Murata CMABJ Wi-Fi Module User Manual Bluetooth Module Data Sheet

Murata Manufacturing Co., Ltd. Wi-Fi Module Bluetooth Module Data Sheet

Users Manual

                                                Preliminary Specification Number : SP-ABJ-E  Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.                   W-LAN Module Data Sheet      P/N: CMWC1ZZABJ-xxx
                                                Preliminary Specification Number : SP-ABJ-E  Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  Revision History  Revision Code Date Description Comments Draft 2014-1-11  Draft  A 2014-2-25                                      Update pin description Update SPI flash size Update the Top view Update storage/operation temperature Add connector information Remove reference circuit    to other document  B 2014-4-29   Add description of two antenna types Add PCB antenna layout guide Update size, top view, bottom view, footprint  C 2015-2-5  Update module height. Add recommended land pattern. Add package and MOQ. Add power up sequence Modify host mode truth table. Update SPI flash spec  D 2015-7-23  Update RF parameters and power consumption Add FCC/IC statement  E 2015-7-24  Update top view and block diagram. Add the description of connector J5.
                                                Preliminary Specification Number : SP-ABJ-E  Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  Contents 1. Feature ........................................................................................................................................................... 1 2. Part Number .................................................................................................................................................. 1 3. Block Diagram ................................................................................................................................................ 1 4. Dimensions, foot print, and terminal configurations .................................................................................... 2 Foot print ............................................................................................................................................... 3 Recommended land pattern .................................................................................................................. 4 Table 1: Terminal Configurations ........................................................................................................ 5 Table 2: GPIO function mapping .......................................................................................................... 6 Table 3: Host mode truth table ............................................................................................................. 6 5. Rating ............................................................................................................................................................. 7 6. Operating Condition ...................................................................................................................................... 7 7. RF Characteristics for IEEE802.11 .................................................................................................................. 7 8. Power up sequence ....................................................................................................................................... 8 9. Module placement guide............................................................................................................................... 9 10. Package ...................................................................................................................................................... 10 NOTICE ............................................................................................................................................................. 11
                                                                            Preliminary Specification Number: SP-ABJ-E P.  1/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 1. Feature -  Based on IEEE802.11b/g/n compliant 1x1 low power Wifi SOC. -  Host MCU optional -  512KB SPI flash, 40MHz Xtal integrated. -  Size: 22.4*15.0*2.4(max) mm -  Internal PCB antenna -  Rich interfaces: UART, SPI, I2S, USB, JTAG, GPIO -  IEEE802.11b/g/n compliant -  Support AP mode, Station mode, and sniffer mode. -  Support WPA, WPA2 security -  Support WPS connection     2. Part Number  CMWC1ZZABJ-xxx (xxx will be assigned by each software in the module)   3. Block Diagram
                                                                            Preliminary Specification Number: SP-ABJ-E P.  2/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 4. Dimensions, foot print, and terminal configurations                               Dimensions                                                        (unit: mm) mark min typ max L  15.0  W  22.4  T(Height) - - 2.4   About connector J5: The connector J5 is for lab/factory conducted RF test only. Please don’t use it for connecting external antenna because of the mechanical reliability.            L W
                                                                            Preliminary Specification Number: SP-ABJ-E P.  3/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  Foot print                       Bottom View        in mm     The shadow area is PCB antenna area. Please refer to Chapter 9: PCB antenna layout guide.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  4/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Recommended land pattern                                                               in mm    Copper is 0.6x1.25mm and stencil is the same size. You can design the copper length more than 1.25mm if you need.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  5/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Table 1: Terminal Configurations  No. Terminal Name Default function (1) GPIO13 Refer to Table 2 GPIO function mapping (2) GPIO12 (3) GPIO11 (4) GPIO10 (5) GPIO9 (6) GPIO8 (7) GPIO7 (8) GPIO6 (9) GPIO5 (10) GPIO4 (11) GPIO3 (12) GPIO2 (13) GPIO1 (14) GPIO0 (15) VDDIO_HOST Connect to 3.3V host IO supply. (16) GND GND (17) GND GND (18) VDD33 VDD33 (19) VDDIO_GPIO Connect to 3.3V host IO supply or 1.8V peripheral IO supply (20) GND GND (21) GPIO15 Refer to Table 2 GPIO function mapping (22) GPIO16 (23) GPIO17 (24) GPIO18 (25) GPIO19 (26) GPIO20 (27) GPIO21 (28) GPIO31 GPIO_31 (29) WAKEUP_N WAKEUP_N (30) CHIP_PWDn Chip power-down control, active low (31) USB_DN USB D- signal (32) USB_DP USB D+ signal     ** The function and status of terminals are configured by specific software.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  6/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  Table 2: GPIO function mapping  GPIO Hosted Hostless GPIO0 SPI_CS/HM1 SPI_CS/HM1 GPIO1 SPI_MOSI SPI_MOSI/I2S1_BCK GPIO2 GPIO/LED UART0_RXD/I2S1_SDI/HM0 GPIO3 SPI_INT SPI_INT/I2S1_SDO GPIO4 SPI_MISO SPI_MISO/I2S1_WS/JTAG_EN GPIO5 SPI_CLK SPI_CLK/I2S1_MCK GPIO6 DEBUG_UART_RXD/TDI I2C_DATA/TDI GPIO7 DEBUG_UART_TXD UART0_TXD GPIO8 UART_RTS UART0_RTS GPIO9 UART_CTS UART0_CTS GPIO10 UART_RXD/TMS UART1_RXD/I2S0_MCK/TMS GPIO11 UART_TXD UART1_TXD/I2S0_BCK/TM GPIO12 I2C_SCK/TCK TCK/I2C_CLK GPIO13 I2C_SDA/TDO TDO GPIO15 SPIM_CLK SPIM_CLK GPIO16 SPIM_CS0 SPIM_CS GPIO17 SPIM_DIO0 SPIM_MOSI GPIO18 SPIM_DIO1 SPIM_MISO GPIO19 SPIM_DIO2 I2S0_SDI GPIO20 SPIM_DIO3 I2S0_SDO GPIO21 SPIM_CS1/LED I2S0_WS/TRST   Table 3: Host mode truth table  Host  mode truth table USB Hosted SPI Hostless/ UART HM0 (GPIO2) 0 0 1 HM1 (GPIO0) 0 1 0
                                                                            Preliminary Specification Number: SP-ABJ-E P.  7/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 5. Rating   min. typ. max. unit Storage Temperature -40 +25 +85 deg.C VDD33 -0.3 3.3 4.0 V VDDIO_HOST -0.3 3.3 4.0 V VDDIO_GPIO -0.3 3.3 4.0 V   6. Operating Condition   min. typ. max. unit Operating Temperature -30 +25 +85 deg.C VDD33 3.14 3.3 3.46 V VDDIO_HOST 1.71 3.3 3.46 V VDDIO_GPIO 1.71 3.3 3.46 V   7. RF Characteristics for IEEE802.11 Conditions: 25deg.C Items Contents Power Levels Current consumption Tx Power Level min. typ. max. unit Typ(continuous Tx mode) Unit  802.11b (11Mbps)  17  dBm 255 mA 802.11g (54Mbps)  14  dBm 240 mA 802.11n (MCS7)  13  dBm 235 mA Rx Minimum Input Level Sensitivity min. typ. max. unit typ Unit  802.11b (11Mbps)  -82  dBm 98 mA 802.11g (54Mbps)  -69  dBm 802.11n (MCS7)  -67  dBm  RF performance is tested at the switch connector on module.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  8/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 8. Power up sequence   Parameter Description Min Max Unit tA Rise time of VDD33 to 90% of 3.3V - 25 ms tC Time  from VDD33 reaching 90% of 3.3V  to  the level of CHIP_PWD_L going above 0.5 * VDD33 5 - us tB The value of tA+tc; during this time, the level of CHIP_PWD_L should stay below 0.5 * VDD33
                                                                            Preliminary Specification Number: SP-ABJ-E P.  9/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  9. Module placement guide    To use internal PCB antenna, some guides must be followed in order to get best antenna           performance.  (1)  Place the antenna area on the edge of the main board.  (2)  NO ground, circuit, component under the antenna area (black shadow in the below picture), including the reverse side of PCB.   No ground area is as large as possible.  (3)  Metal component should be at least 10mm away from PCB antenna (red shadow in the below picture)  (4)  Plastic case should be at least 10mm away from PCB antenna. If it’s metal case, it’s recommended to use external antenna.                                          in mm
                                                                            Preliminary Specification Number: SP-ABJ-E P.  10/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.  10. Package    The module shall be packaged in below tray.     There are 50pcs modules in one tray.    Product MOQ: 1200pcs
                                                                            Preliminary Specification Number: SP-ABJ-E P.  11/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. NOTICE  1. Storage Conditions: TBD  2. Handling Conditions :  Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of ceramics structure.  Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability.   3. Standard PCB Design (Land Pattern and Dimensions) :  All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.  The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.   4. Notice for Chip Placer :  When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.  5. Soldering Conditions:  Carefully perform preheating so that the temperature difference (T) between the solder and products surface should be in the following range. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100deg.C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions.  Soldering method Temperature Soldering iron method TBD Reflow method  - Soldering iron method conditions are indicated below.  Kind of iron Item Ceramics heater Soldering iron wattage TBD Temperature of iron-tip  Iron contact time   - Diameter of iron-tip :   - Do not allow the iron-tip to directly touch the ceramic element.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  12/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 6. Cleaning :  Any cleaning is not permitted.   7. Operational Environment Conditions :  Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.  - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx    etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place.  If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use.  As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.   8. Input Power Capacity :  Products shall be used in the input power capacity as specified in this specification. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.   9. Limitation of Applications:  Please contact Murata before using products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.  - Aircraft equipment. - Aerospace equipment. - Undersea equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-processing equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above.  10. FCC/IC Statement  FCC statement: This module has been tested and found to comply with the FCC Part15.   These  limits  are  designed  to  provide  reasonable  protection  against  harmful  interference  in approved installations.
                                                                            Preliminary Specification Number: SP-ABJ-E P.  13/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.   This  device  complies  with  part  15  of  the  FCC  Rules.  Operation  is  subject  to  the  following  two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  Modifications or changes to this equipment not expressly approved by Murata Manufacturing Co., Ltd. may void the user’s authority to operate this equipment. The  modular  transmitter  must  be  equipped  with  either  a  permanently  affixed  label  or  must  be capable of electronically displaying its FCC identification number  (A)  If  using  a  permanently  affixed  label,  the  modular  transmitter must be  labeled with  its  own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as  the  following:  “Contains  Transmitter  Module  FCC  ID:  VPYCMABJ”  or  “Contains  FCC  ID: VPYCMABJ.” (B)  If  the  modular  transmitter  uses an  electronic  display  of  the FCC  identification  number,  the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into  which  the  module  is  installed  must  display  a  label  referring  to  the  enclosed  module.  This exterior  label  can  use  wording  such  as  the  following:  “Contains  FCC  certified  transmitter module(s).”  To  satisfy  FCC  RF  Exposure  requirements  for  mobile  and  base  station  transmission  devices,  a separation distance of 20 cm or more should be maintained between the antenna of this device and persons  during  operation.  To  ensure  compliance,  operation  at  closer  than  this  distance  is  not recommended.  The  antenna(s)  used  for  this  transmitter  must  not  be  co-located  or  operating  in conjunction with any other antenna or transmitter.  IC statement: Label of the end product: The final end product must be labeled in a visible area with the following "Contains transmitter module IC: 772C-CMABJ "  This Class B digital apparatus complies with Canadian ICES-003. Cetappareilnumérique de la classe B estconforme à la norme NMB-003 du Canada.  This  device  complies  with  RSS-210  of  the  Industry  Canada  Rules.  Operation  is  subject  to  the following two conditions: (1)  This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.  Radiation Exposure Statement: This  equipment  complies  with  IC  radiation  exposure  limits  set  forth  for  an  uncontrolled environment.  This  equipment  should  be  installed  and  operated  with  minimum  distance  20cm between the radiator & your body.  Déclaration d'exposition aux radiations:   Cet  équipement  est  conforme  aux  limites  d'exposition  aux  rayonnements  IC  établies  pour  un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20cm
                                                                            Preliminary Specification Number: SP-ABJ-E P.  14/14 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. de distance entre la source de rayonnement et votre corps.          Note:  Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product.  All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement.  We consider it not appropriate to include other terms and conditions for transaction warranty in product specifications, drawings or other technical documents. Therefore, even if your original part of this product specification includes such terms and conditions as warranty clause, product liability clause, or intellectual property infringement liability clause, we are not able to accept such terms and conditions in this product specification unless they are based on the governmental regulation or what we have agreed otherwise in a separate contact. We would like to suggest that you propose to discuss them under negotiation of contract.  !

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