Microchip Technology MRF24J40MB Spread Spectrum Transmitter User Manual MRF24J40MA
Microchip Technology Inc Spread Spectrum Transmitter MRF24J40MA
Users Manual
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| Document ID | 1143836 |
| Application ID | sN5mNv5smPoof0cl0lbJvQ== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 57.85kB (723097 bits) |
| Date Submitted | 2009-07-23 00:00:00 |
| Date Available | 2009-07-23 00:00:00 |
| Creation Date | 2009-07-07 15:34:40 |
| Producing Software | Acrobat Distiller 8.1.0 (Windows) |
| Document Lastmod | 2009-07-07 15:39:15 |
| Document Title | MRF24J40MA.book |
| Document Creator | FrameMaker 8.0 |
MRF24J40MB Data Sheet 2.4 GHz IEEE Std. 802.15.4™ 20 dBm RF Transceiver Module © 2009 Microchip Technology Inc. Preliminary DS70599B Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, Omniscient Code Generation, PICC, PICC-18, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70599B-page ii Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 2.4 GHz IEEE Std. 802.15.4™ 20 dBm RF Transceiver Module Features: RF/Analog Features: • IEEE Std. 802.15.4™ Compliant RF Transceiver • Supports ZigBee®, MiWi™, MiWi P2P and Proprietary Wireless Networking Protocols • Small Size: 0.9" x 1.3" (22.9 mm x 33.0 mm), Surface Mountable • Integrated Crystal, Internal Voltage Regulator, Matching Circuitry, Power Amplifier, Low Noise Amplifier and PCB Antenna • Easy Integration into Final Product – Minimize Product Development, Quicker Time to Market • Radio Regulation Certified for United States (FCC), Canada (IC) and Europe (ETSI) • Compatible with Microchip Microcontroller Families (PIC16F, PIC18F, PIC24F/H, dsPIC33 and PIC32) • Up to 4000 ft. Range • ISM Band 2.405-2.48 GHz Operation • Data Rate: 250 kbps • -102 dBm Typical Sensitivity with -23 dBm Maximum Input Level • +20 dBm Typical Output Power with 56 dB TX Power Control Range • Integrated Low Phase Noise VCO, Frequency Synthesizer and PLL Loop Filter • Digital VCO and Filter Calibration • Integrated RSSI ADC and I/Q DACs • Integrated LDO • High Receiver and RSSI Dynamic Range Operational: • • • • Operating Voltage: 2.4-3.6V (3.3V typical) Temperature Range: -40°C to +85°C Industrial Simple, Four-Wire SPI Interface Low-Current Consumption: - RX mode: 25 mA (typical) - TX mode: 130 mA (typical) - Sleep: 5 μA (typical) FIGURE 1: MAC/Baseband Features: • Hardware CSMA-CA Mechanism, Automatic ACK Response and FCS Check • Independent Beacon, Transmit and GTS FIFO • Supports all CCA modes and RSS/LQI • Automatic Packet Retransmit Capable • Hardware Security Engine (AES-128) with CTR, CCM and CBC-MAC modes • Supports Encryption and Decryption for MAC Sublayer and Upper Layer PIN DIAGRAM GND RESET WAKE INT SDI SCK © 2009 Microchip Technology Inc. 12 11 10 Preliminary GND GND VIN NC CS SDO DS70599B-page 1 MRF24J40MB Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 7 3.0 Regulatory Approval................................................................................................................................................................... 17 4.0 Electrical Characteristics ........................................................................................................................................................... 21 Appendix A: Revision History............................................................................................................................................................... 23 Index ................................................................................................................................................................................................... 25 The Microchip Web Site ....................................................................................................................................................................... 27 Customer Change Notification Service ................................................................................................................................................ 27 Customer Support ................................................................................................................................................................................ 27 Reader Response ................................................................................................................................................................................ 28 Product Identification System............................................................................................................................................................... 29 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70599B-page 2 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 1.0 DEVICE OVERVIEW 1.1 The MRF24J40MB is a 2.4 GHz IEEE Std. 802.15.4™ compliant, surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier, Low Noise Amplifier and PCB antenna. The MRF24J40MB module operates in the non-licensed 2.4 GHz frequency band. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market. The MRF24J40MB module is compatible with Microchip’s ZigBee®, MiWi™ and MiWi P2P software stacks. Each software stack is available as a free download, including source code, from the Microchip web site: http://www.microchip.com/wireless. Interface Description Figure 1-1 shows a simplified block diagram of the MRF24J40MB module. The module is based on the Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver IC. The module interfaces to many popular Microchip PIC® microcontrollers via a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground, as shown in Figure 1-2. Table 1-1 provides the pin descriptions. Data communications with the MRF24J40MB module are documented in the “MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer to the MRF24J40 Data Sheet for specific serial interface protocol and register definitions. The MRF24J40MB module has received regulatory approvals for modular devices in the United States (FCC), Canada (IC) and Europe (ETSI). Modular approval removes the need for expensive RF and antenna design, and allows the end user to place the MRF24J40MB module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter). Note: See Section 3.0 “Regulatory Approval” for specific requirements to be followed by the integrator. FIGURE 1-1: MRF24J40MB BLOCK DIAGRAM MRF24J40MB IEEE Std. 802.15.4™ Module MRF24J40 PA PCB Antenna Interface Physical SPI Digital I/O MAC Power Management LNA Power 20 MHz Crystal © 2009 Microchip Technology Inc. Preliminary DS70599B-page 3 MRF24J40MB TABLE 1-1: Pin PIN DESCRIPTION Symbol Type Description GND Power RESET DI Global hardware Reset pin WAKE DI External wake-up trigger INT DO Interrupt pin to microcontroller SDI DI Serial interface data input SCK DI Serial interface clock SDO DO Serial interface data output from MRF24J40 Ground CS DI Serial interface enable NC — No connection 10 VIN Power Power supply 11 GND Ground Ground 12 GND Ground Ground Legend: Pin type abbreviation: D = Digital, I = Input, O = Output FIGURE 1-2: MICROCONTROLLER TO MRF24J40MB INTERFACE PIC® MCU DS70599B-page 4 MRF24J40MB I/O CS SDO SDI SDI SDO SCK SCK INTx INT VIN GND I/O WAKE I/O RESET Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 1.2 FIGURE 1-4: Mounting Details The MRF24J40MB is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 0.032" thick with castellated mounting points on the edge. Figure 1-4 is a recommended host PCB footprint for the MRF24J40MB. RECOMMENDED PCB FOOTPRINT The MRF24J40MB has an integrated PCB antenna. For the best performance, follow the mounting details shown in Figure 1-5. It is recommended that the module be mounted on the edge of the host PCB, and an area around the antenna, approximately 1.2", be kept clear of metal objects. A host PCB ground plane around the MRF24J40MB acts as a counterpoise to the PCB antenna. It is recommended to extend the ground plane at least 0.4" around the module. FIGURE 1-3: MODULE DETAILS © 2009 Microchip Technology Inc. Preliminary DS70599B-page 5 MRF24J40MB FIGURE 1-5: MOUNTING DETAILS 1.2” Keep area around antenna (approximately 1.2 inches) clear of metallic structures for best performance Edge of PCB 1.2” 0.315” 0.4” 0.4” PCB Ground Plane (Counterpoise) Underneath and extend as far as possible to the sides and below the module (at least 0.4 inches on each side) for best performance DS70599B-page 6 0.4” Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 2.0 CIRCUIT DESCRIPTION 2.1 The MRF24J40MB is a complete 2.4 GHz IEEE Std. 802.15.4™ compliant surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier, Low Noise Amplifier and PCB antenna. The MRF24J40MB module interfaces to many popular Microchip PIC microcontrollers via a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground. Data communications with the MRF24J40MB module are documented in the “MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer to the MRF24J40 Data Sheet for specific serial interface protocol and register definitions. Schematic A schematic diagram of the module is shown in Figure 2-1 and the Bill of Materials (BOM) is shown in Table 2-1. The MRF24J40MB module is based on the Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver IC (U1). The serial I/O (SCK, SDI, SDO and CS), RESET, WAKE and INT pins are brought out to the module pins. The SDO signal is tri-state buffered by IC7 to solve a silicon errata, where the SDO signal does not release to a high-impedance state, after the CS pin returns to its inactive state. Crystal, X1, is a 20 MHz crystal with a frequency tolerance of ±10 ppm @ 25°C to meet the IEEE Std. 802.15.4 symbol rate tolerance of ±40 ppm. A balun is formed by components: L1, L3, C2 and C3. L2 is an RF choke and pull-up for the RFP and RFN pins on the MRF24J40. C4 is a DC block capacitor. RF switches, IC2 and IC4, switch between the power amplifier, IC3, when transmitting and low noise amplifier, IC5, when receiving. A low-pass filter is formed by components: L10, L11, C31, C32 and C36. The remaining passive components provide bias and decoupling. © 2009 Microchip Technology Inc. Preliminary DS70599B-page 7 MRF24J40MB MRF24J40MB SCHEMATIC 1 MF 20 MHz 10 MF 2.2 MF FIGURE 2-1: DS70599B-page 8 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB TABLE 2-1: MRF24J40MB BILL OF MATERIALS Designator Description Manufacturer Part Number C2 Chip Capacitor 0402 COG 0.5P Johanson Technology 500R07S0R5AV4T C3 Chip Capacitor 0402 COG 0.5P Johanson Technology 500R07S0R5AV4T C4 Chip Capacitor 0402 COG 1.0P Johanson Technology 500R07S1R0BV4T C5 Chip Capacitor 0402 COG 1.5P Murata GRM1555C1H1R5CZ01D C6 Not Used C7 Chip Capacitor 0402 COG 4.7P Murata GRM1555C1H4R7CZ01D C8 Chip Capacitor 0402 COG 4.7P Murata GRM1555C1H4R7CZ01D C9 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D C10 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D C11 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C12 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C13 Chip Capacitor 0402 COG 15P Murata GRM1555C1H150JZ01D C14 Chip Capacitor 0402 COG 15P Murata GRM1555C1H150JZ01D C16 Chip Capacitor 0402 COG 22P Murata GRM1555C1H220JZ01D C17 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C18 Chip Capacitor 0402 COG 5.6P Murata GRM1555C1H5R6CZ01D C19 Chip Capacitor 0402 COG 1.8P Murata GRM1555C1H1R8CZ01D C20 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D C21 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C22 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D C23 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C24 Not Used C25 Chip Capacitor 0402 X7R 1N Murata GRM155R71H102KA01D C26 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C27 Chip Capacitor 0402 COG 10P Murata GRM1555C1H100JZ01D C28 Chip Capacitor 0402 COG 100P Murata GRM1555C1H101JZ01D C29 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C30 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C31 Chip Capacitor 0402 COG 1.5P Johanson Technology 500R07S1R5BV4T C32 Chip Capacitor 0402 COG 0.4P Johanson Technology 500R07S0R4AV4T C33 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D C34 Chip Capacitor 0402 COG 18P Murata GRM1555C1H180JZ01D C35 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C36 Not Used C37 Chip Capacitor 0805 X5R 10U Murata GRM21BR60J106ME19L C38 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C39 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C40 Chip Capacitor 0402 X5R 1U Murata GRM155R60J105ME19D C41 Chip Capacitor 0402 X7R 10N Murata GRM155R71E103KA01D C42 Chip Capacitor 0402 X7R 10N Murata GRM155R71E103KA01D C43 Chip Capacitor 0402 COG 100P Murata GRM1555C1H101JZ01D C44 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C45 Note: Capacitors and inductors cannot be substituted. © 2009 Microchip Technology Inc. Preliminary DS70599B-page 9 MRF24J40MB TABLE 2-1: MRF24J40MB BILL OF MATERIALS (CONTINUED) Designator Description Manufacturer Part Number C46 Chip Capacitor 0402 X5R 100N Murata GRM155R61A104KA01D C47 Chip Capacitor 0402 COG 47P Murata GRM1555C1H470JZ01D C48 Chip Capacitor 0603 X5R 2.2U Murata GRM188R60J225ME01D IC1 802.15.4 Radio Microchip MRF24J40-I/ML IC2 Switch SPDT Skyworks AS179-92 IC3 Power Amplifier SiGe PA2423L-R IC4 Switch SPDT Skyworks AS179-92 IC5 Low Noise Amplifier NEC UPC8233TK-E2-A IC6 Voltage Regulator Microchip MCP1700T-3302E/TT IC7 Buffer-SC70 Package Fairchild NC7SZ125P5X L1 Chip Inductor 0402 8.2N Panasonic ELJ-RF8N2JFB L2 Chip Inductor 0402 2.7N Panasonic ELJ-RF2N7DFB L3 Chip Inductor 0402 4.7N Panasonic ELJ-RF4N7DFB L4 Chip Resistor 0402 0Ohms Dale CRCW04020000Z0ED L5 Chip Inductor 0402 3.3N Panasonic ELJ-RF3N3DFB L6 Chip Inductor 0402 3.9N Panasonic ELJ-RF3N9DFB L7 Chip Inductor 0402 1.5N Panasonic ELJ-RF1N5DFB L8 Chip Inductor 0402 18N Panasonic ELJ-RF18NJFB L9 Chip Inductor 0402 1.5N Panasonic ELJ-RF1N5DFB L10 Chip Inductor 0402 2.2N Panasonic ELJ-RF2N2DFB L11 Chip Inductor 0402 2.7N Panasonic ELJ-RF2N7DFB R1 Chip Resistor 0402 10Ohms 5% Dale CRCW040210R0JNED R2 Not Used R3 Chip Resistor 0402 2.2Ohms 5% Dale CRCW04022R20JNED R4 Chip Resistor 0402 10K 5% Dale CRCW040210K0JNED R7 Not Used R8 Not Used X1 Note: Shield-Custom TBD 20 MHz Crystal Abracon ABM8-156-20.0000MHZ-T Capacitors and inductors cannot be substituted. DS70599B-page 10 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 2.2 Printed Circuit Board The MRF24J40MB module printed circuit board is constructed with FR4 material, four layers and 0.032 inches thick. The layers are shown in Figure 2-2 through Figure 2-6. The stack up of the PCB is shown in Figure 2-7. FIGURE 2-2: TOP SILK SCREEN FIGURE 2-3: TOP COPPER FIGURE 2-4: Note: © 2009 Microchip Technology Inc. Preliminary LAYER 2 – GROUND PLANE Top view positive Gerber. DS70599B-page 11 MRF24J40MB FIGURE 2-5: Note: LAYER 3 – POWER PLANE FIGURE 2-6: Note: Top view positive Gerber. FIGURE 2-7: BOTTOM COPPER Top view. PCB LAYER STACK UP 1/2 oz. Copper Top Copper 8 mil FR4 1/2 oz. Copper Ground Plane 0.032‚ 12 mil FR4 +/- 0.005‚ 1/2 oz. Copper Power Plane 8 mil FR4 1/2 oz. Copper DS70599B-page 12 Preliminary Bottom Copper © 2009 Microchip Technology Inc. MRF24J40MB 2.3 PCB Antenna (www.ansoft.com). The design goal was to create a compact, low-cost antenna with the best radiation pattern. Figure 2-9 shows the simulation drawing and Figure 2-10 and Figure 2-11 show the 2D and 3D radiation patterns, respectively. As shown by the radiation patterns, the performance of the antenna is dependant upon the orientation of the module. Figure 2-12 shows the impedance simulation and Figure 2-13 shows the SWR simulation. The discrete matching circuitry matches the impedance of the antenna with the MRF24J40 transceiver IC. The PCB antenna is fabricated on the top copper trace. Figure 2-8 shows the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB following the recommendations in Section 1.2 “Mounting Details”. The Printed Circuit Board (PCB) antenna was designed and simulated using Ansoft Designer® and HFSS™ 3D full-wave solver software by Ansoft Corporation FIGURE 2-8: PCB ANTENNA DIMENSIONS 1.3 22.0 1.0 6.0 4.2 8.6 3.8 2.0 5.3 1.0 9.6 0.5 1.2 0.5 3.37 6.6 4.3 1.54 0.85 1.2 3.82 1.0 2.0 1.0 1.0 6.6 0.72 Note 1: Dimensions are in mm and tolerance is +/– 0.05 mm. © 2009 Microchip Technology Inc. Preliminary DS70599B-page 13 MRF24J40MB FIGURE 2-9: PCB ANTENNA SIMULATION DRAWING FIGURE 2-10: SIMULATED 2D RADIATION PATTERN DS70599B-page 14 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB FIGURE 2-11: SIMULATED 3D RADIATION PATTERN FIGURE 2-12: SIMULATED PCB ANTENNA IMPEDANCE © 2009 Microchip Technology Inc. Preliminary DS70599B-page 15 MRF24J40MB FIGURE 2-13: DS70599B-page 16 SIMULATED PCB ANTENNA SWR Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 3.0 REGULATORY APPROVAL The user’s manual should include the following statement: The MRF24J40MB module has received regulatory approvals for modular devices in the United States, Canada and European countries. Modular approval allows the end user to place the MRF24J40MB module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The integrator may still be responsible for testing the end product for any additional compliance requirements required with this module, installed (for example: digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed. Annex F of the IEEE Std. 802.15.4 document has a good summary of regulatory requirements in various countries concerning IEEE Std. 802.15.4 devices. The standard can be downloaded from the IEEE Standards web page: http://standards.ieee.org/getieee802/802.15.html. Refer to the specific country radio regulations for details on regulatory compliance. 3.1 United States • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 3.1.1 The MRF24J40MB has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” 15.247 and modular approval in accordance with FCC Public Notice DA 00-1407 Released: June 26, 2000, Part 15 Unlicensed Modular Transmitter Approval. The MRF24J40MB module can be integrated into a finished product without obtaining subsequent and separate FCC approvals. The MRF24J40MB module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: OA3MRF24J40MB -orContains FCC ID: OA3MRF24J40MB This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. © 2009 Microchip Technology Inc. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: MRF24J40MB SETTINGS To meet the FCC requirements, the following settings must be observed by the integrator: • The MRF24J40MB transmit power setting (RFCON3 0x203) cannot exceed -1.9 dB. • Only channels 11 through 25 may be selected (RFCON0 0x200). 3.1.2 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65 “Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields” provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. Preliminary DS70599B-page 17 MRF24J40MB The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance: To satisfy FCC RF exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the MRF24J40MB module is used in a portable application (antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. 3.1.3 HELPFUL WEB SITES Federal Communications http://www.fcc.gov 3.2 Commission (FCC): Canada The MRF24J40MB module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. From Section 7.1.1, RSS-Gen, Issue 2, June 2007, Modular Transmitter Approval: Host devices which contain separately certified modules do not need to be recertified, provided that they meet the following conditions: a) b) c) Note: The host device, as a stand-alone unit without any separately certified modules, complies with all applicable Radio Standards Specifications. The host device and all the separately certified modules it contains jointly meet the RF exposure compliance requirements of RSS-102, if applicable. The host device complies with the certification labeling requirements of each of the modules it contains. From Section 5.2, RSS-Gen, Issue 2, June 2007, Equipment Labels: All Category I radio equipment intended for use in Canada shall permanently display on each transmitter, receiver or inseparable combination thereof, the applicant’s name (i.e., manufacturer’s name, trade name or brand name), model number and certification number. This information shall be affixed in such a manner as to not be removable except by destruction or defacement. The size of the lettering shall be legible without the aid of magnification, but is not required to be larger than an 8-point font size. If the device is too small to meet this condition, the information can be included in the user manual upon agreement with Industry Canada. Label: Contains IC: 7693A-24J40MB From Section 7.1.6, RSS-Gen, Issue 2, June 2007, Digital Circuits: If the device contains digital circuitry that is not directly associated with the radio transmitter, the device shall also have to comply with ICES-003, Class A or B as appropriate, except for ICES-003 labeling requirements. The test data obtained (for the ICES-003 tests) shall be kept by the manufacturer or importer whose name appears on the equipment label, and made available to Industry Canada on request, for as long as the model is being marketed in Canada. 3.2.1 MRF24J40MB SETTINGS To meet Industry Canada (IC) requirements, the following settings must be observed by the integrator: • The MRF24J40MB transmit power setting (RFCON3 0x203) cannot exceed -1.9 dB. • Only channels 11 through 25 may be selected (RFCON0 0x200). 3.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ Compliance of a module in its final configuration is the responsibility of the applicant. A host device will not be considered certified if the instructions regarding antenna configuration provided in the original description, of one or more separately certified modules it contains, were not followed DS70599B-page 18 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 3.3 3.3.1 Europe The MRF24J40MB module has been certified for use in European countries. The following testing has been completed: Test standard ETSI EN 300 328 V1.7.1 (2006-10): • • • • Maximum Transmit Power Maximum EIRP Spectral Density Frequency Range Radiated Emissions Test standards ETSI EN 301 489-1:2008 and ETSI EN 301 489-17:2008: • Radiated Emissions • Electrostatic Discharge • Radiated RF Susceptibility A helpful document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, downloadable from the European Radio Communications Office (ERO): http://www.ero.dk. The end user is responsible for ensuring compliance with harmonized frequencies and labeling requirements for each country the end device is marketed and sold. © 2009 Microchip Technology Inc. MRF24J40MB SETTINGS To meet ETSI requirements, the following settings must be observed by the integrator: • The MRF24J40MB transmit power setting (RFCON3 0x203) cannot exceed -14.9 dB. This is to meet the requirements of ETSI EN 300 328 v1.7.1 (2006-05), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, “For wideband modulations other then FHSS (e.g., DSSS, OFDM, etc.), the maximum e.i.r.p. spectral density is limited to 10 mW per MHz”. The output power of the MRF24J40MB module, at this setting with the PA enabled, is 9 dBm. • Only channels 11 through 25 may be selected (RFCON0 0x200). 3.3.2 HELPFUL WEB SITES: Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org/ European Telecommunications Standards Institute (ETSI): http://www.etsi.org/ European Radio Communications Office (ERO): http://www.ero.dk/ Preliminary DS70599B-page 19 MRF24J40MB NOTES: DS70599B-page 20 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Operating Temperature -40 — +85 °C Supply Voltage for RF, Analog and Digital Circuits 2.4 — 3.6 Supply Voltage for Digital I/O 2.4 3.3 3.6 Input High Voltage (VIH) 0.5 x VDD — VDD + 0.3 Input Low Voltage (VIL) -0.3 — 0.2 x VDD TABLE 4-2: CURRENT CONSUMPTION (TA = 25°C, VDD = 3.3V) Chip Mode Condition Min Typ Max Units Sleep Sleep Clock Disabled — 5 μA — μA TX At Maximum Output Power — 130 mA — mA — 25 mA — mA Min Typ Max Units 2.405 — 2.480 GHz RF Sensitivity — -102 — dBm Maximum RF Input -23 — — dBm — -60 — dBm Input Return Loss -8 -12 — dB Noise Figure (including matching) — 1.9 — dB RX TABLE 4-3: RECEIVER AC CHARACTERISTICS Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz Parameters RF Input Frequency LO Leakage Condition Compatible to IEEE Std. 802.15.4™, 2003 Measured at Balun Matching Network Input at Frequency, 2.405-2.48 GHz Adjacent Channel Rejection @ +/-5 MHz 30 — — dB Alternate Channel Rejection @ +/-10 MHz 40 — — dB RSSI Range — 50 — dB RSSI Error -5 — dB © 2009 Microchip Technology Inc. Preliminary DS70599B-page 21 MRF24J40MB TABLE 4-4: TRANSMITTER AC CHARACTERISTICS Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz Parameters Min Typ Max Units RF Carrier Frequency 2.405 — 2.480 GHz Maximum RF Output Power — 20 — dBm RF Output Power Control Range — 56 — dB — 1.25 — dB Carrier Suppression — -30 — dBc TX Spectrum Mask for Offset Frequency > 3.5 MHz, O-QPSK Signal at 0 dBm Output Power -33 — — dBm TX EVM — 15 — TX Gain Control Resolution DS70599B-page 22 Condition Programmed by Register Preliminary © 2009 Microchip Technology Inc. MRF24J40MB APPENDIX A: REVISION HISTORY Revision A (June 2009) Original release of this document. Revision B (July 2009) Added Section 3.0 “Regulatory Approval”. © 2009 Microchip Technology Inc. Preliminary DS70599B-page 23 MRF24J40MB NOTES: DS70599B-page 24 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB INDEX AC Characteristics Receiver ......................................................................21 Transmitter .................................................................. 22 Antenna Impedance Simulated PCB ............................................................ 15 PCB Antenna ...................................................................... 13 Dimensions ................................................................. 13 Simulation Drawing ..................................................... 14 SWR ........................................................................... 16 PCB Layers Bottom Copper............................................................ 12 Layer 2 – Ground Plane.............................................. 11 Layer 3 – Power Plane ............................................... 12 Stack Up ..................................................................... 12 Top Copper ................................................................. 11 Top Silk Screen .......................................................... 11 Pin Description...................................................................... 4 Pin Diagram .......................................................................... 1 Printed Circuit Board (PCB) ................................................ 11 Bill of Materials (BOM) .......................................................... 9 Block Diagrams Microcontroller to MRF24J40MB Interface.................... 4 MRF24J40MB ............................................................... 3 Circuit Description ................................................................. 7 Customer Change Notification Service ............................... 26 Customer Notification Service ............................................. 26 Customer Support ............................................................... 26 Electrical Characteristics .....................................................21 Current Consumption .................................................. 21 Recommended Operating Conditions ......................... 21 Errata..................................................................................... 2 European Radio Communications (ERC)............................19 Radiation Pattern 2D ............................................................................... 14 3D ............................................................................... 15 Reader Response ............................................................... 27 Regulatory Approval ........................................................... 17 Canada ....................................................................... 18 Settings............................................................... 18 Europe ........................................................................ 19 Settings............................................................... 19 United States .............................................................. 17 Settings............................................................... 17 Revision History .................................................................. 23 RF Exposure ....................................................................... 17 RF/Analog Features.............................................................. 1 FCC ID Number................................................................... 17 FCC RF Exposure Compliance ........................................... 18 Schematic MRF24J40MB ............................................................... 8 Serial I/O SCK, SDI, SDO, CS...................................................... 7 Short Range Devices (SRD) ............................................... 19 Specific Absorption Rate (SAR).......................................... 18 SPI ........................................................................................ 7 Details Module ..........................................................................5 Mounting ....................................................................... 6 Recommended PCB Footprint ...................................... 5 Helpful Web Sites.......................................................... 18, 19 Interface Description ............................................................. 3 Internet Address .................................................................. 26 MAC/Baseband Features ...................................................... 1 Microchip Internet Web Site ................................................ 26 MiWi P2P............................................................................... 3 MiWi Protocol ........................................................................3 More Information ................................................................... 2 Customer Notification System ....................................... 2 Errata ............................................................................2 Mounting Details.................................................................... 5 MRF24J40 Data Sheet...................................................... 3, 7 WWW Address.................................................................... 26 WWW, On-Line Support ....................................................... 2 ZigBee Protocol .................................................................... 3 Overview ............................................................................... 3 DS70599B-page 25 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB NOTES: DS70599B-page 26 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2009 Microchip Technology Inc. Preliminary DS70599B-page 27 MRF24J40MB READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 7924150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: MRF24J40MB Literature Number: DS70599B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70599B-page 28 Preliminary © 2009 Microchip Technology Inc. MRF24J40MB PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X Device Module Module Type Tape and Reel Temperature Range Device MRF24J40MB; VDD range 2.4V to 3.6V Temperature Range = -40°C to © 2009 Microchip Technology Inc. +85°C Examples: a) b) MRF24J40MB-I = Industrial temp. tray MRF24J40MBT-I = Industrial temp., tape and reel. (Industrial) Preliminary DS70599B-page 29 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 03/26/09 DS70599B-page 30 Preliminary © 2009 Microchip Technology Inc.
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