Murata Electronics North America DRWLS1273L DR-WLS1273L-102 User Manual

Murata Electronics North America DR-WLS1273L-102

User Manual

Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 1 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12     DR-WLS1273L-102 FCC/ETSI/IC Certified WLAN/Bluetooth Multifunction Module      Data Sheet
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 2 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Scope  This specification applies to the IEEE802.11a/b/g/n WLAN and Bluetooth 4.0 standards.  Interfaces  WLAN:    4-bit SDIO Bluetooth:   UART, PCM  IC and Firmware  WLAN/BT RF/BB/MAC IC:  TI WL1273L PG 3.1 Front-end IC for WL1273L:  TriQuint TQP6M9002 ES1.8  Clocks and Compliance  Sleep Clock:      External 32.768 kHz oscillator required RoHS:        This module is compliant with the RoHS directive Bluetooth:   Qualified Design Listing: B017989 Certifications   FCC, ETSI and Industry Canada  For mobile operating conditions (greater than 20 cm to the body) - This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.  For portable operating conditions (less than 20 cm to the body) - This equipment complies with FCC radi-ation exposure limits set forth for an uncontrolled environment. This equipment may operate in direct con-tact with the body of the user under normal operating conditions. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.  Certification testing conducted with Antenna Factor ANT-RAF-RPS 2.4/5 GHz antenna, RSMA connector.  Part Numbers   Module:    DR-WLS1273L-102
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 3 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Block Diagram 2 . 4   G H zW L A N / B TV B A TU A R TP C MS D I OS l o w   C L KD C - D CC o n v e r t e r3 8 . 4   M H zF a s t   C L KF r o n t   E n dI C   a n d   R FF i l t e r i n g5 . 8   G H zW L A NW L 1 2 7 3 LV I O DR-WLS1273L-102 WLAN Features  • WLAN MAC baseband processor and RF transceiver which are IEEE802.11a/b/g and IEEE802.11n   PICS compliant • Optimized for ultra-low current consumption in all operating modes • Accepts 19.2, 26, 38.4 or 52 MHz reference clock inputs for easy integration into cellular handsets, etc. • IEEE Standard 802.11d, e, h, i, k, r, PICS compliant • Support for Cisco Client eXtensions (CCX) standard • Serial debug interface • Support for Secure Digital Input/Output (SDIO) host interface • Medium Access Controller (MAC)     – Embedded ARM™ central processing unit (CPU)     – Hardware-based encryption/decryption using 64-, 128- or 256-Bit WEP, TKIP or AES keys     – Supports Wi-Fi protected access (WPA and WPA2.0) and IEEE Standard 802.11i, including        hardware accelerated Advanced Encryption Standard (AES)     – Designed to work with IEEE Std 802.1x for Virtual Private Network (VPN) solutions
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 4 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 • Baseband Processor     – IEEE Std 802.11n single-stream data rates (MCS0-7) and SGI support • 2.4/5.8 GHz Radio     – Digital Radio Processor (DRP) implementation     – Integrated LNA     – Supports IEEE Std 802.11a/b/g and 802.11n  DR-WLS1273L-102 Bluetooth Features  • V4.0 + EDR, Power Class 1.5 + BLE • Bluetooth Qualified Design Listing: B017988 • BT Enhanced Data Rates - 2 and 3 Mbps • Enhanced UART host interface  • Very low power consumption • On-chip Embedded radio     – Integrated 2.4 GHz RF transceiver     – All digital PLL transmitter with digitally controlled oscillator     – Near-zero IF architecture     – On-chip TX/RX switch     – Support for Class-1.5 applications • Embedded ARM microprocessor system     – High rate four wire UART HCI (H4) and three wire UART HCI (H5)     – Automatic clock-detection mechanism • Flexible PCM interface - full flexibility for data order, sampling and positioning • Temperature detection and compensation mechanism ensures minimal variation in the RF performance    over the entire operating temperature range • Low-power scan achieves paging and inquiry scans at 1/3 normal power • Digital Radio Processor (DRP) single-ended 50 ohm I/O for easy RF interfacing • Patch trap mechanism and reserved RAM enables easy bug fixes • Advance Audio Interfaces and capabilities     – A2DP support     – A2DP internal loopback     – Wide-band speech support     – On board SBC encoder/decoder - offloads host for A2DP and wide-band speech processing     – Full support for Bluetooth low energy (BLE) standard. BLE can operate in parallel with standard        Bluetooth function.  WLAN Functional Blocks  The DR-WLS1273L-102 WLAN architecture includes a digital radio processor and a point-to-multipoint baseband core function. The architecture is based on a single-processor ARM core. The device includes on-chip peripherals to enable easy communication between a host system and the WLAN core function.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 5 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 WLAN SDIO Transport Layer  SDIO is the WLAN host interface in the DR-WLS1273L-102. This interface is a standard SDIO interface (SDIO spec Version 2.0). The DR-WLS1273L-102 SDIO also supports the following features:  • 4-bit data bus • Functions number 0 and 2 • Multi-Block data transfer • The SDIO interface is used for WLAN. The WLAN block uses function 2. Function 0 is used for the    common I/O area.  WLAN MAC  The DR-WLS1273L-102 MAC implements the IEEE standard 802.11 MAC sub-layer using both dedicated hardware and embedded firmware. The MAC hardware implements real-time functions, including access protocol management, encryption and decryption.  WLAN Baseband Processor  The DR-WLS1273L-102 baseband processor sits between the on-chip MAC and the radio. The DR-WLS1273L-102 baseband processor implements the IEEE 802.11a/b/g/n PHY sub-layers and has been optimized to perform well in conditions of high multipath and noise.  WLAN RF Radio  The DR-WLS1273L-102 radio is a highly integrated Digital Radio Processor (DRP) designed for 802.11a/b/g/n applications. The DR-WLS1273L-102 RF interfaces are designed for direct, “glueless” con-nection to single-band RF front ends for 2.4 and 5.8 GHz 802.11a/b/g/n applications.  BT Functional Blocks  The DR-WLS1273L-102 BT architecture comprises a digital radio processor and a point-to-multipoint baseband core function. The architecture is based on a single-processor ARM core. The device includes on-chip peripherals to enable easy communication between a host system and the Bluetooth core func-tion.  BT HCI UART Transport Layers  The DR-WLS1273L-102 incorporates one UART module dedicated to the Host Controller Interface (HCI) transport layer. The HCI interface is used to transport commands, events, ACL and data between the Bluetooth device and its host using HCI data packets. The DR-WLS1273L-102 supports the following HCI transport layers, detected automatically when communication starts:  • UART transport layer - HCI four-wire (H4) and HCI three-wire (H5) • HCI interface has a 256 byte receive buffer  The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies - up to a maximum of 4 Mbps. After power-up, the baud rate is set for 115.2 kbps. The maximum baud rate devia-tion supported is -2.5%, +1.5%. The baud rate can thereafter be changed with a VS command. The DR-WLS1273L-102 responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place. The only parameter needed is the desired baud rate. HCI hardware includes the fol-lowing features:
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 6 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 • Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions • Transmitter underflow detection • CTR/RTS hardware flow control    BT UART 4-Wire Interface - H4  The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and the DR-WLS1273L-102 is byte-wise by hardware. Flow control is obtained by the following:  H O S T _ R XH O S T   T XH O S T _ C T SH O S T _ R T SH C I _ R XH C I _ T XH C I _ C T SH C I _ R T SH o s tP r o c e s s o r D R - W L S 1 2 7 3 L - 1 0 2  When the UART RX buffer asses the “flow control” threshold, it sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the DR-WLS1273L-102 stops trans-mitting on the interface. In case HCI_CTS is set high in the middle of transmitting a byte, the DR-WLS1273L-102 finishes transmitting the byte and stops the transmission.  BT UART 3-Wire Interface - H5  This interface consists of three signals: TXD, RXD and GND:  HCI_RX Receive Data on the UART Interface HCI_TX Transmit Data on the UART Interface GND Ground XON/XOFF software flow control is normally used.  The DR-WLS1273L-102 also supports a four-wire mode for H5, with RTS/CTS hardware flow control. Since the same UART module is used for the 3- and 4-wire HCI UART interface, all features supported by the 4-wire interface are also supported for the 3-wire interface. H5 features: • Flow control configured with HCI_VS command, software XON/XOFF, hardware (RTS/CTS), or none • Power management • Configurable timers for re-transmission management • CRC
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 7 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 BT Audio CODEC Interface  The CODEC interface is a fully dedicated programmable serial port that provides the logic to interface to several kinds of PCM codecs. The interface supports: • Two voice channels • Master/slave modes • Coding schemes: μ-Law, A-Law, Linear, Transparent • Long & short frames • Different data lengths, orders and positions • UDI profile • High rate PCM interface for EDR • Enlarged interface options to support a wider variety of codecs • PCM bus sharing  PCM Hardware Interface The PCM interface is one implementation of the codec interface. It contains the following four lines: • Clock - configurable direction (input or output) • Frame Sync - configurable direction (input or output) • Data In - Input • Data Out - Output/Hi-Z  The DR-WLS1273L-102 device can be either the master of the interface where it generates the clock and the frame-sync signals, or slave where it receives these two signals. The PCM interface is fully configured by means of a VS command. For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above 12 MHz, the maximum data burst size is 32 bits. For master mode, the DR-WLS1273L-102 can generate any clock frequency between 64 kHz and 4.096 MHz.  Data Format The data format is fully configurable: • The data length can be from 8 to 320 bits, in 1-bit increments, when working with two channels, or up to 640 bits when using 1 channel. The data length can be set independently for each channel. • The data position within a frame is also configurable with 1-clock (bit) resolution, and can be set inde-pendently (relative to the edge of the Frame Sync signal) for each channel. • The Data_In and Data_Out bit order can be configured independently. For example; Data_In can start with MSB while Data_Out starts with LSB. Each channel is separately configurable. The inverse bit order (i.e. LSB first) is supported only for sample sizes up to 24 bits. • The data in and data out size do not necessarily have to be the same length. • The Data_Out line is configured as a ‘high-Z’ output between data words. Data_Out can also be set for permanent high-Z, irrespective of data out. This allows the DR-WLS1273L-102 to be a bus slave in a mul-ti-slave PCM environment. At power up, Data_Out is configured as high-Z.  Frame-Idle Period The CODEC interface has the capability for frame-idle periods, where the PCM clock can “take a break” and become ‘0’ at the end of the PCM frame, after all data has been transferred. The DR-WLS1273L-102 supports frame-idle periods both as master and slave of the PCM bus. When DR-WLS1273L-102 is the master of the interface, the frame-idle period is configurable. There are 2 configurable parameters: • Clk_Idle_Start - indicates the number of PCM clock cycles from the beginning of the frame till the begin-ning of the idle period. After Clk_Idle_Start clock cycles, the clock becomes ‘0’.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 8 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 • Clk_Idle_End - indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods. The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period, e.g., for PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start = 60, Clk_Idle_End = 90. Between each two-frame sync there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame and lasts 90-60=30 clock cycles. This means that the idle period ends 100-90=10 clock cycles before the end of the frame. The data transmis-sion must end prior to the beginning of the idle period.  Audio Encoding The DR-WLS1273L-102 CODEC interface can use one of four audio coding patterns: • A-Law (8-bit) • m-Law (8-bit) • Linear (8 or 16-bit) • Transparent
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 9 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Mechanical  0 . 5 7 8( 1 4 . 7 )0 . 7 3 5( 1 8 . 7 )0 . 1 0 0( 2 . 5 )0 . 1 3 0( 3 . 3 )0 . 3 6 2( 9 . 2 )0 . 2 5 6( 6 . 5 )0 . 0 4 0( 1 . 0 )0 . 0 3 0( 0 . 8 )0 . 0 3 0( 0 . 8 )0 . 0 4 0( 1 . 0 )0 . 5 0( 1 . 3 )0 . 0 8 0( 2 . 0 )0 . 0 8 0( 2 . 0 )0 . 1 0 5( 2 . 7 )0 . 0 4 1( 1 . 0 )0 . 0 3 0( 0 . 8 )0 . 0 2 8( 0 . 7 )0 . 5 4 2( 2 . 1 7 )0 . 4 8 2( 1 2 . 2 )0 . 0 4 3( 1 . 1 )D i m e n s i o n s   i n   i n c h e s   ( m m )Top S i d e B o t t o mD R - W L S 1 2 7 3 L - 1 0 2   P a c k a g e   D r a w i n g121 51 45 12 62 72 84 14 24 05 01 6V i e w   f r o m   T o p0 . 1 5   ( 3 . 8 )M a x i m u m   H e i g h t0 . 1 2 0( 3 . 0 ) 0 . 0 8 0( 2 . 0 )2 . 4   G H z5 . 8   G H z
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 10 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Module Terminal Description  Num  Terminal Name  Type  System  IC Terminal Connection  Description 1  PCM SYNC  I/O  BT  WL1273L  AUD_FSYNC  PCM I/F 2  PCM CLK  I/O  BT  WL1273L  AUD_CLK  PCM I/F 3  PCM OUT  I/O  BT  WL1273L  AUD_OUT  PCM I/F 4  PCM IN  I/O  BT  WL1273L  AUD_IN  PCM I/F 5  HOST WAKE  I/O  BT  WL1273L  BT_FUNC5  Host Wake Up 6 VBAT IN P SOC WL1273L, TPS62601  PMS_VBAT, VIN  Power supply input 7  BT ENABLE  I  BT  WL1273L  BT_EN  BT Enable/Reset 8  WLAN IRQ  O  WLAN  WL1273L  WLAN_IRQ  WLAN interrupt request 9 NOT USED         Mechanical Connection 10 NOT USED         Mechanical Connection11 NOT USED         Mechanical Connection12 NOT USED         Mechanical Connection13 NOT USED         Mechanical Connection14 WLAN TX I/O WLAN WL1273L WL_RS232_TX  RS232_RX 15 WLAN RX I/O WLAN WL1273L WL_RS232_RX  RS232_TX 16  WLAN EN  I  WLAN  WL1273L  WL_EN  WLAN Enable/Reset 17  SDIO D2  I/O  WLAN  WL1273L  SDIO_D2  SDIO DATA 2 18  SDIO D1  I/O  WLAN  WL1273L  SDIO_D1  SDIO DATA 1 19  SDIO CMD  I/O  WLAN  WL1273L  SDIO_CMD  SDIO CMD 20 NOT USED         Mechanical Connection 21 GND        SOC Ground 22  SDIO CLK  I  WLAN  WL1273L  SDIO_CLK  SDIO CLK 23 UART DBG I/O WLAN WL1273L WL_UART_DBG  WL_UART_DBG 24  SDIO D0  I/O  WLAN  WL1273L  SDIO_D0  SDIO mode: DATA 0 25 NOT USED         Mechanical Connection 26  SDIO D3  I/O  WLAN  WL1273L  SDIO_D3  SDIO mode: DATA 3 27 BT UART DBG I/O BT WL1273L BT_UART_DBG BT_UART_DBG, connect to   TP for software debug 28 NOT USED         Mechanical Connection 29 NOT USED         Mechanical Connection 30  SLEEP CLOCK  I  -  WL1273L  SLOWCLK  SLEEP_CLK Input 31 BT WAKE I/O BT WL1273L BT_FUNC2  BT_WU/BT 32 NOT USED         Mechanical Connection 33  VIO IN  P  SOC  WL1273L  VDDS  Power Supply Input 34 NOT USED         Mechanical Connection
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 11 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12  Num  Terminal Name  Type  System  IC Terminal Connection  Description 35  BT CTS  I/O  BT  WL1273L  HCI_CTS  BT UART CTS 36 NOT USED         Mechanical Connection 37  BT RTS  I/O  BT  WL1273L  HCI_RTS  BT UART RTS 38 NOT USED         Mechanical Connection 39  BT TX  I/O  BT  WL1273L  HCI_TX  BT UART TX 40 NOT USED         Mechanical Connection 41  BT RX  I/O  BT  WL1273L  HCI_RX  BT UART RX 42 GND        SOC Ground 43 GND        SOC Ground 44  2.4 GHZ ANT  I/O  BT, WLAN    RF receiver input RF transmitter output 45 GND        SOC Ground 46 GND        SOC Ground47 GND        SOC Ground48 GND        SOC Ground49  5.8 GHZ ANT  I/O  WLAN      RF receiver input RF transmitter output 50 GND        SOC Ground 51 GND        SOC Ground
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 12 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Absolute Maximum Ratings    Ratings Minimum  Maximum  Units     Temperature  -40  +85  OC     Supply Voltage   VBAT  -0.5  +5.5  V  VIO  -0.5  +2.1  V  Operating Conditions    Specifications Minimum  Typical  Maximum  Units     Temperature1, 2 -40 +25 +85 OC     Supply Voltage   VBAT  3.0 3.6 4.2  V  VIO3  1.70 1.80 1.90  V  Digital I/O Requirements    Specifications  Symbol  Minimum  Maximum  Units     Logic High Input Voltage  VIH  0.65 * VIO  VIO  V     Logic Low Input Voltage  VIL  0  0.35 * VIO  V     Logic High Output Voltage  @ 4.00 mA VOH VIO - 0.450  VIO V  @ 1.00 mA  VIO - 0.112  VIO  @ 0.30 mA  VIO - 0.033  VIO     Logic Low Output Voltage  @ 4.00 mA VOL 0 0.450 V  @ 1.00 mA  0  0.112  @ 0.09 mA  0  0.01     Input Transition Time TR/TF     from 10% to 90%4  CL < 50 fF  TR/TF 0  25  ps     Output Rise Time TR     from 10% to 90%4  CL < 25 pF  TR - 5.3 ns     Output Fall Time TF     from 90% to 10%4  CL < 25 pF  TF - 4.9 ns  Notes:  1.   The device can be reliably operated for 5,000 active WLAN hours cumulative at T ambient of 85 °C. 2.   BIP (calibration) must be run to achieve full power output when temperatures changes more than 20 °C from the last BIP 3.   Minimum ramp time for IO power supply is 100 µs 4.   Applies to all digital lines except SDIO, UART, PCM and slow clock lines.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 13 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 External Slow Clock Requirements    Specifications1 Minimum  Typical  Maximum  Units     Slow Clock Frequency  32.768  kHz     Slow Clock Accuracy  -  -  ±150  ppm     Clock Transition Time, Tr/Tf 10 to 90%  -  -  100  ns     Clock Duty Cycle  15  50  70  %     Input Voltage Limits, Square     Wave, DC-coupled  VIH  0.65 * VIO  -  VIO V  VIL  0  -  0.35 * VIO     Input Impedance  1  -  -  M     Input Capacitance  -  -  5  pF     Rise and Fall Time  -  -  100  ns     Phase Noise @ 1 kHz offset  -  -  -125  dBc/Hz     Jitter, Integrated over 300 to 15000 Hz  -  -  1  Hz  1. The slow digital clock is a fail-safe input.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 14 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 WLAN Power-up Sequence  V I O ,   1 . 8   VV B A T ,   2 . 3   t o   5 . 5   VT 1 T 2TW A K E   U P<   1 0 0   µ sS L O W C L KW L _ E ND C _ R E QD C 2 D C ,   1 . 8   VC L K _ R E QS D I O   C L KW L A N _ I R QFR E F The following sequence describes device power up from shutdown. Only the WLAN Core is enabled; the BT core is disabled. 1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not fail-safe. Exceptions are CLQ_REQ, SLEEP_CLK, XTALP, and PCM_xxx, which are fail-safe and can tolerate external voltages with no VIO and DC2DC. 2. VBAT,VIO and SLEEP_CLK must be available before WLAN ENABLE. 3. TWAKE-UP = T1+T2. The duration of T1 is the time from WLAN ENABLE high until FREF is valid (55 ms typical). The duration of T2 depends on:     Operating system     Host enumeration for the SDIO     PLL configuration     Firmware download     Releasing the core from reset     Firmware initialization
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 15 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 WLAN Power-down Sequence  V B A T ,   2 . 3   t o   5 . 5   VV I O ,   1 . 8   VS L O W C L KW L _ E ND C _ R E QD C 2 D C ,   1 . 8   VC L K _ R E Q            S D I O   C L KW L A N _ I R Q 1. DC_REQ will go low only if WLAN is the only core working. Otherwise if the BT core is working, it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if the BT core is working and using the FREF it will stay high. 3. If WLAN is the only core that is operating, WLAN ENABLE must remain de-asserted for at least 64 µs before it is re-asserted.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 16 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Bluetooth Power-up Sequence  V B A TT 1TW A K E   U P<   1 0 0   µ sV I OS L E E P   C L O C KB T _ R E S E T XD C _ R E Q( i n t e r n a l )DC2DC( 1 . 8   V )C L K _ R E QFR E FU A R T _ R T S The following sequence describes device power-up from shutdown. Only the BT core is enabled; the WLAN  are disabled.  1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not failsafe. Exceptions are CLK_REQ, SLEEP_CLK, XTALP and PCM_xxx, which are failsafe and can tolerate external voltages with no VIO and DC2DC. 2. VIO and SLEEP_CLK must be stable before releasing BT ENABLE (BT_RESETX). 3. Fast clock must be stable maximum 55ms after BT ENABLE goes HIGH. 4. The duration of T1 is defined as the time from BT ENABLE=high until FREF is valid (55 ms typical). 5. The duration of TWAKE-UP is defined as the time from the rising edge of BT ENABLE to the falling edge of UART_RTS. The WL1273L indicates completion of BT power up sequence by asserting RTS low. This occurs up to 100 ms after BT ENABLE goes high.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 17 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Bluetooth Power-down Sequence  V B A TV I OS L E E P   C L O C KB T _ R E S E T XD C _ R E Q( i n t e r n a l )DC2DC( 1 . 8   V )C L K _ R E QU A R T _ R T SB l u e t o o t h   i n a c t i v e The DR-WLS1273L-102 indicates completion of BT power up sequence by asserting RTS low. This occurs up to 100 ms after BT ENABLE (BT_RESETX) goes high.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 18 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Host Interface Combination  WLAN  BT 4-bit SDIO  UART  All core functions support automatic host-interface recognition. The user does not need to configure it in advance.  SDIO Interface Switching Characteristics, 25 pF Load Capacitance  Symbol  Parameter  Minimum  Maximum  Units FCLOCK Clock Frequency  0  25  MHz DC  Low/High Duty Cycle  40  60  % tWL  Pulse Duration, Clock Low  10    ns tWH  Pulse Duration, Clock High  10    ns tTLH  Clock Rise Time    4.3  ns tTHL  Clock Fall Time    3.5  ns tISU  Set-up Time, Input Valid before Clock  5    ns tIH  Hold Time, Input Valid after Clock  5    ns tODLY1  Delay Time, Clock Falling Edge to Output Valid  0  14  ns tODLY2  Delay Time, Clock Falling Edge to Output Invalid  0  14  ns  SDIO Timing  C l o c kI n p u tO u t p u tVI HVI LVO HVO LVI LVI HtT L HtT H LtW LtW HtI HtI S UtO D L Y 2tO D L Y 10.2 0.7
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 19 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 SDIO Interface Read  R e a d   C o m m a n d C a r d   R e s p o n s e C o m m a n dR e a dtR CtC CtA CtC RC M D( I n p u t / O u t p u t )S D 0 - S D 3( I n p u t / O u t p u t ) Symbol  Parameter  Minimum  Maximum  Units tCR Delay Time, Assign Relative Address or Data Transfer Mode; Read command CMD invalid to card response CMD valid 2 64 Clock Cycles tCC Delay Time, CMD command invalid to CMD command valid  8 - Clock Cycles tRC Delay Time, CMD response invalid to CMD command valid  8 - Clock Cycles tAC Access Time, CMD command invalid to SD0-SD3 read data valid  8 - Clock Cycles  SDIO Interface Write  C M D( I n p u t / O u t p u t )S D 0 - S D 3( I n p u t / O u t p u t )C a r d   R e s p o n s eW r i t e C R C   S t a t u s B u s ytd 1td 2 Symbol  Parameter  Minimum  Maximum  Units Td1 Delay Time, CMD Card Response Invalid to SD0-SD3 Write Data Valid 2 - Clock Cycles Td2 Delay Time, SD0-SD3 Write Data Invalid to CRC Status Valid 2 2 Clock Cycles
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 20 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 BT Audio CODEC/PCM Interface Switching Characteristics  Tc l kTWto pti sti hA U D _ C L KA U D _ I N / F S Y N C _ I NA U D _ O U T / F S Y N C _ O U T PCM Master  Symbol  Parameter  Minimum  Maximum  Units TCLK Clock Period  166.7 (6 MHz)  15625 (64 kHz)  ns TW High/Low Pulse Width  50% of TCLK    tis AUD_IN Setup Time  25  ns tih AUD_IN Hold Time  0  top AUD_OUT Propagation Time, 40 pF Load  0 10 top FSYNC_OUT Propagation Time, 40 pF Load  0 10  PCM Slave  Symbol  Parameter  Minimum  Maximum  Units TCLK Clock Period  62.5 (16 MHz)    ns TW High/Low Pulse Width  40% of TCLK    tis AUD_IN Setup Time  8  ns tih AUD_IN Hold Time  0  tis FSYNC_IN Setup Time  8  tih FSYNC_IN Hold Time  0  top AUD_OUT Propagation Time, 40 pF Load  0 21
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 21 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 UART Interface Timing  H C I _ R T SH C I _ R XH C I _ C T SH C I _ T X1 0   b i t st1t2t6t5t3t7t4 Symbol  Parameter  Condition  Minimum  Typical  Maximum  Units BR  Baud Rate  Most Standard Rates  37.5  -  4000  kbps t5, t7 Baud Rate Accuracy  Receive/Transmit -2.5 - 1.5 % t3 CTS Low to TX_DATA   0 2 - µs t4 CTS High to TX_DATA  Hardware Flow Control  -  -  1  byte t6 CTS High Pulse Width   1 - - bit t1 RTS Low to RX_DATA ON   0 2 - µs t2 RTS High to RX_DATA OFF  Interrupt set to 1/4 FIFO  -  -  16  byte  DR-WLS1273L-102 IRQ Operation  1. The default state of the WLAN_IRQ prior to firmware initialization is 0. 2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ     changes its state to 1 3. A WLAN firmware interrupt is handled as follows:     (a) The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the WLAN_IRQ     line (host must be configured as active-low or falling-edge detect).     (b) After the host is available, depending on the interrupt priority and other host tasks, it masks the     firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).     (c) The host reads the internal register status to determine the interrupt sources - the register is cleared     after the read     (d) The host processes in sequence all the interrupts read from this register     (e) The host unmasks the firmware interrupts. 4. The host is ready to receive another interrupt from the WLAN device.  DR-WLS1273L-102 BT Function Low Power Mode Protocols  The DR-WLS1273L-102 includes a mechanism that handles the transition between operating mode and deep sleep low-power mode. The protocol is done via the UART and is known as eHCILL (enhanced HCI Low Level) power management protocol. This protocol is backward compatible with the BRF6150/BRF6300 /BRF6350/WL1273 HCILL Protocol, so a Host that implements the HCILL for BRF6150/BRF6350 does not need to change anything in order to work with the DR-WLS1273L-102. The "Enhanced" portion of the HCILL introduces changes that allow a simpler host implementation of this pro-tocol. See BT-SW-0024 (BRF Enhanced HCILL 4 wire Power Management Protocol). In addition to the HCILL protocol, the DR-WLS1273L-102 also supports the power management schemes inherent in the UART H5 transport layers.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 22 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for IEEE 802.11b Operation, 11 Mbps, 2.4 GHz Conditions: 25 C, VBAT=3.6 V, VIO=1.8 V, VDD_LDO_IN_CLASS1P5 connected to VBAT  System Specifications  Data   Standard  IEEE802.11b   Mode  DSSS/CCK   Frequency, Spacing  2412 to 2462 MHz, 5 MHz   Data Rate  1, 2, 5.5, 11 Mbps DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             TX Mode  -  265  350  mA     RX Mode  -  100  150  mA     Sleep Mode  -  89  200  µA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  16  18  20  dBm   Spectrum Mask:             1st Sidelobes  -  -46  -30  dBr     2nd Sidelobes  -  -55  -50  dBr   Power-on and Power-off Ramp  -  0.06  2.00  µs   RF Carrier Suppression  -  -  -15  dB   Modulation Accuracy (EVM)  -  7  35  %   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -96  -36  dBm     1 to 12.75 GHz  -  -55  -30  dBm     1.8 to 1.9 GHz  -  -96  -47  dBm Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity:             Minimum Input Level, 11 Mbps, FER  8%  - -87 -76 dBm     Maximum Input Level, FER  8%  -10 -  - dBm   Adjacent Channel Rejection, FER  8%  35 -  - dB
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 23 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for IEEE 802.11g Operation, 54 Mbps, 2.4 GHz Conditions: 25 C, VBAT=3.6V, VIO=1.8V, VDD_LDO_IN_CLASS1P5 is connected to VBAT  System Specifications  Data   Standard  IEEE802.11g   Mode  OFDM   Frequency, Spacing  2412 to 2462 MHz, 5 MHz   Data Rate  6, 9, 12, 24, 36, 48, 54 Mbps DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             TX Mode  -  180  270  mA     RX Mode  -  100  150  mA     Sleep Mode  -  -  200  µA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  11  13  15  dBm   Spectrum Mask:             at fC ±11 MHz  -  -31  -20  dBr     at fC ±20 MHz  -  -39  -28  dBr     at fC ≥ ±30 MHz  -  -50  -40  dBr   Constellation Error (EVM)  -  -34  -25  dB   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -96  -36  dBm     1 to 12.75 GHz  -  -58  -30  dBm     1.8 to 1.9 GHz  -  -96  -47  dBm Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity:             Minimum Input Level, 54 Mbps, PER  10%  - -74 -65 dBm     Maximum Input Level, PER  10%  -20 -  - dBm   Adjacent Channel Rejection, 54 Mbps, PER  10%  -1 -  - dB
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 24 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for IEEE 802.11a Operation, 54 Mbps, 5 GHz Conditions: 25 deg C, VBAT=3.6 V, VIO=1.8 V, VDD_LDO_IN_CLASS1P5 is connected to VBAT  System Specifications  Data   Standard  IEEE802.11a   Mode  OFDM   Frequency, Spacing  5180 to 5320 MHz, 20 MHz   Data Rate  6, 9, 12, 24, 36, 48, 54 Mbps DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             TX Mode  -  213  270  mA     RX Mode  -  100  150  mA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  10  12  14  dBm   Spectrum Mask:             at fC ±11 MHz  -  -31  -20  dBr     at fC ±20 MHz  -  -39  -28  dBr     at fC ≥ ±30 MHz  -  -50  -40  dBr   Constellation Error (EVM)  -  -30  -25  dB   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -92  -36  dBm     1 to 12.75 GHz  -  -54  -30  dBm     1.8 to 1.9 GHz  -  -96  -47  dBm Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity:             Minimum Input Level, 54 Mbps, PER  10%  - -72 -65 dBm     Maximum Input Level, PER  10%  -30 - - dBm   Adjacent Channel Rejection, 54 Mbps, PER  10%  -1 - - dB
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 25 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for IEEE 802.11n Operation, 65 Mbps, 2.4 GHz Conditions: 25 C, VBAT=3.6 V, VIO=1.8 V, VDD_LDO_IN_CLASS1P5 is connected to VBAT  System Specifications  Data   Standard  IEEE802.11n-2.4G   Mode  OFDM   Frequency, Spacing  2412 to 2462 MHz, 5 MHz   Data Rate  6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             TX Mode  -  180  250  mA     RX Mode  -  100  150  mA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  10  12  14  dBm   Spectrum Mask:             at fC ±11 MHz  -  -30  -20  dBr     at fC ±20 MHz  -  -33  -28  dBr     at fC ≥ ±30 MHz  -  -49  -45  dBr   Constellation Error (EVM)  -  -  -28  dB   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -95  -36  dBm     1 to 12.75 GHz  -  -71  -30  dBm     1.8 to 1.9 GHz  -  -96  -47  dBm Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity:             Minimum Input Level, 65 Mbps, PER  10%  - -70 -64 dBm     Maximum Input Level, PER  10%  -20 -  - dBm
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 26 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for IEEE 802.11n Operation, 65 Mbps, 5 GHz Conditions: 25 C, VBAT=3.6 V, VIO=1.8 V, VDD_LDO_IN_CLASS1P5 is connected to VBAT  System Specifications  Data   Specification  IEEE802.11n-5G   Mode  OFDM   Frequency, Spacing  5180 to 5320 MHz, 5 MHz   Data Rate  6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             TX Mode  -  225  270  mA     RX Mode  -  107  150  mA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  10  12  14  dBm   Spectrum Mask:             at fC ±11 MHz  -  -30  -20  dBr     at fC ±20 MHz  -  -34  -28  dBr     at fC ≥ ±30 MHz  -  -49  -45  dBr   Constellation Error (EVM)  -  TBD  TBD  dB   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -96  -36  dBm     1 to 12.75 GHz  -  -55  -30  dBm     1.8 to 1.9 GHz  -  -96  -47  dBm Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity:             Minimum Input Level, 65 Mbps, PER  10%  - -67 -64 dBm     Maximum Input Level, PER  10%  -30 -  - dBm
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 27 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 DC and RF Characteristics for Bluetooth Operation, 2.4 GHz Conditions: 25 C, VBAT=3.6 V, VIO=1.8 V, VDD_LDO_IN_CLASS1P5 is connected to VBAT  System Specifications  Data   Bluetooth Standard  Version 4.0   Channel Spacing  1 MHz   Number of RF Channels  79   Power Class  1.5   Operating Mode Frequency hopping spread spectrum, pseudorandom hopping pattern, time division multiple access on transmit or receive, frequency hop after each RX/TX cycle DC Specifications  Minimum  Typical  Maximum  Units   DC Current:             DH1 Packet, 50% RX/TX Slot Duty Cycle  -  38  60  mA     DH3 Packet, 50% RX/TX Slot Duty Cycle  -  45  60  mA     DH5 Packet, 50% RX/TX Slot Duty Cycle  -  48  60  mA Transmitter Specifications  Minimum  Typical  Maximum  Units   RF Output Power  4.5  8.5  -  dBm   Frequency Range, RX/TX  2400 to 2483.5  MHz   -20 dB Bandwidth  -  0.925  1  MHz   Adjacent Channel Power1:         M - N = 2  -  -45  -20  dBm     M - N  ≥ 3   -  -46.5  -40  dBm   Modulation Characteristics:             Modulation  f1 average   140 160 175 kHz     Modulation  f2 average  115 132  - kHz     Modulation  f2 average /  f1 average  0.8 0.9  - -   Initial Frequency Tolerance  -75  -  +75  kHz   Frequency Drift:             1 Slot  -25  +11  +25  kHz     3 Slots  -40  +11.5  +40  kHz     5 Slots  -40  +11.5  +40  kHz   Maximum Frequency Drift Rate  -20  ±5  +20  kHz/50 µs   Out-of-Band Spurious Emissions:             0.03 to 1 GHz  -  -64  -36  dBm     1 to 12.75 GHz  -  -47  -30  dBm     1.8 to 1.9 GHz  -  -  -47  dBm     5.15 to 5.30 GHz  -  -  -47  dBm   ERD Relative Power  -4  -0.2  1  dB    EDR Carrier Frequency Stability and   Modulation Accuracy, /4-DQPSK:         -75 - +75 kHz      -10 - +10 kHz      -75 - +75 kHz     RMS DEVM  -  4  20  %     99% DEVM  -  -  30  %     Peak DEVM  -  9  35  %
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 28 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12  Transmitter Specifications (continued)  Minimum  Typical  Maximum  Units   EDR Carrier Frequency Stability and   Modulation Accuracy, 8DQPSK:        -75 - +75 kHz      -10 - +10 kHz      -75 - +75 kHz     RMS DEVM  -  4  13  %     99% DEVM  -  -  20  %     Peak DEVM  -  11.5  25  % Receiver Specifications  Minimum  Typical  Maximum  Units   Sensitivity, BER  0.1%:          2402 MHz  -  -90  -70  dBm     2441 MHz  -  -90  -70  dBm     2480 MHz  -  -90  -70  dBm   C/I Performance, BER  0.1%2:          Co-channel ratio, -60 dBm Input  -  8  11  dB     1 MHz ratio, -60 dBm Input  -  -8  0  dB     2 MHz ratio, -60 dBm Input  -  -46  -30  dB     3 MHz ratio, -67 dBm Input  -  -49  -40  dB     Image ratio, -67 dBm Input  -  -26  -9  dB     Image ±1 MHz ratio, -67 dBm input  -  47  -20  dB   Blocking Performance, BER  0.1%3:          30 to 2000 MHz  -10  -  -  dBm     2000 to 2400 MHz  -27  -  -  dBm     2500 to 3000 MHz  -27  -  -  dBm     3000 to 12750 MHz  -10  -  -  dBm   Intermodulation Performance, -64 dBm Input,   BER  0.1%  -39 -11  - dBm   Maximum Input Level  -20  -  -  dBm   EDR Sensitivity, BER  0.01%:          /4-DQPSK  - -90 -70 dBm     8DPSK  -  -83.5  -70  dBm  1. Up to three spurious responses within Bluetooth limits are allowed. 2. Up to five spurious responses within Bluetooth limits are allowed. 3. Up to twenty-four spurious responses within Bluetooth limits are allowed.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 29 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Storage Conditions  This product should be stored without opening the packing in an ambient temperature range of 5 to 35 C and humidity range from 20 to 70% RH, and be used within six months of receipt. Packing materials can be deformed at temperatures above 40 C. If the product is not used six months or more after receipt, its solderbility should be tested before being used. The product should be stored in non-corrosive gas. Any excess mechanical shock such as sticking the packing materials with a sharp object or dropping the product, etc., must be avoided in order not to damage the packing materials. This product is applicable to MSL3, based on JEDEC Standard J-STD-020.  After the packing is opened, the product should be stored at an ambient temperature below 30 C and at humidity level less than 60% RH. The product should be used within 168 hours. If the color of the indica-tor in the packing has changed, the product should be baked before soldering at 125 to 130 C for 24 hours. The products should be baked on the heat-resistant tray, as the tape and reel materials are not heat-resistant.  Handling Conditions  Use care in handling or transporting this product as excessive stress or mechanical shock can crack or break the product. Do not touch this product with bare hands as this can result in poor solderability.  Standard PCB Design (Land Pattern and Dimensions)  All the ground terminals should be connected to the ground patterns, and unconnected terminals should be soldered to unconnected PCB pads for mechanical strength. The best land pattern depends on the pattern generation method, grounding method, land dimensions, land forming method of the unconnected terminals and the PCB material and thickness. Contact RFM technical support if you have any questions about adapting the recommend land pattern to your application specifics or before using non-standard land dimensions, etc.  Module PCB Placement  This product can be broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent damage, be sure to follow the specifications for the maintenance of the chip placer being used. Be aware that mechanical chucking can damage this product when used for mounting it on a PCB.  Module Soldering  Preheat so that the temperature difference T between the solder and module surface is less than 130 C. If the module is immersed in solvent after mounting, care should be taken to limit the temperature difference to 100 C. These provisions are necessary to prevent damage due to excessive differential ex-pansion. Contact RFM technical support if you have any questions about soldering methods or are con-sidering other soldering conditions.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 30 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Using a Soldering Iron  A soldering iron of 18 W or less, using a ceramic heater is recommended. The soldering iron tip diameter should be 3 mm maximum, and the tip temperature should be 350 C or less. The iron contact time at each terminal should be limited to 3 seconds. The soldering iron should be applied to the land pattern next to the module terminal, not directly on the module ceramic substrate.  Example Reflow Soldering Profile   Use rosin flux or a weakly active flux with a chlorine content of 0.2 wt% or less.
Preliminary and RFM Confidential   www.RFM.com  Technical support +1.972.448.3700  Page 31 of 31 © 2012 by RF Monolithics, Inc.  E-mail: tech_sup@rfm.com  DR-WLS1273L-102 Data Sheet - 12/13/12 Solder Paste Amount and Assembly Standards  Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of the module’s external pads. If too much or little solder is applied, the mechanical strength can be insufficient.  M o d u l eS o l d e rF i l l e tH e i g h tU n a c c e p t a b l e   A s s e m b l yS a t i s f a c t o r y   A s s e m b l y   u s i n g   S o l d e r   M a s k i n gS o l d e r   W i c k i n gf r o m   W i r e   o fL e a d e d   C o m p o n e n tC h a s s i sS o l d e r   G r o u n dW i c k i n g   t o   M o d u l eS o l d e r   M a s kB l o c k s   W i c k i n gt o   M o d u l eS o l d e r   M a s kB l o c k s   W i c k i n g   t oC o m p o n e n t   L e a dW i r e   L e a d   o fC o m p o n e n tM o u n t e d   L a t e rS o l d e r i n gI r o nP r o p e r   A m o u n t   o f   S o l d e r   P a s t eP C BS u b s t r a t eP C BL a n dS o l d e r   M a s k Cleaning  This product is moisture sensitive and not suitable for water-based cleaning.  Operational Conditions  This product is designed to work under normal environmental conditions - ambient temperature, humidity and pressure. If this product is used under the following circumstances, erratic operation or complete fail-ure can occur:  Atmosphere containing a corrosive gas ( Cl2, NH3, SOx, NOx, etc.) Atmosphere containing a combustible or volatile gas Dusty location Location with direct sunlight Location subject to water splashes, high humidity or condensation  If the customer’s application could subject a module to one or more of the above conditions, consult with RFM technical support before use. Do not apply static electricity or excessive voltage while assembling this module on a PCB or testing it.  Power Supply Voltages  Power supply voltages applied to this product must conform to the specifications for the module. Contact RFM technical support if you have any questions about power supply requirements.

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