NXP Semiconductors JN5169M3V2 ZigBee Modular Transmitter User Manual UM11016

NXP Semiconductors ZigBee Modular Transmitter UM11016

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UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

Rev. 1.0 — 15 June 2016 User manual

Document information

Info Content

Keywords JN5169, Zigbee, module

Abstract JN5169-001-M0x-2 modules user manual

User manual Rev. 1.0 — 15 June 2016 2 of 24

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

Revision history

Rev Date Description

1.0 20160613 Initial version

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NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

1. General description

The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a

ready-made component that provides a fully integrated solution for applications, using the

IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee

Smart Energy, Home Automation and ZigBee 3.0 and can be quickly and easily included

in product designs. The modules integrate all of the RF components required, removing

the need to perform expensive RF design and test. Products can be designed by simply

connecting sensors and switches to the module IO pins. The module uses NXP’s single

chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the

extensive chip development support material. Hence, these modules allow designers to

bring wireless applications to market in the minimum time with significantly reduced

development effort and cost.

3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and

JN5169-001-M06-2.

The variants available are described in the Table 1.

1.1 Variants and identifications information

1.2 Regulatory approvals

The JN5169-001-M0x-2 has been tested against the requirements of the following

European standards.

•Radio EN 300 328 v 1.9.1

•EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2

•Basic Safety Assessment (BSA) EN 60950-1:2006

A Notified Body statement of opinion for this standard is available on request.

The High-power module with M06 suffix is not approved for use in Europe.

All module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC

part 15 regulations and in accordance to FCC public notice DA00-1407. The modular

approvals notice and test reports are available on request.

Additionally, all module types have also received ANATEL “Modular Approval”

2. Features and benefits

2.1 Benefits

•Microminiature module solutions

Table 1. Variants and identifications information

Type number Description FCCID IC ID ANATEL ID

JN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2 8764A-JN5169M0 <tbd>

JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2 8764A-JN5169M3 <tbd>

JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2 8764A-JN5169M6 <tbd>

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•Ready to use in products

•Minimises product development time

•No RF test required for systems

•Compliant with:

–FCC 47CFR Part 15C

–ETSI EN 300-328 V1.9.1

–EN 301-489-17 V2.2.1

–EN60950-1-2006

–ANATEL

•Temperature range: 40 C to +85 C

•Lead-free and RoHS compliant

2.2 Features: modules

•2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible

•JN5169-001-M00-2

–Dimensions: 16 mm 30 mm

–Integrated printed antenna

–TX power 8.5 dBm/10 dBm

–Receiver sensitivity –96.5 dBm

–TX current 27.2 mA at 10 dBm

–TX current 23.6 mA at 8.5 dBm

–RX current 17.8 mA at maximum input level 10 dBm

–RX current 16.2 mA at maximum input level 0 dBm

–2.0 V/3.6 V operation

•JN5169-001-M03-2

–Dimensions: 16 mm 21 mm

–Fl connector

–TX power 8.5 dBm/10 dBm

–Receiver sensitivity –96.5 dBm

–TX current 27.2 mA at 10 dBm

–TX current 23.6 mA at 8.5 dBm

–RX current 17.8 mA at maximum input level 10 dBm

–RX current 16.2 mA at maximum input level 0 dBm

–2.0 V/3.6 V operation

•JN5169-001-M06-2

–Dimensions: 16 mm 30 mm

–Fl connector

–TX power 21 dBm

–Receiver sensitivity –100 dBm

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–TX current 181 mA at 21 dBm

–RX current 22.8 mA

–2.0 V/3.6 V operation

2.3 Features: microcontroller

•32-bit RISC CPU; 1 MHz to 32 MHz clock speed

•Variable instruction width for high coding efficiency

•Multi-stage instruction pipeline

•512 kB Flash

•32 kB RAM

•4 kB EEPROM

•Data EEPROM with guaranteed 100 k write operations

•ZigBee PRO stack with Home Automation and Smart Energy profiles

•2-wire I2C-bus compatible serial interface; can operate as either master or slave

•5PWM (4 timers, 1 timer/counter)

•2 low-power sleep counters

•2UARTs

•SPI-bus Master and Slave port, 3 selects

•Supply voltage monitor with 8 programmable thresholds

•6-input 10-bit ADC, comparator

•Battery and temperature sensors

•Watchdog and Supply Voltage Monitor (SVM)

•Up to 20 Digital IO (DIO) pins

3. Applications

•Robust and secure low-power wireless applications

•ZigBee Smart Energy networks

•ZigBee Home Automation networks

•ZigBee 3.0 networks

•Toys and gaming peripherals

•Energy harvesting - for example, self-powered light switch

4. Overview

The JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface

mount modules targeted at IEEE 802.15.4, ZigBee Smart Energy, Home Automation and

ZigBee 3.0 networking applications, enabling users to realize products with minimum time

to market and at the lowest cost. It removes the need for expensive and lengthy

development of custom RF board designs and test suites. The module uses NXP’s

JN5169 wireless microcontroller to provide a comprehensive solution with large memory,

high CPU and radio performance and all RF components included. All that is required to

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develop and manufacture wireless control or sensing products is to connect a power

supply and peripherals such as switches, actuators and sensors, considerably simplifying

product development.

3 module variants are available:

•JN5169-001-M00-2 with an integrated printed antenna

•JN5169-001-M03-2 with a FL antenna connector

•JN5169-001-M06-2 with a FL antenna connector and also a power amplifier and

LNA for extended range

5. Marking

5.1 JN5169-001-M00-2 and JN5169-001-M03-2

[1] With x = 0 or 3.

The JN5169-001-M0x-2 (with x = 0 or 3) family modules meet the requirements of

Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of

Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006

which came into force on 1st March 2007.

Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view)

Table 2. Marking code

Line number Marking code

Line 1 NXP Logo: B&W outline logo

Line 2 part ID: JN5169-001-M0x-2[1]

Line 3 serial number: NNNNN

Line 4 PMC code: ZbHYWW

Z: SSMC

b: SPIL

H: Halogen free

Y: year

WW: week

Line 5 FCC ID: XXMJN5169MxV2[1]

Line 6 IC: 8764A-JN5169Mx[1]

JN5169-001-M0x-2

(1)

FCC ID:XXMJN5169MxV2(1)

NNNNN

ZbHYWW

IC: 8764A-JN5169Mx(1)

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5.2 JN5169-001-M06-2

The JN5169-001-M06-2 module meets the requirements of Directive 2002/95/EC of the

European Parliament and of the Council on the Restriction of Hazardous Substance

(RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force

on 1st March 2007.

Fig 2. JN5169-001-M06-2 package marking (top view)

Table 3. Marking code

Line number Marking code

Line 1 NXP Logo: B&W outline logo

Line 2 part ID: JN5169-001-M06-2

Line 3 serial number: NNNNN

Line 4 PMC code: ZbHYWW

Z: SSMC

b: SPIL

H: Halogen free

Y: year

WW: week

Line 5 FCC ID: XXMJN5169M6V2

Line 6 IC: 8764A-JN5169M6

JN5169-001-M06-2

FCC ID:XXMJN5169M6V2

NNNNN

ZbHYWW

IC: 8764A-JN5169M6

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6. Block diagram

Fig 3. Block diagram

aaa-022823

MATCHING

2.4 GHz

RADIO

INCLUDING

DIVERSITY

POWER

MANAGEMENT

M00-2 option

integrated

antenna

external

antenna

external

antenna

MATCHING

µFL

CONNECTOR

M03-2 option

MATCHING

PA/LNA

XTAL

µFL

CONNECTOR

M06-2 option

WATCHDOG

TIMER

RAM

32 kB

32-BIT

RISC CPU

4kB

EEPROM

FLASH

512 kB

VOLTAGE

BROWNOUT

O-QPSK

MODEM

128-BIT AES

ENCRYPTION

ACCELERATOR

IEEE802.15.4

MAC

ACCELERATOR

SPI-BUS

MASTER AND SLAVE

2-WIRE SERIAL

(MASTER/SLAVE)

4 X PWM

PLUS TIMER

2 X UART

20 DIO

PLUS 2 DO

SLEEP

COUNTER

6 CHAN

10 BIT ADC

BATTERY AND

TEMP SENSORS

POWER

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7. Pinning information

7.1 Pinning

7.2 Pin description

The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on

the JN5169-001-M06-2.

(1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.

(2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.

(3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.

(4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.

Fig 4. Pin configuration

DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0

DIO5/RTS0/JTAG_TMS/PWM1/PC1

DIO6/TXD0/JTAG_TDO/PWM2

DIO7/RXD0/JTAG_TDI/PWM3

DIO8/TIM0CK_GT/PC1/PWM4

DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN

DIO10/TIM0OUT/32KXTALOUT

VDD

GND

VREF/ADC2

DIO17/SPISMISO/SIF_D/COMP1M/PWM4

DIO16/SPISMISO/SIF_CLK/COMP1P

DIO15(4)

DIO14(3)

RESET_N

DIO13(2)

DIO12(1)

DIO11/PWM1/TXD1

ADC1

DO0/SPICLK/PWM2

DO1/SPIMISO/PWM3

DIO18/SPIMOSI

DIO19/SPISEL0

DIO0/ADO/SPISEL1/ADC3

DIO1/ADE/SPISEL2/ADC4/PC0

DIO2/RFRX/TIM0CK_GT/ADC5

DIO3/RFTX/TIM0CAP/ADC6

Transparent top view

Table 4. Pin description

Symbol Pin Type[1] Description

ADC1 1 I ADC1 — ADC input

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DO0/SPICLK/PWM2[2] 2O DO0 — DO0

SPICLK — SPI-bus master clock output

PWM2 — PWM2 output

DO1/SPIMISO/PWM3[3] 3I/O DO1 — DO1

SPIMISO — SPI-bus Master In, Slave Out input

PWM3 — PWM3 output

DIO18/SPIMOSI 4 I/O DIO18 — DIO18

SPIMOSI — SPI-bus Master Out Slave In output

DIO19/SPISEL0 5 I/O DIO19 — DIO19

SPISEL0 — SPI-bus Master Select Output 0

DIO0/ADO/SPISEL1/ADC3 6 I/O DIO0 — DIO0

ADO — antenna diversity odd output

SPISEL1 — SPI-bus master select output 1

ADC3 — ADC input: ADC3

DIO1/ADE/SPISEL2/ADC4/PC0 7 I/O DIO1 — DIO1

ADE — antenna diversity even output

SPISEL2 — SPI-bus master select output 2

ADC4 — ADC input: ADC4

PC0 — pulse counter 0 input

DIO2/RFRX/TIM0CK_GT/ADC5[4] 8I/O DIO2 — DIO2

RFRX — radio receives control output

TIM0CK_GT — timer0 clock/gate input

ADC5 — ADC input: ADC5

DIO3/RFTX/TIM0CAP/ADC6[4] 9I/O DIO3 — DIO3

RFTX — radio transmit control output

TIM0CAP — timer0 capture input

ADC6 — ADC input: ADC6

DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4

CTS0 — UART 0 clear to send input

JTAG_TCK — JTAG CLK input

TIM0OUT — timer0 PWM output

PC0 — pulse counter 0 input

DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5

RTS0 — UART 0 request to send output

JTAG_TMS — JTAG mode select input

PWM1 — PWM1 output

PC1 — pulse counter 1 input

DIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6

TXD0 — UART 0 transmit data output

JTAG_TDO — JTAG data output

PWM2 — PWM2 data output

Table 4. Pin description …continued

Symbol Pin Type[1] Description

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DIO7/RXD0/JTAG_TDI/PWM3 13 I/O DIO7 — DIO7

RXD0 — UART 0 receive data input

JTAG_TDI — JTAG data input

PWM3 — PWM 3 data output

DIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8

TIM0CK_GT — timer0 clock/gate input

PC1 — pulse counter1 input

PWM4 — PWM 4 output

DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9

TIM0CAP — Timer0 Capture input

32KXTALIN — 32 kHz External Crystal input

RXD1 — UART1 Receive Data input

32KIN — 32 kHz External clock input

DIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10

TIM0OUT — Timer0 PWM Output

32KXTALOUT — 32 kHz External Crystal output

VDD 17 P VDD — supply voltage

GND 18 GND ground

DIO11/PWM1/TXD1 19 I/O DIO11 — DIO11

PWM1 — PWM1 output

TXD1 — UART1 Transmit Data output

DIO12[5] 20 I/O DIO12 — DIO12

PWM2 — PWM2 output

CTS0 — UART0 clear to send input

JTAG_TCK — JTAG CLK input

ADO — antenna diversity odd output

SPISMOSI — SPI-bus slave Master Out, Slave In input

DIO13[6] 21 I/O DIO13 — DIO13

PWM3 — PWM3 output

RTS0 — UART0 request to send output

JTAG_TMS — JTAG mode select input

ADE — antenna diversity even output

SPISMISO — SPI-bus slave master in slave out output

RESET_N 22 I RESET_N — reset input

DIO14[7] 23 I/O DIO14 — DIO14

SIF_CLK — serial interface clock

TXD0 — UART 0 transmit data output

TXD1 — UART 1 transmit data output

JTAG_TDO — JTAG data output

SPISEL1 — SPI-bus master select output 1

SPISSEL — SPI-bus slave select input

Table 4. Pin description …continued

Symbol Pin Type[1] Description

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[1] P = power supply; G = ground; I = input, O = output; I/O = input/output.

[2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode.

[3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program.

[4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module.

[5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.

[6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.

[7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.

[8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.

8. Functional description

8.1 JN5169 single chip wireless microcontroller

The JN5169-001-M0x-2 is constructed around the JN5169-001 single chip wireless

microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and

EEPROM memory and a range of analogue and digital peripherals.

The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2).

DIO15[8] 24 I/O DIO15 — DIO15

SIF_D — serial interface data

RXD0 — UART 0 receive data input

RXD1 — UART 1 receive data input

JTAG_TDI — JTAG data input

SPISEL2 — SPI-bus master select output 2

SPISCLK — SPI-bus slave clock input

DIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16

COMP1P — comparator positive input

SIF_CLK — Serial Interface clock

SPISMOSI — SPI-bus Slave Master Out Slave In input

DIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17

COMP1M — COMP1M; comparator negative input

SIF_D — Serial Interface Data

SPISMISO — SPI-bus Slave Master In Slave Out output

PWM4 — PWM 4 output

VREF/ADC2 27 P VREF — analog peripheral reference voltage

IADC2 — ADC input 2

Table 4. Pin description …continued

Symbol Pin Type[1] Description

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8.2 Peripherals

The performance of all peripherals is defined in the JN5169 Wireless Microcontroller

Datasheet (see Ref. 2).

NXP supplies all the development tools and networking stacks needed to enable

end-product development to occur quickly and efficiently. These are all freely available

from the NXP Wireless Connectivity TechZone (see Ref. 3). A range of

evaluation/developer kits is also available, allowing products to be quickly bread boarded.

Efficient development of software applications is enabled by the provision of a complete,

unlimited, software developer kit. Together with the available libraries for the

IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything

required to develop application code and to trial it with hardware representative of the final

module.

The modules can be user programmed both in development and in production using

software supplied by NXP. Access to the on-chip peripherals, MAC and network stack

software is provided through specific APIs. This information is available on the NXP

support website, together with many example applications, user guides, reference

manuals and application notes.

9. Limiting values

Table 5. Peripherals

Peripherals JN5169-001-M0x-2 Notes

Master SPI-bus port 3 selects 250 kHz - 16 MHz

Slave SPI-bus port 1 250 kHz - 4 MHz

UART 2 16550 compatible

Two-wire serial I/F (compatible with SMbus and I2C-bus) 1 Up to 400kHz

PWM 16 MHz clock

timer 4

timer/counter 1

Programmable Sleep Timers 2 32 kHz clock

Digital IO lines (multiplexed with UARTs, timers and SPI-bus

selects) 20 DIO2 and DIO3 are not available

on JN5169-001-M06 modules

Analog-to-Digital converter 4 10-bit, up to 100 ks/s

Programmable analogue comparator 1 ultra low power mode for sleep

Internal temperature sensor 1

Internal battery sensor 1

Table 6. Limiting values

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.3 +3.6 V

VVREF/ADC2 voltage on pin VREF/ADC2 0.3 VDDA +

0.3V V

VADC1 voltage on pin ADC1 0.3 VDDA +

0.3V V

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10. Recommended operating conditions

[1] To reach the maximum TX power, 2.8 V is the minimum.

11. Characteristics

11.1 DC current

[1] To reach the maximum TX power, 2.8 V is the minimum.

VIO(dig) digital input/output voltage 0.3 VDDD +

0.3V V

Tstg storage temperature 40 +150 C

VESD electrostatic discharge voltage according to ETSI EN 301 489-17

2012 V2.2.1 and ETSI EN 301 489-1

2011 V1.9.2

4- kV

Table 6. Limiting values …continued

Symbol Parameter Conditions Min Max Unit

Table 7. Operating conditions

Symbol Parameter Conditions Min Max Unit

VDD supply voltage [1] 23.6V

Tamb ambient temperature standard range 40 +85 C

Table 8. Active processing

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD supply current M00

radio in receive mode; maximum input level at 10 dBm - 17.8 - mA

radio in receive mode; maximum input level at 0 dBm - 16.7 - mA

radio in transmit mode 10 dBm [1] - 27.2 - mA

radio in transmit mode 8.5 dBm [1] - 23.6 - mA

M03

radio in receive mode; maximum input level at 10 dBm - 17.8 - mA

radio in receive mode; maximum input level at 0 dBm - 16.7 - mA

radio in transmit mode 10 dBm [1] - 27.2 - mA

radio in transmit mode 8.5 dBm [1] - 23.6 - mA

M06

radio in receive mode - 22.8 - mA

radio in transmit mode [1] - 181 - mA

Table 9. Sleep mode

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD(IO) input/output supply

current in sleep mode; with I/O and RC oscillator

timer wake-up; Tamb =25C-0.73-A

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[1] Waiting on chip RESET or I/O event.

11.2 AC characteristics

11.2.1 Radio transceiver

These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V

to 3.6 V and offers the improved RF characteristics shown in Table 11. All RF

characteristics are measured single ended.

[1] With external matching inductors and assuming PCB layout.

Table 10. Deep sleep mode

VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IDD supply current deep sleep mode; measured at 25 C[1] -70-nA

Table 11. RF port characteristics

Single-ended; Impedance = 50



[1]; VDD = 2 V to 3.6 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

frange frequency range 2.4 - 2.485 GHz

Table 12. Radio transceiver characteristics: +25 C

VDD = 2 V to 3.6 V; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Receiver

M00

SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBm

Pi(RX)(max) maximum receiver input

power 1 % PER, measured as sensitivity; supply

current at 17.8 mA -10-dBm

1 % PER, measured as sensitivity; supply

current at 16.2 mA -0-dBm

RSSI RSSI variation 95 dBm to 10 dBm; available through

UM11016 Integrated Peripherals API

4- +4dB

M03

SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBm

Pi(RX)(max) maximum receiver input

power 1 % PER, measured as sensitivity; supply

current at 17.8 mA -10-dBm

1 % PER, measured as sensitivity; supply

current at 16.2 mA -0-dBm

RSSI RSSI variation 95 dBm to 10 dBm; available through

UM11016 Integrated Peripherals API

4- +4dB

M06

SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 100 - dBm

Pi(RX)(max) maximum receiver input

power 1 % PER, measured as sensitivity - 5 - dBm

RSSI RSSI variation 100 dBm to 25 dBm; available through

UM11016 Integrated Peripherals API

4- +4dB

Transmitter

User manual Rev. 1.0 — 15 June 2016 16 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

[1] To reach the maximum TX power, 2.8 V is the minimum on VDD.

[2] Up to an extra 2.5 dB of attenuation is available if required.

12. Federal Communication Commission Statement

•This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules see Ref. 4. These limits are

designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses, and can radiate radio

frequency energy and, if not installed and used in accordance with the instructions,

may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment

does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to

correct the interference by one of the following measures:

–Reorient or relocate the receiving antenna

–Increase the separation between the equipment and receiver

–Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected

–Consult the dealer or an experienced radio/TV technician for help

•OEM integrators instructions

–The OEM integrators are responsible for ensuring that the end-user has no manual

instructions to remove or install module

–The module is limited to installation in mobile or fixed applications, according to

CFR 47 Part 2.1091(b)

–Separate approval is required for all other operating configurations, including

portable configurations with respect to CFR 47 Part 2.1093 and different antenna

configurations

•User guide mandatory statements

M00

Pooutput power IDD = 27.2 mA [1] -10-dBm

IDD = 23.6 mA [1] -8.5-dBm

Po(cr) control range output

power in 6 major steps and then 4 fine steps [2] -42 - dB

M03

Pooutput power IDD = 27.2 mA [1] -10-dBm

IDD = 23.6 mA [1] -8.5-dBm

Po(cr) control range output

power in 6 major steps and then 4 fine steps [2] -42 - dB

M06

Pooutput power [1] -21-dBm

Table 12. Radio transceiver characteristics: +25 C …continued

VDD = 2 V to 3.6 V; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

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NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

–User's instructions of the host device must contain the following statements in

addition to operation instructions:

* “This device complies with part 15 of the FCC Rules. Operation is subject to the

following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that

may cause undesired operation”

* “Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment”

•FCC RF Exposure requirements

–User's instructions of the host device must contain the following instructions in

addition to operation instructions:

Avoid direct contact to the antenna, or keep it to a 20 cm minimum distance while

using this equipment. This device must not be collocated or operating in

conjunction with another antenna or transmitter.

The JN5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to

operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater

than 2 dBi are strictly prohibited for use with these devices. The required antenna

impedance is 50 ohms.

The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed

antenna is 1 dBi.

12.1 FCC end product labelling

The final ‘end product’ should be labelled in a visible area with the following:

“Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to

reflect the version of the module being used inside the product.

13. Industry Canada statement

To reduce potential radio interference to other users, the antenna type and its gain should

be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that

permitted for successful communication.

This device complies with Industry Canada

licence-exempt RSS standard(s). Operation is

subject to the following two conditions: (1) this

device may not cause interference, and (2) this

device must accept any interference, including

interference that may cause undesired

operation of the device.

This device complies with Industry Canada RF

radiation exposure limits set forth for general

population (uncontrolled exposure). This device

must be installed to provide a separation

distance of at least 20 cm from all persons and

must not be collocated or operating in

conjunction with any other antenna or

transmitter.

Le présent appareil est conforme aux CNR

d’Industrie Canada applicables aux appareils

radio exempts de licence. L’exploitation est

autorisée aux deux conditions suivantes: (1) il

ne doit pas produire de brouillage, et (2)

l’utilisateur du dispositif doit être prêt a accepter

tout brouillage radioélectrique reçu, même si ce

brouillage est susceptible de compromettre le

fonctionnement du dispositif.

Le présent appareil est conforme aux niveaux

limites d’exigences d’exposition RF aux

personnes définies par Industrie Canada. Cet

appareil doit être installé afin d’offrir une

distance de séparation d’au moins 20 cm avec

l’utilisateur, et ne doit pas être installé à

proximité ou être utilisé en conjonction avec une

autre antenne ou un autre émetteur.

User manual Rev. 1.0 — 15 June 2016 18 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

The JN5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to

operate with antennas having a maximum gain of 2 dBi. Antennas having a gain

greater than 2 dBi are strictly prohibited for use with these devices. The required

antenna impedance is 50 ohms.

The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the

printed antenna is 1 dBi.

As long as the above condition is met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any

additional compliance requirements required with this module installed (for example,

digital device emissions, PC peripheral requirements, etc).

13.1 Industry Canada end product labelling

For Industry Canada purposes the following should be used:

“Contains Industry Canada ID IC: 8764A-JN5169Mx” (with x = 0 or 3 or 6).

14.

Footprint information for reflow soldering

All modules have the same footprint.

Fig 5. Module PCB footprint

aaa-022825Dimensions in mm

2.54

1.27

3.30

1.5

Ø 1

User manual Rev. 1.0 — 15 June 2016 19 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

15. Package outline

Fig 6. Package outline JN5169-001-M00-2

Fig 7. Package outline JN5169-001-M03-2

2.54 3.30

2.54

1.27

aaa-022826

Dimensions in mm

Thickness: 3.5 mm

aaa-022827

Dimensions in mm

Thickness: 3.5 mm

2.54 3.30

2.54

1.27

2.53

10.85

User manual Rev. 1.0 — 15 June 2016 20 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

Fig 8. Package outline JN5169-001-M06-2

aaa-022828

Dimensions in mm

Thickness: 3.5 mm

2.54 3.30

2.54

1.27

2.81

User manual Rev. 1.0 — 15 June 2016 21 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

16. Abbreviations

17. References

[1] IEEE Std 802.15.4-2011 — IEEE Std 802.15.4-2011 IEEE Standard for Information

Technology.

[2] JN5169 — JN5169 wireless microcontroller datasheet.

[3] Wireless Connectivity —

http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE

LESS-CONNECTIVITY

[4] Part 15 of the FCC Rules —

http://www.ecfr.gov/cgi‐bin/text‐idx?SID=d01e00935bfcb0d53b914e7c8e63f383

&node=47:1.0.1.1.16&rgn=div5

Table 13. Abbreviations

Acronym Description

API Application Program Interface

ADC Analog to Digital Converter

FCC Federal Communication Commission

IO Input Output

OEM Original Equipment Manufacturer

PCB Printed Circuit Board

PER Packet Error Rate

PWM Pulse Width Modulation

R&TTE Radio and Telecommunications Terminal Equipment

RF Radio Frequency

RISC Reduce Instruction Set Computing

RSSI Receive Signal Strength Indicator

RTS Request-To-Send

SPI Serial Peripheral Interface

SVM Supply Voltage Monitor

SYNTH SYNTHesizer

UART Universal Asynchronous Receiver/Transmitter

User manual Rev. 1.0 — 15 June 2016 22 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

18. Legal information

18.1 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

18.2 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Evaluation products — This product is provided on an “as is” and “with all

faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates

and their suppliers expressly disclaim all warranties, whether express, implied

or statutory, including but not limited to the implied warranties of

non-infringement, merchantability and fitness for a particular purpose. The

entire risk as to the quality, or arising out of the use or performance, of this

product remains with customer.

In no event shall NXP Semiconductors, its affiliates or their suppliers be liable

to customer for any special, indirect, consequential, punitive or incidental

damages (including without limitation damages for loss of business, business

interruption, loss of use, loss of data or information, and the like) arising out

the use of or inability to use the product, whether or not based on tort

(including negligence), strict liability, breach of contract, breach of warranty or

any other theory, even if advised of the possibility of such damages.

Notwithstanding any damages that customer might incur for any reason

whatsoever (including without limitation, all damages referenced above and

all direct or general damages), the entire liability of NXP Semiconductors, its

affiliates and their suppliers and customer’s exclusive remedy for all of the

foregoing shall be limited to actual damages incurred by customer based on

reasonable reliance up to the greater of the amount actually paid by customer

for the product or five dollars (US$5.00). The foregoing limitations, exclusions

and disclaimers shall apply to the maximum extent permitted by applicable

law, even if any remedy fails of its essential purpose.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

18.3 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I2C-bus — logo is a trademark of NXP Semiconductors N.V.

User manual Rev. 1.0 — 15 June 2016 23 of 24

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

19. Tables

Table 1. Variants and identifications information . . . . . . .3

Table 2. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Table 3. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 5. Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 6. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 7. Operating conditions . . . . . . . . . . . . . . . . . . . .14

Table 8. Active processing . . . . . . . . . . . . . . . . . . . . . . 14

Table 9. Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 10. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 15

Table 11. RF port characteristics . . . . . . . . . . . . . . . . . . 15

Table 12. Radio transceiver characteristics: +25 °C . . . . 15

Table 13. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21

20. Figures

Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2

packages marking (top view) . . . . . . . . . . . . . . . . .6

Fig 2. JN5169-001-M06-2 package marking (top view). .7

Fig 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Fig 4. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .9

Fig 5. Module PCB footprint. . . . . . . . . . . . . . . . . . . . . .18

Fig 6. Package outline JN5169-001-M00-2 . . . . . . . . . .19

Fig 7. Package outline JN5169-001-M03-2 . . . . . . . . . .19

Fig 8. Package outline JN5169-001-M06-2 . . . . . . . . . .20

NXP Semiconductors UM11016

ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 June 2016

Document identifier: UM11016

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Variants and identifications information . . . . . . 3

1.2 Regulatory approvals . . . . . . . . . . . . . . . . . . . . 3

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 3

2.1 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2 Features: modules . . . . . . . . . . . . . . . . . . . . . . 4

2.3 Features: microcontroller . . . . . . . . . . . . . . . . . 5

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5.1 JN5169-001-M00-2 and JN5169-001-M03-2 . . 6

5.2 JN5169-001-M06-2. . . . . . . . . . . . . . . . . . . . . . 7

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 9

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9

8 Functional description . . . . . . . . . . . . . . . . . . 12

8.1 JN5169 single chip wireless microcontroller. . 12

8.2 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13

10 Recommended operating conditions. . . . . . . 14

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14

11.1 DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

11.2 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 15

11.2.1 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 15

12 Federal Communication Commission Statement

12.1 FCC end product labelling . . . . . . . . . . . . . . . 17

13 Industry Canada statement. . . . . . . . . . . . . . . 17

13.1 Industry Canada end product labelling . . . . . . 18

14 Footprint information for reflow soldering . . 18

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21

17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22

18.1 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

18.2 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

18.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

19 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

20 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

NXP Semiconductors JN5169M3V2 ZigBee Modular Transmitter User Manual UM11016

NXP Semiconductors ZigBee Modular Transmitter UM11016

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