Murata CMABJ Wi-Fi Module User Manual Bluetooth Module Data Sheet

Murata Manufacturing Co., Ltd. Wi-Fi Module Bluetooth Module Data Sheet

Users Manual

Preliminary Specification Number : SP-ABJ-E
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
W-LAN Module Data Sheet
P/N: CMWC1ZZABJ-xxx
Preliminary Specification Number : SP-ABJ-E
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Revision History
Revision
Code
Date
Description
Comments
Draft
2014-1-11
Draft
A
2014-2-25
Update pin description
Update SPI flash size
Update the Top view
Update storage/operation temperature
Add connector information
Remove reference circuit to other document
B
2014-4-29
Add description of two antenna types
Add PCB antenna layout guide
Update size, top view, bottom view, footprint
C
2015-2-5
Update module height.
Add recommended land pattern.
Add package and MOQ.
Add power up sequence
Modify host mode truth table.
Update SPI flash spec
D
2015-7-23
Update RF parameters and power consumption
Add FCC/IC statement
E
2015-7-24
Update top view and block diagram.
Add the description of connector J5.
Preliminary Specification Number : SP-ABJ-E
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Contents
1. Feature ........................................................................................................................................................... 1
2. Part Number .................................................................................................................................................. 1
3. Block Diagram ................................................................................................................................................ 1
4. Dimensions, foot print, and terminal configurations .................................................................................... 2
Foot print ............................................................................................................................................... 3
Recommended land pattern .................................................................................................................. 4
Table 1: Terminal Configurations ........................................................................................................ 5
Table 2: GPIO function mapping .......................................................................................................... 6
Table 3: Host mode truth table ............................................................................................................. 6
5. Rating ............................................................................................................................................................. 7
6. Operating Condition ...................................................................................................................................... 7
7. RF Characteristics for IEEE802.11 .................................................................................................................. 7
8. Power up sequence ....................................................................................................................................... 8
9. Module placement guide............................................................................................................................... 9
10. Package ...................................................................................................................................................... 10
NOTICE ............................................................................................................................................................. 11
Preliminary Specification Number: SP-ABJ-E
P. 1/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
1. Feature
- Based on IEEE802.11b/g/n compliant 1x1 low power Wifi SOC.
- Host MCU optional
- 512KB SPI flash, 40MHz Xtal integrated.
- Size: 22.4*15.0*2.4(max) mm
- Internal PCB antenna
- Rich interfaces: UART, SPI, I2S, USB, JTAG, GPIO
- IEEE802.11b/g/n compliant
- Support AP mode, Station mode, and sniffer mode.
- Support WPA, WPA2 security
- Support WPS connection
2. Part Number
CMWC1ZZABJ-xxx
(xxx will be assigned by each software in the module)
3. Block Diagram
Preliminary Specification Number: SP-ABJ-E
P. 2/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
4. Dimensions, foot print, and terminal configurations
Dimensions (unit: mm)
mark
min
typ
max
L
15.0
W
22.4
T(Height)
-
-
2.4
About connector J5:
The connector J5 is for lab/factory conducted RF test only.
Please don’t use it for connecting external antenna because of the mechanical reliability.
L
W
Preliminary Specification Number: SP-ABJ-E
P. 3/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Foot print
Bottom View in mm
The shadow area is PCB antenna area.
Please refer to Chapter 9: PCB antenna layout guide.
Preliminary Specification Number: SP-ABJ-E
P. 4/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Recommended land pattern
in mm
Copper is 0.6x1.25mm and stencil is the same size.
You can design the copper length more than 1.25mm if you need.
Preliminary Specification Number: SP-ABJ-E
P. 5/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Table 1: Terminal Configurations
No.
Terminal Name
Default function
(1)
GPIO13
Refer to Table 2 GPIO function mapping
(2)
GPIO12
(3)
GPIO11
(4)
GPIO10
(5)
GPIO9
(6)
GPIO8
(7)
GPIO7
(8)
GPIO6
(9)
GPIO5
(10)
GPIO4
(11)
GPIO3
(12)
GPIO2
(13)
GPIO1
(14)
GPIO0
(15)
VDDIO_HOST
Connect to 3.3V host IO supply.
(16)
GND
GND
(17)
GND
GND
(18)
VDD33
VDD33
(19)
VDDIO_GPIO
Connect to 3.3V host IO supply or 1.8V
peripheral IO supply
(20)
GND
GND
(21)
GPIO15
Refer to Table 2 GPIO function mapping
(22)
GPIO16
(23)
GPIO17
(24)
GPIO18
(25)
GPIO19
(26)
GPIO20
(27)
GPIO21
(28)
GPIO31
GPIO_31
(29)
WAKEUP_N
WAKEUP_N
(30)
CHIP_PWDn
Chip power-down control, active low
(31)
USB_DN
USB D- signal
(32)
USB_DP
USB D+ signal
** The function and status of terminals are configured by specific software.
Preliminary Specification Number: SP-ABJ-E
P. 6/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Table 2: GPIO function mapping
GPIO
Hosted
Hostless
GPIO0
SPI_CS/HM1
SPI_CS/HM1
GPIO1
SPI_MOSI
SPI_MOSI/I2S1_BCK
GPIO2
GPIO/LED
UART0_RXD/I2S1_SDI/HM0
GPIO3
SPI_INT
SPI_INT/I2S1_SDO
GPIO4
SPI_MISO
SPI_MISO/I2S1_WS/JTAG_EN
GPIO5
SPI_CLK
SPI_CLK/I2S1_MCK
GPIO6
DEBUG_UART_RXD/TDI
I2C_DATA/TDI
GPIO7
DEBUG_UART_TXD
UART0_TXD
GPIO8
UART_RTS
UART0_RTS
GPIO9
UART_CTS
UART0_CTS
GPIO10
UART_RXD/TMS
UART1_RXD/I2S0_MCK/TMS
GPIO11
UART_TXD
UART1_TXD/I2S0_BCK/TM
GPIO12
I2C_SCK/TCK
TCK/I2C_CLK
GPIO13
I2C_SDA/TDO
TDO
GPIO15
SPIM_CLK
SPIM_CLK
GPIO16
SPIM_CS0
SPIM_CS
GPIO17
SPIM_DIO0
SPIM_MOSI
GPIO18
SPIM_DIO1
SPIM_MISO
GPIO19
SPIM_DIO2
I2S0_SDI
GPIO20
SPIM_DIO3
I2S0_SDO
GPIO21
SPIM_CS1/LED
I2S0_WS/TRST
Table 3: Host mode truth table
Host mode
truth table
USB
Hosted SPI
Hostless/ UART
HM0 (GPIO2)
0
0
1
HM1 (GPIO0)
0
1
0
Preliminary Specification Number: SP-ABJ-E
P. 7/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
5. Rating
min.
typ.
max.
unit
Storage Temperature
-40
+25
+85
deg.C
VDD33
-0.3
3.3
4.0
V
VDDIO_HOST
-0.3
3.3
4.0
V
VDDIO_GPIO
-0.3
3.3
4.0
V
6. Operating Condition
min.
typ.
max.
unit
Operating Temperature
-30
+25
+85
deg.C
VDD33
3.14
3.3
3.46
V
VDDIO_HOST
1.71
3.3
3.46
V
VDDIO_GPIO
1.71
3.3
3.46
V
7. RF Characteristics for IEEE802.11
Conditions: 25deg.C
Items
Contents
Power Levels
Current consumption
Tx Power Level
min.
typ.
max.
unit
Typ(continuous Tx
mode)
Unit
802.11b (11Mbps)
17
dBm
255
mA
802.11g (54Mbps)
14
dBm
240
mA
802.11n (MCS7)
13
dBm
235
mA
Rx Minimum Input
Level Sensitivity
min.
typ.
max.
unit
typ
Unit
802.11b (11Mbps)
-82
dBm
98
mA
802.11g (54Mbps)
-69
dBm
802.11n (MCS7)
-67
dBm
RF performance is tested at the switch connector on module.
Preliminary Specification Number: SP-ABJ-E
P. 8/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
8. Power up sequence
Parameter
Description
Min
Max
Unit
tA
Rise time of VDD33 to 90% of 3.3V
-
25
ms
tC
Time from VDD33 reaching 90% of 3.3V to the
level of CHIP_PWD_L going above 0.5 * VDD33
5
-
us
tB
The value of tA+tc; during this time, the level of CHIP_PWD_L should stay below
0.5 * VDD33
Preliminary Specification Number: SP-ABJ-E
P. 9/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
9. Module placement guide
To use internal PCB antenna, some guides must be followed in order to get best antenna
performance.
(1) Place the antenna area on the edge of the main board.
(2) NO ground, circuit, component under the antenna area (black shadow in the below picture),
including the reverse side of PCB.
No ground area is as large as possible.
(3) Metal component should be at least 10mm away from PCB antenna (red shadow in the below
picture)
(4) Plastic case should be at least 10mm away from PCB antenna. If it’s metal case, it’s
recommended to use external antenna.
in mm
Preliminary Specification Number: SP-ABJ-E
P. 10/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
10. Package
The module shall be packaged in below tray.
There are 50pcs modules in one tray.
Product MOQ: 1200pcs
Preliminary Specification Number: SP-ABJ-E
P. 11/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
NOTICE
1. Storage Conditions:
TBD
2. Handling Conditions :
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products due to the nature of ceramics structure.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.
3. Standard PCB Design (Land Pattern and Dimensions) :
All the ground terminals should be connected to the ground patterns. Furthermore, the ground
pattern should be provided between IN and OUT terminals. Please refer to the specifications for the
standard land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of
products may vary depending on the pattern drawing method, grounding method, land dimensions,
land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to
verify the characteristics in the actual set. When using non-standard lands, contact Murata
beforehand.
4. Notice for Chip Placer :
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
5. Soldering Conditions:
Carefully perform preheating so that the temperature difference (T) between the solder and products
surface should be in the following range. When products are immersed in solvent after mounting, pay
special attention to maintain the temperature difference within 100deg.C. Soldering must be carried
out by the above mentioned conditions to prevent products from damage. Contact Murata before use
if concerning other soldering conditions.
Soldering method
Temperature
Soldering iron method
TBD
Reflow method
- Soldering iron method conditions are indicated below.
Kind of iron
Item
Ceramics heater
Soldering iron wattage
TBD
Temperature of iron-tip
Iron contact time
- Diameter of iron-tip :
- Do not allow the iron-tip to directly touch the ceramic element.
Preliminary Specification Number: SP-ABJ-E
P. 12/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
6. Cleaning :
Any cleaning is not permitted.
7. Operational Environment Conditions :
Products are designed to work for electronic products under normal environmental conditions
(ambient temperature, humidity and pressure). Therefore, products have no problems to be used
under the similar conditions to the above-mentioned. However, if products are used under the
following circumstances, it may damage products and leakage of electricity and abnormal
temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata
before actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
8. Input Power Capacity :
Products shall be used in the input power capacity as specified in this specification.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
9. Limitation of Applications:
Please contact Murata before using products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
- Aircraft equipment.
- Aerospace equipment.
- Undersea equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-processing equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the
above.
10. FCC/IC Statement
FCC statement:
This module has been tested and found to comply with the FCC Part15.
These limits are designed to provide reasonable protection against harmful interference in
approved installations.
Preliminary Specification Number: SP-ABJ-E
P. 13/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and
used in accordance the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by Murata Manufacturing Co.,
Ltd. may void the user’s authority to operate this equipment.
The modular transmitter must be equipped with either a permanently affixed label or must be
capable of electronically displaying its FCC identification number
(A) If using a permanently affixed label, the modular transmitter must be labeled with its own
FCC identification number, and, if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed
must also display a label referring to the enclosed module. This exterior label can use wording such
as the following: “Contains Transmitter Module FCC ID: VPYCMABJ” or “Contains FCC ID:
VPYCMABJ.”
(B) If the modular transmitter uses an electronic display of the FCC identification number, the
information must be readily accessible and visible on the modular transmitter or on the device in
which it is installed. If the module is installed inside another device, then the outside of the device
into which the module is installed must display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains FCC certified transmitter
module(s).”
To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a
separation distance of 20 cm or more should be maintained between the antenna of this device and
persons during operation. To ensure compliance, operation at closer than this distance is not
recommended. The antenna(s) used for this transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
IC statement:
Label of the end product:
The final end product must be labeled in a visible area with the following "Contains transmitter
module IC: 772C-CMABJ "
This Class B digital apparatus complies with Canadian ICES-003.
Cetappareilnumérique de la classe B estconforme à la norme NMB-003 du Canada.
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio
exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne
doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y
compris un brouillage susceptible de provoquer un fonctionnement indésirable.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20cm
Preliminary Specification Number: SP-ABJ-E
P. 14/14
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
de distance entre la source de rayonnement et votre corps.
Note:
Please make sure that your product has been evaluated and confirmed against your specifications
when our product is mounted to your product.
All the items and parameters in this product specification have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment agreed upon between you
and us. You are requested not to use our product deviating from such agreement.
We consider it not appropriate to include other terms and conditions for transaction warranty in product
specifications, drawings or other technical documents. Therefore, even if your original part of this
product specification includes such terms and conditions as warranty clause, product liability clause, or
intellectual property infringement liability clause, we are not able to accept such terms and conditions in
this product specification unless they are based on the governmental regulation or what we have
agreed otherwise in a separate contact. We would like to suggest that you propose to discuss them
under negotiation of contract.
!

Navigation menu