Nanotron Technologies NANOPAN5375V1 Communication and Real Time Location Systems in 2.4 GHz ISM Band User Manual UserMan FCC Exhibit 12

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FCC Required Exhibit 12

nanoPAN 5375 RF Module

User Manual (UserMan)

Version 1.0

NA-09-0256-0008-1.0

FCC ID: SIFNANOPAN5375V1

Document Information

nanoPAN 5375 RF Module User Manual (UserMan)

Document Information

Document Title: nanoPAN 5375 RF Module User Manual (UserMan)

Document Version: 1.0

Published (yyyy-mm-dd): 2009-03-18

Current Printing: 2009-3-18, 11:52 am

Document ID: NA-09-0256-0008-1.0

Document Status: Released

Disclaimer

Nanotron Technologies GmbH believes the information contained herein is correct and accurate at the time of release. Nanotron

Technologies GmbH reserves the right to make changes without further notice to the product to improve reliability, function or

design. Nanotron Technologies GmbH does not assume any liability or responsibility arising out of this product, as well as any

application or circuits described herein, neither does it convey any license under its patent rights.

As far as possible, significant changes to product specifications and functionality will be provided in product specific Errata

sheets, or in new versions of this document. Customers are encouraged to check the Nanotron website for the most recent

updates on products.

Trademarks

nanoNET© is a registered trademark of Nanotron Technologies GmbH. All other trademarks, registered trademarks, and product

names are the sole property of their respective owners.

This document and the information contained herein is the subject of copyright and intellectual property rights under international

form by any means, electronic, mechanical or optical, in whole or in part, without the prior written permission of Nanotron

Technologies GmbH.

Life Support Policy

These products are not designed for use in life support appli-

ances, devices, or systems where malfunction of these prod-

ucts can reasonably be expected to result in personal injury.

Nanotron Technologies GmbH customers using or selling

these products for use in such applications do so at their own

risk and agree to fully indemnify Nanotron Technologies

GmbH for any damages resulting from such improper use or

sale.

Electromagnetic Interference / Compatibility

Nearly every electronic device is susceptible to electromag-

netic interference (EMI) if inadequately shielded, designed, or

otherwise configured for electromagnetic compatibility.

To avoid electromagnetic interference and/or compatibility

conflicts, do not use this device in any facility where posted

notices instruct you to do so. In aircraft, use of any radio fre-

quency devices must be in accordance with applicable regula-

tions. Hospitals or health care facilities may be using

equipment that is sensitive to external RF energy.

With medical devices, maintain a minimum separation of 15

cm (6 inches) between pacemakers and wireless devices and

some wireless radios may interfere with some hearing aids. If

other personal medical devices are being used in the vicinity

of wireless devices, ensure that the device has been ade-

quately shielded from RF energy. In a domestic environment

this product may cause radio interference in which case the

user may be required to take adequate measures.

CAUTION! Electrostatic Sensitive Device. Pre-

caution should be used when handling the

device in order to prevent permanent damage.

FCC User Information

Statement according to FCC part 15.19:

This device complies with Part 15 of the FCC Rules. Opera-

tion is subject to the following two conditions: (1) this device

may not cause harmful interference, and (2) this device must

accept any interference received, including interference that

may cause undesired operation.

Statement according to FCC part 15.21:

Modifications not expressly approved by this company could

void the user's authority to operate the equipment.

RF exposure mobil:

The internal / external antennas used for this mobile transmit-

ter must provide a separation distance of at least 20 cm from

all persons and must not be co-located or operating in con-

junction with any other antenna or transmitter.”

Statement according to FCC part 15.105:

This equipment has been tested and found to comply with the

limits for a Class A and Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a resi-

dential installation and against harmful interference when the

equipment is operated in a commercial environment.

This equipment generates, uses, and can radiate radio fre-

quency energy and, if not installed and used in accordance

with the instructions as provided in the user manual, may

cause harmful interference to radio communications. How-

ever, there is no guarantee that interference will not occur in a

particular installation. Operation of this equipment in a resi-

dential area is likely to cause harmful interference in which

case the user will be required to correct the interference at his

or her own expense.

If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to correct

the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and

receiver.

• Connect the equipment into an outlet on a circuit different

from that to connected.

• Consult the dealer or an experienced technician for help.

Table of Contents

nanoPAN 5375 RF Module User Manual (UserMan)

Table of Contents

1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Key Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1 General / DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.2 RF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.3 Offset Clock Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.3.1 Nominal Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.4 Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1 Overview – Icc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2 Power Down Pad / Power Down Full . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.3 Pout as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.4 Icc as a Function of Pout (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.5 Icc as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5 Module Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.1 Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2 Pin Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.1 Recommended Temperature Profile for Lead Free Reflow Soldering . . . . . . . . . . . . . . . . . . . . . 11

6.2 Footprint and Recommended Landing Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

7 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

8 nanoPAN 5375 RF Test Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.2 PCB Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

List of Tables

nanoPAN 5375 RF Module User Manual (UserMan)

Intentionally Left Blank

Overview

nanoPAN 5375 RF Module User Manual (UserMan)

1 Overview

The nanoPAN 5375 Module integrates all the required components for a complete RF module

based on Nanotron’s innovative nanoLOC TRX Transceiver. At only 29 mm by 15 mm and less

than 4 mm thick, this RF module includes a balun, a band pass filter, a set of clock crystals, a 20

dBm power amplifier, as well as the nanoLOC chip and required circuitry. Figure 1 below shows the

nanoPAN 5375 RF Module with a shielding cap and label.

Figure 1: nanoPAN 5375 RF Module – top showing shielding cap

Figure 2 below shows the pad side of the nanoPAN 5375 RF Module with pins 1 and 32 indicated,

as well as dimensions.

Figure 2: nanoPAN 5375 RF Module – pad side

1.1 Key Components

Figure 3 below shows the key components of the nanoPAN 5375 RF Module.

Figure 3: nanoPAN 5375 RF Module – key components

Scale 3:1

Pin 1

Pin 32

Scale 3:1 29.0 mm

15.0 mm

32 MHz crystal

Band pass filter

nanoLOC chip

32 kHz crystal Balun

Scale 3:1

RF Switch

Power amplifier

Overview

nanoPAN 5375 RF Module User Manual (UserMan)

Table 1: Key components

Component Description

nanoLOC TRX

Transceiver

The nanoLOC chip supports a freely adjustable center frequency with two sets of 3

non-overlapping frequency channels, as well as 14 overlapping frequency channels,

all within the 2.4 GHz ISM band. These channels provide support for multiple physi-

cally independent networks and improved coexistence performance with existing 2.4

GHz wireless technologies. Data rates are selectable from 2 Mbps to 250 kbps.

Due to the chip’s unique chirp pulse, adjustment of the antenna is not critical. This sig-

nificantly simplifies the system’s installation and maintenance (“pick and place”).

A sophisticated MAC controller with CSMA/CA and TDMA support is included, as is

Forward Error Correction (FEC) and 128 bit hardware encryption. To minimize soft-

ware and microcontroller requirements, the nanoLOC chip also provides scrambling,

automatic address matching, and packet retransmission.

Integrated into the nanoLOC chip is a Digital Dispersive Delay Line (DDDL). This is

responsible for distinguishing between two possible incoming signals generated by

another nanoLOC chip. These are either an Upchirp or a Downchirp, both of which

have the same center frequency and the same bandwidth. The difference between an

Upchirp and a Downchirp occurs only in the phase information of the complex spec-

trum. This phase information is enough for the DDDL to compress a pulse at one out-

put port and expand it at the other (that is, to extend the incoming signal to the doubled

duration). In this way the DDDL acts like a matched filter for one of the possible trans-

mitted pulses.

Matching circuits

(Balun)

At the RF interface of the nanoLOC chip, a differential impedance of 200 Ω exists

which is matched to the asymmetrical 50 Ω impedance of the antenna port by a

200 Ω to 50 Ω RF balun. Additional external components at the RF interface have a

power and noise matching function that allows a sharing of the antenna without an

external TX/RX – RF switch.

ISM band pass

filter

For an improved robustness against out-of-band inferences, an ISM band pass filter is

connected at the antenna port.

32.768 kHz and

32 MHz quartz

crystals

The 32.768 kHz quartz is used for the Real Time Clock oscillator. The 32 MHz quartz

works with the internal oscillator circuitry of the nanoLOC chip.

RF switch This switch is actually two devices that are used to switch the RX / TX paths between

receive and transmit mode.

Power amplifier This amplifier gives the module high efficiency, high gain, and a high output power of

20 dBm.

Absolute Maximum Ratings

nanoPAN 5375 RF Module User Manual (UserMan)

2 Absolute Maximum Ratings

Note: It is critical that the ratings provided in Absolute Maximum Ratings be carefully observed.

Stress exceeding one or more of these limiting values may cause permanent damage to the

nanoPAN 5375 RF Module.

3 Electrical Characteristics

3.1 General / DC Parameters

Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.

Note 2: Not tested in production. Only by characterization.

Note 3: RX off, TX off, Baseband Clock on.

Note 4: RX off, TX off, Baseband Clock off.

Table 2: Absolute maximum rating

Parameter Value Unit

Min. operating temperature -40.0 °C

Max. operating temperature +85.0 °C

Max. supply voltage (Vcc)2.7 V

Max. DC current per I/O pin 2.0 mA

Table 3: General / DC-Parameters

Note Symbol Parameter Condition Min. Typ. Max. Units

–Top Operating

temperature –-40.0 –+85.0 °C

–Vcc Supply voltage –2.3 –2.7 V

2Icc Supply current TX Low power TX

Reg 0x00 75.0 mA

2Icc Supply current TX Mid power TX

Reg 0x1F 80.0 mA

2Icc Supply current TX Full power TX

Reg 0xx3F –210.0 –mA

1Icc Supply current RX Unsync (80/1/1) 51.0 mA

1Icc Supply current RX Sync (80/1/1) 46.0 mA

2Icc Supply current Ready (3) 4.0 mA

2Icc Supply current StandBy (4) 2.5 mA

2Icc Supply current Power Up 750.0 uA

1Icc Supply current PD Pad 550.0 625.0 900.0 µA

1Icc Supply current PD FULL 3.0 3.8 5.0 uA

Electrical Characteristics

nanoPAN 5375 RF Module User Manual (UserMan)

3.2 RF Parameters

Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.

Note 2: Not tested in production. Only by characterization.

Note 3: The displayed value is the minimum receive signal power required for BER = 10e-3, which is

equivalent to the maximum receiver sensitivity

3.3 Offset Clock Parameters

Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.

Table 4: RF parameters

Note Symbol Parameter Condition Min. Typ. Max. Units

–Zant Line impedance of

antenna signal ANT – – 50.0 –Ω

–Rdata Data rate –250.0 –2000 kb/s

2Psens Receiver sensitivity 22/4, FECoff –-92.0 -95.0 dBm

2Psens Receiver sensitivity 22/4, FECon –-95.0 -97.0 dBm

1Psens Receiver sensitivity 80/1, FEC 0ff –-85 -86 dBm

2Psens Receiver sensitivity 80/4, FEC 0n –-92 -94 dBm

2Ptx MIN Transmit power TX Reg 0x00 –-17.5 –dBm

2Ptx MID Transmit power TX Reg 0x1F –6.0 –dBm

1Ptx FULL Transmit power TX Reg 0x3F 18.0 19.5 –dBm

1Ptx Transmit power

- 2 harmonics TX Reg 0x3F –-60.0 –dBm

1Ptx Transmit power

- 3 harmonics TX Reg 0x3F –-65.0 –dBm

Table 5: Offset clock parameters

Note Symbol Parameter Condition Min. Typ. Max. Units

1f32m Offset Clock 32.000 MHz 25 °C, 2.5V 0.0 ppm

1f32k Offset Clock 32.768 kHz 25 °C, 2.5V 25.0 ppm

Electrical Characteristics

nanoPAN 5375 RF Module User Manual (UserMan)

3.3.1 Nominal Conditions

Table 6 below lists the nominal conditions, except otherwise noted:

3.4 Digital Interface

Note: Table 7 below lists the parameters and values for the following digital IOs:

+DIIO0, DIIO1, DIIO2, DIIO3

+UCRESET, UCIRQ

+SPITXD, SPIRXD, SPICLK, SPISSN

+/TX_RX

+/PONRESET

Table 6: Nominal conditions

+Tjunct = 30°C

+VSSA = VSSD = GND

+VDDA = VCC = +2.5 V

+Transmission / reception @ 250 kbps

+Nominal frequency bandwidth (TX/RX)

B = 22 MHz @ -30 dBr

+Raw data mode

+No CRC

+No FEC

+No encryption

+Receiver synchronized

+Bit scrambling

+BER = 0.001 during receive mode

+RF output power (PEP) during transmit phase

= 20 dBm EIRP measured during continuous

transmission

+Nominal process

+All RF ports are impedance matched according to

the specification

+All RF power are measured on the IC terminals

(pins)

+For link distance measurement, two identical

nanoLOC systems are used

Table 7: Digital Interface to Sensor / Actor

Symbol Parameter Value Unit

– Number of general purpose input/outputs 4 Number

– Width of each interface 1 Bit

– Direction In/Out

(bi-directional, open-

drain with pull-up

–

– Type Programmable –

CIN Logic Input Capacitance 2.5 pF

Input Voltage

VIL Low level input voltage (minimum) 0.2 x VCC V

VIH High level input voltage (maximum) 0.7 x VCC V

Output Voltage

VOL Low level output voltage (maximum) 0.3 V

VOH High level output voltage (minimum) VCC - 0.3 V

– Maximum output current 2 mA

RUP Equivalent pull-up resistance (minimum)1

1. Can be programmed in nanoLOC TRX. Default is off.

50 kΩ

RUP Equivalent pull-up resistance (maximum)1193 kΩ

RDN Equivalent pull-down resistance (minimum)150 kΩ

RDN Equivalent pull-down resistance (maximum)1275 kΩ

Power Management

nanoPAN 5375 RF Module User Manual (UserMan)

4 Power Management

4.1 Overview – Icc

Figure 4: Typical Icc current drain for different operating modes

4.2 Power Down Pad / Power Down Full

Figure 5: Typical Icc current drain for Power Down Pad / Full

Icc / mA

Power Management

nanoPAN 5375 RF Module User Manual (UserMan)

4.3 Pout as a Function of Tx Register (Typical)

Figure 6: Power management – Pout as a function of Tx register (typical)

4.4 Icc as a Function of Pout (Typical)

Figure 7: Power management – Icc as a function of Pout (typical)

-25

-20

-15

-10

-5

Pout /dBm

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63

110

130

Icc / mA

150

170

190

-25 -20 -15 -10 -5 0 5 10 15 20 25

Pout dBm

Power Management

nanoPAN 5375 RF Module User Manual (UserMan)

4.5 Icc as a Function of Tx Register (Typical)

Figure 8: Power management - Icc as a function of Tx register (typical)

100

150

200

250

Icc / mA

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63

Module Layout

nanoPAN 5375 RF Module User Manual (UserMan)

5 Module Layout

5.1 Measures

Figure 9: nanoPAN 5375 RF Module – measures

5.2 Pin Layout

Figure 10: nanoPAN 5375 RF Module – pins (bottom view)

Figure 11: nanoPAN 5375 RF Module – pin layout (bottom view)

Note: See section 5.3: Pin Description on page 10 for details on the nanoPAN 5375 RF Module

pinning.

15.0

29.0 3.8

Unit = mm

Scale 3:1

Pin 1

Pin 32

17 18 19 20 21

GND

VCC

GND

22 23 24 25 26

GND

ANT

GND

/TX_/RX

54321

SPICLK

GND

VCC

10 9 8 7 6

DIIO2

DIIO3

SPITXD

UCVCC

SPIRXD

GND

/PONRESET

DIIO0

DIIO1

GND

UCIRQ

UCRESET

/SPISSN

Scale 3:1

GND

Module Layout

nanoPAN 5375 RF Module User Manual (UserMan)

5.3 Pin Description

Table 8: nanoPAN 5375 RF Module – pin description

Pin Signal Description Direction

1GND Ground connection (0Vdc) –

2VCC Positive supply voltage Power

3GND Ground connection (0Vdc) –

4GND Ground connection (0Vdc) –

5SPICLK SPI: CLK3Input

6UCVCC1

1. Should have a pull-down of between 100 kΩ and 1 MΩ if power-down mode is used.

Power Supply for µc Output

7SPITXD2

2. SPITXD is SPI data output from the module to the microcontroller. This pin is open-drain as default. This pin must have a pull-up to

Vcc because the pin is driven only when a logical 0 is sent from nanoLOC to the SPI marker. Reconnected value: 100 k

Ω

. This pin

can be programmed as push-pull output. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide and the nano-

LOC SPI Application Note.)

SPI: TX Transmit Data (MISO)3

3. nanoLOC TRX is always a SPI slave device.

Output

8SPIRXD SPI: RX Receive Data (MOSI)3Input

9DIIO34

4. This pin should have a Pull-Down to GND, if not used. Recommended value: 1 M

Ω

Digital IO pin 3 for nanoLOC chip Input/Output

10 DIIO24Digital IO pin 2 for nanoLOC chip Input/Output

11 DIIO14Digital IO pin 1 for nanoLOC chip Input/Output

12 DIIO04Digital IO pin 0 for nanoLOC chip Input/Output

13 /PONRESET Power on reset signal Input

14 GND Ground connection (0Vdc) –

15 GND Ground connection (0Vdc) –

16 GND Ground connection (0Vdc) –

17 GND Ground connection (0Vdc) –

18 GND Ground connection (0Vdc) –

19 GND Ground connection (0Vdc) –

20 GND Ground connection (0Vdc) –

21 VCC internally connected to VCC (Pin 2) Power

22 GND Ground connection (0Vdc) –

23 GND Ground connection (0Vdc) –

24 ANT 50 Ohm RX/TX connection to antenna Input / Output

25 GND Ground connection (0Vdc) –

26 /TX_RX5

5. /TX_RX is Open-Drain output. It must have a Pull-Up to UCVCC if used. Imax: 2mA.

Status Tx / Rx6

6. Should be used as input signal to a logical input.

Output

27 GND Ground connection (0Vdc) –

28 GND Ground connection (0Vdc) –

29 GND Ground connection (0Vdc) –

30 UCIRQ7

7. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 M

Ω

. Default is Open-Drain. and can be programmed as Push-

Pull. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide.)

Interrupt request for µc Output

31 UCRESET8

8. This pin should have a pull-up of 75 K

Ω

and a capacitor of 1 nF to GND if used as controller input signal.

Reset for µc Output

32 /SPISSN9

9. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 M

Ω

SPI: Slave Select Input

Soldering Information

nanoPAN 5375 RF Module User Manual (UserMan)

6 Soldering Information

6.1 Recommended Temperature Profile for Lead Free Reflow Soldering

Figure 12: Recommended temperature profile for reflow soldering (J-STD-020C)

6.2 Footprint and Recommended Landing Pattern

The same dimensions for the solder paste screen are recommended, depending on the solder

screen thickness.

Figure 13: nanoPAN 5375 RF Module footprint – pad configuration (top view)

29.0

28.8

15 14.8 9.4

7.8 7.8

8.4

1.4

2.7 0.1 0.2 1.4 1.6

1.5

1.6

Pin 1 Pin 32 Pin 10

nanoPAN5375 RF Module

Soldering Information

nanoPAN 5375 RF Module User Manual (UserMan)

Figure 14: nanoPAN 5375 RF Module – landing pattern

1 Details of the landing pattern are dependent on the technology and should be defined by the

assembler.

2 For manual setting of the module, it is recommended to use the corner or side marker in the top

layer (copper) or stop mask.

3 For automatic assembly use pattern marker of the carrier board.

29.60

15.7

2.7 0.60 1.00 1.60

1.90

Pin 1

Pin 32 Pin 10

1.6

PCB Layout

nanoPAN 5375 RF Module User Manual (UserMan)

7 PCB Layout

Figure 15: nanoPAN 5375 RF Module – top side

Figure 16: nanoPAN 5375 RF Module – bottom side (inverted)

Figure 17: nanoPAN 5375 RF Module – components top side

PCB Layout

nanoPAN 5375 RF Module User Manual (UserMan)

Intentionally Left Blank

nanoPAN 5375 RF Test Module

nanoPAN 5375 RF Module User Manual (UserMan)

8 nanoPAN 5375 RF Test Module

8.1 Overview

The nanoPAN 5375 RF Test Module was designed for testing and measurement purposes only. It

was used during measurements and simulations to determine parameters published in this docu-

ment, unless otherwise specified. For conducting tests purposes, the nanoPAN 5375 RF Test Mod-

ule includes a 50 Ω coaxial SMA connector.

Figure 18: nanoPAN 5375 RF Test Module

8.2 PCB Layout

Figure 19: nanoPAN 5375 RF Test Module – top layer

nanoPAN 5375 RF Test Module

nanoPAN 5375 RF Module User Manual (UserMan)

Figure 20: nanoPAN 5375 RF Test Module – bottom layer (inverted)

Figure 21: nanoPAN 5375 RF Test Module – measures

Scale = 2:1

2.4 GHz antenna

SMA connector

38.5

Unit = mm

Scale 1:1

38.5

Revision History

nanoPAN 5375 RF Module User Manual (UserMan)

Revision History

Version Date Description/Changes

1.0 2009-03-18 Initial version.

About Nanotron Technologies GmbH

nanoPAN 5375 RF Module User Manual (UserMan)

About Nanotron Technologies GmbH

Nanotron Technologies GmbH develops world-class wireless products for demanding applications based on

its patented Chirp transmission system - an innovation that guarantees high robustness, optimal use of the

available bandwidth, and low energy consumption. Since the beginning of 2005, Nanotron's Chirp technol-

ogy has been a part of the IEEE 802.15.4a draft standard for wireless PANs which require extremely robust

communication and low power consumption.

ICs and RF modules include nanoNET TRX Transceiver, nanoLOC TRX Transceiver, and ready-to-use or

custom wireless solutions. These include, but are not limited to, industrial monitoring and control applica-

tions, medical applications (Active RFID), security applications, and Real Time Location Systems (RTLS).

nanoNET and nanoLOC are certified in Europe, United States, and Japan and supplied to customers world-

wide.

Headquartered in Berlin, Germany, Nanotron Technologies GmbH was founded in 1991 and is an active

member of IEEE and the ZigBee alliance.

Further Information

For more information about this product and other products from Nanotron Technologies, contact a sales

representative at the following address:

Nanotron Technologies GmbH

Alt-Moabit 60

10555 Berlin, Germany

Phone: +49 30 399 954 - 0

Fax: +49 30 399 954 - 188

Email: sales@nanotron.com

Internet: www.nanotron.com

Nanotron Technologies NANOPAN5375V1 Communication and Real Time Location Systems in 2.4 GHz ISM Band User Manual UserMan FCC Exhibit 12

Nanotron Technologies GmbH Communication and Real Time Location Systems in 2.4 GHz ISM Band UserMan FCC Exhibit 12

UserMan

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