OPENBRAIN Technologies M5G BLUETOOTH MODULE User Manual M5G

OPENBRAIN Technologies Co., Ltd. BLUETOOTH MODULE M5G

Users Manual

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Date Submitted2010-03-01 00:00:00
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Creation Date2010-02-26 18:45:43
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Customer :
SBNTECH
Ref. No
Rev. No
Issued Date :
APS-2009-012
1.1
2009.5.23
Approval Sheet
for Product Specification
Product Name : Bluetooth Module
Model No.
: M5G
Customer Approval
Signature / Stamp
TEL : +82-31-596-6400 FAX : +82-31-596-6410
E-mail : obt@openbrain.co.kr
http://www.OPENBRAIN.co.kr
http://www.sonorix.com
OPENBRAIN Technologies Co., LTD.
OPENBRAIN Technologies Co., LTD.
Change History
Rev.
Date
Author
Reason for Change
0.9
2008.5.26
S.H.Cho
Preliminary Drafting
1.0
2008.6.18
S.H.Cho
Antennae characteristics and reliability test data supplements
1.1
2009.5.23
Y.Y.Lim
Change the Connector (SMD > DIP)
Internal Check/Approval
Author
Checked by
Approved by
Name
Y.Y.Lim
J.H.Park
J.D.Oh
Date
2009.5.23
Signature
OPENBRAIN Technologies Co., LTD.
Contents
1. SUMMARY ................................................................................................................................................ 4
1.1.
1.2.
1.3.
1.4.
1.5.
PRODUCT SUMMARY .................................................................................................................................... 4
PRODUCT FEATURES .................................................................................................................................... 4
SPECIFICATIONS .......................................................................................................................................... 4
APPLICATION ............................................................................................................................................... 5
EXTERNAL APPEARANCE AND PIN (PAD) SPECIFICATIONS ................................................................................. 5
2. HOW TO USE............................................................................................................................................ 7
2.1.
2.2.
HARDWARE DESIGN METHODOLOGY .............................................................................................................. 7
OPERATING PROCEDURES ............................................................................................................................ 7
3. PRODUCT SPECIFICATIONS .................................................................................................................. 8
3.1.
3.2.
3.3.
3.4.
ELECTRICAL SPECIFICATIONS ........................................................................................................................ 8
CURRENT CONSUMPTION ............................................................................................................................. 9
ANTENNAE RADIATION CHARACTERISTICS .................................................................................................... 10
MECHANICAL SPECIFICATIONS ..................................................................................................................... 13
4. PRECAUTIONS DURING HANDLING ................................................................................................... 14
4.1.
4.2.
GENERAL PRECAUTIONS ............................................................................................................................. 14
MAXIMIZING RF PERFORMANCE .................................................................................................................. 14
5. RELIABILITY TEST RESULT ................................................................................................................. 15
5.1.
5.2.
5.3.
OPERATING AND STORAGE TEMPERATURE TEST RESULTS................................................................................ 15
TIME VS TEMPERATURE FOR OPERATING & STORAGE RELATIVE GRAPH.......................................................... 15
RADIO CHARACTERISTICS FOR EACH CHECK POINT ...................................................................................... 16
6. PACKAGING ........................................................................................................................................... 20
7. PRODUCT SETTING (CUSTOMIZATION) ............................................................................................. 21
8. FCC Information …………………………………………………………………………………………….. 22
OPENBRAIN Technologies Co., LTD.
1. Summary
This document defines the product specifications of Bluetooth voice communication module (M5G)
including electrical and mechanical characteristics manufactured by OPENBRAIN for customer approval
purposes.
1.1. Product Summary
OPENBRAIN’s M5G is a compact Bluetooth
module designed to provide easy Bluetooth audio
application
for
communication
devices
without
Bluetooth functionality. By integrating the module
into
communication
devices
that
use
speaker/microphone or wired ear-sets, it enables the
communication device to be used with Bluetooth
headsets within a range of 10m distance.
M5G integrates all the functions needed to
replace existing audio connection wirelessly and has
been designed such that it is possible to control and
monitor the functions externally via serial (UART)
communication
thereby
enabling
Bluetooth
functionality to be implemented into devices in a
short period of time. Also, the module has been designed to be ultra-small and light with minimal power
consumption thereby making it ideal for integration without sacrificing electrical and mechanical design
factors of existing devices. The advantages of using M5G are, it makes production easy and simple as
the modules are RF tuned and tested before supply and it is not necessary for customers to secure
additional Bluetooth test/measuring equipments.
1.2. Product Features
„
Wireless application possible without having to change circuit or software of existing
communication devices
„
Built-in antennae eliminates the need for separate antennae
„
Control of all functions and state monitoring via UART communication
„
Can be customized according to customer requirements
1.3. Specifications
„
Bluetooth V2.0, 1.2, 1.1 compatible
„
Frequency Band : 2,400 ~ 2,483 MHz
„
Embedded Protocol : L2CAP, RFCOMM, SDP
OPENBRAIN Technologies Co., LTD.
„
Embedded Profile : Handsfree AG
„
Output Power: 0dBm (Power Class 2)
„
Receiver Sensitivity : < -80dBm
„
Max. Data Rate : 702kbps
„
Antennae Gain: 0dBi Max.
„
Voice Signal Interface: Analog Single Ended or Differential
„
Host Interface: UART (1.8V Level, 115,200bps).
„
Operating Voltage: 3.3V
„
Operating Temp: -25 ~ +85℃
„
Size: 22.0mm X 36.0mm X 8.4mm
1.4. Application
„
Mobile phones, Video phones, VoIP phones
„
Other Voice Communication Devices
1.5. External Appearance and Pin (Pad) Specifications
Mechanical Layout
(unit: mm)
Top View
22.0 ± 0.3
Antenna
36.0 ± 0.3
Bluetooth Chip
Connector
1.4
2 4 6 . .
1 3 5 . .
1.2
2.0
4.0
* For mechanical part details, refer to 3.4
18
17
1. VDD
2. RESETB
3. GND
4. GND
5. UART_TX
6. UART_RX
7. PCM_OUT
8. PCM_SYNC
9. PCM_IN
10. PCM_CLK
11. MIC+
12. MIC13. SPK+
14. SPK15. SPI_MISO
16. SPI_CSB
17. SPI_MOSI
18. SPI_CLK
OPENBRAIN Technologies Co., LTD.
Pin Description
Pin No
Name
Description
VDD
Positive supply (3.0V~4.2V)
RESETB
Reset if low. Input debounced so must be low for > 5ms to cause a
reset
GND
Ground
GND
Ground
UART_TX
UART data output
UART_RX
UART data input
PCM_OUT
PCM Synchronous data out
PCM_SYNC
PCM Synchronous data sync
PCM_IN
PCM Synchronous data in
10
PCM_CLK
PCM Synchronous data clock
11
MIC+
Microphone differential, Input P
12
MIC-
Microphone differential, Input N
13
SPK+
Speaker differential output P
or single ended output
14
SPK-
Speaker differential output N
or single ended output
15
SPI_MISO
Serial Peripheral interface data output
16
SPI_CSB
Chip select for synchronous serial peripheral interface
17
SPI_MOSI
Serial Peripheral interface data input
18
SPI_CLK
Serial Peripheral interface clock
OPENBRAIN Technologies Co., LTD.
2.
How to Use
2.1. Hardware Design Methodology
To use M5G module with existing communication devices, connect Host Processor with RESETB
and UART transceiver port as shown and connect SP+, SP-, MIC+ and MIC- to analog audio input/output
port of Audio Codec via Differential Mode. To connect audio input/output as Single Ended Mode, use any
one of the two terminals or use dedicated audio Amp to change the mode. But Differential Mode is
strongly recommended as it has the effect of improving S/N ratio. In case Single Ended Mode has to be
used, it is recommended that dedicated Amp be used.
+3.3V
M5G Bluetooth
Audio Module
VDD
RESETB
UART
SP
MIC
GND
Host Processor
5,6
13,14
Audio Codec &
Amplifier
11,12
3,4
2.2. Operating Procedures
The operating procedures for M5G module are as follows: Details on operating procedures and
UART communication protocol are defined in a separate document.
„
Pairing Mode: Searches for Bluetooth devices in the vicinity that support Handsfree and
Headset profiles and allows user to connect with a specific selected device.
„
Paging Mode: Connection attempt with paired device. If pairing information of multiple devices
are present, paging will start with the latest device that has been connected.
„
Connected Mode: Bluetooth link established with paged device.
„
Incoming Call: The state wherein bell rings when call is coming in.
„
Outgoing Call: The state wherein user makes a call.
„
Talk Mode: The state where user is talking with other party.
OPENBRAIN Technologies Co., LTD.
3. Product Specifications
3.1. Electrical Specifications
Absolute Maximum Ratings
Symbol
VDD
Parameter
Min
Max
Unit
Power Input Voltage (Pin 1)
-0.4
+5.6
VSS-0.4
VDD+0.4
dBm
+120
℃
V+, V-
Port Input Voltage
PinRF
RF Input Power
Ts
Storage Temp.
„
-35
Be careful not to expose the product to voltages and signals beyond rated values indicated
above as this may cause damage.
Recommended Operating Conditions
Symbol
VDD
To
Parameter
Min
Typ
Max
Unit
Power Input Voltage (Pin 1)
2.2
3.3
4.2
Operating Temp.
-25
+25
+85
℃
RF Characteristics
Symbol
PoutRF
MODF1avg
Parameter
Condition
Min
Typ
Max
Unit
+2
+4
dBm
Data = 00001111
140
164
175
kHz
Data = 10101010
115
150
0.8
0.97
Transmit Output Power
Modulation Characteristics
MOFF2max
F2avg/F1avg
20dB BW
RXsense
PinRF
IMP
Receive Sensitivity
BER < 0.001
Maximum Input Level
Inter-Modulation Performance
F1 = +3MHz
kHz
940
1000
kHz
-83
-79
dBm
-20
-10
dBm
-39
-15
dBm
-10
dBm
-27
-15
dBm
F2 = +6MHz
PinRF = -64dBm
OOB
Out Of Band Blocking
PinRF = -10dBm
Performance
30MHz ~ 2GHz
3GHz ~ 12.75GHz
PinRF = -27dBm
2000MHz ~ 2399MHz
2498MHz ~ 3000MHz
* Measured Temperature : +25℃, Measured Voltage : 3.3V
OPENBRAIN Technologies Co., LTD.
Audio Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Vain_max
Input Full Scale at Maximum Gain
mVrms
Vain_min
Input Full Scale at Minimum Gain
350
mVrms
BWain
Bandwidth of Microphone Amplifier
20
kHz
IMPmic
Mic Mode Input Impedance
20
kohm
Input Mode Input Impedance
130
ohm
Vsp_out
Output Voltage Full Scale Swing(Differential)
2.0
Vp-p
Isp_out
Output Current Drive (at Full Scale Swing)
BWaout
Output -3dB Bandwidth
Lres
Allowed Load: Resistive
Lcap
Allowed Load: Capacitive
IMPin
10
20
40
18.5
mA
kHz
Open
ohm
500
pF
3.2. Current Consumption
Operating Mode
Connection Type
UART Rate(kbps)
Average
Unit
Page Scan
115.2
0.49
mA
Inquiry and Page Scan
115.2
0.83
mA
ACL 1.28s sniff
Master
38.4
0.37
mA
SCO HV1
Master/Slave
38.4
41
mA
SCO HV3
Master/Slave
38.4
21~26
mA
Standby Host Connection
38.4
76
uA
Reset(RESETB low)
58
uA
* Operating Temp: +25℃, Measurement point: 1.8V VDD input terminal
OPENBRAIN Technologies Co., LTD.
3.3. Antennae Radiation Characteristics
Antennae Radiation Coordinates
θ
φ
Radiation gain(E-Field, dBi)
Freq
(GHz)
2.400
2.450
2.500
XY
Peak
-0.96
-1.71
-1.12
XZ
Average
-4.01
-4.67
-4.28
Peak
-1.11
-1.53
-1.18
YZ
Average
-4.54
-5.12
-4.55
10
Peak
-6.31
-7.27
-7.64
Average
-10.45
-11.21
-11.72
Total Gain
Peak
Average
-0.96
-5.67
-1.53
-5.23
-1.12
-5.62
OPENBRAIN Technologies Co., LTD.
Radiation Pattern - Azimuth XY (E-Field, Standalone Module)
11
OPENBRAIN Technologies Co., LTD.
Radiation Pattern - Azimuth XY (E-Field, Module Mounted onto Product)
12
OPENBRAIN Technologies Co., LTD.
3.4. Mechanical Specifications
Mechanical Dimension
(Unit: mm)
22.0 ± 0.3
7.5
Antenna
36.0 ± 0.3
Bluetooth Chip
Connector
2.0
3.0
2 4 6 . .
1 3 5 . .
18
17
1.4
1.2
2.0
1. VDD
2. RESETB
3. GND
4. GND
5. UART_TX
6. UART_RX
7. PCM_OUT
8. PCM_SYNC
9. PCM_IN
10. PCM_CLK
11. MIC+
12. MIC13. SPK+
14. SPK15. SPI_MISO
16. SPI_CSB
17. SPI_MOSI
18. SPI_CLK
4.0
3.0
2.0
13
OPENBRAIN Technologies Co., LTD.
4. Precautions during handling
4.1. General precautions
Precautions for handling M5G modules are as follows:
„
Do not expose the modules to static electricity as it may cause damage.
„
Use power source that will provide enough current to power input terminal of module.
„
Use only rated voltage or RF signals.
4.2. Maximizing RF Performance
To maximize RF performance of products that use M5G module, PCB has to be designed taking
into the consideration the following:
„
Sufficient Ground area has to be secured on Main PCB for stable RF performance.
„
Objects (conductors, insulators) close to antennae will interfere radiation and distort radiation
pattern. For conductors, they should be at least 10mm away from antennae and for insulators
such as plastic parts, at least 5mm away.
„
Main PCB must be designed such that the ground of Main PCB does not intrude into ground
of module and antennae boundary lines as shown in the diagram below.
How to mount module onto Main PCB
Remove Ground of PCB
Boundary of Main PCB
Ground surface of Main PCB
14
Remove Ground of PCB
OPENBRAIN Technologies Co., LTD.
5. Reliability Test Result
5.1. Operating and storage temperature test results
„
M5G module stored in temperature and moisture resistant chamber for 2 hours from -35 ~
+120℃
Operating Temp.
Result
Storage Temp.
Result
+85℃
Normal
+120℃
Normal
+20℃
Normal
-25℃
Normal
Normal
-35℃
5.2. Time Vs Temperature for Operating & Storage Relative Graph
15
Normal
OPENBRAIN Technologies Co., LTD.
5.3. Radio Characteristics for Each Check Point
„
Measurement results and Bluetooth specification compliance of modules stored in
temperature and moisture resistant chamber for 2 hours at -25℃
RF Operating Check 1(-25℃)
Result
Bluetooth
(dBm)
Spec.(dBm)
Output Power
+2.65
-6 to +4
Pass
Sensitivity at 0.1% BER for all packet types
-86
≤-70
Pass
Verdict
Modulation
Channel
df1_avg
df2_avg
df2/df1
Bluetooth
(kHz)
(kHz)
(%)
Spec.
164.6
158.7
96.42
140
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