Nikon NEXIVVMR If Not Then NEXIV
User Manual: Nikon If not then Manual: ://www.nikoninstruments.com/images/stories/PDFs/NEXIV
Open the PDF directly: View PDF 
.
Page Count: 12
| Download | |
| Open PDF In Browser | View PDF |
CNC Video Measuring Systems Destined to Improve Quality The NEXIV VMR Series Specifications and equipment are subject to change without any notice or obligation on the part of the manufacturer. January 2005 ©2005 NIKON CORPORATION WARNING TO ENSURE CORRECT USAGE, READ THE CORRESPONDING MANUALS CAREFULLY BEFORE USING YOUR EQUIPMENT. * Monitor images are simulated. Company names and product names appearing in this brochure are their registered trademarks or trademarks. NIKON INSTECH CO., LTD. NIKON INSTRUMENTS EUROPE B.V. NIKON INSTRUMENTS INC. Parale Mitsui Bldg., 8, Higashida-cho, Kawasaki-ku, Kawasaki, Kanagawa 210-0005, Japan phone: +81-44-223-2177 fax: +81-44-223-2182 www.nikon-instruments.jp/eng/ P.O. Box 222, 1170 AE Badhoevedorp, The Netherlands phone: +31-20-44-96-222 fax: +31-20-44-96-298 www.nikon-instruments.com/ 1300 Walt Whitman Road, Melville, N.Y. 11747-3064, U.S.A. phone: +1-631-547-8500; +1-800-52-NIKON (within the U.S.A.only) fax: +1-631-547-0306 www.nikonusa.com/ NIKON FRANCE S.A.S. FRANCE phone: +33-1-45-16-45-16 fax: +33-1-45-16-00-33 NIKON GMBH GERMANY phone: +49-211-9414-0 fax: +49-211-9414-322 NIKON INSTRUMENTS S.p.A. ITALY phone: + 39-55-3009601 fax: + 39-55-300993 NIKON AG SWITZERLAND phone: +41-43-277-2860 fax: +41-43-277-2861 NIKON UK LTD. UNITED KINGDOM phone: +44-20-8541-4440 fax: +44-20-8541-4584 NIKON CANADA INC. CANADA phone: +1-905-625-9910 fax: +1-905-625-0103 NIKON INSTRUMENTS (SHANGHAI) CO., LTD. CHINA phone: +86-21-5058-5055 fax: +86-21-5058-5060 (Beijing office) CHINA phone: +86-10-5869-2255 fax: +86-10-5869-2277 NIKON SINGAPORE PTE LTD SINGAPORE phone: +65-6559-3618 fax: +65-6559-3668 NIKON MALAYSIA SDN. BHD. MALAYSIA phone: +60-3-78763887 fax: +60-3-78763387 NIKON CORPORATION Fuji Bldg., 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 100-8331, Japan www.nikon.com/ This brochure is printed on recycled paper made from 40% used material. Printed in Japan (0501- xx)T Code No. 2CE-IWTH-2 En The perfect answer to all your measurement needs The NEXIV VMR series. With an expanded lineup that includes small to ultra-wide measurement platforms as well as models with LU-Nikon CFI60 Optics-Head, the NEXIV VMR series provides complete support for all your measurement needs. NEXIV VMR EZ Solution Finder Appropriate Object Size (for FOV measurement at highest magnification) 1*–5 µm 4*–20 µm VMR-1515/1515 Performa VMR Maximum Magnification Module Model Z120X VMR-3020 VMR-6555 VMR-10080 Electronic Devices: SMD/Connector/Ferrule Higher Magnification Color Camera Ultimate Precision Flat Panel Display Devices OLED/LCD-Cell Process VMR-H3030 Advanced Packaging Technology: Water Level CSP, Flipchip Super Zoom & High Accuracy Non-Contact Height Measurement Semiconductor Packaging/Final Assembly Process Type 3 VMR-12072 LCD-Array Process Probe Cards High Density & Miniature Machined Parts MEMS Medical Devices Module Process Metrology Laboratory Master Machine Yes (Limited Use) Yes Printed Circuit Boards, Mask Pattern Large Size, Multiple Parts Measurement Dies & Molds 8*–40 µm Optional Parts Model Optical Head Type 2 Yes Larger Measurement Envelope High Precision Dies & Molds Versatile Measurement Tasks 16*–80 µm Type 1 Machined, Cast, Stamped, Etched, & Molded Parts Yes Appropriate Wafer Size Appropriate Display Panel Size Model LU 150mm (6 inch) wafers 200mm (8 inch) wafers 22 in. 37 in. 47 in. *For clear edges such as metallized line patterns on a transparent glass. Optional Parts Standard Provided Software Optional Software Rotary Indexer RI-3600L (for Type 1 to 3) Yes Yes Yes No Online CAD Interface VMR AutoMeasure / VMR CAD Reader Offline CAD Interface VMR Virtual AutoMeasure 2D Profile Analysis VMR Profiler Hard / Software Control VMR Control Program Multiple Language Support English/Japanese / Mandarin Chinese / Traditional Chinese / German / French, etc. Data File Management VMR Data Manager Quick Data Reporting VMR Report Generator Statistical Process Control SPC-PC IV / SPC-IV Excel 3D Surface Analysis NEXIV Bird's Eye View 3D Surface & Roughness Analysis D-Surf Gear Evaluation according to ISO Gear Measurement Software No Yes Small Part Measurement Platform Ultrahigh-Precision Measurement Platform NEXIV VMR-1515 and VMR-1515 Performa NEXIV VMR-H3030 With ultra-high precision and versatility, this model can serve as the The VMR-1515 series has a smaller travel (X, Y, Z) 150 x 150 x 150. A low master instrument in your laboratory. NEXIV VMR-H3030 achieves cost entry model called the Performa (without Laser AF and Outer LED sub-micrometer level uncertainty (U1xy 0.6 mm + 2L/1000 µm, U2xy Ring Illuminator) is available for video measurement applications. 0.9 + 3L/1000 µm) thanks to optimum layout of the ultra-precise low-thermal expansion glass scales and robust hardware designs. Travel (X, Y, Z) 300 x 300 x 150 mm. Ideal for high precision molds. Type 1, 2, 3 Models Type 1, 2, 3 Models ¡Ultrahigh precision appropriate for the Master Instrument ¡3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements ¡Wide illumination choices ensure accurate detection of edges in dies and molds ¡Long working distance (50mm) permits measurement of parts with large height variance ¡15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibration at all magnifications allows rapid field of view measurements of multiple parameters. ¡User-friendly software ¡3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements ¡A long 50mm working distance sufficiently supports measurements of 3D workpieces ¡15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibration at all magnifications allows rapid field of view measurements of multiple parameters. ¡High-speed TTL Laser AF ensures high-precision AF independent of surface shape. (Performa models have only Vision AF, no Laser AF) Applications Semiconductor packages, Substrates, Stamped parts, Connectors and small parts, Clock parts Applications Master calibration instrument for laboratory, Dies and molds, Finely machined parts Connector Finely Machined Part and its 3D Graphic PGA Plastic Gear Black Injection Molding Parts - Connector Flip Chip Bump and its 3D Graphic Z120X Model (with Maximum Magnification Module) With an ultra-precision stage and maximum magnification module, it measures critical workpieces with superior accuracy (e.g., critical dimensions on patterned masks and bump heights). ¡ 120X optical magnification enables measurements of rerouted patterns on wafer level CSP Z120X Model (with Maximum Magnification Module) LU Model (universal epi-illuminator/motorized nosepiece) ¡120X optical magnification enables measurements of fine line widths ¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x ¡High-precision TTL Laser AF features high N.A. and enables ¡Supports brightfield, darkfield, DIC, simple polarizing applications measurements of small height gaps ¡Perfect for measurements of high-density, finely-machined workpieces ¡Motorized quintuple universal nosepiece ¡Easy to use software controls all functions of the system ¡Optional Bird’s-Eye View software plots MEMS parts in 3D format ¡ High precision stage facilitates accurate measurements even for wider dimensions ¡ Enables measurements of top and bottom widths of etched lines Applications ¡ Laser AF enables measurements of micron-sized bump heights Small high-density PCBs, Small precision dies and molds, ¡ Allows evaluation of cross-sectional shapes of bumps and solder balls Packages (2D + height), MEMS parts Applications Small-size LCDs, Organic EL panels, wafers up to 150mm Applications Wafer level CSP, Wafer level bump height, Wafer level SIP, Rerouted masks, Masks for MEMS 4 5 Versatile Part Measurement Platform Wide Stage Envelopment Platform NEXIV VMR-3020 NEXIV VMR-6555 High-speed measurements with large 650 x 550 mm stroke stage. Optimal for measurements of PCB patterns and external dimensions of a display panel. You can save inspection costs by measuring a number of small parts at one time after placing them together on the stage. The standard model of the NEXIV series with 300 x 200 mm stage stroke. It handles a variety of measurement tasks including those for mechanical parts, molded parts, stamped parts and various other workpieces. Type 1, 2, 3 Models Type 1, 2, 3 Models ¡Variety of illumination choices facilitates accurate detection of edges in molded parts ¡ 3 models (type: 1, 2, 3) with 5-step zoom magnification to cover different fields of view and resolution requirements ¡ Long working distance (50mm) permits measurement of parts with large height variances ¡ 15X zoom provides wide field of view for rapid search and high magnification for accurate measurement. Accurate calibration at all magnifications allows rapid field of view measurements of multiple parameters ¡ User-friendly software ¡ Laser AF enables cross-sectional shape and flatness evaluation as well as 3D profiling ¡650 x 550 mm stage stroke perfect for PCBs ¡Automatic measurement of batches of parts by placing multiple pieces together on the stage ¡Laser AF achieves high-accuracy measurements of bump heights ¡Laser AF also enables measurements of height variance and warping in workpieces ¡Search function enables measurements of lands and holes of PCBs ¡Search function provides accurate measurements even when workpieces are not properly located on the stage ¡Variety of illumination choices facilitate accurate edge detection even for vague geometries ¡High-speed stage and image processing provide higher throughput Applications Applications Semiconductor packages (multiple pieces), Substrates, Printing masks for substrates, Stamped parts (multiple pieces), Connectors (multiple pieces), Injection molded parts (multiple pieces) Semiconductor packages, Substrates, Stamped parts, Connectors, Injection molded parts HDD Slider HDD Slider Height Gap Profile ***** Circuit Patterns on Flipchip Multi-Vision AF on Bonding Wire Z120X Model (with Maximum Magnification Module) LU Model (universal epi-illuminator/motorized nosepiece) Its maximum magnification module achieves measurements of finely machined workpieces. Perfect for measurements of topical MEMS parts, high-density PCBs and semiconductor packages. ¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x ¡ The combination of the maximum magnification module and high-precision ¡Easy to use software controls all functions of the system stage enables accurate measurements of large geometry workpieces as well as minute structures ¡Laser AF uses small spot size to provide accurate measurements of finer cross-sectional shapes and heights ¡Optional surface analysis software displays 3D shapes of MEMS parts Applications High-density PCBs, Exposure masks for substrates, Packages (2D + height), MEMS parts Loop Cross Section CCD IC Patterns Z120X Model (with Maximum Magnification Module) LU Model (universal epi-illuminator/motorized nosepiece) Amazing 120X zoom combined with a big stage enables ultrahigh magnification measurements on big workpieces. Ideal for measuring high-density PCBs and their masks. ¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x ¡Supports brightfield, darkfield, DIC, simple polarizing applications ¡Motorized quintuple universal nosepiece ¡Easy to use software controls all functions of the system ¡Supports brightfield, darkfield, DIC, simple polarizing applications ¡Motorized quintuple universal nosepiece Applications ¡ Amazing 120X zoom Small-size LCDs, Organic EL panels, 8” (200mm) wafers ¡Measurements of 1µm line widths are possible at the maximum magnification ¡Laser AF perfect for measuring small, complicated geometries ¡High-speed stage and image processing provide higher throughput Applications FPD panels (up to 22”) Applications High-density PCBs, Exposure masks for substrate, Semiconductor packages (multiple pieces; 2D + height), Photo plotter machines for masks, Probe cards 6 7 Ultrawide Measurement Platform 47-inch Display Device Measurement Platform NEXIV VMR-10080 NEXIV VMR-12072 Long 1000 x 800 mm stage stroke performs brilliantly in the measurement of large-size workpieces. Ultralong 1200 x 720 mm stage stroke allows the measurement of large workpieces such as FPD devices. Type 1, 2, 3 Models Type 1, 2, 3 Models ¡Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs ¡ 3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements ¡ Laser AF also enables measurements of height variance and warping in workpieces ¡ Search function facilitates measurements of lands and holes of PCBs ¡ Variety of illumination choices facilitate accurate edge detection even for vague geometries ¡ High-speed stage and high-speed image processing provide high throughput ¡Ultralong stage stroke enables measurements of large LCD substrates/modules and PCBs ¡3 models (type: 1, 2, 3) with 5 step zoom magnification to cover different fields of view and resolution requirements ¡Laser AF enables the measurement of height gaps and warping in workpieces ¡Search function enables measurements of lands and holes of PCBs ¡Variety of illumination choices facilitate accurate edge detection, even for vague geometries ¡High-speed stage and high-speed image processing provide high throughput Applications Printing masks for substrates, Mother substrates for PCBs, Shadow masks, FPD devices Applications Large FPD panels and related devices Laser Scan on FPC and its Cross Section Photo Mask Pattern Metallized Patterns of FPC FPD-Cell Process LCD-TFT LCM-ACF under DIC Microscopy Color Filter Z120X Model (with Maximum Magnification Module) LU Model (universal epi-illuminator/motorized nosepiece) Z120X Model (with Maximum Magnification Module) LU Model (universal epi-illuminator/motorized nosepiece) The model achieves ultrahigh magnification measurements with a long 1000 x 800 mm stage stroke. Ideal for measuring minute line widths of large-size display panels. ¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x ¡Supports brightfield, darkfield, DIC, simple polarizing applications ¡Motorized quintuple universal nosepiece ¡Easy to use software controls all functions of the system The model achieves ultrahigh magnification measurements with an ultralong 1200 x 720 mm stage stroke, making it ideal for the measurement of large workpieces such as FPD devices. ¡Full range of Nikon CFI60 LU microscope objectives from 5x to 150x ¡Supports brightfield, darkfield, DIC, simple polarizing applications ¡Motorized quintuple universal nosepiece ¡Easy to use software controls all functions of the system Applications ¡Laser AF achieves highly accurate measurements of bump heights ¡Laser AF also enables the measurements of height gaps and warping in workpieces ¡Search function enables measurements of lands and holes of PCBs ¡Search function also provides accurate measurements even when workpieces are not properly located on the stage ¡High-speed stage and image processing provide higher throughput ¡ Automatic measurements of batches of small parts ¡Laser AF achieves high-accuracy measurements of bump heights ¡Laser AF enables measurements of height variance and warping in workpieces ¡Search function enables measurements of lands and holes of PCBs ¡Search function also provides accurate measurements even when workpieces are not located properly on the stage ¡Variety of illumination choices facilitate accurate edge detection even for weak edges ¡High-speed stage and image processing provide higher throughput Large FPD panels (up to 37”) ¡ Automatic measurement of batches of small parts Applications Large FPD panels and related devices (up to 47”*) * Including module parts. Applications Applications LCD glass substrates (pattern measurements), LCD glass substrates (pattern measurements), Organic EL glass substrates (pattern measurements) Organic EL glass substrates (pattern measurements) 8 9 Ensure measurements with high accuracy and at high speeds. Optical Head for Type 1, 2, 3 Standard head with 15X high-speed zoom Widefield, high N.A. objective lens Wide choice of illumination 8-sector LED ring illumination The standard head features 5-step, 15X high-speed zoom, providing greater flexibility in choosing magnifications according to the size of the measuring area. The highly corrected objective lens is equivalent to those found in Nikon's top-end microscopes. They have a high N.A. of 0.35 with a long 50mm working distance at all magnifications. The VMR series comes with four illumination choices to provide illumination perfect for the workpiece to be measured. These include: ¡Two LED ring illuminators—Inner (37 degrees oblique angle against Optical Axis), Outer (75 degrees oblique angle) ¡Episcopic illumination (top light) ¡Diascopic illumination (bottom light) Edges previously difficult to capture can be Illumination window detected with high resolution. In addition, the VMR series features automatic light intensity control to provide the same brightness to multiple NEXIV systems without the need to edit the teaching program. An illumination system consisting of inner and outer ring illuminators has been specially developed for the VMR series. The system makes possible observations of extremely low-contrast edges which are usually invisible under episcopic illumination by arbitrarily combining illuminations from eight directions. Best for edge enhancement of the contours of bosses, pins, ceramic packages, and similar workpieces. Magnification vs field of view (mm) Zoom position 1 2 3 4 5 Upgraded TTL Laser AF Type 1 Optical magnification 0.5x 18x 9.33 x 7 1x 36x 4.67 x 3.5 2x 72x 2.33 x 1.75 4x 144x 1.165 x 0.875 7.5x 270x 0.622 x 0.467 1x 36x 4.67 x 3.5 2x 72x 2.33 x 1.75 4x 144x 1.165 x 0.875 8x 288x 0.582 x 0.437 15x 540x 0.311 x 0.233 2x 72x 2.33 x 1.75 4x 144x 1.165 x 0.875 8x 288x 0.582 x 0.437 16x 576x 0.291 x 0.218 30x 1080x 0.155 x 0.117 TTL Laser AF provides high resolution, long working distances, and fast operating speed for perfect focusing on narrow spaces at low magnifications. High-speed scanning measurement is possible at a rate of 1000 points per second max., enabling ultra-precise Z-axis measurements in a variety of applications. Total magnification Field of view (mm) Type 2 Optical magnification Total magnification Field of view (mm) Type 3 Optical magnification Total magnification Field of view (mm) Total magnifications listed above represent those on the monitor screen when a 17” TFT monitor is set to the SXGA (1280 x 1024 pixels) mode. Camera's zoom optics AF detection optics Connector Objective lens 1X Workpiece 50mm 2X How TTL Laser AF works Episcopic illumination LED ring illumination (large angles of incidence) High-speed, high-precision Vision AF 4X 8X Inner ring illuminator (37° from the optical axis) This type can be universally used whenever strong illumination from various directions is needed. This illumination also provides a full 50mm working distance. Dichroic mirror LED How the 8-sector LED ring illuminator works Thanks to the adoption of a new algorithm and a progressive scan CCD camera, Vision AF now provides greater speeds and accuracy closer to TTL Laser AF. Vision AF is convenient for applications where TTL Laser AF cannot be used, for example, when focusing on chamfered or round edges. The Multiple-Vision AF enables the simultaneous measurement of multiple points with different heights within the field of view. Metallized Patterns of FPC Episcopic illumination Outer ring illuminator (75° from the optical axis) This type enables the observation of workpieces that are impossible with lighting at a shallow angle. When not in use, the illuminator retracts, creating more space over the workpiece. When in use, the working distance will be 10mm. LED ring illumination (medium angles of incidence) 15X Color cameras can be used (optional). Surface focus 10 Multi-Vision AF 11 With variable magnifications up to 120x, these models address applications that demand higher precision and density. Maximum Magnification Module VMR-Z120X Newly developed maximum magnification module VMR-Z120X Two objective lenses—wide field and high power (N.A. 0.55) High-resolution TTL Laser AF with ultra tiny laser spot Three illumination types The new module achieves a 1x to 120X magnification range by using two objectives and changing the optical path. An 8-step zoom gives this system the capability to do rapid field of view measurements of hundreds of parameters and do critical measurements of line widths down to 1µm. The combination of these two objective lenses enables a broad array of applications ranging from wide-field observations at low magnifications to accurate measurements at high magnifications. The module comes with a high-resolution TTL Laser AF that incorporates high N.A. objectives and achieves ultra tiny laser spots. It significantly improves performance in focusing on and scanning over thin, transparent/semitransparent (e.g. resists) surfaces or irregular reflection surfaces. High-speed scanning measurement is possible at a rate of 1000 points per second max., enabling ultra-precise Z-axis measurements in a variety of applications. The module delivers the best illumination to any workpieces by providing three types of CNC controllable illuminations—episcopic, diascopic (high magnification head), and darkfield illuminations. This enables edges to be detected with high accuracy. Magnification vs field of view (mm) Optical magnification Total magnification Field of view (mm) 1X 36X 4.67×3.5 2X 72X 2.33×1.75 4X 144X 1.165×0.875 7.5X 270X 0.622×0.467 Optical magnification Total magnification Field of view (mm) 16X 576X 0.291X0.218 32X 1146X 0.146X0.109 64X 2292X 0.073X0.055 120X 4320X 0.039X0.029 High magnifications darkfield illumination Camera's zoom optics AF detection optics Total magnifications listed above represent those on the monitor screen when a 17” TFT monitor is set to the SXGA (1280 x 1024 pixels) mode. Dichroic mirror Objective lens Low magnifications 32mm Workpiece 9.8mm How TTL Laser AF works Episcopic illumination 1X 2X 4X Darkfield illumination 7.5X Low magnifications darkfield illumination High magnifications Minute steps measured 16X 12 32X 64X 120X (6µm linewidth) 13 Nikon’s industry-acclaimed CFI60 optics supports high-precision, strain-free measurements. LU Head (LU Model) Universal epi-illuminator/motorized nosepiece type CFI60 optical system Wide variety of CFI60 objective lenses CFI60 optics, the culmination of Nikon’s optical technologies, achieves brilliant, high-contrast images, making the system most suitable for the observation of large LCD substrates and color filters. This system can perform both dimensional measurements of a workpiece via image processing and observation in a single unit. By using a high-contrast DIC slider, enhanced DIC imaging is also possible. The CFI60 optical system creates bright, high-contrast images by minimizing flare, while offering higher numerical apertures (N.A.) and longer working distances (W.D.). The VMR series can use a wide array of CFI60 universal objective lenses, including the CFI LU Plan BD. CFI Objective Lenses for LCD N.A. Glass Thickness Correction Range MTI L Plan Epi 20x CR 0.45 0 to 1.2mm 10.9mm at t=0 Working Distance (t=glass thickness (mm)) 10.5mm at t=0.6 MTI L Plan Epi 50x CR 0.7 0 to 1.2mm 3.9mm at t=0 3.4mm at t=0.6 3.0mm at t=1.2 MTI L Plan Epi 100x CRA 0.85 0 to 0.7mm 1.20mm at t=0 1.05mm at t=0.3 0.85mm at t=0.7 MTI L Plan Epi 100x CRB 0.85 0.6 to 1.3mm 1.3mm at t=0.6 1.15mm at t=0.9 0.95mm at t=1.3 10.0mm at t=1.2 * Working Distance varies depending on correction for glass thickness. Magnification and FOV Size CFI LU Plan Epi CFI LU Plan Epi ELWD Objective Lens With 1.0x Tube Lens Motorized universal nosepiece The CNC-based motorized nosepiece enables changes in magnification during the execution of a teaching program. This enables microscopy at the best magnification and with the optimum objective lens. With 0.5x Tube Lens CFI LU Plan BD ELWD CFI LU Plan BD CFI60 objective lenses CFI LU Plan BD Magnification N.A. W.D. (mm) 5x 10x 20x 50x 100x 150x Total Magnification 180 360 720 1800 3600 5400 Field of View 0.933 0.467 0.233 0.093 0.047 0.031 0.701 0.350 0.175 0.070 0.035 0.023 Total Magnification 90 180 360 900 1800 2700 Field of View 1.866 0.933 0.467 0.187 0.093 0.062 1.401 0.701 0.350 0.140 0.070 0.047 * Either 0.5x Tube Lens or 1.0x Tube Lens is selectable as a factory option. 5X 0.15 18.00 10X 0.30 15.00 Automatic control from measurement to data processing 20X 0.45 4.50 Easy to use software controls all functions of the system. From multisource light control to image processing and stage movement, the process of measurement is automated for consistent, accurate results. Effect of LCD objective lens 50X 0.80 1.00 100X 0.90 1.00 Comparison of images observed over glass substrates. Patterns can be clearly visualized, even when viewed through glass. 20X 0.40 13.00 50X 0.55 9.80 100X 0.80 3.50 5X 0.15 23.50 10X 0.30 17.30 20X 0.45 4.50 1.00 The following operations are manually controlled on the LU model: Brightfield/darkfield illumination changeover Field and aperture diaphragm settings Polarizer*, analyzer*, Nomarski prism settings * Option to motorize. CFI LU Plan BD ELWD CFI LU Plan Epi* High-speed, high-precision Vision AF (Auto Focus) An optional motorized rotating polarizer/analyzer allows the operator to optimize contrast according to the workpiece. During DIC imaging, phase differences with greater sharpness can be visualized. Motorized rotating analyzer CFI LU Plan Epi ELWD* 50X 0.80 100X 0.90 1.00 20X 0.40 13.00 10.10 50X 0.55 100X 0.80 3.50 CFI LU Plan Apo BD 150X 0.90 0.42 CFI LU Plan Apo Epi* 150X 0.95 0.30 With Plan EPI objective lens With LCD objective lens Nomarski DIC image Darkfield image With CFI LU Plan BD 20x objective lens CFI LU Plan BD 50x objective lens *An LU objective adapter is necessary when using the EPI series of objective lenses. Motorized rotating polarizer 14 15 Advanced intelligent search Edge detection with excellent precision Enhanced capabilities yet easier operation Enhances accuracy for increased productivity Gray scale processing via video edge probes Enhanced edge detection with Nikon’s unique algorithm The black and gray portions of a workpiece are digitally classified into 256 levels, then edges are detected and processed based on this classification. This prevents measurement data from being affected by changes in illumination. Thanks to Nikon’s proprietary edge detection algorithm (patent pending), detection of edges at low magnifications is now possible with excellent precision. This enables the detection of minute, low-contrast edges, a task that is difficult to perform using gray scale processing. Image recognition capability almost equal to the human eye and a detection speed among the world’s fastest allow the system to measure any workpiece with unrivaled precision. Video edge probes with auto “best-fit” function When the operator clicks the point to be measured, the system automatically rotates the probes, sets them at the optimum position, and sets the probe size, all automatically. Skew alignment and deviations between the edge probing points within a workpiece are automatically corrected by a pattern-matching feature, eliminating possible measurement errors. PMM (Pattern Matching Measurement) Determines coordinate values for features too difficult to measure in the normal geometric measuring mode. APS (Auto Position Search) Thanks to this function, the operator no longer needs to manually place multiple workpieces in proper alignment; the NEXIV automatically searches workpiece position for skew alignment. Trained pattern 1 Only a main edge is extracted and enhanced Drag to resize and fit the projection probe to the edge Actual searched pattern 1 Processing window Search on left-side mark Search on right-side mark After this process Actual searched pattern 2 Before APS Before edge enhancement After APS Processing window MPS (Multi-Pattern Search) Drag to resize and fit the circle probe to the circle Automatically corrects deviations between the edge probing points programmed in a teaching file as well as irregular feature positions without edge probing error. After this process Easy selection of desired edges by eliminating dust and burrs Some workpieces contain multiple edges within a given caliper, or their contrast is too low, making edge detection extremely difficult. This function graphically profiles the contrasts of the image within the caliper using a multi-gray-level scale, enabling the operator to select any one of a number of edges. Selection of the desired edge is simple: click the appropriate buttons in the edge selection menu and adjust a threshold level using the mouse. Gray scale processing 16 Dust clearly removed by the projection probe Edge selection graphic window Enhancement after eliminating noise factors Processing window Normal pin location Pattern matched on abnormal pin location Circle probe appears on the abnormal pin location without measurement failure 17 User-friendly standard software: VMR AutoMeasure Interactive wizards simplify a whole range of tasks. Main program Online CAD interface program Video window Illumination window D.R.O. window By importing CAD data (IGES, DXF, Gerber, and Excellon) of a workpiece, the operator can display its graphics in the CAD graphic window on NEXIV VMR AutoMeasure. This facilitates efficiency in teaching and shortens working time. ¡The operator can move the stage to the desired position by doubleclicking the appropriate position within the input workpiece. ¡This function makes it possible to create a teaching file automatically from CAD feature data on NEXIV VMR AutoMeasure. Two-dimensional profile shape analysis program: NEXIV Profiler This program makes it possible to measure and judge 2-dimensional profile shapes in a workpiece that cannot be measured in the normal geometric mode. Now more accurate quantitative measurements can be taken than with the chart comparison method using profile projectors and/or conventional measuring microscopes. NEXIV VMR Control Program This program enables multiple teaching files to be run sequentially according to set replay instructions. ¡Simplifies the process of giving instructions to measure many different workpieces continuously, e.g., measurements of various dedicated jigs ¡Allows the inspector’s operating environment to be separated from that of the system administrator ¡Enables the administration of inspection date, inspector, date of manufacture, lot number and other inspection data ¡Automatic printing linked to inspection sheets 6 5 Shape profile function 4 3 The NEXIV can now accomplish the following measurements. When the operator enters the start point, end point, and the measurement pitch, NEXIV automatically performs measurement and saves the results. 2 1 On XY plane: ¡Constant pitch profiling— CAD interface off-line teaching support program: along axis ¡Constant pitch profiling— along vector ¡Constant pitch profiling— along angle NEXIV Virtual AutoMeasure On XZ/YZ plane: This program enables CAD data to be read into the Virtual Video Window on a separate computer, allowing the operator to use NEXIV’s teaching program with the same operational procedures as on the online computer. This eliminates the necessity of using the actual workpiece during teaching sessions and lets the NEXIV system concentrate on automatic measurement for increased productivity. ¡Supports IGES, DXF, DMIS, NC files, Gerber, and Excellon. ¡The Virtual Video Window enables the operator to confirm the current field of view based on CAD data. ¡Same operational procedures as the NEXIV AutoMeasure. ¡Manual or one-click automated programming. ¡Possible to combine programs with Macro steps, such as Line Width Measure and Multi Pattern Search. ¡Height constant pitch CAD graphic window Graphic window Result window List window Interactive teaching wizards A set of default teaching wizards provides step-by-step guides to facilitate teaching, regardless of the knowledge or experience of the operator. Besides these, operators can customize teaching wizards by registering frequently used teaching procedures. Teaching wizards Interactive measurement wizards The measurement wizards guide operators, step by step, through what is required to achieve their tasks. In addition to the default wizards, operators can create customized wizards by registering frequently used procedures to streamline future operation. Constant pitch profiling on XY plane profiling—along axis NEXIV VMR Visual Basic Control ¡Height constant pitch profiling—along angle Height constant pitch profiling on XZ plane (IC lead) Shape evaluation function Deviations between the measurement results and the nominal shape data are graphically displayed on the monitor or printed out for easy evaluation. ¡Calculation of shape deviations: axis direction; normal direction ¡Table listing of shape data ¡Graph drawing of shape data ¡Creation of nominal shape data: data can be created not only by keyedin entry but also from CAD data. Data creation by exchanging the measured shape data is also possible. With the newly developed Communication Package Program, users can program their own application software to remotely control the various functions of the NEXIV AutoMeasure on a Visual Basic 6.0/Net environment. By sending variables to the AutoMeasure teaching file, workpieces of different sizes can be measured on a single program. The results data then can be sent back to the VB program. Shape"best fit"function This function is used to minimize the deviation between the measurement results and the nominal shape data. Deviation evaluation is easy even when the two use different coordinates. Creation of nominal shape data from CAD data Nominal shape data can be created from CAD data in the DXF/IGES file format. Measurement wizards 18 19 Automated Wafer Measuring System Handy options Focus images synthesis program: MultiLayer View Contribute to time and labor savings throughout the work process 3D surface analysis program: NEXIV Bird's-Eye View Running on Origin , this program allows data obtained using the Scan Measure feature provided with TTL Laser AF to be plotted in a 3-dimensional format. After that, 3-dimensional shape analysis and 2-dimensional cross-section shape analysis can be performed. TM Note: OriginTM is software developed by OriginLab® Corporation. The MultiLayer View program can be used to synthesize focus portions of multiple images of the same field of view taken at different layers, creating one perfect image that is in focus throughout. Before synthesis is carried out, the images can be displayed as thumbnails on a PC monitor so that users can select the desired focus portions. ¡ The NIXIV’s CCD camera captures multiple images on the Z-axis. ¡ In a configuration with the NEXIV system, users can easily attach the whole image of measured portions to an inspection result sheet. Main functions ¡ 2-D, 3-D display ¡ Contour output ¡ Z-slice display ¡ Sliced area/perimeter display ¡ Cross section profile data display/save NEXIV VMR-3020 with Wafer Loader NWL860T With a wafer loading/unloading system, this system measures the whole contents of a wafer carrier automatically. ¡ Dedicated software provides fully automatic carrier-by-carrier measure- ments ¡ User-friendly GUI facilitates the selection of wafers to be measured ¡ Wafer map facilitates the selection of chips to be measured ¡ Industry-proven NWL860T wafer loader ensures reliable wafer transport ¡ In combination with the VMR-3020 Z120X, it can measure minuscule dimensions on wafers Applications ¡ Attachment of synthesized images to inspection result sheet ¡ Filing of measured images Surface analysis software: D-SURF This software not only draws 3D graphics of a minuscule workpiece surface measured by the NEXIV system, but it also provides various analyses such as the calculation of various evaluation values. Gear evaluation software This software provides evaluations on various parameters of the measured workpiece, including pitch deviations, tooth space runout, base tangent length, and dimension overpin , based on industrial standards. Report generating program: VMR Report Generator This software is fully compatible with the NEXIV VMR AutoMeasure software and enables the quick generation of inspection results sheets in various report forms including user-designed forms. Users can even customize the program for their own easier use by making macro scripts. Operating environment: Windows® Excel2000/XP Memory space: 64MB or more An example of macro scripts written by users: In order to input manually the data measured by other instruments and compile them into one complete report, the macro automatically makes cell blanks and display them in sky blue and a message prompts manual inputs. Wafer Carrier Measuring System NEXIV VMR-C4540 Non-contact, fully automatic measurement provides outstanding throughput. Perfect for measuring FOUP and FOSB. ¡ Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments ¡ SEMI-compliant kinematic plate provides perfect XYZ coordinates ¡ Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes ¡ Laser AF provides fast, non-contact measurements of wafer positions Rotary indexer RI-3600L ¡ Wide area, high-intensity LED illumination enables accurate measurements of wafer heights The RI-3600L can rotate the image of a workpiece and display it with a 0.01° resolution. Because it can be controlled externally, it enables automatic measurements while controlling the posture of the workpiece. ¡ 300mm, 200mm wafer carrier and SMIF Pod base Minimum readout: 1” P BD 46 Y46 6 6 × Y4 ×4 6 46 Y4 46 6 × Y ×4 Control resolution: 0.01° Real-time SPC via DDE (Dynamic Data Exchange) Using a DDE Link function, measured data can be immediately transferred to spreadsheets such as Microsoft Excel®, SPC-PC IV, SPC-PC IV Excel, and others, making real-time SPC analysis possible. Note: SPC-PC IV and SPC-PC IV Excel are products of Quality America Inc. 1 ×3 Max. workpiece diameter: 75mm 0 ×3 0 ×3 Operation mode: Auto or Manual Pre-set points: Point of origin and 3 others P FD Y5 2/3 Z30 3 1 ×3 1 Z3 0 Z3 HD P 1 Z3 Dedicated isolation table This pneumatic-type isolation table effectively absorbs external vibrations preventing them from affecting measurements. 20 21 Specifications Dimensional diagrams Main Unit Model VMR-H3030/Z120X Unit: mm VMR-H3030/Z120X/LU VMR-1515/Z120X/LU VMR-3020/Z120X/LU VMR-6555/Z120X/LU VMR-10080/Z120X/LU VMR-12072/Z120X/LU VMR-1515/Z120X/LU VMR-3020/Z120X/LU 230 300 x 300 x 150mm (11.8 x 11.8 x 5.9 in.) 150 x 150 x 150 mm (5.9 x 5.9 x 5.9 in.) 300 x 200 x 150mm (11.8 x 7.9 x 5.9 in.) 650 x 550 x 150mm (25.6 x 21.7 x 5.9 in.) 1000 x 800 x 150mm (39.4 x 31.5 x 5.9 in.) 1200 x 720 x 150 mm (47.2 x 28.3 x 5.9 in.) With max. magnification module (low mag. lens) 250 x 300 x 150mm (9.8 x 11.8 x 5.9 in.) 100 x 150 x 150 mm (3.9 x 5.9 x 5.9 in.) 250 x 200 x 150mm (9.8 x 7.9 x 5.9 in.) 600 x 550 x 150mm (23.6 x 21.7 x 5.9 in.) 950 x 800 x 150mm (37.4 x 31.5 x 5.9 in.) 1150 x 720 x 150 mm (45.3 x 28.3 x 5.9 in.) 0.01µm 0.1 µm Maximum workpiece weight 30kg (66.1 lb) 20kg (44.0 lb) 30kg (66.1 lb) 40kg (88.2 lb) U1X, U1Y 0.6 + 2L/1000 µm (workpiece max. 10kg) 1.5 + 4L/1000 µm (workpiece max. 5kg) 1.5 + 4L/1000 µm (workpiece max. 5kg) 1.5 + 2.5L/1000 µm (workpiece max. 30kg) 2 + 4L/1000 µm (workpiece max. 40kg) 2.2 + 4L/1000 µm (workpiece max. 40kg) U2XY 0.9 + 3L/1000 µm (workpiece max. 10kg) 2.5 + 4L/1000 µm (workpiece max. 5kg) 2.5 + 4L/1000 µm (workpiece max. 5kg) 2.5 + 2.5L/1000 µm (workpiece max. 30kg) 3 + 4L/1000 µm (workpiece max. 40kg) 3.2 + 4L/1000 µm (workpiece max. 40kg) Z-axis (L: Length in mm < W.D.) 0.9 + L/150 µm 1.5 + L/150 µm Note: Z-axis accuracy is guaranteed by Laser AF. Camera B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD Working distance Optical Head for Type 1, 2, 3 With max. magnification module LU model 50mm High mag. objective lens: 9.8mm Low mag. objective lens: 32mm Refer to CFI Objective Lenses for LCD on page 15. Magnification vs field of view Optical Head for Type 1 Optical Head for Type 2 Optical Head for Type 3 With max. magnification module LU model 0.5 – 7.5X / 9.33 x 7 – 0.622 x 0.467 mm 1 – 15X / 4.67 x 3.5 – 0.311 x 0.233 mm 2 – 30X / 2.33 x 1.75 – 0.155 x 0.117 mm 1 – 120X / 4.67 x 3.5 – 0.039 x 0.029 mm Refer to Magnification and FOV Size on page 15. Auto focus TTI Laser AF and Vision AF. LU model: Vision AF only Illumination Optical Head for Type 1, 2, 3 With max. magnification module LU model Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring) Episcopic, diascopic (with high mag. head only), darkfield illumination Diascopic, Episcopacy & Darkfield illumination 825 510 560 580 1000 250 690 1100 1786 1406 230 1748 1288 1288 560 377 560 250 300 1050 1680 1200 1444 (36.0 x 41.7 x 51.2 in., 992.1 lb.) (20.2 x 27.7 x 47.2in., 396.8lb.) (24.6 x 28.7 x 47.0 in., 441.0 lb.) 1000 x 1100 x 1900 mm, approx. 570kg 512 x 703 x 1200 mm, approx. 180kg 690 x 730 x 1725 mm, approx. 240kg 1220 x 1680 x 1750 mm, approx. 600kg 1530 x 2200 x 1750 mm, approx. 1500kg 1734 x 2200 x 1750 mm, approx. 1600kg (39.4 x 43.3 x 74.8 in., 1256.6 lb.) (20.2 x 27.7 x 47.2 in., 396.8 lb.) (27.2 x 28.7 x 67.9 in., 529.1 lb.) (48.0 x 66.1 x 68.9 in., 1322.8 lb.) (60.2 x 86.6 x 68.9 in., 3306.9 lb.) (68.3 x 86.6 x 68.9 in., 3527.4 lb.) 2400 (W) x 2000 (D) mm (94.5 x 78.7 in.) 2800 (W) x 2500 (D) mm (110.2 x 98.4 in.) 3000 (W) x 2500 (D) mm (118.1 x 98.4 in.) – NWL860 27.5 – 250 655 – 900 625 x 728 x 1195 mm, approx. 200kg 560 512 x 703 x 1200 mm, approx. 180kg 60 915 x 1060 x 1300 mm, approx. 450kg 2010 1735 Controller 1400 2200 250 VMR-C4540 VMR-3020 Main unit & table 1200 1644 1400 2200 250 Max. 13A (Standard type), 15A (Z120X type) Dimensions & weight Main unit only 730 VMR-12072/Z120X/LU 850 850 950 1078 250 2530 Max. 11A (Standard type), 13A (Z120X type) 690 1748 165 1275 1750 AC100-240V ±10%, 50/60Hz Power consumption 730 1586 1206 230 1220 856 230 NEXIV VMR-3020 with Wafer Loader NWL860T Power source 250 VMR-10080/Z120X/LU VMR-6555/Z120X/LU 466 Measuring accuracy 1000 Minimum readout 560 With max. magnification module (high mag. lens) 230 560 1200 x 720 x 150 mm (47.2 x 28.3 x 5.9 in.) 1725 1000 x 800 x 150mm (39.4 x 31.5 x 5.9 in.) 825 510 650 x 550 x 150mm (25.6 x 21.7 x 5.9 in.) 850 300 x 200 x 150mm (11.8 x 7.9 x 5.9 in.) 377 150 x 150 x 150 mm (5.9 x 5.9 x 5.9 in.) 560 300 x 300x 150 mm (11.8 x 11.8 x 5.9 in.) 1900 Optical Head for Type 1, 2, 3 LU model 1725 Stroke (XxYxZ) 710 690 1739 730 1400 250 x 550 x 500 mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.) Footprint 2400 (W) x 1400 (D) mm (94.5 x 55.1 in.) Main unit IBM PC/AT (Windows® XP) Monitor 17-in. TFT color 2100 (W) x 1100 (D) mm (82.7 x 43.3 in.) 2100 (W) x 1100 (D) mm (82.7 x 43.3 in.) Position of tapped holes for custom fixtures Host Computer VMR-H3030/Z120X/LU VMR-1515/Z120X/LU VMR-3020/Z120X/LU VMR-6555/Z120X/LU *The “Z120X” type is equivalent to the “TZ” type in Japan. 0.27X to 2.74X (5-step 10X zoom) Field of view 20 x 16 mm to 2.0 x 1.6 mm Footprint (excluding areas for operation and maintenance) 2750 (W) x 1100 (D) mm (108.3 x 43.3 in.) Max. workpiece weight 15kg (33.1 lb.) Measuring accuracy (10 + 10L/1000)µm, L = measuring length in mm Main unit weight Approx. 370kg (815.7 lb.) Repeatability (2σ) 2µm Illumination Episcopic, diascopic, darkfield Auto focus Laser AF, Vision AF Power source AC100-240V±10%, 50/60Hz Power consumption (approx.) AC100-120V: 13A (main unit), 9A (PC) Dimensions 1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.) Weight Approx. 1400kg (3086.41 lb.) Host computer IBM PC/AT (Windows® 2000) Monitor 17-in. TFT Requirements Electricity AC100-240V ±10%, 50/60Hz, 11.5A max. Vacuum –800hPa (–600mmHg), 10NI/min. 230(Glass surface) 56 105 65 351 330 355 (Glass surface) 480 75 60 97.5 30 8 X 13 65 Y 78 63 28 96 752 78 63 200 230 (Glass surface) 356 60 60 60 60 150(Measuring range) 78 60 78 33 60 30 60 240 30 60 28 300 50 200(Measuring range) 50 105 150(Measuring range) Measuring range 550 (Y stroke) Optical magnification 105 105 88 100 100 100 100 100 100 88 20-M6 Depth10 706 (Glass surface) 736 1700 (W) x 960 (D) x 1735 (H) mm (66.9 x 37.8 x 68.3 in.) 60 60 16 8 Main unit dimensions (excluding PC rack) 330 (Glass surface) 60 104.5 B&W 1/2-in. CCD 105 16-M6 Depth10 60 63 650 (X stroke) 776 (Stage glass) 63 540 14-M8 Depth 20 VMR-10080/Z120X/LU 34 63 40-M8 Depth 15 1126 1058 (Stage glass) 1000 (X stroke) Measuring range 38 98 AC200-240V: 7A (main unit), 5A (PC) 63 16 22 NWL860 100 100 100 100 100 100 100 100 100 100 1094 VMR-12072/Z120X/LU 44-M8 Depth 15 34 63 63 16 34 63 1326 1258 (Stage glass) 1200 (X stroke) Measuring range 63 16 100100 100100100 100100 100 100100 100 100 1294 34 63 25.5 Camera 60 60 91100 100 100 100 100 100 100 100 91 931 Vacuum chuck, mechanical transfer 60 60 63 16 25.5 Wafer transfer/chuck 60 33 90˚/2 sec. 41 Kinematic plate rotation speed Y axis: max. 50mm/s (2.0 in.) 60 15 420 300 (Measuring range) 60 21 164 XZ axis: max. 200mm/s (7.9 in.) 300 982 903 (Stage glass) 720 (Y stroke) 0.1 µm Head travel speed 38 98 Minimum readout 330 (Glass surface) 540 360˚ (in 90˚ increments) 30 105 Rotary table 25.5 480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.) 91 100 100 100 100 100 100 100 100 91 931 Non-contact, transmitted-type sensor Measuring head (X x Y x Z) 25.5 Orientation flat/notch detection 420 300 (Measuring range) 60 60 60 60 60 60 8 minutes + NEXIV’s measurement time 200mm wafer carriers (with dedicated adapter) Stroke 60 Processing speed per carrier (Continuous transfer of 25 wafers) (FOUP, FOSB, OC) 60 Entegris® 150mm: PA182-60MB, 200mm: 192-80M SEMI-compliant 300mm wafer carriers 41 84 Standard wafer carriers Wafer Carrier Measuring System VMR-C4540 Compatible carriers 45 24-M6 Depth10 60 982 903 (Glass surface) 800 (Y stroke) ø150mm/200mm (SEMI/JEIDA compliant, silicon ) 60 60 60 Automatic Wafer Measuring System VMR-3020 + NWL860T Compatible wafer sizes 420 300 (Measuring range) 60 60 60 60 60 306 60 63 180(Glass surface) 63 60 23
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.3 Linearized : Yes Create Date : 2005:01:27 07:27:32Z Modify Date : 2005:01:31 13:25:24+01:00 Page Count : 12 Creation Date : 2005:01:27 07:27:32Z Mod Date : 2005:01:31 13:25:24+01:00 Producer : Acrobat Distiller 5.0.5 for Macintosh Author : Metadata Date : 2005:01:31 13:25:24+01:00 Creator : Title : NEXIVVMR.qxdEXIF Metadata provided by EXIF.tools