Murata LBEE5ZZ1PJ W-LAN + Bluetooth Module User Manual

Murata Manufacturing Co., Ltd. W-LAN + Bluetooth Module Users Manual

Contents

Users Manual

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Application IDVoToih8mDhEnQH/KHE3uJg==
Document DescriptionUsers Manual
Short Term ConfidentialNo
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Date Submitted2018-12-26 00:00:00
Date Available2019-01-01 00:00:00
Creation Date2018-12-18 09:51:07
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Document Lastmod2018-12-18 09:51:07
Document TitleUsers Manual
Document CreatorMicrosoft® Word 2010
Document Author: MM04133

Preliminary Specification Number :SP-ZZ1PJ-331-J
W-LAN + Bluetooth Module Data Sheet
Qualcomm Chipset
for 802.11a/b/g/n/ac + Bluetooth 5.0 (Dual)
Sample Part Number: LBEE5ZZ1PJ-TEMP
MP Part Number: 1PJ
Preliminary & Confidential
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The revision history of the product specification
Revised
Revision
Date
Code
May 4,
2018
May 17
2018
May 28,
2018
July 6, 2018
Revised
Page
Change
Reason
First release
Updated Scope and Key feature
Updated
13~19
Added the WLAN TX power range
Added
10
14~19
20
21
12
13~16
20/23
23
24
31
10
12
16~17
13
28
-Added Manufacturing site
-Added Weight info
-Added Co planarity spec
-Updated Storage Temperature range
-Updated Operating Temperature range
-Updated Specification Temperature range.
-Revise title of section 12 to “POWER SEQUENCE Timing”
-Revised characterization table
-Updated BT TX Power spec
-Updated BLE TX Power spec
-Added Digital I/O Requirements
-Added INTERFACE TIMING
-Revised the spec of Adjacent Input Level Sensitivity
-Added *10) to DC/RF Characteristics for IEEE802.11ac-5G
-Revised DC/RF Characteristics for Bluetooth
-Added Box and Label info
-Revised spec of ta2
-Revised spec of VOL
-Added UHS SDIO timing requirement
-Revised Digital IO requirement
-Revised Reference circuit
Added/updated
-Revised Marking
-Updated BT Output Power spec
-Added EDR Output Power spec
-Added Radio certification information
-Added the module picture
-Added Appendix
-Updated BT version
Revised
July 23,
2018
Aug 3, 2018
Sep 3, 2018
Sep 12,
2018
Oct 8, 2018
25
Nov 7, 2019
Nov 8, 2019
37~44
Revised Item
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Added
Revised/Added
Revised
Revised
Added
Updated
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TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
SCOPE ..................................................................................................................................................... 3
KEY FEATURE ...................................................................................................................................... 3
Manufacturing site ................................................................................................................................. 3
Part Number ........................................................................................................................................... 3
RoHS Compliance ................................................................................................................................... 3
Block Diagram ........................................................................................................................................ 3
Certification Information ....................................................................................................................... 4
7.1.
8.
Radio Certification ................................................................................................................... 4
DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 4
8.1.
8.2.
8.3.
Dimensions ............................................................................................................................... 4
Pin Layout and PIN Descriptions ........................................................................................... 5
Marking ..................................................................................................................................... 7
9. ABSOLUTE MAXIMUM RATINGS*1)................................................................................................... 8
10.
OPERATING CONDITION*2) ............................................................................................................ 8
11.
External low–power 32.768 kHz clock............................................................................................... 9
12.
POWER SEQUENCE Timing .......................................................................................................... 10
12.1.
12.2.
12.3.
13.
14.
Case 1: 3.3 V power down after 1.8 V................................................................................ 10
Case 2: 1.8 V power down after 3.3 V.................................................................................11
Case 3: All power rails supplied with 3.3 V ...................................................................... 12
Digital I/O Requirements ................................................................................................................. 12
INTERFACE TIMING ...................................................................................................................... 13
14.1.
Bluetooth UART Timing .................................................................................................... 13
14.1.1.
UART transmit Timing ............................................................................................... 13
14.1.2.
UART Receiver Timing ............................................................................................... 13
14.2.
I2S Timing ........................................................................................................................... 13
14.2.1.
I2S Transmitter Timing............................................................................................... 14
14.2.2.
I2S Receiver Timing..................................................................................................... 14
14.3.
SDIO Timing ....................................................................................................................... 15
14.3.1.
SDIO Default Mode Timing ........................................................................................ 15
14.3.2.
SDIO High-Speed Mode Timing ................................................................................. 16
14.3.3.
SDIO UHS mode Timing ............................................................................................ 16
15.
DC / RF Characteristics.................................................................................................................... 18
15.1.
15.2.
15.3.
15.4.
15.5.
15.6.
15.7.
15.8.
15.9.
16.
17.
18.
19.
LAND PATTERN (TOP VIEW) ........................................................................................................ 27
REFERENCE CIRCUIT ................................................................................................................... 28
TAPE AND REEL PACKING ........................................................................................................... 29
NOTICE ............................................................................................................................................. 33
19.1.
19.2.
19.3.
19.4.
19.5.
19.6.
19.7.
19.8.
20.
DC/RF Characteristics for IEEE802.11b - 2.4GHz .......................................................... 18
DC/RF Characteristics for IEEE802.11g - 2.4GHz .......................................................... 19
DC/RF Characteristics for IEEE802.11n – 2.4GHz ......................................................... 20
DC/RF Characteristics for IEEE802.11ac – 2.4GHz ........................................................ 21
DC/RF Characteristics for IEEE802.11a - 5GHz ............................................................. 22
DC/RF Characteristics for IEEE802.11n - 5GHz ............................................................. 23
DC/RF Characteristics for IEEE802.11ac - 5GHz ............................................................ 24
DC/RF Characteristics for Bluetooth ................................................................................ 25
DC/RF Characteristics for Bluetooth (LE)........................................................................ 26
Storage Conditions: ............................................................................................................ 33
Handling Conditions: ......................................................................................................... 33
Standard PCB Design (Land Pattern and Dimensions): ................................................. 33
Notice for Chip Placer: ....................................................................................................... 33
Soldering Conditions: ......................................................................................................... 34
Cleaning: ............................................................................................................................. 34
Operational Environment Conditions: .............................................................................. 34
Input Power Capacity: ........................................................................................................ 35
PRECONDITION TO USE OUR PRODUCTS ............................................................................... 36
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.
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1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 5.0 combo module.
2. KEY FEATURE
- Chipset: QCA9377-3
- Size: 7.2 x 7.4 x 1.25 (max) mm
- Weight: 0.15g/pc
- PCB w/ shielded resin mold module
- IEEE802.11a/b/g/n/ac dual band 2.4G/5G
- Supports BT5.0 (Except Options)
- SDIO 3.0 supporting SDR104 (WLAN), UART/PCM (Bluetooth)
- Lead Free Module
3. Manufacturing site
Company name:
Shenzhen Murata Technology Co., Ltd.
Address:
15 Cuijing Road, Longtian Street, Shenzhen Grand Industrial Zone, PingShan District, Shenzhen,
Guangdong, 518118 China
4. Part Number
Ordering Part Number
LBEE5ZZ1PJ-331TEMP
Description
In case of sample order
5. RoHS Compliance
This module is compliant with the RoHS directive.
6. Block Diagram
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7. Certification Information
7.1.
Radio Certification
USA/Canada
FCC ID
VPYLBEE5ZZ1PJ
IC
772C-LBEE5ZZ1PJ
*Please follow installation manual in Appendix
Europe
EN300 328 v2.1.1, Draft EN 300 328 v2.2.0, EN301 893 v2.1.1 and Final draft EN300 440 v2.2.1are
prepared.
8. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS
8.1.
Dimensions



Table 1 Dimension (Unit: mm)
Mark
Dimension
7.40±0.20
0.30±0.10
a1
0.80±0.10
a4
0.25±0.15
b2
0.20±0.15
b5
1.55±0.15
b8
0.55±0.10
c3
0.30±0.10
e1
0.30±0.10
e4
Mark
a2
a5
b3
b6
c1
c4
e2
e5
Dimension
7.20±0.20
0.30±0.10
0.30±0.10
1.45±0.15
1.05±0.15
0.55±0.10
0.80±0.10
0.30±0.10
0.30±0.10
Mark
a3
b1
b4
b7
c2
c5
e3
Dimension
1.25 max
0.30±0.10
0.20±0.15
5.15±0.15
1.35±0.15
0.55±0.10
0.30±0.10
0.30±0.10
(unit : mm)
Co-planarity: 100um Max.
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8.2.
Pin Layout and PIN Descriptions
Top View
Table 2 Terminal Configurations
Pin
NO.
Terminal Name
Type
VDDIO or
pad voltage
Connection to
IC terminal
Description
GND
Ground
Ground
VBUCK_GND_PM
Ground
VBUCK_GND_PM
Ground for internal 1.1 V regulator
PWM_PM
1.1V
PWM_PM
SWREG PMU 1.1V output.
VDD11_PM
1.1V
VDD11_PM
1.1 V voltage feedback to SWREG PMU.
GND
Ground
Ground
SDIO_DATA3
I/O
VDDIO_SDIO
SDIO_D3
SDIO data bus D3
SDIO_DATA2
I/O
VDDIO_SDIO
SDIO_D2
SDIO data bus D2
SDIO_DATA1
I/O
VDDIO_SDIO
SDIO_D1
SDIO data bus D1
SDIO_DATA0
I/O
VDDIO_SDIO
SDIO_D0
SDIO data bus D0
10
SDIO_CMD
VDDIO_SDIO
SDIO_CMD
SDIO CMD line signal
11
SDIO_CLK
OD(1)
VDDIO_SDIO
SDIO_CLK
SDIO clock signal
12
VDDIO_SDIO
Power
1.8V or 3.3V
VDDIO_SDIO
Voltage supply for SDIO
13
SDIO_INTERRUPT_L
VDDIO_SDIO
SDIO_INTERRUPT_L
SDIO interrupt signal
14
GND
Ground
Ground
15
32KHz_CLK_IN
VDDIO_GPIO2
LF_CLK_IN
External low–power 32.768 kHz clock input
16
VDDIO_GPIO2
Power
1.8V or 3.3V
VDDIO_GPIO2
Voltage supply
17
HCI_UART_WAKEHOST
OD(1)
VDDIO_GPIO2
HCI_UART_WAKEHOST
Bluetooth wakeup host. Active high
18
WLAN_RF_KILL_L
VDDIO_GPIO2
WLAN_RFKILL_L
Turn off WLAN RF analog and front–end.
Active low.
19
GND
Ground
Ground
20
2G_WIFI/BT_RF_OUT
A,O
2G WIFI and BT output
21
GND
Ground
Ground
22
2G_WIFI/BT_RF_IN
A, I
2G WIFI and BT input
23
GND
Ground
Ground
24
ANT
A, I/O
RF Transmit / Receive Antenna
25
GND
Ground
Ground
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26
3D_FRAME_SYNC
VDDIO_GPIO1
3D_FRAME_SYNC
Frame sync signal from TV to sync with 3D
27
HCI_UART_RXD
VDDIO_GPIO1
HCI_UART_RXD
UART RXD signal
28
HCI_UART_TXD
VDDIO_GPIO1
HCI_UART_TXD
UART TXD signal
29
HCI_UART_RTS
VDDIO_GPIO1
HCI_UART_RTS
UART RTS signal
30
HCI_UART_CTS
VDDIO_GPIO1
HCI_UART_CTS
UART CTS signal
31
PCM_CLK
VDDIO_GPIO1
BT_I2S_SCK
Bluetooth PCM_CLK signal
32
PCM_SYNC
I/O
VDDIO_GPIO1
BT_I2S_WS
Bluetooth PCM_SYNC signal
33
PCM_IN
OD(1)
VDDIO_GPIO1
BT_I2S_SDI
Bluetooth PCM_IN signal
34
PCM_OUT
VDDIO_GPIO1
BT_I2S_SDO
Bluetooth PCM_OUT signal
35
GND
Ground
Ground
36
VDDIO_XTAL
Power
1.8V or 3.3V
VDDIO_XTAL
Voltage supply for XTAL
37
VDDIO_GPIO1
Power
1.8V or 3.3V
VDDIO_GPIO1
Voltage supply
38
GND
Ground
Ground
39
WLAN_EN
VDDIO_AO
WL_EN
WLAN enable. Active high
40
BT_EN
VDDIO_AO
BT_EN
Bluetooth enable. Active high
41
VDD_3P3
Power
3.3V
VDD33_PM
3.3 V input voltage
42
VDDIO_AO
Power
1.8V or 3.3V
VDDIO_AO_PM
Always–on I/O supply for power
glass via Bluetooth.
management and real–time clock. This
supply must be present if any other supply
is present.
43
GND
Ground
Ground
44
LTE_UART_RXD
VDDIO_GPIO1
LTE_UART_RXD
LTE coexistence signal.
45
LTE_UART_TXD
VDDIO_GPIO1
LTE_UART_TXD
46
CLK_REQ
VDDIO_GPIO1
CLK_REQ
Clock request output
47
DBG_UART_TXD
OD(1)
VDDIO_AO
GPIO[19]
DBG_UART_TXD
48
DBG_UART_RXD
OD(1)
VDDIO_GPIO2
GPIO[18]
DBG_UART_RXD
49
QOW
OD(1)
VDDIO_GPIO2
QOW
This signal can be used to enable for
50~
GND
Ground
LTE_UART_RXD or LTE_FS.
LTE co– existence signal.
LTE_UART_TXD or LTE_PRI.
external Wireless charging UART circuit.
Ground
62
(1)
OD means this PIN is a digital output signal with open drain, an external pull-up or pull-down resistor is needed when this PIN is
used.
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8.3.
Marking
Marking
Meaning
Pin 1 Marking
Module Descriptor
Inspection Number
Murata Logo
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9. ABSOLUTE MAXIMUM RATINGS*1)
Parameter
Storage Temperature
VDD_3P3
VDDIO_SDIO
VDDIO_GPIO1
Supply Voltage
VDDIO_GPIO2
VDDIO_XTAL
VDDIO_AO
min.
-40
-0.3
max.
85
3.65
Unit
deg.C
-0.3
3.6
*1)
Stresses in excess of the absolute ratings may cause permanent damage. Functional operation
is not implied under these conditions. Exposure to absolute ratings for extended periods of time
may adversely affect reliability. No damage assuming only one parameter is set at limit at a time
with all other parameters are set within operating condition.
10. OPERATING CONDITION*2)
Parameter
Operating Temperature
Specification Temperature range
VDD_3P3
VDDIO_SDIO
VDDIO_GPIO1
Supply Voltage
VDDIO_GPIO2
VDDIO_XTAL
VDDIO_AO
min.
-20
-20
3.135
typ.
25
3.3
max.
70
60
3.465
unit
deg.C
deg.C
1.71
1.8 or 3.3
3.46
*2)
Functionality is guaranteed but the specifications require the derating at over-temperatures,
over-voltage condition.
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11. External low–power 32.768 kHz clock
The 32 kHz clock is used in low-power modes such as IEEE power-save and sleep. It serves as a timer
to determine when to wake up to receive beacons in various power-save schemes and to maintain
basic logic operations when in sleep.
Type1PJ module does not require an external 32 kHz clock. By default, Type1PJ module utilizes its
internal 200 kHz clock shared with the WLAN and BT subsystem.
If the end application has a more accurate 32 kHz clock, then it can be supplied externally via the
LF_CLK_IN pin. The LF_CLK_IN pin must be grounded when using the default internal clock mode. If
an external 32 kHz clock is used, the requirements are:
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12. POWER SEQUENCE Timing
12.1.
Case 1: 3.3 V power down after 1.8 V
If the battery source can be removed from the end user device (battery removed, AC/DC plugged
in), this is the recommended power sequence. It will avoid violating the power off sequence by
allowing the 3.3 V rail to shut down after the 1.8 V rail.
Notes:
1. VDDIO_GPIO voltage should match VIO voltage from the host. In some applications,
VDDIO_GPIO may connected to 3.3 V upon Host VIO voltage.
2. In this case, both WLAN_EN and BT_EN on the 1PJ are at 3.3 V due to using the VDD_AO
power rail. If the host VIO voltage is 1.8 V, it must have level shifters to interface with host.
3. All host interface signals must stay floating or low before valid power on sequence (WLAN_EN
and BT-EN goes high).
Symbol
Parameter
Min
Max
Units
ta1
No requirement if VDDIO_AO connected to 3.3 V
μs
ta2
90% of 3.3 V to 10% of 1.8 V
μs
ta3
90% of VDDIO_GPIO to 0.7 V of both WLAN_EN and BT_EN
10
μs
ta4
WLAN_EN valid to LF_CLK_IN input
μs
ta5
WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert
(tristate or low)
μs
ta6
Both WLAN_EN = low and BT_EN = low to 90% of 1.8 V
10
μs
μs
μs
ta7
ta8
3.3 V always higher than 1.8 V during operation, with power
off by removing battery or unplugging AC/DC
VDDIO_AO and VDDIO_XTAL should be connected to 3.3 V
power rail
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12.2.
Case 2: 1.8 V power down after 3.3 V
If the battery source cannot be removed from the end user device, this is the recommended
power sequence for this application. This sequence allows the software to control the power
on/off sequence.
Notes:
1. VDDIO_GPIO voltage should match VIO voltage from the host. In some applications,
VDDIO_GPIO may connected to 3.3 V upon host VIO voltage.
2. Both WLAN_EN and BT_EN of 1PJ are 1.8 V. If host VIO voltage is 1.8 V, it does
not need level shifter to interface with host.
3. All host interface signals must stay floating or low before WLAN_EN/BT_EN =”high”, and
after WLAN_EN/BT_EN = Low.
Symbol
Parameter
Min
Max
Units
tb1
No requirement if VDDIO_AO connected to 1.8 V
μs
tb2
90% of 1.8 V to 10% of 3.3 V
μs
tb3
90% of 3.3 V to 0.7 V of both WLAN_EN and BT_EN
10
μs
tb4
WLAN_EN valid to LF_CLK_IN input
μs
tb5
WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert
(tristate or low)
μs
tb6
Both WLAN_EN = low and BT_EN = low to 90% of 3.3 V
10
μs
tb7
10% of 3.3 V to 90% of 1.8 V
μs
tb8
VDDIO_AO and VDDIO_XTAL should be connected to 1.8 V
power rail
μs
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12.3.
Case 3: All power rails supplied with 3.3 V
All power pins are connected to 3.3 V only include VDDIO_AO, VDDIO_XTAL, VDDIO_GPIOx.
Notes:
All host signals are either GND or floating before WLAN_EN/BT_EN =”high”, and after
WLAN_EN/BT_EN = Low.
Symbol
Parameter
Min
Max
Units
tc1
90% of 3.3 V to 0.7 V of both WLAN_EN and BT_EN
μs
tc4
WLAN_EN valid to LF_CLK_IN input
μs
tc5
WLAN_EN de-assert (“low”) to LF_CLK_IN de-assert (tristate
or low)
μs
tc6
Both WLAN_EN = low and BT_EN = low to 90% of 3.3 V
10
μs
Maximum
VDDIO +
0.3
0.3x
VDDIO
Unit
uA
kohm
VDDIO
0.1x
VDDIO
-11
13. Digital I/O Requirements
Symbol
VIH
Parameter
High-level input voltage
VIL
Comments
Type
Low-level input voltage
Minimum
0.7x
VDDIO
-0.3
VSHYS
Schmitt hysteresis
IIL
Input low leakage current
1.8 V IO: 375
3.3 V IO: 645
RPULL
Input pull resistor
VOH
High-level output voltage
VOL
Low-level output voltage
0.9x
VDDIO
IOH
IOL
CIN
High-level output current
Low-level output current
Input capacitance
VIN = 0 V
Supply = VIO
max
Up or down
-5
1.8 V IO: 120
3.3 V IO: 70
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mV
mA
mA
pF
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14. INTERFACE TIMING
14.1. Bluetooth UART Timing
14.1.1. UART transmit Timing
tofftxd
Parameter
Description
Min
Typ
Max
Unit
tofftxd
Delay from CTS to TXD stop
byte
14.1.2. UART Receiver Timing
toffrxd
14.2.
Parameter
Description
Min
Typ
Max
Unit
toffrxd
Delay from RTS to RXD stop
byte
I2S Timing
Transmitter
Lower Limit
Upper Limit
Min
Max
Min
Max
Clock Period T
Ttr
Master Mode: Clock generated by transmitter or receiver
HIGH tHC
0.35Ttr
LOW tLC
0.35Ttr
Slave Mode: Clock accepted by transmitter or receiver
HIGH hTC
0.35Ttr
LOW tLC
0.35Ttr
Rise time tRC
0.15Ttr
Transmitter
Delay tdtr
0.8T
Hold time thtr
Receiver
Setup time tsr
Hold time thr
Lower Limit
Min
Max
Ttr
Receiver
Upper Limit
Min
Max
Notes
0.35Ttr
0.35Ttr
0.35Ttr
0.35Ttr
0.2Tr
Notes:
a.
b.
c.
d.
e.
f.
The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be
able to handle the data transfer rate.
At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space
ratio. For this reason, tHC and tLC are specified with respect to T.
In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that
they can detect the signal. So long as the minimum periods are greater than 0.35T r, any clock that meets the
requirements can be used.
Because the delay(tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter
driven by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative.
Therefore, the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock
rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr.
To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the
clock signal and T, always giving the receiver sufficient setup time.
The data setup and hold time must not be less than the specified receiver setup and hold time.
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14.2.1. I2S Transmitter Timing
14.2.2. I2S Receiver Timing
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14.3.
SDIO Timing
14.3.1. SDIO Default Mode Timing
fPP
tWL
tWH
CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
(max)
tODLY
(min)
SDIO Bus Timing parameters (default Mode)
Parameter
Symbol
Min
SDIO CLK (All values are referred to minimum VIH and maximum VIL
Frequency-Data Transfer Mode
fPP
Frequency-Identification Mode
fOD
0 /100
Clock Low Time
tWL
10
Clock High Time
tWH
10
Clock Rise Time
tTLH
Clock low Time
tTHL
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
Input Hold Time
tIH
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
Output Delay time-Identification Mode
tODLY
Typ
Max
Unit
25
400
10
10
MHz
kHz
ns
ns
ns
ns
ns
ns
14
50
ns
ns
a. 0 Hz means to stop the clock. The given minimum frequency range is for cases where continuous clock is required.
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14.3.2. SDIO High-Speed Mode Timing
fPP
tWL
50% VDD
tWH
CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
tOH
SDIO Bus Timing parameters (High-Speed Mode)
Parameter
Symbol
Min
SDIO CLK (All values are referred to minimum VIH and maximum VIL
Frequency-Data Transfer Mode
fPP
Clock Low Time
tWL
Clock High Time
tWH
Clock Rise Time
tTLH
Clock low Time
tTHL
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
Input Hold Time
tIH
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
Output Hold time
tOH
2.5
Total System Capacitance (each line)
CL
Typ
Max
Unit
50
MHz
ns
ns
ns
ns
ns
ns
14
40
ns
ns
pF
14.3.3. SDIO UHS mode Timing
In UHS mode the supported features are:
1. Embedded SDIO
The chip is only designed for embedded system; that is, it should be mounted on the PCB with host
system and not support plug & play.
2. Fixed voltage supply (VDDIO_SDIO 1.8 V)
There is no on-chip LDO to do voltage switch when it receives CMD11 (voltage switch command). In
other words, the VDDIO_SDIO power supply is provided from host and should keep constant. Note,
though, it does not support voltage switch, it does follow the timing flow of CMD11, with the exception
of no voltage change, so there is no effect to SW code.
3. Support for 8-bit mode
The 8-bit mode dedicated to embedded system is supported with the maximum frequency of 50 MHz
a). Clock signal timing
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Symbol
tCLK
tCR, tCF
Clock duty
Min
4.8
30
Max
0.2*tCLK
70
Unit
ns
ns
Remark
208MHz (max.) between rising edge, VCT=0.975V
tCR, tCF<0.96ns (max.) at 208MHz, C=10 pF
b). Input timing
Symbol
tIS
tIH
Symbol
tIS
tIH
Min
1.4
0.8
Min
0.8
Max
Max
Unit
ns
ns
Unit
ns
ns
SDR104 mode
C =10 pF, VCT=0.975V
C=10 pF, VCT=0.975V
SDR12, SDR25 and SDR50 modes
C =10 pF, VCT=0.975V
C=10 pF, VCT=0.975V
c). Output timing (SDR12/SDR25/SDR50)
Symbol
Min
Max
Unit
Remark
tODLY
7.5
ns
TCLK=10ns, CL=30 pF, driver B for SDR50
tTODLY
14
ns
TCLK=20ns, CL=40 pF, driver B for SDR25,12
tOH
1.5
ns
Hold time at the tODLY , CL=15 pF
d). Output timing (SDR104)
Symbol
tOP
Delta tOP
tODW
Min
-350
0.6
Max
1550
Unit
ns
ps
UI
Remark
Output phase
Delay variation due to temperature change after tuning
tODW =2.88ns at 208 MHz.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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15. DC / RF Characteristics
15.1.
DC/RF Characteristics for IEEE802.11b - 2.4GHz
Specification
Mode
Frequency
Data rate
IEEE802.11b
DSSS / CCK
2412 to 2472 MHz
1, 2, 5.5, 11Mbps
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting=19 dBm, 11Mbps mode unless otherwise specified.
Items
Contents
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
330
*4) *5)
2) Rx mode
60
- Tx Characteristics min.
typ.
max.
2. Output Power
18
19
20
3. Spectrum Mask margin
1) 1st side lobes(-30dBr)
2) 2nd side lobes(-50dBr)
4. Power-on and Power-down ramp
2.0
5. RF Carrier Suppression
15
6. Modulation Accuracy (EVM)
35
7.Frequency tolerance
-20
20
8. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
9. Minimum Input Level Sensitivity
-76
10. Maximum Input Level (PER < 8%)
-10
11. Adjacent Channel Rejection
35
(FER < 8%)
*4): Defined when output power setting is 19 dBm at Murata module antenna pad
*5): Data rate is 1Mbps
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unit
mA
mA
unit
dBm
dB
dB
μsec
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.2.
DC/RF Characteristics for IEEE802.11g - 2.4GHz
Specification
Mode
Frequency
Data rate
IEEE802.11g
OFDM
2412 to 2472 MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting=18 dBm, 54Mbps mode unless otherwise specified.
Items
Contents
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
310
*6) *7)
2) Rx mode
60
- Tx Characteristics min.
typ.
max.
2. Output Power
17
18
19
3. Spectrum Mask margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -40dBr)
4) 30MHz to 33MHz (-40dBr)
4. Constellation Error (EVM)
-25
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-65
8. Maximum Input Level (PER < 10%)
-20
9. Adjacent Channel Rejection
-1
(PER < 10%)
*6): Defined when output power setting is 18dBm at Murata module antenna pad
*7): Data rate is 6Mbps
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unit
mA
mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.3.
DC/RF Characteristics for IEEE802.11n – 2.4GHz
Specification
Mode
Frequency
Data rate
IEEE802.11n
OFDM
2412 to 2472 MHz
MCS0-MCS7
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting=18 dBm, BW=20MHz, MCS7 unless otherwise specified.
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
310
*8)*9)
2) Rx mode
60
- Tx Characteristics min.
typ.
max.
2. Output Power
17
18
19
3. Spectrum Mask
1) 9MHz to 11MHz (0 ~ -20dBr)
2) 11MHz to 20MHz (-20 ~ -28dBr)
3) 20MHz to 30MHz (-28 ~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
-27
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-64
8. Adjacent Channel Rejection
-2
(PER < 10%)
*8): Defined when output power setting is 18 dBm at Murata module antenna pad
*9): Data rate is MCS0
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unit
mA
mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.4.
DC/RF Characteristics for IEEE802.11ac – 2.4GHz
Specification
Mode
Frequency
Data rate
IEEE802.11ac
OFDM
2412 to 2472 MHz
MCS0-MCS9
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting=17 dBm, MCS9,BW=40MHz unless otherwise specified.
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
290
*8)*9)
2) Rx mode
62
- Tx Characteristics min.
typ.
max.
2. Output Power
16
17
18
3. Spectrum Mask
1) 9MHz to 11MHz (0 ~ -20dBr)
2) 11MHz to 20MHz (-20 ~ -28dBr)
3) 20MHz to 30MHz (-28 ~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
-32
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-54
8. Adjacent Channel Rejection
-9
(PER < 10%)
*8): Defined when output power setting is 17 dBm at Murata module antenna pad
*9): Data rate is MCS0
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unit
mA
mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.5.
DC/RF Characteristics for IEEE802.11a - 5GHz
Specification
Mode
Frequency
Data rate
IEEE802.11a
OFDM
5180 to 5825MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting= 14 dBm, 54Mbps unless otherwise specified.
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
420
*8)*9)
2) Rx mode
80
- Tx Characteristics min.
typ.
max.
2. Output Power
13
14
15
3. Spectrum Mask
1) 9MHz to 11MHz (0 ~ -20dBr)
2) 11MHz to 20MHz (-20 ~ -28dBr)
3) 20MHz to 30MHz (-28 ~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
-25
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-65
8. Adjacent Channel Rejection
-1
(PER < 10%)
*8): Defined when output power setting is 14 dBm at Murata module antenna pad
*9): Data rate is 6Mbps
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unit
mA
mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.6.
DC/RF Characteristics for IEEE802.11n - 5GHz
Specification
Mode
Frequency
Data rate
IEEE802.11n
OFDM
5180 to 5825MHz
MCS0-MCS7
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting= 14 dBm, BW=20MHz ,MCS7 unless otherwise specified.
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
420
*8)*9)
2) Rx mode
80
- Tx Characteristics min.
typ.
max.
2. Output Power
13
14
15
3. Spectrum Mask
1) 9MHz to 11MHz (0 ~ -20dBr)
2) 11MHz to 20MHz (-20 ~ -28dBr)
3) 20MHz to 30MHz (-28 ~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
-32
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-64
8. Adjacent Channel Rejection
-2
(PER < 10%)
*8): Defined when output power setting is 14 dBm at Murata module antenna pad
*9): Data rate is MCS0
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mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.7.
DC/RF Characteristics for IEEE802.11ac - 5GHz
Specification
Mode
Frequency
Data rate
IEEE802.11ac
OFDM
5210 to 5775MHz
MCS0-MCS9
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Output power setting= 1 dBm, BW=80MHz ,MCS9 unless otherwise specified.
- DC Characteristics min.
typ.
max.
1. DC current
1) Tx mode (1024byte, 20usec interval)
370
*8)*9)
2) Rx mode
90
- Tx Characteristics min.
typ.
max.
2. Output Power *10)
11
12
13
3. Spectrum Mask
1) 9MHz to 11MHz (0 ~ -20dBr)
2) 11MHz to 20MHz (-20 ~ -28dBr)
3) 20MHz to 30MHz (-28 ~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
-32
5.Frequency tolerance
-20
20
6. Out band Spurious Emissions
1) 30-1000MHz
-36
2) 1000-12750MHz
-30
3) 1800-1900MHz
-47
4) 5150-5300MHz
-47
- Rx Characteristics min.
typ.
max.
7. Minimum Input Level Sensitivity
-51
8. Adjacent Channel Rejection
-9
(PER < 10%)
*8): Defined when output power setting is 12dBm at Murata module antenna pad
*9): Data rate is MCS0
*10):Target output power for MCS9 VHT=40 at 5190, 5230, 5270 and 5310MHz is 7dBm.
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unit
mA
mA
unit
dBm
dB
dB
dB
dB
dB
ppm
dBm
dBm
dBm
dBm
unit
dBm
dB
Preliminary Specification Number : SP-ZZ1PJ-331-J
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15.8.
DC/RF Characteristics for Bluetooth
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Items
Contents
Bluetooth specification (power class)
Version 2.1 + EDR (Class1)
Channel frequency (spacing)
2402 to 2480 MHz (1MHz)
Current Consumption
Min.
Typ.
Max.
(a) Tx=DH5
55
(b) Tx=2DH5
50
(c) Tx=3DH5
50
(d) Rx=DH5
22
(e) Rx=2DH5
22
(f) Rx=3DH5
22
Transmitter
Min.
Typ.
Max.
Output Power@DH5 2402MHz
Output Power@DH5 2441MHz
0.5
6.5
Output Power@DH5 2480MHz
Frequency range
2402
2480
20dB bandwidth
950
1000
Adjacent Channel Power *1
(a) [M-N] =2
-20
(b) [M-N] ≥3
-40
Modulation characteristics
(a) Modulation Δf1avg
140
175
(b) Modulation Δf2max
115
© Modulation Δf2avg / Δf1avg
0.8
Carrier Frequency Drift
(a) 1slot
-25
+25
(b) 3slot / 5slot
-40
+40
© Maximum drift rate
20
EDR Output Power@2DH5
7.5
EDR Output Power@3DH5
EDR Relative Power
-4
+1
EDR Carrier Frequency Stability and
Modulation Accuracy
(a) ωi
-75
+75
(b) ωi+ωo
-75
+75
(c) ωo
-10
+10
(d) RMS DEVM (DQPSK)
20
(e) Peak DEVM (DQPSK)
35
(f) 99% DEVM (DQPSK)
30
(g) RMS DEVM (8DPSK)
13
(h) Peak DEVM (8DPSK)
25
(i) 99% DEVM (8DPSK)
20
Spurious Emissions
-36
(a) 10MHz≦f<2387MHz
-30
(b) 2387MHz≦f<2400MHz
-47
(c) 2483.5MHz
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unit
mA
mA
mA
mA
mA
mA
Unit
dBm
dBm
dBm
MHz
MHz
dBm
dBm
kHz
kHz
kHz
kHz
kHz/50us
dBm
dBm
dB
kHz
kHz
kHz
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
dB
(c) 2MHz
(d) 3MHz
Maximum Input Level (BER<0.1%)
Preliminary Specification Number : SP-ZZ1PJ-331-J
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-30
dB
-40
dB
-20
dBm
*1: Up to three spurious responses within Bluetooth limits are allowed.
*2: Up to five spurious responses within Bluetooth limits are allowed.
15.9.
DC/RF Characteristics for Bluetooth (LE)
Conditions : 25deg.C,
VDD_3P3,VDDIO_SDIO,VDDIO_GPIO1,VDDIO_GPIO2,VDDIO_XTAL,VDDIO_AO=3.3V
Items
Contents
Bluetooth specification (power class)
Version 4.1(LE)
Channel frequency (spacing)
2402 to 2480 MHz (2MHz)
Number of RF Channel
40
Item / Condition
Min.
Typ.
Max.
Center Frequency
2402
2480
Channel Spacing
Number of RF channel
40
Output power 2402MHz
Output power 2440MHz
0.5
6.5
Output power 2480MHz
Modulation Characteristics
1) Δf1avg
225
275
2) Δf2max (at 99.9%)
185
3) Δf2avg / Δf1avg
0.8
Carrier frequency offset and drift
1) Frequency offset
150
2) Frequency drift
50
3) Drift rate
20
Receiver sensitivity (PER < 30.8%)
-70
Maximum input signal level (PER < 30.8%)
-10
PER Report Integrity (-30dBm input)
50
65.4
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Unit
MHz
MHz
dBm
dBm
dBm
kHz
kHz
kHz
kHz
kHz
dBm
dBm
Preliminary Specification Number : SP-ZZ1PJ-331-J
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16. LAND PATTERN (TOP VIEW)

***Stencil design:
For 0.3×0.55mm electrodes, stencil pad is 0.24mm*0.44mm and should put in the center of the each
conductor.
For 0.8×0.8mm electrodes, stencil pad is 0.66mm*0.66mm and should put in the center of the each
conductor.
***This is based on Murata’s condition using the thickness of the stencil 100 um.
So this is just the recommendation and needs to modify based on your condition.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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17. REFERENCE CIRCUIT
C6
L1
1.5uH
TOLERANCE = 20%
C7
1uF
C3
R14
10K
OQW
R6
10K
VDDIO_AO
R5
10K
LBEE5ZZ1PJ-331
32KHZ_CLK_IN
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
SDIO_CMD
SDIO_CLK
SDIO_INTERRUPT_L
VDDIO_SDIO
VDDIO_XTAL
VDDIO_GPIO1
VDDIO_GPIO2
VDDIO_AO
VDD_3P3
GND
PWM_PM
VDD11_PM
VBUCK_GND_PM
R4
10K
VDDIO_GPIO2
41
12
36
37
16
42
VDDIO_AO
R15 VDDIO_SDIO
NU
VDDIO_XTAL
VDDIO_GPIO2
VDDIO_GPIO1
47uF
R13
NU
10
11
13
15
LTE_UART_TXD
LTE_UART_RXD
Notes for the power supply voltage:
1uF
C11
R12
NU
VDD_3V3
1. VDD_3V3 is powered by 3.3V typically.
2. VDDIO_AO, VDDIO_GPIO1, VDDIO_GPIO2, VDDIO_XTAL,
VDDIO_SDIO can be powered by 1.8V or 3.3V.
It should match the VIO voltage from host.
For the each I/O voltage group of 1PJ module, please
refer to 1PJ module datasheet.
C5
VDDIO_GPIO1
2.2uF
VDDIO_AO
C4
VDD_3V3
10uF
C10
0.1uF
VDDIO_SDIO
C9
10uF
VDDIO_XTAL
C8
1uF
VDDIO_GPIO2
1uF
R11
NU
VDDIO_SDIO
R10
10K
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
SDIO_CMD
SDIO_CLK
WL_DEV_WAKEUP_HOST
32KHz Clock in
VDDIO_GPIO2
R3
10K
25
24
23
22
21
20
19
27
28
29
30
26
34
33
32
31
R9
10K
R17 0R
R2
R16 0R
27
R8
SW1
SKQY A
J1
CON2
J2
SKQY A
CON2
SW2
J3
SMA connector
RF-SOCKET_0
0.1uF
C2
R7
10K
VDDIO_AO
0.1uF
C1
R1
10K
VDDIO_AO
27
C13
NU
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Murata(China) Investment Co., Ltd.
BT Reset
BT_EN
WLAN_EN
WLAN Reset
BT_UART_RXD
BT_UART_TXD
BT_UART_RTS
BT_UART_CTS
NU
C12
BT_HOST_WAKEUP_DEV/3D_FRAME_SY NC
BT_PCM_OUT
BT_PCM_IN
BT_PCM_SY NC
BT_PCM_CLK
VDDIO_GPIO1
BT_DEV_WAKEUP_HOST
BT_EN
WLAN_EN
PCM_OUT
PCM_IN
PCM_SY NC
PCM_CLK
3D_FRAME_SY NC
HCI_UART_RXD
HCI_UART_TXD
HCI_UART_RTS
HCI_UART_CTS
GND
ANT
GND
2G_WIFI/BT_RF_IN
GND
2G_WIFI/BT_RF_OUT
GND
GND
35
GND
38
WLAN_RF_KILL_L
18
WLAN_RF_KILL_L
17
HCI_UART_WAKEHOST
GND
43
40
39
BT_EN
WLAN_EN
CLK_REQ
45
44
CLK_REQ
46
LTE_UART_TXD
LTE_UART_RXD
DBG_UART_RXD
DBG_UART_TXD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
49
QOW
48
47
DBG_UART_RXD
DBG_UART_TXD
58
57
56
55
54
53
52
51
59
60
61
62
50
GND
GND
14
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18. TAPE AND REEL PACKING
(1) Dimensions of Tape (Plastic tape)
Feeding direction
Unit: mm
P0
16+/-0.2
7.5+/-0.1
0.3+/-0.05
1.75+/-0.1
12+/-0.1
4+/-0.1
P2
A0
B0
K0
D0
D1
W1
W2
25.5 +/-1.0
29.5 +/-1.0
2+/-0.1
7.8+/-0.1
7.6+/-0.1
1.25+/-0.1
1.5+0.1/-0
1.5+/-0.1
(2) Dimensions of Reel
Unit: mm
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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(3) Taping Diagrams
[1] Feeding Hole :
[2] Hole for chip :
[3] Cover tape
[4] Base tape
[3]
As specified in (1)
As specified in (1)
62 um in thickness
As specified in (1)
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
(4) Leader and Tail tape
Tail tape
(No components) Components
No components
Leader tape
(Cover tape alone)
160 to 190 mm
150mm min.
250 mm min.
Feeding direction
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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-The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
-The cover tape and base tape are not adhered at no components area for 250 mm min.
-Tear off strength against pulling of cover tape: 5 N min.
-Packaging unit: 1000 pcs/ reel
- Material: Base tape: Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.1 N max. in the direction of peeling as shown below.
1.1 N max.
165 to 180 °
Cover tape
Base tape
- PACKAGE (Humidity proof packing)
Desiccant
Caution
label
Certification
label
Humidity
Indicator
表Label
示ラ ベル
Anti-humidity
Plastic Bag
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the
humidity indicator.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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- Box
Box for plastic bag: 90 x 350 x 350 mm
Carton box: 390 x 380 x 380 mm
5 boxes for plastic bag are stored to a carton box as below.
- Label
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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19. NOTICE
19.1.
Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
19.2.
Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
19.3.
Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of
products may vary depending on the pattern drawing method, grounding method, land dimensions,
land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to
verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
19.4.
Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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19.5.
Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions(Example)
Within 3s
235 to 245 deg.C
220 deg.C
Cooling down
Slowly
180 deg.C
150 deg.C
Pre-heating
Within 120s
Within 60s
time(s)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
19.6.
Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not permitted.
19.7.
Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the
similar conditions to the above-mentioned. However, if products are used under the following
circumstances, it may damage products and leakage of electricity and abnormal temperature may
occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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static electricity or excessive voltage while assembling and measuring.
19.8.
Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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20. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the
specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that
our product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications
provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such
products, which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY
ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention
of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,
if you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by
the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right,
copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in
which our products or services are used. Information provided by us regarding third-party products or services does not
constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such
information may require a license from a third party under the patents or other intellectual property of the third party, or a
license from us under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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Appendix
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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LBEE5ZZ1PJ Installation Manual (FCC)
FCC ID of this module is as follows;
FCC ID:
VPYLBEE5ZZ1PJ
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statement required by FCC on the product and in
the installation manual Notice.
Contents
1. Theory of operation
2. Antenna
3. Notice
1. Theory of operation
Frequency of operation
Scan
2.4GHz
Active
Active
Active
Active
Active
Passive
Passive
Passive
Passive
Passive
Passive
Active
Active
Active
802.11b/g/n-HT20
2412MHz – 2462MHz (ch1 – ch11)
802.11n-HT40
2422MHz – 2452MHz (ch3 – ch9)
W52
802.11a/n-HT20/ac-VHT-20 5180MHz – 5240MHz (ch36 – ch48)
802.11n-HT40/ac-VHT-40
5190MHz – 5239MHz (ch38 – ch46)
802.11ac-VHT80
5210MHz (ch42)
W53
802.11a/n-HT20/ac-VHT-20 5260MHz – 5320MHz (ch52 – ch64)
802.11n-HT40/ac-VHT-40
5270MHz – 5310MHz (ch54 – ch62)
802.11ac-VHT80
5290MHz (ch58)
W56
802.11a/n-HT20/ac-VHT-20 5500MHz – 5720MHz (ch100 – ch144)
802.11n-HT40/ac-VHT-40
5510MHz – 5710MHz (ch102 – ch142)
802.11ac-VHT80
5530MHz – 5690MHz (ch106 – ch138)
W58
802.11a/n-HT20/ac-VHT-20 5745MHz – 5825MHz (ch149 – ch165)
802.11n-HT40/ac-VHT-40
5755MHz – 5795MHz (ch151 – ch159)
802.11ac-VHT80
5775MH (ch155)
The device cannot operate in 5600MHz~5650MHz band in Canada
Ad-hoc
mode
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
Yes
Yes
Yes
Compliance with FCC requirement 15.407(c)
Data transmission is always initiated by software, which is the passed down through the MAC, through
the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the
MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then
turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets is being transmitted. In other words, this device automatically discontinue
transmission in case of either absence of information to transmit or operational failure.
Frequency Tolerance: ± 20ppm
End users cannot modify the software because F/W & driver are installed in device.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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2. Antenna
■Please refer to KDB 996369
■Please perform the antenna design that followed the specifications of the antenna.
■About the signal line between an antenna and a module
It is a 50-ohm line design.
Fine tuning of return loss etc. can be performed using a matching network.
However, it is required to check "Class1 change" and "Class2 change" which the authorities define
then.
The concrete contents of a check are the following three points.
1) It is the same type as the antenna type of antenna specifications.
2) An antenna gain is lower than a gain given in antenna specifications.
3) The emission level is not getting worse.
■50-ohm feed line(microstrip line length)
Antenna type
50-ohm feed line length
Antenna
2.4GHz Monopole PCB Antenna
5GHz Monopole PCB Antenna
We test it at 26.4mm as a representative
3. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and
in the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains Transmitter Module FCC ID: VPYLBEE5ZZ1PJ
or
Contains FCC ID: VPYLBEE5ZZ1PJ
●Please describe the following warning to the manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void
the user’s authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or
transmitter.
※When the product is small, as for these words mentioned above, the posting to a manual is possible.
●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's
grant of authorization. Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3) The use of an antenna with gain less than 2.0 dBi(2.4GHz), 2.0 dBi(5.15~5.35GHz), 1.2 dBi
(5.47~5.725GHz) and 1.0 dBi (5.725~5.85GHz).
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer
considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining
a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled
in a visible area with the following: “Contains FCC ID: VPYLBEE5ZZ1PJ”. The grantee's FCC ID can be
used only when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
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Preliminary Specification Number : SP-ZZ1PJ-331-J
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LBEE5ZZ1PJ Installation Manual (IC)
IC No. of this device is as follows;
IC:
772C-LBEE5ZZ1PJ
For OEM integration only – device cannot be sold to general public.
Therefore, we will ask OEM to include the following statements required by IC on the product and in the
installation manual Notice.
Contents
1. Theory of operation
2. Antenna
3. Notice
1. Theory of operation
Frequency of operation
Scan
2.4GHz
Active
Active
Active
Active
Active
Passive
Passive
Passive
Passive
Passive
Passive
Active
Active
Active
802.11b/g/n-HT20
2412MHz – 2462MHz (ch1 – ch11)
802.11n-HT40
2422MHz – 2452MHz (ch3 – ch9)
W52
802.11a/n-HT20/ac-VHT-20 5180MHz – 5240MHz (ch36 – ch48)
802.11n-HT40/ac-VHT-40
5190MHz – 5239MHz (ch38 – ch46)
802.11ac-VHT80
5210MHz (ch42)
W53
802.11a/n-HT20/ac-VHT-20 5260MHz – 5320MHz (ch52 – ch64)
802.11n-HT40/ac-VHT-40
5270MHz – 5310MHz (ch54 – ch62)
802.11ac-VHT80
5290MHz (ch58)
W56
802.11a/n-HT20/ac-VHT-20 5500MHz – 5720MHz (ch100 – ch144)
802.11n-HT40/ac-VHT-40
5510MHz – 5710MHz (ch102 – ch142)
802.11ac-VHT80
5530MHz – 5690MHz (ch106 – ch138)
W58
802.11a/n-HT20/ac-VHT-20 5745MHz – 5825MHz (ch149 – ch165)
802.11n-HT40/ac-VHT-40
5755MHz – 5795MHz (ch151 – ch159)
802.11ac-VHT80
5775MH (ch155)
The device cannot operate in 5600MHz~5650MHz band in Canada
Ad-hoc
mode
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
Yes
Yes
Yes
Data transmission is always initiated by software, which is the passed down through the MAC, through
the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the
MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then
turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets is being transmitted. In other words, this device automatically discontinue
transmission in case of either absence of information to transmit or operational failure.
La transmission des données est toujours initiée par le logiciel, puis les données sont transmises par
'intermédiaire du MAC, par la bande de base numérique et analogique et, enfin, à la puce RF. Plusieurs
paquets spéciaux sont initiés par le MAC. Ce sont les seuls moyens pour qu'une partie de la bande de
base numérique active l'émetteur RF, puis désactive celui-ci à la fin du paquet. En conséquence,
l'émetteur reste uniquement activé lors de la transmission d'un des paquets susmentionnés. En
d'autres termes, ce dispositif interrompt automatiquement toute transmission en cas d'absence
d'information à transmettre ou de défaillance.
End users cannot modify the software because F/W & driver are installed in device.
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2. Antenna
■Please refer to KDB 996369
■Please perform the antenna design that followed the specifications of the antenna.
■About the signal line between an antenna and a module
It is a 50-ohm line design.
Fine tuning of return loss etc. can be performed using a matching network.
However, it is required to check "Class1 change" and "Class2 change" which the authorities define
then.
The concrete contents of a check are the following three points.
1) It is the same type as the antenna type of antenna specifications.
2) An antenna gain is lower than a gain given in antenna specifications.
3) The emission level is not getting worse.
■50-ohm feed line(microstrip line length)
Antenna type
50-ohm feed line length
Antenna
2.4GHz Monopole Antenna
5GHz Monopole Antenna
We test it at 6.15mm as a representative
3. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in the
Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains IC: 772C-LBEE5ZZ1PJ
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts
de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage;
2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
*When the product is small, as for these words mentioned above, the posting to a manual is possible.
5150-5250 MHz band is restricted to indoor operation only.
La bande 5150-5250 MHz est restreinte à une utilisation à l’intérieur seulement.
High-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and
5650-5850
MHz and that these radars could cause interference and/or damage to LE-LAN devices.
Les radars de haute puissance sont désignés utilisateurs principaux (c.-à-d., qu'ils ont la priorité) pour les
bandes 5250-5350 MHz et 5650-5850 MHz, et ces radars pourraient causer du brouillage et/ou des
dommages aux dispositifs LAN-EL.
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and
meets RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un environnement
non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF) CNR-102 de l’IC. Cet
équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus entre le radiateur et le corps
humain.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's grant of
authorization.
Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used within
20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
This device is intended only for OEM integrators under the following conditions: (For module
device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3) The use of an antenna with gain less than 2.0 dBi (2.4GHz), 2.0dBi (5.15~5.35GHz), 1.2dBi
(5.47~5.725GHz) and 1.0dBi (5.725~5.85GHz).
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
(Pour utilisation de dispositif module)
1)L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et
les utilisateurs, et
2)Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 3 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour
toutes exigences de conformité supplémentaires requis pour ce module installé.
Data transmission is always initiated by software, which is the passed down through the MAC, through
the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the
MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then
turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets is being transmitted. In other words, this device automatically discontinue
transmission in case of either absence of information to transmit or operational failure.
La transmission des données est toujours initiée par le logiciel, puis les données sont transmises par
'intermédiaire du MAC, par la bande de base numérique et analogique et, enfin, à la puce RF. Plusieurs
paquets spéciaux sont initiés par le MAC. Ce sont les seuls moyens pour qu'une partie de la bande de
base numérique active l'émetteur RF, puis désactive celui-ci à la fin du paquet. En conséquence,
l'émetteur reste uniquement activé lors de la transmission d'un des paquets susmentionnés. En
d'autres termes, ce dispositif interrompt automatiquement toute transmission en cas d'absence
d'information à transmettre ou de défaillance.
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
Preliminary Specification Number : SP-ZZ1PJ-331-J
44 / 44
IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or
co-location with another transmitter), then the Canada authorization is no longer considered valid and
the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada
n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et
'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled
in a visible area with the following: “Contains IC: 772C-LBEE5ZZ1PJ ”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut
être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les
utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante:
"Contient des IC: 772C-LBEE5ZZ1PJ ".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la
façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui
intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et
avertissements comme indiqué dans ce manuel.
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
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Producer                        : Microsoft® Word 2010
Creator                         : MM04133
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Create Date                     : 2018:12:18 09:51:07+08:00
Modify Date                     : 2018:12:18 09:51:07+08:00
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Part                            : 1
Conformance                     : A
Author                          : MM04133
EXIF Metadata provided by EXIF.tools
FCC ID Filing: VPYLBEE5ZZ1PJ

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