NXP Laboratories UK JN5148M6 JN5148-001-M06 IEEE802.15.4 Wireless Module User Manual JN DS JN5148 001 Myy

NXP Laboratories UK Ltd JN5148-001-M06 IEEE802.15.4 Wireless Module JN DS JN5148 001 Myy

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Data Sheet: JN5148-001-Myy

JenNet, ZigBee PRO and IEEE802.15.4 Module

JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

Features: Module

• 2.4GHz IEEE802.15.4, JenNet and

ZigBee PRO compatible

• JN5148-001-M00/03

up to 1km range (Ext antenna)

M00: integral antenna 18x32mm

M03: uFl connector 18x30mm

o TX power +2.5dBm

o Receiver sensitivity –95dBm

o TX current 15mA

o RX current 17.5mA

o 2.3-3.6V operation

• JN5148-001-M06

up to 4km range (Ext Antenna)

o 22dBm TX Power

o 18dBm TX power (M04

compatible)

o Receiver sensitivity -100dBm

o uFl connector

o TX current 84mA

o RX current 23mA

o 18x41mm

o 2.3-3.6V operation

Features: Microcontroller

• 32-bit RISC CPU, up to 32MIPs with

low power

• 128kB ROM stores system code

• 128kB RAM stores system data and

bootloaded program code

• 4Mbit serial flash for program code

and data

• On chip OTP efuse

• JTAG debug interface

• 4-input 12-bit ADC, 2 12-bit DACs, 2

comparators

• 3 application timer/counters,

• 2 UARTs

• SPI port with 5 selects

• 2-wire serial interface

• 4-wire digital audio interface

• Watchdog timer

• Up to 21 DIO

Industrial temp (-40°C to +85°C)

Lead-free and RoHS compliant

Overview

The JN5148-001-Myy family is a range of ultra low power, high performance surface

mount modules targeted at JenNet and ZigBee PRO networking applications,

enabling users to realise products with minimum time to market and at the lowest

cost. They remove the need for expensive and lengthy development of custom RF

board designs and test suites. The modules use NXP’s JN5148 wireless

microcontroller to provide a comprehensive solution with large memory, high CPU

and radio performance and all RF components included. All that is required to

develop and manufacture wireless control or sensing products is to connect a power

supply and peripherals such as switches, actuators and sensors, considerably

simplifying product development.

Three module variants are available: JN5148-001-M00 with an integrated antenna,

JN5148-001-M03 with an antenna connector and the JN5148-001-M06 with an

antenna connector, power amplifier and LNA for extended range. The modules can

implement networking stacks such as JenNet and ZigBee PRO, as well as customer

applications

Module Block Diagram

Benefits

• Microminiature module solutions

• Ready to use in products

• Minimises product development

time

• No RF test required for systems

• Compliant with FCC part 15

rules, IC Canada RSS 210e,

ETSI EN 300-328

Applications

• Robust and secure low power

wireless applications

• ZigBee PRO and JenNet

networks

• Home and commercial building

automation

• Utilities metering (e.g. AMR)

• Location Aware services (e.g.

Asset Tracking)

• Toys and gaming peripherals

• Industrial systems

• Telemetry

• Remote Control

Timers

UARTs

12-bit ADC,

comparators

12-bit DACs,

temp sensor

2-wire serial

SPI

RAM

128kB

128-bit AES

Encryption

Accelerator

2.4GHz

Radio

ROM

128kB

RISC CPU

Power

Management

XTAL

O-QPSK

Modem

IEEE802.15.4

MAC

Accelerator

512kB Serial

Flash Memory

JN5148 chip

Power

Matching

uFl

Connector

Matching

Integrated Antenna

Matching

uFl

Connector PA / LNA

External

Antenna

M00 Option

M03 Option

M06 Option

4-Wire Audio

Sleep Counters

32-byte

OTP eFuse

Watchdog timer

Time of Flight

Engine

ii JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

Contents

1. Introduction 3

1.1. Variants 3

1.2. Regulatory Approvals 3

2. Specifications 4

3. Product Development 6

3.1. JN5148 Single Chip Wireless Microcontroller 6

4. Pin Configurations 7

4.1. Pin Assignment 8

4.2. Pin Descriptions 9

4.2.1 Power Supplies 9

4.2.2 SPI Memory Connections 9

5. Electrical Characteristics 10

5.1. Maximum Ratings 10

5.2. Operating Conditions 10

Appendix A Additional Information 11

A.1 Outline Drawing 11

A.2 Module PCB Footprint 14

A.3 Manufacturing 15

A.3.1 Reflow Profile 15

A.3.2 Soldering Paste and Cleaning 15

A.4 Ordering Information 16

A.5 Tape and Reel Information: 17

A.5.1 Tape Orientation and dimensions 17

A.5.2 Cover tape details 17

A.5.3 Leader and Trailer 18

A.5.4 Reel Dimensions: 18

A.6 Related Documents 18

A.7 Federal Communication Commission Interference Statement 19

A.7.1 Antennas approved by FCC for use with JN5148 modules 20

A.7.2 High Power Module usage limitation 20

A.7.3 FCC End Product Labelling 20

A.8 Industry Canada Statement 21

A.8.1 Industry Canada End Product Labelling 21

A.9 European R & TTE Directive 1999/5/EC Statement 21

A.10 RoHS Compliance 22

A.11 Status Information 22

A.12 Disclaimers 22

Version Control 23

1. Introduction

The JN5148-001-Myy module family provides designers with a ready made component that provides a fully

integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],

including JenNet and ZigBee PRO, and can be quickly and easily included in product designs. The modules

integrate all of the RF components required, removing the need to perform expensive RF design and test. Products

can be designed by simply connecting sensors and switches to the module IO pins. The modules use NXP’s single

chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip development

support material. Hence, this range of modules allows designers to bring wireless applications to market in the

minimum time with significantly reduced development effort and cost.

Three variants are available: JN5148-001-M00 (standard module with integral antenna), JN5148-001-M03 (standard

module with uFl connector for use with external antennae) and JN5148-001-M06 (high RF power with uFL connector,

improved sensitivity module for evaluation of extended range applications). All modules have FCC modular

approvals, CE approval and are compliant with EU regulations. The variants available are described below.

1.1. Variants

1.2. Regulatory Approvals

All module types have been tested against the requirements of the following European standards. For the Radio, EN

300 328 v1.7.1. EMC, EN 301 489-17 v2.1.1 and the Basic Safety Assessment (BSA) EN 60950-1:2006, a Notified

Body statement of opinion for this standard is available on request. The High Power module with M06 suffix is

approved for use in Europe with reduced output power: +10dBm EIRP is the maximum permitted in Europe.

Additionally, all module types have received FCC “Modular Approvals”, in compliance with CFR 47 FCC part 15

regulations and in accordance to FCC Public notice DA00-1407, appendix A.7 contains details on the conditions

applying to this modular approval. The modules are approved for use with a range of different antennas; further

details of which can be found in section Appendix A.6.1. The modular approvals notice and test reports are available

on request.

The high power module variant is classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used at a

distance of less than 20 cm (8”) from any person.

In addition, all modules have Industry Canada modular approval and RSS210e Issue 7 (June 2007) certification.

Variant Description FCCID Industry Canada ID

JN5148-001-M00 Standard Power, integrated antenna TYOJN5148M0 IC: 7438A-CYO5148M0

JN5148-001-M03 Standard Power, uFl connector TYOJN5148M3 IC: 7438A-CYO5148M3

JN5148-001-M06 High Power, uFl connector TYOJN5148M6 IC: 7438A-CYO5148M6

4 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

2. Specifications

Most specification parameters for the modules are specified in the chip datasheet - JN-DS-JN5148 Wireless

Microcontroller Datasheet, [2]. Where there are differences, the parameters are defined here.

VDD=3.0V @ +25°C

Typical DC Characteristics

Notes

JN5148-001-

M00/03

JN5148-001-

M06

Deep sleep current

1.3uA

120nA

Sleep current

2.6uA

1.25uA

With active sleep timer

Radio transmit current (M04 Compatibility Mode)

15mA

84mA

CPU in doze, radio transmitting

Radio transmit current

178mA

CPU in doze, radio transmitting

Radio transmit current (ETSI Mode)

48mA

CPU in doze, radio transmitting

Radio receive current

17.5mA

23mA

CPU in doze, radio receiving

Centre frequency accuracy +/-25ppm +/-25ppm Additional +/-15ppm allowance for

temperature and ageing

Typical RF Characteristics

Notes

Receive sensitivity -95dBm -100dBm

Nominal for 1% PER, as per

802.15.4 section 6.5.3.3 (Note 1)

Transmit power (M04 Compatibility Mode)

+2.5dBm

+18dBm

Nominal (Note 2)

Transmit power

+22dBm

Nominal

Transmit power (ETSI Mode)

+8dBm/MHz

Nominal (Note 3)

Maximum input signal +5dBm -5dBm For 1% PER, measured as

sensitivity

RSSI range -95 to -10

dBm

-105 to -20

dBm

RF Port impedance – uFl connector

50 ohm

2.4 - 2.5GHz

Rx Spurious Emissions

-61dBm

-69dBm

Measured conducted into 50ohms

Tx Spurious Emissions

-40dBm

-49dBm

Measured conducted into 50ohms

VSWR (max)

2:1

2.4 - 2.5GHz

Peripherals

Notes

Master SPI port

5 selects

3 selects

250kHz - 16MHz

Slave SPI port 



250kHz - 8MHz

Two UARTs



16550 compatible

Two-wire serial I/F (compatible with SMbus & I2C)



Up to 400kHz

Three programmable Timer/Counters with

capture/compare facility, Tick timer



16MHz clock

Two programmable Sleep Timers



32kHz clock

Digital IO lines (multiplexed with UARTs, timers

and SPI selects)

Four channel Analogue-to-Digital converter 



12-bit, up to 100ks/s

Two channel Digital-to-Analogue converter



12-bit, up to 100ks/s

Two programmable analogue comparators



Ultra low power mode for sleep

Internal temperature sensor and battery monitor



The performance of all peripherals is defined in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2]

Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated

antenna have approximately 4 dB less e.i.r.p and reciprocal receive sensitivity.

Note 2: It is possible to operate the M06 module with similar output power to the JN5148-001-M04 modules by

implementing a small change in the software as provided in the latest SDK.

Note 3: ETSI mode is achieved through a software setting as provided in the latest SDK. Note that this is different to

the equivalent setting for the JN5148-001-M04.

6 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

3. Product Development

NXP supplies all the development tools and networking stacks needed to enable end-product development to occur

quickly and efficiently. These are all freely available from www.nxp.com/jennic. A range of evaluation/developer kits

is also available, allowing products to be quickly bread boarded. Efficient development of software applications is

enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the

IEEE802.15.4 MAC and the JenNet and ZigBee PRO network stacks, this package provides everything required to

develop application code and to trial it with hardware representative of the final module.

The modules can be user programmed both in development and in production using software supplied by NXP.

Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This

information is available on the NXP support website, together with many example applications, user guides, reference

manuals and application notes.

3.1. JN5148 Single Chip Wireless Microcontroller

The JN5148-001-Myy series is constructed around the JN5148-001 single chip wireless microcontroller, which

includes the radio system, a 32-bit RISC CPU, ROM and RAM memory and a range of analogue and digital

peripherals.

The chip is described fully in JN-DS-JN5148 Wireless Microcontroller Datasheet [2].

The module also includes a 4Mbit serial flash memory, which holds the application code that is loaded into the

JN5148 during the boot sequence and provides static data storage, required by the application.

4. Pin Configurations

ADC4

DAC1

DAC2

COMP2+

COMP2-

SPICLK

SPIMISO

SPIMOSI

SPISSZ

DIO0

DIO1

DIO2

SPISSM

SPISWP

DIO3

DIO4

DIO5

DIO6

DIO7

DIO8

DIO9

DIO10

DIO11

VDD

GND

VSSA

ADC3

ADC2

ADC1

DIO20

DIO19

DIO18

DIO17

DIO16

DIO15

RESETN

DIO14

DIO13

DIO12

17 18 19 20 21 22 23 24 25 26

COMP1+

COMP1-

NC VREF

Figure 1: Pin Configuration (top view)

Note that the same basic pin configuration applies for all module designs. However, DIO3 (pin 15) and DIO2 (pin 12)

are not available on the high power modules (M06) and, the pins NC (pin 42) and VREF (pin 43) are not available on

the standard modules (M00 and M03).

8 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

4.1. Pin Assignment

Pin Functions Signal

Type

Description

Primary Alternate Functions

1 ADC4 3.3V Analogue to Digital Input

2 DAC1 3.3V DAC Output

3 DAC2 3.3V DAC Output

4 COMP2+ 3.3V Comparator 2 Input +ve

5 COMP2- 3.3V Comparator 2 Input -ve

6 SPICLK CMOS SPI Clock Output

7 SPIMISO CMOS SPI Master In Slave Out Input

8 SPIMOSI CMOS SPI Master Out Slave In Output

9 SPISSZ CMSO SPI Select From Module – SS0

Output

10 DIO0 SPISEL1 CMOS DIO0 or SPI Slave Select Output 1

11 DIO1 SPISEL2 PC0 CMOS DIO1, SPI Slave Select Output 2

or Pulse Counter0 Input

12 DIO2* SPISEL3 RFRX CMOS DIO2, SPI Slave Select Output 3

or Radio Receive Control Output

13 SPISSM CMOS SPI Select to FLASH (Input)

14 SPISWP CMOS FLASH Write Protect (Input)

15 DIO3* SPISEL4 RFTX CMOS DIO3, SPI Slave Select Output 4

or Radio Transmit Control Output

16 DIO4 CTS0 JTAG_TCK CMOS DIO4, UART 0 Clear To Send

Input or JTAG CLK

17 DIO5 RTS0 JTAG_TMS CMOS DIO5, UART 0 Request To Send

Output or JTAG Mode Select

18 DIO6 TXD0 JTAG_TDO CMOS DIO6, UART 0 Transmit Data

Output or JTAG Data Output

19 DIO7 RXD0 JTAG_TDI CMOS DIO7, UART 0 Receive Data Input

or JTAG Data Input

20 DIO8 TIM0CK_GT PC1 CMOS DIO8, Timer0 Clock/Gate Input or

Pulse Counter1 Input

21 DIO9 TIM0CAP 32KXTALIN 32KIN CMOS DIO9, Timer0 Capture Input, 32K

External Crystal Input or 32K

Clock Input

22 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or

32K External Crystal Output

23 DIO11 TIM1CK_GT TIM2OUT CMOS DIO11, Timer1 Clock/Gate Input or

Timer2 PWM Output

24 VDD 3.3V Supply Voltage

25 GND 0V Digital Ground

26 VSSA 0V Analogue Ground

27 DIO12 TIM1CAP ADO DAI_WS CMOS DIO12, Timer1 Capture Input,

Antenna Diversity or Digital Audio

Word Select

28 DIO13 TIM1OUT ADE DAI_SDIN CMOS DIO13, Timer1 PWM Output,

Antenna Diversity or Digital Audio

Data Input

29 RESETN CMOS Reset input

30 DIO14 SIF_CLK IP_CLK CMOS DIO14, Serial Interface Clock or

Intelligent Peripheral Clock Input

31 DIO15 SIF_D IP_DO CMOS DIO15, Serial Interface Data or

Intelligent Peripheral Data Out

32 DIO16 IP_DI

CMOS DIO16, Intelligent Peripheral Data

33 DIO17 CTS1 IP_SEL DAI_SCK JTAG_TCK CMOS DIO17, UART 1 Clear To Send

Input, Intelligent Peripheral Device

Select Input or Digital Audio Clock

or JTAG CLK

34 DIO18 RTS1 IP_INT DAI_SDOUT JTAG_TMS CMOS DIO18, UART 1 Request To Send

Output, Intelligent Peripheral

Interrupt Output or Digital Audio

Data Output or JTAG Mode Select

35 DIO19 TXD1 JTAG_TDO CMOS DIO19 or UART 1 Transmit Data

Output or JTAG Data Out

36 DIO 20 RXD1 JTAG_TDI CMOS DIO 20, UART 1 Receive Data

Input or JTAG data In

37 COMP1- 3.3V Comparator 1 Input -ve

38 COMP1+ 3.3V Comparator 1 Input +ve

39 ADC1 3.3V Analogue to Digital Input

40 ADC2 3.3V Analogue to Digital Input

41 ADC3 3.3V Analogue to Digital Input

42 VREF 3.3V Analogue Peripheral Reference

Voltage

43 NC

Do Not Connect

*: These two pins are not connected for High power modules

: These two pins are only used on the High power modules

4.2. Pin Descriptions

All pins behave as described in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2], with the exception of the

following:

4.2.1 Power Supplies

A single power supply pin, VDD is provided. Separate analogue (VSSA) and digital (GND) grounds are provided.

These should be connected together at the module pins.

4.2.2 SPI Memory Connections

SPISWP is a write protect pin for the serial flash memory. This should be held low to inhibit writes to the flash device.

SPISSZ is connected to SPI Slave Select 0 on the JN5148.

SPISSM is connected to the Slave Select pin on the memory.

This configuration allows the flash memory device to be programmed using an external SPI programmer if required.

For programming in this mode, the JN5148 should be held in reset by taking RESETN low. Two potential flash 4Mbit

memory devices may be used in the module, the Micron M25P40 and the Winbond W25X40BLSN.

The memory can also be programmed over the UART by using the flash programmer software provided by NXP. This

is available as part of the Software Developer kit and libraries available from www.nxp.com/jennic. To enter this

programming mode, SPIMISO (pin 7) should be held low whilst the chip is reset. Once programming has finished, the

chip should be reset, when it will execute the new code downloaded.

For normal operation of the module and programming over the UART, SPISSZ should be connected to

SPISSM.

10 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

5. Electrical Characteristics

In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in

the chip datasheet. Where there are differences, they are detailed below.

5.1. Maximum Ratings

Exceeding these conditions will result in damage to the device.

Parameter Min Max

Device supply voltage VDD

-0.3V

3.6V

Voltage on analogue pins VREF, ADC1-4, DAC1-2,

COMP1M, COMP1P, COMP2M, COMP2P, IBIAS

-0.3V

VDD + 0.3V

Voltage on 5v tolerant digital pins DIO0-DIO8 &

DIO11-20, RESETN

-0.3V Lower of (VDD + 2V) and

5.5V

Voltage on 3v tolerant digital pins DIO9, DIO10,

SPISSM, SPISWP, SPICLK, SPIMOSI, SPIMISO,

SPISSZ

-0.3V

VDD + 0.3V

Storage temperature

-40ºC

150ºC

5.2. Operating Conditions

Supply Min Max

VDD 2.3V 3.6V

Ambient temperature range -40ºC 85ºC

Appendix A Additional Information

A.1 Outline Drawing

32.2mm

18mm

2.76

2.54

1.27

Thickness: 3.5mm

Figure 2 JN5148-001-M00 Outline Drawing

12 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

30mm

18mm

2.76

2.54

6.58

9.76mm

1.27

Thickness: 3.5mm

Figure 3 JN5148-001-M03 Outline Drawing

40.5mm

18mm

2.76

2.54

1.27

2.54

4.05mm

7.2mm

Thickness: 3.5mm

Figure 4 JN5148-001-M06 Outline Drawing

14 JN-DS-JN5148-001-Myy 1v5 © NXP Laboratories UK 2012

A.2 Module PCB Footprint

All dimensions are in mm.

2.49

2.23

1.27

17.42

1.5

Ø1

* *

Note: All modules have the same footprint except for the M06 which has 2 additional pins marked with a *

Figure 5 Module PCB footprint

RF note for –M00 modules with integral antenna: No components, ground plane or tracks on any layer of the

mother board should be placed within 20mm of the 3 free sides of the antenna. Tracks etc may be placed

adjacent to the can, but should not extend past the can towards the antenna end of the module for 20mm

from the antenna.

A.3 Manufacturing

A.3.1 Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste

manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.

Figure 6: Recommended solder reflow profile

A.3.2 Soldering Paste and Cleaning

NXP does not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed in

water) for the following reasons:

Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.

The module label could be damaged or removed.

NXP recommends use of a 'no clean' solder paste for all its module products.

Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp

(235ºC)

Target Time (s) 90~130 30~60 20~50 10~15 150~270

A.4 Ordering Information

Ordering Code Format:

Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or

Prototypes. Devices of this status have an Rx suffix after the module type to identify qualification status during these

product phases - for example, JN5148-001-M00R1T.

Part Number Ordering Code Description

JN5148-001-M00T JN5148-001-M/00T JN5148 module, variant as detailed above

JN5148-001-M03T JN5148-001-M/03T

JN5148-001-M06T JN5148-001-M/06T

Shipping

T Tape Mounted 500-piece reel

JN5148 - 001 – M / Y1Y2 Y3

Module Type

00 Standard Power, Integral antenna

03 Standard Power, uFl connector

06 High power, uFl connector

Label line 1: IC ID Number

Label line 2: FCC ID Number

Label line 3: Part Number

Label line 4: Barcode Label

Label line 5: YYWWTNNNNN (see below)

Identifier

Description

Format

Year

06 (example)

Week

45 (example)

Module type

NNNNN

Serial Number

Figure 8: Example module labelling for FCC approved modules

A.5 Tape and Reel Information:

A.5.1 Tape Orientation and dimensions

All dimensions are in mm

Module type: A B W F E P0 P1 P2 T Cover Tape

width (W)

JN5148-001-M00 18.4 32.6 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5

JN5148-001-M03 18.4 30.4 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5

JN5148-001-M06 18.5 40.9 56 26.2 1.75 4.0 2.0 24.0 3.4 49.5

Tolerance ±0.1 ±0.1 ±0.3 ±0.1 +0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1

A.5.2 Cover tape details

Thickness (T) 0.061mm

Surface resistivity (component side) 104 to 107 Ohms/sq

Surface resistivity (component side) Non-conductive

Backing type: Polyester

Adhesive type: PSA

Sealing: Room ambient

A.5.3 Leader and Trailer

300 MM300 MM

A.5.4 Reel Dimensions:

All dimensions are in mm.

Module type:

W (min)

JN5148-xxx-M00/03

330 ±1.0

2.2±0.5

13 ±0.2

100 +0.1

44.5 ±0.3

JN5148-xxx-M06

330 ±1.0

2.2±0.5

13 ±0.2

100 +0.1

56.5 ±0.3

A.6 Related Documents

[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

[2] JN-DS-JN5148 Wireless Microcontroller Datasheet

A.7 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15

of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

WARNING!

FCC Radiation Exposure Statement:

This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an

uncontrolled environment. To maintain compliance follow the instructions below;

1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.

This transmitter module is authorized to be used in other devices only by OEM integrators under the

following condition:

The transmitter module must not be co-located with any other antenna or transmitter.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end product for any additional compliance requirements required with this module

installed (for example, digital device emissions, PC peripheral requirements, etc.).

A.7.1 Antennas approved by FCC for use with JN5148 modules

Brand Model Number Description Gain (dBi) Connector type

1 Antenna Factor ANT-2.4-CW-RCT-RP Vertical - knuckle antenna 2.2 RP-SMA

2 Antennova 2010B6090-01 Vertical - knuckle antenna 2.2 RP-SMA

3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA

4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA

5 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA

6 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL

7 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA

8 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL

9 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA

10 Aveslink Technology, Inc E-0903-AX Embedded - nickel silver strip 2 None

11 Aveslink Technology, Inc E-0904-AX Embedded - nickel silver strip 2 None

12 Embedded Antenna Design

FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA

13 Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL

14 Laird Technologies WRR2400-IP04 Vertical - knuckle-flying lead 1.5 uFL

15 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA

16 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL

17 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA

These antennae or versions with alternative connectors may be used to meet European regulations.

This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi.

Antennas not included in this list or having a gain greater than 2.2 dBi are strictly prohibited for use with this device.

The required antenna impedance is 50 ohms.

A.7.2 High Power Module usage limitation

The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not

be used

at a distance of < 20 cm (8”) from any people.

IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with

another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the

final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate FCC authorization.

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this

RF module in the user manual of the end product.

The user manual for the end product must include the following information in a prominent location;

“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-

located or operating in conjunction with any other antenna or transmitter.”

A.7.3 FCC End Product Labelling

The final ‘end product’ should be labelled in a visible area with the following:

“Contains TX FCC ID: TYOJN5148M0, TYOJN5148M3 or TYOJN5148M6 ” to reflect the version of the module being

used inside the product.

A.8 Industry Canada Statement

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the

equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.

These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a

gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end-product for any additional compliance requirements required with this module

installed (for example, digital device emissions, PC peripheral requirements, etc).

A.8.1 Industry Canada End Product Labelling

For Industry Canada purposes the following should be used.

“Contains Industry Canada ID IC: 7438A-CYO5148M0, IC: 7438A-CYO5148M3 or IC: 7438A-CYO5148M4” to reflect

the version of the module being used inside the product.

A.9 European R & TTE Directive 1999/5/EC Statement

All modules listed in this datasheet are compliant with ETSI EN 300 328 V1.7.1 (2006-10), EMC, EN 301 489-17

v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006 (2006-06) and are subject to a Notified

Body Opinion.

The modules are approved for use with the antennas listed in the following table. The high power module M06 is

limited to an antenna with a gain of 2.2 dBi or less and is approved for use with a reduced output power: +10dBm

EIRP is the maximum permitted.