Multi Tech Systems 92U07G30822 GSM/EDGE/HSDPA Modem User Manual
Multi Tech Systems Inc GSM/EDGE/HSDPA Modem
User Manual
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Universal Socket Connectivity Embedded Device Networking Solutions Hardware Guide for Developers Copyright and Technical Support Universal Socket Connectivity Hardware Guide for Developers for HDSPA Approval Rev. A, 08/267/07 Copyright This publication may not be reproduced, in whole or in part, without prior expressed written permission from MultiTech Systems, Inc. All rights reserved. Copyright © 2004-7 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties with respect to the contents hereof and specifically disclaim any implied warranties of merchantability or fitness for any particular purpose. Furthermore, Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. See the Multi-Tech Web site for current revisions of documentation. Trademarks Trademarks and Registered Trademarks of Multi-Tech Systems, Inc. are SocketModem,SocketWireless and the Multi-Tech logo. Patents This device covered by one or more of the following patents: 6,031,867; 6,012,113; 6,009,082; 5,905,794; 5,864,560; 5,815,567; 5,815,503; 5,812,534; 5,809,068; 5,790,532; 5,764,628; 5,764,627; 5,754,589; 5,724,356; 5,673,268; 5,673,257; 5,644,594; 5,628,030; 5,619,508; 5,617,423; 5,600,649; 5,592,586; 5,577,041; 5,574,725; 5,559,793; 5,546,448; 5,546,395; 5,535,204; 5,500,859; 5,471,470; 5,463,616; 5,453,986; 5,452,289; 5,450,425; 5,355,365; 5,309,562; 5,301,274. Other Patents Pending. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 Phone: 763-785-3500 or 800-328-9717 Fax: 763-785-9874 Internet Address: http://www.multitech.com Technical Support Country Europe, Middle East, Africa: U.S., Canada, all others: By Email support@multitech.co.uk support@multitech.com By Phone +(44) 118 959 7774 800-972-2439 or 763-717-5863 Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Chapter 1 - Universal Socket Connectivity Multi-Tech Embedded Solutions Multi-Tech’s embedded device networking solutions instantly add communication ability to your existing or new product with minimal engineering effort giving you an edge on your competition while accelerating your time-tomarket. Our universal socket family of embedded solutions is designed around a flexible comm-port architecture to provide analog or ISDN dial-up, cellular, Wi-Fi or Bluetooth wireless, or Ethernet socket connectivity with interchangeable modules. This means you can utilize one system design and populate it with your preferred connectivity option giving you flexibility and a seamless migration path to future technologies. Universal Socket Connectivity Features • • • • • Flexible comm-port architecture Interchangeable socket modules Cost-effective system design Easy migration to future technologies Complete global compliance The Universal Socket Design Each pin on a SocketModem corresponds to a particular function. The universal socket design provides a universal location for each function pin. This allows each SocketModem to be used in a common board. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Universal Developer Kit Contents All products covered in this document can be evaluated using the MTSMI-UDK (Universal Developer Kit). • • • • • • • • • • • • • • • • • • • One MTSMI-UDK Developer Board One 100-240V 9V-1A power supply w/IEC-320 connector One IEC-320 power cord w/US type plug One IEC-320 power cord w/EURO type plug One IEC-320 power cord w/UK type plug One RJ-45 cable (CARJ45NK-RJ45 7’8C non-keyed) One 7 foot RJ-11 cable plug - plug/4C One SMA jack to MMCX plug antenna cable (for CDMA and GPRS antennas) One RSMA jack to MMCX plug antenna cable (for Bluetooth antenna) One antenna 850/1900, right angle, 3-stripe (for CDMA and GPRS modules) One antenna 900/1800, right angle 4-stripe (for GPRS modules) One 2.4GHz ½ WAVE antenna with reverse polarity (for SocketWireless Bluetooth and SocketWireless Wi-Fi) One DB9F-DB25M 6 foot modem serial cable One generic CDMA Activation Notice One Verizon Activation Notice One Spring Activation Notice One Cingular Activation Notice One Universal Socket Connectivity Developer CD with BVRP Mobile PhoneTools One Promo Screwdriver AT Commands Are Included on the Developer CD AT Commands Multi-Tech provides Reference Guides for each SocketModem's AT commands, fax commands, and voice commands. These reference guides are available on the CD included in the Developer Kit. They are also available by email at mailto:oemsales@multitech.com or by using the Developer Guide Request Form on Multi-Tech's Web site. Fax Commands Fax Commands are included in the AT Command Reference Guide when applicable to the product. They are available on the CD included in the Developer Kit. Note: Fax Commands supported by product: • SocketModem MT5600SMI supports Class 1 & 1.0 • SocketModem MT5656SMI supports Class 1 & 2 (not 2.0/2.1) • SocketModem MT9234SMI supports all Class 1 and Class 2 commands (Class 1, 1.0, 2, 2.0/2.1) • SocketModem MT5634SMI supports all Class 1 and Class 2 commands (Class 1, 1.0, 2, 2.0/2.1) • Wireless SocketModem GPRS MTSMC-G supports Class 1 core commands only (defined by ITU T.31) • Wireless SocketModem CDMA MTSMC-C supports Class 2.0 Group 3 • Wireless SocketModem EDGE MTSMC-E supports Class 1 Group 3 • Wireless SocketModem HSDPA MTSMC-H supports Class 1 Group 3 Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Design Considerations Noise Suppression Design Considerations Engineering noise-suppression practices must be adhered to when designing a printed circuit board (PCB) containing the SocketModem module. Suppression of noise is essential to the proper operation and performance of the modem itself and for surrounding equipment. Two aspects of noise in an OEM board design containing the SocketModem must be considered: onboard/off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Of particular concern is noise in frequency ranges affecting modem performance. On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a separate, but equally important, concern. This type of noise can affect the operation of surrounding equipment. Most local government agencies have stringent certification requirements that must be met for use in specific environments. Proper PC board layout (component placement, signal routing, trace thickness and geometry, etc.) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification. Other aspects of proper noise-suppression engineering practices are beyond the scope of this designer guide. The designer should consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes. PC Board Layout Guidelines In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. All power and ground traces should be 0.05 inches wide. The recommended hole size for the SocketModem pins is 0.036 in. +/-0.003 in. in diameter. Spacers can be used to hold the SocketModem vertically in place during the wave solder process. A spacer should be placed on pin 32 and pin 64 of the SocketModem. A suggested part number for the spacer is BIVAR 9380.130 for P1 (0.310in) option SocketModems. The spacers can be left on permanently and will not effect operation. All creepages and clearances for the SocketModem have been designed to meet requirements of safety standards EN60950 or EN60601. The requirements are based on a working voltage of 125V or 250V. When the recommended DAA* circuit interface is implemented in a third party design, all creepage and clearance requirements must be strictly followed in order to meet safety standards. The third party safety design must be evaluated by the appropriate national agency per the required specification. User accessible areas: Based on where the third party design is to be marketed, sold, or used, it may be necessary to provide an insulating cover over all TNV exposed areas. Consult with the recognized safety agency to determine the requirements. Note: Even if the recommended design considerations are followed, there are no guarantees that a particular system will comply with all the necessary regulatory requirements. It is imperative that specific designs be completely evaluated by a qualified/recognized agency. *DAA stands for Data Access Arrangement. DAA is the telephone line interface of the module. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Electromagnetic Interference (EMI) Considerations The following guidelines are offered to specifically help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines but are mentioned again to reinforce their importance. In order to minimize the contribution of the SocketModem-based design to EMI, the designer must understand the major sources of EMI and how to reduce them to acceptable levels. 1. Keep traces carrying high frequency signals as short as possible. 2. Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. 3. Decouple power from ground with decoupling capacitors as close to the SocketModem module power pins as possible. 4. Eliminate ground loops, which are unexpected current return paths to the power source and ground. 5. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification. 6. Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines. 7. Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. 8. Locate cables and connectors so as to avoid coupling from high frequency circuits. 9. Lay out the highest frequency signal traces next to the ground grid. 10. If a multilayer board design is used, make no cuts in the ground or power planes and be sure the ground plane covers all traces. 11. Minimize the number of through-hole connections on traces carrying high frequency signals. 12. Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. 13. On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. 14. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point. Electrostatic Discharge Control All electronic devices should be handled with certain precautions to avoid damage due to the accumulation of static charge. See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing. Multi-Tech Systems, Inc. strives to follow all of these recommendations. Input protection circuitry has been incorporated into the Multi-Tech devices to minimize the effect of this static buildup, proper precautions should be taken to avoid exposure to electrostatic discharge during handling. Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). Multi-Tech recommends that you use our packaging when returning a product and when you ship your products to your customers. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Mechanicals and Schematics Mechanical Dimensions in Inches Note: This tooling hole is not on all models. 64 63 62 61 60 59 58 57 56 55 54 1 2 3 4 5 6 7 8 9 10 11 53 12 52 13 51 14 50 15 49 16 48 17 47 18 46 19 45 20 44 21 43 22 42 23 41 24 40 25 39 26 38 27 37 28 36 29 35 30 34 31 33 32 Dimensions Are Shown in Inches Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 1 – Universal Socket Connectivity Mechanical Dimensions in Millimeters Dimensions Are Shown in Millimeters Maximum Component Height Product Measurement from top of board to highest topside component Measurement from bottom of board to lowest bottom-side component SocketModem – MT5600SMI SocketModem – MT5656SMI SocketModem – MT5634SMI SocketModem – MT9234SMI SocketModem – MT2492SMI SocketModem – MT2456SMI SocketModem IP – MT2456SMI-IP SocketModem IP – MT5656SMI-IP SocketEthernet IP – MTXCSEM SocketEthernet IP – MT100SEM SocketModem ISDN – MT128SMI SocketModem GPRS – MTSMC-G SocketModem CDMA – MTSMC-C SocketModem EDGE – MTSMC-E SocketModem HSDPA – MTSMC-H SocketWireless Wi-Fi – MT800SWM SocketWireless Bluetooth – MTS2BTSMI .110 inches (2.794 mm) .212 inches (5.384 mm) .290 inches (7.366 mm) .290 inches (7.366 mm) .177 inches (4.495 mm) .212 inches (5.384 mm) .228 inches (5.791 mm) .212 inches (5.384 mm) .315 inches (8.001 mm) .341 inches (8.661 mm) .299 Inches (7.594 mm) .153 inches (3.886 mm) .238 inches (6.045 mm) .253 inches (6.426 mm) .253 inches (6.426 mm) .202 inches (5.130 mm) .089 inches (2.260 mm) .110 inches (2.794 mm) .110 inches (2.794 mm) .114 inches (2.895 mm) .114 inches (2.895 mm) NA .110 inches (2.794 mm) .114 inches (2.895 mm) .110 inches (2.794 mm) .075 inches (1.905 mm) .110 inches (2.794 mm) .069 inches (1.752 mm) .118 inches (2.997 mm) .118 inches (2.997 mm) .118 inches (2.997 mm) .118 inches (2.997 mm) NA NA Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 2 – SocketModem HSDPA Antenna System for Embedded GSM and CDMA Modems The antenna system for use with Multi-Tech GSM or CDMA modems includes a coax cable to interface between UFL or MMCX connection on the modem and the antenna. RF Specifications GSM/EGSM RF Specifications GSM 850 Frequency RX Frequency TX RF Power Stand EGSM 900 GSM 1800 GSM 1900 869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 1990 MHz 824 to 849 MHz 880 to 915 MHz 1710 to 1785 MHz 1850 to 1910 MHz 2W at 12.5% duty cycle 2W at 12.5% duty cycle 1W at 12.5% duty cycle 1W at 12.5% duty cycle CDMA RF Specifications Frequency RX Frequency TX CDMA 800 CDMA 1900 869 to 894 MHz 824 to 849 MHz 1930 to 1990 MHz 1850 to 1910 MHz Coax Cable An optional 6” antenna cable (SMA Jack to MMCX Plug) can be ordered from Multi-Tech Systems, Inc. Part Number CASMA-MMCX-1 CASMA-MMCX-10 Description SMA to MMCX COAX RF 6 inch cable (Single Pack) SMA to MMCX COAX RF 6 inch cable (Ten Pack) MMCX Plug Cable Specifications Cable Type: Attentuation: Connector Impedance: G-178/u <1.0db 50 ohm Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) Chapter 2 – SocketModem HSDPA Connector An antenna with an SMA connector may be directly connected to a SocketModem GPRS/CDMA through a mating MMCX to SMA adapter. MMCX / SMA Connector Available from Amphenol Amphenol http://www.amphenol.com/ Order No: 908-31100 Antenna GSM/EGSM Antenna Requirements/Specifications Frequency Range: Impedance: VSWR: Typical Radiated Gain: Radiation: Polarization: Wave: 2.4 to 2.5 GHz 50 ohm <2.0:1 0 dBi on azimuth plane Omni Vertical Half Wave Dipole Antennas Available from Multi-Tech: Description Hinged Right Angle 900/1800 MHz Cellular Modem Antenna Hinged Right Angle 800/1900 MHz Cellular Modem Antenna Part Number ANF1-1HRA ANCF2-1HRA PTCRB Requirements Note: There cannot be any alteration to the authorized antenna system. The antenna system must be the same type with similar in-band and out-of-band radiation patterns and maintain the same specifications. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 10 Chapter 2 – SocketModem HSDPA Safety Notices and Warnings Note to OEMs: The following safety statements may be used in the documentation of your final product applications. Telecom Safety Warning 1. 2. 3. 4. 5. 6. 7. 8. 9. Never install telephone wiring during a lightning storm. Never install a telephone jack in wet locations unless the jack is specifically designed for wet locations. This product is to be used with UL and cUL listed computers. Never touch uninsulated telephone wires or terminals unless the telephone line has been disconnected at the network interface. Use caution when installing or modifying telephone lines. Avoid using a telephone during an electrical storm. There may be a remote risk of electrical shock from lightning. Do not use a telephone in the vicinity of a gas leak. To reduce the risk of fire, use only 26 AWG or larger telecommunication line cord. This product must be disconnected from its power source and telephone network interface when servicing. Wireless Safety General Safety The modem is designed for and intended to be used in fixed and mobile applications. “Fixed” means that the device is physically secured at one location and is not able to be easily moved to another location. “Mobile” means that the device is designed to be used in other than fixed locations. Caution: Maintain a separation distance of at least 20 cm (8 inches) is normally maintained between the transmitter’s antenna and the body of the user or nearby persons. The Modem is not designed for or intended to be used in portable applications within 20 cm. (8 inches) of the body of the user. RF Interference Issues It is important to follow any special regulations regarding the use of radio equipment due in particular to the possibility of radio frequency, RF, interference. Please follow the safety advice given below carefully. • Switch OFF your Wireless MultiModem when in an aircraft. The use of cellular telephones in an aircraft may endanger the operation of the aircraft, disrupt the cellular network and is illegal. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. • Switch OFF your Wireless MultiModem when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. • Switch OFF your Wireless MultiModem in hospitals and any other place where medical equipment may be in use. • Respect restrictions on the use of radio equipment in fuel depots, chemical plants or where blasting operations are in progress. • There may be a hazard associated with the operation of your Wireless MultiModem close to inadequately protected personal medical devices such as hearing aids and pacemakers. Consult the manufacturers of the medical device to determine if it is adequately protected. • Operation of your Wireless MultiModem close to other electronic equipment may also cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers’ recommendations. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 11 Chapter 2 – SocketModem HSDPA Vehicle Safety • Do not use your MultiModem while driving. • Respect national regulations on the use of cellular telephones in vehicles. Road safety always comes first. • If incorrectly installed in a vehicle, the operation of Wireless MultiModem telephone could interfere with the correct functioning of vehicle electronics. To avoid such problems, be sure that qualified personnel have performed the installation. Verification of the protection of vehicle electronics should be part of the installation. • The use of an alert device to operate a vehicle’s lights or horn on public roads is not permitted. Maintenance of Your Modem Your Wireless MultiModem is the product of advanced engineering, design, and craftsmanship and should be treated with care. The suggestions below will help you to enjoy this product for many years. • Do not expose the Wireless MultiModem to any extreme environment where the temperature is above 50ºC or humidity is above 90% noncondensing. • Do not attempt to disassemble the Wireless MultiModem. There are no user serviceable parts inside. • Do not expose the Wireless MultiModem to water, rain, or spilled beverages. It is not waterproof. • Do not place the Wireless MultiModem alongside computer discs, credit or travel cards, or other magnetic media. The phone may affect the information contained on discs or cards. • The use of accessories not authorized by Multi-Tech or not compliant with Multi-Tech's accessory specifications may invalidate the warranty of the Wireless MultiModem. • In the unlikely event of a fault in the Wireless MultiModem, contact Multi-Tech Tech Support. Your Responsibility This Wireless MultiModem is your responsibility. Please treat it with care respecting all local regulations. It is not a toy. Therefore, keep it in a safe place at all times and out of the reach of children. Try to remember your Unlock and PIN codes. Become familiar with and use the security features to block unauthorized use and theft. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 12 Chapter 2 – SocketModem HSDPA Waste Electrical and Electronic Equipment Statement Note to OEMs: The statement is included for your information and may be used in the documentation of your final product applications. WEEE Directive The WEEE directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister Directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all Multi-Tech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user’s responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product. July, 2005 Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 13 Chapter 2 – SocketModem HSDPA Restriction of the Use of Hazardous Substances (RoHS) Multi-Tech Systems, Inc. Certificate of Compliance 2002/95/EC Multi-Tech Systems Inc. confirms that MTxxxxSMI, MTSMC-G-F1, MTxxxxSEM, MTIFM, and MTxxxSWM now comply with the chemical concentration limitations set forth in the directive 2002/95/EC of the European Parliament (Restriction Of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS) These Multi-Tech Systems, Inc. products do not contain the following banned chemicals: Lead, [Pb] > 1000 PPM Mercury, [Hg] > 1000 PPM Hexavalent Chromium, [Cr+6] > 1000 PPM Cadmium, [Cd] > 100 PPM Polybrominated Biphenyl, [PBB] > 1000 PPM Polybrominated Diphenyl Ether, [PBDE] > 1000 PPM Moisture Sensitivity Level (MSL) =1 Tin Whisker Growth = None detected Maximum Soldering temperature = 260C (wave only) Notes: 1. Lead usage in some components is exempted by the following RoHS annex; therefore, higher lead concentration would be found in some modules (>1000ppm). a. 2. 3. Lead in high melting temperature type solders (i.e., tin-lead solder alloys containing more than 85% lead). b. Lead in electronic ceramic parts (e.g., piezoelectronic devices). Moisture Sensitivity Level (MSL) – Analysis is based on the components/material used on the board. Tin Whisker Study was done per NEMI guidelines (Elevated temperature cycle of 60°C and non-condensing relative humidity of 87% exposed to this environment for 1000 hours). Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 14 Chapter 2 – SocketModem HSDPA Chapter 2 – SocketModem HSDPA Introduction The Multi-Tech SocketModem HSDPA embedded wireless modem delivers some of the fastest cellular data speeds by utilizing HSDPA technology. It allows users to connect to the Internet and send and receive data faster than possible with an ordinary GSM/GPRS network making it ideal for highly data-intensive applications. Based on industry-standard open interfaces, the SocketModem wireless modem is equipped with quad-band, high-speed RS232 technology, which means it can be used worldwide on all existing GSM networks. In addition, it utilizes Multi-Tech's universal socket design. Product Ordering Information Product Description Region MTSMC-H MTSMC-H-U MTSMI-UDK SocketModem Quad Band HSPDA Class 10 – 5V SocketModem Quad Band HSPDA Class 10 w/USB Universal Developer Kit Global Global Global Order This Product How to Read the Product Codes in the Table Above: UDK HSDPA (High-Speed Downlink Packet Access) USB Universal Developer Kit Other Product Codes: The complete product code will end in .Rx. For example, MTSMC-H.Rx. “R” indicates product revision. “x” is the revision number. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 15 Chapter 2 – SocketModem HSDPA Technical Specifications Category Standards: GSM Class GSM / GPRS / EGPRS Data Transfer UMTS Data Rate (Release 99, June 2004, W-CDMA FDD standard) Bandwidth Connectors Operating Voltage (Power Supply) Output power (according to Release 99) Description Small MS GPRS • Multislot Class 10 • Full PBCCH support • Mobile Station Class B • Coding Scheme 1 – 4 EGPRS • EDGE E2 power class for 8 PSK • Downlink coding schemes – CS 1-4, MCS 1-9 • Uplink coding schemes – CS 1-4, MCS 1-9 • BEP reporting • SRB loopback and test mode B • 8-bit, 11-bit RACH • PBCCH support • 1 phase/2 phase access procedures • Link adaptation and IR • NACC, extended UL TBF • Mobile Station Class B CSD • V.110, RLP, non-transparent • 9.6 kbps PS data rate – 384 kbps DL / 384 kbps UL CS data rate – 64 kbps DL / 64 kbps UL • UMTS/HSDPA: Single band, 2100MHz • GSM/GPRS/EDGE: Dual band, 900/1800MHz • UMTS/HSDPA: Triple band, 850//1900/2100MHz • GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz Antenna: MMCX SIM: Standard 3V SIM receptacle 5V Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Operating Temperatures Min -30 °C Typ +25 °C Max +75 Storage Environment -40° to +85° C Humidity 20% to 90% non-condensing 2.55” L x 1.4” W x 0.563” H (6.48 cm x 3.5 cm x 1.43 cm) Dimensions 1 oz. (0.028 kg.) Weight Certifications & Approvals Certifications: CE Mark Safety Certifications: UL 60950 cUL 60950 EN 60950 AS/NZS 60950:2000 EMC Approvals: FCC Part 2, 15, 22, 24 EN 55022 EN 55024 Network: PTCRB Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 16 Chapter 2 – SocketModem HSDPA Warranty Intelligent Features 2 years SMS – Text & PDU, Point-to-Point, cell broadcast AT Command Compatible Voice features include Half Rate (HR), Full Rate (FR), Enhanced Full Rate (EFR), Adaptive multi rate (AMR), as well as hands free echo cancellation, and noise reduction Embedded TCP/IP protocol stack brings Internet connectivity Audio Audio speech codecs • GSM: AMR, EFR, FR, HR • 3GPP: AMR-WB • 3GPP2: EVRC, EVRC-B (4GV-WB/NB) • Diverse: G.711 vocoder • One ringing melody supported • CEPT supervisory tones supported • DTMF supported Other • Handset, Headset, Speakerphone and Transparent mode • TTY support selecting a dedicated audio mode • Download of audio parameters • Gains and volumes can be controlled by AT commands • Several additional ringing melodies • CEPT and ANSI supervisory tones supported Pin Configurations Top View SocketModem HSDPA Pinout For pin descriptions, see the Universal Pinout Descriptions in Chapter 1. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 17 Chapter 2 – SocketModem HSDPA HSPDA Electrical Characteristics I/O Electrical Characteristics 5VDC Characteristics (VDD = 5V ± 0.25V) VDDMAX = 5.25V Digital Inputs –DTR (40), –TXD (35), –RTS (33) –RESET Digital Outputs –DCD (39), –CTS (38), –DSR (37), –RI (36), –RXD (34) Digital Input Capacitance Input High Min 2.0V Input High Min 2.6V Output High Min 4V Input Low Max 0.8V Input Low Max 1.0V Output Low Max 0.4V Current Drive 2mA 5 pF HSPDA Power Consumption Voice Mode Power Consumption GSM Call Power Consumption in EGSM900 and GSM850 @ 25 degrees C Voltage +5V +5V +5V Conditions During TX bursts @ 2W Average @ 2W Average idle mode INOM 1.2 A 250mA 28mA IMAX 2.0 A 335mA 35mA GSM Call Power Consumption in GSM1800 & 1900 MHz @ 25 degrees C Voltage +5V +5V +5V Conditions During TX bursts @ 1W Average @1W Average idle mode INOM 1.1 A 210mA 28mA IMAX 1.6 A 285mA 35mA Data Mode Power Consumption GPRS Class 10 Power Consumption in EGSM/GPRS 900 MHz and GSM/GRPS 850 MHz Voltage +5V +5V +5V +5V Conditions During TX bursts @ 2W Average @ 2W Average @ 1W Average idle mode INOM 1.5 A 400mA 280mA 28mA IMAX 2.0 A 610mA 488mA 35mA GPRS Class 10 Power Consumption in GSM/GRPS 1800 MHz and GSM/GRPS 1900 MHz Voltage +5V +5V +5V +5V Conditions During TX bursts @ 1W Average @ 1W Average @ .25W Average idle mode INOM 1.1 A peak 350mA 180mA 28mA IMAX 1.2 A peak 510mA 460mA 35mA EGPRS Class 10 Power Consumption in EGRPS 900 MHz and EGRPS 850 MHz Voltage +5V +5V +5V +5V Conditions During TX bursts @ 5W Average @ .5W Average @ .25W Average idle mode INOM 1.4 A peak 430mA 375mA 28mA IMAX 1.6 A peak 525mA 450mA 35mA Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 18 Chapter 2 – SocketModem HSDPA Application Notes Radio Characteristics Frequency RX Frequency TX RF Power Stand GSM 850 869 to 894 MHz 824 to 849 MHz 2W at 12.5% duty cycle Impedance VSWR Typical Radiated Gain EGSM 900 GSM 1800 925 to 960 MHz 1805 to 1880 MHz 880 to 915 MHz 1710 to 1785 MHz 2W at 12.5% duty 1W at 12.5% duty cycle cycle 50 ohms <2 0 dBi on azimuth plane GSM 1900 1930 to 1990 MHz 1850 to 1910 MHz 1W at 12.5% duty cycle Receiver Features • • • • • • • EGSM Sensitivity : < -108 dBm GSM 1800/GSM 1900 Sensitivity : < -107 dBm Selectivity @ 200 kHz : > +9 dBc Selectivity @ 400 kHz : > +41 dBc Dynamic range : 62 dB Intermodulation : > -43 dBm Co-channel rejection : + 9 dBc Transmitter Features • • • • • • • • • • • Maximum output power (EGSM) : 24 dBm +/- 2 dB Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB Minimum output power (EGSM): 5 dBm +/- 5 dB Minimum output power (DCS/PCS): 0 dBm +/- 5 dB H2 level : < -30 dBm H3 level : < -30 dBm Noise in 925 - 935 MHz : < -67 dBm Noise in 935 - 960 MHz : < -79 dBm Noise in 1805 - 1880 MHz : < -71 dBm Phase error at peak power : < 5 ° RMS Frequency error : +/- 0.1 ppm max Audio Interface – Electrical Characteristics Speaker Output Differential speaker output capable of driving 8 ohm load. 1.0945 Vpp (differential) typical. Microphone Input Balanced microphone input: full scale input 1.1 Vpp. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 19 Chapter 2 – SocketModem HSDPA Baud Rate Switches on the HSDPA SocketModem MTSMC-H SocketModem Baud Rate dip switch settings Switch Bank ● ● ● ● 920K ● ● ● 460K ● ● 230K ● ● 115K ● 57.6K ● 38.4K ● 19.2K ● 9.6K ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 20 Chapter 2 – SocketModem HSDPA Operating Modes The table below briefly summarizes the various operating modes. Mode Normal operation Function GSM / GPRS / UMTS / HSDPA SLEEP GSM IDLE Power saving mode set automatically when no call is in progress and the USB connection is suspended by host or not present. Software is active. Once registered to the GSM network, paging with BTS is carried out in order to achieve synchrony with the GSM network. The repetition rate depends on the parameter BSPA_Multiframe. The module is ready to send and receive. GSM TALK Connection between two subscribers is in progress. Power consumption depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be measured in TALK_GSM mode: DTX off, FR and no frequency hopping, otherwise same as for IDLE measurements. Module is attached and ready for GPRS data transfer, but no data is currently sent or received. GPRS IDLE GPRS DATA GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS DATA EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS / HSDPA IDLE Module is attached and ready for UMTS / HSDPA data transfer, but no data is currently sent or received. UMTS DATA UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. HSDPA DATA HSDPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 21 Chapter 2 – SocketModem HSDPA Turn off the Module Using AT Command The best and safest approach to powering down is to issue the AT^SMSO command. This procedure lets the module log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode. In this mode, only the RTC stays active. After sending AT^SMSO do not enter any other AT commands. There are two ways to verify that the module turns off: Wait for the ”OK” – response. It indicates that data has been stored non-volatile and that the module turns off in less than TBD second. Important Note: The SocketModem requires a reset to become active again. USB Interface The Module supports a USB 1.1 Full Speed (12Mbit/s) device interface. The USB I/O-pins are capable of driving the signal at min 3.0V. To properly connect the module’s USB interface to the host a USB 1.1 compatible connector is required. Furthermore, the USB modem driver for Windows XP delivered with the module be installed as described in the Installation Guide. While the USB connection is active, the module will not change into SLEEP Mode. To enable switching into SLEEP mode the USB host has to be able to change into suspend mode. On incoming calls, the module will then generate a remote wake up request to resume the USB connection. This can be realized by means of the HOST_WAKEUP line. If no call, data or message transfer is in progress, the HOST_WAKEUP line is passive. To save power, the host could then shut down the USB interface. If a call or other request (URC’s, messages) arrives, the host can be woken up again by activation of HOST_WAKEUP (passive to active transition). Analog Audio Interface The module supports one analog audio interface available on the board to board connector. The following two pictures show the balanced headset interface with microphone feeding and the line interface. Network Connectivity Status Signals One status signal is provided for signaling the module’s connectivity status (58 of the socket). Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342G) 22
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