Nikon If Not Then NWL860

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NWL-Series 03.1.21 9:01 AM ページ1

IC Inspection Wafer Loaders

NWL860/641

Series

NWL-Series 03.1.20 4:53 PM ページ3

The perfect answer to macro insp ection tasks
The NWL-860 series provides a full range of macro inspection
capabilities—one of the features considered most essential
for inspecting semiconductor patterns with progressively
higher steps and ever-increasing layers.
A single cassette wafer loader capable of handling 8- and 6inch (200 and 150 mm) wafers, this series of wafer loaders
not only comes standard with pattern side macro inspection
capability, but also with the ability to perform back side
periphery and center macro inspections as well.
The NWL-860TMB SP comes in a stainless-steel body and
generates no static electricity, preventing particulate from
attaching to the wafers. The NWL-860TMB INX comes with an
SMIF elevator and both models feature a stop switch for
greater safeguards against abnormalities. MB-type models are
also available exclusively for macro inspections.

Macro inspections of 8- to 6-inch wafers

NWL-860TMB SP

Besides pattern side macro inspection, the NWL-860 series
can perform back side periphery and center macro
inspections. Macro inspection parameters, such as wafer
rotation speed and tilt angle, can be set automatically or
manually. Use the macro setting knobs to preset initial
settings and make later adjustments using the joystick.
(Joystick adjustments not possible during back side center
macro inspections)

Dust-free, stainless-steel body

High reliability

Simple, easy operation

Should an error occur, an error message appears on the
LCD panel with a wafer recovery feature. Even when the
power is turned OFF, the vacuum chuck stays ON, and the
wafer is automatically returned to the cassette when the
power is switched ON again. For even greater safety, the
SP and INX types both feature an emergency button.

The NWL-860 series uses a dialog-type operating
system with an LCD panel, in which display
information is logically classified, allowing settings
for each step to be made easily on a single screen.
Sophisticated functions such as file management
for cassettes and wafer samples further enhance
operational ease. A dedicated input keypad for
setting inspection processes and programming
wafers to be checked is also available as an option.

Ergonomic design
Back side periphery inspection

Pattern side macro inspection

Non-contact pre-alignment function
Prevention of wafer contamination is a vital issue when
inspecting semiconductors. To avoid any chance of
contamination, the NWL-860 series employs non-contact
pre-alignment using photoelectric sensors to center wafers,
avoiding all contact during orientation flat/notch operations.
Furthermore, the whole system is configured, so that the
entire inspection process can be performed without
disturbing the downflow air stream in the cleanroom.
2

NWL-860 Series
NWL-860TMB

Back side macro inspection

Back side center inspection

IC Inspection Wafer Loaders

To assure operation in a natural posture, ergonomics
surround every aspect of this system’s design. Operation
keys and knobs are located at the front and close to the
operator, so that operation requires a minimum movement
of the hand or eye. The wafer cassette is set at the front and
35° to the left of the operator, enhancing cassette setting
and streamlining visual wafer inspections.

High throughput
Not only is the speed of the elevator surprisingly
fast, but the use of a non-contact centering
mechanism makes it possible to perform alignment
operations quickly and accurately. A multi-arm
system also allows loading and unloading of wafers
with the utmost precision, increasing the overall
efficiency of transfer and wafer exchange
operations. This dramatically decreases cycle
times, providing levels of throughput never seen
before in any other system.

NWL-860TMB INX
SMIF elevator model

Communication function (option)
A data communication function conforming to SEMI
(SECS) standards can be added optionally,
enabling transfer of inspection data via the RS232C interface or by remote control. This proves
handy when expanding the system or incorporating
it into a total network.
3

NWL-Series 03.1.20 4:54 PM ページ5

IC Inspection Wafer Loaders

Nikon’s IC inspection microscope and the NWL-860
series constitute a highly efficient IC external
inspection system

NWL-860 Series
SMIF pod™

NWL-860TMB SP + ECLIPSE L200

NWL-860TMB INX + ECLIPSE L200

Fiber illumination (option)

Fiber illumination (option)
Exchange arm

Exchange arm
Orientation flat/notch
detector
SMIF elevator
Orientation flat/notch detector

Wafer position detector
IC inspection microscope
(ECLIPSE L200)

Wafer position detector

IC inspection microscope
(ECLIPSE L200)

Pre-alignment sensor

Feeder arm
Dedicated stage (NWL-860 stage)

Buffer section (syringe)

Feeder arm
Buffer section (syringe)

Pre-alignment sensor

Dedicated stage
(NWL-860 stage)

Rotation dial

Elevator section

Rotation dial

Fine movement knob
Driving handle

Fine movement knob
Driving handle

Stop switch

NWL-860TMB SP Control Panel

NWL-860TMB INX Control Panel

1. Cursor keys
2. LCD display
3. Function keys
4. Stop key
5. Micro Reject key
6. Macro Reject key
7. Manual key
8. Macro setting knobs
9. Pattern side macro inspection rotation speed
10. Pattern side macro inspection X tilt angle
11. Pattern side macro inspection Y tilt angle
12. Back side periphery inspection tilt angle
13. Back side center inspection rotation angle
14. Joystick
15. Start switch

1.
2.
3.
4.
5.
6.
7.
8.

Operation/display section

Cursor keys
LCD display
Function keys
Stop key
Micro Reject key
Macro Reject key
Manual key
Macro setting knobs
9. Pattern side macro inspection rotation speed
10. Pattern side macro inspection X tilt angle
11. Pattern side macro inspection Y tilt angle
12. Back side periphery inspection tilt angle
13. Back side center inspection rotation angle
14. Stop switch
15. Joystick
16. Start switch

Dedicated microscope base plate

Dimensional Diagram
NWL-860TMB SP + ECLIPSE L200

2

Dedicated microscope base plate

Operation/display section

Dimensional Diagram
NWL-860TMB INX + ECLIPSE L200

2
1

1

3

3

6

7

9

14

11

12

13

535 (21.1)

6

7

8
10

11

12

13

375 (14.8)

785 (30.1)

14

918 (36.1)

15

5

4

9

760 (30.0)

5

625 (24.6)

4

10

838-856 (33.0-33.7)

8

4

Stop switch

Unit: mm (inch)

15

375 (14.8)
1168 (46.0)

16

Unit: mm (inch)

5

NWL-Series 03.1.20 4:54 PM ページ7

IC Inspection Wafer Loaders

IC Inspection Wafer Loaders

NWL-641M/641
Quick Reference Chart

For 6- to 4-inch Wafer Inspection

Wafer
size

Inspection mode

Models
Macro illumination
unit (option)

Dual exchange arms

86inch inch

Micro

Macro

NWL-860TMB

● ●

●

●

●

●

NWL-860TM

● ●

●

●

NWL-860T

● ●

●

NWL-860MB*

● ●

●

●

●

NWL-860TMB SP

● ●

●

●

●

●

NWL-860TM SP*

● ●

●

●

NWL-860T SP*

● ●

●

NWL-860MB SP

● ●

Stage (rotatable 360°, with
vacuum wafer chuck)

Setting switches
(hidden switches)

Orientation flat detector

Operation handle

Back side
macro
(periphery)

Back side
macro
(center)

SECS2

Stainless
steel
body &
peek
chuck

●

Option

●

●

Option

●

●

Option

●

Option

●

Stop
switch

SMIF
elevator

Feeder arm
Wafer position detector

730 mm (28.7 in.)

NWL-641M
598 mm (23.3 in.)

Simple, speedy wafer exchange
Operation is a breeze, thanks to the logical arrangement of keys on
the control panel. The NWL-641 series can memorize up to 10
combinations of wafer channels to be inspected. The orientation flat
detector allows the wafer direction to be set in four directions
(0°, 90°, 180°, 270°) individually during wafer loading onto the
microscope or during wafer unloading. Wafer exchange takes a
short two seconds.

360° rotation vacuum wafer chuck
The vacuum wafer chuck on the stage draws and holds a wafer
transferred by the loader, and if necessary, the wafer can be rotated
360° by using the syringe rotation knob, allowing the loaders to
meet the varying needs of microscopic inspection.

Enhanced macro observations with unique
fluttering mode (641M only)

Dimensional Diagram
NWL-641M + OPTIPHOT 150

Figures in parentheses
are those for Type 641

The 641M incorporates sophisticated macro observation
movements, including Nikon’s original fluttering mode, tilt macro
rotation, and fluttering + tilt macro rotation.

The loader in the NWL-641 series uses transmission-type laser
wafer sensors. These sensors check the presence of wafers in the
cassette, wafer tilt, as well as wafer deformation, to determine
automatically the ideal position in which to take the wafers in and
out, thus ensuring secure transfer.

●

NWL-860MB INX

●

NWL-860TMB INX*
(6-inch only)
730 (730)/28.7˝ (28.7˝)
685 (655)/27.0˝ (25.8˝)

Irregular-shaped wafer cassette capability

NWL-860TMB INX

NWL-860MB INX*
MAX 220/8.7˝

(6-inch only)

●

●

●

●

NWL-641

●

●

NWL-641M

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

Anti-contamination design
To significantly curtail dust generation from the equipment and the
attachment of particles to wafers, Nikon adopted a special design,
whereby the motor unit in the macro mechanism is located as far
apart as possible from the wafer under inspection.

6

266 (246)/
10.5˝ (9.7˝)

598/23.5˝

●

Unit: mm/inch

Note: Models with asterisks are available on a special order basis.

7

NWL-Series 03.1.21 9:01 AM ページ2

Specifications
Wafer size
Wafer cassette
Number of wafers

NWL-860TMB/860TMB SP NWL-860MB/860MB SP
NWL-860TMB INX
NWL-860MB INX
8 to 6 inches (conforms to both SEMI and JEIDA)
Fluoroware® PA182-60MB, Fluoroware® PA192-80M
25 wafers (6-inch), 25 or 26 wafers (8-inch)

Inspection mode

1. Micro inspection
2. Tilt macro inspection
3. Back side center macro inspection
4. Back side periphery macro inspection

Wafer transfer
Pre-alignment

Robotic transfer with vacuum chuck
Non-contact pre-alignment

Orientation flat/notch
detection

By transmitted-type sensor
Wafer angle before and after inspection can be specified in increments of 90° degrees

Stage
Compatible microscopes

Dedicated stage (rotatable 360°; with vacuum chuck)
Nikon OPTIPHOT 300/200C/150, ECLIPSE L200

Dimensions (WxDxH)
and weight (Approx.)

Main unit: 530 x 620 x 275 mm, 50 kg (INX type: 786 x 752 x 442 mm, 60 kg)
Footprint (WxD): 900 x 620 mm (INX type: 1450 x 800 mm)

Vacuum
Power source

Pressure: – 600 mmHg (– 80 kPa) or less, Displacement:10 nl/min. or more
AC 100V/120V, 220V/240V ±10%, 50/60 Hz, 3.5A max.

Wafer size
Wafer cassette
Number of wafers

NWL-641
6, 5 and 4 inches
Fluoroware® H-BAR type housing
25 wafers

Inspection mode

1. Tilt macro inspection
2. Back side center macro inspection
3. Back side periphery macro inspection

NWL-860TM/860TM SP

1. Micro inspection

1. Micro inspection
2. Tilt macro inspection

1. Micro inspection

NWL-641M

1. Micro inspection
2. Tilt macro inspection

Wafer transfer

Robotic transfer with vacuum chuck

Orientation flat/notch
detection

By transmitted-type sensor
Wafer angle before and after inspection can be specified in increments of 90° degrees

Stage
Compatible microscopes

Dedicated stage (rotatable 360°; with vacuum chuck)
Nikon OPTIPHOT 300/200C/150, ECLIPSE L200

Dimensions (WxDxH)
and weight (Approx.)

246 x 655 x 245 mm,
21 kg

Vacuum

Pressure: – 600 mmHg (– 80 kPa) or less, Displacement: 10 nl/min. or more
AC 100V/120V ±10%, 50/60 Hz, 1.7A max.
AC 220V/240V ±10%, 50/60 Hz, 0.85A max.

Power source

NWL-860T/860T SP

266 x 655 x 245 mm,
23.5 kg

Note: Class 1 laser equipment
*All models listed here are UL/CE approved.

WARNING

TO ENSURE CORRECT USAGE, READ THE CORRESPONDING
MANUALS CAREFULLY BEFORE USING YOUR EQUIPMENT.

Specifications and equipment are subject to change without any notice or
obligation on the part of the manufacturer. September 2000.

©2000 NIKON CORPORATION

ISO 9001

Accredited by the
Dutch Council for
Accreditation

ISO 9001 Certified
NIKON CORPORATION
Instruments Company

ISO 14001
ISO 14001 Certified
NIKON CORPORATION
Yokohama Plant

NIKON CORPORATION

NIKON EUROPE B.V.

NIKON INSTRUMENTS INC.

9-16, Ohi 3-chome, Shinagawa-ku, Tokyo 140-8505, Japan
Phone: +81-3-3773-8122 Fax: +81-3-3773-8115
http://www.nikon.com/
http://www.nikon.co.jp/inst/

P.O. Box 222, 1170 AE Badhoevedorp, The Netherlands
Phone: +31-20-44-96-222 Fax: +31-20-44-96-298

1300 Walt Whitman Road, Melville, N.Y. 11747-3064, U.S.A.
Phone: +1-631-547-8500 Fax: +1-631-547-0306

NIKON CANADA INC.

NIKON SINGAPORE PTE LTD

CANADA Phone: +1-905-625-9910 Fax: +1-905-625-0103

SINGAPORE Phone: +65-2978123 Fax: +65-2978131

NIKON FRANCE S.A.

NIKON AG

FRANCE Phone: +33-1-45-16-45-16 Fax: +33-1-45-16-00-33

SWITZERLAND Phone: +41-1-913-62 00 Fax: +41-1-910-37 44

NIKON GmbH

NIKON UK LTD.

GERMANY Phone: +49-211-9414-0 Fax: +49-211-9414-322

UNITED KINGDOM Phone: +44-181-541-4440 Fax: +44-181-541-4584

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ITALY Phone: + 39-55-3009601 Fax: + 39-55-300993

Printed in Japan (0009-10)T

Code No.

2CE-KXTH-3

This brochure is printed on recycled paper made from 40% used material.

E



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