Novatel Wireless CNN0301 1XRTT Multi-Band M2M OEM Module User Manual CNN0301IG001 HS 3001

Novatel Wireless Inc. 1XRTT Multi-Band M2M OEM Module CNN0301IG001 HS 3001

Contents

User Manual

HS 3001Integration GuideCNN0301IG001Version:DRAFT 0.110 May, 2012
GeneralTERMS OF USE OF NEW MATERIALS - PLEASE READ CAREFULLYFrom time to time, Enfora, in its sole discretion, may make available for download on its website(www.enfora.com), or may transmit via mail or email, updates or upgrades to, or new releases of, thefirmware, software or documentation for its products (collectively, 'New Materials'). Use of such NewMaterials is subject to the terms and conditions set forth below, and may be subject to additional termsand conditions as set forth in Enfora's Technical Support Policy (posted on its website) and/or any writtenagreement between the user and Enfora.All New Materials are provided AS IS. Enfora makes no warranty or representation with respect to themerchantability, suitability, functionality, accuracy or completeness of any such New Materials. The user ofsuch New Materials assumes all risk (known or unknown) of such use. Enfora reserves all rights in suchNew Materials. The user shall have only a revocable and limited license to use such New Materials inconnection with the products for which they are intended. Distribution or modification of any NewMaterials without Enfora's consent is strictly prohibited.IN NO EVENT WILL ENFORA BE RESPONSIBLE FOR ANY INCIDENTAL, INDIRECT, CONSEQUENTIAL ORSPECIAL DAMAGES AS A RESULT OF THE USE OF ANY NEW MATERIALS. ENFORA'S MAXIMUM LIABILITYFOR ANY CLAIM BASED ON THE NEW MATERIALS SHALL NOT EXCEED FIFTY U.S. DOLLARS ($50).- ii -
Copyright© 2012 Enfora, Inc. All rights reserved. Complying with all applicable copyright laws is the responsibility ofthe user. Without limiting the rights under copyright, no part of this document may be reproduced, storedin or introduced into a retrieval system, or transmitted in any form or by any means (electronic,mechanical, photocopying, recording or otherwise), or for any purpose, without the express writtenpermission of Enfora, Inc.Enfora and the Enfora logo are either registered trademarks or trademarks of Enfora, Inc. in the UnitedStates.251 Renner PkwyRichardson, TX 75080 USAPhone: (972) 633-4400Fax: (972) 633-4444Email: info@enfora.comwww.enfora.com- iii -
WARRANTY INFORMATION[Revised: 11/11/2010]This warranty applies to (a) products sold directly by Enfora, unless a different warranty is specified in awritten agreement between Enfora and the purchaser; and (b) products sold to end users through adistributor authorized by Enfora, but only where the authorized distributor does not provide a separatewarranty on such products, and Enfora has agreed to provide this warranty to such end users. If youpurchased the product from an authorized distributor, please check whether this warranty from Enfora, ora separate warranty from the distributor, applies to your purchase. This warranty does not apply to any (i)accessories or batteries for the products; or (ii) demonstration samples or prototypes of the products.Unless otherwise provided in a written agreement between Enfora and the purchaser, all such accessories,batteries, samples or prototypes are provided by Enfora AS IS without any warranty of any kind.Enfora warrants to the original purchaser of the product from Enfora or its authorized distributor (asapplicable) that, for a period of one (1) year from the date of shipment of the product from Enfora, theproduct hardware will be substantially free from defects in material or workmanship under normaloperation, and the product firmware will perform substantially in accordance with the productdocumentation provided by Enfora. Enfora does not warrant that (a) the product hardware or firmwarewill meet the purchaser's requirements; (b) the operation of the product hardware or firmware will beuninterrupted or error-free; or (c) the product, when integrated in, or combined with, other products orsoftware not supplied by Enfora, will continue to perform substantially in accordance with the productdocumentation. This limited warranty is for the benefit of the original purchaser, and is not transferable.During the warranty period, Enfora, at its expense and in its sole discretion, will repair the product, orreplace the product with a corresponding or equivalent product, if it is determined to have a covereddefect, provided that the purchaser first notifies Enfora (directly or through its authorized distributor fromwhich the product was purchased) of any such defect, furnishes Enfora with a proof of purchase (ifrequired), requests and obtains a return merchandize authorization (RMA) number from Enfora, andreturns the product under that RMA to Enfora (or, at Enfora's option, to its authorized distributor), with theshipping charges being prepaid by purchaser. If, upon reasonable examination of the returned product,Enfora does not substantiate the defect claimed by purchaser, or determines that the defect is not coveredunder this limited warranty, Enfora will not be required to repair or replace the product, but may insteadreship the product to the purchaser (or, at Enfora's option, to its authorized distributor where the productcan be made available to purchaser), in which case the purchaser shall be responsible for paying Enfora'scost for reshipping the product to purchaser (or to Enfora's authorized distributor), and Enfora's usualcharges for unpacking, testing, and repacking the product for reshipment to purchaser (or to Enfora'sauthorized distributor).Purchaser shall bear the risk of loss or damage in transit to any product returned bypurchaser to Enfora, or any returned product not found to be defective or covered under this warranty, andreshipped by Enfora to purchaser (or to Enfora's authorized distributor). In the event Enfora repairs or- 4 -
replaces a defective product covered by this limited warranty, the repaired or replacement product will becovered under this limited warranty for the remainder of the original warranty period on the defectiveproduct, or a period of ninety (90) days, whichever is longer. If Enfora is unable to repair or replace adefective product covered by this limited warranty, Enfora will provide to purchaser a credit or a refund(at Enfora's option) of the original purchase price (excluding taxes and shipping charges). Any returned andreplaced product, or any product for which Enfora has furnished a credit or a refund, becomes theproperty of Enfora.Enfora shall not have any obligation to provide any firmware bug fixes, upgrades or new releases except asmay be necessary to correct any covered defect of which purchaser notifies Enfora in writing during thewarranty period. Enfora, from time to time and in its sole discretion, may make available for download onits website (www.enfora.com), or may provide via email, certain firmware bug fixes, upgrades or newreleases for the product. Download and use of any such bug fixes, upgrades or new releases is subject to allof the applicable terms and conditions of Enfora's technical support policy as posted and updated on itswebsite.Enfora shall have no obligation under this limited warranty for (a) normal wear and tear; (b) the cost ofprocurement of substitute products; or (c) any defect that is (i) discovered by purchaser during thewarranty period but for which purchaser does not request an RMA number from Enfora, as requiredabove, until after the end of the warranty period, (ii) caused by any accident, misuse, abuse, improperinstallation, handling or testing, or unauthorized repair or modification of the product, (iii) caused by use ofany materials not supplied by Enfora, or by use of the product other than in accordance with itsdocumentation, or (iv) the result of electrostatic discharge, electrical surge, fire, flood or similar causes.The purchaser (or its customers, as applicable) shall be solely responsible for the proper configuration,testing and verification of the Enfora product prior to deployment in the field, and for ensuring that anyend user product or system into which the Enfora product is integrated or incorporated operates asintended and meets the requirements of purchaser (or its customers). Enfora shall have no responsibilitywhatsoever for the integration, configuration, testing, verification, installation, upgrade, support ormaintenance of any such end user product or system, or for any liabilities, damages, costs or expensesassociated therewith.ENFORA'S SOLE RESPONSIBILITY AND PURCHASER'S SOLE REMEDY UNDER THIS LIMITED WARRANTYSHALL BE FOR ENFORA TO REPAIR OR REPLACE THE PRODUCT (OR IF REPAIR OR REPLACEMENT IS NOTPOSSIBLE, PROVIDE A CREDIT OR REFUND OF THE PURCHASE PRICE) AS PROVIDED ABOVE. ENFORAEXPRESSLY DISCLAIMS ALL OTHER WARRANTIES OF ANY KIND, EXPRESS OR IMPLIED, INCLUDINGWITHOUT LIMITATION ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY,SATISFACTORY PERFORMANCE AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ENFORABE LIABLE FOR ANY INDIRECT, SPECIAL, EXEMPLARY, INCIDENTAL OR CONSEQUENTIAL DAMAGES(INCLUDING WITHOUT LIMITATION LOSS OR INTERRUPTION OF USE, DATA, REVENUES OR PROFITS)- 5 -
RESULTING FROM A BREACH OF THIS WARRANTY OR BASED ON ANY OTHER LEGAL THEORY, EVEN IFENFORA HAS BEEN ADVISED OF THE POSSIBILITY OR LIKELIHOOD OF SUCH DAMAGES.Some jurisdictions may require a longer warranty period than specified above and, accordingly, forproducts sold in those jurisdictions the applicable warranty period shall be extended as required under thelaws of those jurisdictions. Furthermore, some jurisdictions may not allow the disclaimer of impliedwarranties or the exclusion or limitation of incidental or consequential damages, so the above disclaimer,limitation or exclusion may not apply to products sold in those jurisdictions. This limited warranty gives thepurchaser specific legal rights and the purchaser may have other legal rights that vary from jurisdiction tojurisdiction.This limited warranty shall be governed by the laws of the State of Texas, United States of America,without regard to conflict of laws principles. This limited warranty shall not be governed in any respect bythe United Nations Convention on Contracts for the International Sale of Goods.Regulatory ComplianceFCC CERTIFICATIONEnfora certifies that the Enabler HS 3001 CDMA Radio Module (FCC ID: MIVCNN0301) complies with theRF requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24,Subpart E and Part 22 of the FCC Rules and Regulations. This certification is contingent upon installation,operation and use of the Enabler HS 3001 module and its host product in accordance with all instructionsprovided to both the OEM and end user. When installed and operated in a manner consistent with theinstructions provided, the Enabler HS 3001 module meets the maximum permissible exposure (MPE) limitsfor general population / uncontrolled exposure at defined in Section 1.1310 of the FCC Rules andRegulations.The Enabler HS 3001 module is designed for use in a variety of host units, "enabling" the host platform toperform wireless data communications. However, there are certain criteria relative to integrating themodem into a host platform such as a PC, laptop, handheld, monitor and control unit, etc. that must beconsidered to ensure continued compliance with FCC compliance requirements.In order to use the Enabler HS 3001 module without any additional FCC certification the installation mustmeet the following conditions:lThe system antenna(s) connected to the Enabler HS 3001 module must be installed to provide atleast 20cm separation from the human body during normal operation.lThe system antennas must not be co-located with any other transmitter or antenna.- 6 -
lThe system antenna(s) used with the Enabler HS 3001 module must not exceed the following levels:lBand Class 0: the maximum gain is 2.2dBi.lBand Class 1: the maximum gain is 8dBi.If any of these conditions are not met then additional information should be sought from the FCC or an FCCqualified test laboratory.The system user manuals and other documentation must also include appropriate caution and warningstatements and information.FCC NOTICE TOUSERSEnfora has not approved any changes or modifications to this device by the user. Any changes ormodifications could void the users authority to operate the device. See 47 CFR Sec. 15.21. The devicecomplies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This devicemay not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation. See 47 CFR Sec. 15.19.This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant topart 15 of the FCC rules. These limits are designed to provide reasonable protection against harmfulinterference in a residential installation. This equipment generates, uses, and can radiate radio frequencyenergy and, if not installed and used in accordance with the instructions, may cause harmful interferenceto radio communications. However, there is no guarantee that interference will not occur in a particularinstallation. If this equipment does cause harmful interference to radio or television reception, which canbe determined by turning the equipment off and on the user is encouraged to try to correct theinterference by one or more of the following measures:lReorient or relocate the receiving antenna.lIncrease the separation between the equipment and receiver.lConnect the equipment into an outlet on a circuit different from that to which the receiver is con-nected.lConsult the dealer or an experienced radio/TV technician for help.If the FCCID of the module is not visible when installed in the host platform, then a permanently attachedor marked label must be displayed on the host unit referring to the module.The label should contain wording such as:Contains FCC ID: MIVCNN0301This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) This device must accept any interferencereceived, including interference that may cause undesired operation.ROHS COMPLIANCE- 7 -
As a part of Enfora’s corporate policy of environmental protection, Enfora takes every step to ensure thatthe HS 3002 modules are designed and manufactured to comply to the European Union Directive2002/95/EC for the Restriction of Hazardous Substances (RoHS).- 8 -
Important Safety InformationThe following information applies to the devices described in this manual. Always observe all standard andaccepted safety precautions and guidelines when handling any electrical device.lSave this manual: it contains important safety information and operating instructions.lDo not expose the HS 3001 product to open flames.lEnsure that liquids do not spill onto the devices.lDo not attempt to disassemble the product: Doing so will void the warranty. This product does notcontain consumer-serviceable components.DisclaimerThe information and instructions contained within this publication comply with all FCC, GCF, PTCRB,R&TTE, IMEI and other applicable codes that are in effect at the time of publication. Enfora disclaims allresponsibility for any act or omissions, or for breach of law, code or regulation, including local or statecodes, performed by a third party.Enfora strongly recommends that all installations, hookups, transmissions, etc., be performed by personswho are experienced in the fields of radio frequency technologies. Enfora acknowledges that theinstallation, setup and transmission guidelines contained within this publication are guidelines, and thateach installation may have variables outside of the guidelines contained herein. Said variables must betaken into consideration when installing or using the product, and Enfora shall not be responsible forinstallations or transmissions that fall outside of the parameters set forth in this publication.Enfora shall not be liable for consequential or incidental damages, injury to any person or property,anticipated or lost profits, loss of time, or other losses incurred by Customer or any third party inconnection with the installation of the Products or Customer's failure to comply with the information andinstructions contained herein.- 9 -
Table of Contents1 Introduction/Overview 11.1 Product Overview 11.2 HS 3001 Product Specifications 11.3 Reference Documents 41.3.1 HS 3001 Product Documentation 41.4 Typical Usage 51.5 Contacting Enfora 52 Module Power 62.1 Operating Power 62.1.1 Typical Input Current 62.1.2 CDMA Operation Input Current 63 Interfaces 73.1 Module Mounting to Host Board (Reference) 73.2 Connectors 103.3 RF Connection Options 113.3.1 RF Board-to-Board Connector Option 113.4 I/O Connector Pin Assignments 114 Hardware Design Guidelines 154.1 General Design Guidelines for Utilizing HS 3001 Modules 154.1.1 Advanced Tips for an RF Friendly Layout 154.1.2 Audio Reference Design 204.2 Control Connector Signal Descriptions and Functions 224.2.1 Module Power (PINS 87, 89, 91, 93, 95, 97, 99) 234.2.2 Modem Power-on and Recovery Techniques 234.2.3 Power Switch Logic Detect (Pin 85) 234.2.4 ON/OFF (PIN 37) 24- x -
4.2.5 Phone On - PHON (PIN 35) 254.2.6 Internal Power Switch 264.2.7 Voltage Reference - VRIO_MSME1.8 (PIN 77) 264.2.8 USB (PINS 1, 3, 5, 7) 274.2.9 General Purpose Input/Output Interface 274.2.10 RTC Sleep 284.2.11 Serial Interfaces and Handshake (Pins 11, 13, 15, 21) 284.2.12 Digital Audio Interface (PINS 12, 14, 16, 18) 294.2.13 32 KHZ Output (PIN 56) 304.2.14 Analog-to-Digital Inputs (PIN 44 and 74) 304.2.15 Handset Microphone Input (PINS 65, 67) 314.2.16 Handset Microphone BIASOutput (PIN 63) 314.2.17 Handset Speaker Output (PINS 71, 73) 314.2.18 Headset Microphone Input (PIN 55) 324.2.19 Headset Speaker Output Left and Right (PINS 57, 59) 324.2.20 Headset Detect (PIN 47) 334.3 Circuit Protection 33- xi -
1 Introduction/Overview1.1 Product OverviewThe HS 3001 modem is a compact, wireless OEM module that utilizes the Code Division Multiple AccessCDMA international communications standard to provide two-way wireless capabilities. The HS 3001module is a fully approved CDMA device, enabling application-specific, two-way communication andcontrol.The small size of the HS 3001 module allows it to be integrated easily into the application and packaging.Figure: 1 - HS 3001 Module1.2 HS 3001 Product SpecificationsThe following table lists the main features and specifications of the HS 3001 Module.Physical Dimensions and WeightSize (L x W x H) 28.0 mm x 25.0 mm x 4.50 mmWeight 4 grams- 1 -
InterfacesHost Interface Serial InterfaceData input/output interface 100 position 0.4mm pitch connector (Molex P/N 55909-1074)Primary serial port V.24 protocol, 1.8V levels, UART implementation, Hardware flowcontrolUSB port USB serial port and USB Debug (USB Debug is Enfora Use only)GPIO Up to 8 GPIOAudio Analog and Digital audioVoice Supports Handset and Headset audio interfacesAntenna Interface B2B Spring contactCommand protocol Enfora Packet API, CDMA AT command setReference clock 32kHz output reference clocks (accessible via 100-pin connector)ADC 2 ADC inputsLogiclUART1lPCMlDigital AudiolGPIOlPWONlPower Control1.8 VUART2 2.85 VUSB 3.3 VVBUS 5.0 VMic Bias Out 1.8 V @ 1.5 mA max.Audio Mic Inputs 1.0 Vp-p ±12%Ear Audio Out TBDHeadset Out L&R TBDPowerElectrical power Electrical power 3.3 to 4.4 Vdc (vbat)Supply Vripple must be less than 25mV across all frequencies.- 2 -
Peak currents and average powerdissipationRefer to the Operating Power table in the Technical Specificationsfor peak currents and average power dissipation for variousmodes of operation.Radio FeaturesFrequency bands BC0-800 MHz –US Cell, BC1-1900 MHz – US PCSRadio Mode CDMA 1xRTT, 153 kbps FL/RLChipset Qualcomm QSC1110Packet Data TransferProtocol CDMA 1xRTT (153 kbps UL and DL)Short Message Services Text, PDU, MO/MT, Cell BroadcastApplication InterfaceHost Protocol AT commands, PPP FOTA and UDP API available in future release.Internal Protocols PPP, UDP PAD UDP API, TCP API and TCP PAD available in futurerelease.Physical Interface UART, USBAudio Interface Digital, Analog, Headset and Handset interfaces.Audio Features Handset Microphone biasingHeadset Microphone biasingHeadset Plug/Unplug detectionHandset microphone input (MICIN, MICIP pins)Headset microphone input (HSMIC pin)Outputs Handset earphone outputs (EARP, EARN pins)Headset 32 Ω stereo outputs (HSOL, HSOR pins)Mechanical: OperationalOperational vibration, sinusoidal TBD- 3 -
Operational vibration, random TBDMechanical: Storage and Trans-portationTransportation vibration, packaged ASTM D999Drop, packaged ASTM D775 method A, 10 dropsShock, un-packaged TBDDrop, un-packaged TBDEnvironmentalCDMA Sensitivity (Typical) ≤ -108 dBmCompliant Operating Temp. -20 °C to 60 °C (CDMA Spec Compliant)Operating Temperature. -30 °C to 70 °CStorage Temperature -40 °C to 85 °CHumidity Up to 95% non condensingEmissions FCC 47 CFR Parts 2,15,22 & 24RegulatoryAgency approvals FCC Certification1.3 Reference Documents1.3.1 HS 3001 Product Documentation1.3.1.1 ManualslCNN0301AT001 - HS 3001 AT Command ReferencelCNN0301TG001 - HS 3001 Transition GuidelENF0000SD001 - HDK Guide- 4 -
1.4 Typical UsageA variety of applications can use the HS 3001 module for transmitting/receiving data/voice, such as:lAutomated Meter Reading (AMR)lPoint of Sale ApplicationslE-mail and Internet accesslAutomated Vehicle Location (AVL)lMachine to Machine communication (M2M)lTelematicslTelemetrylWireless SecuritylSmart PhoneslTelemedicine1.5 Contacting EnforaFor technical support and customer service dealing with the modem itself, contact the company where youpurchased the product. If you purchased the product directly from Enfora, visit the SUPPORT page on theEnfora website. www.enfora.com- 5 -
2 Module Power2.1 Operating Power2.1.1 Typical Input CurrentTest Conditions:Typical Results @ 3.6 V, 20 deg C, with 1000 μF at connector input on VBAT and RF terminated into a 50Ωresistive load.Traffic Data Rate: FullBC0 Ch = 550BC1 Ch = 5502.1.2 CDMA Operation Input CurrentBand Mode Low Nom/Avg High/Peak UnitsAverage PeakMAXBC1 550mABC0 490mAMINBC1 130mABC0 115mA- 6 -
3 InterfacesImage TBDFigure: 2 - Front of Module (Board-to-Board RF Conn. Version)Image TBDFigure: 3 - Pin 1 Reference, 100-Pin I/O Connector3.1 Module Mounting To Host Board (Reference)The module provides mounting tabs that must be soldered to a PCB. These tabs provide circuit groundingfor the module.Figure: 4 - Host Board Layout- 7 -
Figure: 5 - Module Mounting- 8 -
Figure: 6 - Host Pads for Board-To-Board RF Connector- 9 -
Figure: 7 - Modem Mounting Pads3.2 ConnectorsOn The Modem: 100-Pin I/O Connector, Plug, SMT, Dual Row, 0.4 mm Pitch- 10 -
lEnfora PN = CON-1040-0100lMolex PN = 55909-1074On The Host: 100-Pin I/O Connector, Socket, SMT, Dual Row, 0.4 mm Pitch (Mate to module)lEnfora PN = CON-1040-0101lMolex PN = 51338-1074The mated height of the two connectors is 1.50 mm.3.3 RF Connection Options3.3.1 RF Board-to-Board Connector OptionOn The Modem:Enfora PN = CON-0009-0006Sunridge PN = MCE-15A-G01On The Host PCB:No connector required.3.4 I/O Connector Pin AssignmentsThe following table shows the pin assignments for the input/output connector.Pin Function Description Notes01 VBUS USB Power02 GND Ground03 VBUS USB Power04 GND Ground05 USB_DP USB Data (+)06 LED_SINK Current sink for LED07 USB_DM USB Data (-)08 Reserved N/A Do Not Connect09 Reserved N/A Do Not Connect10 Reserved N/A Do Not Connect- 11 -
Pin Function Description Notes11 UART_RTS UART1 RTS (input)12 PCM_DIN Digital Audio I/F Data In13 UART_CTS UART1 CTS (output)14 PCM_CLK Digital Audio Clock15 UART_RX UART1 RX (output)16 PCM_SYNC Digital Audio Interface Sync17 Reserved N/A Do Not Connect18 PCM_DOUT Digital Audio I/F Data Out19 Reserved N/A Do Not Connect20 Reserved N/A Do Not Connect21 UART_TX UART1 TX (input)22 Reserved N/A Do Not Connect23 Reserved N/A Do Not Connect24 Reserved N/A Do Not Connect25 Reserved N/A Do Not Connect26 Reserved N/A Do Not Connect27 UART2_RX UART 2 RX (output)28 Reserved N/A Do Not Connect29 UART2_TX UART 2 TX (input)30 Reserved N/A Do Not Connect31 Reserved N/A Do Not Connect32 Reserved N/A Do Not Connect33 Reserved N/A Do Not Connect34 Reserved N/A Do Not Connect35 PHON "Phone on" - momentary low to activate36 Reserved N/A Do Not Connect37 ON\OFF Power Control Switch Input38 Reserved N/A Do Not Connect39 Reserved N/A Do Not Connect40 Reserved N/A Do Not Connect- 12 -
Pin Function Description Notes41 Reserved N/A Do Not Connect42 Reserved N/A Do Not Connect43 Reserved N/A Do Not Connect44 ADC2 Analog In #245 Reserved N/A Do Not Connect46 Reserved N/A Do Not Connect47 HSDET Headset Detect48 Reserved N/A Do Not Connect49 Reserved N/A Do Not Connect50 Reserved N/A Do Not Connect51 Reserved N/A Do Not Connect52 Reserved N/A Do Not Connect53 MICBIAS Microphone Bias54 GND Ground55 HSMIC+ Headset Microphone (+)56 CLK32K_BUF Buffered 32.768 kHz clock output57 HSOL Headset Out Left (+)58 GPIO_4 General Purpose IO59 HSOR Headset Out Right (+)60 GPIO_3 General Purpose IO61 Reserved N/A Do Not Connect62 GPIO_2 General Purpose IO63 MICBIAS Microphone Bias64 GPIO_1 General Purpose IO65 MICIP Microphone +66 GPIO_7 General Purpose IO67 MICIN Microphone -68 GPIO_5 General Purpose IO69 GND Ground70 GPIO_6 General Purpose IO- 13 -
Pin Function Description Notes71 EARP Earphone +72 GPIO_8 General Purpose IO73 EARN Earphone -74 ADCIN1 ADC IN 175 GND Ground76 Reserved N/A Do Not Connect77 VRIO_MSME1.8 Reference Voltage (<5 mA) for external interfaces78 Reserved N/A Do Not Connect79 Reserved N/A Do Not Connect80 Reserved N/A Do Not Connect81 Reserved N/A Do Not Connect82 Reserved N/A Do Not Connect83 Reserved N/A Do Not Connect84 Reserved N/A Do Not Connect85 PSLOGIC On/Off logic select86 GND Ground/Power Return/Shield87 VBAT Power Input88 GND Ground89 VBAT Power Input90 GND Ground91 VBAT Power Input92 GND Ground93 VBAT Power Input94 GND Ground95 VBAT Power Input96 GND Ground97 VBAT Power Input98 GND Ground99 VBAT Power Input100 GND Ground- 14 -
4 Hardware Design Guidelines4.1 General Design Guidelines For Utilizing HS 3001ModulesThe following guidelines are provided in an effort to allow HS 3001 module users to successfully implementtheir PCB layout to obtain the best performance. This includes the lowest possible EMI emissions,maximum thermal conduction, mechanical integrity, and voice quality. The HS 3001 module is a verycompact, high performance design, yet it is easy to interface into the final product. In order to realize itsfull potential, designers should pay close attention to ground structures, the routing of RF and Digitaltraces, and the size of the power supply lines.Warning: These design tips are strictly guidelines and are not meant to be a completelist of items that guarantee actual performance. Each application is different andmay require variation from these guidelines, however, care should be given to utilizethese sound engineering principles whenever possible4.1.1 Advanced Tips For An RF Friendly Layout4.1.1.1 Ground PlaneTo ensure the lowest possible EMI emissions and maximum thermal conductivity, it is recommended thatall metal tabs on the cellular module shield must be soldered down onto a continuous ground plane thatruns under the entire module. Ample ground vias should be provided around the metal tabs to create a lowimpedance ground. It is recommended to minimize the number of I/O and power traces and vias under thecellular module to allow for as much ground plane as possible. An example of a good ground structure andpad layout is shown below in Figure 1.- 15 -
Figure: 8 - Example of good ground plane for CDMA modules4.1.1.2 Thermal ReliefBecause the ground plane acts as a large heat sink, it can affect the solderability of components. Acommon method to reduce this effect is to use thermal relief around the pad in question. However, greatcare must be taken when using thermal relief for high current or high frequency applicationsFor example, a large thermal relief like the one shown in Figure 2 can serve the purpose for generalapplications such as low current, low speed data lines, DC connections and audio frequency applications.However, such thermal relief structures should be avoided for applications where high current and/or highfrequency is involved, such as those using the cellular Module. Depending on the frequency of operation,the long narrow thermal relief traces between the pad and the ground plane act like an RF choke. These RFchokes become higher impedance at harmonics of the fundamental frequency making it problematic forhigh frequency suppression. This can make it difficult to pass type approval testing.- 16 -
Figure: 9 - Example of a POOR RF Thermal ReliefIf thermal relief is necessary, it is recommended that you use short, fat traces similar to those shown inFigure 3. This will still provide a solderable connection, while providing a better RF connection. Makingthem shorter also allows for a more continuous ground plane due to less copper being removed from thearea. It is also recommended to have ground vias around all thermal relief of critical ground pins such asthe five cellular shield tabs.- 17 -
Figure: 10 - Example of a GOOD RF Thermal Relief4.1.1.3 Antenna And RF Signal TraceThe PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic impedance,coplanar, or routed into internal layers to keep the top layer continuous around and underneath thecellular module. Ample ground vias should be provided around the RF contacts, the RF trace and launchpad. If possible, keep I/O and power traces away from the RF port. This includes traces running parallel ororthogonal to it. Thermal relief should not be used on the antenna output port ground pads. The designermust pay close attention to the size of the pad and thickness of the dielectric beneath the signal pad andtrace. Most PCB manufacturers can adjust the trace width to maintain 50 ohms impedance if the tracesare identified and instructions are included on the FAB drawing. This service is typically provided at no orminimal additional cost.For minimum RF emissions due to the fundamental frequency of operation, the cellular module works bestwith an antenna load that has a VSWR of 1.5:1 or better. The antenna should not have gain at the harmonicfrequencies, otherwise, the conducted harmonics could get amplified to a point where the product nolonger passes type approval. However, for applications where antenna quality is less than ideal, it isrecommended to have a low pass filter (Pi structure with N=3) in the RF path to the antenna. This is asecondary plan should there be a need to lower harmonic levels at frequencies above the PCS band. The- 18 -
pad structure may also be used to match the antenna load impedance, if required. If it is not needed, acapacitor of low reactance may be used to bridge the Pi structure.The RF cable going between the cellular module and the antenna is very lossy, therefore, the length of thiscable should be kept as short a possible.4.1.1.4 VBAT InputThe HS 3001 Vbat input can have a relative high current draw that can fluctuate rapidly, especially whentransmitting at max power and burst mode. The Vbat interface must be designed to provide the requiredinstantaneous voltage and current with minimal voltage droop. This includes both sufficient bulkdecoupling capacitance as well as adequate layout provisions.When laying out the connections to the cellular module interface connector, it is tempting to use traces ofthe same width as the connector pins. However, this is a very compact connector and traces of that widthwill not have sufficient copper. Similar to the discussion on thermal relief, the use of narrow traces toconnect the Vbat pins to the source voltage can act like a high impedance and cause a significant voltagedroop when higher currents are required as shown in Figure 4.Figure: 11 - Example of Vbat Voltage Droop- 19 -
If the Vbat drops too low, the cellular modules will reset. To minimize the trace loss, it is suggested to usea larger trace that spans several pins as shown in Figure 5. Any concern about solderability can bemitigated by using solder mask with cutouts for the individual pins as shown by the blue lines in the figure.The layout should provide sufficient trace width over the entire trace from the Enable modules all the wayto the source of the Vbat voltage. Any transitions between layers for this trace should utilize multiple vias.Since even the best layout will have some impedance from the source to the cellular module, sufficientbulk decoupling capacitance is required at the Vbat input to the cellular module. It is suggested to use atleast two 1000 uF, low ESR, tantalum capacitors located very close to the cellular interface connector Vbatpins. Any thermal relief used on these capacitors should comply with the information given above in orderto provide the lowest impedance possible. The grounding of these capacitors is critical. Therefore, it shouldbe a low impedance and should utilize multiple vias to the internal ground plane close to the capacitor aswell.Figure: 12 - Example of GOOD Vbat layout4.1.2 Audio Reference DesignThe audio quality is very dependent on the circuit design and layout. As an aid to obtaining good audioquality, a reference design has been included below.- 20 -
4.1.2.1 Audio Schematics- 21 -
Figure: 13 - Audio Reference Design Schematic4.2 Control Connector Signal Descriptions And FunctionsUnless otherwise noted in the following sections, all digital signals will reference the followingspecifications:Parameter Parameter/Conditions Comments MIN TYP MAX UNITVIH High level Input voltage 1.17 1.83 VVIL Low level Input voltage -0.3 0.63 VVshys Schmitt hysteresis voltage 15 mVILInput leakage current VDDX = Max, VIN - 0 V to VDDM 200 nAVOH High level output voltage I out = I OH 1.35 1.8 VVOL Low leveloutput voltage I Out = I OL 0 0.45 VIOH High level output voltage 3 mAIOL Low level output voltage CMOS, at pin rated drive strength 3 mACIN Input Capacitance 5 pF- 22 -
4.2.1 Module Power (PINS 87, 89, 91, 93, 95, 97, 99)The HS 3001 module uses a single voltage source of VCC=+3.3V to 4.4V.VBAT Parameter/Conditions Min Typ Max UnitsMain Battery Supply Voltage In Regulation 3.3 4.4 VdcPeak Current 1000 µF on Host at Module Connector 550 mAWarning: The uplink burst will cause strong ripple on the voltage lines and should beeffectively filtered. It is recommended that 1000 µF of capacitance be placed as closeto the modem I/O connector as possible. It should be noted that the input voltagelevel should not drop below the minimum voltage rating under any circumstances,especially during the uplink burst period.4.2.2 Modem Power-on And Recovery TechniquesThe HS 3001 provides module integrators with improved modem power-on and recovery techniques, whilemaintaining backwards compatibility to Enabler IIIG integrations. The addition of an internal power switchand input power-on logic select pin, allows users the flexibility to maintain backwards compatibility orselect different power-on options. This internal power switch also allows integrators the flexibility of notsupplying an external power switch. Pin-37, previously a reset pin, has been replaced with a device powerON/OFF pin. This pin controls the internal power switch.Pin-85 (PSLOGIC) allows users to select the default behavior of the ON/OFF control (Pin-37). Once power isapplied via the internal power switch, Pin-35 (PHON) is used as like a phone on/off switch.4.2.3 Power Switch Logic Detect (Pin 85)Hardware input pin to determine the functionality of the ON/OFF pin (Pin-37). If Pin-85 is tied to VBAT,Modem ON/OFF (Pin-37) defaults to high when open circuit, and the modem power switch will be ON. IfPin-85 is left open, Modem ON/OFF (Pin-37) defaults to low when open circuit and the modem will be off(requires ON/OFF to be driven high to power on).- 23 -
Note: Externally connecting Pin-85 to ground is not recommended4.2.4 ON/OFF (PIN 37)Pin-37 is the ON/OFF control input for the modem's internal power switch. When it is high, the modem'spower switch will be ON. When it is low, the modem power will be OFF.Note that Pin-35 PHON (Power On) is a signal input and is the normal method forturning the modem ON or OFF. However, Pin 35 cannot turn the modem on if Pin 37is low, because the modem will not have power applied to it.Symbol Parameter Condition Min Typ Max UnitsVEN_TH Enable Threshold Voltage VIN - 1.75 to 4.5V, ID = -250uA 0.4 1.25 VIEN Enable Input Current VIN = VEN = 5.5V, ID = OPEN 2.5 4 uAPulldown approximately 1M ohm.- 24 -
NOTE: The modem may not completely shut down/reset even with a mechanicalpower switch or this circuit implemented if the modem’s I/O lines have anothersource of power that applies voltage to the modem.To alleviate this situation, make sure that the interface circuitry is set to tri-state oras an input. If this is not possible, additional hardware may be needed to shunt highimpedance lines to ground during these situations.The un-switched power source must be capable of supporting the inrush currentrequired by the bulk capacitance. The enable switch can be soft started via voltageramp or modulation to reduce the peak current as needed.DO NOT USE a Modem Power Switch as a routine shutdown or reset. This techniquefor shutting down the modem does not properly deregister the modem from thenetwork. The carrier may impose penalties if a fleet of equipment does not routinelyfollow a proper deregistration process. If integrators wish to use this methodroutinely, than a graceful detach from the network should be accomplished first. Thiscan be done by sending AT$OFF.4.2.5 Phone On - PHON (PIN 35)This input signals the modem to start and is equivalent to a “phone power button”.A falling-edge on this Active-Low input will switch-ON the module or switch-OFF the module. The firmwarecontrolled OFF function will deregister the modem from the network before shutting the modem OFF.This input has a “weak pull-up” resistor internal to the module. If users want the modem to automaticallycome on when power is applied, they can tie this line low.If RTC Sleep is required, then the PHON line must be floated to allow the internal resistor to pull the linehigh. (The RTC sleep function is not available in the initial firmware release.)Controlling the PHON signal must only be performed by an open collector/open drain device. If controllingthis signal from a microprocessor’s I/O pin, the PHON can be pulled low when the I/O is configured to bean output and floated high by reconfiguring the pin to be an input.Warning: The OFF Delay is controlled by the AT$OFFDLY command. A value of 0disables the PHON line from turning the module off. 0 is the default value.To enable the module to switch-OFF via PHON you must set AT$OFFDLY to a valueother than 0. The valid range is 100 to 1000 milliseconds.- 25 -
Parameter Parameter/Conditions Comments MIN TYP MAX UNITVIH High level Input voltage 1.17 1.83 VVIL Low level Input voltage -0.3 0.63 VVshys Schmitt hysteresis voltage 15 mVILInput leakage current VDDX = Max, VIN - 0 V to VDDM 200 nAVOH High level output voltage I out = I OH 1.35 1.8 VVOL Low leveloutput voltage I Out = I OL 0 0.45 VIOH High level output voltage 3 mAIOL Low level output voltage CMOS, at pin rated drive strength 3 mACIN Input Capacitance 5 pF4.2.6 Internal Power SwitchThe modem has an internal power switch that supplies the modem operating power when ON.Figure: 14 - Internal Power Switch4.2.7 Voltage Reference - VRIO_MSME1.8 (PIN 77)To be used as a voltage reference source ONLY. Do not connect current loads to this pin. This pin must bedecoupled to ground with at least a 0.1 µF capacitor at the output. Noise induced on this pin will affect theperformance of the baseband.- 26 -
4.2.8 USB (PINS 1, 3, 5, 7)5V Tolerant TransceiverUSB Parameter/Conditions Min Typ Max UnitsInput Voltage 4.4 4.65 5.25 VOutput voltage High (Driven) 2.8 3.3 3.6 VdcLow 0.0 0.1 0.3 VdcTransceiver D+/- Leakage Current -2 2 μA4.2.9 General Purpose Input/Output InterfaceGPIO number Pin numberGPIO 1 64GPIO 2 62GPIO 3 60GPIO 4 58GPIO 5 68GPIO 6 70GPIO 7 66GPIO 8 72Each general-purpose signal may be selected as inputs or outputs. The GPIOs can be used independently asa user-specified function.Digital I/O Specifications -Baseband FunctionsParameter Comments Min Typ Max UnitsVIH High level input voltage CMOS / Schmitt 1.17 1.83 VVIL low level input voltage CMOS / Schmitt -0.3 0.63 VVSHYS Schmitt hysteresis voltage 100 mVIIH Input high leakage current 1 2 No pull-down 1 uAIIL Input high leakage current 1 2 no pull-up -1 uAIIHPD Input high leakage current 1 with pull-down 3 30 uAIILPU Input high leakage current 2 with pull-up -30 -3 uAVOH High level votage CMOS, at pin rated drive strength 1.35 1.80 VVOL Low level votage CMOS, at pin rated drive strength 0 0.45 VIOZH 3 State leakage current 2 Logic high output 1 uAIOZL 3 State leakage current 2 Logic low output -1 uA- 27 -
IOZHPD 3 State leakage current 2 Logic high output with oull down 3 30 uAIOZLPU 3 State leakage current 2 Logic high output with pull-up -30 -3 uAIOZHKP 3 State leakage current 2 Logic high output with keeper -20 -3 uAIOZLKP 3 State leakage current 2 Logic high output with keeper 3 20 uACIN Input Capacitance 7 pF4.2.10 RTC SleepIn this mode, the modem is off except for its Real-Time-Clock. When put into this mode, the modem canwake itself up at a designated time/interval. See the HS 3001 AT command manual for details4.2.11 Serial Interfaces And Handshake (Pins 11, 13, 15, 21)The pin naming for TX/RX/RTS/CTS is referenced as a DTE .The DTE device should match their input pins tothe Enfora outputs and vice-versa. Additionally, there are AT commands that may need to be executed inorder to insure proper operation. See the chart below.9 way D Connector Pin Number Signal Signal Direction Enfora Pin Number Enfora AT Command2 Receive Data (RD) from DCE 153 Transmit Data (TD) from DTE 215 Signal Ground both7 Request To Send (RTS) from DTE 11 AT+IFC8 Clear To Send (CTS) from DCE 13 AT+IFCFactory Set Pin ConfigurationThe key features of the UART in the modem mode are as follows:l16C750 compatibilitylBaud rates: 300,600,1200,2400,4800,9600,19200,38400,57600,115200,230400lSupported data format:lData bit: 8 bitslParity bit: nonelStop bit: 1 bitlHardware flow control RTS/CTSThe HS 3001 module is designed to be used like a DTE device.Default settings are 8 data, 1 stop, no parity, and 115200. RTS and CTS may be used for hardwarehandshaking. The serial interface is 1.8V logic. By default, hardware handshaking (AT+IFC) is enabled. The- 28 -
module will be expecting the RTS line to be low before it will transmit data. If the integrator does not wishto use flow control, please see below for minimal serial implementations:For a minimal Serial implementation use one of the following two configurations:lConnect RxData (pin 15) and TxData (pin 21) to the COM port serial data lines.lRTS (pin 11) be pulled up through a 100K resistor if not used.lThe user must set AT+IFC=0,0 to disable flow control to communicate with the modem.lTie RTS (pin 11) to CTS (pin 13), on the modem to loopback the flow control signalsNotes:lTying RTS (pin 11) to ground to “spoof” flow control will cause the modem to draw more current.lIt is not recommended to leave RTS (pin 11) unconnected.4.2.12 Digital Audio Interface (PINS 12, 14, 16, 18)This port is only available in Master mode and to be used for PCM digital audio. Below are the settings forconfiguring its operation and the interface specification:4.2.12.1 Digital Audio ConfigurationThe default settings for the digital audio are:lMode = MasterlMCSI_CLK = 2.048MHzlWord Size = 16 BitslSync Pulse = 8KHzlFrame mode = burstlClock edge Sync = rising edgeThe following command is required to set the unit up in digital audio mode:AT$voicepth=2This configures the EIII module to use digital audio instead of analog audio.4.2.12.2 Digital Audio Data FormatThe 16 bit word is sent MSB first. Data received is also MSB first. No other data manipulation is donewithin the module.- 29 -
Pin Name Pin Number Signal Direction DescriptionPCM_RX 12 I Serial Data InputPCM_TX 18 O Serial Data OutputPCM_CLK 14 IO Serial Clock I/OPCM_FSYNC 16 IO Frame Synchronization I/O4.2.13 32 KHZ Output (PIN 56)A 32.768 kHz signal is available as an output from the module. This signal should only be used as an inputto a high impedance device. Additional loads or capacitance on the line may cause performance issueswith the module. If the line is not used, leave floating.Parameter Comments Min Typ Max UnitsOscillation frequency 32.765 KHzDuty Cycle 45 50 55 %JitterCycle to cycle 50 nsperiod 10 ns4.2.14 Analog-to-Digital Inputs (PIN 44 And 74)The monitoring ADC (MADC) consists of a successive approximation 10–bit analog–to–digital converter(ADC).HKADC SpecificationsParameter Min Typ Max Units CommentsResolution 12 Programmable to 8-bit or 10-bitDNL -1 +3 LSBINL -6 +6 LSB For V ref = VDD and 1.2 V (provided exter-nally through AIN0)Full scale error -25.6 +25.6 LSB ± *2.5% for V ref = VDD and 1.2 VOffset error -12 +12 LSB for V ref = VDD and 1.2 VNumber of inputchannels5Full scale inputrangeGND VDDA VInput resistance 1.5 KΩ S/H resistanceInput capac-itance12.4 pF S/H capacitor- 30 -
Sampling time 9.6 µsConversion Clock 0.6 2.4 MHz 1.2 and 4.8 MHz also software pro-grammableThroughput rate 40.98 87.56 KHzVDDA 2.0 2.1 2.2 V Analog power supplyVDD_MSM 1.62 1.8 1.98 V Digital power supplyVDD OperatingCurrent0.5 mAVDD_MSM Oper-ating current0.5 mAPowerdown cur-rent1.0 µA4.2.15 Handset Microphone Input (PINS 65, 67)Parameter Test Conditions Min Typ Max Units NotesFull scale input voltage voltage across either MIC 1P and MICiN, MIC2P and MIC2N 0.89 1.00 1.12 Vrms ± 1dB level errorInput impendence Difference input impedance 16 20 24 KΩInput impendence Single ended input impedance 8 10 12 KΩInput offset voltage 5 5 mVInput capacitance At each pin of all inputs 5 pF4.2.16 Handset Microphone BIASOutput (PIN 63)Parameter Comments Min Typ Max UnitsMIC bias output voltage 1.8 VMIC bias output current 1.5 mAMIC bias voltage accuracy Minimum load -3 +3 %MIC bias output voltage load regulation 30 ΩSupply currentActive State 50 100 uAIdle State 10 100 uA4.2.17 Handset Speaker Output (PINS 71, 73)Parameter Test Conditions Min Typ Max Units NotesDAC toEAROP/EARONfullscale outputf = 1.02 Hz, 0 dBFs 1.11 1.25 1.40 Vrms ± 1 dB level errorEAROP/EARON f = 498 Hz, 0 dBFs 38.5 48.8 61.3 mW 22 to 20 kHz- 31 -
output power,4% or less THD+NmeasurementBWOutput DC level,EAR1OP andEAR1ON withrespect to VSSInput = .999 dBFs 1.03 1.05 1.07 V4.2.18 Headset Microphone Input (PIN 55)Parameter Test Conditions Min Typ Max Units NotesFull scale input voltage voltage across oin 55 and ground 0.89 1.00 1.12 Vrms ± 1dB level errorInput impendence Single ended input impedance 8 10 12 KΩInput offset voltage 5 5 mVInput capacitance At each pin of all inputs 5 pF4.2.19 Headset Speaker Output Left And Right (PINS 57, 59)Parameter Test Conditions Min Typ Max Units NotesBoth modes - HPH_LP and HPH_RN configured single ended, analog volume control = 0 dBDAC to HPH_LP and HPH_RNfullscale outputf = 1.02 kHz, 0 bDFS 0.531 0.595 0.668 VrmsOutput DC level, HPH_LP andHRH_RN wih respect to VSSInput = 0.999 dBFs 1.03 1.05 1.07 VOutput impedence 0.5 ΩVoice Mode - HPH_LP and / or HPH_RN configured single ended, analog volume control =0 dBHPH_LP and HPH_RN outputpower, 4% or less THD+Nf = 1.02 kHz, 0 bDFS 17.6 22.1 27.9 mW 22 to 20 kHzmeasurementbandwidthDAC to HPH_LP and HPH_RNoutput noise levelInput = 0.999 dBFs, Fs = 8 kHz or 16kHz, A-weighted106 uVrmsBoth modes - HPH_LP and HPH_RN configureddifferential (HPH_LP/HPH_RN), analog volume control = 0 dBDAC to HPH_LP and HPH_RNfullscale outputf = 1.02 kHz, 0 dBFS, 32Ω load 1.06 1.19 1.34 VrmsDAC to HPH_LP/HPH_RN gainerror relative to gain @ -3 dBFSf = 1.02 kHz, -60 dBFS -1.2 1.2 dB Linearty spotcheckOutput DC level, HPH_P andHPH_N with respect to VSSInput = .999 dBFs 1.03 1.05 1.07 VOutput impedence 1.0 ΩVoice Mode - HPH_LP and / or HPH_RN configured differential (HPH_LP/HPH_RN), analog volume control =0 dBHPH_LP/HPH_RN outputpower, 4% or less THD+Nf = 498 Hz, -3 dBFS, 32Ω 17.6 22.1 27.9 mW 22 to 20 kHzmeasurementbandwidthDAC to HPH_LP/HPH_RN out- Input = 0.999 dBFS, Fs = 8 kHz, A- 212 uVrms 22 to 20 kHz- 32 -
put noise level weighted measurementbandwidth4.2.20 Headset Detect (PIN 47)Parameter Parameter/Conditions Comments MIN TYP MAX UNITVIH High level Input voltage 1.17 1.83 VVIL Low level Input voltage -0.3 0.63 VVshys Schmitt hysteresis voltage 15 mVILInput leakage current VDDX = Max, VIN - 0 V to VDDM 200 nAVOH High level output voltage I out = I OH 1.35 1.8 VVOL Low leveloutput voltage I Out = I OL 0 0.45 VIOH High level output voltage 3 mAIOL Low level output voltage CMOS, at pin rated drive strength 3 mACIN Input Capacitance 5 pF4.3 Circuit ProtectionOther than very low level ESD protection within the module’s integrated circuits, the module does not haveany protection against ESD events or other excursions that exceed the specified operating parameters.Generally, ESD protection (typically TVS/Transzorb devices) should be added to all signals that leave thehost board. This includes VBAT/VCC.Series resistors (typically 47 ohm) can also be added in series with data lines to limit the peak currentduring a voltage excursion.Warning: It is the Integrator’s responsibility to protect the Enabler module fromelectrical disturbances and excursions, which exceed the specified operatingparameters.- 33 -

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