Nanotron Technologies NANOPAN5375V1 Communication and Real Time Location Systems in 2.4 GHz ISM Band User Manual UserMan FCC Exhibit 12
Nanotron Technologies GmbH Communication and Real Time Location Systems in 2.4 GHz ISM Band UserMan FCC Exhibit 12
UserMan
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| Mirror Download [FCC.gov] | |
| Document ID | 1085876 |
| Application ID | qU2i7uMGVVJ8ECVQfYrNIg== |
| Document Description | UserMan |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 43.74kB (546792 bits) |
| Date Submitted | 2009-03-26 00:00:00 |
| Date Available | 2009-03-26 00:00:00 |
| Creation Date | 2009-03-18 14:40:06 |
| Producing Software | Acrobat Distiller 6.0.1 (Windows) |
| Document Lastmod | 2009-03-18 14:48:09 |
| Document Title | UserMan - FCC Exhibit 12 |
| Document Creator | FrameMaker 8.0 |
| Document Author: | Nanotron Technologies GmbH |
FCC Required Exhibit 12 nanoPAN 5375 RF Module User Manual (UserMan) Version 1.0 NA-09-0256-0008-1.0 FCC ID: SIFNANOPAN5375V1 Document Information nanoPAN 5375 RF Module User Manual (UserMan) Document Information Document Title: nanoPAN 5375 RF Module User Manual (UserMan) Document Version: 1.0 Published (yyyy-mm-dd): 2009-03-18 Current Printing: 2009-3-18, 11:52 am Document ID: NA-09-0256-0008-1.0 Document Status: Released Disclaimer Nanotron Technologies GmbH believes the information contained herein is correct and accurate at the time of release. Nanotron Technologies GmbH reserves the right to make changes without further notice to the product to improve reliability, function or design. Nanotron Technologies GmbH does not assume any liability or responsibility arising out of this product, as well as any application or circuits described herein, neither does it convey any license under its patent rights. As far as possible, significant changes to product specifications and functionality will be provided in product specific Errata sheets, or in new versions of this document. Customers are encouraged to check the Nanotron website for the most recent updates on products. Trademarks nanoNET© is a registered trademark of Nanotron Technologies GmbH. All other trademarks, registered trademarks, and product names are the sole property of their respective owners. This document and the information contained herein is the subject of copyright and intellectual property rights under international convention. All rights reserved. No part of this document may be reproduced, stored in a retrieval system, or transmitted in any form by any means, electronic, mechanical or optical, in whole or in part, without the prior written permission of Nanotron Technologies GmbH. Copyright © 2009 Nanotron Technologies GmbH. Life Support Policy These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nanotron Technologies GmbH customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nanotron Technologies GmbH for any damages resulting from such improper use or sale. Electromagnetic Interference / Compatibility Nearly every electronic device is susceptible to electromagnetic interference (EMI) if inadequately shielded, designed, or otherwise configured for electromagnetic compatibility. To avoid electromagnetic interference and/or compatibility conflicts, do not use this device in any facility where posted FCC User Information Statement according to FCC part 15.19: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Statement according to FCC part 15.21: Modifications not expressly approved by this company could void the user's authority to operate the equipment. RF exposure mobil: The internal / external antennas used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.” Statement according to FCC part 15.105: This equipment has been tested and found to comply with the limits for a Class A and Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide Page ii NA-09-0256-0008-1.0 notices instruct you to do so. In aircraft, use of any radio frequency devices must be in accordance with applicable regulations. Hospitals or health care facilities may be using equipment that is sensitive to external RF energy. With medical devices, maintain a minimum separation of 15 cm (6 inches) between pacemakers and wireless devices and some wireless radios may interfere with some hearing aids. If other personal medical devices are being used in the vicinity of wireless devices, ensure that the device has been adequately shielded from RF energy. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. CAUTION! Electrostatic Sensitive Device. Precaution should be used when handling the device in order to prevent permanent damage. reasonable protection against harmful interference in a residential installation and against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions as provided in the user manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his or her own expense. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to connected. • Consult the dealer or an experienced technician for help. © 2009 Nanotron Technologies GmbH. Table of Contents nanoPAN 5375 RF Module User Manual (UserMan) Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Key Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 General / DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.2 RF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.3 Offset Clock Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.3.1 Nominal Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.4 Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.1 Overview – Icc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.2 Power Down Pad / Power Down Full . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.3 Pout as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.4 Icc as a Function of Pout (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.5 Icc as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Module Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 Pin Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 Recommended Temperature Profile for Lead Free Reflow Soldering . . . . . . . . . . . . . . . . . . . . . 11 6.2 Footprint and Recommended Landing Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 nanoPAN 5375 RF Test Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.2 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1 List of Tables nanoPAN 5375 RF Module User Manual (UserMan) Intentionally Left Blank Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Overview nanoPAN 5375 RF Module User Manual (UserMan) 1 Overview The nanoPAN 5375 Module integrates all the required components for a complete RF module based on Nanotron’s innovative nanoLOC TRX Transceiver. At only 29 mm by 15 mm and less than 4 mm thick, this RF module includes a balun, a band pass filter, a set of clock crystals, a 20 dBm power amplifier, as well as the nanoLOC chip and required circuitry. Figure 1 below shows the nanoPAN 5375 RF Module with a shielding cap and label. Scale 3:1 Figure 1: nanoPAN 5375 RF Module – top showing shielding cap Figure 2 below shows the pad side of the nanoPAN 5375 RF Module with pins 1 and 32 indicated, as well as dimensions. Scale 3:1 29.0 mm 15.0 mm Pin 32 Pin 1 Figure 2: nanoPAN 5375 RF Module – pad side 1.1 Key Components Figure 3 below shows the key components of the nanoPAN 5375 RF Module. Scale 3:1 32 kHz crystal Balun RF Switch 32 MHz crystal Power amplifier nanoLOC chip Band pass filter Figure 3: nanoPAN 5375 RF Module – key components © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1 1 Overview nanoPAN 5375 RF Module User Manual (UserMan) Table 1: Key components Component Description The nanoLOC chip supports a freely adjustable center frequency with two sets of 3 non-overlapping frequency channels, as well as 14 overlapping frequency channels, all within the 2.4 GHz ISM band. These channels provide support for multiple physically independent networks and improved coexistence performance with existing 2.4 GHz wireless technologies. Data rates are selectable from 2 Mbps to 250 kbps. Due to the chip’s unique chirp pulse, adjustment of the antenna is not critical. This significantly simplifies the system’s installation and maintenance (“pick and place”). nanoLOC TRX Transceiver A sophisticated MAC controller with CSMA/CA and TDMA support is included, as is Forward Error Correction (FEC) and 128 bit hardware encryption. To minimize software and microcontroller requirements, the nanoLOC chip also provides scrambling, automatic address matching, and packet retransmission. Integrated into the nanoLOC chip is a Digital Dispersive Delay Line (DDDL). This is responsible for distinguishing between two possible incoming signals generated by another nanoLOC chip. These are either an Upchirp or a Downchirp, both of which have the same center frequency and the same bandwidth. The difference between an Upchirp and a Downchirp occurs only in the phase information of the complex spectrum. This phase information is enough for the DDDL to compress a pulse at one output port and expand it at the other (that is, to extend the incoming signal to the doubled duration). In this way the DDDL acts like a matched filter for one of the possible transmitted pulses. Matching circuits (Balun) At the RF interface of the nanoLOC chip, a differential impedance of 200 Ω exists which is matched to the asymmetrical 50 Ω impedance of the antenna port by a 200 Ω to 50 Ω RF balun. Additional external components at the RF interface have a power and noise matching function that allows a sharing of the antenna without an external TX/RX – RF switch. ISM band pass filter For an improved robustness against out-of-band inferences, an ISM band pass filter is connected at the antenna port. 32.768 kHz and 32 MHz quartz crystals The 32.768 kHz quartz is used for the Real Time Clock oscillator. The 32 MHz quartz works with the internal oscillator circuitry of the nanoLOC chip. RF switch This switch is actually two devices that are used to switch the RX / TX paths between receive and transmit mode. Power amplifier This amplifier gives the module high efficiency, high gain, and a high output power of 20 dBm. Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. 2 Absolute Maximum Ratings nanoPAN 5375 RF Module User Manual (UserMan) 2 Absolute Maximum Ratings Table 2: Absolute maximum rating Parameter Value Unit Min. operating temperature -40.0 °C Max. operating temperature +85.0 °C Max. supply voltage (Vcc) 2.7 Max. DC current per I/O pin 2.0 mA Note: It is critical that the ratings provided in Absolute Maximum Ratings be carefully observed. Stress exceeding one or more of these limiting values may cause permanent damage to the nanoPAN 5375 RF Module. 3 Electrical Characteristics 3.1 General / DC Parameters Table 3: General / DC-Parameters Note Symbol Parameter Condition Min. Typ. Max. Units – Top Operating temperature – -40.0 – +85.0 °C – Vcc Supply voltage – 2.3 – 2.7 Icc Supply current TX Low power TX Reg 0x00 75.0 mA Icc Supply current TX Mid power TX Reg 0x1F 80.0 mA Icc Supply current TX Full power TX Reg 0xx3F Icc Supply current RX Unsync (80/1/1) 51.0 mA Icc Supply current RX Sync (80/1/1) 46.0 mA Icc Supply current Ready (3) 4.0 mA Icc Supply current StandBy (4) 2.5 mA Icc Supply current Power Up 750.0 uA Icc Supply current PD Pad 550.0 625.0 900.0 µA Icc Supply current PD FULL 3.0 3.8 5.0 uA – 210.0 – mA Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C. Note 2: Not tested in production. Only by characterization. Note 3: RX off, TX off, Baseband Clock on. Note 4: RX off, TX off, Baseband Clock off. © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 3 3 3.2 Electrical Characteristics nanoPAN 5375 RF Module User Manual (UserMan) RF Parameters Table 4: RF parameters Note Symbol – Zant – Parameter Condition Min. Typ. Max. Units Line impedance of antenna signal ANT – – 50.0 – Ω Rdata Data rate – 250.0 – 2000 kb/s Psens Receiver sensitivity 22/4, FECoff – -92.0 -95.0 dBm Psens Receiver sensitivity 22/4, FECon – -95.0 -97.0 dBm Psens Receiver sensitivity 80/1, FEC 0ff – -85 -86 dBm Psens Receiver sensitivity 80/4, FEC 0n – -92 -94 dBm Ptx MIN Transmit power TX Reg 0x00 – -17.5 – dBm Ptx MID Transmit power TX Reg 0x1F – 6.0 – dBm Ptx FULL Transmit power TX Reg 0x3F 18.0 19.5 – dBm Ptx Transmit power - 2 harmonics TX Reg 0x3F – -60.0 – dBm Ptx Transmit power - 3 harmonics TX Reg 0x3F – -65.0 – dBm Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C. Note 2: Not tested in production. Only by characterization. Note 3: The displayed value is the minimum receive signal power required for BER = 10e-3, which is equivalent to the maximum receiver sensitivity 3.3 Offset Clock Parameters Table 5: Offset clock parameters Note Symbol Parameter Condition Min. Typ. Max. Units f32m Offset Clock 32.000 MHz 25 °C, 2.5V 0.0 ppm f32k Offset Clock 32.768 kHz 25 °C, 2.5V 25.0 ppm Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C. Page 4 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Electrical Characteristics nanoPAN 5375 RF Module User Manual (UserMan) 3.3.1 Nominal Conditions Table 6 below lists the nominal conditions, except otherwise noted: Table 6: Nominal conditions + Tjunct = 30°C + BER = 0.001 during receive mode + VSSA = VSSD = GND + RF output power (PEP) during transmit phase = 20 dBm EIRP measured during continuous transmission + VDDA = VCC = +2.5 V + Transmission / reception @ 250 kbps + Nominal process + Nominal frequency bandwidth (TX/RX) + All RF ports are impedance matched according to B = 22 MHz @ -30 dBr the specification + Raw data mode + All RF power are measured on the IC terminals + No CRC (pins) + No FEC + For link distance measurement, two identical nanoLOC systems are used + No encryption + Receiver synchronized + Bit scrambling 3.4 Digital Interface Note: Table 7 below lists the parameters and values for the following digital IOs: DIIO0, DIIO1, DIIO2, DIIO3 UCRESET, UCIRQ SPITXD, SPIRXD, SPICLK, SPISSN /TX_RX /PONRESET Table 7: Digital Interface to Sensor / Actor Symbol Parameter Value Unit – Number of general purpose input/outputs Number – Width of each interface Bit – Direction In/Out (bi-directional, opendrain with pull-up – – Type Programmable – 2.5 pF CIN Logic Input Capacitance Input Voltage VIL Low level input voltage (minimum) 0.2 x VCC VIH High level input voltage (maximum) 0.7 x VCC Output Voltage VOL Low level output voltage (maximum) 0.3 VOH High level output voltage (minimum) VCC - 0.3 mA 50 kΩ – Maximum output current RUP Equivalent pull-up resistance RUP Equivalent pull-up resistance (maximum)1 193 kΩ RDN Equivalent pull-down resistance (minimum)1 50 kΩ RDN Equivalent pull-down resistance (maximum)1 275 kΩ 1. (minimum)1 Can be programmed in nanoLOC TRX. Default is off. © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 5 4 Power Management nanoPAN 5375 RF Module User Manual (UserMan) 4 Power Management Overview – Icc Icc / mA 4.1 Figure 4: Typical Icc current drain for different operating modes Power Down Pad / Power Down Full Icc / mA 4.2 Figure 5: Typical Icc current drain for Power Down Pad / Full Page 6 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Power Management nanoPAN 5375 RF Module User Manual (UserMan) 4.3 Pout as a Function of Tx Register (Typical) 25 20 15 10 Pout /dBm -5 -10 -15 -20 -25 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 Figure 6: Power management – Pout as a function of Tx register (typical) 4.4 Icc as a Function of Pout (Typical) 190 170 150 Icc / mA 130 110 90 70 50 -25 -20 -15 -10 -5 10 15 20 25 Pout dBm Figure 7: Power management – Icc as a function of Pout (typical) © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 7 4 4.5 Power Management nanoPAN 5375 RF Module User Manual (UserMan) Icc as a Function of Tx Register (Typical) 250 200 Icc / mA 150 100 50 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 Register 0x44: TxOutputPower0 Figure 8: Power management - Icc as a function of Tx register (typical) Page 8 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Module Layout nanoPAN 5375 RF Module User Manual (UserMan) 5 Module Layout 5.1 Measures Unit = mm Scale 3:1 3.8 29.0 15.0 Figure 9: nanoPAN 5375 RF Module – measures 5.2 Pin Layout Scale 3:1 Pin 32 Pin 1 17 18 19 20 21 /TX_/RX GND ANT GND GND VCC GND GND GND Scale 3:1 GND Figure 10: nanoPAN 5375 RF Module – pins (bottom view) 22 23 24 25 26 GND 16 27 GND GND 15 28 GND UCRESET 32 /SPISSN DIIO3 DIIO2 10 9 GND 31 11 VCC 12 DIIO1 GND DIIO0 GND UCIRQ SPICLK GND 30 UCVCC 29 13 SPITXD 14 SPIRXD GND /PONRESET Figure 11: nanoPAN 5375 RF Module – pin layout (bottom view) Note: See section 5.3: Pin Description on page 10 for details on the nanoPAN 5375 RF Module pinning. © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 9 5 Module Layout 5.3 Pin Description nanoPAN 5375 RF Module User Manual (UserMan) Table 8: nanoPAN 5375 RF Module – pin description Pin Signal Description GND Ground connection (0Vdc) VCC Positive supply voltage GND Ground connection (0Vdc) – GND Ground connection (0Vdc) – SPICLK UCVCC SPI: CLK3 Direction – Power Input Power Supply for µc Output SPITXD2 SPI: TX Transmit Data (MISO)3 Output SPIRXD SPI: RX Receive Data (MOSI)3 Input DIIO34 Digital IO pin 3 for nanoLOC chip Input/Output 10 DIIO24 Digital IO pin 2 for nanoLOC chip Input/Output 11 DIIO14 Digital IO pin 1 for nanoLOC chip Input/Output 12 DIIO04 Digital IO pin 0 for nanoLOC chip Input/Output 13 /PONRESET 14 GND Ground connection (0Vdc) – 15 GND Ground connection (0Vdc) – 16 GND Ground connection (0Vdc) – 17 GND Ground connection (0Vdc) – 18 GND Ground connection (0Vdc) – 19 GND Ground connection (0Vdc) – 20 GND Ground connection (0Vdc) – 21 VCC internally connected to VCC (Pin 2) 22 GND Ground connection (0Vdc) – 23 GND Ground connection (0Vdc) – 24 ANT 50 Ohm RX/TX connection to antenna 25 GND Ground connection (0Vdc) 26 /TX_RX5 27 GND Ground connection (0Vdc) – 28 GND Ground connection (0Vdc) – 29 GND Ground connection (0Vdc) – 30 UCIRQ7 31 UCRESET8 32 /SPISSN9 1. 2. 3. 4. 5. 6. 7. 8. 9. Power on reset signal Status Tx / Rx6 Input Power Input / Output – Output Interrupt request for µc Output Reset for µc Output SPI: Slave Select Input Should have a pull-down of between 100 kΩ and 1 MΩ if power-down mode is used. SPITXD is SPI data output from the module to the microcontroller. This pin is open-drain as default. This pin must have a pull-up to Vcc because the pin is driven only when a logical 0 is sent from nanoLOC to the SPI marker. Reconnected value: 100 kΩ. This pin can be programmed as push-pull output. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide and the nanoLOC SPI Application Note.) nanoLOC TRX is always a SPI slave device. This pin should have a Pull-Down to GND, if not used. Recommended value: 1 MΩ. /TX_RX is Open-Drain output. It must have a Pull-Up to UCVCC if used. Imax: 2mA. Should be used as input signal to a logical input. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 MΩ. Default is Open-Drain. and can be programmed as PushPull. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide.) This pin should have a pull-up of 75 KΩ and a capacitor of 1 nF to GND if used as controller input signal. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 MΩ. Page 10 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Soldering Information nanoPAN 5375 RF Module User Manual (UserMan) 6 Soldering Information 6.1 Recommended Temperature Profile for Lead Free Reflow Soldering Figure 12: Recommended temperature profile for reflow soldering (J-STD-020C) 6.2 Footprint and Recommended Landing Pattern The same dimensions for the solder paste screen are recommended, depending on the solder screen thickness. 29.0 28.8 1.4 7.8 8.4 7.8 15 14.8 9.4 1.5 Pin 32 1.6 nanoPAN5375 RF Module Pin 1 Pin 10 2.7 0.1 0.2 1.4 1.6 Figure 13: nanoPAN 5375 RF Module footprint – pad configuration (top view) © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 11 6 Soldering Information nanoPAN 5375 RF Module User Manual (UserMan) 29.60 1.6 15.7 1.90 Pin 32 Pin 10 Pin 1 2.7 0.60 1.00 1.60 Figure 14: nanoPAN 5375 RF Module – landing pattern Details of the landing pattern are dependent on the technology and should be defined by the assembler. For manual setting of the module, it is recommended to use the corner or side marker in the top layer (copper) or stop mask. For automatic assembly use pattern marker of the carrier board. Page 12 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. PCB Layout nanoPAN 5375 RF Module User Manual (UserMan) 7 PCB Layout Scale 3:1 Figure 15: nanoPAN 5375 RF Module – top side Scale 3:1 Figure 16: nanoPAN 5375 RF Module – bottom side (inverted) Scale 3:1 Figure 17: nanoPAN 5375 RF Module – components top side © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 13 7 PCB Layout nanoPAN 5375 RF Module User Manual (UserMan) Intentionally Left Blank Page 14 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. nanoPAN 5375 RF Test Module nanoPAN 5375 RF Module User Manual (UserMan) 8 nanoPAN 5375 RF Test Module 8.1 Overview The nanoPAN 5375 RF Test Module was designed for testing and measurement purposes only. It was used during measurements and simulations to determine parameters published in this document, unless otherwise specified. For conducting tests purposes, the nanoPAN 5375 RF Test Module includes a 50 Ω coaxial SMA connector. Figure 18: nanoPAN 5375 RF Test Module 8.2 PCB Layout Figure 19: nanoPAN 5375 RF Test Module – top layer © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 15 8 nanoPAN 5375 RF Test Module nanoPAN 5375 RF Module User Manual (UserMan) Scale = 2:1 Figure 20: nanoPAN 5375 RF Test Module – bottom layer (inverted) SMA connector Unit = mm Scale 1:1 38.5 2.4 GHz antenna 38.5 Figure 21: nanoPAN 5375 RF Test Module – measures Page 16 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH. Revision History nanoPAN 5375 RF Module User Manual (UserMan) Revision History Version Date 1.0 2009-03-18 Description/Changes Initial version. © 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 17 About Nanotron Technologies GmbH nanoPAN 5375 RF Module User Manual (UserMan) About Nanotron Technologies GmbH Nanotron Technologies GmbH develops world-class wireless products for demanding applications based on its patented Chirp transmission system - an innovation that guarantees high robustness, optimal use of the available bandwidth, and low energy consumption. Since the beginning of 2005, Nanotron's Chirp technology has been a part of the IEEE 802.15.4a draft standard for wireless PANs which require extremely robust communication and low power consumption. ICs and RF modules include nanoNET TRX Transceiver, nanoLOC TRX Transceiver, and ready-to-use or custom wireless solutions. These include, but are not limited to, industrial monitoring and control applications, medical applications (Active RFID), security applications, and Real Time Location Systems (RTLS). nanoNET and nanoLOC are certified in Europe, United States, and Japan and supplied to customers worldwide. Headquartered in Berlin, Germany, Nanotron Technologies GmbH was founded in 1991 and is an active member of IEEE and the ZigBee alliance. Further Information For more information about this product and other products from Nanotron Technologies, contact a sales representative at the following address: Nanotron Technologies GmbH Alt-Moabit 60 10555 Berlin, Germany Phone: +49 30 399 954 - 0 Fax: +49 30 399 954 - 188 Email: sales@nanotron.com Internet: www.nanotron.com Page 18 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.
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