NXP Semiconductors JN5169M3V2 ZigBee Modular Transmitter User Manual UM11016
NXP Semiconductors ZigBee Modular Transmitter UM11016
User Manual.pdf
UM11016 ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Rev. 1.0 — 15 June 2016 Document information Info Content Keywords JN5169, Zigbee, module Abstract JN5169-001-M0x-2 modules user manual User manual UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Revision history Rev Date Description 1.0 20160613 Initial version Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 1. General description The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee Smart Energy, Home Automation and ZigBee 3.0 and can be quickly and easily included in product designs. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test. Products can be designed by simply connecting sensors and switches to the module IO pins. The module uses NXP’s single chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive chip development support material. Hence, these modules allow designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost. 3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and JN5169-001-M06-2. The variants available are described in the Table 1. 1.1 Variants and identifications information Table 1. Variants and identifications information Type number Description FCCID JN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2 8764A-JN5169M0 IC IDANATEL ID JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2 8764A-JN5169M3 JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2 8764A-JN5169M6 1.2 Regulatory approvals The JN5169-001-M0x-2 has been tested against the requirements of the following European standards. • Radio EN 300 328 v 1.9.1 • EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2 • Basic Safety Assessment (BSA) EN 60950-1:2006 A Notified Body statement of opinion for this standard is available on request. The High-power module with M06 suffix is not approved for use in Europe. All module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407. The modular approvals notice and test reports are available on request. Additionally, all module types have also received ANATEL “Modular Approval” 2. Features and benefits 2.1 Benefits • Microminiature module solutions UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules • • • • Ready to use in products Minimises product development time No RF test required for systems Compliant with: – FCC 47CFR Part 15C – ETSI EN 300-328 V1.9.1 – EN 301-489-17 V2.2.1 – EN60950-1-2006 – ANATEL • Temperature range: 40 C to +85 C • Lead-free and RoHS compliant 2.2 Features: modules • 2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible • JN5169-001-M00-2 – Dimensions: 16 mm 30 mm – Integrated printed antenna – TX power 8.5 dBm/10 dBm – Receiver sensitivity –96.5 dBm – TX current 27.2 mA at 10 dBm – TX current 23.6 mA at 8.5 dBm – RX current 17.8 mA at maximum input level 10 dBm – RX current 16.2 mA at maximum input level 0 dBm – 2.0 V/3.6 V operation • JN5169-001-M03-2 – Dimensions: 16 mm 21 mm – Fl connector – TX power 8.5 dBm/10 dBm – Receiver sensitivity –96.5 dBm – TX current 27.2 mA at 10 dBm – TX current 23.6 mA at 8.5 dBm – RX current 17.8 mA at maximum input level 10 dBm – RX current 16.2 mA at maximum input level 0 dBm – 2.0 V/3.6 V operation • JN5169-001-M06-2 – Dimensions: 16 mm 30 mm – Fl connector – TX power 21 dBm – Receiver sensitivity –100 dBm UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules – TX current 181 mA at 21 dBm – RX current 22.8 mA – 2.0 V/3.6 V operation 2.3 Features: microcontroller • • • • • • • • • • • • • • • • • • 32-bit RISC CPU; 1 MHz to 32 MHz clock speed Variable instruction width for high coding efficiency Multi-stage instruction pipeline 512 kB Flash 32 kB RAM 4 kB EEPROM Data EEPROM with guaranteed 100 k write operations ZigBee PRO stack with Home Automation and Smart Energy profiles 2-wire I2C-bus compatible serial interface; can operate as either master or slave 5 PWM (4 timers, 1 timer/counter) 2 low-power sleep counters 2 UARTs SPI-bus Master and Slave port, 3 selects Supply voltage monitor with 8 programmable thresholds 6-input 10-bit ADC, comparator Battery and temperature sensors Watchdog and Supply Voltage Monitor (SVM) Up to 20 Digital IO (DIO) pins 3. Applications • • • • • • Robust and secure low-power wireless applications ZigBee Smart Energy networks ZigBee Home Automation networks ZigBee 3.0 networks Toys and gaming peripherals Energy harvesting - for example, self-powered light switch 4. Overview The JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, ZigBee Smart Energy, Home Automation and ZigBee 3.0 networking applications, enabling users to realize products with minimum time to market and at the lowest cost. It removes the need for expensive and lengthy development of custom RF board designs and test suites. The module uses NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development. 3 module variants are available: • JN5169-001-M00-2 with an integrated printed antenna • JN5169-001-M03-2 with a FL antenna connector • JN5169-001-M06-2 with a FL antenna connector and also a power amplifier and LNA for extended range 5. Marking 5.1 JN5169-001-M00-2 and JN5169-001-M03-2 JN5169-001-M0x-2(1) NNNNN ZbHYWW FCC ID:XXMJN5169MxV2(1) IC: 8764A-JN5169Mx(1) Fig 1. Table 2. JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view) Marking code Line number Marking code Line 1 NXP Logo: B&W outline logo Line 2 part ID: JN5169-001-M0x-2[1] Line 3 serial number: NNNNN Line 4 PMC code: ZbHYWW Z: SSMC b: SPIL H: Halogen free Y: year WW: week Line 5 FCC ID: XXMJN5169MxV2[1] Line 6 IC: 8764A-JN5169Mx[1] [1] With x = 0 or 3. The JN5169-001-M0x-2 (with x = 0 or 3) family modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007. UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 5.2 JN5169-001-M06-2 JN5169-001-M06-2 NNNNN ZbHYWW FCC ID:XXMJN5169M6V2 IC: 8764A-JN5169M6 Fig 2. Table 3. JN5169-001-M06-2 package marking (top view) Marking code Line number Marking code Line 1 NXP Logo: B&W outline logo Line 2 part ID: JN5169-001-M06-2 Line 3 serial number: NNNNN Line 4 PMC code: ZbHYWW Z: SSMC b: SPIL H: Halogen free Y: year WW: week Line 5 Line 6 FCC ID: XXMJN5169M6V2 IC: 8764A-JN5169M6 The JN5169-001-M06-2 module meets the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007. UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 6. Block diagram integrated antenna external antenna external antenna µFL CONNECTOR WATCHDOG TIMER MATCHING M00-2 option MATCHING 2.4 GHz RADIO INCLUDING DIVERSITY VOLTAGE BROWNOUT PA/LNA 32-BIT RISC CPU 4kB EEPROM MATCHING IEEE802.15.4 MAC ACCELERATOR M06-2 option XTAL FLASH 512 kB O-QPSK MODEM M03-2 option µFL CONNECTOR RAM 32 kB POWER MANAGEMENT 128-BIT AES ENCRYPTION ACCELERATOR SPI-BUS MASTER AND SLAVE 2-WIRE SERIAL (MASTER/SLAVE) 4 X PWM PLUS TIMER 2 X UART 20 DIO PLUS 2 DO SLEEP COUNTER 6 CHAN 10 BIT ADC BATTERY AND TEMP SENSORS POWER aaa-022823 Fig 3. Block diagram UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 7. Pinning information 7.1 Pinning ADC1 1 27 VREF/ADC2 DO0/SPICLK/PWM2 2 26 DIO17/SPISMISO/SIF_D/COMP1M/PWM4 DO1/SPIMISO/PWM3 3 25 DIO16/SPISMISO/SIF_CLK/COMP1P DIO18/SPIMOSI 4 24 DIO15(4) DIO19/SPISEL0 5 23 DIO14(3) DIO0/ADO/SPISEL1/ADC3 6 22 RESET_N DIO1/ADE/SPISEL2/ADC4/PC0 7 21 DIO13(2) DIO2/RFRX/TIM0CK_GT/ADC5 8 20 DIO12(1) VDD 17 GND 18 DIO10/TIM0OUT/32KXTALOUT 16 DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 DIO7/RXD0/JTAG_TDI/PWM3 13 DIO8/TIM0CK_GT/PC1/PWM4 14 DIO6/TXD0/JTAG_TDO/PWM2 12 DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 19 DIO11/PWM1/TXD1 DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 DIO3/RFTX/TIM0CAP/ADC6 9 Transparent top view The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on the JN5169-001-M06-2. (1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. (2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. (3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. (4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK. Fig 4. Pin configuration 7.2 Pin description Table 4. Pin description Symbol Pin Type[1] Description ADC1 ADC1 — ADC input UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 4. Pin description …continued Symbol Pin Type[1] Description DO0/SPICLK/PWM2[2] DO0 — DO0 SPICLK — SPI-bus master clock output PWM2 — PWM2 output DO1/SPIMISO/PWM3[3] I/O DO1 — DO1 SPIMISO — SPI-bus Master In, Slave Out input PWM3 — PWM3 output DIO18/SPIMOSI I/O DIO19/SPISEL0 I/O DIO18 — DIO18 SPIMOSI — SPI-bus Master Out Slave In output DIO19 — DIO19 SPISEL0 — SPI-bus Master Select Output 0 DIO0/ADO/SPISEL1/ADC3 I/O DIO0 — DIO0 ADO — antenna diversity odd output SPISEL1 — SPI-bus master select output 1 ADC3 — ADC input: ADC3 DIO1/ADE/SPISEL2/ADC4/PC0 I/O DIO1 — DIO1 ADE — antenna diversity even output SPISEL2 — SPI-bus master select output 2 ADC4 — ADC input: ADC4 PC0 — pulse counter 0 input DIO2/RFRX/TIM0CK_GT/ADC5[4] I/O DIO2 — DIO2 RFRX — radio receives control output TIM0CK_GT — timer0 clock/gate input ADC5 — ADC input: ADC5 DIO3/RFTX/TIM0CAP/ADC6[4] I/O DIO3 — DIO3 RFTX — radio transmit control output TIM0CAP — timer0 capture input ADC6 — ADC input: ADC6 DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4 CTS0 — UART 0 clear to send input JTAG_TCK — JTAG CLK input TIM0OUT — timer0 PWM output PC0 — pulse counter 0 input DIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5 RTS0 — UART 0 request to send output JTAG_TMS — JTAG mode select input PWM1 — PWM1 output PC1 — pulse counter 1 input DIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6 TXD0 — UART 0 transmit data output JTAG_TDO — JTAG data output PWM2 — PWM2 data output UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 4. Pin description …continued Symbol Pin Type[1] Description DIO7/RXD0/JTAG_TDI/PWM3 13 DIO7 — DIO7 I/O RXD0 — UART 0 receive data input JTAG_TDI — JTAG data input PWM3 — PWM 3 data output DIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8 TIM0CK_GT — timer0 clock/gate input PC1 — pulse counter1 input PWM4 — PWM 4 output DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9 TIM0CAP — Timer0 Capture input 32KXTALIN — 32 kHz External Crystal input RXD1 — UART1 Receive Data input 32KIN — 32 kHz External clock input DIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10 TIM0OUT — Timer0 PWM Output 32KXTALOUT — 32 kHz External Crystal output VDD 17 VDD — supply voltage GND 18 GND ground DIO11/PWM1/TXD1 19 I/O DIO11 — DIO11 PWM1 — PWM1 output TXD1 — UART1 Transmit Data output DIO12[5] 20 I/O DIO12 — DIO12 PWM2 — PWM2 output CTS0 — UART0 clear to send input JTAG_TCK — JTAG CLK input ADO — antenna diversity odd output SPISMOSI — SPI-bus slave Master Out, Slave In input DIO13[6] 21 I/O DIO13 — DIO13 PWM3 — PWM3 output RTS0 — UART0 request to send output JTAG_TMS — JTAG mode select input ADE — antenna diversity even output SPISMISO — SPI-bus slave master in slave out output RESET_N 22 RESET_N — reset input DIO14[7] 23 I/O DIO14 — DIO14 SIF_CLK — serial interface clock TXD0 — UART 0 transmit data output TXD1 — UART 1 transmit data output JTAG_TDO — JTAG data output SPISEL1 — SPI-bus master select output 1 SPISSEL — SPI-bus slave select input UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 4. Pin description …continued Symbol Pin Type[1] Description DIO15[8] 24 DIO15 — DIO15 I/O SIF_D — serial interface data RXD0 — UART 0 receive data input RXD1 — UART 1 receive data input JTAG_TDI — JTAG data input SPISEL2 — SPI-bus master select output 2 SPISCLK — SPI-bus slave clock input DIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16 COMP1P — comparator positive input SIF_CLK — Serial Interface clock SPISMOSI — SPI-bus Slave Master Out Slave In input DIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17 COMP1M — COMP1M; comparator negative input SIF_D — Serial Interface Data SPISMISO — SPI-bus Slave Master In Slave Out output PWM4 — PWM 4 output VREF/ADC2 [1] 27 VREF — analog peripheral reference voltage ADC2 — ADC input 2 P = power supply; G = ground; I = input, O = output; I/O = input/output. [2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode. [3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program. [4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module. [5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI. [6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO. [7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL. [8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK. 8. Functional description 8.1 JN5169 single chip wireless microcontroller The JN5169-001-M0x-2 is constructed around the JN5169-001 single chip wireless microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and EEPROM memory and a range of analogue and digital peripherals. The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2). UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 8.2 Peripherals Table 5. Peripherals Peripherals JN5169-001-M0x-2 Notes Master SPI-bus port 3 selects 250 kHz - 16 MHz Slave SPI-bus port 250 kHz - 4 MHz UART 16550 compatible Two-wire serial I/F (compatible with SMbus and I2C-bus) Up to 400kHz PWM 16 MHz clock timer timer/counter Programmable Sleep Timers 32 kHz clock Digital IO lines (multiplexed with UARTs, timers and SPI-bus selects) 20 DIO2 and DIO3 are not available on JN5169-001-M06 modules Analog-to-Digital converter 10-bit, up to 100 ks/s Programmable analogue comparator ultra low power mode for sleep Internal temperature sensor Internal battery sensor The performance of all peripherals is defined in the JN5169 Wireless Microcontroller Datasheet (see Ref. 2). NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone (see Ref. 3). A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded. Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware representative of the final module. The modules can be user programmed both in development and in production using software supplied by NXP. Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes. 9. Limiting values Table 6. Limiting values Symbol Parameter VDD Min Max Unit supply voltage 0.3 +3.6 VVREF/ADC2 voltage on pin VREF/ADC2 0.3 VDDA + 0.3V VADC1 voltage on pin ADC1 0.3 VDDA + 0.3V UM11016 User manual Conditions All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 6. Limiting values …continued Symbol Parameter Min Max Unit VIO(dig) digital input/output voltage Conditions 0.3 VDDD + 0.3V Tstg storage temperature 40 +150 C VESD electrostatic discharge voltage kV according to ETSI EN 301 489-17 2012 V2.2.1 and ETSI EN 301 489-1 2011 V1.9.2 10. Recommended operating conditions Table 7. Symbol Operating conditions Parameter Conditions VDD supply voltage Tamb ambient temperature [1] [1] standard range Min Max Unit 3.6 40 +85 C To reach the maximum TX power, 2.8 V is the minimum. 11. Characteristics 11.1 DC current Table 8. Active processing VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions IDD supply current M00 radio in receive mode; maximum input level at 10 dBm radio in receive mode; maximum input level at 0 dBm Min Typ Max Unit 17.8 mA 16.7 mA radio in transmit mode 10 dBm [1] 27.2 mA radio in transmit mode 8.5 dBm [1] 23.6 mA 17.8 mA M03 radio in receive mode; maximum input level at 10 dBm radio in receive mode; maximum input level at 0 dBm 16.7 mA radio in transmit mode 10 dBm [1] 27.2 mA radio in transmit mode 8.5 dBm [1] 23.6 mA 22.8 mA 181 mA M06 radio in receive mode [1] radio in transmit mode [1] To reach the maximum TX power, 2.8 V is the minimum. Table 9. Sleep mode VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD(IO) input/output supply current in sleep mode; with I/O and RC oscillator timer wake-up; Tamb = 25 C 0.73 A UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 10. Deep sleep mode VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol IDD [1] Parameter Conditions supply current deep sleep mode; measured at 25 C [1] Min Typ Max Unit 70 nA Waiting on chip RESET or I/O event. 11.2 AC characteristics 11.2.1 Radio transceiver These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V to 3.6 V and offers the improved RF characteristics shown in Table 11. All RF characteristics are measured single ended. Table 11. RF port characteristics Single-ended; Impedance = 50 [1]; VDD = 2 V to 3.6 V; Tamb = 40C to +85C; unless otherwise specified. Symbol Parameter frange frequency range [1] Conditions Min Typ Max Unit 2.4 2.485 GHz Max Unit With external matching inductors and assuming PCB layout. Table 12. Radio transceiver characteristics: +25 C VDD = 2 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Receiver M00 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 96.5 dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA 10 dBm 1 % PER, measured as sensitivity; supply current at 16.2 mA dBm 95 dBm to 10 dBm; available through UM11016 Integrated Peripherals API 4 +4 dB RSSI RSSI variation M03 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 96.5 dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA 10 dBm 1 % PER, measured as sensitivity; supply current at 16.2 mA dBm 95 dBm to 10 dBm; available through UM11016 Integrated Peripherals API 4 +4 dB RSSI RSSI variation M06 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 100 dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity dBm RSSI RSSI variation 100 dBm to 25 dBm; available through UM11016 Integrated Peripherals API 4 +4 dB Transmitter UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Table 12. Radio transceiver characteristics: +25 C …continued VDD = 2 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions output power IDD = 27.2 mA Min Typ Max Unit [1] 10 dBm M00 Po Po(cr) IDD = 23.6 mA [1] 8.5 dBm control range output power in 6 major steps and then 4 fine steps [2] 42 dB output power IDD = 27.2 mA [1] 10 dBm IDD = 23.6 mA [1] 8.5 dBm in 6 major steps and then 4 fine steps [2] 42 dB [1] 21 dBm M03 Po Po(cr) control range output power M06 output power Po [1] To reach the maximum TX power, 2.8 V is the minimum on VDD. [2] Up to an extra 2.5 dB of attenuation is available if required. 12. Federal Communication Commission Statement • This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules see Ref. 4. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: – Reorient or relocate the receiving antenna – Increase the separation between the equipment and receiver – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected – Consult the dealer or an experienced radio/TV technician for help • OEM integrators instructions – The OEM integrators are responsible for ensuring that the end-user has no manual instructions to remove or install module – The module is limited to installation in mobile or fixed applications, according to CFR 47 Part 2.1091(b) – Separate approval is required for all other operating configurations, including portable configurations with respect to CFR 47 Part 2.1093 and different antenna configurations • User guide mandatory statements UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules – User's instructions of the host device must contain the following statements in addition to operation instructions: * “This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation” * “Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment” • FCC RF Exposure requirements – User's instructions of the host device must contain the following instructions in addition to operation instructions: Avoid direct contact to the antenna, or keep it to a 20 cm minimum distance while using this equipment. This device must not be collocated or operating in conjunction with another antenna or transmitter. The JN5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms. The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi. 12.1 FCC end product labelling The final ‘end product’ should be labelled in a visible area with the following: “Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to reflect the version of the module being used inside the product. 13. Industry Canada statement This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. This device complies with Industry Canada RF radiation exposure limits set forth for general population (uncontrolled exposure). This device must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) il ne doit pas produire de brouillage, et (2) l’utilisateur du dispositif doit être prêt a accepter tout brouillage radioélectrique reçu, même si ce brouillage est susceptible de compromettre le fonctionnement du dispositif. Le présent appareil est conforme aux niveaux limites d’exigences d’exposition RF aux personnes définies par Industrie Canada. Cet appareil doit être installé afin d’offrir une distance de séparation d’au moins 20 cm avec l’utilisateur, et ne doit pas être installé à proximité ou être utilisé en conjonction avec une autre antenne ou un autre émetteur. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication. UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules The JN5169-001-M03-2 and JN5169-001-M06-2 modules have been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms. The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc). 13.1 Industry Canada end product labelling For Industry Canada purposes the following should be used: 14. “Contains Industry Canada ID IC: 8764A-JN5169Mx” (with x = 0 or 3 or 6). Footprint information for reflow soldering 16 1.27 Ø1 2.54 1.5 2.54 3.30 Dimensions in mm aaa-022825 All modules have the same footprint. Fig 5. UM11016 User manual Module PCB footprint All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 15. Package outline 16 30 1.27 2.54 2.54 3.30 Thickness: 3.5 mm aaa-022826 Dimensions in mm Fig 6. Package outline JN5169-001-M00-2 16 10.85 2.53 1.27 21 2.54 2.54 3.30 Thickness: 3.5 mm Dimensions in mm Fig 7. UM11016 User manual aaa-022827 Package outline JN5169-001-M03-2 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 16 2.81 30 1.27 2.54 2.54 3.30 Thickness: 3.5 mm Dimensions in mm Fig 8. UM11016 User manual aaa-022828 Package outline JN5169-001-M06-2 All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 16. Abbreviations Table 13. Abbreviations Acronym Description API Application Program Interface ADC Analog to Digital Converter FCC Federal Communication Commission IO Input Output OEM Original Equipment Manufacturer PCB Printed Circuit Board PER Packet Error Rate PWM Pulse Width Modulation R&TTE Radio and Telecommunications Terminal Equipment RF Radio Frequency RISC Reduce Instruction Set Computing RSSI Receive Signal Strength Indicator RTS Request-To-Send SPI Serial Peripheral Interface SVM Supply Voltage Monitor SYNTH SYNTHesizer UART Universal Asynchronous Receiver/Transmitter 17. References [1] IEEE Std 802.15.4-2011 — IEEE Std 802.15.4-2011 IEEE Standard for Information Technology. [2] JN5169 — JN5169 wireless microcontroller datasheet. [3] Wireless Connectivity — http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE LESS-CONNECTIVITY [4] Part 15 of the FCC Rules — http://www.ecfr.gov/cgi‐bin/text‐idx?SID=d01e00935bfcb0d53b914e7c8e63f383 &node=47:1.0.1.1.16&rgn=div5 UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 21 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 18. Legal information 18.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 18.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18.3 Trademarks Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product I2C-bus — logo is a trademark of NXP Semiconductors N.V. UM11016 User manual Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 22 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 19. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Variants and identifications information . . . . . . .3 Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .9 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .13 Operating conditions . . . . . . . . . . . . . . . . . . . .14 Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Active processing . . . . . . . . . . . . . . . . . . . . . . 14 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 15 RF port characteristics . . . . . . . . . . . . . . . . . . 15 Radio transceiver characteristics: +25 °C . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21 20. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view) . . . . . . . . . . . . . . . . .6 JN5169-001-M06-2 package marking (top view) . .7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .9 Module PCB footprint. . . . . . . . . . . . . . . . . . . . . .18 Package outline JN5169-001-M00-2 . . . . . . . . . .19 Package outline JN5169-001-M03-2 . . . . . . . . . .19 Package outline JN5169-001-M06-2 . . . . . . . . . .20 UM11016 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 23 of 24 UM11016 NXP Semiconductors ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules 21. Contents 1.1 1.2 2.1 2.2 2.3 5.1 5.2 7.1 7.2 8.1 8.2 10 11 11.1 11.2 11.2.1 12 12.1 13 13.1 14 15 16 17 18 18.1 18.2 18.3 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 3 Variants and identifications information . . . . . . 3 Regulatory approvals . . . . . . . . . . . . . . . . . . . . 3 Features and benefits . . . . . . . . . . . . . . . . . . . . 3 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Features: modules . . . . . . . . . . . . . . . . . . . . . . 4 Features: microcontroller . . . . . . . . . . . . . . . . . 5 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 JN5169-001-M00-2 and JN5169-001-M03-2 . . 6 JN5169-001-M06-2. . . . . . . . . . . . . . . . . . . . . . 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pinning information . . . . . . . . . . . . . . . . . . . . . . 9 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9 Functional description . . . . . . . . . . . . . . . . . . 12 JN5169 single chip wireless microcontroller. . 12 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Recommended operating conditions. . . . . . . 14 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14 DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 15 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 15 Federal Communication Commission Statement 16 FCC end product labelling . . . . . . . . . . . . . . . 17 Industry Canada statement. . . . . . . . . . . . . . . 17 Industry Canada end product labelling . . . . . . 18 Footprint information for reflow soldering . . 18 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 June 2016 Document identifier: UM11016
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