Nikon NEXIVVMR If Not Then NEXIV
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Destined to Improve Quality
The NEXIV VMR Series
Destined to Improve Qualit
y
CNC Video Measuring Systems
This brochure is printed on recycled paper made from 40% used material.
Specifications and equipment are subject to change without any notice or obligation
on the part of the manufacturer. January 2005 ©2005 NIKON CORPORATION
Printed in Japan (0501- xx)T Code No. 2CE-IWTH-2
www.nikon.com/
Fuji Bldg., 2-3, Marunouchi 3-chome, Chiyoda-ku,
Tokyo 100-8331, Japan
NIKON CORPORATION
NIKON INSTECH CO., LTD.
Parale Mitsui Bldg., 8, Higashida-cho, Kawasaki-ku,
Kawasaki, Kanagawa 210-0005, Japan
phone: +81-44-223-2177 fax: +81-44-223-2182
www.nikon-instruments.jp/eng/
NIKON INSTRUMENTS (SHANGHAI) CO., LTD.
CHINA phone: +86-21-5058-5055 fax: +86-21-5058-5060
(Beijing office)
CHINA phone: +86-10-5869-2255 fax: +86-10-5869-2277
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SINGAPORE phone: +65-6559-3618 fax: +65-6559-3668
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MALAYSIA phone: +60-3-78763887 fax: +60-3-78763387
NIKON INSTRUMENTS EUROPE B.V.
P.O. Box 222, 1170 AE Badhoevedorp, The Netherlands
phone: +31-20-44-96-222 fax: +31-20-44-96-298
www.nikon-instruments.com/
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NIKON AG
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UNITED KINGDOM phone: +44-20-8541-4440 fax: +44-20-8541-4584
NIKON INSTRUMENTS INC.
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phone: +1-631-547-8500; +1-800-52-NIKON (within the U.S.A.only) fax: +1-631-547-0306
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NIKON CANADA INC.
CANADA phone: +1-905-625-9910 fax: +1-905-625-0103
* Monitor images are simulated.
Company names and product names appearing in this brochure are their registered trademarks or trademarks.
WARNING TO ENSURE CORRECT USAGE, READ THE CORRESPONDING
MANUALS CAREFULLY BEFORE USING YOUR EQUIPMENT.
With an expanded lineup that includes small to ultra-wide measurement platforms
as well as models with LU-Nikon CFI60 Optics-Head,
the NEXIV VMR series provides complete support for all your measurement needs.
NEXIV VMR EZ Solution Finder
Model
Higher Magnification
VMR-3020VMR-1515/1515 Performa VMR-6555 VMR-10080 VMR-12072 VMR-H3030
YesYes Yes No No Yes
Optional Parts
Color Camera
Yes (Limited Use)
Yes
Yes
1*–5 µm
8*–40 µm
4*–20 µm
16*–80 µm
Yes
VMR Maximum Magnification High Density & Miniature
Machined Parts
Probe Cards
MEMS
LCD-Array Process
Advanced Packaging Technology:
Water Level CSP, Flipchip
Metrology Laboratory
High Precision Dies & Molds
Master Machine
Printed Circuit Boards, Mask Pattern
Machined, Cast, Stamped, Etched, & Molded Parts
Medical Devices
Dies & Molds
Semiconductor Packaging/Final Assembly Process
Electronic Devices:
SMD/Connector/Ferrule
Flat Panel Display Devices
OLED/LCD-Cell Process Module Process
Module Model Z120X
Type 2
Type 1
Model LU
22 in.200mm (8 inch) wafers
Appropriate Wafer Size Appropriate Display Panel Size
150mm (6 inch) wafers 37 in. 47 in.
Online CAD Interface
Offline CAD Interface
VMR AutoMeasure / VMR CAD Reader
VMR Virtual AutoMeasure
Quick Data Reporting VMR Report Generator
SPC-PC IV / SPC-IV ExcelStatistical Process Control
3D Surface Analysis NEXIV Bird's Eye View
3D Surface & Roughness Analysis D-Surf
2D Profile Analysis VMR Profiler
Hard / Software Control VMR Control Program
Multiple Language Support English/Japanese / Mandarin Chinese / Traditional Chinese / German / French, etc.
Data File Management VMR Data Manager
Type 3
*For clear edges such as metallized line patterns on a transparent glass.
Appropriate Object Size
(for FOV measurement at
highest magnification)
Optional Parts (for Type 1 to 3)
Rotary Indexer RI-3600L
Gear Measurement Software
Gear Evaluation according to ISO
Optional Software
Standard Provided
Software
Super Zoom & High Accuracy Non-Contact Height Measurement
Large Size, Multiple Parts Measurement
Versatile Measurement Tasks
Ultimate Precision
Larger Measurement Envelope
Optical Head
The NEXIV VMR series.
The perfect answer to all your measurement needs
4 5
Small Part Measurement Platform
NEXIV VMR-1515 and
VMR-1515 Performa
Finely Machined Part and its 3D Graphic Flip Chip Bump and its 3D Graphic
Type 1, 2, 3 Models
¡3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view
and resolution requirements
¡A long 50mm working distance sufficiently supports measurements of 3D workpieces
¡15X zoom provides wide field of view for rapid search and high magnification for accurate
measurement. Accurate calibration at all magnifications allows rapid field of view meas-
urements of multiple parameters.
¡High-speed TTL Laser AF ensures high-precision AF independent of surface shape.
(Performa models have only Vision AF, no Laser AF)
Applications
Semiconductor packages, Substrates, Stamped parts, Connectors and small parts, Clock parts
The VMR-1515 series has a smaller travel (X, Y, Z) 150 x 150 x 150. A low
cost entry model called the Performa (without Laser AF and Outer LED
Ring Illuminator) is available for video measurement applications.
With ultra-high precision and versatility, this model can serve as the
master instrument in your laboratory. NEXIV VMR-H3030 achieves
sub-micrometer level uncertainty (U1xy 0.6 mm + 2L/1000 µm, U2xy
0.9 + 3L/1000 µm) thanks to optimum layout of the ultra-precise
low-thermal expansion glass scales and robust hardware designs.
Travel (X, Y, Z) 300 x 300 x 150 mm. Ideal for high precision molds.
Z120X Model
(with Maximum Magnification Module)
¡120X optical magnification enables measurements of fine line widths
¡High-precision TTL Laser AF features high N.A. and enables
measurements of small height gaps
¡Perfect for measurements of high-density, finely-machined workpieces
¡Optional Bird’s-Eye View software plots MEMS parts in 3D format
Applications
Small high-density PCBs, Small precision dies and molds,
Packages (2D + height), MEMS parts
LU Model
(universal epi-illuminator/motorized nosepiece)
¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x
¡Supports brightfield, darkfield, DIC, simple polarizing applications
¡Motorized quintuple universal nosepiece
¡Easy to use software controls all functions of the system
Applications
Small-size LCDs, Organic EL panels, wafers up to 150mm
Ultrahigh-Precision
Measurement Platform
NEXIV VMR-H3030
Type 1, 2, 3 Models
¡Ultrahigh precision appropriate for the Master Instrument
¡3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements
¡Wide illumination choices ensure accurate detection of edges in dies and molds
¡Long working distance (50mm) permits measurement of parts with large height variance
¡15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate
calibration at all magnifications allows rapid field of view measurements of multiple parameters.
¡User-friendly software
Applications
Master calibration instrument for laboratory, Dies and molds, Finely machined parts
Z120X Model
(with Maximum Magnification Module)
With an ultra-precision stage and maximum magnification module, it measures critical workpieces with
superior accuracy (e.g., critical dimensions on patterned masks and bump heights).
¡120X optical magnification enables measurements of rerouted patterns on wafer level CSP
¡High precision stage facilitates accurate measurements even for wider dimensions
¡Enables measurements of top and bottom widths of etched lines
¡Laser AF enables measurements of micron-sized bump heights
¡Allows evaluation of cross-sectional shapes of bumps and solder balls
Applications
Wafer level CSP, Wafer level bump height, Wafer level SIP, Rerouted masks, Masks for MEMS
Connector PGA Plastic Gear Black Injection Molding Parts - Connector
76
HDD Slider HDD Slider Height Gap Profile ***** Circuit Patterns on Flipchip
Versatile Part Measurement Platform
NEXIV VMR-3020
Type 1, 2, 3 Models
¡Variety of illumination choices facilitates accurate detection of edges in molded parts
¡3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements
¡Long working distance (50mm) permits measurement of parts with large height variances
¡15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibra-
tion at all magnifications allows rapid field of view measurements of multiple parameters
¡User-friendly software
¡Laser AF enables cross-sectional shape and flatness evaluation as well as 3D profiling
Applications
Semiconductor packages, Substrates, Stamped parts, Connectors, Injection molded parts
Z120X Model
(with Maximum Magnification Module)
Its maximum magnification module achieves measurements of finely
machined workpieces. Perfect for measurements of topical MEMS parts,
high-density PCBs and semiconductor packages.
¡The combination of the maximum magnification module and high-precision
stage enables accurate measurements of large geometry workpieces as
well as minute structures
¡Laser AF uses small spot size to provide accurate measurements of finer
cross-sectional shapes and heights
¡Optional surface analysis software displays 3D shapes of MEMS parts
Applications
High-density PCBs, Exposure masks for substrates, Packages (2D + height), MEMS parts
LU Model
(universal epi-illuminator/motorized nosepiece)
¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x
¡Supports brightfield, darkfield, DIC, simple polarizing applications
¡Motorized quintuple universal nosepiece
¡Easy to use software controls all functions of the system
Applications
Small-size LCDs, Organic EL panels, 8” (200mm) wafers
Multi-Vision AF on Bonding Wire Loop Cross Section CCD IC Patterns
Wide Stage Envelopment Platform
NEXIV VMR-6555
Type 1, 2, 3 Models
¡650 x 550 mm stage stroke perfect for PCBs
¡Automatic measurement of batches of parts by placing multiple pieces together on the stage
¡Laser AF achieves high-accuracy measurements of bump heights
¡Laser AF also enables measurements of height variance and warping in workpieces
¡Search function enables measurements of lands and holes of PCBs
¡Search function provides accurate measurements even when workpieces are not properly located on the stage
¡Variety of illumination choices facilitate accurate edge detection even for vague geometries
¡High-speed stage and image processing provide higher throughput
Applications
Semiconductor packages (multiple pieces), Substrates, Printing masks for substrates, Stamped parts (multiple pieces),
Connectors (multiple pieces), Injection molded parts (multiple pieces)
High-speed measurements with large 650 x 550 mm stroke stage.
Optimal for measurements of PCB patterns and external dimensions of a
display panel. You can save inspection costs by measuring a number of
small parts at one time after placing them together on the stage.
Z120X Model
(with Maximum Magnification Module)
Amazing 120X zoom combined with a big stage enables ultrahigh
magnification measurements on big workpieces. Ideal for measuring
high-density PCBs and their masks.
¡Amazing 120X zoom
¡Measurements of 1µm line widths are possible at the maximum
magnification
¡Laser AF perfect for measuring small, complicated geometries
¡High-speed stage and image processing provide higher throughput
Applications
High-density PCBs, Exposure masks for substrate, Semiconductor packages (multiple pieces;
2D + height), Photo plotter machines for masks, Probe cards
LU Model
(universal epi-illuminator/motorized nosepiece)
¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x
¡Supports brightfield, darkfield, DIC, simple polarizing applications
¡Motorized quintuple universal nosepiece
¡Easy to use software controls all functions of the system
Applications
FPD panels (up to 22”)
The standard model of the NEXIV series with 300 x 200 mm stage stroke.
It handles a variety of measurement tasks including those for mechanical
parts, molded parts, stamped parts and various other workpieces.
8 9
Laser Scan on FPC and its Cross Section Photo Mask Pattern Metallized Patterns of FPC
Ultrawide Measurement Platform
NEXIV VMR-10080
Type 1, 2, 3 Models
¡Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs
¡3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements
¡Laser AF also enables measurements of height variance and warping in workpieces
¡Search function facilitates measurements of lands and holes of PCBs
¡Variety of illumination choices facilitate accurate edge detection even for vague geometries
¡High-speed stage and high-speed image processing provide high throughput
Applications
Printing masks for substrates, Mother substrates for PCBs, Shadow masks, FPD devices
Long 1000 x 800 mm stage stroke performs brilliantly in the
measurement of large-size workpieces.
Z120X Model
(with Maximum Magnification Module)
The model achieves ultrahigh magnification measurements with a long
1000 x 800 mm stage stroke. Ideal for measuring minute line widths of
large-size display panels.
¡Automatic measurements of batches of small parts
¡Laser AF achieves high-accuracy measurements of bump heights
¡Laser AF enables measurements of height variance and warping in workpieces
¡Search function enables measurements of lands and holes of PCBs
¡Search function also provides accurate measurements even when work-
pieces are not located properly on the stage
¡Variety of illumination choices facilitate accurate edge detection even for
weak edges
¡High-speed stage and image processing provide higher throughput
Applications
LCD glass substrates (pattern measurements),
Organic EL glass substrates (pattern measurements)
LU Model
(universal epi-illuminator/motorized nosepiece)
¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x
¡Supports brightfield, darkfield, DIC, simple polarizing applications
¡Motorized quintuple universal nosepiece
¡Easy to use software controls all functions of the system
Applications
Large FPD panels (up to 37”)
FPD-Cell Process LCD-TFT LCM-ACF under DIC Microscopy Color Filter
47-inch Display Device
Measurement Platform
NEXIV VMR-12072
Type 1, 2, 3 Models
¡Ultralong stage stroke enables measurements of large LCD substrates/modules and PCBs
¡3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements
¡Laser AF enables the measurement of height gaps and warping in workpieces
¡Search function enables measurements of lands and holes of PCBs
¡Variety of illumination choices facilitate accurate edge detection, even for vague geometries
¡High-speed stage and high-speed image processing provide high throughput
Applications
Large FPD panels and related devices
Ultralong 1200 x 720 mm stage stroke allows the measurement
of large workpieces such as FPD devices.
Z120X Model
(with Maximum Magnification Module)
The model achieves ultrahigh magnification measurements with an
ultralong 1200 x 720 mm stage stroke, making it ideal for the
measurement of large workpieces such as FPD devices.
¡Automatic measurement of batches of small parts
¡Laser AF achieves highly accurate measurements of bump heights
¡Laser AF also enables the measurements of height gaps and warping in
workpieces
¡Search function enables measurements of lands and holes of PCBs
¡Search function also provides accurate measurements even when work-
pieces are not properly located on the stage
¡High-speed stage and image processing provide higher throughput
Applications
LCD glass substrates (pattern measurements),
Organic EL glass substrates (pattern measurements)
LU Model
(universal epi-illuminator/motorized nosepiece)
¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x
¡Supports brightfield, darkfield, DIC, simple polarizing applications
¡Motorized quintuple universal nosepiece
¡Easy to use software controls all functions of the system
Applications
Large FPD panels and related devices (up to 47”*) * Including module parts.
10 11
Widefield, high N.A. objective lens
The highly corrected objective lens is equivalent to those found in Nikon's
top-end microscopes. They have a high N.A. of 0.35 with a long 50mm
working distance at all magnifications.
Standard head with 15X high-speed zoom
The standard head features 5-step, 15X high-speed zoom,
providing greater flexibility in choosing magnifications according to the size
of the measuring area.
Color cameras can be used (optional).
Magnification vs field of view (mm)
Type 1
Type 2
Type 3
Optical magnification
Total magnification
Field of view (mm)
0.5x
Zoom position 12 3 4 5
18x
9.33 x 7
1x
36x
4.67 x 3.5
2x
72x
2.33 x 1.75
4x
144x
1.165 x 0.875
7.5x
270x
0.622 x 0.467
Optical magnification
Total magnification
Field of view (mm)
1x
36x
4.67 x 3.5
2x
72x
2.33 x 1.75
4x
144x
1.165 x 0.875
8x
288x
0.582 x 0.437
15x
540x
0.311 x 0.233
Optical magnification
Total magnification
Field of view (mm)
2x
72x
2.33 x 1.75
4x
144x
1.165 x 0.875
8x
288x
0.582 x 0.437
16x
576x
0.291 x 0.218
30x
1080x
0.155 x 0.117
Total magnifications listed above represent those on the monitor screen
when a 17” TFT monitor is set to the SXGA (1280 x 1024 pixels) mode.
Wide choice of illumination
The VMR series comes with four
illumination choices to provide
illumination perfect for the workpiece to be meas-
ured. These include:
¡Two LED ring illuminators—Inner (37 degrees
oblique angle against Optical Axis), Outer (75
degrees oblique angle)
¡Episcopic illumination (top light)
¡Diascopic illumination (bottom light)
Edges previously difficult to capture can be
detected with high resolution.
In addition, the VMR series features
automatic light intensity control to provide the same brightness to multiple
NEXIV systems without the need to edit the teaching program.
8-sector LED ring illumination
An illumination system consisting of inner and outer ring
illuminators has been specially developed for the VMR series. The system
makes possible observations of extremely low-contrast edges which are
usually invisible under episcopic illumination by arbitrarily combining
illuminations from eight
directions. Best for edge
enhancement of the contours of
bosses, pins, ceramic packages, and
similar workpieces.
Outer ring illuminator
(75° from the optical axis)
This type enables the observation of work-
pieces that are impossible with lighting at a
shallow angle. When not in use, the illumi-
nator retracts, creating more space over the
workpiece. When in use, the working dis-
tance will be 10mm.
Episcopic illumination
Episcopic illumination
Connector
Metallized Patterns of FPC
LED ring illumination
(large angles of incidence)
LED ring illumination
(medium angles of incidence)
Inner ring illuminator
(37° from the optical axis)
This type can be universally used
whenever strong illumination from
various directions is needed. This
illumination also provides a full 50mm
working distance.
1X 2X
15X
8X4X
Illumination window
How the 8-sector LED ring illuminator works
Upgraded TTL Laser AF
TTL Laser AF provides high resolution, long working distances, and fast
operating speed for perfect focusing on narrow spaces at low magnifica-
tions. High-speed scanning measurement is possible at a rate of 1000
points per second max., enabling ultra-precise Z-axis measurements in a
variety of applications.
High-speed, high-precision Vision AF
Thanks to the adoption of a new algorithm and a progressive scan CCD
camera, Vision AF now provides greater speeds and accuracy closer to TTL
Laser AF. Vision AF is convenient for applications where TTL Laser AF can-
not be used, for example, when focusing on chamfered or round edges.
The Multiple-Vision AF enables the simultaneous measurement of multiple
points with different heights within the field of view.
How TTL Laser AF works
Dichroic mirror
Camera's zoom optics
AF detection
optics
Objective lens
50mm
Workpiece
LED
Multi-Vision AFSurface focus
Optical Head for Type 1, 2, 3
Ensure measurements with high accuracy and at high speeds.
12 13
Newly developed maximum magnification module VMR-Z120X
The new module achieves a 1x to 120X magnification range by using two
objectives and changing the optical path. An 8-step zoom gives this system
the capability to do rapid field of view measurements of hundreds of parame-
ters and do critical measurements of line widths down to 1µm.
Two objective lenses—wide field and high power (N.A. 0.55)
The combination of these two objective lenses enables a broad array of
applications ranging from wide-field observations at low magnifications to
accurate measurements at high magnifications.
Magnification vs field of view (mm)
Optical magnification
Total magnification
Field of view (mm)
Optical magnification
Total magnification
Field of view (mm)
Total magnifications listed above represent those on the monitor screen
when a 17” TFT monitor is set to the SXGA (1280 x 1024 pixels) mode.
0.622×0.467
7.5X
270X
4.67×3.5
36X
1X
2.33×1.75
72X
2X
1.165×0.875
144X
4X
0.291
X
0.218
576X
16X
0.146
X
0.109
1146X
32X
0.073
X
0.055
2292X
64X
0.039
X
0.029
4320X
120X
Three illumination types
The module delivers the best illumination to any workpieces by providing
three types of CNC controllable illuminations—episcopic, diascopic (high
magnification head), and darkfield illuminations. This enables edges to be
detected with high accuracy.
High-resolution TTL Laser AF with ultra tiny laser spot
The module comes with a high-resolution TTL Laser AF that in-
corporates high N.A. objectives and achieves ultra tiny laser spots. It signifi-
cantly improves performance in focusing on and scanning over thin, trans-
parent/semitransparent (e.g. resists) surfaces or irregular reflection sur-
faces. High-speed scanning measurement is possible at a rate of 1000
points per second max., enabling ultra-precise Z-axis measurements in a
variety of applications.
How TTL Laser AF works
32mm
Dichroic mirror
Camera's zoom optics
AF detection
optics
Objective lens
Workpiece 9.8mm
Minute steps measured
High magnifications darkfield illumination
Episcopic illumination Darkfield illumination
Low magnifications darkfield illumination
Low magnifications
High magnifications
1X 2X
16X 32X 64X 120X (6µm linewidth)
7.5X4X
Maximum Magnification Module VMR-Z120X
With variable magnifications up to 120x,
these models address applications that demand higher precision and density.
14 15
CFI60 optical system
CFI60 optics, the culmination of Nikon’s optical technologies, achieves
brilliant, high-contrast images, making the system most suitable for the
observation of large LCD substrates and color filters. This system can
perform both dimensional measurements of a workpiece via image
processing and observation in a single unit. By using a high-contrast DIC
slider, enhanced DIC imaging is also possible.
Motorized universal nosepiece
The CNC-based motorized nosepiece enables changes in magnification
during the execution of a teaching program. This enables microscopy at the
best magnification and with the optimum objective lens.
Automatic control from measurement to data processing
Easy to use software controls all functions of the system. From multi-
source light control to image processing and stage movement, the process
of measurement is automated for consistent, accurate results.
The following operations are manually controlled on the LU model:
Brightfield/darkfield illumination changeover
Field and aperture diaphragm settings
Polarizer*, analyzer*, Nomarski prism settings * Option to motorize.
High-speed, high-precision Vision AF (Auto Focus)
An optional motorized rotating polarizer/analyzer allows the operator to opti-
mize contrast according to the workpiece. During DIC imaging, phase dif-
ferences with greater sharpness can be visualized.
Effect of LCD objective lens
Comparison of images observed over glass substrates.
Patterns can be clearly visualized, even when viewed through glass.
Nomarski DIC image Darkfield image
Wide variety of CFI60 objective lenses
The CFI60 optical system creates bright, high-contrast images by minimiz-
ing flare, while offering higher numerical apertures (N.A.) and longer work-
ing distances (W.D.). The VMR series can use a wide array of CFI60 uni-
versal objective lenses, including the CFI LU Plan BD.
CFI Objective Lenses for LCD
CFI LU Plan Epi
CFI LU Plan BD CFI LU Plan BD ELWD
CFI LU Plan Epi ELWD
*An LU objective adapter is necessary when using the EPI series of objective lenses.
* Working Distance varies depending on correction for glass thickness.
* Either 0.5x Tube Lens or 1.0x Tube Lens is selectable as a factory option.
CFI60 objective lenses Magnification N.A. W.D. (mm)
CFI LU Plan BD 5X 0.15 18.00
10X 0.30 15.00
20X 0.45 4.50
50X 0.80 1.00
100X 0.90 1.00
CFI LU Plan BD ELWD 20X 0.40 13.00
50X 0.55 9.80
100X 0.80 3.50
CFI LU Plan Epi* 5X 0.15 23.50
10X 0.30 17.30
20X 0.45 4.50
50X 0.80 1.00
100X 0.90 1.00
CFI LU Plan Epi ELWD* 20X 0.40 13.00
50X 0.55 10.10
100X 0.80 3.50
CFI LU Plan Apo BD 150X 0.90 0.42
CFI LU Plan Apo Epi* 150X 0.95 0.30
N.A. Glass Thickness Correction Range Working Distance (t=glass thickness (mm))
MTI L Plan Epi 20x CR 0.45 0 to 1.2mm 10.9mm at t=0 10.5mm at t=0.6 10.0mm at t=1.2
MTI L Plan Epi 50x CR 0.7 0 to 1.2mm 3.9mm at t=0 3.4mm at t=0.6 3.0mm at t=1.2
MTI L Plan Epi 100x CRA 0.85 0 to 0.7mm 1.20mm at t=0 1.05mm at t=0.3 0.85mm at t=0.7
MTI L Plan Epi 100x CRB 0.85 0.6 to 1.3mm 1.3mm at t=0.6 1.15mm at t=0.9 0.95mm at t=1.3
Magnification and FOV Size
Objective Lens 5x 10x 20x 50x 100x 150x
With 1.0x Tube Lens Total Magnification 180 360 720 1800 3600 5400
Field of View 0.933 0.467 0.233 0.093 0.047 0.031
0.701 0.350 0.175 0.070 0.035 0.023
With 0.5x Tube Lens Total Magnification 90 180 360 900 1800 2700
Field of View 1.866 0.933 0.467 0.187 0.093 0.062
1.401 0.701 0.350 0.140 0.070 0.047
With Plan EPI objective lens With LCD objective lens
With CFI LU Plan BD 20x objective lens CFI LU Plan BD 50x objective lens
LU Head (LU Model) Universal epi-illuminator/motorized nosepiece type
Nikon’s industry-acclaimed CFI60 optics supports high-precision, strain-free measurements.
Motorized rotating analyzer
Motorized rotating polarizer
16 17
Dust clearly removed by the projection probe
Edge selection graphic window
Easy selection of desired edges by eliminating dust and burrs
Some workpieces contain multiple edges within a given caliper, or their
contrast is too low, making edge detection extremely difficult. This function
graphically profiles the contrasts of the image within the caliper using a
multi-gray-level scale, enabling the operator to select any one of a number
of edges. Selection of the desired edge is simple: click the appropriate
buttons in the edge selection menu and adjust a threshold level using the
mouse.
Enhanced capabilities yet easier operation Enhances accuracy for increased productivity
Advanced intelligent search
Gray scale processing via video edge probes
The black and gray portions of a workpiece are digitally classified into 256
levels, then edges are detected and processed based on this classification.
This prevents measurement data from being affected by changes in
illumination.
Video edge probes with auto “best-fit” function
When the operator clicks the point to be measured, the system
automatically rotates the probes, sets them at the optimum position, and
sets the probe size, all automatically.
Enhanced edge detection with Nikon’s unique algorithm
Thanks to Nikon’s proprietary edge detection algorithm (patent pending),
detection of edges at low magnifications is now possible with excellent
precision. This enables the detection of minute, low-contrast edges, a task
that is difficult to perform using gray scale processing. Image recognition
capability almost equal to the human eye and a detection speed among the
world’s fastest allow the system to measure any workpiece with unrivaled
precision.
Drag to resize and fit the projection
probe to the edge
Drag to resize and fit the circle probe to
the circle
After this process
After this process
Only a main edge is extracted and
enhanced
Processing window
Gray scale processing
Before edge enhancement Processing window
Enhancement after eliminating noise
factors
Processing window
APS (Auto Position Search)
Thanks to this function, the operator no longer needs to manually place
multiple workpieces in proper alignment; the NEXIV automatically searches
workpiece position for skew alignment.
MPS (Multi-Pattern Search)
Automatically corrects deviations between the edge probing points
programmed in a teaching file as well as irregular feature positions without
edge probing error.
PMM (Pattern Matching Measurement)
Determines coordinate values for features too difficult to measure in the
normal geometric measuring mode.
Search on left-side mark Search on right-side mark
Before APS After APS
Pattern matched on abnormal pin location
Normal pin location
Circle probe appears on the abnormal pin
location without measurement failure
Actual searched pattern 1
Actual searched pattern 2
Trained pattern 1
Skew alignment and deviations between the edge probing points within a
workpiece are automatically corrected by a pattern-matching feature, elimi-
nating possible measurement errors.
Edge detection with excellent precision
18 19
Interactive wizards simplify a whole range of tasks.
User-friendly standard software:
VMR AutoMeasure
Main program
Video window Illumination window D.R.O. window
Graphic window
Interactive measurement wizards
The measurement wizards guide
operators, step by step, through
what is required to achieve their
tasks. In addition to the default
wizards, operators can create
customized wizards by
registering frequently used
procedures to streamline future
operation.
Result window List window
Measurement wizards
Interactive teaching wizards
A set of default teaching wizards
provides step-by-step guides to
facilitate teaching, regardless of
the knowledge or experience of the
operator. Besides these, operators
can customize teaching wizards by
registering frequently used teach-
ing procedures.
Online CAD interface program
By importing CAD data (IGES, DXF, Gerber, and Excellon) of a
workpiece, the operator can display its graphics in the CAD graphic
window on NEXIV VMR AutoMeasure. This facilitates efficiency in
teaching and shortens working time.
¡The operator can move the stage to the desired position by double-
clicking the appropriate position within the input workpiece.
¡This function makes it possible to create a teaching file automatically
from CAD feature data on NEXIV VMR AutoMeasure.
Teaching wizards
CAD graphic window
CAD interface off-line teaching support program:
NEXIV Virtual AutoMeasure
This program enables CAD data to be read into the Virtual Video
Window on a separate computer, allowing the operator to use NEXIV’s
teaching program with the same operational procedures as on the
online computer. This eliminates the necessity of using the actual
workpiece during teaching sessions and lets the NEXIV system
concentrate on automatic measurement for increased productivity.
¡Supports IGES, DXF, DMIS, NC files, Gerber, and Excellon.
¡The Virtual Video Window enables the operator to confirm the
current field of view based on CAD data.
¡Same operational procedures as the NEXIV AutoMeasure.
¡Manual or one-click automated programming.
¡Possible to combine programs with Macro steps, such as Line Width
Measure and Multi Pattern Search.
NEXIV VMR Control Program
This program enables multiple teaching files to be run sequentially
according to set replay instructions.
¡Simplifies the process of giving instructions to measure many different
workpieces continuously, e.g., measurements of various dedicated jigs
¡Allows the inspector’s operating
environment to be separated from that of
the system administrator
¡Enables the administration of inspection
date, inspector, date of manufacture, lot
number and other inspection data
¡Automatic printing linked to inspection
sheets
NEXIV VMR Visual Basic Control
With the newly developed Communication Package Program,
users can program their own application software to remotely
control the various functions of the NEXIV AutoMeasure on a
Visual Basic 6.0/Net environment. By sending variables to the
AutoMeasure teaching file, workpieces of different sizes can
be measured on a single program. The results data then can
be sent back to the VB program.
1
2
3
4
5
6
Two-dimensional profile shape analysis program:
NEXIV Profiler
This program makes it possible to measure and judge 2-dimensional
profile shapes in a workpiece that cannot be measured in the normal
geometric mode. Now more accurate quantitative measurements can be
taken than with the chart comparison method using profile projectors
and/or conventional measuring microscopes.
Shape profile function
The NEXIV can now accomplish the
following measurements. When the
operator enters the start point, end
point, and the measurement pitch,
NEXIV automatically performs
measurement and saves the
results.
On XY plane:
¡Constant pitch profiling—
along axis
¡Constant pitch profiling—
along vector
¡Constant pitch profiling—
along angle
On XZ/YZ plane:
¡Height constant pitch
profiling—along axis
¡Height constant pitch
profiling—along angle
Shape evaluation function
Deviations between the measurement results and the nominal shape data
are graphically displayed on the monitor or printed out for easy evaluation.
¡Calculation of shape deviations: axis direction; normal direction
¡Table listing of shape data
¡Graph drawing of shape data
¡Creation of nominal shape data: data can be created not only by keyed-
in entry but also from CAD data. Data creation by exchanging the
measured shape data is also possible.
Shape"best fit"function
This function is used to minimize the deviation between the measurement
results and the nominal shape data. Deviation evaluation is easy even
when the two use different coordinates.
Creation of nominal shape data from CAD data
Nominal shape data can be created from CAD data in the DXF/IGES file
format.
Constant pitch profiling on XY plane
Height constant pitch profiling on XZ
plane (IC lead)
20 21
Rotary indexer RI-3600L
The RI-3600L can rotate the image of a workpiece and display it with a
0.01° resolution. Because it can be controlled externally, it enables
automatic measurements while controlling the posture of the workpiece.
Minimum readout: 1”
Control resolution: 0.01°
Max. workpiece diameter: 75mm
Operation mode: Auto or Manual
Pre-set points: Point of origin and 3
others
Focus images synthesis program: MultiLayer View
The MultiLayer View program can be used to synthesize focus portions of
multiple images of the same field of view taken at different layers, creating
one perfect image that is in focus throughout. Before synthesis is carried
out, the images can be displayed as thumbnails on a PC monitor so that
users can select the desired focus portions.
¡The NIXIV’s CCD camera captures multiple images on the Z-axis.
¡ In a configuration with the NEXIV system, users can easily attach the
whole image of measured portions to an inspection result sheet.
Main functions
¡2-D, 3-D display
¡Contour output
¡Z-slice display
¡Sliced area/perimeter display
¡Cross section profile data display/save
Applications
¡Attachment of synthesized images to
inspection result sheet
¡Filing of measured images
Dedicated isolation table
This pneumatic-type isolation table effectively
absorbs external vibrations preventing them
from affecting measurements.
Surface analysis software: D-SURF
This software not only draws
3D graphics of a minuscule
workpiece surface measured
by the NEXIV system, but it
also provides various
analyses such as the
calculation of various
evaluation values.
3D surface analysis program: NEXIV Bird's-Eye View
Running on OriginTM, this program allows data obtained using the Scan
Measure feature provided with TTL Laser AF to be
plotted in a 3-dimensional for-
mat. After that, 3-dimensional
shape analysis and 2-dimen-
sional cross-section shape
analysis can be performed.
Note: OriginTM is software developed
by OriginLab®Corporation.
Gear evaluation software
This software provides
evaluations on various
parameters of the
measured workpiece,
including pitch deviations,
tooth space runout, base
tangent length, and
dimension overpin , based on
industrial standards.
Real-time SPC via DDE (Dynamic Data Exchange)
Using a DDE Link function, measured data can be immediately transferred
to spreadsheets such as Microsoft Excel®, SPC-PC IV, SPC-PC IV Excel,
and others, making real-time
SPC analysis possible.
Note: SPC-PC IV and SPC-PC IV
Excel are products of Quality
America Inc.
Contribute to time and labor savings
throughout the work process
Handy options
Report generating program: VMR Report Generator
This software is fully compatible with the NEXIV VMR AutoMeasure software
and enables the quick generation of inspection results sheets in various
report forms including user-designed forms. Users can even customize the
program for their own easier use by making macro scripts.
Operating environment: Windows®
Excel2000/XP
Memory space: 64MB or more
An example of macro scripts written by
users: In order to input manually the
data measured by other instruments and
compile them into one complete report,
the macro automatically makes cell
blanks and display them in sky blue and
a message prompts manual inputs.
With a wafer loading/unloading system, this system measures the
whole contents of a wafer carrier automatically.
¡Dedicated software provides fully automatic carrier-by-carrier measure-
ments
¡User-friendly GUI facilitates the selection of wafers to be measured
¡Wafer map facilitates the selection of chips to be measured
¡Industry-proven NWL860T wafer loader ensures reliable wafer transport
¡In combination with the VMR-3020 Z120X, it can measure
minuscule dimensions on wafers
Non-contact, fully automatic measurement provides
outstanding throughput. Perfect for measuring FOUP and FOSB.
¡Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
¡SEMI-compliant kinematic plate provides perfect XYZ coordinates
¡Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes
¡Laser AF provides fast, non-contact measurements of wafer positions
¡Wide area, high-intensity LED illumination enables accurate measurements of wafer heights
¡300mm, 200mm wafer carrier and SMIF Pod base
Wafer Carrier Measuring System
NEXIV VMR-C4540
×30
×30
×31
Z31
Z30 Z30
Z31
×31
×46 ×46
×46
×46
Y46
Y46
Y46
Y46
FDP
HDP
Y52/33
BDP
Automated Wafer Measuring System
NEXIV VMR-3020 with Wafer Loader NWL860T
22 23
Specifications
Wafer Carrier Measuring System VMR-C4540
Compatible carriers SEMI-compliant 300mm wafer carriers
(FOUP, FOSB, OC) 200mm wafer carriers (with dedicated adapter)
Stroke Measuring head (X x Y x Z) 480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.)
Rotary table 360˚ (in 90˚ increments)
Minimum readout 0.1 µm
Head travel speed XZ axis: max. 200mm/s (7.9 in.) Y axis: max. 50mm/s (2.0 in.)
Kinematic plate rotation speed 90˚/2 sec.
Camera B&W 1/2-in. CCD
Optical magnification 0.27X to 2.74X (5-step 10X zoom)
Field of view 20 x 16 mm to 2.0 x 1.6 mm
Max. workpiece weight 15kg (33.1 lb.)
Measuring accuracy (10 + 10L/1000)µm, L = measuring length in mm
Repeatability (2σ)2µm
Illumination Episcopic, diascopic, darkfield
Auto focus Laser AF, Vision AF
Power source AC100-240V±10%, 50/60Hz
Power consumption (approx.) AC100-120V: 13A (main unit), 9A (PC)
AC200-240V: 7A (main unit), 5A (PC)
Dimensions 1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.)
Weight Approx. 1400kg (3086.41 lb.)
Host computer IBM PC/AT (Windows®2000)
Monitor 17-in. TFT
Automatic Wafer Measuring System VMR-3020 + NWL860T
Compatible wafer sizes ø150mm/200mm
(SEMI/JEIDA compliant, silicon )
Standard wafer carriers Entegris®150mm: PA182-60MB,
200mm: 192-80M
Processing speed per carrier 8 minutes + NEXIV’s measurement time
(Continuous transfer
of 25 wafers)
Orientation flat/notch detection Non-contact, transmitted-type sensor
Wafer transfer/chuck Vacuum chuck, mechanical transfer
Main unit dimensions 1700 (W) x 960 (D) x 1735 (H) mm
(excluding PC rack) (66.9 x 37.8 x 68.3 in.)
Footprint 2750 (W) x 1100 (D) mm (108.3 x 43.3 in.)
(excluding areas for operation
and maintenance)
Main unit weight Approx. 370kg (815.7 lb.)
Requirements
Electricity AC100-240V ±10%, 50/60Hz, 11.5A max.
Vacuum –800hPa (–600mmHg), 10NI/min.
Stroke (XxYxZ)
Optical Head for Type 1, 2, 3
300 x 300x 150 mm 150 x 150 x 150 mm 300 x 200 x 150mm 650 x 550 x 150mm 1000 x 800 x 150mm 1200 x 720 x 150 mm
LU model (11.8 x 11.8 x 5.9 in.) (5.9 x 5.9 x 5.9 in.) (11.8 x 7.9 x 5.9 in.) (25.6 x 21.7 x 5.9 in.) (39.4 x 31.5 x 5.9 in.) (47.2 x 28.3 x 5.9 in.)
With max. magnification module
300 x 300 x 150mm 150 x 150 x 150 mm 300 x 200 x 150mm 650 x 550 x 150mm 1000 x 800 x 150mm 1200 x 720 x 150 mm
(high mag. lens) (11.8 x 11.8 x 5.9 in.) (5.9 x 5.9 x 5.9 in.) (11.8 x 7.9 x 5.9 in.) (25.6 x 21.7 x 5.9 in.) (39.4 x 31.5 x 5.9 in.)(47.2 x 28.3 x 5.9 in.)
With max. magnification module
250 x 300 x 150mm 100 x 150 x 150 mm 250 x 200 x 150mm 600 x 550 x 150mm 950 x 800 x 150mm 1150 x 720 x 150 mm
(low mag. lens) (9.8 x 11.8 x 5.9 in.) (3.9 x 5.9 x 5.9 in.) (9.8 x 7.9 x 5.9 in.) (23.6 x 21.7 x 5.9 in.) (37.4 x 31.5 x 5.9 in.) (45.3 x 28.3 x 5.9 in.)
Minimum readout 0.01
µ
m0.1
µ
m
Maximum workpiece weight 30kg (66.1 lb) 20kg (44.0 lb) 30kg (66.1 lb) 40kg (88.2 lb)
Measuring accuracy U
1X
, U
1Y
0.6 + 2L/1000
µ
m1.5 + 4L/1000
µ
m1.5 + 4L/1000
µ
m
1.5 + 2.5L/1000
µ
m2 + 4L/1000
µ
m2.2 + 4L/1000
µ
m
(workpiece max. 10kg) (workpiece max. 5kg) (workpiece max. 5kg) (workpiece max. 30kg) (workpiece max. 40kg) (workpiece max. 40kg)
U
2XY
0.9 + 3L/1000
µ
m2.5 + 4L/1000
µ
m2.5 + 4L/1000
µ
m
2.5 + 2.5L/1000
µ
m3 + 4L/1000
µ
m3.2 + 4L/1000
µ
m
(workpiece max. 10kg) (workpiece max. 5kg) (workpiece max. 5kg) (workpiece max. 30kg) (workpiece max. 40kg) (workpiece max. 40kg)
Z-axis (L: Length in mm < W.D.) 0.9 + L/150
µ
m1.5 + L/150
µ
m Note: Z-axis accuracy is guaranteed by Laser AF.
Camera B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD
Working distance
Optical Head for Type 1, 2, 3
50mm
With max. magnification module High mag. objective lens: 9.8mm Low mag. objective lens: 32mm
LU model Refer to CFI Objective Lenses for LCD on page 15.
Magnification vs field of view
Optical Head for Type 1
0.5 – 7.5X / 9.33 x 7 – 0.622 x 0.467 mm
Optical Head for Type 2
1 – 15X / 4.67 x 3.5 – 0.311 x 0.233 mm
Optical Head for Type 3
2 – 30X / 2.33 x 1.75 – 0.155 x 0.117 mm
With max. magnification module 1 – 120X / 4.67 x 3.5 – 0.039 x 0.029 mm
LU model Refer to Magnification and FOV Size on page 15.
Auto focus TTI Laser AF and Vision AF. LU model: Vision AF only
Illumination
Optical Head for Type 1, 2, 3
Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring)
With max. magnification module Episcopic, diascopic (with high mag. head only), darkfield illumination
LU model Diascopic, Episcopacy & Darkfield illumination
Power source AC100-240V
±
10%, 50/60Hz
Power consumption Max. 11A (Standard type)
,
13A (Z120X type) Max. 13A (Standard type)
,
15A (Z120X type)
Dimensions & weight
Main unit only 915 x 1060 x 1300 mm, 512 x 703 x 1200 mm, 625 x 728 x 1195 mm,
–––
approx. 450kg approx. 180kg approx. 200kg
(36.0 x 41.7 x 51.2 in., 992.1 lb.) (20.2 x 27.7 x 47.2in., 396.8lb.) (24.6 x 28.7 x 47.0 in., 441.0 lb.)
Main unit & table 1000 x 1100 x 1900 mm, 512 x 703 x 1200 mm, 690 x 730 x 1725 mm, 1220 x 1680 x 1750 mm, 1530 x 2200 x 1750 mm, 1734 x 2200 x 1750 mm,
approx. 570kg approx. 180kg approx. 240kg approx. 600kg approx. 1500kg approx. 1600kg
(39.4 x 43.3 x 74.8 in., 1256.6 lb.) (20.2 x 27.7 x 47.2 in., 396.8 lb.) (27.2 x 28.7 x 67.9 in., 529.1 lb.) (48.0 x 66.1 x 68.9 in., 1322.8 lb.) (60.2 x 86.6 x 68.9 in., 3306.9 lb.) (68.3 x 86.6 x 68.9 in., 3527.4 lb.)
Controller 250 x 550 x 500 mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)
Footprint 2400 (W) x 1400 (D) mm 2100 (W) x 1100 (D) mm 2100 (W) x 1100 (D) mm 2400 (W) x 2000 (D) mm 2800 (W) x 2500 (D) mm 3000 (W) x 2500 (D) mm
(94.5 x 55.1 in.) (82.7 x 43.3 in.) (82.7 x 43.3 in.) (94.5 x 78.7 in.) (110.2 x 98.4 in.) (118.1 x 98.4 in.)
Model VMR-H3030/Z120X VMR-1515/Z120X/LU VMR-3020/Z120X/LU VMR-6555/Z120X/LU VMR-10080/Z120X/LU VMR-12072/Z120X/LU
Main Unit
Main unit IBM PC/AT (Windows®XP)
Monitor 17-in. TFT color
Host Computer
*The “Z120X” type is equivalent to the “TZ” type in Japan.
1000 1100250
560
580
1000
1900
VMR-H3030/Z120X/LU
230
1725
825
510
560
690 730250
VMR-1515/Z120X/LU
230
1725
825
510
560
690 730250
VMR-3020/Z120X/LU
Dimensional diagrams
1220
1078
856
230
950 250
1750
1275
850
466 165
560
VMR-6555/Z120X/LU
1680
1050300
1586
1444
1206
230
1200 250
1748
1288
850
377
560
2200
1400
VMR-10080/Z120X/LU
1786
1644
1406
230
1200 250
1748
1288
850
377
560
2200
1400
VMR-12072/Z120X/LU
1400
1739
2530
2010
900
VMR-C4540
655
560
27.5
60 1735
690
250
710 730
VMR-3020
NWL860
NWL860
NEXIV VMR-3020 with Wafer Loader NWL860T
Position of tapped holes for custom fixtures
60355
(Glass surface)
65
75330105
480
63
230
(Glass surface)
63
78
200
78
356
50 50
200
(Measuring range)
300 28
60
300
(Measuring range)
420
45 15
60
60
6060606060
60
60 6060
Depth
10
20-M6
28
16-M6
Depth
10
60 60 60
30
60 60
300 21
105 96
65 56
351
33
30 60 60 60 30
240 33
78 78
63 63
306
150(
Measuring range
)
230(
Glass surface
)
150(Measuring range)
180(
Glass surface
)
Y
X
8810010010010010010088
752
16
13
706
(Glass surface)
8736
776
(Stage glass)
650
(X stroke)
63 63
104.5 550
(Y stroke)
97.5
30
8
14-M8
Depth
20
Measuring range
VMR-3020/Z120X/LUVMR-H3030/Z120X/LU VMR-1515/Z120X/LU
VMR-10080/Z120X/LU VMR-12072/Z120X/LU
VMR-6555/Z120X/LU
40-M8
Depth 15
800
(Y stroke)
1000
(X stroke)
903
(Glass surface)
1058
(Stage glass)
1126
982
38
98 84
41
100 100 100 100 100 100 100 100 100 100
63 63
16 1094 16
25.5 931 25.5
91100 100 100 100 100 100 100 10091
34 34
63 63
Measuring range
44-M8
Depth 15
(Stage glass)
(X
stroke
)
(Y
stroke
)
(Stage glass)
Measuring range
720
1200
903
1258
1326
982
38
98 164
41
100100 100 100100 100100 100100 100100 10063 63
16 1294 16
25.5 25.5
9191 100100100100100100100100
34 34
63 63
931
Depth
10
24-M6
330 (Glass surface)
330 (Glass surface)
540
540
60 60606060
60
300
(Measuring range)
60
420
60 60 60 60 60
60 60
420
300
(Measuring range)
105 105
105 105
60
60 60
60
Unit: mm
