Murata LBEE5ZZ1PJ W-LAN + Bluetooth Module User Manual

Preliminary Specification Number :SP-ZZ1PJ-331-J

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

W-LAN + Bluetooth Module Data Sheet

Qualcomm Chipset

for 802.11a/b/g/n/ac + Bluetooth 5.0 (Dual)

Sample Part Number:

LBEE5ZZ1PJ-TEMP

MP Part Number:

1PJ

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

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The revision history of the product specification

Revised

Date

Revision

Code

Revised

Page

Revised Item

Change

Reason

May 4,

2018

-

First release

May 17

2018

A

3

Updated Scope and Key feature

Updated

May 28,

2018

B

13~19

Added the WLAN TX power range

Added

July 6, 2018

C

3

4

8

10

14~19

20

21

-Added Manufacturing site

-Added Weight info

-Added Co planarity spec

-Updated Storage Temperature range

-Updated Operating Temperature range

-Updated Specification Temperature range.

-Revise title of section 12 to “POWER SEQUENCE Timing”

-Revised characterization table

-Updated BT TX Power spec

-Updated BLE TX Power spec

Added/updated

July 23,

2018

D

12

13~16

20/23

23

24

31

-Added Digital I/O Requirements

-Added INTERFACE TIMING

-Revised the spec of Adjacent Input Level Sensitivity

-Added *10) to DC/RF Characteristics for IEEE802.11ac-5G

-Revised DC/RF Characteristics for Bluetooth

-Added Box and Label info

Added

Aug 3, 2018

E

10

12

16~17

-Revised spec of ta2

-Revised spec of VOL

-Added UHS SDIO timing requirement

Revised/Added

Sep 3, 2018

F

13

-Revised Digital IO requirement

Revised

Sep 12,

2018

G

28

-Revised Reference circuit

Revised

Oct 8, 2018

H

7

25

-Revised Marking

-Updated BT Output Power spec

-Added EDR Output Power spec

Revised

Nov 7, 2019

I

4

7

37~44

-Added Radio certification information

-Added the module picture

-Added Appendix

Added

Nov 8, 2019

J

3

-Updated BT version

Updated

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TABLE OF CONTENTS

1. SCOPE ..................................................................................................................................................... 3

2. KEY FEATURE ...................................................................................................................................... 3

3. Manufacturing site ................................................................................................................................. 3

4. Part Number ........................................................................................................................................... 3

5. RoHS Compliance ................................................................................................................................... 3

6. Block Diagram ........................................................................................................................................ 3

7. Certification Information ....................................................................................................................... 4

7.1. Radio Certification ................................................................................................................... 4

8. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 4

8.1. Dimensions ............................................................................................................................... 4

8.2. Pin Layout and PIN Descriptions ........................................................................................... 5

8.3. Marking ..................................................................................................................................... 7

9. ABSOLUTE MAXIMUM RATINGS*1)................................................................................................... 8

10. OPERATING CONDITION*2) ............................................................................................................ 8

11. External low–power 32.768 kHz clock............................................................................................... 9

12. POWER SEQUENCE Timing .......................................................................................................... 10

12.1. Case 1: 3.3 V power down after 1.8 V ................................................................................ 10

12.2. Case 2: 1.8 V power down after 3.3 V .................................................................................11

12.3. Case 3: All power rails supplied with 3.3 V ...................................................................... 12

13. Digital I/O Requirements ................................................................................................................. 12

14. INTERFACE TIMING ...................................................................................................................... 13

14.1. Bluetooth UART Timing .................................................................................................... 13

14.1.1. UART transmit Timing ............................................................................................... 13

14.1.2. UART Receiver Timing ............................................................................................... 13

14.2. I2S Timing ........................................................................................................................... 13

14.2.1. I2S Transmitter Timing ............................................................................................... 14

14.2.2. I2S Receiver Timing ..................................................................................................... 14

14.3. SDIO Timing ....................................................................................................................... 15

14.3.1. SDIO Default Mode Timing ........................................................................................ 15

14.3.2. SDIO High-Speed Mode Timing ................................................................................. 16

14.3.3. SDIO UHS mode Timing ............................................................................................ 16

15. DC / RF Characteristics.................................................................................................................... 18

15.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz .......................................................... 18

15.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz .......................................................... 19

15.3. DC/RF Characteristics for IEEE802.11n – 2.4GHz ......................................................... 20

15.4. DC/RF Characteristics for IEEE802.11ac – 2.4GHz ........................................................ 21

15.5. DC/RF Characteristics for IEEE802.11a - 5GHz ............................................................. 22

15.6. DC/RF Characteristics for IEEE802.11n - 5GHz ............................................................. 23

15.7. DC/RF Characteristics for IEEE802.11ac - 5GHz ............................................................ 24

15.8. DC/RF Characteristics for Bluetooth ................................................................................ 25

15.9. DC/RF Characteristics for Bluetooth (LE) ........................................................................ 26

16. LAND PATTERN (TOP VIEW) ........................................................................................................ 27

17. REFERENCE CIRCUIT ................................................................................................................... 28

18. TAPE AND REEL PACKING ........................................................................................................... 29

19. NOTICE ............................................................................................................................................. 33

19.1. Storage Conditions: ............................................................................................................ 33

19.2. Handling Conditions: ......................................................................................................... 33

19.3. Standard PCB Design (Land Pattern and Dimensions): ................................................. 33

19.4. Notice for Chip Placer: ....................................................................................................... 33

19.5. Soldering Conditions: ......................................................................................................... 34

19.6. Cleaning: ............................................................................................................................. 34

19.7. Operational Environment Conditions: .............................................................................. 34

19.8. Input Power Capacity: ........................................................................................................ 35

20. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 36

Please be aware that an important notice concerning availability, standard warranty and use in critical applications of

Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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1. SCOPE

This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 5.0 combo module.

2. KEY FEATURE

- Chipset: QCA9377-3

- Size: 7.2 x 7.4 x 1.25 (max) mm

- Weight: 0.15g/pc

- PCB w/ shielded resin mold module

- IEEE802.11a/b/g/n/ac dual band 2.4G/5G

- Supports BT5.0 (Except Options)

- SDIO 3.0 supporting SDR104 (WLAN), UART/PCM (Bluetooth)

- Lead Free Module

3. Manufacturing site

Company name:

Shenzhen Murata Technology Co., Ltd.

Address:

15 Cuijing Road, Longtian Street, Shenzhen Grand Industrial Zone, PingShan District, Shenzhen,

Guangdong, 518118 China

4. Part Number

Ordering Part Number

Description

LBEE5ZZ1PJ-331TEMP

In case of sample order

5. RoHS Compliance

This module is compliant with the RoHS directive.

6. Block Diagram

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7. Certification Information

7.1. Radio Certification

USA/Canada

FCC ID

VPYLBEE5ZZ1PJ

IC

772C-LBEE5ZZ1PJ

*Please follow installation manual in Appendix

Europe

EN300 328 v2.1.1, Draft EN 300 328 v2.2.0, EN301 893 v2.1.1 and Final draft EN300 440 v2.2.1are

prepared.

8. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS

8.1. Dimensions

Table 1 Dimension (Unit: mm)

Mark

Dimension

Mark

Dimension

Mark

Dimension

L

7.40±0.20

W

7.20±0.20

T

1.25 max

a1

0.30±0.10

a2

0.30±0.10

a3

0.30±0.10

a4

0.80±0.10

a5

0.30±0.10

b1

0.20±0.15

b2

0.25±0.15

b3

1.45±0.15

b4

5.15±0.15

b5

0.20±0.15

b6

1.05±0.15

b7

1.35±0.15

b8

1.55±0.15

c1

0.55±0.10

c2

0.55±0.10

c3

0.55±0.10

c4

0.80±0.10

c5

0.30±0.10

e1

0.30±0.10

e2

0.30±0.10

e3

0.30±0.10

e4

0.30±0.10

e5

0.30±0.10

(unit : mm)

Co-planarity: 100um Max.

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8.2. Pin Layout and PIN Descriptions

Table 2 Terminal Configurations

NO.

Terminal Name

Type

VDDIO or

pad voltage

Connection to

IC terminal

Description

1

GND

Ground

-

Ground

2

VBUCK_GND_PM

Ground

-

VBUCK_GND_PM

Ground for internal 1.1 V regulator

3

PWM_PM

O

1.1V

PWM_PM

SWREG PMU 1.1V output.

4

VDD11_PM

I

1.1V

VDD11_PM

1.1 V voltage feedback to SWREG PMU.

5

GND

Ground

-

Ground

6

SDIO_DATA3

I/O

VDDIO_SDIO

SDIO_D3

SDIO data bus D3

7

SDIO_DATA2

I/O

VDDIO_SDIO

SDIO_D2

SDIO data bus D2

8

SDIO_DATA1

I/O

VDDIO_SDIO

SDIO_D1

SDIO data bus D1

9

SDIO_DATA0

I/O

VDDIO_SDIO

SDIO_D0

SDIO data bus D0

10

SDIO_CMD

I

VDDIO_SDIO

SDIO_CMD

SDIO CMD line signal

11

SDIO_CLK

OD(1)

VDDIO_SDIO

SDIO_CLK

SDIO clock signal

12

VDDIO_SDIO

Power

1.8V or 3.3V

VDDIO_SDIO

Voltage supply for SDIO

13

SDIO_INTERRUPT_L

O

VDDIO_SDIO

SDIO_INTERRUPT_L

SDIO interrupt signal

14

GND

Ground

-

Ground

15

32KHz_CLK_IN

I

VDDIO_GPIO2

LF_CLK_IN

External low–power 32.768 kHz clock input

16

VDDIO_GPIO2

Power

1.8V or 3.3V

VDDIO_GPIO2

Voltage supply

17

HCI_UART_WAKEHOST

OD(1)

VDDIO_GPIO2

HCI_UART_WAKEHOST

Bluetooth wakeup host. Active high

18

WLAN_RF_KILL_L

I

VDDIO_GPIO2

WLAN_RFKILL_L

Turn off WLAN RF analog and front–end.

Active low.

19

GND

Ground

-

Ground

20

2G_WIFI/BT_RF_OUT

A,O

-

2G WIFI and BT output

21

GND

Ground

-

Ground

22

2G_WIFI/BT_RF_IN

A, I

-

2G WIFI and BT input

23

GND

Ground

-

Ground

24

ANT

A, I/O

-

RF Transmit / Receive Antenna

25

GND

Ground

-

Ground

Top View

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26

3D_FRAME_SYNC

I

VDDIO_GPIO1

3D_FRAME_SYNC

Frame sync signal from TV to sync with 3D

glass via Bluetooth.

27

HCI_UART_RXD

I

VDDIO_GPIO1

HCI_UART_RXD

UART RXD signal

28

HCI_UART_TXD

O

VDDIO_GPIO1

HCI_UART_TXD

UART TXD signal

29

HCI_UART_RTS

O

VDDIO_GPIO1

HCI_UART_RTS

UART RTS signal

30

HCI_UART_CTS

I

VDDIO_GPIO1

HCI_UART_CTS

UART CTS signal

31

PCM_CLK

I

VDDIO_GPIO1

BT_I2S_SCK

Bluetooth PCM_CLK signal

32

PCM_SYNC

I/O

VDDIO_GPIO1

BT_I2S_WS

Bluetooth PCM_SYNC signal

33

PCM_IN

OD(1)

VDDIO_GPIO1

BT_I2S_SDI

Bluetooth PCM_IN signal

34

PCM_OUT

O

VDDIO_GPIO1

BT_I2S_SDO

Bluetooth PCM_OUT signal

35

GND

Ground

-

Ground

36

VDDIO_XTAL

Power

1.8V or 3.3V

VDDIO_XTAL

Voltage supply for XTAL

37

VDDIO_GPIO1

Power

1.8V or 3.3V

VDDIO_GPIO1

Voltage supply

38

GND

Ground

-

Ground

39

WLAN_EN

I

VDDIO_AO

WL_EN

WLAN enable. Active high

40

BT_EN

I

VDDIO_AO

BT_EN

Bluetooth enable. Active high

41

VDD_3P3

Power

3.3V

VDD33_PM

3.3 V input voltage

42

VDDIO_AO

Power

1.8V or 3.3V

VDDIO_AO_PM

Always–on I/O supply for power

management and real–time clock. This

supply must be present if any other supply

is present.

43

GND

Ground

-

Ground

44

LTE_UART_RXD

I

VDDIO_GPIO1

LTE_UART_RXD

LTE coexistence signal.

LTE_UART_RXD or LTE_FS.

45

LTE_UART_TXD

O

VDDIO_GPIO1

LTE_UART_TXD

LTE co– existence signal.

LTE_UART_TXD or LTE_PRI.

46

CLK_REQ

O

VDDIO_GPIO1

CLK_REQ

Clock request output

47

DBG_UART_TXD

OD(1)

VDDIO_AO

GPIO[19]

DBG_UART_TXD

48

DBG_UART_RXD

OD(1)

VDDIO_GPIO2

GPIO[18]

DBG_UART_RXD

49

QOW

OD(1)

VDDIO_GPIO2

QOW

This signal can be used to enable for

external Wireless charging UART circuit.

50~

62

GND

Ground

-

Ground

(1) OD means this PIN is a digital output signal with open drain, an external pull-up or pull-down resistor is needed when this PIN is

used.

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8.3. Marking

Marking

Meaning

A

Pin 1 Marking

B

Module Descriptor

C

Inspection Number

D

Murata Logo

A

B

C

D

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9. ABSOLUTE MAXIMUM RATINGS*1)

Parameter

min.

max.

Unit

Storage Temperature

-40

85

deg.C

Supply Voltage

VDD_3P3

-0.3

3.65

V

VDDIO_SDIO

VDDIO_GPIO1

VDDIO_GPIO2

VDDIO_XTAL

VDDIO_AO

-0.3

3.6

V

*1) Stresses in excess of the absolute ratings may cause permanent damage. Functional operation

is not implied under these conditions. Exposure to absolute ratings for extended periods of time

may adversely affect reliability. No damage assuming only one parameter is set at limit at a time

with all other parameters are set within operating condition.

10. OPERATING CONDITION*2)

Parameter

min.

typ.

max.

unit

Operating Temperature

-20

-

70

deg.C

Specification Temperature range

-20

25

60

deg.C

Supply Voltage

VDD_3P3

3.135

3.3

3.465

V

VDDIO_SDIO

VDDIO_GPIO1

VDDIO_GPIO2

VDDIO_XTAL

VDDIO_AO

1.71

1.8 or 3.3

3.46

V

*2) Functionality is guaranteed but the specifications require the derating at over-temperatures,

over-voltage condition.

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11. External low–power 32.768 kHz clock

The 32 kHz clock is used in low-power modes such as IEEE power-save and sleep. It serves as a timer

to determine when to wake up to receive beacons in various power-save schemes and to maintain

basic logic operations when in sleep.

Type1PJ module does not require an external 32 kHz clock. By default, Type1PJ module utilizes its

internal 200 kHz clock shared with the WLAN and BT subsystem.

If the end application has a more accurate 32 kHz clock, then it can be supplied externally via the

LF_CLK_IN pin. The LF_CLK_IN pin must be grounded when using the default internal clock mode. If

an external 32 kHz clock is used, the requirements are:

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12. POWER SEQUENCE Timing

12.1. Case 1: 3.3 V power down after 1.8 V

If the battery source can be removed from the end user device (battery removed, AC/DC plugged

in), this is the recommended power sequence. It will avoid violating the power off sequence by

allowing the 3.3 V rail to shut down after the 1.8 V rail.

Notes:

1. VDDIO_GPIO voltage should match VIO voltage from the host. In some applications,

VDDIO_GPIO may connected to 3.3 V upon Host VIO voltage.

2. In this case, both WLAN_EN and BT_EN on the 1PJ are at 3.3 V due to using the VDD_AO

power rail. If the host VIO voltage is 1.8 V, it must have level shifters to interface with host.

3. All host interface signals must stay floating or low before valid power on sequence (WLAN_EN

and BT-EN goes high).

Symbol

Parameter

Min

Max

Units

ta1

No requirement if VDDIO_AO connected to 3.3 V

0

-

μs

ta2

90% of 3.3 V to 10% of 1.8 V

0

-

μs

ta3

90% of VDDIO_GPIO to 0.7 V of both WLAN_EN and BT_EN

10

-

μs

ta4

WLAN_EN valid to LF_CLK_IN input

0

-

μs

ta5

WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert

(tristate or low)

0

-

μs

ta6

Both WLAN_EN = low and BT_EN = low to 90% of 1.8 V

10

-

μs

ta7

3.3 V always higher than 1.8 V during operation, with power

off by removing battery or unplugging AC/DC

0

-

μs

ta8

VDDIO_AO and VDDIO_XTAL should be connected to 3.3 V

power rail

0

-

μs

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12.2. Case 2: 1.8 V power down after 3.3 V

If the battery source cannot be removed from the end user device, this is the recommended

power sequence for this application. This sequence allows the software to control the power

on/off sequence.

Notes:

1. VDDIO_GPIO voltage should match VIO voltage from the host. In some applications,

VDDIO_GPIO may connected to 3.3 V upon host VIO voltage.

2. Both WLAN_EN and BT_EN of 1PJ are 1.8 V. If host VIO voltage is 1.8 V, it does

not need level shifter to interface with host.

3. All host interface signals must stay floating or low before WLAN_EN/BT_EN =”high”, and

after WLAN_EN/BT_EN = Low.

Symbol

Parameter

Min

Max

Units

tb1

No requirement if VDDIO_AO connected to 1.8 V

0

-

μs

tb2

90% of 1.8 V to 10% of 3.3 V

0

-

μs

tb3

90% of 3.3 V to 0.7 V of both WLAN_EN and BT_EN

10

-

μs

tb4

WLAN_EN valid to LF_CLK_IN input

0

-

μs

tb5

WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert

(tristate or low)

0

-

μs

tb6

Both WLAN_EN = low and BT_EN = low to 90% of 3.3 V

10

-

μs

tb7

10% of 3.3 V to 90% of 1.8 V

0

-

μs

tb8

VDDIO_AO and VDDIO_XTAL should be connected to 1.8 V

power rail

0

-

μs

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12.3. Case 3: All power rails supplied with 3.3 V

All power pins are connected to 3.3 V only include VDDIO_AO, VDDIO_XTAL, VDDIO_GPIOx.

Notes:

All host signals are either GND or floating before WLAN_EN/BT_EN =”high”, and after

WLAN_EN/BT_EN = Low.

Symbol

Parameter

Min

Max

Units

tc1

90% of 3.3 V to 0.7 V of both WLAN_EN and BT_EN

0

-

μs

tc4

WLAN_EN valid to LF_CLK_IN input

0

-

μs

tc5

WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert (tristate

or low)

0

-

μs

tc6

Both WLAN_EN = low and BT_EN = low to 90% of 3.3 V

10

-

μs

13. Digital I/O Requirements

Symbol

Parameter

Comments

Minimum

Type

Maximum

Unit

VIH

High-level input voltage

0.7x

VDDIO

-

VDDIO +

0.3

V

VIL

Low-level input voltage

-0.3

-

0.3x

VDDIO

V

VSHYS

Schmitt hysteresis

-

1.8 V IO: 375

3.3 V IO: 645

-

mV

IIL

Input low leakage current

VIN = 0 V

Supply = VIO

max

-5

-

5

uA

RPULL

Input pull resistor

Up or down

-

1.8 V IO: 120

3.3 V IO: 70

-

kohm

VOH

High-level output voltage

0.9x

VDDIO

-

VDDIO

V

VOL

Low-level output voltage

0

-

0.1x

VDDIO

V

IOH

High-level output current

3

-

mA

IOL

Low-level output current

-

-11

mA

CIN

Input capacitance

-

3

pF

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14. INTERFACE TIMING

14.1. Bluetooth UART Timing

14.1.1. UART transmit Timing

Parameter

Description

Min

Typ

Max

Unit

tofftxd

Delay from CTS to TXD stop

-

8

byte

14.1.2. UART Receiver Timing

Parameter

Description

Min

Typ

Max

Unit

toffrxd

Delay from RTS to RXD stop

-

8

byte

14.2. I2S Timing

Transmitter

Receiver

Lower Limit

Upper Limit

Lower Limit

Upper Limit

Min

Max

Min

Max

Min

Max

Min

Max

Notes

Clock Period T

Ttr

-

Ttr

-

a

Master Mode: Clock generated by transmitter or receiver

HIGH tHC

0.35Ttr

-

0.35Ttr

-

b

LOW tLC

0.35Ttr

-

0.35Ttr

-

b

Slave Mode: Clock accepted by transmitter or receiver

HIGH hTC

-

0.35Ttr

-

0.35Ttr

-

c

LOW tLC

-

0.35Ttr

-

0.35Ttr

-

c

Rise time tRC

-

0.15Ttr

-

d

Transmitter

Delay tdtr

-

0.8T

-

e

Hold time thtr

0

-

d

Receiver

Setup time tsr

-

0.2Tr

-

f

Hold time thr

-

0

-

f

Notes:

a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be

able to handle the data transfer rate.

b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space

ratio. For this reason, tHC and tLC are specified with respect to T.

c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that

they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the

requirements can be used.

d. Because the delay(tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter

driven by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative.

Therefore, the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock

rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr.

e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the

clock signal and T, always giving the receiver sufficient setup time.

f. The data setup and hold time must not be less than the specified receiver setup and hold time.

tofftxd

toffrxd

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14.2.1. I2S Transmitter Timing

14.2.2. I2S Receiver Timing

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14.3. SDIO Timing

14.3.1. SDIO Default Mode Timing

CLK

Output

Input

fPP

tWH

tISU

tIH

tODLY

(min)

tWL

tTHL

tTLH

tODLY

(max)

SDIO Bus Timing parameters (default Mode)

Parameter

Symbol

Min

Typ

Max

Unit

SDIO CLK (All values are referred to minimum VIH and maximum VIL

Frequency-Data Transfer Mode

fPP

0

-

25

MHz

Frequency-Identification Mode

fOD

0a /100

-

400

kHz

Clock Low Time

tWL

10

-

ns

Clock High Time

tWH

10

-

ns

Clock Rise Time

tTLH

-

10

ns

Clock low Time

tTHL

-

10

ns

Inputs: CMD, DAT (referenced to CLK)

Input Setup Time

tISU

5

-

ns

Input Hold Time

tIH

5

-

ns

Outputs: CMD, DAT (referenced to CLK)

Output Delay time-Data Transfer Mode

tODLY

0

-

14

ns

Output Delay time-Identification Mode

tODLY

0

-

50

ns

a. 0 Hz means to stop the clock. The given minimum frequency range is for cases where continuous clock is required.

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14.3.2. SDIO High-Speed Mode Timing

CLK

Input

Output

fPP

tWH

tISU

tIH

tOH

tWL

tTHL

tTLH

tODLY

50% VDD

SDIO Bus Timing parameters (High-Speed Mode)

Parameter

Symbol

Min

Typ

Max

Unit

SDIO CLK (All values are referred to minimum VIH and maximum VIL

Frequency-Data Transfer Mode

fPP

0

-

50

MHz

Clock Low Time

tWL

7

-

ns

Clock High Time

tWH

7

-

ns

Clock Rise Time

tTLH

-

3

ns

Clock low Time

tTHL

-

3

ns

Inputs: CMD, DAT (referenced to CLK)

Input Setup Time

tISU

6

-

ns

Input Hold Time

tIH

2

-

ns

Outputs: CMD, DAT (referenced to CLK)

Output Delay time-Data Transfer Mode

tODLY

-

14

ns

Output Hold time

tOH

2.5

-

ns

Total System Capacitance (each line)

CL

-

40

pF

14.3.3. SDIO UHS mode Timing

In UHS mode the supported features are:

1. Embedded SDIO

The chip is only designed for embedded system; that is, it should be mounted on the PCB with host

system and not support plug & play.

2. Fixed voltage supply (VDDIO_SDIO 1.8 V)

There is no on-chip LDO to do voltage switch when it receives CMD11 (voltage switch command). In

other words, the VDDIO_SDIO power supply is provided from host and should keep constant. Note,

though, it does not support voltage switch, it does follow the timing flow of CMD11, with the exception

of no voltage change, so there is no effect to SW code.

3. Support for 8-bit mode

The 8-bit mode dedicated to embedded system is supported with the maximum frequency of 50 MHz

a). Clock signal timing

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Symbol

Min

Max

Unit

Remark

tCLK

4.8

-

ns

208MHz (max.) between rising edge, VCT=0.975V

tCR, tCF

-

0.2*tCLK

ns

tCR, tCF<0.96ns (max.) at 208MHz, C=10 pF

Clock duty

30

70

%

b). Input timing

Symbol

Min

Max

Unit

SDR104 mode

tIS

1.4

-

ns

C =10 pF, VCT=0.975V

tIH

0.8

-

ns

C=10 pF, VCT=0.975V

Symbol

Min

Max

Unit

SDR12, SDR25 and SDR50 modes

tIS

3

-

ns

C =10 pF, VCT=0.975V

tIH

0.8

-

ns

C=10 pF, VCT=0.975V

c). Output timing (SDR12/SDR25/SDR50)

Symbol

Min

Max

Unit

Remark

tODLY

-

7.5

ns

TCLK=10ns, CL=30 pF, driver B for SDR50

tTODLY

-

14

ns

TCLK=20ns, CL=40 pF, driver B for SDR25,12

tOH

1.5

-

ns

Hold time at the tODLY , CL=15 pF

d). Output timing (SDR104)

Symbol

Min

Max

Unit

Remark

tOP

0

2

ns

Output phase

Delta tOP

-350

1550

ps

Delay variation due to temperature change after tuning

tODW

0.6

-

UI

tODW=2.88ns at 208 MHz.

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15. DC / RF Characteristics

15.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz

Specification

IEEE802.11b

Mode

DSSS / CCK

Frequency

2412 to 2472 MHz

Data rate

1, 2, 5.5, 11Mbps

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting=19 dBm, 11Mbps mode unless otherwise specified.

Items

Contents

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*4) *5)

-

330

-

mA

2) Rx mode

-

60

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

18

19

20

dBm

3. Spectrum Mask margin

1) 1st side lobes(-30dBr)

0

-

dB

2) 2nd side lobes(-50dBr)

0

-

dB

4. Power-on and Power-down ramp

-

2.0

μsec

5. RF Carrier Suppression

15

-

dB

6. Modulation Accuracy (EVM)

-

35

%

7.Frequency tolerance

-20

-

20

ppm

8. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

9. Minimum Input Level Sensitivity

-

-76

dBm

10. Maximum Input Level (PER < 8%)

-10

-

dBm

11. Adjacent Channel Rejection

(FER < 8%)

35

-

dB

*4): Defined when output power setting is 19 dBm at Murata module antenna pad

*5): Data rate is 1Mbps

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15.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz

Specification

IEEE802.11g

Mode

OFDM

Frequency

2412 to 2472 MHz

Data rate

6, 9, 12, 18, 24, 36, 48, 54Mbps

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting=18 dBm, 54Mbps mode unless otherwise specified.

Items

Contents

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*6) *7)

-

310

-

mA

2) Rx mode

-

60

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

17

18

19

dBm

3. Spectrum Mask margin

1) 9MHz to 11MHz (0~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28~ -40dBr)

0

-

dB

4) 30MHz to 33MHz (-40dBr)

0

-

dB

4. Constellation Error (EVM)

-

-25

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-65

dBm

8. Maximum Input Level (PER < 10%)

-20

-

dBm

9. Adjacent Channel Rejection

(PER < 10%)

-1

-

dB

*6): Defined when output power setting is 18dBm at Murata module antenna pad

*7): Data rate is 6Mbps

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15.3. DC/RF Characteristics for IEEE802.11n – 2.4GHz

Specification

IEEE802.11n

Mode

OFDM

Frequency

2412 to 2472 MHz

Data rate

MCS0-MCS7

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting=18 dBm, BW=20MHz, MCS7 unless otherwise specified.

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*8)*9)

-

310

-

mA

2) Rx mode

-

60

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

17

18

19

dBm

3. Spectrum Mask

1) 9MHz to 11MHz (0 ~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20 ~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28 ~ -45dBr)

0

-

dB

4) 30MHz to 33MHz (-45dBr)

0

-

dB

4. Constellation Error (EVM)

-

-27

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-64

dBm

8. Adjacent Channel Rejection

(PER < 10%)

-2

-

dB

*8): Defined when output power setting is 18 dBm at Murata module antenna pad

*9): Data rate is MCS0

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15.4. DC/RF Characteristics for IEEE802.11ac – 2.4GHz

Specification

IEEE802.11ac

Mode

OFDM

Frequency

2412 to 2472 MHz

Data rate

MCS0-MCS9

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting=17 dBm, MCS9,BW=40MHz unless otherwise specified.

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*8)*9)

-

290

-

mA

2) Rx mode

-

62

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

16

17

18

dBm

3. Spectrum Mask

1) 9MHz to 11MHz (0 ~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20 ~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28 ~ -45dBr)

0

-

dB

4) 30MHz to 33MHz (-45dBr)

0

-

dB

4. Constellation Error (EVM)

-

-32

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-54

dBm

8. Adjacent Channel Rejection

(PER < 10%)

-9

-

dB

*8): Defined when output power setting is 17 dBm at Murata module antenna pad

*9): Data rate is MCS0

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15.5. DC/RF Characteristics for IEEE802.11a - 5GHz

Specification

IEEE802.11a

Mode

OFDM

Frequency

5180 to 5825MHz

Data rate

6, 9, 12, 18, 24, 36, 48, 54Mbps

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting= 14 dBm, 54Mbps unless otherwise specified.

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*8)*9)

-

420

-

mA

2) Rx mode

-

80

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

13

14

15

dBm

3. Spectrum Mask

1) 9MHz to 11MHz (0 ~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20 ~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28 ~ -45dBr)

0

-

dB

4) 30MHz to 33MHz (-45dBr)

0

-

dB

4. Constellation Error (EVM)

-

-25

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-65

dBm

8. Adjacent Channel Rejection

(PER < 10%)

-1

-

dB

*8): Defined when output power setting is 14 dBm at Murata module antenna pad

*9): Data rate is 6Mbps

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15.6. DC/RF Characteristics for IEEE802.11n - 5GHz

Specification

IEEE802.11n

Mode

OFDM

Frequency

5180 to 5825MHz

Data rate

MCS0-MCS7

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting= 14 dBm, BW=20MHz ,MCS7 unless otherwise specified.

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*8)*9)

-

420

-

mA

2) Rx mode

-

80

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power

13

14

15

dBm

3. Spectrum Mask

1) 9MHz to 11MHz (0 ~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20 ~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28 ~ -45dBr)

0

-

dB

4) 30MHz to 33MHz (-45dBr)

0

-

dB

4. Constellation Error (EVM)

-

-32

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-64

dBm

8. Adjacent Channel Rejection

(PER < 10%)

-2

-

dB

*8): Defined when output power setting is 14 dBm at Murata module antenna pad

*9): Data rate is MCS0

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15.7. DC/RF Characteristics for IEEE802.11ac - 5GHz

Specification

IEEE802.11ac

Mode

OFDM

Frequency

5210 to 5775MHz

Data rate

MCS0-MCS9

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Output power setting= 1 dBm, BW=80MHz ,MCS9 unless otherwise specified.

- DC Characteristics -

min.

typ.

max.

unit

1. DC current

1) Tx mode (1024byte, 20usec interval)

*8)*9)

-

370

-

mA

2) Rx mode

-

90

-

mA

- Tx Characteristics -

min.

typ.

max.

unit

2. Output Power *10)

11

12

13

dBm

3. Spectrum Mask

1) 9MHz to 11MHz (0 ~ -20dBr)

0

-

dB

2) 11MHz to 20MHz (-20 ~ -28dBr)

0

-

dB

3) 20MHz to 30MHz (-28 ~ -45dBr)

0

-

dB

4) 30MHz to 33MHz (-45dBr)

0

-

dB

4. Constellation Error (EVM)

-

-32

dB

5.Frequency tolerance

-20

-

20

ppm

6. Out band Spurious Emissions

1) 30-1000MHz

-

-36

dBm

2) 1000-12750MHz

-

-30

dBm

3) 1800-1900MHz

-47

dBm

4) 5150-5300MHz

-

-47

dBm

- Rx Characteristics -

min.

typ.

max.

unit

7. Minimum Input Level Sensitivity

-

-51

dBm

8. Adjacent Channel Rejection

(PER < 10%)

-9

-

dB

*8): Defined when output power setting is 12dBm at Murata module antenna pad

*9): Data rate is MCS0

*10):Target output power for MCS9 VHT=40 at 5190, 5230, 5270 and 5310MHz is 7dBm.

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15.8. DC/RF Characteristics for Bluetooth

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Items

Contents

Bluetooth specification (power class)

Version 2.1 + EDR (Class1)

Channel frequency (spacing)

2402 to 2480 MHz (1MHz)

Current Consumption

Min.

Typ.

Max.

unit

(a) Tx=DH5

-

55

-

mA

(b) Tx=2DH5

-

50

-

mA

(c) Tx=3DH5

-

50

-

mA

(d) Rx=DH5

-

22

-

mA

(e) Rx=2DH5

-

22

-

mA

(f) Rx=3DH5

-

22

-

mA

Transmitter

Min.

Typ.

Max.

Unit

Output Power@DH5 2402MHz

0

6

dBm

Output Power@DH5 2441MHz

0.5

6.5

dBm

Output Power@DH5 2480MHz

1

7

dBm

Frequency range

2402

-

2480

MHz

20dB bandwidth

-

950

1000

MHz

Adjacent Channel Power *1

(a) [M-N] =2

-

-20

dBm

(b) [M-N] ≥3

-

-40

dBm

Modulation characteristics

(a) Modulation Δf1avg

140

-

175

kHz

(b) Modulation Δf2max

115

-

kHz

0.8

-

Carrier Frequency Drift

(a) 1slot

-25

-

+25

kHz

(b) 3slot / 5slot

-40

-

+40

kHz

-

20

kHz/50us

EDR Output Power@2DH5

1

7.5

dBm

EDR Output Power@3DH5

1

8

dBm

EDR Relative Power

-4

-

+1

dB

EDR Carrier Frequency Stability and

Modulation Accuracy

(a) ωi

-75

-

+75

kHz

(b) ωi+ωo

-75

-

+75

kHz

(c) ωo

-10

-

+10

kHz

(d) RMS DEVM (DQPSK)

-

20

%

(e) Peak DEVM (DQPSK)

-

35

%

(f) 99% DEVM (DQPSK)

-

30

%

(g) RMS DEVM (8DPSK)

-

13

%

(h) Peak DEVM (8DPSK)

-

25

%

(i) 99% DEVM (8DPSK)

-

20

%

Spurious Emissions

(a) 10MHz≦f<2387MHz

-

-36

dBm

(b) 2387MHz≦f<2400MHz

-

-30

dBm

(c) 2483.5MHz<f≦2496.5MHz

-47

dBm

(d) 2496.5MHz<f≦8GHz

-

-47

dBm

Receiver

Min.

Typ.

Max.

unit

BDR Sensitivity (BER<0.1%)

-

-80

dBm

EDR Sensitivity (BER<0.007%)@8DPSK

-

-77

dBm

C/I Performance (BER<0.1%) *2

(a) co-channel

-

11

dB

(b) 1MHz

-

0

dB

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(c) 2MHz

-

-30

dB

(d) 3MHz

-

-40

dB

Maximum Input Level (BER<0.1%)

-20

-

dBm

*1: Up to three spurious responses within Bluetooth limits are allowed.

*2: Up to five spurious responses within Bluetooth limits are allowed.

15.9. DC/RF Characteristics for Bluetooth (LE)

Conditions : 25deg.C,

VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V

Items

Contents

Bluetooth specification (power class)

Version 4.1(LE)

Channel frequency (spacing)

2402 to 2480 MHz (2MHz)

Number of RF Channel

40

Item / Condition

Min.

Typ.

Max.

Unit

Center Frequency

2402

-

2480

MHz

Channel Spacing

-

2

-

MHz

Number of RF channel

-

40

-

Output power 2402MHz

0

6

dBm

Output power 2440MHz

0.5

6.5

dBm

Output power 2480MHz

1

7

dBm

Modulation Characteristics

1) Δf1avg

225

-

275

kHz

2) Δf2max (at 99.9%)

185

-

kHz

3) Δf2avg / Δf1avg

0.8

-

Carrier frequency offset and drift

1) Frequency offset

-

150

kHz

2) Frequency drift

-

50

kHz

3) Drift rate

-

20

kHz

Receiver sensitivity (PER < 30.8%)

-

-70

dBm

Maximum input signal level (PER < 30.8%)

-10

-

dBm

PER Report Integrity (-30dBm input)

50

-

65.4

%

Preliminary Specification Number : SP-ZZ1PJ-331-J

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< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

16. LAND PATTERN (TOP VIEW)

***Stencil design:

For 0.3×0.55mm electrodes, stencil pad is 0.24mm*0.44mm and should put in the center of the each

conductor.

For 0.8×0.8mm electrodes, stencil pad is 0.66mm*0.66mm and should put in the center of the each

conductor.

***This is based on Murata’s condition using the thickness of the stencil 100 um.

So this is just the recommendation and needs to modify based on your condition.

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Murata(China) Investment Co., Ltd.

17. REFERENCE CIRCUIT

SDIO_CMD

LBEE5ZZ1PJ-331

GND

1

VBUCK_GND_PM

2

PWM_PM

3

VDD11_PM

4

GND

5

SDIO_DATA3

6

SDIO_DATA2

7

SDIO_DATA1

8

SDIO_DATA0

9

GND

43

LTE_UART_RXD 44

LTE_UART_TXD 45

CLK_REQ 46

DBG_UART_TXD 47

DBG_UART_RXD 48

QOW 49

GND

50

2G_WIFI/BT_RF_IN 22

GND 23

ANT 24

GND 25

3D_FRAME_SYNC 26

HCI_UART_RXD 27

HCI_UART_TXD 28

HCI_UART_RTS 29

HCI_UART_CTS 30

GND

51 GND

52 GND

53 GND

54 GND

55 GND

56 GND

57 GND

58

GND

59

GND

60

GND

61

GND

62

PCM_CLK 31

PCM_SYNC 32

PCM_IN 33

PCM_OUT 34

GND

35

VDDIO_XTAL

36

VDDIO_GPIO1

37

GND

38

WLAN_EN 39

BT_EN 40

VDD_3P3

41

VDDIO_AO

42

SDIO_CMD

10

SDIO_CLK

11

VDDIO_SDIO

12

SDIO_INTERRUPT_L

13

GND

14

32KHZ_CLK_IN

15

VDDIO_GPIO2

16

HCI_UART_WAKEHOST 17

WLAN_RF_KILL_L 18

GND 19

2G_WIFI/BT_RF_OUT 20

GND 21

BT_UART_CTS

BT_UART_RTS

BT_UART_RXD

BT_UART_TXD

LTE_UART_TXD

LTE_UART_RXD

WL_DEV_WAKEUP_HOST

32KHz Clock in

C7

47uF

DBG_UART_TXD

DBG_UART_RXD

BT_PCM_OUT

J3

RF-SOCKET_0

2

3

4

1

5

SMA connector

BT_DEV_WAKEUP_HOST

R10

10K

BT_PCM_SYNC

BT_EN

BT_PCM_CLK

SDIO_CLK

BT_PCM_IN

WLAN_EN

1. VDD_3V3 is powered by 3.3V typically.

2. VDDIO_AO, VDDIO_GPIO1, VDDIO_GPIO2, VDDIO_XTAL,

VDDIO_SDIO can be powered by 1.8V or 3.3V.

It should match the VIO voltage from host.

For the each I/O voltage group of 1PJ module, please

refer to 1PJ module datasheet.

Notes for the power supply voltage:

WLAN_EN

OQW

R5

10K

R17 0R

R13

NU

VDDIO_AO

R12

NU

R11

NU

R3

10K

R8 27

C2

0.1uF

R7

10K

VDDIO_GPIO2

BT_HOST_WAKEUP_DEV/3D_FRAME_SYNC

TOLERANCE = 20%

L1 1.5uH

VDDIO_AO

C3

1uF

VDD_3V3

VDDIO_GPIO1

VDDIO_GPIO2

WLAN Reset

VDDIO_XTAL

J2

CON2

1

2

R9

10K

VDDIO_GPIO1

WLAN_RF_KILL_L

VDDIO_SDIO

CLK_REQ

R6

10K

VDDIO_AO

R4

10K

VDDIO_GPIO2

R15

NU

R14

10K

SDIO_DATA3

SW2 SKQY A

1 2

SDIO_DATA2

VDDIO_SDIO

SDIO_DATA1

R2 27

BT_EN

R1

10K

C1

0.1uF

BT Reset VDDIO_AO SW1 SKQYA

1 2

J1

CON2

1

2

R16 0R

SDIO_DATA0

VDDIO_GPIO1

VDDIO_SDIOVDDIO_XTALVDDIO_GPIO2

VDDIO_AO

C11

0.1uF

C10

10uF

C6

1uF

C5

2.2uF

C4

10uF

C8

1uF

C9

1uF

C13

NU

VDD_3V3

C12

NU

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Murata(China) Investment Co., Ltd.

18. TAPE AND REEL PACKING

(1) Dimensions of Tape (Plastic tape)

Unit: mm

W

16+/-0.2

P2

2+/-0.1

F

7.5+/-0.1

A0

7.8+/-0.1

T

0.3+/-0.05

B0

7.6+/-0.1

E

1.75+/-0.1

K0

1.25+/-0.1

P

12+/-0.1

D0

1.5+0.1/-0

P0

4+/-0.1

D1

1.5+/-0.1

(2) Dimensions of Reel

Unit: mm

W1

25.5 +/-1.0

W2

29.5 +/-1.0

Feeding direction

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< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

(3) Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62 um in thickness

[4] Base tape : As specified in (1)

(4) Leader and Tail tape

Feeding Hole

Chip

Feeding Direction

[2]

[3]

[4]

[3]

[1]

160 to 190 mm

Tail tape

(No components)

Components

No components

Feeding direction

Leader tape

(Cover tape alone)

150mm min.

250 mm min.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Murata(China) Investment Co., Ltd.

-The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled

toward the user.

-The cover tape and base tape are not adhered at no components area for 250 mm min.

-Tear off strength against pulling of cover tape: 5 N min.

-Packaging unit: 1000 pcs/ reel

- Material: Base tape: Plastic

Reel : Plastic

Cover tape, cavity tape and reel are made the anti-static processing.

- Peeling of force: 1.1 N max. in the direction of peeling as shown below.

- PACKAGE (Humidity proof packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the

humidity indicator.

165 to 180 °

1.1 N max.

Base tape

Cover tape

表示ラベル

Label

Desiccant

Humidity

Indicator

Anti-humidity

Plastic Bag

Caution

label

Certification

label

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

- Box

Box for plastic bag: 90 x 350 x 350 mm

Carton box: 390 x 380 x 380 mm

5 boxes for plastic bag are stored to a carton box as below.

- Label

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

19. NOTICE

19.1. Storage Conditions:

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5 to

35deg.C and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)

- The product left more than 6months after reception, it needs to be confirmed the solderbility before

used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp

object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)

- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be

used within 168hours.

- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125+5/-0deg.C, 24hours, 1time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and

Cover Tape) are not heat-resistant.

19.2. Handling Conditions:

Be careful in handling or transporting products because excessive stress or mechanical shock may

break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of

products may change. Do not touch products with bear hands that may result in poor solder ability and

destroy by static electrical charge.

19.3. Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern

should be provided between IN and OUT terminals. Please refer to the specifications for the standard

land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of

products may vary depending on the pattern drawing method, grounding method, land dimensions,

land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to

verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

19.4. Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a

worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to

follow the specifications for the maintenance of the chip placer being used. For the positioning of

products on the PCB, be aware that mechanical chucking may damage products.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

19.5. Soldering Conditions:

The recommendation conditions of soldering are as in the following figure.

When products are immersed in solvent after mounting, pay special attention to maintain the

temperature difference within 100 °C. Soldering must be carried out by the above mentioned

conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.

Contact Murata before use if concerning other soldering conditions.

Reflow soldering standard conditions(Example)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

19.6. Cleaning:

Since this Product is Moisture Sensitive, any cleaning is not permitted.

19.7. Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions (ambient

temperature, humidity and pressure). Therefore, products have no problems to be used under the

similar conditions to the above-mentioned. However, if products are used under the following

circumstances, it may damage products and leakage of electricity and abnormal temperature may

occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before

actual use.

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply

Within 120s

Pre-heating

time(s)

220 deg.C

Within 60s

Cooling down

Slowly

180 deg.C

150 deg.C

235 to 245 deg.C

Within 3s

Preliminary Specification Number : SP-ZZ1PJ-331-J

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< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

static electricity or excessive voltage while assembling and measuring.

19.8. Input Power Capacity:

Products shall be used in the input power capacity as specified in this specifications.

Inform Murata beforehand, in case that the components are used beyond such input power capacity

range.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

20. PRECONDITION TO USE OUR PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the

specifications of our product when our product is mounted to your product.

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that

our product is used for the purpose, under the condition and in the environment specified in this specification. You are

requested not to use our product deviating from the condition and the environment specified in this specification.

Please note that the only warranty that we provide regarding the products is its conformance to the specifications

provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such

products, which are caused under the conditions other than those specified in this specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,

INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY

ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention

of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,

if you use our products in such applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,

DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY

FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment. - Aerospace equipment - Undersea equipment.

- Power plant control equipment - Medical equipment.

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment. - Disaster prevention / crime prevention equipment.

-Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our

product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by

the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right,

copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in

which our products or services are used. Information provided by us regarding third-party products or services does not

constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such

information may require a license from a third party under the patents or other intellectual property of the third party, or a

license from us under our patents or other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing of

mass-destruction weapons and the purpose of military use.

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",

etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials

and/or components from our suppliers.

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your

company and that you understand and accept the validity of the contents herein. When you are not able to return the

signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or

approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer

acknowledges that engineering samples may deviate from specifications and may contain defects due to their

development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability

for damages caused by

- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the

product to be sold by you,

-deviation or lapse in function of engineering sample,

-improper use of engineering samples.

We disclaim any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

Appendix

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

LBEE5ZZ1PJ Installation Manual (FCC)

FCC ID of this module is as follows;

FCC ID:

VPYLBEE5ZZ1PJ

For OEM integration only – device cannot be sold to general public.

Therefore we will ask OEM to include the following statement required by FCC on the product and in

the installation manual Notice.

Contents

1. Theory of operation

2. Antenna

3. Notice

1. Theory of operation

Frequency of operation

Scan

Ad-hoc

mode

2.4GHz

802.11b/g/n-HT20

2412MHz – 2462MHz (ch1 – ch11)

Active

Yes

802.11n-HT40

2422MHz – 2452MHz (ch3 – ch9)

Active

Yes

W52

802.11a/n-HT20/ac-VHT-20

5180MHz – 5240MHz (ch36 – ch48)

Active

Yes

802.11n-HT40/ac-VHT-40

5190MHz – 5239MHz (ch38 – ch46)

Active

Yes

802.11ac-VHT80

5210MHz (ch42)

Active

Yes

W53

802.11a/n-HT20/ac-VHT-20

5260MHz – 5320MHz (ch52 – ch64)

Passive

No

802.11n-HT40/ac-VHT-40

5270MHz – 5310MHz (ch54 – ch62)

Passive

No

802.11ac-VHT80

5290MHz (ch58)

Passive

No

W56

802.11a/n-HT20/ac-VHT-20

5500MHz – 5720MHz (ch100 – ch144)

Passive

No

802.11n-HT40/ac-VHT-40

5510MHz – 5710MHz (ch102 – ch142)

Passive

No

802.11ac-VHT80

5530MHz – 5690MHz (ch106 – ch138)

Passive

No

W58

802.11a/n-HT20/ac-VHT-20

5745MHz – 5825MHz (ch149 – ch165)

Active

Yes

802.11n-HT40/ac-VHT-40

5755MHz – 5795MHz (ch151 – ch159)

Active

Yes

802.11ac-VHT80

5775MH (ch155)

Active

Yes

The device cannot operate in 5600MHz~5650MHz band in Canada

Compliance with FCC requirement 15.407(c)

Data transmission is always initiated by software, which is the passed down through the MAC, through

the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the

MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then

turns off at the end of the packet. Therefore, the transmitter will be on only while one of the

aforementioned packets is being transmitted. In other words, this device automatically discontinue

transmission in case of either absence of information to transmit or operational failure.

Frequency Tolerance: ± 20ppm

End users cannot modify the software because F/W & driver are installed in device.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Murata(China) Investment Co., Ltd.

2. Antenna

■Please refer to KDB 996369

■Please perform the antenna design that followed the specifications of the antenna.

■About the signal line between an antenna and a module

It is a 50-ohm line design.

Fine tuning of return loss etc. can be performed using a matching network.

However, it is required to check "Class1 change" and "Class2 change" which the authorities define

then.

The concrete contents of a check are the following three points.

1) It is the same type as the antenna type of antenna specifications.

2) An antenna gain is lower than a gain given in antenna specifications.

3) The emission level is not getting worse.

■50-ohm feed line(microstrip line length)

Antenna

Antenna type

2.4GHz Monopole PCB Antenna

5GHz Monopole PCB Antenna

50-ohm feed line length

We test it at 26.4mm as a representative

3. Notice

For OEM integration only – device cannot be sold to general public.

Therefore we will ask OEM to include the following statements required by FCC/IC on the product and

in the Installation manual Notice.

Please describe the following warning on the final product which contains this module.

Contains Transmitter Module FCC ID: VPYLBEE5ZZ1PJ

or

Contains FCC ID: VPYLBEE5ZZ1PJ

●Please describe the following warning to the manual.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) This device may not cause harmful interference, and (2) this device must accept any

interference received, including interference that may cause undesired operation.

FCC CAUTION

Changes or modifications not expressly approved by the party responsible for compliance could void

the user’s authority to operate the equipment.

This transmitter must not be co-located or operated in conjunction with any other antenna or

transmitter.

※When the product is small, as for these words mentioned above, the posting to a manual is possible.

●When installing it in a mobile equipment. Please describe the following warning to the manual.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment

and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and

operated keeping the radiator at least 20cm or more away from person’s body.

RF Exposure requirements are met when installed in mobile equipment.

This module cannot be installed in portable equipment without further testing and a change to FCC's

grant of authorization. Contact Murata regarding portable applications.

Note)

Portable equipment : Equipment for which the spaces between human body and antenna are used

within 20cm.

Mobile equipment : Equipment used at position in which the spaces between human body and antenna

exceeded 20cm.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

3) The use of an antenna with gain less than 2.0 dBi(2.4GHz), 2.0 dBi(5.15~5.35GHz), 1.2 dBi

(5.47~5.725GHz) and 1.0 dBi (5.725~5.85GHz).

As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed

IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer

considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM

integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining

a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such

that 20 cm may be maintained between the antenna and users. The final end product must be labeled

in a visible area with the following: “Contains FCC ID: VPYLBEE5ZZ1PJ”. The grantee's FCC ID can be

used only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Preliminary Specification Number : SP-ZZ1PJ-331-J

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

LBEE5ZZ1PJ Installation Manual (IC)

IC No. of this device is as follows;

IC:

772C-LBEE5ZZ1PJ

For OEM integration only – device cannot be sold to general public.

Therefore, we will ask OEM to include the following statements required by IC on the product and in the

installation manual Notice.

Contents

1. Theory of operation

2. Antenna

3. Notice

1. Theory of operation

Frequency of operation

Scan

Ad-hoc

mode

2.4GHz

802.11b/g/n-HT20

2412MHz – 2462MHz (ch1 – ch11)

Active

Yes

802.11n-HT40

2422MHz – 2452MHz (ch3 – ch9)

Active

Yes

W52

802.11a/n-HT20/ac-VHT-20

5180MHz – 5240MHz (ch36 – ch48)

Active

Yes

802.11n-HT40/ac-VHT-40

5190MHz – 5239MHz (ch38 – ch46)

Active

Yes

802.11ac-VHT80

5210MHz (ch42)

Active

Yes

W53

802.11a/n-HT20/ac-VHT-20

5260MHz – 5320MHz (ch52 – ch64)

Passive

No

802.11n-HT40/ac-VHT-40

5270MHz – 5310MHz (ch54 – ch62)

Passive

No

802.11ac-VHT80

5290MHz (ch58)

Passive

No

W56

802.11a/n-HT20/ac-VHT-20

5500MHz – 5720MHz (ch100 – ch144)

Passive

No

802.11n-HT40/ac-VHT-40

5510MHz – 5710MHz (ch102 – ch142)

Passive

No

802.11ac-VHT80

5530MHz – 5690MHz (ch106 – ch138)

Passive

No

W58

802.11a/n-HT20/ac-VHT-20

5745MHz – 5825MHz (ch149 – ch165)

Active

Yes

802.11n-HT40/ac-VHT-40

5755MHz – 5795MHz (ch151 – ch159)

Active

Yes

802.11ac-VHT80

5775MH (ch155)

Active

Yes

The device cannot operate in 5600MHz~5650MHz band in Canada

Data transmission is always initiated by software, which is the passed down through the MAC, through

the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the

MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then

turns off at the end of the packet. Therefore, the transmitter will be on only while one of the

aforementioned packets is being transmitted. In other words, this device automatically discontinue

transmission in case of either absence of information to transmit or operational failure.

La transmission des données est toujours initiée par le logiciel, puis les données sont transmises par

'intermédiaire du MAC, par la bande de base numérique et analogique et, enfin, à la puce RF. Plusieurs

paquets spéciaux sont initiés par le MAC. Ce sont les seuls moyens pour qu'une partie de la bande de

base numérique active l'émetteur RF, puis désactive celui-ci à la fin du paquet. En conséquence,

l'émetteur reste uniquement activé lors de la transmission d'un des paquets susmentionnés. En

d'autres termes, ce dispositif interrompt automatiquement toute transmission en cas d'absence

d'information à transmettre ou de défaillance.

End users cannot modify the software because F/W & driver are installed in device.

Preliminary Specification Number : SP-ZZ1PJ-331-J

42 / 44

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

2. Antenna

■Please refer to KDB 996369

■Please perform the antenna design that followed the specifications of the antenna.

■About the signal line between an antenna and a module

It is a 50-ohm line design.

Fine tuning of return loss etc. can be performed using a matching network.

However, it is required to check "Class1 change" and "Class2 change" which the authorities define

then.

The concrete contents of a check are the following three points.

1) It is the same type as the antenna type of antenna specifications.

2) An antenna gain is lower than a gain given in antenna specifications.

3) The emission level is not getting worse.

■50-ohm feed line(microstrip line length)

Antenna

Antenna type

2.4GHz Monopole Antenna

5GHz Monopole Antenna

50-ohm feed line length

We test it at 6.15mm as a representative

3. Notice

For OEM integration only – device cannot be sold to general public.

Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in the

Installation manual Notice.

Please describe the following warning on the final product which contains this module.

Contains IC: 772C-LBEE5ZZ1PJ

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the

following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts

de licence.

L’exploitation est autorisée aux deux conditions suivantes :

1) l’appareil ne doit pas produire de brouillage;

2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d’en compromettre le fonctionnement.

*When the product is small, as for these words mentioned above, the posting to a manual is possible.

5150-5250 MHz band is restricted to indoor operation only.

La bande 5150-5250 MHz est restreinte à une utilisation à l’intérieur seulement.

High-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and

5650-5850

MHz and that these radars could cause interference and/or damage to LE-LAN devices.

Les radars de haute puissance sont désignés utilisateurs principaux (c.-à-d., qu'ils ont la priorité) pour les

bandes 5250-5350 MHz et 5650-5850 MHz, et ces radars pourraient causer du brouillage et/ou des

dommages aux dispositifs LAN-EL.

Preliminary Specification Number : SP-ZZ1PJ-331-J

43 / 44

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata(China) Investment Co., Ltd.

●When installing it in a mobile equipment. Please describe the following warning to the manual.

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and

meets RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and

operated keeping the radiator at least 20cm or more away from person’s body.

Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un environnement

non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF) CNR-102 de l’IC. Cet

équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus entre le radiateur et le corps

humain.

RF Exposure requirements are met when installed in mobile equipment.

This module cannot be installed in portable equipment without further testing and a change to FCC's grant of

authorization.

Contact Murata regarding portable applications.

Note)

Portable equipment : Equipment for which the spaces between human body and antenna are used within

20cm.

Mobile equipment : Equipment used at position in which the spaces between human body and antenna

exceeded 20cm.

This device is intended only for OEM integrators under the following conditions: (For module

device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

3) The use of an antenna with gain less than 2.0 dBi (2.4GHz), 2.0dBi (5.15~5.35GHz), 1.2dBi

(5.47~5.725GHz) and 1.0dBi (5.725~5.85GHz).

As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

(Pour utilisation de dispositif module)

1)L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et

les utilisateurs, et

2)Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 3 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas

nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour

toutes exigences de conformité supplémentaires requis pour ce module installé.