Nokia Solutions and Networks FZCWM2A1 Wi-Fi AP Module 802.11 ac User Manual M2A AC210m front

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Document ID	2903748
Application ID	9dYahbZNy15hR38isAmrxw==
Document Description	User Manual rev.pdf
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Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2016-02-16 00:00:00
Date Available	2016-02-16 00:00:00
Creation Date	2016-01-22 16:32:03
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Document Lastmod	2016-02-05 11:13:29
Document Title	M2A-AC210m-front
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AC210MWi-Fi AP Module Datasheet
Signal Definition
Introduction
Signal
Type
SGMII_0_MB_WIFI_DN
SGMII_0_MB_WIFI_DP
The AC210M is a high-performance 2x2 802.11a/b/g/n/ac Wi-Fi AP module. It supports simultaneous operation of 2.4 GHz and
5 GHz frequency bands. The module provides two MMCX RF connectors for combined 2.4G and 5G radio and one 60-pin
board-to-board connector for connection to the host system.
Description
SGMII Differential
The signal is AC coupled. Proper biasing is provided on the module
Input
receiver.
Interface Definition
WiFi
Std
WiFi Card Usage
RF Card Usage
I/O Voltage
Pin
Use
Gnd
not present
GND
DP
not present
SYNCINB0_MB_RF_DN
lvds_1.8v
DP
not present
SYNCINB0_MB_RF_DP
lvds_1.8v
Gnd
not present
GND
DP
not present
SERDOUT1_RF_MB_DN
cml_1.8v
DP
not present
SERDOUT1_RF_MB_DP
cml_1.8v
Gnd
not present
GND
DP
not present
SERDIN0_MB_RF_DN
cml_1.8v
DP
not present
SERDIN0_MB_RF_DP
cml_1.8v
Gnd
not present
GND
Extra not present
GP_INTERRUPT
cmos_[VDD_IF]
Gnd
GND
GND
DP
Reserved
SYNCOUTB0_RF_MB_DP
lvds_1.8v
DP
Reserved
SYNCOUTB0_RF_MB_DN
lvds_1.8v
Gnd
GND
GND
DP
SGMII_1_WIFI_MB_DP
SERDOUT2_RF_MB_DP sgmii_1.2v/cml_1.8v
DP
SGMII_1_WIFI_MB_DN
SERDOUT2_RF_MB_DN sgmii_1.2v/cml_1.8v
Gnd
GND
GND
DP
SGMII_0_WIFI_MB_DP
SERDOUT3_RF_MB_DP sgmii_1.2v/cml_1.8v
DP
SGMII_0_WIFI_MB_DN
SERDOUT3_RF_MB_DN sgmii_1.2v/cml_1.8v
10
Gnd
GND
GND
11
DP
Reserved
RX_MYK_ENABLE
cmos_[VDD_IF]
cmos_[VDD_IF]
12
DP
Reserved
RX_LNA_ENABLE_MAIN
13
Gnd
Reserved
RX_LNA_ENABLE_DIV
cmos_[VDD_IF]
14
Extra Reserved
TX_MYK_ENABLE
cmos_[VDD_IF]
15
Extra Reserved
TX_KEY_MAIN
cmos_[VDD_IF]
16
Extra Reserved
TX_KEY_DIV
cmos_[VDD_IF]
17
Gnd
Reserved
TR_SWITCH_MAIN
cmos_[VDD_IF]
18
DP
Reserved
TR_SWITCH_DIV
cmos_[VDD_IF]
19
DP
I2C_9550_SCL (for test)Reserved
n/c on mb
I2C_9550_SDA (for test)GND
n/c on mb wifi slot
20
Gnd
21
DP
TRSTn
GPIO4 (TRSTn)
n/c on mb
22
DP
TDO
GPIO5 (TDO)
n/c on mb
23
Gnd
TDI
GPIO6 (TDI)
n/c on mb
24
DP
TMS
GPIO7 (TMS)
n/c on mb
25
DP
TCK
GPIO8 (TCK)
n/c on mb
26
Gnd
Reserved
TEST
n/c on mb
27
DP
5V_SENSE
5V_SENSE
ana_5.1v
28
DP
VCC_5.1V
VCC_5.1V
29
Gnd
VCC_5.1V
VCC_5.1V
30
Extra VCC_5.1V
VCC_5.1V
36 DP
SGMII_1_MB_WIFI_DPSERDIN2_MB_RF_DP
sgmii_1.2v/cml_1.8v
rf/wifi,
37 DP
SGMII_1_MB_WIFI_DNSERDIN2_MB_RF_DN
sgmii_1.2v/cml_1.8v
rf/wifi,
38 Gnd
GND
GND
39 DP
SGMII_0_MB_WIFI_DPSERDIN3_MB_RF_DP
sgmii_1.2v/cml_1.8v
rf/wifi,
40 DP
SGMII_0_MB_WIFI_DNSERDIN3_MB_RF_DN
sgmii_1.2v/cml_1.8v
rf/wifi,
41 Gnd
GND
GND
42 DP
I2C_SCL
I2C_SCL
cmos_3.3v
43 DP
I2C_SDA
I2C_SDA
cmos_3.3v
44 Gnd
GND
GND
45 Extra Reserved
SPI_SCLK
cmos_[VDD_IF]
46 Extra UART_WIFI_MB
SPI_MISO
cmos_[VDD_IF]
47 Extra UART_MB_WIFI
SPI_MOSI
cmos_[VDD_IF]
48 Gnd
Reserved
SPI_CS_n
cmos_[VDD_IF]
49 DP
I2C_WP
I2C_WP
cmos_3.3v
50 DP
RESET_n
RESET_n
cmos_[VDD_IF]
51 Gnd
GND
GND
52 DP
LED_WLAN_0
GPIO0
cmos_[VDD_IF]
53 DP
LED_WLAN_1
GPIO1
cmos_[VDD_IF]
54 Gnd
LED_WLAN_2
GPIO2
cmos_[VDD_IF]
55 DP
LED_WLAN_3
GPIO3
cmos_[VDD_IF]
56 DP
VDD_IF
VDD_IF (1.8v from MB, 2.5v from FPGA Dev Card)
57 Gnd
VCC_5.1V
VCC_5.1V
58 DP
VCC_5.1V
VCC_5.1V
59 DP
VCC_5.1V
VCC_5.1V
60 Gnd
VCC_5.1V
VCC_5.1V
SGMII_0_WIFI_MB_DN
Pullup/down
MB
Dir
mb, 0.1uF
mb, 0.1uF
rf, 0.1uF
rf, 0.1uF
mb, 4.7K, gnd
mb, 0.1uF
mb, 0.1uF
mb, 0.1uF
mb, 0.1uF
rf,
rf,
rf,
rf,
rf,
rf,
rf,
rf,
4.7K, gnd
4.7K, gnd
4.7K, gnd
4.7K, gnd
4.7K, gnd
4.7K, gnd
4.7K, gnd
4.7K, gnd
rf, 1K, gnd
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
0.1uF
0.1uF
mb 1K; rf/wifi 10K, 3.3v I/O
mb 1K; rf/wifi 10K, 3.3v I/O
rf, 4.7k, gnd
mb, 4.7k, VDD_IF
rf, 4.7k, VDD_IF
rf, 4.7k, VDD_IF
rf, 4.7k, 3.3v
rf/wifi, 4.7K, VDD_IF
mb,
mb,
mb,
mb,
10K,
10K,
10K,
10K,
VDD_IF
VDD_IF
VDD_IF
VDD_IF
I,
I,
I,
I,
I/O
I/O
I/O
I/O
SGMII_0_WIFI_MB_DP
SGMII_1_MB_WIFI_DN
-/-/1480 (mV, min/typ/max)
Vil
Input Single Voltage Low
520/-/- (mV, min/typ/max)
Vidth
Input Differential Threshold
-50/-/50 (mV, min/typ/max)
Vio
Internal Offset Voltage
800/900/1000 (mV,min/typ/max)
Receiver Differential Input
100ohm
SGMII Differential
Output
NC
Voh
High Level Output Voltage
-/1050/1195 (mV, min/typ/max)
Vol
Low Level Output Voltage
200/750/-(mV, min/typ/max)
VoD
Output Differential Voltage
300mV
VoS
Output Offset Voltage
500/900/1070(mV, min/typ/max)
Reserved
The signals are not connected on the module.
Board Present
On module the signal is pulled to GND with a 0 ohm resistor.
SGMII_1_MB_WIFI_DP
SGMII_1_WIFI_MB_DN
SGMII_1_WIFI_MB_DP
WIFI_PRESENCE_n
Indication
RESET_n
Reset
External reset to the module. It is internally pulled down GND by 10k
ohm resistor. This reset signal is connected to module CPU through
GPIO..
The signal must be driven by 1.8V logic.
IIC_SDA
IO
I2C Data
IIC_SCL
I2C Clock
Vih
Input Voltage High
2/-/3.5 (V, min/typ/max)
Vil
Input Voltage Low
-0.5/-/0.8 (V, min/typ/max)
Voh
High Level Output Voltage
2.2/-/3.3 (V, min/typ/max)
Vol
Low Level Output Voltage
-0.2/-/0.6 (V, min/typ/max)
LED_WLAN_0
OC
2.4G LED
LED_WLAN_1
OC
5G LED
Open collector driven, sink maxim 20mA current when LED lit
LED_WLAN_2
OC
LED_Reserved
(Reserved) Open collector driven, sink maxim 20mA current when
Open collector driven, sink maxim 20mA current when LED lit
LED lit
LED_WLAN_3
OC
LED_Reserved
(Reserved) Open collector driven, sink maxim 20mA current when
LED lit
VCC_5.1V
0.1uF
0.1uF
Input Single Voltage High
Impedance
AC
Coupling
Vih
Rin
The module communicates with the host system through an 82-pin connector (the Wi-Fi modules populate 60-pin only).
The connector on the module is Molex 171810-1115.
The connector definition follows Nokia RF and WiFi Card Interface Pinout.xlsx rev 11.
RF
Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
Parameters
POW
5V Power Input
5.1V+/-0.15V.
0~3A
5V Power Sense
The 5V sense is directly wired on the Wi-Fi module from VCC_5.1V
UART signal from MB
The signal must be driven by 1.8V logic
ER
5V_SENSE
POW
ER
UART_WIFI_MB
to Module
UART_MB_WIFI
UART signal from
The signal must be driven by 1.8V logic
I2C_WP
I2C write protect signal
On module this signal is connected to EEPROM write protection,
driving high to enable EEPROM write protection.
The signal must be driven by 3.3V logic
VDD_IF
I2C_9550_SCL
(for test)
I2C_9550_SDA
I/O
(for test)
1.8V voltage
On module this is 1.8V voltage level reference
I2C clk signal from
On module this is connected to CPU GPIO16 for manufacturing test
9550
only
I2C data signal
On module this is connected to CPU GPIO 21 for manufacturing test
between 9550 and
only
slave units
Reserved
NC
GND
GND
JTAG
I/O
Reserved pins
The reserved pins are NOT connected on the Wi-Fi module
GND
GND
JTAG debug pins
Connected to CPU EJTAG port for device debug. This interface shall
not be daisy chained on MB. This interface must be driven by 2.5V
logic
Power Supply
Power consumption
Capacitive load
Power up ramping
Average power consumption of the module under typical operation mode shall be less than 10W. Peak power supply
current is less than 3A at 5.1V.
The module shall not present a capacitive load to the mainboard larger than 1500uF
The module is not designed for hot swapping. The power supply ramping speed is not controlled by the module itself.
Operation Environment
Operating temperature
Operating humidity
Storage temperature
Elevations
Environment
Surge
The module shall support a low operating temperature limit of -40C.
The upper operating temperature limit will be determined by empirically measuring the case temperature of the critical
components and ensuring that none of the individual component limits are violated while the module is operating within
the Nokia host platform. Once data is available, this entry shall be updated with the upper operating temperature limit.
The module is expected to withstand heatsink body temperature of 80C when proper heatsinking is in place.
5% to 95% non-condensing
-40°C to +85°C
86kPa～106kPa
Shall be RoHS 2011/65/EU compliant (RoHS 6 compliant, no Pb);
WEEE 2002/96/EC recyclable materials requirements
Telcordia GR-63-CORE
The module does not provide onboard surge protection.
Safety and EMC
Safety
This WiFi module design shall not prevent the host product from obtaining NRTL Listing 60950 (US &CA), CB with
IEC/EN 60950-1 (Basic safety certificate for worldwide marketing)
EMC/EMI
GB 9254 -2008(Class B of Product) , EN55022, CISPR 22:2006 , EN55024, CISPR 24:2010
Unwanted Emission
The noisy circuits such as crystal, CPU, DDR, etc. are well shielded to avoid generating unwanted emission impacting
the LTE/3G band receiver.
ESD
HBM 1.5KV
Package information
1. PCBA Label 1
PCBA Label：
2D data Matrix, no printed label.
2. PCBA Label 2
Label on PCBA board---Nokia SN
Label size : 30 x 7mm
Material : heat resisting PET
Colors: White material, printing in black
Font Arial size is 3pt
Barcode: code 128B
Label on PCBA board---Certification information
Label size : 15 x 5mm
Material : heat resisting PET
Colors: White material, printing in black
Font Arial size is 3pt

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