................................................................... 23 ED A NT NT NN N O T ON 5.0 REFERE E IR UI ...........................................................................................................................25 NC C C T I F RMA I .......................................................................................................... 2 6.0 ER IFI A I T C T ON N O T ON .0 M DU E U I E A D REF W PR FI E ...................................................................................... 29 L O TL N LO O L 8.0 PA KA GI G A D S RA GE I F RMA I .................................................................................... 34 TO N O T ON A PPE DIX ........................................................................................................................................................ 3 TO OUR VALUED CUSTOMERS It is ou r intent ion to provide our valued custom ers wit h the best doc um entation possible to ensure su ccessf u l u se of your Microchip products . To t his en d, w e will cont inu e to im prove our publications t o bett er su it you r needs . Our publication s will be refined and enhanced as new volum es and updates are introduced . If you h ave any questions or comm ents r egar din g t his publication , please contact t he Market ing C ommunications Department via E%m ail at docerrors@microchip com . W e w elcome your feedback . Data S heet To obt ain t he m ost u p% t o% dat e ver sion of this dat a sheet, pleas e r egist er at our W orldwide W eb sit e at: http://www.microchip.com You can determine the version of a data sheet by examining its literature num ber f ound on the bottom outside corner of any page . The last character of t he literat ur e n um ber is the version num ber ,( e.g ., DS 30000000 A is ver sion A of docum en t DS 30000000) . Errata An errata sheet,describing minor operational differences from the data sheet and recomm ended workarounds, may exist for curr ent devices . As device/docum en tation issu es becom e known t o us, w e will publish an errata sheet . The errat a will specify the revision of silicon and revision of docum ent to w hich it applies . To determ ine if an errata sheet e xists f or a particular device , please check with one of t he f ollowin g : • Microchip’s W orldwide W eb site ; http://www.microchip.com • Your local Microchip sales office (see last page) W hen contacting a sales office , please specif y which device , revision of silicon and data sheet (include literature number) you are u sin g . Cust ome r Not if ication Syste m Register on our w eb site at www.microchip.com to receive the most current information on all of our products . Most Current Abbreviat ions List : HFP: H a ds free Pr file AV RC P: Anudai V ide o Rem te tr l Pr file o i Dio i Con o filo A2 DP: A d a oced A ud str but Pr e on PBAP: Ph e B k A ccess Pr file on oo HS P: Headset Pr file o fil S PP: Serial Port Pr 2015 Microchip Techn ology Inc . Preliminary Edition Page 3 1 EVICE OVERVIEW .0 D The stereo module series include BM20 and BM23. The chip integra tes Blue tooth 4. 1 radio transceiver, PMU and DSP. Figure 1Ò 1and 1Ò2 shows the application block diagram. FIGURE 1 1: BM20 Ty pica l A pplicat ion ® The following depic ts an e xample of BM20 module operate as an independent system or connec ted to an MCU. Audio utput IS2020S Microphone Aux_In 1Cr6MtHz ys al I2C EEPROM IC UART BM20 MCU ption FIGURE 1 2 : BM23 Ty pica l A pplicat ion ® The following depic ts an e xample of BM23 module connected to an MCU, e xternal DSP/ CODEC. ġ 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 4 1.1 INTERFACE DESCRIPTION able 1 1 BM20 p i d iagram is sh w i Figure 1 3. he pi descripti s are sh w i o n n a T on o n nT FIGURE 1Ç3 : BM20 PIN DIAGRAM TABLE 1 1: BM20 PIN DES CRIPT ION ® Name Pin No. Pintype Descri ptio n IO pin, default pullíhigh input (Note 1) I/O P0_0 1. Slide Switch Detector, active low. 2. UART TX_IND, active low. Embedded RO M/ External Fla sh enable EAN H: Embedded ; L: External Fla sh IO pin, default pullíhigh input (Note 1) P3_0 Lineíin Detector (default), active low. IO pin, default pullíhigh input P2_0 System Configuration,b H: App lication L: Ba se and (IBDK Mode) IO pin, default pullíhigh input (Note 1) 1. NFC detection pin, active low. I/O P1_5 2. Out_Ind_0 3 lide itch Detector, active lo . S Sw w. 4 Buzzer ignal Output IO pin, default pullíhigh input. (Note 1) I/O P0_4 1 NFC detection pin, active low. 2.. Out_Ind_0 Ríchannel analog headphone output S PKR AO HPM Headphone common mode ou tput/sense inpu t 2015 Microchip Technology Inc. Preliminary Edition Page 5 Pin No. Name S PKL Pintype 10 V DDA 11 12 13 14 15 16 17 MIC 1_P 18 I/O P0_1 19 20 21 22 23 V DD_IO í ADAP_IN BAT_IN NC G ND 24 SYS_PW R 25 26 MFB 27 28 LED1 29 P2_4 30 P0_2 31 I/O P0_3 32 HC I_TX D 33 HC I_RX D 34 P0_5 35 P2_7 MIC 1_N MIC_ BIA AIR AIL RST VCC_RF BK_O UT LED2 2015 Microchip Technology Inc. Descri ptio n Lích annel analog headphone output Positive power supply/reference voltage for CODEC, no need to add power to this pin. Mic 1 mono differential analog positive inpu t Mic 1 mono differential analog negative input Electric micro phone b iasing voltage Ríchannel singleíended analog inputs Lích annel singleíended analog inpu ts System Reset Pin, Low : reset 1.28V RF LDO output, no need to add power to this pin. IO pin, default pullíhigh input (Note 1) 1. FW D key when class 2 RF (default), active low. 2. Class 1TX Control signal of external RF T/ R switch, active high. Power output , no need to add power to this pin 5V Po er adaptor input 3 3V~4 2 V Lií Ion ba ttery input No Connection Ground Pin System Power Output BAT mode :3 3~4 2V . . Adapter mode : 4.0V 1.8V buck output, no need to add power to this pin 1 Power key when in off mode 2.. UART_R X_IND: MC use to akeup BT (Note 1) LED Driver 1 LED Driver 2 IO pin, default pullíhigh input System Configuration, L: Boo t Mode with P2_0 lo w combina tion IO pin, default pullíhigh input (Note 1) Play/ Pause key (default), active low. IO pin, default pullíhigh input (Note 1) 1. REV key (default), active low. 2. Buzzer Signal Output 3 Out_Ind_1 4 Class 1 RX Control signal of external RF T/ R s itch, active high HC Ií ART TX data HC Ií ART RX data IO pin, default pullíhigh input (Note 1) Volume do n (default), active lo w. IO pin, default pullíhigh input (Note 1) Volume up key (default), active lo w. Preliminary Edition Page 6 Pin No. Pintype Name 36 P2_4 37 G ND 38 í í í 39 40 NC NC NC Descri ptio n IO pin, default pullíhigh input System Configuration, L: Boo t Mode with P2_0 lo w combina tion Ground Pin No Connection No Connection No Connection * I: signal input pin * O : signal output pin * I/O : signal input/output pin * P : pow er pin N ote 1: These bu tton or functions can b e setup by “IS20XXS U I” tool 2015 Microchip Technology Inc. Preliminary Edition Page 7 able 1 2 BM23 p i d iagram is sh w i Figure 1 4. he pi descripti s are sh w i o n n a T on o n nT FIGU RE 1Ç4 : BM23 PIN DIAGRAM TABLE 1 2 : BM23 PIN DES CRIPT ION ® Pin No. Pin Type Name Descri ptio n IO pin, default pullíhigh input (Note 1) I/O P0_0 U2 ART TX_IND IO RFS0 I S interface : DAC Left/ Right Clock I/O T FS0 I2S interface : ADC Left/ Right Clock I/O I2S interface : Bit Clock S LK0 DR0 I2S interface : DAC Digital Left/ Right Data DT0 I2S interface : ADC Digital Left/ Right Data I/O P0_4 IO pin, default pullíhigh input Embedded RO M/ External Fla sh enable EAN High : RO M mode; Lo w : External Flash mode MIC 1_P Mic 1 mono d ifferen tial analog po sitive input 10 MIC 1_N Mic 1 mono d ifferen tial analog nega tive inpu t 11 MIC_ BIA S Power output, microphone biasing voltage Power output, reserve for external cap to fine tune audio frequency 12 V DDA 13 AIR Stereo analog line in, Ríchannel 14 AIL Stereo analog line in, Líchannel 2015 Microchip Technology Inc. Preliminary Edition Page 8 Pin No. 15 16 17 18 19 20 21 22 23 24 I/O íí Name G ND RST_N NC NC V DDIO P1_5 P0_1 ADAP_IN BAT_IN NC 25 SYS_PW R 26 27 MFB 28 29 LED1 30 P2_4 31 38 I/O I/O I/O I/O I/O I/O P0_2 P0_3 HC I_TX D HC I_RX D P0_5 P2_7 P2_0 P3_0 39 P2_0 40 G ND 42 íí íí íí 32 33 34 35 36 37 41 43 íí íí I/O I/O BK_O UT LED2 NC NC NC Ground Descri ptio n System Reset Pin, active when rising edge. íí íí Power output, V DDIO pin, no need to add power to this pin IO pin, default pullíhigh input IO pin, default pullíhigh input 5V po er adaptor input 3 3~4 2V Liíion ba ttery input . . íí System Power Output BAT mode :3 3~4 2V . . Adapter mode : 4.0V Power output, 1v8 pin, no need to add power to this pin 1 Power key when in off mode 2.. UART_R X_IND: MC u se to akeup BT LED Driver 1, 4mA ma x LED Driver 2, 4mA ma x IO pin, default pullíhigh input System Configuration, L: Boo t Mode with P2_0 lo w combina tion IO pin, default pullíhigh input IO pin, default pullíhigh input HC Ií ART TX data HC Ií ART RX data IO pin, default pullíhigh input IO pin, default pullíhigh input IO pin, default pullíhigh input IO pin, default pullíhigh input IO pin, default pullíhigh input System Configuration,b H: App lication L: Ba se and (IBDK Mode) Ground íí íí íí * I: signal input pin * O : signal output pin * I/O : signal input/output pin * P : pow er pin N ote 1: These bu tton or functions can b e setup by “IS20XXS U I” tool 2015 Microchip Technology Inc. Preliminary Edition Page 9 IC ION INFORM ION .0 APPL AT AT 2.1 O PERAT IO N WIT H EXT ERNAL MC U Stereo module support UART command se t to make an e xternal MCU to control module. Here is the connection interface between BMXX and MCU. FIGURE 2 m1: INT ERFA C E BETW EEN MCU AND BMXX MODULE ŎńŖŠ ŘłŌņŖő őıŠı UART interface ŖłœŕŠœř ʼnńŊŠŕřŅ UART interface ŖłœŕŠŕř ʼnńŊŠœřŅ Ń੠سŌņŖő ŎŇŃ XX MCU can control module by UART interface and wakeup module by PWR pin. Stereo module provide wakeup MCU function by connect to P0 0 pin of module. “UART Command Set” document provide all func tion which module support and UI tool will help you to se t up your system support UA RT command. For more de tail description, please reference “UART CommandSe t v154” document and “IS20XXS UI” tool. 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 10 Here are some suggestions of UART control signal timing sequence: FIGURE 2 m2 : POW ER ON/OFF S EQUENCE 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 11 FIGURE 23 : T IMING S EQUENCE OF RX IN DICAT ION AFT ER POW ER ON FIGURE 24 : T IMING S EQUENCE OF POW ER OFF 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 12 FIGURE 2 m5 : T IMING S EQUENCE OF POW ER ON (NA CK) FIGURE 2 m6 : RES ET T IMING S EQUENCE IF MODULE HANGS UP 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 3 FIGURE 2 ¥7 : T IMING SEQUENCE OF POW ER DROP PROTECT ION Power BAT N +4V ġ _I 2.9V ~ RST N from Reset C I ġ If BT’s BAT use adaptor translates voltage by LDO, we recommend use “Reset IC” to avoid power 0ms off suddenly. R est IC spec output pin must be “Open Drain” delay time ˣ ʀ1 Rec omme nd pa rt : T CM809SVNB7 13 or G69 1L263T73 2015 Microchip Technology Inc. Preliminary Edition Page 14 2.2 I2S Signa l A pplicat ion for BM23 BM23 support I2 S digital audio signal in terface to connect your e xternal CODEC/DSP. It provide 8k Hz , 44.1k Hz and 48k Hz sampling ra te ; it also support 16 bits and 24bits da ta forma t. The I2 S setting can be set up by UI and DSP tools. The external CODEC/DSP needs to be connec ted to SLK0, R FS0 , TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively). The I2 S signal connection be tween BM23 and external DSP as below: FIGURE 2 m9 : MAST ER FIGURE 2 m10 : SLAV E MODE REFERENCE CONNECT ION MODE REFERENCE CONNECT ION Note 1: For 002 version chip or module, system should connect line 1 in slave mode figu re. And , system not support ADC signal from external DSP/CODEC . Note 2 : For other version chip or module, system should connect line 2 in sla ve mod e fig ure. A bout “Mast” or “Slave ” mode se tting , you can use “DSP Configuration Tool” to se t up system. 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 5 The clock and data tim ing as below: FIGURE 211: T IMING FOR I2S MODES (both master a nd slave) FIGURE 2 12: T IMING FOR PCM MODES (both master a nd slave) 2.3 RESET (RST_N) RST is module reset pin which is active LOW. To reset the module the RST must hold LOW for at _N least 63ns. 2.4 STATUS LED (LED1, LED2) The status LED provide below status indication: Standby nquiry I Link Link Back Low Battery age P Battery Charging Each status indication LED flashing sequence and brightness is configurable by UI tool. 5 Microchip Technology Inc. 201 Preliminary Ed ition Page 6 2 .5 EXT ERNA L CONFIG URATION Stereo module can be configured and firmware programmed using an external configuration and programming tool available from Microchip. Figure 2®7 shows the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. Configuration and firmware programming modes are entered accordingly to the system configuration I/O pins as shown in Table 2î1. Pin P20, P24 and EAN pin have internal pull®up. FIGURE 2 ¥13 : EXT ERNAL PROGRA MMING HEA DER CONNECT IONS (Here is the interface connect example of the BM23) T A BLE2¥1: SYSTEM CONFIGURAT ION S ETT INGS P20 P24 EA N High Low Low High High Low High High High 2015 Microchip Technology Inc. Operational Mode A PP mode (Normal operation) Test mode (W rite EEPROM) Write Flash (Firmware programming if flash buildîin in chip) Preliminary Edition Page 17 3.0 ELECTRICAL CHARACTERISTICS Table 3.1: ABSOLUTE MAXIMUM SPECIFICAT ION Symbol Parameter BAT_IN Input voltage for batte ry ADAP_IN Input voltage for adaptor TSTORE Storage tempe rat ure T OPERATION Ope ratio n tempe rat ure Min s65 s20 Max 4.3 7.0 +150 +70 Table 3.2 : RECOMMENDED OPERATING CONDITION Symbol Parameter Min Typical BAT_IN Input voltage for batte ry 3.7 ADAP_IN Input voltage for adaptor 4.5 T OPERATION s20 +25 Ope ratio n tempe rat ure Note: Absolute and Recommended operating condition tables reflect typ ical usage for device. TABLE 3¥3: I/O AND RESET LEVEL Parameter Min. I/ O Supply Voltage (V DD_IO) 2.7 I/O Voltage Levels V IL input log ic leve ls low 0.3 ® 2.0 V IH input log ic leve ls hig h V OL o ut put log ic leve ls low 2.4 V OH o ut put log ic leve ls hig h RESET VTH RES t hreshold voltage Note: (1) VDD O voltage is programmable by EEPROM parameters . (2) Thes_I e parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Typ. 3.0 Unit ºC ºC Max 4.2 5.5 +70 Unit ºC Max. 3.3 Units 0.8 3.6 0.4 1.6 Page 18 Table 3ð4 : BATTERY CHARGER Min Parameter ADAP_IN Input Voltage 4.5 Supply current to cha rge r o nly Headroo m > 0.7V Max imum Batte ry 170 (ADAP_IN=5V ) Fast Cha rge Current Headroo m = 0.3V Note: ENX2=0 160 (ADAP_IN=4.5V ) Headroo m > 0.7V Max imum Batte ry 330 (ADAP_IN=5V ) Fast Cha rge Current Headroo m = 0.3V Note: ENX2=1 180 (ADAP_IN=4.5V ) Trickle Cha rge Voltage T hreshold Batte ry Cha rge Te rminatio n Current, (% of Fast Cha rge Current ) Note: (1) Headroom = VADAP V BAT (2) ENX2 is not allowed_INto– be enabled when VADAP VBAT > 2V (3) These parameters are characterized but not tes_INted– in manufacturing. Table 3.5: LED DRIV ER Paramet er Open#drain Voltage Programmab le Current Range Intensity Control Min 200 240 Unit mA mA 180 240 mA 350 420 mA 220 270 mA 10 Typical Max Unit 3.6 5 .25 mA step mA 16 0.35 Note: (1) Test condition: SA R VDD= 1.8V , temperature=25 ºC . _ characterized but not tested in manufacturing. (2) These parameters are 2015 Microchip Technology Inc. Max 5.5 4.5 Current Step Power Down Open#drain Current Shutdown Current Typical 5.0 Preliminary Edition ȫ ȫ Page 19 Table 3.6 : A UDIO CODEC ANA LOGUET O DIGIT AL CONV ERTER T = 25oC, V dd=3.0V , 1KHz s ine wave input, Bandw idt h = 20Hz~20KHz Parameter (Cond ition) Min. Typ. Resolutio n Out put Sample Rate Signa l to Noise Ratio Note : 1 88 (SNR @MIC or Lines in mode ) Dig ita l Ga in s54 Dig ita l Ga in Resolutio n 2~6 MIC Boost Ga in 20 A na log Ga in A na log Ga in Resolutio n Input fullssca le at max imum ga in (diffe rentia l) Input fullssca le at minimum ga in (diffe rentia l) 3dB bandw idt h Micro pho ne mode (input impedance ) THD+N (micro pho ne input ) @30mV rms input Note: (1) fin= 1K Hz , B/W =20~20K Hz , Abweighted , THD+N < 1%, 150mVpp input (2) Th ese parameters are ch aracterized but not tested in manu facturing. 2015 Microchip Technology Inc. Preliminary Edition Max. 16 48 4.85 60 2.0 800 20 24 0.02 Unit Bits KHz dB dB dB dB dB dB mV rms mV rms KHz KV Page 20 Table 3.7 : A UDIO CODEC DIGITAL T O A NALOGUE CONV ERTER T= 25oC, Vdd=3.0V , 1KHz sine wave input , Bandwidth = 20 Hz~20 KHz Paramet er (Condition) Min. Over#sampling rate Resolution Output Sample Rate Signal to Noise Ratio Note: 1 (S NR @cap#less mode) for 48k Hz Signal to Noise Ratio Note: 1 (S NR @single#end mode) for 48k Hz Digital Gain 16 Max . Unit 20 48 Bits KHz dB dB 4 .85 dB #28 Analog Gain Resolution Output Voltage Full#scale Swing (A V DD=2 .8V) Maximum Output Power ( 16 load) 4 5 Maximum Output Power (32 load) Resistive Capacitive Allowed Load Signal to Noise Ratio (S NR @ 16 dB 742 .5 mV rms 34 .5 mW 17.2 mW 16 load) ȟ Note: (1) fin= 1K Hz , B/W =20~20K Hz , Abweighted , THD+N < 0 .0 1%, 0dB FS signal , Load= 100K (2) These parameters are characterized but not tested in manufacturing. Table 3.8 : T RANSMITTER SECTION FOR BDR A ND EDR Paramet er Typ Min #4 O .C. ȟ 500 űŇġ 0 .05 dB 3.0 4 .0 luet ooth B cificati n spe # o # 1.2 #4 to 1 Max dB load) Maximum RF transmit power EDR/ BDR Relat ive transmit power dB 2~6 Analog Gain ȟ 128 #54 Digital Gain Resolution THD+ N ( 16 Typ. Unit d Bm dB Note: The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. Test condition: VCC RF= 1.28V , temperature=25 ºC . 2015 Microchip Technology Inc. Preliminary Edition Page 21 Table 3.9 : RECEIV ER SECTION FOR BDR AND EDR Typ Modulation Min Sensitivity at 0.1% BER Sensitivity at 0.01% BER Max luet ooth B cificati n spe Unit GFSK #90 ≤#70 d Bm π/4 DQPSK #9 1 #82 ≤#70 d Bm ≤#70 d Bm 8DPS K Note: (1) Test condition: VCC RF= 1.28V , temperature=25 ºC . _ characterized but not tested in manufacturing. (2) These parameters are Table 3.10 : SYSTEM CURRENT CONSUMPT ION OF ANA LOG A UDIO OUTPUT Sy st em Status Typ. Max . System Off Mode Unit uA Standby Mode 0 .8 mA Linked Mode 0 .4 mA SCO Link 7 .8 mA 10.7 mA A2 DP Link (V p p= ¨ 200mV; 1k tone signal) Note: Use BM20 EVB as test platform. Test condition: BAT N= 3 .8V , link with _I HTC EY Ecell phone ; distance between cell phone and EVB : 30cm. Table 3.11: SYSTEM CURRENT CONSUMPT ION OF DIGIT AL AUDIO OUT PUT (I2S) Sy st em Status Typ. Max . System Off Mode Unit uA Standby Mode 0 .4 mA Linked Mode 0 .4 mA SCO Link 9.3 mA A2 DP Link ( k tone signal) 11.7 Note: Use BM23 EVB as test platform Test condition: BAT N= 3 .8V , link with HTC M8 cell phone ; distance between cell phone and 2S signal link with Y_I AMAHA Y DA174 EVB 2015 Microchip Technology Inc. Preliminary Edition mA EVB : 30cm ; Page 22 4 INTED ANTENNA INFO MATION .0 PR 4.1 MO DULE RADIATION PATTERN The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is shown in Figure 4 2. FIGURE 41: ANT ENNA KEEP OUT AREA EXAMPLES FIGURE 42 : ANT ENNA 3D RADIAT ION PATT ERN @2441 MHz 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 23 4 .2 MO DULE PLACEMENT RULE On the m ain PCB the areas under the antenna should not contain any top inner layer or bottom copper as shown in Figure 4 . A low im pedance ground plane will ensure the best radio ®1 ® performance (best range lowest noise). The ground plane can be extended beyond the m inimum recommended as need for the main PCB EMC noise reduc tion. For the best range performance, keep all external metal away from the ceram ic chip antenna at least 5 mm. Here are some e xamples of good and poor placement on a carrier board with GND plane. FIGURE 43: MODULE PLACEMENT EXAMPLES FIGURE 44: GND PLANE ON MAIN APPLICAT ION BOARD 5 Microchip Technology Inc . 201 Preliminary Ed ition Page 24 52 egaP _ DIDO e:a D e rs tT z eSi T , ayu dh itl , p A16 MAIN il2015 IR ITCU Sht of 1 e 1. 1 v R 306S T2 BM20 it mea dN oar B XX P/N rcu Ci eer f enc 1 01 K R13 V2 10K 1R2 1/ C u V01 26 GND B3 MF RSW _ PS NO SW 1 8 1 BITSW SW LI _ DES T2 3 30 2 SS1 _ BAINT 1 01 R 2 K 10 onn C iBL ec 2 1 or t aery tt ID D+ ) D VBUS 5 4 3 2 1 MB P3 131S250 11 10/ 8C1 BR 1u 6V 5V . TEL8 s H ,. 5FNo ,5 6357 yncu iCh Industry 88 , 078it3 . Ed 35 a ., RsiVI a T nchHuS wn i iece rknc , Pa _ 0P0 1 2 10/ C91 u 6V1 JJ x P12 5P cu it r Ci w it ed Sli 5V _ AINT 8765 4321 J P2 _ P00 FMB _ AMP _ RTN _ HCI _ HCI EN S TX RX DD RSW _ PS D2 L E 2 DHR 1 LED LE D1 1 LE 2 DB LE ON TC UAR BUG DE O VFE OHT or BL SE UE RE OL U) RT CM y (b D1 LE 1/ 7C 1/ C u 16V 1 u 16V 61 L IAR AI _ P24 _ HCI _ HCI ENA _ P20 TXD RXD 8765 4321 J x J8P1 3P x1 J8P 365S P2 T8H .0 C _ P30 u 1/16V 15 LNI LNI _ ER _ LE 10 0 7R 1 R6 Aud MFB AMPEo i E ER U U _ TX _ RX / nable _ S _ RAT _ ARTR IND IND Tn TXD XD N0P 8R 60 NE 1 3 10 2 4 UT NP I I N0P 5R 60 2 4 6 L SW SW L _ NC MI 1/ C u 16V 14 2 4 RE SW WD x P11 J6P PKR tCi ri es R nI ug) Pl up k ac B 3SW PA Y/ 5V St 39 83 ANT MB02 PCB1 eo er 1/ C u V16 3 TU ON 3 1 B 2 TASWC WS T 4 2 1 3 B 1 FM TASWC WS T 2 4 2 1K/ 1 1 R1 MF _ B PSRS 40 ANT NAT 32 2 2K R 1 2 1 2 MM 3 1 D D 2 _ TN 4 1 S B39T 04 p 15/50V C4 _ P02 T 1 3 TASWC 2 4 PKL NP06 9C2 03 aJ ET RES TIUCRIC EC ERE ER p 15/50V C _ P01 T 1 3 TASWC 4SW 1/ u V16 9C C72 C13 NP06 9C3 03 PM AIR _ MIC _ MINC _ MIC PKL AOH PK FNC _ AMP _ P20 _ P30 EAN _ P00 BIA 1 P1 S PM 8 RS EN 41 M 31 M 21 M 1 V 10 9 7 6 5 4 3 E 2 1 AIR I S I I D PKL AO PK _ P0 _ P51 _ P02 _ P03 AN _ P00 ARI STL _ CBIA _ CN1 _ C1P DA S HPM RS 4 VCC _RF PVDD 0_1 _I ON S ADAP HCI _ HCI BAT _I _IN_ _ BK L L NC GND PSRS OT MFB ED1 ED2 _ P24 _ P02 _ P03 _ TXD RXD _ P05 _ P72 _ P24 ND W 2 25 26 72 82 29 30 31 3 3 3 35 36 73 4 LL 2 4 MF E E _ P2 _ P0 _ P0 H H _ P0 _ P72 _ P2 B 1D 2D 4 2 3 _ T _ CIR 5 4 XD XD _ PS RSW p 15/50V C7 _ P03 T 1 3 TASWC 2 4 1K R3 1 . 262/ 1K 75R u 3 M .2 _ ICBI . u /2V6 A 3 AOH 12453 PJ 7P 2051 . cnI ygolonhceT pihcorciM 51 02 0 5 TIU CRI C E CN EREFER 0 2MB 1. 5 MI _ CP PJ P1 2051 11 67 11 89 120 2221 23 1/ C u 16V 01 12453 MIC ARI STL _N VDDV_I O 0_1 BAT_I N p 155/V0 1C2 _ P72 T 1 3 TASWC p 15/50V C1 _ P05 T 1 3 TASWC 2 4 2K R4 noitidE yranimilerP 6 x1 SP of het 15 03 ve 0 R XX BM BM ot ot cu Ci cu Ci en en ef re ef re : ter z ie ardoma , y dia itle e arc ,h 2 egaP /N 385 573 ncr IN EAN _ A BT 57 SPE0 MF PWR ER AT 73 , Pak csin ,. 5FNo y it , 5Industr , .. yERd w aain , siVIHnchuS u 1 7C /16V 1 on ti gur fi on C em t ys S IN NXI RA B/U /MF D2 25 S1 Â4 389  PJ K1 /5V 4 C 12 70p 57 SPE0 u 1 11 /16V . 0 EC ieec _ AP SO ER PO u 1 61 /16V C1 C2 . 0  88 u Â6 . TE /16V u1 /16V u1 . 0 AK JC ÂD on ti ec t eD EIN LIN P3 u 1 1C 16V/ 12 K1 R _ 0 on ti gur fi on C em t ys S P2 AIL on ti gur fi on C em t ys S P2 AIR  C1 HR LE D2 LE K1 0R u1 C /16V D2 LE /16V 3 u1 . 0 RED eD ne Li /5V O) eR b( nP oi P0 4 C8 70p uA ve ti cA K1 9 *P30 ow L BLU D1 LE 57 SPE0  LE D1 LE D1 h) l( NXI RUA P0 SP scr on ti pi e OD GPI PU IN LIN AUX EO ER ST x1 _ 2 IN _ AP 6 5 D D IN _ AP _ ST /V1 7 u0 H H _ CI _ IC TX XR IN D _ AT ÂT T P P 4 4 AN IN BT _ A 4 3 PS 67 89 34 21 22 2 1 _ 2 P0 /16V u1 5C 2K 1 R ER AN 6 5 0T 0R D D BI K1 R7 . u 2 2C /6 /6 1K . u 1 R6 D D H H _ CI _ CI TX RX 7 _ C DT DR0 DP C1  DP PU IN TF SLK0 0 RF 0P 0_ 0 x1 0P P P _ 0 _ 02 3 38 x1 FB P0 M _ 0 F AM dat 0T 0R D D 6 5 4 3 2 2 TF SLK0 0 1 1 Rec es ram ef y ch y ch n n es ram mn v ei sra BM ÂP RF 2 1 2 2 1 1 r or ro al z i z i n n l at at i i ock o o n n Se RS_ UR _ UR TT T TXD RDX sra ecr mn v ei t a dat al al r r i Se i Se _ EP _ ST _ IC _ CI N XT XR D D le Enab AMP dio uA _ TX _ XR / _ IND IND 3 4 0P _ 0P2 N 2 1 4 3 TF RF 0P LK0S 0 0 _ 0 S S H H 0 _ CI _ CI 0 P TX XR P P 0P _ _ 27 _ 2 _ 3 D D 31 23 33 34 3 63 E 0 B1 3 3 3 3 R R5 RA AC 2MB 2. 5 (b 3 3 3 3 1 3 R R ERF SI I2 . cnI ygolonhceT pihcorciM 51 02 IU CRI C E CNEREFER BU H or ET LU M u4 _ I 25V/ M u4 _ I 25V/ NC 50/ 0p2 D2 4 LE P _ 2 E 0 I N_ C1 _ C1 A 4 N P . 0 ÂT B D1 MF LE 26 2 D1 D2 _ I_ CN 10 1 1 CO _ VC P P _ 2_ _ 2 29 D_ I D C_ A BI LE LE AIR 1 12 BI _ IC . 0 C6 ÂT  TP TP O MF _ B AIL AIR 15 1 N AIL RST NCNC VDD_ PP0__5 I O ADAP_ BAT_ I INN AMB_DET SYS_PWR U BI _ I noitidE yranimilerP 6 ERTIFI ATION INFORMATION .0 C Q CO A O .1 B T F INF RM TI FIGURE 61: BM15/BM20/BM23/BM25 QDID Data 2015 Microchip Technology Inc. Preliminary Edition Page 27 G LA O Y APP OVAL BM23 has got these countries regulatory approval: .2 RE • United States ; FCC ID: A8T BM23S PKXYC2A • Canada ; IC ID: 12246A# BM23S PKXYC2 • Europe • Japan : 202#S MC067 • Korea ; Certification No .: MSIP#C RM#S S# B M23SPKXY • Taiwan ; NCC No.: CCA L15 LP0270T3 BM20 has got these countries regulatory approval: • United States : FCC ID: A8T BM20S PKXY NBZ • Canada ; IC ID: 12246A# BM20S PKS 1 • Europe • Japan : 202#S MD048 Korea ; Certification No .: MS IP#C RM#mc p# B M20SPKS 1NBC • Taiwan ; NCC No.: CCA N15 LP0460T2 For more in formation, please reference appendix. 2015 Microchip Technology Inc. Preliminary Edition Page 28 7 MODULE OUTLINE AND REFLOW PROFILE .0 OD SO A DP OO P L D .1 M IMEN CB F RINT FIGURE 71: BM20 Outline Dimens ion PCB dimens ion: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 29 FIGURE 72: BM23 Outline Dimens ion PCB dimens ion: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 30 FIGURE 7 3 : BM20 PCB FOOT PRINT Note: The “Keep Out A rea” is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 3 1 FIGURE 7 4 : BM23 PCB FOOT PRINT Note: The “Keep Out A rea” is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 32 7 LOW PRO FILE FIGURE 75: REFLOW PROFILE .2 REF Slope : 1~2 /sec max. ɗ (2 17 o peak) ɗt peak : 260 +5/0 ɗ Ramp down ra e : Max. 3 /sec . t ɗ 2 17 ɗ Prehea : 150~200 ɗ 20~40 sec . 60 ~ 180 sec . 60 ~ 150 sec Time (sec ) 25 ɗ SolderingRecommendations Stereo module was assembled using standard leadJf ree ref low profile IPC/JEDEC JJST DJ020. Th e module can be sold ered t o t he main PCB using standard leaded and leadJf ree solder ref low prof iles. T o avo id damag ing of t he module t he recommendat ions are listed as f ollow s: • • • • • • Ref er t o Microchip T echnology A pplicat ion Note A N233 Sold er Ref low Recommendat ion (DS00233) fo r the soldering ref low recommendat ions Do not ex ceed peak temperat ure (T P) of 250 degree C Ref er t o t he solder paste data sheet f or specif ic ref low p rofile recommendat ions Use no Jclean f lux solder paste Do not wash as mo ist ure can be t rapped under t h e shield Use only one f low . If t h e PCB requires mult iple f low s, app ly t h e module on t he f inal f low . 2015 Microchip Technology Inc. Preliminary Edition Page 33 8 ACKAGING AND STORAGE INFORMATION .0 P The module is packaged into trays (see following page) of sixty three (63 ) modules in a 7 x 9 format. These trays are then sealed into bags. T en sealed bags are then placed in a box of 630 pieces with a dimension of 36 * 16 * 9.5 cm3 . The shelf life o f each module in a sealed bag is 12 month s at <40°C and <90% relative humidity. After a bag is opened, devices that will be subj ected to reflow solder or other high temperature processes must be mounted with in 168 hours (7 days) at factory conditions of <30°C an d <60% relative humid ity. 5 Microchip Technology Inc. 201 Preliminary Edition Page 34 ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ 5 Microchip Technology Inc. 201 Preliminary Edition Page 35 8.1 O RDERI ġ NG INFORMAT IO N TABLE 5 1: Module Ordering Inf ormation art Number Description BM20SPKS 1NBC Bluetooth 4. 1 BDR/EDR, Class 2 Surface Mount module BM23SPKS 1NB9 Bluetooth 4. 1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and sh ield with integrated antenna and sh ield Note: The module can only be purchased through a Microchip representative. Go to http:// www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ 5 Microchip Technology Inc. 201 Preliminary Edition Page 36 ENDIX PP A.1 United Sġtates The module has received Federa l Communicatio ns Commissio n (FCC) CFR47 Te le communicatio ns, Part 15 Subpart C “Intentio na l Rad iators” modula rapprova l in accordance wit h Part 15.2 12 Modula r T ransmitterapprova l. Modula r approva l a llows t he end user to integrate t he module into a finis hed product wit ho ut o btaining s ubseq uent and separate FCC approva ls for intentio na l rad iatio n, provided no changes or mod if icatio ns are made to t he module circuit ry. Changes or mod if icatio ns co uld void t he user’s a ut hority to operate t he eq uipment. The end user must comply wit h a ll of t he instructio ns provided by t he Grantee,w hich ind icate insta llatio nand/oroperating cond it io ns necessary for complia nce. The finis hed product is req uired to comply wit h a ll applica ble FCC eq uipment a t horizatio ns reg ulatio ns, req uirements and eq uipment f unctio ns not associated wit h t he transmitter module portio n. For example , complia nce must be demonstrated to reg ulatio ns forot hertransmitter components wit hint he host product; to req uirements for unintentio na l rad iators (Part 15 Subpart B “Unintentio na l Rad iators” ),s uch as d ig ita ldevices, computer periphera ls , rad io receivers,etc.;and to add it io na l a ut horizatio n req uirements for t he non® transmitterf unctio ns on t he transmitter module (i.e., Verif icatio n, or Decla ratio n of Conformity ) (e.g.,transmitter modules may a lso contain d ig ita l logic f unctio ns ) as appropriate. A.1.1 LABELING AND USERINFORMATION REQUIREMENTS The BM20/ BM23 module has been la be led wit h its own FCC ID number, and if t he FCC ID is not vis ible w hen t he module is insta lled inside anot her device,t hen t he o utside of t he finis hed product into w hich t he module is insta lled must a lso d is play a la be l referring to t he enclosed module . This exterio r la be l can use word ing as fo llows: F ID: BM SPKXY Contains T ransmitter odule CC C2A or A8T 23 Contains CC C2A A 8T 23 BM SPKXY F ID: Th is device complies with art 15 o f the CC ules. peration is subj ect to the following two conditions ( 1) this d evice may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation F ID: BM SPKXYNBZ F ID: BM SPKXYNBZ Th is device complies with Part 15 o f the FCC Rules. Operation is subj ect to the following two conditions: ( 1) this d evice may Contains T ransmitter odule CC A8T 20 or Contains CC A 8T 20 not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user’s manua l for t he finis hed product s ho uld include t he fo llowing statement: 5 Microchip Technology Inc. 201 Preliminary Edition Page 3 q Th is e uipment has been tested and found to comply with th e limits for a Class d igital device, pursuant to part 15 of the CC ules. These limits are designed to provid e reasonable protection against h armful interference in a resid ential installation . Th is e uipment generates, uses and can rad iate ra dio fre uency energy, and if not installe d an d used in accordance with the instructions, may cause harmful interference to radio communications. owever, there is no guarantee th at interference will not occur in a particular installation. f th is e uipment does cause harm ful interference to radio or television reception , wh ich can be determined by turning the e uipment off and on, th e user is encouraged to try to correct th e interference by one or more o f the following measures eorient or relocate the receiving antenna . ncrease the separation between the e uipment and receiver. Connect the e uipment into an outlet on a circuit d ifferent from that to which the receiver is connected. Consult the d ealer or an experienced radio T technician for help. • R • I • /V • A ddit ional inf ormat ion on labeling and user inf ormat ion requirements f or Part 5 dev ices can be f ound in DB Pub licat ion av ailable at t he CC ffice of Eng ineering and T echnology ( ET ) Di a orat ory v s on now le g e atabase ( DB) http :// apps.f cc.g ov/ oetcf/ kdb/in dex .cf m. 784 748 F O 3.1.2 RF EXPOSURE K 44 7498 All t ran smitters regulated by CC must comply w it h R ex posure requirements. DB eneral R Ex posure uidance prov ides guidance in d etermining w h et her propo sed or ex ist ing t ransmitt ing f acilit ies o perat ions or d ev ices comp ly w it h limits f or human ex posure t o Radio requency (R ) fields adopted by t h e edera l Communicat ions Commission ( CC). From t he FCC Grant : Output power listed is conducted.This grant is v alid only w hen t he module is sold t o OEM integ rat ors and mu st be insta lled by t he O EM or OEM integrat ors. This t ransmitter is rest ricted f or use w it h t he specific antenna(s) tested in t his applicat ion f or Cert if icat ion and must not be co Jlocated or operat ing in con unct ion w it h any ot her antenna or t ransmitters w it hin a ho st dev ice ex cept in accordancew it h CC mult iJt ransmitter p roduct p rocedures. 3.1.3 HELPFUL WEB SITES Federal Communicat ions Commission (FCC): http://www .f cc.gov FCC Off ice of Eng ineering and T echnology (OET ) Laborat ory Div ision Know ledg e Database (KDB): http:// apps.f cc.gov/ oetcf/ kdb/index .cf m 5 Microchip Technology Inc. 201 Preliminary Edition Page 3 A 2 Canada T he BM23 module has been cert ified f or u se in Canada under Indust ry Canada (IC) Radio Standards Specif icat ion (RSS) RSSJ2 0 and RSSJ en . Modular approv a l permits t he insta llat ion of a module in a ho st dev ice w it hout t he need t o recert ify t h e dev ice. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements f or t he Host Dev ice (f rom Sect ion 3.2.1, RSSJGen, Issue 3, December 2010): T he host dev ice sha ll be p roperly labeled t o id ent ify t h e module w it hin t he host dev ice. T he Indust ry Canada cert ificat ion label of a module shall b e clearly v isible at all t imes w hen insta lled in h h h i h ho st d ev ice must b e la beled t o display t h e Indust ry Canada t e ost de ce ot erw se t e cert ificat ion number of t h e module, preceded by t he w ord s Conta in s t ransmitter module , or t he w ord Conta ins or similar w ording ex pressing t h e sa me meaning, as f ollow s: v , “ ” “ ” 1 46A JBM23SPKXY C2 Containst ran smitter module IC: 22 1 46A JBM20SPKS1 Containst ran smitter module IC: 22 71 User Manual Not ice f or icenseJEx empt Radio A pparat us (f rom S ect ion . .3 RSSJ en, Issue 3, D ecember 20 0): User manua ls f or licen seJex empt radio appa rat u s shall conta in t h e f ollow ing or equiv alent not ice in a con spicuou s locat ion in t he user manual or alternat iv ely on t he d ev ice or bot h: T his dev ice comp lies w it h Indust ry Canada licen seJex empt RSS standa rd (s). perat ion is sub ect t o t he f ollow ing tw o condit ions: ( ) t his dev ice may not cause interf eren ce an d (2) t his dev ice must accept any interf eren ce, including interf erence t hat may cause undesired operat ion of t h e dev ice. Le présent appareil est conf orme aux CNR d'Indust rie Canada applicables aux appareils radio ex empts de licence. L'ex p loitat ion est aut orisée aux deux condit ions suiv antes: (1) l'appareil n e do it pas produ ire de brouillag e, et (2) l'ut ilisateur de l'appa reil do it accepter t out brou illag e radioélect riqu e subi même si le brouillag e est suscept ible d'en comp romett re le f onct ionn ement . 71 T ransmitterAntenna (f rom Sect ion . .2 RSSJ en Issue 3 D ecember 20 0): User manua ls f or t ransmitters shall display t he f ollow ing not ice in a con sp icuous locat ion: 5 Microchip Technology Inc. 201 Preliminary Edition Page 3 Under Indu st ry Canada regulat ion s, t his radio t ran smitter may only operate using an antenna of a ty pe and max imum (or lesser) g a in app rov ed f or t h e t ransmitter by Indust ry Canada.T o reduce potent ial radio interf erence t o ot h er u sers t he antenna ty pe and its g ain should b e so cho sen t hat t he equ iv alent isot ropically radiated power (e.i.r.p.) is not more t han t hat necessa ry f or su ccessf ul communicat ion . à é é é é Conf orm ment la r glementat ion d Indust rie Canada le pr sent metteur radio peut f on ct ionner av ec une antenne d un ty pe et d un g ain max imal (ou inf rieur) approuv pour l metteur par Indust rie Canada. Dans le but de r duire les risques de b rouillag e radio lect rique l intent ion d es aut res ut ilisateurs, il f aut ch oisir le ty pe d antenne et son g ain de sorte que la puissance isot rope rayonn e quiv a lente (p.i.r.e.) ne d passe pas l intensit n cessaire l ta blissement d une commun icat ion sat isf aisante. 'é é é à' é é à 'é é é é é é T he abov e not ice may be affix ed t o t h e dev ice instead of display ed in t he u ser manual. User manuals f or t ran smitters equipped w it h detachable a ntennas sha ll also conta in t h e f ollow ing not ice in a conspicuous locat ion: This radio t ransmitter (ident ify t he dev ice by cert if icat ion number or model number if Category II) has been approv ed by Indust ry Canada t o operatew it h t he antenna ty pes listed below w it h t he max imum permissible g a in and required antenna impedance f or each antenna ty pe indicated. Antenna ty pes not included in t his list hav ing a g ain greater t han t he max imum g ain indicated f or t hat ty pe, a re st rict ly prohibited f or use w it h t his dev ice. à é é é é Conf orm ment la r glementat ion d Indu st rie Canada le pr sent metteur radio peut f onct ionn er av ec un e antenne d un ty pe et d un g a in max ima l (ou inf rieur) approuv pour l metteur par Indust rie Cana da. Dan s le but de r duire les risqu es d e brouillag e radio lect riqu e l intent ion des aut res ut ilisateurs, il f aut choisir le ty pe d antenne et son g ain de sorte que la puissance isot rope rayonn e quiv alente (p.i.r.e.) ne d passe pas l inten sit n cessa ire l tablissement d une communicat ion sat isf aisante. 'é é à' é é à 'é é é é é é é Immediately f ollow ing t he ab ov e not ice t he manuf act urer shall prov ide a list of all antenna ty pes approv ed f or use w it h t he t ransmitter indicat ing t he max imum permissible antenna g ain (in dBi) a nd required impedance f or each. A.2.2 OSURE A ll t ran smitters regulated by IC must comply w it h R ex po sure requirements listed in RSSJ 02 J Radio requency (R ) Ex posure Compliance of Radio communicat ion A pparat us (All requency Band s). A.2.3 WEB SITES Indu st ry Canada : http://www .ic.g c.ca/ 5 Microchip Technology Inc. 201 Preliminary Edition Page 4 A 3 Europe T he BM23 module is an R TT E Direct iv e assessed radio module t hat is CE ma rked and has been manuf act ured and tested w it h t he intent ion of being integrated int o a fina l p roduct . 1999 / 5/ EC Essent ial T he BM23 module has been tested t o R TTE Direct iv e Requirements f or ea lt h and Saf ety (A rt icle (3. (a)), Elect romagn et ic Compat ibility (EMC) ro ean (A rt icle 3. (b)), and Radio (A rt icle 3.2) and are summari ed in a le om liance esting . A Not if ied Body p inion has a lso been issued. C p T b 3Ó1:Eu p T he R TT E Compliance A ssociat ion prov id es guidance on modular dev ices in document ec nical idance ote av ailab le at http://www .rtteca.com/ ht ml/dow nload area .ht m. T h Gu N : 01 T b A.3Ó1: Eu p C p ote T o maintain conf ormance t o t he test ing listed in a le ro ean om liance esting, t he module sha ll be in stalled in accordance w it h t he in stallat ion inst ruct ion s in t his data sheet and sha ll not be modif ied. When integ rat ing a radio module int o a completed product t he integ rat or becomes t he manuf act urerof t he fina l product and is t heref ore responsible f or d emon st rat ing comp liance of t he f ina l product w it h t he essent ial requ irements of t he R TTE Direct iv e. A.3.1 ABELING AND USERINFORMATION REQUIREMENTS T he label on t he f inal p roduct w hich conta in s t h e BM23 module must f ollow CE idance ote marking requirements. Th e R TTE Compliance A ssociat ion ec nical prov ides gu idance on final p roduct CE marking . T h Gu 01 A.3.2 ANTENNA REQUIREMENTS From R&TT E Compliance A ssociat ion document Technical Guidance Note 01: Prov ided t he integ rat or installing an assessed radio module w it h an integ ra l or specif ic antenna and insta lled in conf ormancew it h t he radio module manuf act urer s installat ion inst ruct ion s requ ires no f urt h er ev a luat ion under Art icle 3.2 of t he R TT E Direct iv e and do es not require f urt her involv ement of an R TT E Direct iv e Not if ied Body f or t h e final p roduct . Sect ion 2.2. ’ 4] T b 3Ó1 was perf ormed using t he integ ral The European Comp liance T est ing listed in a le ceramic chip antenna. TABLE A.3Ó1:EUROPEAN COMPLIANCE TESTING Standards Certificatio Article Saf ety EN 60950J (3.1(a)) EN 50371:2002J03 Healt h EMC EN 30 1 489J1V1.8.1 (2008J04 ) (3.1(b)) EN 30 1 489J17 V 2.1 .1 (2009 J05) di EN 300 328 V1.7.1 (2006J10) (3.2) R o Laboratory p Number Date Re ort Not ified Body 5 Microchip Technology Inc. 201 Preliminary Edition Page 4 A.3.3 HELPFULWEB SITES A document t hat can be used as a starting point in understand ing t he use of Short Range Devices (SRD) in Europe is t he European Rad io Communicatio ns Committee (ERC) Recommendatio n 70®03 E,w hich can be downloaded fromt he European Rad io Communicatio ns Office (ERO) at: http://www.ero.dk/ . Add it io na l he lpf ul we b sites are: • Rad io and Te le communicatio ns Termina l Eq uipment (R&TT E): http://ec.e uropa.e u/enterprise/ rtte/ index_en.htm • European Conference of Posta l and Te le communicatio ns Ad ministratio ns (CEPT): http://www.cept.org • European Te le communicatio ns Standards Instit ute (ET SI): http://www.etsi.org • European Rad io Communicatio ns Office (ERO): http://www.ero.dk • The Rad io and Te le communicatio ns Termina l Eq uipment Complia nce Associatio n (R&TT E CA): http://www.rtteca.com/ 5 Microchip Technology Inc. 201 Preliminary Edition Page 4 4 Japan The BM20/BM23 module has received type certif icatio nand is la be led wit h its own technica l conformity mark and certif icatio n number as req uired to conformto t he technica l standards reg ulated by t he Ministry of Interna lAffairs and Communicatio ns (MIC) of Japan purs uant to t he Rad io A ct of Japan. Integratio n of t his module into a fina l product does not req uire add it io na l rad io certif icatio n provided insta llatio n instructio ns are fo llowed and no mod if icatio ns of t he module are a llowed . Add it io na l testing may be req uired : • If t he host product is s ubject to e le ctrica l applia nce safety (for example , powered froman AC mains ),t he host product may req uire Product Safety Ele ctrica l A pplia nce and Materia l (PSE) testing. The integrators ho uld contact t heir conformance la boratory to determine if t his testing is req uired . Th ere is anvo luntary Ele ctromagnetic Compatibility (EMC) test fort he • host product ad ministered by V CCI: http://www.vcci.j p/vcci_e/ index.html A.4.1 LABELING AND USERINFORMATION REQUIREMENTS The la be l on t he fina l product w hich contains t he BM20/ BM23 module must fo llow Japan marking req uirements. The integratorof t he module s ho uld referto t he la be ling req uirements for Japan availa ble at t he Ministry of Interna lAffairs and Communicatio ns (MIC) we bsite. The BM20/ BM23 module is la be led wit h its own technica l conformity mark and certif icatio n number. The fina l product in w hich t his module is being used must have a la be l referring to t he type certif ied module inside: Contains transmitter module wit h certif icate number: A.4.2 HELPFULWEB SITES Ministry of Interna lAffairs and Communicatio ns (MIC): http://www.te le .so umu.go.j p/e/ index.htm Associatio nof Rad io Industries and Businesses (ARIB): http://www.arib.or.j p/eng lis h/ 5 Microchip Technology Inc. 201 Preliminary Edition Page 43 5 Korea The BM23 module has received certif icatio n of conformity in accordance wit h t he Rad io Waves A ct. Integratio n of t his module into a fina l product does not req uire add it io na l rad io certif icatio n provided insta llatio n instructio ns are fo llowed and no mod if icatio ns of t he module are a llowed . A.5.1 LABELING AND USERINFORMATION REQUIREMENTS The la be l on t he fina l product w hich contains t he BM23 module must fo llow KC marking req uirements. The integratorof t he module s ho uld referto t he la be ling req uirements for Korea availa ble on t he Korea Communicatio ns Commissio n (KCC) we bsite. The BM23 module is la be led wit h its own KC mark. The fina l product req uires t he KC mark and certif icate numberof t he module : (MSIPùCRMùS9SùBM23SPKXY ) A.5.2 HELPFULWEB SITES Korea Communications Commission (KCC): http://www.kcc .go .kr National Radio Research Agency (RRA):http://rra .go .kr 5 Microchip Technology Inc. 201 Preliminary Edition Page 44 A 6 Taiw an T he BM23 module has receiv ed comp liance app rov al in accordancew it h t he T elecommunicat ion s A ct . Cust omers seeking t o u set he comp liance app rov a l in t heir p ro duct should contact Microchip T echnology sales or dist ribut ion part n ers t o obtain a etter of Aut hority . insta llat ion in st ruct ions a re f ollowed and no modificat ions of t he module a re a llow ed. Integ rat ion of t his module int o a f inal product does not requ ire addit ional radio cert ificat ion prov id ed A.6 .1 LABELING AND USERINFORMATION REQUIREMENTS T he BM23 module is labeled w it h its ow n NCC ma rk and cert if icate number as below : CCAL15LP0270T3 ’ T he user s manua l should conta in below warn ing (f or R d ev ice) in t radit iona l Chinese: ὀព ! ౫᧸ పຌ⋡㟁Ἴ㍽ᑕᛶ㟁ᶵ⟶⌮㎨ἲ ➨༑ᲄ ⥂ᆺᘧㄆㆇྜ᱁அపຌ⋡ᑕ㢖㟁ᶵ㸪㠀⥂チྍ㸪 බྖ ࠊၟᡈ⏝⪅ᆒᚓ᧩⮬ㆰ᭦㢖⋡ࠊຍຌ⋡ᡈㆰ᭦ཎタィ அ ≉ᛶཬຌ⬟ࠋ ➨༑ᅄᲄ పຌ⋡ᑕ㢖㟁ᶵஅ⏝ᚓᙳ㡪㣕⯟Ᏻཬᖸᨐྜἲ㏻ಙ㸹 ⥂ⓐ⌧᭷ᖸᨐ⌧㇟㸪᠕❧ ༶⏝㸪୪ᨵၿ⮳↓ᖸᨐ᪉ᚓ⧤⧰⏝ࠋ ๓㡯ྜἲ㏻ಙ㸪ᣦ౫㟁ಙつᐃసᴗஅ↓⥺㟁ಙࠋ ప ຌ⋡ᑕ㢖㟁ᶵ㡲ᚸཷྜἲ㏻ಙᡈᕤᴗࠊ⛉Ꮵཬ㓾⒪⏝㟁Ἴ㍽ᑕᛶ 㟁ᶵタഛஅᖸᨐࠋ A.6 .2 HELPFULWEB SITES Nat ional Communicat ions Commission (NCC): http ://www .n cc.gov .tw 5 Microchip Technology Inc. 201 Preliminary Edition Page 45 A MERICAS Corporate Office 355 W e t Ch ndle lvd . 2Ch ndle s Z 8a5 4r 6B 99 a r ,A Tel : 48 G79 G7 22 1 200 Fax : 48 G79 G7 77 Technic0al Su2pp2ort: http://www.microchip .com/ support Web Address : www.microchip.com Atlanta Duluth ,GA Tel : 678G957G96 4 Fax : 678G957G 1455 Austin Tel : 5 ,GTX57G337 12 2 Boston Westborough , MA Tel : 774G76 G 87 Fax : 774G760000 G 88 Chicago 00 Itasca , IL Tel : 63 G 85G 7 Fax : 63002G28500 G00715 Cleveland Independence ,OH Tel : 6G447G 464 Fax2: 2116G4470G0643 Dallas Addison , TX Tel : 97 G8 8G74 3 Fax : 9722G8118G29224 Detroit Novi , MI Tel : 48G848G4 000 Houston TX Tel : 8 G894G5983 Indi2anapol Noblesville , sIN Tel : 3 7G773G83 3 Fax : 3117G773G5453 Los Angeles Mission Viejo , CA Tel : 949G46 G95 3 Fax : 949G4622G96208 New York, NY Tel : 63 G435 1 G 000 San Jose CA , G9 Tel : 4 8G 735 110 Canada | Toronto Tel : 9 5G673G 699 Fax : 9005G6730G6509 Page 46 AS IA/PACIFIC Asia Pacific Office Suites 3707G 14 , 37th Floor Tower 6 , The Gatew ay Harbour City, Kowloon Hong Kong Tel : 85 G 943G 5 100 Fax : 85222G240 1G343 Australia | Sydney1 Tel : 6 G G9868G6733 Fax : 6112G2G9868G6755 China | Beij ing Tel : 86G G8569G7 Fax : 86G1010G8528G2000 China | Chengdu 10 Tel : 86G 8G8665G55 11 Fax : 862G28G8665G7889 China| Chongqing Tel : 86G 3G898 G9588 Fax : 862G23G89800G9500 China| Hangzhou Tel : 86G57 G879 G8 5 Fax : 86G5711G87922G811116 China | Hong Kong SAR Tel : 85 G 943G 5 100 Fax : 85222G240 1G343 China | Nanjing 1 Tel : 86G 5G8473G 46 Fax : 862G25G84732G24700 China | Qingdao Tel : 86G53 G85 G 7355 Fax : 86G5322G850202G7205 China| Shanghai Tel : 86G G54 7G5533 Fax : 8621 G2 1G54007G5066 China| Shenyang Tel : 86G 4G 334G 8 9 Fax : 862G242G23342G23293 China| Shenzhen Tel : 86G755G 8864G Fax : 86G755G82032200 G 76 China | Wuhan 1 0 Tel : 86G 7G598 G53 Fax : 862G27G59800G5 00 China | Xian 11 Tel : 86G 9G8833G7 5 Fax : 862G29G8833G72256 China | Xiamen Tel : 86G59 G 388 38 Fax : 86G59222G23881130 China | Zhuhai Tel : 86G756G 3 Fax :86G756G32100 409 2 100 AS IA/PA CIFIC India | Bangalore Tel : 9 G8 G 3 9 G4444 Fax :911G800G300900G4 123 India | New Delhi Tel : 9 G G4 6 G863 Fax :911G1111G411600G86312 India | Pune Tel : 9 G G 3 9G 5 1 20 0 1 1 00 Japan | Osaka Tel : 8 G6G6 5 G7 6 Fax :811G6G611522G913 010 Japan | Tokyo Tel : 8 G3G688 G 377 Fax :811G3G68800G37701 Korea | Daegu Tel : 8 G53G 744G43 Fax :822G53G744G430021 Korea | Seoul Tel : 8 G G554G 7 Fax : 82 2 558 5200 93 or 82G2G552G82GG5934G 2 Malaysia | Kuala Lumpur Tel : 6 G3G6 G9857 Fax :600G3G6202011G9859 Malaysia | Penang Tel : 6 G4G 7G 887 Fax : 600G422 G227G40608 Philippines | Manila Tel : 63G G634G 9 65 Fax : 632G2G634G90069 Singapore Tel : 65G6334G 887 Fax : 65G6334G88500 Taiwan | Hsin Chu Tel : 886G3G 5778G366 Fax :886G3G5770G955 hsiung Tai:wan Tel 886G|Kao 7G213G78 pe TTela :wan 886 5 8 86 Fax :886G2G2G2G25008G G0 00 iland | Bangkok102 TTelha: 66 694 35 Fax : 66G2G2G G694G G113510 EUROPE Austria | Wels Tel : 43G7 4 G 44G39 Fax : 43G72242222 44 393 22 G CGopen Denmark hagen Tel : 45G445 G 8 8 Fax : 45G448052G28229 France | Paris Tel : 33G G69G53G63G Fax : 33G11G69G30G9020 G79 Germany | Dusseldorf Tel : 49G 9G37664 German212y | Munich00 Tel : 49G89G6 7G 44G Fax : 49G89G6227G11440G44 Germany | Pforzheim Tel : 49G7 3 G4 475 Italy | Mi2lan1 2 0 Tel : 39G 33 G74 6 Fax : 390G03311G4662 78111 Italy | Venice Tel : 39G 49G76 5 86 Netherlan ds |2Drunen Tel : 3 G4 6G69 399 Fax : 311G4116G6900340 Poland | Warsaw Tel : 48G G33 5737 Spain |22Madr2id Tel : 34G9 G7 8G 8G9 Fax : 34G911G70080G08G901 Sweden | Stockholm Tel : 46G8G 5 9 G4654 UK | Woki0ng0ham Tel : 44G 8G 9 G58 Fax : 44G11118G9212 1G580020 5 Microchip Technology Inc. 20 1
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