NXP Semiconductors OM12000 GSM/GPRS Module User Manual

NXP Semiconductors GSM/GPRS Module

User Manual

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NXP BU AUTOMOTIVE
ATOP 2.5G Project
TELEMATICS
OM12000 (ATOP) HW user
manual
Info
Document type
Author
Author Role
Keywords
Documentation
Raf Peeters
Content
documentation
Raf Peeters
Application HW engineer
ATOP 2.5G, Telebox mini
NXP Semiconductors
OM1200 (ATOP) Project
Summary
1.
Document purpose .................................................................................................. 3
Purpose ................................................................................................................................................... 3
Scope....................................................................................................................................................... 3
Support ................................................................................................................................................... 3
History ..................................................................................................................................................... 3
2.
3.
4.
Blockdiagram & photos ........................................................................................... 4
Powersupply & battery charger .............................................................................. 6
RF Antenna connections ........................................................................................ 10
GPRS ...................................................................................................................................................... 10
GPS ........................................................................................................................................................ 11
NFC ........................................................................................................................................................ 12
5.
6.
7.
8.
9.
10.
SIM card ................................................................................................................. 12
Clock microcontroller ............................................................................................ 13
USB......................................................................................................................... 14
PNX uart buffer ...................................................................................................... 15
CAN transceiver ..................................................................................................... 16
LED’s and buttons .................................................................................................. 18
Reset switch .......................................................................................................................................... 18
Ecall button ........................................................................................................................................... 18
LED’s...................................................................................................................................................... 18
11.
12.
Accelerometer / Eeprom / SSI1 serial interface .................................................... 20
Audio connections ................................................................................................. 22
Analog audio in ..................................................................................................................................... 22
Analog audio out ................................................................................................................................... 23
12.1.1
Earphone................................................................................................................... 23
12.1.2
Speaker ..................................................................................................................... 24
13.
14.
15.
Board technology .................................................................................................. 25
Comments User Manual ........................................................................................ 27
FCC Class statement ............................................................................................. 27
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NXP Semiconductors
1.
OM1200 (ATOP) Project
Document purpose
Purpose
Purpose of this document isto provide an uszer manual for OM12000 by
describing Telebox Mini HW, which serves as reference HW platform for NXP SW
development and demo within context of ATOP (OM12000) 2.5G project.
Scope
This document is intended for all (HW/SW engineers, customers) who need
detailed understanding of Telebox Mini v3.x HW implementation and schematics.
Support
For HW questions, issue or any problem, please contact customer support.
History
The Telebox Mini has already some history.
This new version 3.x which accommodates B2 ATOP version, and also some major
changes are implemented in the power supply circuitry.
Since this Telebox Mini aims to be a prototype for SW development and demo, there are
a lot of jumper stuff options for test purpose which customers don’t need to copy. The
default stuff option is indicated in the schematics by adding “dnp” “do not place”
markers on components not stuffed by default.
Main mechanical dimensions of this demo pcb were defined in order to fit in the small
blue demobox GEPRO 8023 from ELPAC.
As a result layout design and component choice had some restriction to fulfil the tight
pcb area restriction.
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NXP Semiconductors
2.
OM1200 (ATOP) Project
Blockdiagram & photos
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NXP Semiconductors
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OM1200 (ATOP) Project
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NXP Semiconductors
3.
OM1200 (ATOP) Project
Powersupply & battery charger
The ATOP SiP module basically has 4 powersupply inputs:

V_BATT_SW:
supplies baseband PNX, frontend GPRS poweramp, NFC part, and GPS part (via onboard
LDO’s controlled by PNX)

V_BAT_RTC_PNX:
supplies baseband RTC function (if not connected externally, internally
supplied/bypassed by V_BATT)

V_BATT_LPC:
supplies microcontroller LPC (via onboard LDO 3V0, default ON)
R67 allows for currentmeasurement on LPC domain

V_BATT_RTC:
supplies RTC function of microcontroller LPC
The ATOP also has some powersupply outputs, generated by baseband PMU function:

V_SIM:
SIM card interface

V_PERM, VREF :
for reference only, should not be externally loaded

V_IO (2V8 ):
for reference only, should not be externally loaded (supplies baseband digital interface
including SSI, GPIO, DAI, JTAG and debug)
Presence of V_IO can be detected on the microcontroller LPC via R53 on GPIO
LPC_uart1_CTS P0.17

VDD_3V0:
This is the output voltage of the onboard LDO supplying the microcontroller LPC.
This supply can be used in the application , but with limited currentload since shared
with microcontroller consumption.
(The LDO, LDS3985M30, is a 3V / 300mA output current regulator. The onboard
microcontroller LPC2368 has max 125mA at maximum activity according datasheet)
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NXP Semiconductors
OM1200 (ATOP) Project
Figure 1 :extract of schematics Telebox Mini v3.0 : powersupply & battery charger
Main supply of the design is provided by the Li‐polymer battery , in this case PLF323450
from Varta Microbattery, typical capacity 570mAh. (connector J5)
Since this battery sample has no built‐in NTC thermistor , R15 10k has been added to
allow the baseband PNX charger function detect the battery presence.
Slideswitch J4 allows total disconnection of the battery from the system to avoid
possible battery drain (on the shelve) or manually switch ON/OFF the system by the
user.
Capacitors C1 and C43 provide extra energy buffer to compensate, during GPRS
transmission slots, possible battery voltage drop due to all kind of V_BATT resistance
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NXP Semiconductors
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(total path from battery up to supply pin of GPRS frontend poweramp) like connection
wires, slideswitch, powerpath FET, pcb trace and internal battery impedance.
The value actually implemented/needed on customer boards depends on requirements
and implementation.
The battery level can be measured via resistive divider R49 / R50, connected to the ADC
input of the ATOP microcontroller LPC.
Powerpath controller LTC4412:
VSYS is the main supply connected to VBAT pins of ATOP module.
LTC4412 controls the source for this VSYS, 2 options :
‐
battery
‐
external supply/adaptor
Whichever of these 2 input supplies has the highest level will be connected to VSYS.
The external supply VIN is attached to the system via either mini USB connector or
solderpad PAD1. (stuff option via R157/R159)
VBAT of the ATOP has a maximum limit of 4.8V.
Other devices on the Telebox Mini (CAN, LPC VBUS and classD) have also maximum
limits on 5.5V.
In order to fulfil these limitation some extra circuitry has been added :
a) Diodes D16 and D12 create some voltage drop , which will depend on the current to
VSYS, on it’s turn dependent on application.
D12 can be bypassed by R24 in case the system current is high enough. We target to
have LTC4412 switched always for VIN path, if external supply is present (for this we
need for worst case, meaning when fully charged battery, minimum 4.2V at SENSE pin
of LTC4412)
b) Comparator/zener U22 will enable the path VIN_to_VDC_5V (2nd FET of dual FET T3)
as long as VIN is smaller then 5.36V, so that after diode voltage drop VSYS is less than
4.8V. Output pin1 of U22 will pulldown the gate and as such enable the PFET.
In order to be able to fulfil maximum allowed current drain from USB hosts (USB_spec:
initially during enumeration max 100mA … maximum current negotiable upto 500mA)
dual bipolar transistor Q28 (internal resistors) and Q29 is added.
This allows , in Telebox Mini applications were external supply is connected to a real
USB host bus with current limitation, and VIN R157 option is stuffed, the LPC FW to
control and force the powerpath controller LTC4412 to connect VSYS to battery source,
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NXP Semiconductors
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in case system current is expected to increase above the negotiated allowed max USB
host currentdrain.
The PNP part of Q28 will short the Gate_Source resistor R146 of VIN_to_VDC_5V FET
T3_2 when the GPIO LPC_PIPESTAT(1) P2.2 is pulled LOW.
Default after reset of LPC (input/pullup mode GPIO) this “disable” function is OFF, in
USB applications the system startup current should be limited to 100mA…
Charger function:
The ATOP baseband PNX has an integrated charger function which needs only some
external FET Si5935DC, T1 (dual FET package of which one FET is charge ON/OFF control
with bodydiode such to avoid any reverse current when OFF, the other FET is analog
controlled for chargecurrent levelsetting ) and series resistor R4 (100mOhm) to
measure chargecurrent.
Important remark:
‐
make sure the chargecurrent amplitude, programmed in baseband flash
memory, is compatible with maximum allowed chargecurrent specified in the
datasheet of the applied battery!
‐
In order to avoid overheating the charger dual FET T1 ( dissipation of 2nd FET is
equal to product (delta VIN – VBAT) * I_charge limit VIN of the external attached
charger adaptor to 5V!
(some precautions (cooling copper area) have been taken to reduce the thermal
resistance Rth_ja of T1, but physical pcb area limitation of Telebox Mini limits
cooling efficiency)
RTC backup from battery:
In order to keep RTC of LPC alive when main supply is off (external supply disconnected
and slideswitch J4 in OFF state) the LPC RTC circuitry will be kept supplied by VBAT_in
(=directly connected to battery) via dual_series diode D14 (D15 prevents reverse
current to VDD_3V0). See next stuffing option:
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NXP Semiconductors
4.
OM1200 (ATOP) Project
RF Antenna connections
GPRS
Onboard the ATOP module there is an antenna RF switch in front of the poweramp. The
Telebox Mini offers 2 ways for connecting a 50 ohm GPRS quad‐band antenna.
GSM_ANT1: SMA jack J7 (SMA 19‐70‐4‐TGG Multicomp)
GSM_ANT2: UFL jack J8 (U.FL‐R‐SMT Hirose)
This path is meant to accommodate some internal gprs antenna inside the product
housing by means of 50 ohm U.FL cable assembly.
Microcontroller GPIO ‘GSM_ANT_SWITCH’ P1.0 selects either of the paths:
GPIO P1.0
GSM_ANT1
GSM_ANT2
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NXP Semiconductors
OM1200 (ATOP) Project
OFF
ON
ON
OFF
Remark: for development this quadband GPRS antenna is used on GSM_ANT1 SMA:
MC0114015‐FME‐BU‐W, manufactured MC‐Technologies http://www.mc‐
technologies.net/en/wireless_modules/antennen‐und‐zubehoer/index.php
GPS
The ATOP module has an onboard LNA which accommodates for a passive GPS antenna.
This input of the LNA is connected to the U.FL connector J2.
This path is meant to accommodate some internal GPS antenna inside a mechanical
prototype housing by means of 50 ohm U.FL cable assembly.
In order to connect some external active GPS antenna , connector J1 accomodates for a
(longer) 50 ohm SMA cable. In this option, we use input GPS_ANT_2 which bypasses the
onboard LNA. The onboard LNA is disabled by pulling its input low via the npn part of
Q24 (controlled by GPIO LPC_PWM_1_3 P3.26).
The bias supply for the active antenna is provided via the chargepump U14 MAX1759,
configured for Vout = 4.3V. Since there is a PIN diode in the path with drop of about 1V,
this leaves about 3.3V for the antenna supply. To accommodate for other supply
requirements R102/R40 can be changed accordingly.
GPIO P3.26 will exclusively activate either the onboard LNA or the chargepump bias
supply according following truth table:
GPIO P3.26
Internal LNA/passive GPS
Bias supply/active GPS
OFF
ON
ON
OFF
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NXP Semiconductors
OM1200 (ATOP) Project
Remark: for development following active GPS patch antenna is used:
GAACZ‐A, , 5m cable , 3‐5V, manufactured by Active Robots Ltd. http://www.active‐
robots.co.uk/active‐gps‐antenna‐p‐552.html
NFC
The ATOP module has a NFC reader function onboard.
Connector J3, Molex 53261‐0371, accommodates for the NFC coil.
Stuff option C3 is for RF test , for normal use it is stuffed with 0 ohm jumper.
The cable connecting the Telebox Mini with the antenna coil should be maximum 10cm.
Remark : for development a NXP reference coils design is used.
5.
SIM card
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NXP Semiconductors
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Connector J9, CCM03‐MK3 from C&K, accommodates for SIM card insertion.
U5, PRTR5V0U4Y NXP, provides ESD protection.
The Telebox Mini has a stuff option to accommodate a pcb soldered SIM chip (U6).
(R38/R42 allow for possible future pinchange)
In order to switch access between both SIM card options, analog mux U13 multiplexes
the SIM data lines by GPIO control LPC_tracepkt(1) P2.6.
Default stuff option R48 / R47 selects connector J9.
R58 allows bypass/i.e. not to stuff the mux.
If R47 and/or U6 would be stuffed following truth table would hold:
GPIO P2.6
SIM card
SIM chip
OFF
ON
ON
OFF
6.
Clock microcontroller
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NXP Semiconductors
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There are 2 options on the Telebox Mini to source an external clock to the
microcontroller LPC. 26M_EXT is a 26MHz output clock from the ATOP baseband. Buffer
U11 buffers the clock signal , while R69/R65 resistive divider matches max voltage swing
specified by the LPC.
Another option for sourcing the LPC external clock is using the 12MHz crystal Y1 with
the LPC own internal mainoscillator. (required for USB or HS CAN feature
implementation with more stringent clock jitter requirements)
For this option: stuff R147 / R148 and remove AC coupling C18.
7.
USB
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NXP Semiconductors
OM1200 (ATOP) Project
The ATOP microcontroller LPC has a USB2.0 full speed device controller onboard which
can be accessed by mini‐B USB connector J10.
U7 provides ESD protection with integrated pi‐type filter, 33ohm series resistors and 1k5
pullup resistor (connected to Q26 for delayed device detect signalling option).
Also this USB connector is used as battery charger input.
Please refer to chapter 3 ‘powersupply and battery charger’, regarding stuffoptions
R157/R158/R159 and maximum USB host drain current limitations!
It is possible to wake up the microcontroller LPC from powerdown mode by event
detection on any GPIO from port 0 or 2. To allow wake up event from USB charger
cable insert detection , R44 connects LTC4412 ‘STAT’ signal to GPIO LPC_tracepkt(0)
P2.5. When USB_miniB connector is used as charger input, STAT will be pulled LOW
when charger is present.
8.
PNX uart buffer
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NXP Semiconductors
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In order to properly startup the baseband , there should not be any parasitic supply
current present on the PNX pins before sending “power ON” command via LPC SW. So
any input current should be avoided for all PNX IO pins (pcm, analog,…)
In order to avoid RS232 transceiver on the PNX uart lines could unintentionally supply
current, a buffer U9 has been inserted on the Telebox Mini to allow proper control by
the microcontroller LPC via GPIO LPC_CAP0_1 P1.27.
GPIO P1.27
PNX uart
Enabled
Disabled
9.
CAN transceiver
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NXP Semiconductors
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The ATOP microcontroller LPC has 2 CAN controllers onboard (CAN2.0, 1Mbit/s).
Telebox Mini accommodates one CAN controller with a high speed CAN transceiver, U2
TJA1042T, with some common mode choke option and ESD protection.
The CAN interface is only functional when VDC_5V is applied to the system (either via
USB or via external powersupply). When not powered, the transceiver has ideal passive
behaviour, not disturbing eventually connected CAN bus.
GPIO LPC_PWM_1_2 P3.25 can control standby status of the transceiver.
In standby mode there is possibility for remote wake‐up capability via the CAN bus.
Besides CAN interface, the 3p J6 Molex 53261‐0371 connector can also accommodate
for connection to the microcontroller LPC uart 0 port.
This would allow flashing new code to LPC from outside the blue mechanical box
(EINT_0, needed to bring LPC in flash mode, is available at the illuminated pushbutton
SW1)
Stuff option J6 connection:
‐R13/R14 : LPC_uart0
‐R17/R25: CAN2
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NXP Semiconductors
OM1200 (ATOP) Project
10. LED’s and buttons
Reset switch
Tact switch SW2 on the side of the board allows manual resetting the system.
Ecall button
Illuminated push button SW1 is intended as manual input from the user to initiate an
Ecall. GPIO LPC_EINT0 P2.10 is low when the button is pushed. Since it is part of port2,
this button is capable to wake up a powered down system. The button also has an
integrated red LED to allow user interaction.
LED’s
1 red LED D4 and 1 green/red LED D5 are available for user interface.
In all cases the LED’s are ON when the GPIO is set HIGH (U3/U4 are buffering invertors)
Following table provides an overview of GPIO connections to the LED’s
Red LED D4
GPIO P2.1
Green LED D5
GPIO P1.18
Red Ecall button LED
GPIO P1.28
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NXP Semiconductors
OM1200 (ATOP) Project
V3.2 changes:
Removed stuff option R28/R30 for supply of LED’s.
Since Vsys will be higher then 3V, U3 and U4 are not able to disable LED current …
Following updated schematics:
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NXP Semiconductors
OM1200 (ATOP) Project
11. Accelerometer / Eeprom / SSI1 serial interface
One synchronous serial interface SSI1 of ATOP microcontroller LPC is available for
external device/user application (for instance to connect some serial display via the
debugconnector J11)
Onboard the Telebox Mini a 3D digital output accelerometer U10 LIS302DL (ST) is
stuffed and connected with this SSI1 port as well as a SPI EEPROM U21 M95xxx.
The accelerometer has 2 configurable interrupt output lines, that allow wake up of a
powered down ATOP system (even when accelero itself in powerdown mode).
INT1
GPIO P2.0
INT2
GPIO P2.3
GPIO LPC_tracesync P2.4 selects which device (CS0 or CS1) is connected with SSI1 port.
The CS line is muxed by the 2‐input OR gate U18 (invertor U17 either selects CS_0 or
CS_1)
GPIO P2.4
CS1
CS0
OFF
ON
ON
OFF
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NXP Semiconductors
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Via resistors stuff options different combinations can be implemented for connection to
CS0 or CS1 of SSI1 interface chipselect :
Default stuffing:
‐
Accelero (CS_acc) : CS0
‐
Eeprom (CS_mem) : CS1
‐
External via debug connector (CS_ext): not connected
Another stuffoption (via R81/R99) allows for connecting the accelero in I2C mode (this
way making SSI1 also available for debuginterface connector at the same time)
Default:
Accelero in SPI mode
V3.2 changes:
a)
In order to allow linking baseband BB_PCM audio output with SSI1 channel of the
microcontroller, a special stuffing option has been added . (R162/163/164/165)
Since in this usecase, baseband PCM needs to be bus master , LPC should be configured
as slave SSI1.
In order to avoid possible conflicts with the other slave SSI1 peripherals (chipselects CS0
and CS1, SPI_memory U21 CS_mem and SPI_accelero U10 CS_acc) , both CS should be
disconnected from the bus :
Remove R116/R135 , stuff R115 (memory)
Remove R137/R140 , stuff R142 (accelero)
Also don’t use external CS_ext , don’t stuff R145 (default)
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12. Audio connections
Analog audio in
The ATOP baseband PNX has two microphone input ports :
EXTMIC_BIAS/EXTMIC_IN_P/EXTMIC_IN_N : not connected
INTMIC_BIAS/INTMIC_IN_P/INTMIC_IN_N : implemented on Telebox Mini with
necessary passive components and protection
Default stuff option provides for the differential connection mode. Connector J15
accomodates for a standard 3.5mm mono plug electret microphone. In case a small
electret microphone would be integrated in the mechanical housing, provision has been
made for a smaller 2p connector J16 Molex 53261‐0271. (J16 <> 3.5mm J15/J14 can only
exclusively be stuffed !)
In case higher bias supply is needed (like for instance automotive AKG Q400 series
preamplified mouse microphone ) , an extra DCDC convertor is added U15 MAX1896,
default configured for 8V. In this case place R133 and remove R87 (also remove
protection diode D7 since it will clip at 5V)
Enable pin of U15 can be SW controlled via 2 possible GPIO’s , P2.2 possibly conflicting
with ‘USB force battery supply’, or P1.27 possibly conflicting with PNX_uart buffer
control. To enable the DCDC, set the GPIO HIGH. Default this SW control is not stuffed.
In case voltage swing output of preamplified micro would be too large, resistors
R129/R130 could be resistive divider.
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NXP Semiconductors
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V3.2 changes :
a)
To make U15 stable when loaded , R161/C49 are required.
Following updated schematics:
Analog audio out
The ATOP baseband PNX provides some analog output channels.
12.1.1 Earphone
Telebox Mini has implemented earphone output channel EAR_OUTN/EAR_OUTP with
necessary passive components and protection.
Two stuff options are implemented :
‐
audio referenced to common mode VCM (avoids large capacitors, but could be
problem when connecting to external device with input reference to GND level)
‐
AC‐coupled outputs, reference GND
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NXP Semiconductors
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In the latter case , some annoying poweron ‘plop’ can be heared. This can be avoided by
keeping the outputs to GND level during poweron (Q12 and Q13 are small footprint ,
and have very low ON resistance to minimize plop level). Control of the ‘antiplop’
transistors is done by baseband GPIO2_BOOT0 (has pullup resistor on ATOP module)
The common mode option should be preferred since the bodydiodes of Q12/Q13 will
create some harmonic distortion at larger output swing. Nevertheless the other option
is stuffed by default to avoid possible unintentionally conflict VCM <> GND.
Connector J14 provides accommodation for a standard 3.5mm stereo plug.
12.1.2 Speaker
The ATOP baseband PNX provides option to source an 8 ohm speaker with max 500mW
output power. For this: remove R86/R90/R75/R87R78 and stuff R79/R80.
If this powerlevel is not sufficient for the application , Telebox Mini provides with an
external class D audio amplifier SA58672 from NXP, which could provide up to
1.7W/8ohm when supplied from VDC_5V . Class D feature only available when external
supply connected !
The amplifier enable pin can be SW controlled by GPIO LPC_tracepkt(3) P2.8, set HIGH
to enable.
Speaker connector J13: 2p Molex 53261‐0721.
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V3.2 changes:
a)
In order to have speaker output accessible on the 3.5mm jack connector J14 (=earphone
output default) some stuffing option is added : R100/R112.
For this usecase following stuffing should be applied :

Remove L5 /L6/R92/R93

Stuff R100/R112
Following updated schematics:
13. Board technology
The Telebox Mini is targeted to be a HW platform for SW development and demo
vehicle. It is a prototype, not intended to be mass production ready.
As such it is not advised to run very large quantity batches, there will be yield issues.
Also possibly not fully optimized for cost and assembly machine limitations.
Maximum effort has been done to keep the outline mechanical dimensions as small as
possible, integrating all features described above and still fitting the blue demo box
GEPRO 8023.
EDA tool being used is ORCAD schematic Capture and Layout v10.5.0.
DRC (design rule check) global spacing settings are set at 70um.
Standard VIA dimensions used are (padsize 0.4mm/drillhole 0.2mm) diameter.
Outline pcb dimensions : 65mm x 42.8mm
(4 halve‐circle cut‐outs, for mechanical spacer with 2mm screws : in long side of the pcb
at horizontal coordinates x=3 and x=62 and both y=0 and 42.8)
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Pcb thickness : 1.2mm
Number of layers: 6 :
1 .top
2 .gnd
3 .pwr
4 .in1
5 .in2 (=gnd2)
6 .bot
Stack buildup technology used:
Regarding the impedance control for 50 ohm RF antenna traces located on layer 1.top,
layer 5. in2 is used as reference ground in order to keep RF trace wide enough to lower
losses (instead of using layer 2.gnd). All other layers in between have been kept free of
traces and copper around the transmission lines.
Trace width : 0.9mm
GND clearance copperfill : 0.2mm
sum thickness of layers buildup: 0.852mm
Er = 4.4
copper thickness 18um >>> results in about 50 ohm :
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14. Comments User Manual
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may
cause undesired operation.
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by NXP Semicondcutors, could void the user's
authority to operate the equipment
15. FCC Class statement
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in are sidential installation. This
equipment generates uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, we cannot guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio or television technician for help.
© NXP N.V. 2010 All rights reserved
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