NXP Laboratories UK JN5148M6 JN5148-001-M06 IEEE802.15.4 Wireless Module User Manual JN DS JN5148 001 Myy

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Data Sheet: JN5148-001-Myy
JenNet, ZigBee PRO and IEEE802.15.4 Module
Overview
The JN5148-001-Myy family is a range of ultra low power, high performance surface
mount modules targeted at JenNet and ZigBee PRO networking applications,
enabling users to realise products with minimum time to market and at the lowest
cost. They remove the need for expensive and lengthy development of custom RF
board designs and test suites. The modules use NXP’s JN5148 wireless
microcontroller to provide a comprehensive solution with large memory, high CPU
and radio performance and all RF components included. All that is required to
develop and manufacture wireless control or sensing products is to connect a power
supply and peripherals such as switches, actuators and sensors, considerably
simplifying product development.
Three module variants are available: JN5148-001-M00 with an integrated antenna,
JN5148-001-M03 with an antenna connector and the JN5148-001-M06 with an
antenna connector, power amplifier and LNA for extended range. The modules can
implement networking stacks such as JenNet and ZigBee PRO, as well as customer
applications
Features: Module
•
•
•
512kB Serial
Flash Memory
JN5148 chip
Time of Flight
Engine
RAM
128kB
ROM
128kB
M00 Option
uFl
Connector
O-QPSK
Modem
Matching
uFl
Connector
PA / LNA
Matching
M06 Option
RISC CPU
Timers
Features: Microcontroller
UARTs
M03 Option
External
Antenna
SPI
2-wire serial
2.4GHz
Radio
Watchdog timer
Power
Management
IEEE802.15.4
MAC
Accelerator
32-byte
OTP eFuse
4-Wire Audio
•
32-bit RISC CPU, up to 32MIPs with
low power
•
128kB ROM stores system code
•
128kB RAM stores system data and
bootloaded program code
•
4Mbit serial flash for program code
and data
Sleep Counters
12-bit ADC,
comparators
128-bit AES
Encryption
Accelerator
12-bit DACs,
temp sensor
Power
Benefits
Applications
•
Microminiature module solutions
•
•
Ready to use in products
Robust and secure low power
wireless applications
•
Minimises product development
time
•
ZigBee PRO and JenNet
networks
•
•
No RF test required for systems
Compliant with FCC part 15
rules, IC Canada RSS 210e,
ETSI EN 300-328
JN5148-001-M06
up to 4km range (Ext Antenna)
o 22dBm TX Power
o 18dBm TX power (M04
compatible)
o Receiver sensitivity -100dBm
o uFl connector
o TX current 84mA
o RX current 23mA
o 18x41mm
o 2.3-3.6V operation
XTAL
Matching
JN5148-001-M00/03
up to 1km range (Ext antenna)
M00: integral antenna 18x32mm
M03: uFl connector 18x30mm
o TX power +2.5dBm
o Receiver sensitivity –95dBm
o TX current 15mA
o RX current 17.5mA
o 2.3-3.6V operation
Module Block Diagram
Integrated Antenna
2.4GHz IEEE802.15.4, JenNet and
ZigBee PRO compatible
•
On chip OTP efuse
•
JTAG debug interface
•
4-input 12-bit ADC, 2 12-bit DACs, 2
comparators
•
3 application timer/counters,
•
2 UARTs
Home and commercial building
automation
•
SPI port with 5 selects
•
•
2-wire serial interface
Utilities metering (e.g. AMR)
•
4-wire digital audio interface
•
Location Aware services (e.g.
Asset Tracking)
•
Watchdog timer
•
•
Up to 21 DIO
Toys and gaming peripherals
•
Industrial systems
•
•
Telemetry
Remote Control
•
JN-DS-JN5148-001-Myy 1v5
Industrial temp (-40°C to +85°C)
Lead-free and RoHS compliant
© NXP Laboratories UK 2012
Contents
1. Introduction
1.1.
1.2.
Variants
Regulatory Approvals
2. Specifications
3. Product Development
3.1.
JN5148 Single Chip Wireless Microcontroller
4. Pin Configurations
4.1.
4.2.
4.2.1
4.2.2
Pin Assignment
Pin Descriptions
Power Supplies
SPI Memory Connections
5. Electrical Characteristics
10
5.1.
Maximum Ratings
5.2.
Operating Conditions
Appendix A Additional Information
A.1 Outline Drawing
A.2 Module PCB Footprint
A.3 Manufacturing
A.3.1 Reflow Profile
A.3.2 Soldering Paste and Cleaning
A.4 Ordering Information
A.5 Tape and Reel Information:
A.5.1 Tape Orientation and dimensions
A.5.2 Cover tape details
A.5.3 Leader and Trailer
A.5.4 Reel Dimensions:
A.6 Related Documents
A.7 Federal Communication Commission Interference Statement
A.7.1 Antennas approved by FCC for use with JN5148 modules
A.7.2 High Power Module usage limitation
A.7.3 FCC End Product Labelling
A.8 Industry Canada Statement
A.8.1 Industry Canada End Product Labelling
A.9 European R & TTE Directive 1999/5/EC Statement
A.10 RoHS Compliance
A.11 Status Information
A.12 Disclaimers
Version Control
10
10
11
11
14
15
15
15
16
17
17
17
18
18
18
19
20
20
20
21
21
21
22
22
22
23
ii
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
1. Introduction
The JN5148-001-Myy module family provides designers with a ready made component that provides a fully
integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],
including JenNet and ZigBee PRO, and can be quickly and easily included in product designs. The modules
integrate all of the RF components required, removing the need to perform expensive RF design and test. Products
can be designed by simply connecting sensors and switches to the module IO pins. The modules use NXP’s single
chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip development
support material. Hence, this range of modules allows designers to bring wireless applications to market in the
minimum time with significantly reduced development effort and cost.
Three variants are available: JN5148-001-M00 (standard module with integral antenna), JN5148-001-M03 (standard
module with uFl connector for use with external antennae) and JN5148-001-M06 (high RF power with uFL connector,
improved sensitivity module for evaluation of extended range applications). All modules have FCC modular
approvals, CE approval and are compliant with EU regulations. The variants available are described below.
1.1. Variants
Variant
Description
FCCID
Industry Canada ID
JN5148-001-M00
Standard Power, integrated antenna
TYOJN5148M0
IC: 7438A-CYO5148M0
JN5148-001-M03
Standard Power, uFl connector
TYOJN5148M3
IC: 7438A-CYO5148M3
JN5148-001-M06
High Power, uFl connector
TYOJN5148M6
IC: 7438A-CYO5148M6
1.2. Regulatory Approvals
All module types have been tested against the requirements of the following European standards. For the Radio, EN
300 328 v1.7.1. EMC, EN 301 489-17 v2.1.1 and the Basic Safety Assessment (BSA) EN 60950-1:2006, a Notified
Body statement of opinion for this standard is available on request. The High Power module with M06 suffix is
approved for use in Europe with reduced output power: +10dBm EIRP is the maximum permitted in Europe.
Additionally, all module types have received FCC “Modular Approvals”, in compliance with CFR 47 FCC part 15
regulations and in accordance to FCC Public notice DA00-1407, appendix A.7 contains details on the conditions
applying to this modular approval. The modules are approved for use with a range of different antennas; further
details of which can be found in section Appendix A.6.1. The modular approvals notice and test reports are available
on request.
The high power module variant is classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used at a
distance of less than 20 cm (8”) from any person.
In addition, all modules have Industry Canada modular approval and RSS210e Issue 7 (June 2007) certification.
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
2. Specifications
Most specification parameters for the modules are specified in the chip datasheet - JN-DS-JN5148 Wireless
Microcontroller Datasheet, [2]. Where there are differences, the parameters are defined here.
VDD=3.0V @ +25°C
Typical DC Characteristics
Notes
JN5148-001M00/03
JN5148-001M06
Deep sleep current
1.3uA
120nA
Sleep current
2.6uA
1.25uA
With active sleep timer
Radio transmit current (M04 Compatibility Mode)
15mA
84mA
CPU in doze, radio transmitting
Radio transmit current
178mA
CPU in doze, radio transmitting
Radio transmit current (ETSI Mode)
48mA
CPU in doze, radio transmitting
17.5mA
23mA
CPU in doze, radio receiving
+/-25ppm
+/-25ppm
Radio receive current
Centre frequency accuracy
Additional +/-15ppm allowance for
temperature and ageing
Typical RF Characteristics
Notes
Receive sensitivity
-95dBm
-100dBm
Nominal for 1% PER, as per
802.15.4 section 6.5.3.3 (Note 1)
Transmit power (M04 Compatibility Mode)
+2.5dBm
+18dBm
Nominal (Note 2)
Transmit power
+22dBm
Nominal
Transmit power (ETSI Mode)
+8dBm/MHz
+5dBm
-5dBm
-95 to -10
dBm
-105 to -20
dBm
RF Port impedance – uFl connector
50 ohm
50 ohm
2.4 - 2.5GHz
Rx Spurious Emissions
-61dBm
-69dBm
Measured conducted into 50ohms
Tx Spurious Emissions
-40dBm
-49dBm
Measured conducted into 50ohms
2:1
2:1
Maximum input signal
RSSI range
VSWR (max)
Nominal (Note 3)
For 1% PER, measured as
sensitivity
2.4 - 2.5GHz
Peripherals
Notes
Master SPI port
5 selects
3 selects
250kHz - 16MHz
Slave SPI port


250kHz - 8MHz
Two UARTs


16550 compatible
Two-wire serial I/F (compatible with SMbus & I C)


Up to 400kHz
Three programmable Timer/Counters with
capture/compare facility, Tick timer


Two programmable Sleep Timers


Digital IO lines (multiplexed with UARTs, timers
and SPI selects)
21
19
Four channel Analogue-to-Digital converter


12-bit, up to 100ks/s
Two channel Digital-to-Analogue converter


12-bit, up to 100ks/s
JN-DS-JN5148-001-Myy 1v5
16MHz clock
32kHz clock
© NXP Laboratories UK 2012
Two programmable analogue comparators


Internal temperature sensor and battery monitor


Ultra low power mode for sleep
The performance of all peripherals is defined in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2]
Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated
antenna have approximately 4 dB less e.i.r.p and reciprocal receive sensitivity.
Note 2: It is possible to operate the M06 module with similar output power to the JN5148-001-M04 modules by
implementing a small change in the software as provided in the latest SDK.
Note 3: ETSI mode is achieved through a software setting as provided in the latest SDK. Note that this is different to
the equivalent setting for the JN5148-001-M04.
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
3. Product Development
NXP supplies all the development tools and networking stacks needed to enable end-product development to occur
quickly and efficiently. These are all freely available from www.nxp.com/jennic. A range of evaluation/developer kits
is also available, allowing products to be quickly bread boarded. Efficient development of software applications is
enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the
IEEE802.15.4 MAC and the JenNet and ZigBee PRO network stacks, this package provides everything required to
develop application code and to trial it with hardware representative of the final module.
The modules can be user programmed both in development and in production using software supplied by NXP.
Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This
information is available on the NXP support website, together with many example applications, user guides, reference
manuals and application notes.
3.1. JN5148 Single Chip Wireless Microcontroller
The JN5148-001-Myy series is constructed around the JN5148-001 single chip wireless microcontroller, which
includes the radio system, a 32-bit RISC CPU, ROM and RAM memory and a range of analogue and digital
peripherals.
The chip is described fully in JN-DS-JN5148 Wireless Microcontroller Datasheet [2].
The module also includes a 4Mbit serial flash memory, which holds the application code that is loaded into the
JN5148 during the boot sequence and provides static data storage, required by the application.
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
4. Pin Configurations
NC
ADC4
DAC1
43
42
41
40
DAC2
COMP2+
COMP2SPICLK
SPIMISO
SPIMOSI
SPISSZ
DIO0
39
DIO1
DIO2
SPISSM
SPISWP
DIO3
VREF
ADC3
ADC2
10
ADC1
38 COMP1+
37 COMP136 DIO20
35 DIO19
34 DIO18
33 DIO17
32 DIO16
11
31
12
30
13
29
14
28
15
27
DIO15
DIO14
RESETN
DIO13
DIO12
VDD
GND
VSSA
DIO10
DIO11
DIO4
DIO5
DIO6
DIO7
DIO8
DIO9
16 17 18 19 20 21 22 23 24 25 26
Figure 1: Pin Configuration (top view)
Note that the same basic pin configuration applies for all module designs. However, DIO3 (pin 15) and DIO2 (pin 12)
are not available on the high power modules (M06) and, the pins NC (pin 42) and VREF (pin 43) are not available on
the standard modules (M00 and M03).
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
4.1. Pin Assignment
Pin
No
Pin Functions
Primary
Alternate Functions
Signal
Type
Description
ADC4
3.3V
DAC1
3.3V
Analogue to Digital Input
DAC Output
DAC2
3.3V
DAC Output
COMP2+
3.3V
Comparator 2 Input +ve
COMP2-
3.3V
Comparator 2 Input -ve
SPICLK
CMOS
SPI Clock Output
SPIMISO
CMOS
SPI Master In Slave Out Input
SPIMOSI
CMOS
SPI Master Out Slave In Output
SPISSZ
CMSO
SPI Select From Module – SS0
Output
10
DIO0
SPISEL1
CMOS
DIO0 or SPI Slave Select Output 1
11
DIO1
SPISEL2
PC0
CMOS
DIO1, SPI Slave Select Output 2
or Pulse Counter0 Input
12
DIO2*
SPISEL3
RFRX
CMOS
DIO2, SPI Slave Select Output 3
or Radio Receive Control Output
SPI Select to FLASH (Input)
13
SPISSM
CMOS
14
SPISWP
CMOS
FLASH Write Protect (Input)
15
DIO3*
SPISEL4
RFTX
CMOS
DIO3, SPI Slave Select Output 4
or Radio Transmit Control Output
16
DIO4
CTS0
JTAG_TCK
CMOS
DIO4, UART 0 Clear To Send
Input or JTAG CLK
17
DIO5
RTS0
JTAG_TMS
CMOS
DIO5, UART 0 Request To Send
Output or JTAG Mode Select
18
DIO6
TXD0
JTAG_TDO
CMOS
DIO6, UART 0 Transmit Data
Output or JTAG Data Output
19
DIO7
RXD0
JTAG_TDI
CMOS
DIO7, UART 0 Receive Data Input
or JTAG Data Input
20
DIO8
TIM0CK_GT
PC1
CMOS
DIO8, Timer0 Clock/Gate Input or
Pulse Counter1 Input
21
DIO9
TIM0CAP
32KXTALIN
CMOS
DIO9, Timer0 Capture Input, 32K
External Crystal Input or 32K
Clock Input
22
DIO10
TIM0OUT
32KXTALOUT
CMOS
DIO10, Timer0 PWM Output or
32K External Crystal Output
23
DIO11
TIM1CK_GT
TIM2OUT
CMOS
DIO11, Timer1 Clock/Gate Input or
Timer2 PWM Output
32KIN
24
VDD
3.3V
Supply Voltage
25
GND
0V
Digital Ground
26
VSSA
0V
Analogue Ground
27
DIO12
TIM1CAP
ADO
DAI_WS
CMOS
DIO12, Timer1 Capture Input,
Antenna Diversity or Digital Audio
Word Select
28
DIO13
TIM1OUT
ADE
DAI_SDIN
CMOS
DIO13, Timer1 PWM Output,
Antenna Diversity or Digital Audio
Data Input
29
RESETN
CMOS
Reset input
30
DIO14
SIF_CLK
IP_CLK
CMOS
DIO14, Serial Interface Clock or
Intelligent Peripheral Clock Input
31
DIO15
SIF_D
IP_DO
CMOS
DIO15, Serial Interface Data or
Intelligent Peripheral Data Out
32
DIO16
IP_DI
CMOS
DIO16, Intelligent Peripheral Data
In
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
33
DIO17
CTS1
IP_SEL
DAI_SCK
JTAG_TCK
CMOS
DIO17, UART 1 Clear To Send
Input, Intelligent Peripheral Device
Select Input or Digital Audio Clock
or JTAG CLK
34
DIO18
RTS1
IP_INT
DAI_SDOUT
JTAG_TMS
CMOS
DIO18, UART 1 Request To Send
Output, Intelligent Peripheral
Interrupt Output or Digital Audio
Data Output or JTAG Mode Select
35
DIO19
TXD1
JTAG_TDO
CMOS
DIO19 or UART 1 Transmit Data
Output or JTAG Data Out
36
DIO 20
RXD1
JTAG_TDI
CMOS
DIO 20, UART 1 Receive Data
Input or JTAG data In
37
COMP1-
3.3V
Comparator 1 Input -ve
38
COMP1+
3.3V
Comparator 1 Input +ve
39
ADC1
3.3V
Analogue to Digital Input
40
ADC2
3.3V
Analogue to Digital Input
41
ADC3
3.3V
Analogue to Digital Input
42
VREF
3.3V
Analogue Peripheral Reference
Voltage
43
NC+
Do Not Connect
*: These two pins are not connected for High power modules

: These two pins are only used on the High power modules
4.2. Pin Descriptions
All pins behave as described in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2], with the exception of the
following:
4.2.1 Power Supplies
A single power supply pin, VDD is provided. Separate analogue (VSSA) and digital (GND) grounds are provided.
These should be connected together at the module pins.
4.2.2 SPI Memory Connections
SPISWP is a write protect pin for the serial flash memory. This should be held low to inhibit writes to the flash device.
SPISSZ is connected to SPI Slave Select 0 on the JN5148.
SPISSM is connected to the Slave Select pin on the memory.
This configuration allows the flash memory device to be programmed using an external SPI programmer if required.
For programming in this mode, the JN5148 should be held in reset by taking RESETN low. Two potential flash 4Mbit
memory devices may be used in the module, the Micron M25P40 and the Winbond W25X40BLSN.
The memory can also be programmed over the UART by using the flash programmer software provided by NXP. This
is available as part of the Software Developer kit and libraries available from www.nxp.com/jennic. To enter this
programming mode, SPIMISO (pin 7) should be held low whilst the chip is reset. Once programming has finished, the
chip should be reset, when it will execute the new code downloaded.
For normal operation of the module and programming over the UART, SPISSZ should be connected to
SPISSM.
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
5. Electrical Characteristics
In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in
the chip datasheet. Where there are differences, they are detailed below.
5.1. Maximum Ratings
Exceeding these conditions will result in damage to the device.
Parameter
Min
Max
Device supply voltage VDD
-0.3V
3.6V
Voltage on analogue pins VREF, ADC1-4, DAC1-2,
COMP1M, COMP1P, COMP2M, COMP2P, IBIAS
-0.3V
VDD + 0.3V
Voltage on 5v tolerant digital pins DIO0-DIO8 &
DIO11-20, RESETN
-0.3V
Lower of (VDD + 2V) and
5.5V
Voltage on 3v tolerant digital pins DIO9, DIO10,
SPISSM, SPISWP, SPICLK, SPIMOSI, SPIMISO,
SPISSZ
-0.3V
VDD + 0.3V
Storage temperature
-40ºC
150ºC
5.2. Operating Conditions
Supply
10
Min
Max
VDD
2.3V
3.6V
Ambient temperature range
-40ºC
85ºC
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
Appendix A Additional Information
A.1 Outline Drawing
18mm
32.2mm
1.27
mm
2.54
mm
2.54
mm
2.76
mm
Thickness: 3.5mm
Figure 2 JN5148-001-M00 Outline Drawing
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
11
18mm
9.76mm
6.58
mm
30mm
1.27
mm
2.54
mm
2.54
mm
2.76
mm
Thickness: 3.5mm
Figure 3 JN5148-001-M03 Outline Drawing
12
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
18mm
7.2mm
4.05mm
40.5mm
1.27
mm
2.54
mm
2.54
mm
2.76
mm
Thickness: 3.5mm
Figure 4 JN5148-001-M06 Outline Drawing
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
13
A.2 Module PCB Footprint
All dimensions are in mm.
17.42
1.27
Ø1
2.23
1.5
2.23
2.49
Note: All modules have the same footprint except for the M06 which has 2 additional pins marked with a *
Figure 5 Module PCB footprint
RF note for –M00 modules with integral antenna: No components, ground plane or tracks on any layer of the
mother board should be placed within 20mm of the 3 free sides of the antenna. Tracks etc may be placed
adjacent to the can, but should not extend past the can towards the antenna end of the module for 20mm
from the antenna.
14
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
A.3 Manufacturing
A.3.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.
Temperature
Target Time (s)
25~160 ºC
160~190 ºC
> 220º C
230~Pk.
Pk. Temp
(235ºC)
90~130
30~60
20~50
10~15
150~270
Figure 6: Recommended solder reflow profile
A.3.2 Soldering Paste and Cleaning
NXP does not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed in
water) for the following reasons:
Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.
The module label could be damaged or removed.
NXP recommends use of a 'no clean' solder paste for all its module products.
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
15
A.4 Ordering Information
Ordering Code Format:
JN5148 - 001 – M / Y1Y2 Y3
Shipping
Tape Mounted 500-piece reel
Module Type
00
Standard Power, Integral antenna
03
Standard Power, uFl connector
06
High power, uFl connector
Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or
Prototypes. Devices of this status have an Rx suffix after the module type to identify qualification status during these
product phases - for example, JN5148-001-M00R1T.
Part Number
Ordering Code
Description
JN5148-001-M00T
JN5148-001-M/00T
JN5148 module, variant as detailed above
JN5148-001-M03T
JN5148-001-M/03T
JN5148-001-M06T
JN5148-001-M/06T
Label line 1: IC ID Number
Label line 2: FCC ID Number
Label line 3: Part Number
Label line 4: Barcode Label
Label line 5: YYWWTNNNNN (see below)
Identifier
YY
WW
NNNNN
Description
Year
Week
Module type
Serial Number
Format
06 (example)
45 (example)
Figure 8: Example module labelling for FCC approved modules
16
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
A.5 Tape and Reel Information:
A.5.1 Tape Orientation and dimensions
All dimensions are in mm
Module type:
P0
P1
P2
Cover Tape
width (W)
JN5148-001-M00
18.4
32.6
44
20.2
1.75
4.0
2.0
24.0
3.4
37.5
JN5148-001-M03
18.4
30.4
44
20.2
1.75
4.0
2.0
24.0
3.4
37.5
JN5148-001-M06
18.5
40.9
56
26.2
1.75
4.0
2.0
24.0
3.4
49.5
Tolerance
±0.1
±0.1
±0.3
±0.1
+0.1
±0.1
±0.1
±0.1
±0.1
±0.1
A.5.2 Cover tape details
Thickness (T)
0.061mm
Surface resistivity (component side)
10 to 10 Ohms/sq
Surface resistivity (component side)
Non-conductive
Backing type:
Polyester
Adhesive type:
PSA
Sealing:
Room ambient
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
17
A.5.3 Leader and Trailer
300 MM
300 MM
A.5.4 Reel Dimensions:
All dimensions are in mm.
Module type:
W (min)
JN5148-xxx-M00/03
330 ±1.0
2.2±0.5
13 ±0.2
100 +0.1
44.5 ±0.3
JN5148-xxx-M06
330 ±1.0
2.2±0.5
13 ±0.2
100 +0.1
56.5 ±0.3
A.6 Related Documents
[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] JN-DS-JN5148 Wireless Microcontroller Datasheet
18
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
A.7 Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
WARNING!
FCC Radiation Exposure Statement:
This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an
uncontrolled environment. To maintain compliance follow the instructions below;
1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.
This transmitter module is authorized to be used in other devices only by OEM integrators under the
following condition:
The transmitter module must not be co-located with any other antenna or transmitter.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc.).
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
19
A.7.1 Antennas approved by FCC for use with JN5148 modules
Brand
Model Number
Description
Gain (dBi) Connector type
Antenna Factor
ANT-2.4-CW-RCT-RP
Vertical - knuckle antenna
2.2
RP-SMA
Antennova
2010B6090-01
Vertical - knuckle antenna
2.2
RP-SMA
Hyperlink Technology
HG2402RD-RSF
Vertical - knuckle antenna
2.2
RP-SMA
Aveslink Technology, Inc
E-0005-AC
Vertical- flying lead
RP-SMA
Aveslink Technology, Inc
E-2411-GC
Vertical - swivel
RP-SMA
Aveslink Technology, Inc
E-2410-CA
Vertical - bulkhead- flying lead
uFL
Aveslink Technology, Inc
E-2410-GC
Vertical - swivel
RP-SMA
Aveslink Technology, Inc
E-2820-CA
Vertical - bulkhead- flying lead
uFL
Aveslink Technology, Inc
E-2820-GC
Vertical - swivel
RP-SMA
10
Aveslink Technology, Inc
E-0903-AX
Embedded - nickel silver strip
None
11
Aveslink Technology, Inc
E-0904-AX
Embedded - nickel silver strip
None
12 Embedded Antenna Design
FBKR35068-RS-KR
Vertical - knuckle antenna
RP-SMA
13
Nearson
S131CL-L-PX-2450S
Vertical - knuckle-flying lead
uFL
14
Laird Technologies
WRR2400-IP04
Vertical - knuckle-flying lead
1.5
uFL
15
Laird Technologies
WRR2400-RPSMA
Vertical - knuckle-flying lead
1.3
RP-SMA
16
Aveslink Technology, Inc
E-6170-DA
Vertical - right angle
uFL
17
Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
RP-SMA
These antennae or versions with alternative connectors may be used to meet European regulations.
This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi.
Antennas not included in this list or having a gain greater than 2.2 dBi are strictly prohibited for use with this device.
The required antenna impedance is 50 ohms.
A.7.2 High Power Module usage limitation
The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used
at a distance of < 20 cm (8”) from any people.
IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location;
“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be colocated or operating in conjunction with any other antenna or transmitter.”
A.7.3 FCC End Product Labelling
The final ‘end product’ should be labelled in a visible area with the following:
“Contains TX FCC ID: TYOJN5148M0, TYOJN5148M3 or TYOJN5148M6 ” to reflect the version of the module being
used inside the product.
20
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
A.8 Industry Canada Statement
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a
gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end-product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc).
A.8.1 Industry Canada End Product Labelling
For Industry Canada purposes the following should be used.
“Contains Industry Canada ID IC: 7438A-CYO5148M0, IC: 7438A-CYO5148M3 or IC: 7438A-CYO5148M4” to reflect
the version of the module being used inside the product.
A.9 European R & TTE Directive 1999/5/EC Statement
All modules listed in this datasheet are compliant with ETSI EN 300 328 V1.7.1 (2006-10), EMC, EN 301 489-17
v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006 (2006-06) and are subject to a Notified
Body Opinion.
The modules are approved for use with the antennas listed in the following table. The high power module M06 is
limited to an antenna with a gain of 2.2 dBi or less and is approved for use with a reduced output power: +10dBm
EIRP is the maximum permitted.
Brand
Model Number
Description
Antenna Factor
ANT-2.4-CW-RCT-RP
Vertical - knuckle antenna
Gain (dBi) Connector type
2.2
RP-SMA
Antennova
2010B6090-01
Vertical - knuckle antenna
2.2
RP-SMA
Hyperlink Technology
HG2402RD-RSF
Vertical - knuckle antenna
2.2
RP-SMA
Aveslink Technology, Inc
E-0005-AC
Vertical- flying lead
RP-SMA
Aveslink Technology, Inc
E-2411-GC
Vertical - swivel
RP-SMA
Aveslink Technology, Inc
E-2410-CA
Vertical - bulkhead- flying lead
uFL
Aveslink Technology, Inc
E-2410-GC
Vertical - swivel
RP-SMA
Aveslink Technology, Inc
E-2820-CA
Vertical - bulkhead- flying lead
uFL
Aveslink Technology, Inc
E-2820-GC
Vertical - swivel
RP-SMA
10
Aveslink Technology, Inc
E-0903-AX
Embedded - nickel silver strip
None
11
Aveslink Technology, Inc
E-0904-AX
Embedded - nickel silver strip
None
12 Embedded Antenna Design
FBKR35068-RS-KR
Vertical - knuckle antenna
RP-SMA
13
Nearson
S131CL-L-PX-2450S
Vertical - knuckle-flying lead
uFL
14
Laird Technologies
WRR2400-IP04
Vertical - knuckle-flying lead
1.5
uFL
15
Laird Technologies
WRR2400-RPSMA
Vertical - knuckle-flying lead
1.3
RP-SMA
16
Aveslink Technology, Inc
E-6170-DA
Vertical - right angle
uFL
17
Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
RP-SMA
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
21
A.10 RoHS Compliance
JN5148-001-Myy devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the
Council on the Restriction of Hazardous Substance (RoHS).
The JN5148-001-M00, M03 and M06 modules meet the requirements of Chinese RoHS requirements SJ/T113632006.
Full data can be found at www.nxp.com/jennic.
A.11 Status Information
The status of this Data Sheet is Production.
NXP products progress according to the following format:
Advanced
The Data Sheet shows the specification of a product in planning or in development.
The functionality and electrical performance specifications are target values and may be used as a guide to the final
specification.
NXP reserves the right to make changes to the product specification at anytime without notice.
Preliminary
The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.
The functionality of the product is final. The electrical performance specifications are target values and may be used
as a guide to the final specification. Modules are identified with an Rx suffix, for example JN5148-001-M00R2.
NXP reserves the right to make changes to the product specification at anytime without notice.
Production
This is the production Data Sheet for the product.
All functional and electrical performance specifications, where included, including min and max values are derived
from detailed product characterization.
This Data Sheet supersedes all previous document versions.
NXP reserves the right to make changes to the product specification at anytime.
A.12 Disclaimers
The contents of this document are subject to change without notice. NXP reserves the right to make changes,
without notice, in the products, including circuits and/or software, described or contained therein. Information
contained in this document regarding device applications and the like is intended through suggestion only and may
be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.
NXP warrants performance of its hardware products to the specifications applicable at the time of sale in accordance
with NXP’s standard warranty. Testing and other quality control techniques are used to the extent NXP deems
necessary to support this warranty. Except where mandatory by government requirements, testing of all parameters
of each product is not necessarily performed.
NXP assumes no responsibility or liability for the use of any of these products, conveys no license or title under any
patent, copyright, or mask work right to these products, and makes no representations or warranties that these
products are free from patent, copyright, or mask work infringement, unless otherwise specified.
NXP products are not intended for use in life support systems, appliances or systems where malfunction of these
products can reasonably be expected to result in personal injury, death or severe property or environmental damage.
NXP customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify NXP for any damages resulting from such use.
All products are sold subject to NXP's terms and conditions of sale supplied at the time of order acknowledgment.
All trademarks are the property of their respective owners.
22
JN-DS-JN5148-001-Myy 1v5
© NXP Laboratories UK 2012
Version Control
Version
Notes
1.0
1st Issue of Advanced Datasheet
1.1
1st Issue of Preliminary Datasheet, minor parametric changes and addition of Appendix A6.3
1.2
1st Issue of Production Datasheet, addition of PCB cleaning information in Appendix A3
1.3
Logo updated and support of JenNet added
1.4
Ordering information changed
1.5
Withdrawn the M04 High Power Module and added the new High Power Module (M06)
NXP Laboratories UK Ltd
Furnival Street
Sheffield
S1 4QT
United Kingdom
Tel: +44 (0)114 281 2655
Fax: +44 (0) 114 281 2951
For the contact details of your local NXP office or distributor, refer to the NXP web site:
www.nxp.com/jennic
© NXP Laboratories UK 2012
JN-DS-JN5148-001-Myy 1v5
23

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