Multi Tech Systems 92U12616852 MultiConnect Embedded PCIe Cellular Modem User Manual developer guide
Multi Tech Systems Inc MultiConnect Embedded PCIe Cellular Modem developer guide
developer guide
MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide MULTICONNECT PCIE DEVELOPER GUIDE MultiConnect PCIe Developer Guide Models: MTPCIE-H5-xx, MTPCIE-BW Part Number: S000538, Version 1.2 USA and Canada Edition Copyright This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2013 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement. Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. Trademarks Multi-Tech, SocketModem, and the Multi-Tech logo are registered trademarks of Multi-Tech Systems, Inc. MultiConnect is a trademark of Multi-Tech System. All other brand and product names are trademarks or registered trademarks of their respective companies. Legal Notices The Multi-Tech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted Applications is at the user’s sole risk and liability. MULTI-TECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTI-TECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTI-TECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS. The Multi-Tech products and the final application of the Multi-Tech products should be thoroughly tested to ensure the functionality of the Multi-Tech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the Multi-Tech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent Multi-Tech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever. Contacting Multi-Tech Knowledge Base The Knowledge Base provides immediate access to support information and resolutions for all Multi-Tech products. Visit http://www.multitech.com/kb.go. Support Portal To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com. Support Business Hours: M-F, 9am to 5pm CT Country By Email By Phone Europe, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774 U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863 Warranty To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112 Phone: (800) 328-9717 or (763) 785-3500 Fax (763) 785-9874 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide CONTENTS Contents Product Overview .................................................................................................................................................... 6 About MultiConnect PCIe.............................................................................................................................................. 6 Documentation ........................................................................................................................................................... 6 Product Build Options ................................................................................................................................................... 6 Developer Kit Contents ................................................................................................................................................ 6 Attaching Power Supply Blades .................................................................................................................................... 7 Power Supply and Blades............................................................................................................................................ 7 Attaching the Blades ................................................................................................................................................... 7 Pinout...................................................................................................................................................................... 8 Multi-Tech Mini PCIe Pinout ......................................................................................................................................... 8 Standard Mini-PCI Express Pinout ............................................................................................................................ 11 Pinout for Cellular USB Only ....................................................................................................................................... 13 Design Considerations............................................................................................................................................ 14 Design Consideration .................................................................................................................................................. 14 Noise Suppression Design ........................................................................................................................................... 14 PC Board Layout Guideline ......................................................................................................................................... 14 Electromagnetic Interference .................................................................................................................................... 14 Electrostatic Discharge Control................................................................................................................................... 15 USB Design ................................................................................................................................................................. 15 Developer Board and Schematics........................................................................................................................... 16 Developer Board ......................................................................................................................................................... 16 Assembly Diagram....................................................................................................................................................... 18 Top ............................................................................................................................................................................ 18 Bottom ...................................................................................................................................................................... 19 Developer Board Block Diagram ................................................................................................................................. 20 Developer Board Schematics ...................................................................................................................................... 21 Board Components ..................................................................................................................................................... 30 Installing a Communications Device onto the Board.................................................................................................. 31 Installing a SIM Card .................................................................................................................................................. 31 Safety Notices and Warnings ................................................................................................................................. 32 Radio Frequency (RF) Safety ....................................................................................................................................... 32 Sécurité des fréquences radio ................................................................................................................................. 32 Vehicle Safety.............................................................................................................................................................. 32 User Responsibility...................................................................................................................................................... 33 Device Maintenance ................................................................................................................................................... 33 Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure .................................. 33 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide CONTENTS Labeling Requirements .......................................................................................................................................... 34 Approvals and Certification......................................................................................................................................... 34 Example HSPA+ H5 Labels......................................................................................................................................... 34 Host Labeling............................................................................................................................................................. 35 Regulatory Statements .......................................................................................................................................... 36 R&TTE Directive Compliance ...................................................................................................................................... 36 Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37 International Modem Restrictions .............................................................................................................................. 37 Industry Canada and FCC ............................................................................................................................................ 37 Requirements for Cellular Antennas with regard to FCC/IC Compliance ................................................................. 38 Industry Canada and FCC Identification Numbers ................................................................................................... 38 Environmental Notices........................................................................................................................................... 39 Waste Electrical and Electronic Equipment Statement .............................................................................................. 39 WEEE Directive.......................................................................................................................................................... 39 Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 39 Information on HS/TS Substances According to Chinese Standards ......................................................................... 40 Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 41 Antennas, Cables, GPS ........................................................................................................................................... 42 Antenna System Cellular Devices................................................................................................................................ 42 FCC and IC Antenna Requirements Toward License Exempt Radio Transmitters (Bluetooth/Wlan)....................... 42 Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure ................................ 42 Cellular Antenna Information ................................................................................................................................... 42 Antenna Cable Information ...................................................................................................................................... 43 GPS Antennas............................................................................................................................................................ 44 Bluetooth and Wi-Fi Antenna Specifications ............................................................................................................ 44 OEM Integration ....................................................................................................................................................... 45 Device Overview .................................................................................................................................................... 47 Description .................................................................................................................................................................. 47 Product Build Options ................................................................................................................................................. 47 Account Activation for Cellular Devices ..................................................................................................................... 47 Bluetooth/Wi-Fi .......................................................................................................................................................... 47 Mechanical Drawing .............................................................................................................................................. 49 MTPCIE-H5-xx.............................................................................................................................................................. 49 MTPCIE-BW ................................................................................................................................................................. 50 Specifications......................................................................................................................................................... 51 MTPCIE-H5 Specifications ........................................................................................................................................... 51 MTPCIE-H5 DC Electrical Characteristics..................................................................................................................... 53 Absolute Maximum Rating........................................................................................................................................ 53 PCIE Connector Leads ................................................................................................................................................. 53 Typical Power Flow .................................................................................................................................................... 59 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide CONTENTS Power Measurements................................................................................................................................................. 60 MTPCIE-H5 ................................................................................................................................................................ 60 MTPCIE-H5-V-BW ...................................................................................................................................................... 60 MTPCIE-BW ............................................................................................................................................................... 60 Application Notes .................................................................................................................................................. 61 RF Performances ......................................................................................................................................................... 61 Receiver Features for Cellular Devices ..................................................................................................................... 61 Frequency Bands......................................................................................................................................................... 62 Installing Drivers for Non-UIP HSPA+ Devices......................................................................................................... 63 HSPA+ Device Driver Installation ................................................................................................................................ 63 Installing on Linux ..................................................................................................................................................... 63 Windows Release Notes .......................................................................................................................................... 64 Downloading the Windows USB Driver ................................................................................................................... 64 Windows Notes ........................................................................................................................................................ 64 Installing on Windows 8, 7 or Vista ......................................................................................................................... 65 Installing on Windows XP ......................................................................................................................................... 66 Uninstalling Windows Drivers................................................................................................................................... 67 Remove Microsoft Installed Drivers.......................................................................................................................... 67 Developer Note......................................................................................................................................................... 68 Using Linux with H5 Devices .................................................................................................................................. 69 Shell Commands.......................................................................................................................................................... 69 Testing Serial Ports.................................................................................................................................................... 69 Create a PPP Connection ............................................................................................................................................ 69 Example..................................................................................................................................................................... 69 C Programming............................................................................................................................................................ 70 open()........................................................................................................................................................................ 70 read()......................................................................................................................................................................... 71 write()........................................................................................................................................................................ 72 close()........................................................................................................................................................................ 72 Test Program() .......................................................................................................................................................... 73 Index...................................................................................................................................................................... 75 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PRODUCT OVERVIEW Product Overview About MultiConnect PCIe The MultiConnect™ PCIe embedded cellular modem is a complete, ready-to-integrate communications device that offers standard-based penta-band HSPA+ 21, dual-band EV-DO Rev A, or CDMA performance. This quick-to-market communications device allows developers to add wireless communication and GPS tracking to products with a minimum of development time and expense. The MultiConnect PCIe embedded cellular modem is based on industry-standard open interfaces and utilizes a PCI Express Mini Card form factor. Documentation The following documentation is available by email to oemsales@multitech.com or by using the Developer Guide Request Form at www.multitech.com. ■ MultiConnect PCIe Developer Guide – This document. Provides an overview, safety and regulatory information, design considerations, schematics, and device information for developers. ■ AT Command Guide – Device specific AT command reference guide. Product Build Options Product Description MTPCIE-H5 HSPA+ Embedded Cellular Modem MTPCIE-H5-V HSPA+ Embedded Cellular Modem with digital voice and GPS. MTPCIE-H5-V-BW HSPA+ Embedded Cellular Modem with digital voice, GPS, Wi-Fi, and Bluetooth MTPCIE-BW Wi-Fi and Bluetooth Developer Kit MTPCIE-DK Developer Kit Note: ■ These units ship without network activation. ■ To connect them to the cellular network, you need a cellular account. For more information, refer to Account Activation. ■ GP devices have a dedicated GPS receiver. ■ The complete product code may end in .Rx. For example, MTPCIE-H5.Rx, where R is revision and x is the revision number. ■ All builds can be ordered individually or in 50-packs. Developer Kit Contents Your Developer Kit (MTPCIE-DK1) includes the following: Developer Board 1 - MTPCIE-DK Developer Board Power Supply 1 - 100-240V 9V-1.7A power supply with removable blades, 1 - US blade/plug, 1 - EURO blade/plug, 1 - UK blade/plug MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PRODUCT OVERVIEW Cables 1 - RS-232 DB9F-DB9M serial cable, 1 - RJ-45 Ethernet cable, 2 -USB cable 2 - SMA-to-UFL antenna cables (1 - for cellular, 1 - for GPS) 1 - RSMA-to-UFL antenna cable for Bluetooth/Wi-Fi Antennas 1 - 3.3V magnetic GPS antenna , 1 - HEPTA band SMA antenna, 1 - 2.4GHz, dipole Wi-Fi antenna Customer Notices Modem activation notice Additional One promotional screwdriver Attaching Power Supply Blades Power Supply and Blades If your device shipped with a power cord, attach the blades for your region. Power Supply no blades Power Supply with EU blade Power Supply with NAM blade Power Supply with UK blade Attaching the Blades To attach a power supply blade: 1. 2. 3. Remove the power supply cover (not shown). To do this, slide the lock down and hold it while you lift off the cover. Insert the latch on the blade into the notch on the power supply. Slide the lock down and hold it while you press the blade in place. Then, release it. 1 - Latch 2 - Notch 3 - Sliding lock MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PINOUT Pinout Multi-Tech Mini PCIe Pinout Note: Some modems do not include all the pins shown above. Refer to your model’s Device Guide for model specific pinout information. SDIO can operate up to 25Mhz. Treat the SDIO traces to Host like a bus and keep the bus length as short as possible. Multi-Tech recommends adding series termination resistors on all the SDIO traces. Pin # Name I/O Function SDIO_D0 I/O Wi-Fi SDIO_D0 3.3Vaux 3.3Vaux SDIO_D1 I/O Wi-Fi SDIO_D1 GND SDIO_D2 I/O BT_TXD MTPCIE-H5 MTPCIE-H5-V-BW MTPCIEBW Wi-Fi SDIO_D2 Bluetooth Transmit data SDIO_D3 I/O Wi-Fi SDIO_D3 BT_RTS Bluetooth RTS GND 10 BT_CTS Bluetooth CTS 11 SDIO_CMD I/O Wi-Fi SDIO_CMD 12 BT_RXD Bluetooth Receive data 13 SDIO_CLK Wi-Fi SDIO_CLK 14 BT_EN Bluetooth enable (low disable) 15 GND 16 GPIO_2 I/O 3G Cellular General purpose I/O 17 WLAN_EN Wi-Fi enable (low disable) 18 GND 19 WLAN_IRQ Wi-Fi interrupt (low active) 20 3G_ONOFF 3G Cellular On/Off (low X active) Ground Ground Ground Ground MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PINOUT Pin # Name I/O Function MTPCIE-H5 MTPCIE-H5-V-BW MTPCIEBW Ground 21 GND 22 3G_RST 3G Cellular Reset line (low active) 23 1.8V 1.8V output 24 3.3Vaux 3.3Vaux 25 GPIO_1 I/O Bluetooth General purpose I/O 26 GND Ground 27 GND Ground 28 3G_DVI_WA0 I/O 3G Cellular digital voice control line 29 GND Ground 30 3G_DVI_CLK I/O 3G Cellular digital voice clock 31 3G_DVI_RX 3G Cellular digital voice receive 32 RI 3G Cellular UART RI 33 3G_DVI_TX 3G Cellular digital voice transmit 34 GND Ground 35 GND Ground 36 USB_D- 3G USB Negative Data 37 GND Ground 38 USB_D+ I/O 3G USB Positive Data 39 3.3Vaux 3.3Vaux 40 GND Ground 41 3.3Vaux 3.3Vaux 42 LED_WWAN# O 3G Cellular STAT LED Output 43 GND Ground 44 DCD 3G Cellular UART DCD 45 CTS 3G Cellular UART CTS 46 GPIO_3 I/O 3G Celllular General purpose I/O 47 RTS 3G Cellular UART RTS I/O MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PINOUT 10 Pin # Name I/O Function 48 DTR 3G Cellular UART DTR 49 RXD 3G Cellular UART Receive data 50 GND 51 TXD 3G Cellular UART transmit data 52 3.3Vaux 3.3Vaux Ground MTPCIE-H5 MTPCIE-H5-V-BW MTPCIEBW MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PINOUT Standard Mini-PCI Express Pinout Pin # Function I/O Description WAKE# WAKE 3.3Vaux 3.3Vaux COEX1 Co-existence pin, not defined GND COEX2 Co-existence pin, not defined 1.5V 1.5V CLKREQ# CLKREQ# UIM_PWR UIM_PWR GND 10 UIM_DATA I/O UIM_DATA 11 REFCLK+ PCI Express reference clock 12 UIM_CLK UIM_CLK 13 REFCLK- PCI Express reference clock 14 UIM_RESET UIM_RESET 15 GND 16 UIM_VPP 17 Reserved Reserved 18 GND GND 19 Reserved Reserved 20 W_DISABLE# 21 GND 22 PERST# PERST# 23 PERn0 PCI Express receiver differential pair signal 24 3.3Vaux 3.3Vaux 25 PERp0 PCI Express receiver differential pair signal 26 GND GND 27 GND GND 28 1.5V 29 GND 30 SMB_CLK SMB_CLK 31 PETn0 PCI Express transmitter differential pair signal 32 SMB_DATA I/O SMB_DATA GND GND GND UIM_VPP W_DISABLE# GND 1.5V GND MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 11 PINOUT 12 Pin # Function I/O Description 33 PETp0 PCI Express transmitter differential pair signal 34 GND GND 35 GND GND 36 USB_D- 37 GND 38 USB_D+ I/O USB Positive Data 39 3.3Vaux 3.3Vaux 40 GND 41 3.3Vaux 3.3Vaux 42 LED_WWAN# LED Output 43 GND 44 LED_WLAN# 45 Reserved 46 LED_WPAN# 47 Reserved 48 1.5V 49 Reserved Reserved 50 GND GND 51 Reserved Reserved 52 3.3Vaux I/O USB Negative Data GND GND GND LED Output Reserved LED Output Reserved 1.5V 3.3Vaux MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide PINOUT Pinout for Cellular USB Only Pin # Name I/O Description 3.3 Vaux 3.3 Vaux GND Ground GND Ground 15 GND Ground 18 GND Ground 20 3G_ONOFF 21 GND 22 3G_RST 3G cellular reset line 24 3.3 Vaux 3.3 Vaux 26 GND Ground 27 GND Ground 29 GND Ground 35 GND Ground 36 USB_D- 37 GND 38 USB_D+ I/O 3G USB Positive Data 39 3.3 Vaux 3.3 Vaux 40 GND 41 3.3 Vaux 3.3 Vaux 42 LED_WWAN 3G Cellular STAT LED Output 43 GND Ground 50 GND Ground 52 3.3 Vaux 3G cellular on/off Ground I/O 3G USB Negative Data Ground Ground 3.3 Vaux MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 13 DESIGN CONSIDERATIONS Design Considerations Design Consideration When using the Multi-Tech MiniPCIe form factor: ■ Consult your modem’s device guide for device dimensions. With the modem, the Multi-Tech Mini PCIe form factor exceeds the standard Mini PCIe maximum component height for top and bottom. ■ If you need to install components under the module, use taller connectors to avoid conflict. Multi-Tech recommends not installing components under the module. ■ Check the Pinout table for pins that differ from the MiniPCIe spec. Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB) containing the MultiConnect PCIe. Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design that contains the MultiConnect PCIe must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled onboard can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern. On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments. Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification. Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes. PC Board Layout Guideline In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide. Electromagnetic Interference The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels. ■ Keep traces carrying high frequency signals as short as possible. ■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. ■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible. 14 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DESIGN CONSIDERATIONS ■ Eliminate ground loops, which are unexpected current return paths to the power source and ground. ■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines. ■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. ■ Locate cables and connectors to avoid coupling from high frequency circuits. ■ Lay out the highest frequency signal traces next to the ground grid. ■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. ■ Minimize the number of through-hole connections on traces carrying high frequency signals. ■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. ■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. ■ Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point. Electrostatic Discharge Control Handle all electronic devices with precautions to avoid damage due to the static charge accumulation. See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing. Multi-Tech strives to follow these recommendations. Input protection circuitry is incorporated in Multi-Tech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling. Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). Multi-Tech recommends that you use our packaging when returning a product and when you ship your products to your customers. USB Design Multi-Tech recommends that you review Intel's High Speed USB Platform Design Guidelines for information about USB signal routing, impedance, and layer stacking. Also: ■ Shield USB cables with twisted pairs (especially those containing D+/D-). ■ Use a single 5V power supply for USB devices. See the Power Draw section in your model’s Device Guide for current (ampere) requirements. ■ Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance for the USB pair and to maintain a 20 mil space from the USB pair and all other signals. ■ If power is provided externally, use a common ground between the carrier board and the device. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 15 DEVELOPER BOARD AND SCHEMATICS Developer Board and Schematics Note: Third-party components shown in the following drawings are included as examples only. Developer Board This developer board drawing shows the major board components. 16 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 17 DEVELOPER BOARD AND SCHEMATICS Assembly Diagram Top 18 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS Bottom MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 19 DEVELOPER BOARD AND SCHEMATICS Developer Board Block Diagram 20 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS Developer Board Schematics MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 21 DEVELOPER BOARD AND SCHEMATICS 22 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 23 DEVELOPER BOARD AND SCHEMATICS 24 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 25 DEVELOPER BOARD AND SCHEMATICS 26 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 27 DEVELOPER BOARD AND SCHEMATICS 28 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 29 DEVELOPER BOARD AND SCHEMATICS Board Components Jumper Description JP3, JP4, JP5, JP48 Selects CGND or GND for antenna holder grounding. Default is CGND. JP6 JP6 allows you to select either the internal 5V regulator (INT PWR) or to choose EXT 5V (EXT PWR). For the EXT PWR, you can use your own external 5V power source and plug it into J11. JP43, JP44 Not used by PCIe devices. JP45 Board Power. Default is installed. JP49 Probes for connecting speaker. JP50 Probes for connecting microphone. JP51, JP52 Debugging probes for PCIE connector J23. JP53, JP54 Selects USB host connected to PCIe device. Pins 1 & 2 jumpered selects external USB host connected to J4. JP57, JP58 Selects USB host connected to quad serial UART U20. Pins 1 & 2 jumpered selects external USB host connected to J24. JP59, JP60, JP61,JP63,JP64, Selects serial connection for PCIe device. Pins 1 & 2 jumpered selects DB9 connector JP69 J1 connected to PCIe device. Pins 2 & 3 jumpered selects quad UART U20 connected to PCIe device. All jumpers must be moved to the same position. 30 JP65, JP66, JP67, JP68 Selects serial connection for PCIe Bluetooth device. Pins 1 & 2 jumpered selects DB9 connector J14 connected to PCIe Bluetooth device. Pins 2 & 3 jumpered selects quad UART U20 connected to PCIe Bluetooth device. All jumpers must be moved to the same position. JP70 Probes for PCIe GPIO2 & GPIO3. The pin next to the text "GPIO_3.3V" is GPIO3. The center pin is GPIO2. JP73, JP74 Not used by PCIe devices. JP75, JP76, JP77, JP78 When these jumpers are installed, DVI interface of audio codec U84 is connected to DVI interface of PCIe device. By removing these jumpers when connecting an external DVI device. JP79, JP80 Use these jumper pins to connect an external DVI device. JP81, J82 Selects source for programming audio codec U84. Pins 1 & 2 jumpered selects MICRO U84 as source. Default is MICRO. JP83, JP84 These pins can be used for programming MICRO U84. JP85 Selects power source for MICRO U85. Default is 1.8v JP86 May be used to manually reset PCIe Bluetooth device by briefly installing and then removing a jumper. Default is no jumper installed. JP87 Not applicable for this device. JP88 May be used to manually reset PCIe Wi-Fi device by briefly installing and then removing a jumper. Default is no jumper installed. JP89 This jumper, when installed, connects power to PCIe device. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVELOPER BOARD AND SCHEMATICS Jumper Description JP90 Not used by PCIe device.This jumper, when installed, connects power to OCG-E device. (When using Developer Kit with OCG-E devices). J6 Not used by PCIe device. J23 Socket for installing PCIe device. J8, J9, J10, J13 Oscilloscope probe ground connections S1 Not used by PCIe device. S3 Reset button for PCIe device. S4 Button for on/off of PCIe. Installing a Communications Device onto the Board To install a device on the board: 1. 2. Align the device pin with Pin 1 of the socket connector on the board and press firmly. Use the optional antenna lead to connect to the device's antenna connector. Installing a SIM Card To install a SIM card: ■ Install the SIM card into the SIM card holder on the radio. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 31 SAFETY NOTICES AND WARNINGS Safety Notices and Warnings The following safety statements may be relevant and required in the host product literature. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below. ■ Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers’ recommendations. ■ Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device. ■ Do not place the antenna outdoors. ■ Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both. ■ Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. ■ Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use. Sécurité des fréquences radio En raison de la possibilité d'interférences de radiofréquence (RF), il est important que vous suiviez une quelconque réglementation concernant l'utilisation du matériel radio. Suivez les conseils de sécurité ci-dessous. ■ Fonctionnement de votre appareil à proximité d'autres appareils électroniques peuvent causer des interférences si l'équipement est insuffisamment protégé. Respectez les panneaux d'avertissement et les recommandations du fabricant. ■ Différentes industries et les entreprises limitent l'utilisation des appareils cellulaires. Respectez les règlements sur l'utilisation des équipements radio dans les dépôts de carburant, les usines chimiques, ou lorsque des opérations de dynamitage sont en cours. Suivez restrictions pour n'importe quel environnement où vous utilisez l'appareil. ■ Ne pas placer l'antenne à l'extérieur. ■ Éteignez votre appareil sans fil dans un avion. Utilisant des dispositifs électroniques portables dans un avion peut mettre en danger le fonctionnement de l'avion, peut perturber le réseau cellulaire, et est illégal. Le non-respect de cette restriction peut entraîner la suspension ou le refus des services cellulaires au contrevenant, une action en justice, ou les deux. ■ Éteignez votre appareil sans fil lorsque autour de l'essence ou pompes diesel-carburant et avant de remplir votre véhicule avec du carburant. ■ Éteignez votre appareil sans fil dans les hôpitaux et tout autre endroit où l'équipement médical peut être utilisé. Vehicle Safety When using your device in a vehicle: 32 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SAFETY NOTICES AND WARNINGS ■ Do not use this device while driving. ■ Respect national regulations on the use of cellular devices in vehicles. ■ If incorrectly installed in a vehicle, operating the wireless device could interfere with the vehicle’s electronics. To avoid such problems, use qualified personnel to install the device. The installer should verify the vehicle electronics are protected from interference. ■ Using an alert device to operate a vehicle’s lights or horn is not permitted on public roads. ■ UL evaluated this device for use in ordinary locations only. UL did NOT evaluate this device for installation in a vehicle or other outdoor locations. UL Certification does not apply or extend to use vehicles or outdoor applications or in ambient temperatures above 40° C. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. Device Maintenance When maintaining your device: ■ Do not attempt to disassemble the device. There are no user serviceable parts inside. ■ Do not expose your device to any extreme environment where the temperature or humidity is high. ■ Do not expose the device to water, rain, or spilled beverages. It is not waterproof. ■ Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The information contained on discs or cards may be affected by the device. ■ Using accessories, such as antennas, that Multi-Tech has not authorized or that are not compliant with Multi-Tech's accessory specifications may invalidate the warranty. If the device is not working properly, contact Multi-Tech Technical Support. Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure The antenna intended for use with this unit meets the requirements for mobile operating configurations and for fixed mounted operations, as defined in 2.1091 of the FCC rules for satisfying RF exposure compliance. If an alternate antenna is used, consult user documentation for required antenna specifications. Compliance of the device with the FCC and IC rules regarding RF Exposure was established and is given with the maximum antenna gain as specified above for a minimum distance of 20 cm between the devices radiating structures (the antenna) and the body of users. Qualification for distances closer than 20 cm (portable operation) would require re-certification. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 33 LABELING REQUIREMENTS Labeling Requirements Approvals and Certification Your Multi-Tech device is an industry and/or carrier approved modem. ■ PTCRB Requirements (GPRS and HSPA/HSDPA only). The antenna system cannot be altered. If altered, additional PTCRB testing may be required. ■ For HSPA+, HSPA, HSDPA and GPRS Devices The modem's 15-character IMEI (International Mobile Equipment Identity) number is printed on the modem's label. Example HSPA+ H5 Labels Note: Actual labels will vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is larger than actual size. 1 - Multi-Tech Model Identification. 2 - Multi-Tech Ordering Part Number. 3 - IMEI (International Mobile Equipment Identity). 34 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide LABELING REQUIREMENTS Labels are positioned on the device as follows: Host Labeling The following statements are required to be on the host label: ■ This device contains FCC ID: {Add the FCC ID of the specific device} ■ This device contains equipment certified under IC ID: {Add the IC ID of the specific device} MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 35 REGULATORY STATEMENTS Regulatory Statements R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives: Council Directive 2004/108/EC of 15 December 2004 on the approximation of the laws of Member States relating to electromagnetic compatibility; and Council Directive 2006/95/EC of 12 December 2006 on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits; and Council Directive 1999/5/EC of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.0.2 EN 300 440-2 V1.4.1 EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2 EN 301 489-3 V1.4.1 EN 301 489-7 V1.3.1 Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + AC:2011 EN 62311:2008 36 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide REGULATORY STATEMENTS Restriction of the Use of Hazardous Substances (RoHS) Multi-Tech Systems, Inc Certificate of Compliance 2011/65/EU Multi-Tech Systems confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). These Multi-Tech products do not contain the following banned chemicals1: ■ Lead, [Pb] < 1000 PPM ■ Mercury, [Hg] < 1000 PPM ■ Hexavalent Chromium, [Cr+6] < 1000 PPM ■ Cadmium, [Cd] < 100 PPM ■ Polybrominated Biphenyl, [PBB] < 1000 PPM ■ Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM Environmental considerations: ■ Moisture Sensitivity Level (MSL) =1 ■ Maximum Soldering temperature = 260C (in SMT reflow oven) Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration would be found in some modules (>1000 PPM); - Resistors containing lead in a glass or ceramic matrix compound. International Modem Restrictions Some dialing and answering defaults and restrictions may vary for international modems. Changing settings may cause a modem to become non-compliant with national regulatory requirements in specific countries. Also note that some software packages may have features or lack restrictions that may cause the modem to become noncompliant. Industry Canada and FCC This device complies with Industry Canada licence-exempt RSS standard(s) and part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS exemptes de licence standard (s) et la partie 15 des règles de la FCC. Son fonctionnement est soumis aux deux conditions suivantes: MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 37 REGULATORY STATEMENTS 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Warning: Changes or modifications to this radio device not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Note: In Wi-Fi operation, the modem cannot operate on Channels 12, 13, or 14 due to FCC regulations. Requirements for Cellular Antennas with regard to FCC/IC Compliance Alterations to the antenna system may require additional testing at a certified lab. The antenna system must maintain the same specifications. The antenna must be the same type, with similar in-band and out-of-band radiation patterns. This device has been designed to operate with the antennas listed below and having a maximum gain for 850 Mhz of <= 6.4 dBi , for 1700 Mhz of <= 6.5 dBi, and for 1900 Mhz of <= 3 dBi. Antennas not included in this list or that have a gain greater than specified are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. Industry Canada and FCC Identification Numbers Additional device information is available on the Industry Canada and FCC websites. 38 Model Canada ID FCC ID MTPCIE-H5 125A-0047 AU792U12616852 MTPCIE-H5-V 125A-0047 AU792U12616852 MTPCIE-H5-V-BW 125A-0048 AU792U12616836 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide ENVIRONMENTAL NOTICES Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all Multi-Tech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product. July, 2005 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 39 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII). Hazardous/Toxic Substance/Elements Name of the Component Lead (PB) Mercury (Hg) Cadmium Hexavalent (CD) Chromium (CR6+) Polybromi Polybrominat nated ed Diphenyl Biphenyl Ether (PBDE) (PBB) Printed Circuit Boards Resistors Capacitors Ferrite Beads Relays/Opticals ICs Diodes/ Transistors Oscillators and Crystals Regulator Voltage Sensor Transformer Speaker Connectors LEDs Screws, Nuts, and other Hardware AC-DC Power Supplies Software /Documentation CDs Booklets and Paperwork Chassis X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits. O Represents that no such substances are used or that the concentration is within the aforementioned limits. 40 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依照中国标准的有毒有害物质信息 根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准-中华人民共和国《电子信息产品污染 控制管理办法》(第 39 号),也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒 物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。 有害/有毒物质/元素 成分名称 铅 (PB) 汞 (Hg) 镉 (CD) 六价铬 (CR6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 印刷电路板 电阻器 电容器 铁氧体磁环 继电器/光学部件 ICs 二极管/晶体管 振荡器和晶振 调节器 电压传感器 变压器 扬声器 连接器 LEDs 螺丝、螺母以及其它五金件 交流-直流电源 软件/文档 CD 手册和纸页 底盘 X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。 O 表示不含该物质或者该物质的含量水平在上述限量要求之内。 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 41 ANTENNAS, CABLES, GPS Antennas, Cables, GPS Antenna System Cellular Devices The cellular/wireless performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required by specific network carriers. FCC and IC Antenna Requirements Toward License Exempt Radio Transmitters (Bluetooth/Wlan) The license-exempt Blutooth/WLAN radio transmitter contained in this equipment may only be operated with an antenna of a type, a maximum gain and the required antenna impedance as approved and specified below. To reduce potential radio interference to other users, choose the antenna type and it's gain so that the equivalent isotropically radiated power (EIRP) is not more than that necessary for successful communication. Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure The antenna intended for use with this unit meets the requirements for mobile operating configurations and for fixed mounted operations, as defined in 2.1091 of the FCC rules for satisfying RF exposure compliance. If an alternate antenna is used, consult user documentation for required antenna specifications. Compliance of the device with the FCC and IC rules regarding RF Exposure was established and is given with the maximum antenna gain as specified above for a minimum distance of 20 cm between the devices radiating structures (the antenna) and the body of users. Qualification for distances closer than 20 cm (portable operation) would require re-certification. Cellular Antenna Information 3G Authorized Antennas The cellular radio portion was approved with the following antenna: Manufacturer: Laird Technologies. Description: HEPTA-SM Model Number: MAF94300 Multi-Tech ordering information: 42 Model Quantity ANHB-1HRA ANHB-10HRA 10 ANHB-50HRA 50 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide ANTENNAS, CABLES, GPS 3G Antenna Requirements/Specifications Category Description Frequency Range 824 – 960 MHz / 1710 – 1990 MHz / 1920 – 2170 MHz Impedance 50 Ohms VSWR VSWR should not exceed 2.0:1 at any point across the bands of operation Typical Radiated Gain 850 MHz 3.17 dBi 950 MHz 3.51 dBi 1800 MHz 3.55 dBi 1900 MHz 3.0 dBi 2100 MHz 3.93 dBi Radiation Omni-directional Polarization Linear Vertical Antenna Cable Information Use the following UFL to SMA RF cable to connect the device to the antenna. Description: Coax SMA to UFL 8.5inch (216mm) Multi-Tech Part Number: 45009575L Multi-Tech ordering information: Model Quantity CASMA-UFL-1 CASMA-UFL-10 10 CASMA-UFL-50 50 Average Cable Loss The table shows the average cable loss for each cell band. Band Loss 800 0.37 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 43 ANTENNAS, CABLES, GPS Band Loss 900 0.40 1800 0.70 1900 0.63 2100 0.70 GPS Antennas GPS Antenna Specifications Category Description Frequency Range 1575.24 MHz Impedance 50 Ohms VSWR 2.0:1 max Gain 10-30 dBi LNA Current Consumption 40 mA max Noise Figure < 2dB Polarization RHCP Input voltage 3.0V ± 0.2V Bluetooth and Wi-Fi Antenna Specifications Manufacturer: Taoglas Antenna Solutions Manufacturer's Model Number: GW.11.A153 Category Description Frequency Range 2.4000 to 2.4835 GHz Impedance 50 Ohms VSWR VSWR should not exceed 2.0:1 at any point across the bands of operation Peak Radiated Gain 2.3 dBi on azimuth plane Radiation Omni-directional Polarization Linear Vertical Connector RP-SMA(M) Multi-Tech Ordering Information 44 Model Number Quantity ANWF-1HRA ANWF-10HRA 10 ANWF-50HRA 50 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide ANTENNAS, CABLES, GPS Bluetooth and Wi-Fi Antenna Cable Information Use the following UFL to R-SMA RF cable to connect the device to the antenna. Description: Coax R-SMA to UFL 6 inch (152.4mm) Multi-Tech Part Number: 45009628L Multi-Tech ordering information: Model Quantity CARSMA-UFL-1 CARSMA-UFL-10 10 CARSMA-UFL-50 50 Average Cable Loss The table shows the average cable loss for each cell band. Band Loss 2.4MHz 0.63 OEM Integration Note: This device is for OEM integration only. FCC and Industry Canada Information to End-users FCC & IC Information to End-users The user manual for the end-users must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 3, Dec 2010; 7.1.2 and 7.1.3 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 45 ANTENNAS, CABLES, GPS FCC Grant Notes The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary. Installing in Portable Equipment The available scientific evidence does not show that any health problems are associated with using low power wireless devices. There is no proof, however, that these low power wireless devices are absolutely safe. Low power wireless devices emit low levels of radio frequency energy (RF) in the microwave range while being used. Whereas high levels of RF can produce health effects (by heating tissue), exposure of low-level RF that does not produce heating effects causes no known adverse health effects. Many studies of low-level RF exposures have not found any biological effects. Some studies have suggested that some biological effects might occur, but such findings have not been confirmed by additional research. MTPCIE-H5 has been tested and found to comply with FCC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines in Supplement C to OET65. FCC Definitions Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons. Grant Limitations This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee. Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Note: Host devices incorporating unlicensed radio transmitters must be provided with the related antenna fixed mounted or, if coming with an external antenna connector, this connector must be of a non-standard type. In any case must an antenna be provided with the unlicensed transmitter. Note: Only use antennas approved respectively as listed for the unlicensed radios (Bluetooth/Wi-Fi) 46 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide DEVICE OVERVIEW Device Overview Description The MultiConnect PCIe embedded cellular modem is a complete, ready-to-integrate communications device that offers standards-based penta-band HSPA+ 21 performance. This quick-to-market communications device allows developers to add wireless communication and GPS tracking to products with a minimum of development time and expense. The MultiConnect PCIe embedded cellular modem is based on industry-standard open interfaces and uses a PCI Express Mini Card form factor. Product Build Options Product Description MTPCIE-H5 HSPA+ Embedded Cellular Modem MTPCIE-H5-V HSPA+ Embedded Cellular Modem with digital voice and GPS. MTPCIE-H5-V-BW HSPA+ Embedded Cellular Modem with digital voice, GPS, Wi-Fi, and Bluetooth MTPCIE-BW Wi-Fi and Bluetooth Developer Kit MTPCIE-DK Developer Kit Note: ■ These units ship without network activation. ■ To connect them to the cellular network, you need a cellular account. For more information, refer to Account Activation. ■ GP devices have a dedicated GPS receiver. ■ The complete product code may end in .Rx. For example, MTPCIE-H5.Rx, where R is revision and x is the revision number. ■ All builds can be ordered individually or in 50-packs. Account Activation for Cellular Devices Some Multi-Tech cellular modems are pre-configured to operate on a specific cellular network, such as Sprint or Verizon Wireless. Before you can use the modem, you must set up a cellular data account with your service provider. Each service provider has its own process for adding devices to their network. Refer to Multi-Tech's Cellular Activation site http://www.multitech.com/activation.go for step-by-step instructions on activating your cellular modem with your service provider. Bluetooth/Wi-Fi All Wi-Fi and Bluetooth drivers and stacks are based on Linux open source. ■ For Wi-Fi, use the Linux calibrator tool. The WiFi drivers are compat-wireless drivers for TI WL12XX build under Linux kernel 2.6.39.4. For more information see http://linuxwireless.org/en/users/Drivers/wl12xx/calibrator. ■ For BlueTooth, use the Linux hcitool. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 47 DEVICE OVERVIEW Both tools are currently available inside our embedded Linux systems. These tools do not run on PCs. To invoke the tools, secure shell into the device using putty or another tool from your Windows computer. Once you secure shell and login, you can invoke the tools and test. You will need Ethernet connectivity to the development board for the secure shell and login. 48 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide MECHANICAL DRAWING Mechanical Drawing MTPCIE-H5-xx MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 49 MECHANICAL DRAWING MTPCIE-BW 50 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SPECIFICATIONS Specifications MTPCIE-H5 Specifications Category Description General Standards Penta-band HSPA+ 21 Quad-band GSM/GPRS/EDGE SMS is based on CS/Packet-Switched (PS) domain of GSM and WCDMA USB Interface is CDC-ACM compliant Frequency Bands Penta-band HSPA: 850/900/1700/1900/2100 MHz Quad-band GSM/GPRS/EDGE: 850/900/1800/1900 MHz Speed Data Speed HSDPA data service of up to 21.0 Mbps downlink/5.76 Mbps uplink Interface USB Interface USB 2.0 high speed compatible UART Interface 0-1.8V Physical Description Weight 0.4 oz. (10 g) Dimensions 1.892" x 1.181" (48.057 mm x 29.997 mm) Note: With the form factor, dimensions exceed the standard MiniPCIe maximum component height for top and bottom. Connectors Antenna Connector 1 surface mount UFL connector for cellular 1 surface mount UFL connector for GPS Bluetooth and Wi-Fi: share 1 UFL connector SIM 1.8V and 3V SIM holder for mini-SIM card Environment Operating Temperature -35° C to +85° C Storage Temperature -35° C to +85° C Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 3.1 V to 3.5 V, normal is 3.3 V Input Power 3.3VDC SMS, Wi-Fi, Bluetooth MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 51 SPECIFICATIONS Category Description SMS Point-to-Point messaging Mobile-Terminated SMS Mobile-Originated SMS Wi-Fi IEEE 802.11 b,g, n, compliant SDIO host interface (0-1.8V) Bluetooth Serial Port Protocol (SPP) UART Interface 1.8V GPS High-sensitivity of indoor reception, better than -165 Cold start autonomous -147 dBm Hot start autonomous -161 dBm Tracking mode -166 dBm Accuracy 3 m TTF from cold start 42 s TTF from warm start 30 s TTF from hot start 1.8 s Multi-channel GPS L1 1575.42 MHz GPS NMEA 0183 output format Datum WGS-84 Certifications and Compliance EMC Compliance FCC Part 15 Class B EN55022 Class B EN55024 Radio Compliance FCC Part 22 FCC Part 24 FCC Part 15C (BT & Wi-FI intentional radiators) RSS 132 RSS 133 Part 27 resp. RSS-139 EN 301 511 complete by EN301908-1 & -2 EN 301 489-1 EN 301 489-7 EN 301 489-24 and by EN301489-3 52 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SPECIFICATIONS Category Description Safety Compliance UL 60950-1 cUL 60950-16t EN 60950-1 Network Compliance GCF Certified Module MTPCIE-H5 DC Electrical Characteristics Units: Volts Parameter Minimum Maximum 3.3 Volt Powered 3.0 3.6 Input Low Level 0.35 Input High Level 1.5 1.9 Output Low Level 0.2 Output High Level 1.6 1.9 Absolute Maximum Rating Voltage at any signal pin: 0.0V to +1.9V PCIE Connector Leads PIN # Name I/O Function Type Notes SDIO_D0 I/O Wi-Fi SDIO_D0 1.8V SDIO can operate up to 25Mhz. The SDIO traces to Host must be treated like a bus and the bus length shall be as short as possible. Recommend adding series termination resistors on all the SDIO traces. 3.3Vaux 3.3Vaux SDIO_D1 I/O Wi-Fi SDIO_D1 GND 1.8V MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V no function no function no function no function Ground MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 53 SPECIFICATIONS 54 PIN # Name I/O Function Type SDIO_D2 I/O Wi-Fi SDIO_D2 BT_TXD SDIO_D3 BT_RTS GND 10 BT_CTS 11 Notes MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V 1.8V no function no function Bluetooth Transmit data 1.8V no function no function I/O Wi-Fi SDIO_D3 1.8V no function no function Bluetooth RTS 1.8V no function no function 1.8V no function no function SDIO_CMD I/O Wi-Fi SDIO_CMD 1.8V no function no function 12 BT_RXD Bluetooth Receive data 1.8V no function no function 13 SDIO_CLK Wi-Fi SDIO_CLK 1.8V Upto 25mhz no function no function 14 BT_EN Bluetooth enable 1.8V (low disable) low disable no function no function 15 GND 16 GPIO_2 I/O 3G Cellular 1.8V General purpose I/O AT#GPIO=2,x,x no function 17 WLAN_EN Wi-Fi enable (low disable) 1.8V Low disable no function no function 18 GND Ground 19 WLAN_IRQ O Wi-Fi interrupt (low active) 1.8V Low active no function no function Ground Bluetooth CTS Ground MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SPECIFICATIONS PIN # Name I/O Function Type Notes 1.8V Active Low: Properly turn off and detach from the carrier network. Initial power on needs at least 5.5 seconds before AT command are issued. Low for at least 1 second turns off the 3G radio. It can take at least 8 seconds to turn off 3G radio. High turns on the 3G radio and it needs at least 13 seconds before AT commanda are issued.. No connect if not used. Active Low: Emergency reset without proper shutdown and without detach from the network. Low for at least 50 ms resets the 3G radio. It takes at least 2.5 seconds to reset and turn the 3G radio off. High turns on the 3G radio and needs at least 7.5 seconds before AT command are issued. No connect if not used 20 3G_ONOFF I 3G Cellular On/Off (low active) 21 GND Ground 22 3G_RST 3G Cellular Reset 1.8V line (low active) 23 1.8V 1.8V output 100mA output current at 1.8V MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V no function no function 55 SPECIFICATIONS 56 PIN # Name I/O Function Type 24 3.3Vaux 3.3Vaux 25 GPIO_1 I/O Bluetooth 1.8V General purpose I/O 26 GND Ground 27 GND Ground 28 3G_DVI_W I/O A0 3G Cellular digital voice control line 29 GND Ground 30 3G_DVI_CL I/O 31 Notes No connect MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V no function no function 1.8V no function 3G Cellular digital voice clock 1.8V no function 3G_DVI_RX I 3G Cellular digital voice receive 1.8V no function 32 RI 3G Cellular UART 1.8V RI no function 33 3G_DVI_TX O 3G Cellular digital voice transmit no function 34 GND Ground 35 GND Ground 36 USB_D- 37 GND 38 USB_D+ I/O 3G USB Positive Data 39 3.3Vaux 3.3Vaux 40 GND 41 3.3Vaux I/O 1.8V 3G USB Negative 3.3V Data Ground 3.3V Ground 3.3Vaux MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SPECIFICATIONS PIN # Name 42 I/O LED_WWA O N# Function Type 3G Cellular STAT 1.8V LED Output Notes MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V Command to enable LED function, AT#GPIO=1,0,2. This pin needs an external transistor to drive an external LED. Therefore, status indicated is reversed with respect to the pin status: Permanently off = Device off Fast blinking (Period 1s, Ton 0.5s) = Net search / Not registered / turning off Slow blinking (Period 3s, Ton 0.3s) = Registered full service Permanently on = a voice call is active 43 GND Ground 44 DCD 3G Cellular UART 1.8V DCD no function 45 CTS 3G Cellular UART 1.8V CTS no function 46 GPIO_3 I/O 3G Celllular 1.8V General purpose I/O AT#GPIO=3,x,x no function 47 RTS 3G Cellular UART 1.8V RTS Avoid having any HIGH logic level signal applied to any 3G input digital pins when the 3G module is powered off or during an ON/OFF transition. no function MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 57 SPECIFICATIONS 58 PIN # Name I/O Function Type 48 DTR 3G Cellular UART 1.8V DTR 49 RXD 3G Cellular UART 1.8V Receive data 50 GND 51 TXD 3G Cellular UART 1.8V transmit data 52 3.3Vaux 3.3Vaux Notes Avoid having any HIGH logic level signal applied to any 3G input digital pins when the 3G module is powered off or during an ON/OFF transition. MTPCIE-H5V-BW MTPCIEH5 MTPCIEH5-V no function no function Ground Avoid having any HIGH logic level signal applied to any 3G input digital pins when the 3G module is powered off or during an ON/OFF transition. no function MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide SPECIFICATIONS Typical Power Flow ■ Peak inrush current is a fast rising pulse at power start up on board supplies or modem cap charging. It is influenced by the design and limits of the power supply providing power to the device. ■ Radio initialization is a lower value steady current phase that occurs while the radio gets initialized and ready to talk to the cell network. ■ Once connected to the network, there is a steady idle current state. ■ When data is transmitted to the network, power peaks from this idle state. Peak data values are influenced by the distance from the towers and decided by the carrier network. ■ Power starts dropping when the device is disconnected. ■ After it is disconnected, power draw lowers if the device is told to enter sleep mode. Sleep mode keeps the receiver active and the device periodically wakes up long enough to tell the network it is still available. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 59 SPECIFICATIONS Power Measurements Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into your power source when determining product load. MTPCIE-H5 Radio Protocol Cellular Call Box Connection No Data (Amps) Average Measured Current (Amps) at Maximum Power TX Pulse (Avg) Total Inrush Charge Amplitude Current Measured in (Amps) for GSM850 or Millicoulomb Peak Current for HSDPA GSM850 0.056 0.629 2.5 5.27 HSDPA 0.057 0.727 0.804 5.27 3.3 Volts Note: Inrush Current:The input current during power up, or a reset. MTPCIE-H5-V-BW Radio Protocol Cellular Call Box Connection No Data (Amps) Average Measured Current (Amps) at Maximum Power TX Pulse (Avg) Total Inrush Charge Amplitude Current Measured in (Amps) for GSM850 or Millicoulomb Peak Current for HSDPA GSM850 0.062 1.058 2.9 2.51 HSDPA 0.062 0.970 1.052 2.51 3.3 Volts Note: Inrush Current:The input current during power up, or a reset. MTPCIE-BW Voltage Inrush Current (Amps) Idle Mode after MT100EOCG Boots Up (Amps) Max Power with Bluetooth and WiFi in Broadcast Mode (Amps) 3.3 Volts 0.056 0.0064 0.326 Note: Inrush Current:The input current during power up, or a reset. 60 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide APPLICATION NOTES Application Notes RF Performances RF performances are compliant with the ETSI recommendation 05.05 and 11.10. The module’s radio transceiver meets the requirements of 3GPP Release 5 & 6. All values indicated are conducted. Receiver Features for Cellular Devices Category Description GSM 850 Sensitivity < -109 dBm E-GSM 900 Sensitivity < -106 dBm DCS 1800 Sensitivity < -105 dBm PCS 1900 Sensitivity < -105 dBm UMTS Band I 2100 Sensitivity < -109 dBm UMTS Band II 1900 Sensitivity < -108 dBm UMTS Band V 850 Sensitivity < -110 dBm UMTS Band VI 800 Sensitivity < -110 dBm MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 61 APPLICATION NOTES Frequency Bands 62 Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX-RX offset GSM850 824.2- 848.8 869.2 - 893.8 128 - 251 45 MHz EGSM900 890.0 - 914.8 935.0 - 959.8 0 - 124 45 MHz 880.2 - 889.8 925.2 - 934.8 975 - 1023 45 MHz DCS1800 1710.2 - 1784.8 1805.2 - 1879.8 512 - 885 95 MHz PCS1900 1850.2 - 1909.8 1930.2 - 1989.8 512 - 810 80 MHz WCDMA850 (band V) 826.4 - 846.6 871.4 - 891.6 Tx: 4132 45 MHz 4233 Rx: 4357 - 4458 WCDMA900 (band VIII) 882.4 - 912.6 927.4 - 957.6 Tx: 2712 45 MHz 2863 Rx: 2937 - 3088 WCDMA1700 (band IV) 1710.4 - 1755.6 2112.4 - 2167.6 Tx: 1312 400MHz 1513 Rx: 9662 - 9938 WCDMA1900 (band II) 1852.4 - 1907.6 1932.4 - 1987.6 Tx: 9262 80MHz 9538 Rx: 9662 - 9938 WCDMA2100 (band I) 2112.4 - 2167.6 Tx: 9612 190MHz 9888 Rx: 10562 - 10838 1922.4 - 1977.6 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES Installing Drivers for Non-UIP HSPA+ Devices HSPA+ Device Driver Installation Installing on Linux The Linux OS includes a generic USB driver for modems supporting CDC/ACM. Multi-Tech tested the following Linux operating systems and all used port ttyACM0. If your system has another device using this port, your port numbers may be different. ■ Ubuntu ■ Debian ■ Centos ■ Ubuntu 13.04 ■ Debian 6.0.6 ■ Fedora 15 ■ openSUSE 11.4 ■ CentOS 6.0 To install the device on any Linux Kernel with CDC/ACM support, connect USB cable from the device to a USB port on your computer. For most recent Linux distributions, there are no drivers to install. If the operating system recognizes the modem, seven devices are created (assuming no other ACM values have been assigned): ■ /dev/ttyACM0 ■ /dev/ttyACM1 ■ /dev/ttyACM2 ■ /dev/ttyACM3 ■ /dev/ttyACM4 ■ /dev/ttyACM5 ■ /dev/ttyACM6 Only the following devices can be used for AT commands: ■ /dev/ttyACM0 (data port for PPP connections and AT commands) ■ /dev/ttyACM3 (generic port for AT commands) Troubleshooting Linux If Linux does not create devices, check for the kernel module: # lsmod | grep cdc_acm If entries aren't found, load the kernel module with root privileges: # modprobe cdc-acm MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 63 INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES If this returns an error response, such as # FATAL: Module cdc-acm not found, the kernel module is not on your system. You will need to build the driver. Building a Linux Driver If your system is missing the Linux driver: 1. 2. 3. 4. 5. Retrieve the appropriate kernel source code version for your system. This should be in your OS distribution package. Unpack it. In its root directory type: # make menuconfig Configure the kernel according to your system configuration, Browse to menu Device Driver > USB Support and select USB Modem (CDC ACM) support. To start the build once configured, type # make The kernel module cdc-acm.ko is in the directory drivers/usb/class. If the kernel was built previously, compile the module by typing: # make M=drivers/usb/class To load the module use modprobe or insmod. Windows Release Notes We tested h5-u-windriver_8.00.04.zip ev3-u_windriver_8.00.04.zip driver on the following Windows operating systems. ■ Windows 8 x86 and x64, Windows 7 x86 and x64, Vista x86 and x64, XP x86 and x64, Windows Server 2012, Windows Server 2008 x86 and x64, and Windows Server 2003 x86 ■ Drivers install correctly, but may require .NET Framework version 3.5 or older. ■ After installing the driver for this device, the device may not be available when Windows comes out of a sleep/hibernate state. To correct this issue, unplug the device from the USB port and then plug it back in to the same port. ■ Windows Server 2003 x64 ■ Not supported with version 8.00.04. Downloading the Windows USB Driver If you haven't downloaded the driver: 1. 2. 3. 4. Go to the Multi-Tech Support page, www.multitech.com/support.go and select your product from the Product Families drop down list. Click Drivers. Select h5-u_windriver_8.00.04.zip and Save the driver to your computer. Extract the files to your computer. Windows Notes Installing on USB Host Powered Devices When you connect a USB host powered device to a computer through a USB cable, the Windows Add New Hardware Wizard may display Cannot Install this Hardware. If this occurs, click Finish. Windows detects additional devices and prompts you to install them. 64 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES Installing on Non-USB Powered Devices Turn on the device and wait 15 seconds before connecting the USB cable. If you connect the USB cable before supplying power to the device, the Windows Add New Hardware Wizard may appear and show Cannot Install this Hardware. If this occurs, click Finish. Windows detects additional devices and prompts you to install the additional devices. If Windows does not detect new device, unplug the USB cable, turn the device off and on, wait 15 seconds, insert the USB cable, and install devices when prompted. Installing on Windows 8, 7 or Vista This process installs multiple drivers and ports. Note: If you previously installed USB drivers for this device, uninstall them before installing or re-installing this driver. Uninstall all existing drivers for this device. Refer to Uninstall Windows Drivers for details. Before you connect the device (disconnect the device if you connected it): CAUTION: If you connected the device before installing the drivers, Windows may install drivers automatically. Your device may not operate correctly with these drivers. Uninstall the drivers before proceeding. See Remove Microsoft Installed Drivers for details. 1. 2. 3. 4. 5. 6. 7. 8. Go to the location where you extracted the driver and open the H5-USB\Driver folder. Right-click on TelitUSBInstaller_In_U8.00.04.exe and select Run as Administrator. Click Yes or Allow to allow the installer to make changes to your computer. Click Next and follow the instructions in the installation wizard. Click the Install option when prompted, for example, Install this driver software anyway. Click Finish. Connect USB cable from the device to a USB port on your computer. Windows indicates when the device is ready to use. Signal strength LEDs require a device reboot after installing software. Disconnect the device from the computer's USB port for a few seconds and reconnect the device to the same USB port. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 65 INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES Installing on Windows XP This process installs four drivers. Note: If you previously installed USB drivers for this device, uninstall them before installing or re-installing this driver. Uninstall all existing drivers for this device. Refer to Uninstall Windows Drivers for details. Before you connect the device (disconnect the device if you connected it): 1. 2. 3. 4. Go to the location where you extracted the driver and open the H5-USB\Driver folder. Right-click on TelitUSBInstaller_In_U8.00.04.exe and select Run. Click Next and follow the instructions in the installation wizard. Click Continue Anyway each time this screen appears. 5. 6. Click Finish. Connect USB cable from the device to a USB port on your computer. After it detects the hardware, Windows opens the New Hardware Wizard. 7. Select No, not this time and click Next. 8. Select Install the software automatically (Recommended) and click Next. 9. Select Finish. 10. Repeat Steps 7-9 for each additional New Hardware Wizard. Windows indicates when the device is ready to use. 11. Signal strength LEDs require a device reboot after installing software. Disconnect the device from the computer's USB port for a few seconds and reconnect the device to the same USB port. 66 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES Uninstalling Windows Drivers Note: Disconnect the device before uninstalling drivers. Windows 8 To uninstall drivers from Windows 8: 1. 2. 3. Open Windows Programs and Features. Uninstall Windows Driver Package – Intel Mobile Communications (flashusb) USB. Uninstall all Telit modems, ports, and USB drivers. Windows 7 or Vista To uninstall drivers from Windows 7 or Vista: 1. 2. 3. Open Programs and Features from the Windows Control Panel. Uninstall the Windows Driver Package – Telit Wireless Solutions (telitusbser) Modem. Uninstall all Telit modems, ports, and USB. Windows XP To uninstall drivers from Windows XP: 1. 2. 3. Open the Control Panel and go to Add or Remove Programs. Uninstall Windows Driver Package – Telit Wireless Solutions (telitusbser) Modem. Uninstall all other Telit modems, Ports and USB. Remove Microsoft Installed Drivers If using Windows 7 and connect the device before installing drivers, Windows Update automatically installs drivers. Your device may not operate correctly with these drivers. To remove these drivers: 1. With the device plugged in, open the Device Manager. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 67 INSTALLING DRIVERS FOR NON-UIP HSPA+ DEVICES 2. 3. 4. Right-click on the Telit Mobile Modem and select Uninstall. Select Delete the driver software for this device and click OK. Repeat the removal steps to uninstall each Telit port and the Telit Universal Serial Bus Control. Developer Note By default each time an H5 device with a different IMEI value is connected using this USB driver, the operating system will not require searching for the drivers again and uses the same ports created in a previous installation. To prevent this, use the utility included with the driver download to manage port creation as follows. To enable USB IMEI identification, where the operating system creates a new set of ports with different COM enumeration for each H5 device with a different IMEI value: 1. 2. 3. Uninstall the driver if already installed. Double-click H5_enable_USB_IMEI_indentification.reg in the folder where you extracted the driver files. Install the driver as normal. To disable USB IMEI identification (driver default setting): 1. 2. 3. 68 Uninstall the driver if already installed. Double-click H5_disable_USB_IMEI_indentification.reg in the folder where you extracted the driver files. Install the driver as normal. MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide USING LINUX WITH H5 DEVICES Using Linux with H5 Devices Shell Commands Testing Serial Ports To test the serial ports created by the driver, type in a shell: # cat /dev/ttyACM0 & # echo –en "ATE0\r" > /dev/ttyACM03 # echo –en "AT\r" > /dev/ttyACM0 Note: Sending ATE0 is required, to avoid issues in the terminal output. It prevents the sending/receiving spurious characters to/from the modem when used with the Linux commands “echo” and “cat” You can perform the same test using the other interface (ttyACM1 ttyACM3). Create a PPP Connection Most recent Linux distributions have GUI tools for creating PPP connections; the following instructions are for creating a PPP connection through command line interface. PPP support must be compiled into the kernel; pppd and chat programs are also required. pppd needs two scripts: the first script performs the environment setting and calls the second script, which is used by the chat program. For creating a PPP connection type: # pppd file /etc/pppd_script & Example # Debug info from pppd debug #kdebug 4 # Most phones don't reply to LCP echos lcp-echo-failure 3 lcp-echo-interval 3 # Keep pppd attached to the terminal # Comment this to get daemon mode pppd nodetach # The chat script (be sure to edit that file, too!) connect "/usr/sbin/chat -v -f /etc/chatscripts/hsdpa_connect" # Serial Device to which the modem is connected /dev/ttyACM3 # Serial port line speed 115200 dump # The phone is not required to authenticate #noauth username password MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 69 USING LINUX WITH H5 DEVICES # If you want to use the HSDPA link as your gateway defaultroute # pppd must not propose any IP address to the peer #noipdefault ipcp-accept-local ipcp-accept-remote # Keep modem up even if connection fails #persist # Hardware flow control crtscts # Ask the peer for up to 2 DNS server addresses usepeerdns # No ppp compression novj nobsdcomp novjccomp nopcomp noaccomp # For sanity, keep a lock on the serial line lock # Show password in debug messages show-password This script calls the option connect using the script hsdpa_connect, for example: #!/bin/sh # Connection to the network '' AT+CGDCONT=1,"IP"," " # Dial the number. OK ATD*99***1# # The modem is waiting for the following answer CONNECT '' After launching a PPP connection is possible to use ftp protocol or other utilities that allow the access to the Internet. C Programming The following topics show all the functions that can be used from C source code to perform read/write operations on the serial devices. open() The open() function shall establish the connection between a file and a file descriptor. The file descriptor is used by other I/O functions to refer to that file. Header File fcntl.h Prototype: int open(const char *pathname, int flags) Parameters: 70 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide USING LINUX WITH H5 DEVICES pathname – file name with its own path. flags – is an int specifying file opening mode: is one of O_RDONLY, O_WRONLY or O_RDWR which request opening the file read-only, write-only or read/write, respectively. Returns: The new file descriptor fildes if successful, -1 otherwise. Example Open the /dev/ttyACM0. int fd; // file descriptor for the /dev/ttyACM0 entry if((fd = open("/dev/ttyACM0", O_RDONLY) < 0) /* Error Management Routine */ } else { /* ttyACM0 Device Opened */ read() The read() function reads nbyte bytes from the file associated with the open file descriptor, fildes, and copies them in the buffer that is pointed to by buf. Header File unistd.h Prototype: ssize_t read(int fildes, void *buf, size_t nbyte) Parameters: fildes - file descriptor buf - destination buffer pointer nbyte - number of bytes that read() attempts to read Returns: The number of bytes actually read if the operation is completed successfully, otherwise it is -1. Example Read sizeof(read_buff) bytes from the file associated with fd and stores them into read_buff. char read_buff[BUFF_LEN]; if(read(fd, read_buff, sizeof(read_buff)) < 0) /* Error Management Routine */ } else { /* Value Read */ MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 71 USING LINUX WITH H5 DEVICES write() The write() function writes nbyte bytes from the buffer that are pointed by buf to the file associated with the open file descriptor. fildes. Header File unistd.h Prototype: ssize_t write(int fildes, const void *buf, size_t nbyte) Parameters: fildes – file descriptor buf – destination buffer pointer nbyte – number of bytes that write() attempts to write Returns: The number of bytes actually written if the operation is completed successfully, otherwise it is -1. Example Write strlen(value_to_be_written) bytes from the buffer pointed by value_to_be_written to the file associated with the open file descriptor, fd. char value_to_be_written[] = “dummy_write”; if (write(fd, value_to_be_written, strlen(value_to_be_written)) < 0) /* Error Management Routine */ } else { /* Value Written */ close() The close() function shall deallocate the file descriptor indicated by fildes. To deallocate means to make the file descriptor available for return by subsequent calls to open() or other functions that allocate file descriptors. Header File unistd.h Prototype: int close(int fildes); Parameters: fildes - file descriptor Returns: 0 if successful, otherwise it is -1. 72 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide USING LINUX WITH H5 DEVICES Example Close the ttyACMx file. if(close(fd) < 0) /* Error Management Routine */ } else { /* File Closed */ Test Program() The following simple C program is useful to test the modem issuing an AT command. The program opens the /dev/ttyACM0 interface and calls the write() and the read() function to send an AT command and receive the subsequent output. #include /* Standard input/output definitions */ #include /* String function definitions */ #include /* UNIX standard function definitions */ #include /* File control definitions */ #include /* Error number definitions */ #include /* POSIX terminal control definitions */ #define USB "/dev/ttyACM0" #define BUFSIZE 1000 #define BAUDRATE B115200 int open_port(char *port) struct termios options; int fd; fd = open(port, O_RDWR | O_NOCTTY | O_NDELAY); if (fd == -1) printf("open_port: Unable to open the port - "); else printf ( "Port %s with file descriptor=%i",port, fd); fcntl(fd, F_SETFL, FNDELAY); tcgetattr( fd, &options ); cfsetispeed( &options, BAUDRATE ); cfsetospeed( &options, BAUDRATE ); options.c_cflag |= ( CLOCAL | CREAD); options.c_cflag &= ~(CSIZE | PARENB | CSTOPB | CSIZE); options.c_cflag |= CS8; options.c_cflag &= ~CRTSCTS; options.c_lflag &= ~(ICANON | ECHO | ECHOE | ISIG); options.c_iflag &= ~(IXON | IXOFF | IXANY | ICRNL | INLCR | IGNCR); options.c_oflag &= ~OPOST; if ( tcsetattr( fd, TCSANOW, &options ) == -1 ) printf ("Error with tcsetattr = %s\n", strerror ( errno ) ); MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide 73 USING LINUX WITH H5 DEVICES else printf ( "%s\n", "succeed" ); return (fd); int main() int serialFD = open_port(USB); char buf[BUFSIZE]; memset(buf,0,BUFSIZE); write(serialFD, "AT\r" , strlen("AT\r")); sleep(1); read( serialFD, buf, BUFSIZE ); printf("The string is: %s\n", buf); close(serialFD); return 0; The sleep instruction is required because the modem response after issuing the AT command is not immediate, so you need to wait a bit before reading. There are more efficient ways to do this, for example, you can put the read call in a while loop and exit when the read buffer contains a certain string. 74 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide INDEX Index account activation.........................................................47 activation cellular devices.........................................................47 antenna .........................................................................42 cable....................................................................43 45 cellular devices.........................................................42 GPS...........................................................................44 Wi-Fi RF....................................................................44 assembly diagram .........................................................18 Bluetooth ......................................................................47 build options ..............................................................6 47 ESD ................................................................................15 European Community Directives ..................................36 FCC grant notes...............................................................45 frequency bands ...........................................................62 GPS antenna....................................................................44 ground plane.................................................................14 cable.........................................................................43 45 CAD drawing.............................................................49 50 CE mark .........................................................................36 Chinese hazardous substances Chinese version........................................................41 English version .........................................................40 C programming close .........................................................................72 open .........................................................................70 read ..........................................................................71 test program ............................................................73 write.........................................................................72 handling precautions due to ESD..................................15 hazardous substances ...................................................37 host labeling..................................................................45 HSPA+............................................................................34 HSPA+21........................................................................47 IMEI ...............................................................................34 install SIM card ...................................................................31 installing device on board .......................................................31 developer board............................................................16 device maintenance ............................................................33 dialing restrictions.........................................................37 drawing ....................................................................49 50 jumpers .........................................................................30 electrical characteristics ..........................................................53 electromagnetic interference .......................................14 electrostatic discharge ..................................................15 EMI ................................................................................14 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide labeling host ..........................................................................45 labels .............................................................................34 Linux building driver..........................................................64 C programming ........................................................70 driver........................................................................47 install........................................................................63 PPP connection ........................................................69 75 INDEX shell commands .......................................................69 troubleshoot driver..................................................63 maintenance .................................................................33 mechanical drawing .................................................49 50 noise suppression..........................................................14 PC board layout.............................................................14 pinout............................................................................53 USB...........................................................................13 pinout table.....................................................................8 standard ...................................................................11 power draw...................................................................60 PTCRB ............................................................................34 transmitter features......................................................61 uninstall.........................................................................67 USB...........................................................................13 67 design consideration................................................15 driver download.......................................................64 notes ........................................................................64 USB driver install..............................................................63 65 66 uninstall ...................................................................67 user responsibility.........................................................33 vehicle safety ................................................................32 Vista .........................................................................65 67 radio frequency interference........................................32 receiver features ...........................................................61 RoHS..............................................................................37 safety RF interference ........................................................32 vehicle......................................................................32 safety standards............................................................14 SIM card ........................................................................31 specifications.................................................................51 76 Wi-Fi ..............................................................................47 Wi-Fi RF specifications ..................................................44 Windows release notes............................................................64 USB driver download ...............................................64 USB driver release notes..........................................64 Windows 7 ...............................................................65 67 Windows 8 ....................................................................65 uninstall ...................................................................67 Windows XP .............................................................66 67 XP ..................................................................................66 MultiConnectTM PCIe MTPCIE-H5/MTPCIE-BW Developer Guide
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