Omron 6CYSIDV6800208 ReaderWriter/ RFID System User Manual Z279 E1 01

Omron Corporation ReaderWriter/ RFID System Z279 E1 01

User Manual 3

149RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceID タ グ取 り 付け時の注意事項V680-D1KP52MTDifferences in Surrounding Metals (Reference)Communications distances are affected by the type of metal in back of or surrounding the Tag, asshown in the following table.Mutual Interference with Tags (Reference)Provide the mounting distances indicated below to prevent malfunctions due to mutual interferencewhen using more than one Tag.鉄SUS 黄銅 アルミ ニウム形V680-D1KP52MT 100% 85～90% 80～85% 80～85%注. 周囲/背面金属が鉄の場合を100% と し ています。25mm min. 25mm min.
150Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistanceV680-D1KP66MTEffect of Metal behind Tags (Reference)The V680-D1KP66MT can be surface-mounted or it can be embedded in metal. If it is embedded inmetal, the height of the metal casing must not exceed that of the Tag.Mutual Interference with Tags (Reference)Provide the mounting distances indicated below to prevent malfunctions due to mutual interferencewhen using more than one Tag.ID Tag3.5mm min.MetalEmbeddedID TagMetalSurface-mounted金属ID タ グxx• V680-HS52 &V680-D1KP66MT10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS63 &V680-D1KP66MT10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS65 &V680-D1KP66MT10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%60100mm min. 100mm min.
151RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceV680-D2KF52MDifferences in Surrounding Metals (Reference)Communications distances are affected by the type of metal in back of or surrounding the Tag, asshown in the following table.The values for steel are set to 100%Mutual Interference with Tags (Reference)Provide the mounting distances indicated below to prevent malfunctions due to mutual interferencewhen using more than one Tag.Steel SUS Brass AluminumV680-D2KF52M 100% 80% to 85% 80% to 85% 75% to 80%25mm min. 25mm min.
152Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistanceV680-D2KF67MEffect of Surrounding Metals (Reference)The V680-D2KF67M can be surface-mounted or it can be embedded in metal. If it is embedded inmetal, the height of the metal casing must not exceed that of the Tag.Mutual Interference with Tag (Reference)To prevent malfunctioning due to mutual interference when using more than one Tag,leave sufficient space between them as shown in the following diagram.ID Tag4.5mm min.MetalEmbeddedID TagMetalSurface-mounted• V680-HS52 &V680-D2KF67M10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS63 & V680-D2KF67M10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS65 & V680-D2KF67M10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%ID Tag XX120mm min. 120mm min.
153RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceV680-D1KP66TEffect of Metal behind Tags (Reference)The V680-D1KP66T communications distance is reduced if there is any metal material behind the Tag. If the Tag is to be mounted to metal, then either use a V600-A86 Attachment (sold separately) or inserta non-metal spacer (such as plastic or resin). The relationship between the distance from the Tag tothe metal surface and the communications distance is shown below.The Attachment is 10 mm thick, and more than one Attachment can be stacked.Mutual Interference with Tag (Reference)To prevent malfunctioning due to mutual interference when using more than one Tag, leave sufficientspace between them as shown in the following diagram.M3 countersunk screwV600-A86 Attachment InstallationInstall so that the mounting holes are aligned.• V680-HS52 &V680-D1KP66T10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%ID TagMetal on backAntennaCommunica-tionsdistanceYXMetal• V680-HS63 &V680-D1KP66T10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS65 &V680-D1KP66T10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%Antenna ID TagMetal on backMetalYXCommunica-tionsdistanceAntenna ID TagMetal on backMetal YXCommunica-tionsdistance100mm min. 100mm min.
154Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistanceV680-D1KP66T-SPEffect of Metal behind Tags (Reference)Mounting ID Tags to metal workpieces or palettes will affect the communications capabilities. Place non-metal-lic parts (e.g., plastic or resin) between the metallic parts by referring to the following relationship between thedistance between the ID Tag and the metallic body versus the communications distance.• V680-HS52 &V680-D1KP66T-SP10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS63 &V680-D1KP66T-SP10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS65 &V680-D1KP66T-SP10 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%ID TagMetal on backAntennaYXMetalCommunica-tionsdistanceAntenna ID TagMetal on backMetal YXCommunica-tionsdistanceYXCommunica-tionsdistanceMetalAntenna ID TagMetal on back
155RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceMutual Interference with Tag (Reference)To prevent malfunctioning due to mutual interference when using more than one Tag, leave sufficientspace between them as shown in the following diagram.100mm min. 100mm min.100mm min. 100mm min.
156Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistanceV680-D2KF67Effect of Metal behind Tags (Reference)The V680-D2KF67 communications distance is reduced if there is any metal material behind the Tag.Mutual Interference with Tag (Reference)To prevent malfunctioning due to mutual interference when using more than one Tag, leave sufficientspace between them as shown in the following diagram.• V680-HS52 &V680-D2KF6710 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS63 &V680-D2KF6710 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%• V680-HS65 &V680-D2KF6710 20 30 40 50 (mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%ID TagMetal on backAntennaCommunica-tionsdistanceYXID TagMetal on backAntennaCommunica-tionsdistanceYXID TagMetal on backAntennaCommunica-tionsdistanceYXMetal200mm min. 200mm min.
157RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceV680-D8KF68/-D32KF68Effect of Metal behind Tags (Reference)The transmission distance will be reduced if there is metal in back ofa Tag. When mounting on a metal surface, use the specialAttachment (V680-A81) of another sales or insert a non-metallicspacer (e.g., plastic, wood, etc.).The following diagrams show the relationship between the distancebetween a Tag and metal surface and the transmission distance. TheAttachment is 10 mm thick.• Special Attachment (V680-A81) Installation DirectionM4 screwSpring washerFlat washer• V680-HS63 &V680-D8KF68/-D32KF6810 20 30 40(mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%AntennaWhen Attachment (V680-A81) is not usedWhen Attachment (V680-A81) is usedAtachmentMetal on backMetal Communica-tionsdistanceYXID Tag• V680-HS63 &V680-D8KF68/-D32KF6810 20 30 40(mm)05070Distance to metal (x)604030201090(%)10080The communications distance withoutmetal is 100%When Attachment (V680-A81) is not usedWhen Attachment (V680-A81) is usedAtachmentAntennaMetal Metal on backYXCommunica-tionsdistanceID Tag
158Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistanceMutual Interference with Tags (Reference)To prevent malfunctioning due to mutual interference when using more than one Tag, leave sufficientspace between them as shown in the following diagram.When V680-HS63, V680-HS52 are UsedWhen V680-HS65 is Used120mm min. 120mm min.120mm min. 120mm min.150mm min. 150mm min.150mm min. 150mm min.
159RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistanceInfuence of Angle (Refernce)Install Antennas and Tags as close to parallel to each other as possible. Communications are possibleeven when an Antenna and a Tag are mounted at an angle, but the communications distance will beshortened. The relation between the angle and the communications distance is shown below.Percentage Drop in Communications Distance According to Angle of V680-D1KP52MT Tag angle (θ°)010 20 30 40V680-HS51 and V680-D1KP52MT 0% -1% -5% -10% -15%V680-HS51 and V680-D1KP52MT(Metal: Steel) 0% 0% 0% -4% -28%V680-HS52 and V680-D1KP52MT 0% 0% 0% -2% -6%V680-HS52 and V680-D1KP52MT(Metal: Steel) 0% -6% -13% -25% -V680-HS63 and V680-D1KP52MT 0% -2% -5% -9% -14%-: The measurement is no possible because the Tag comes in contact with the Antenna.• V680-HS51 & V680-D1KP52MT • V680-HS51 & V680-D1KP52MT(Metal: Steel)• V680-HS52 & V680-D1KP52MT • V680-HS52 & V680-D1KP52MT(Metal: Steel)●形V680-HS63 & 形V680-D1KP52MTAntenna Nuts ID TagSteelToothed washer Non-metallic materialθAntenna Nuts ID TagSteelToothed washer θSteelAntennaID TagθNon-metallic materialAntennaID TagSteelθAntennaID TagθNon-metallic materialSteel
160Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D1KP66T Tag angle (θ°)010 20 30 40V680-HS52 and V680-D1KP66T 0% -1% -2% -4% -7%V680-HS63 and V680-D1KP66T 0% -2% -3% -5% -9%V680-HS65 and V680-D1KP66T 0% -1% -3% -6% -11%• V680-HS52 & V680-D1KP66T • V680-HS63 & V680-D1KP66T• V680-HS65 & V680-D1KP66TAntenna ID TagθAntennaID TagNon-metallic materialθMetalAntennaID Tagθ
161RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D1KP66MT Tag angle (θ°)010 20 30 40V680-HS52 and V680-D1KP66MT(Metal: Steel) 0% -1% -2% -5% -9%V680-HS63 and V680-D1KP66MT(Metal: Steel) 0% -1% -4% -7% -13%V680-HS65 and V680-D1KP66MT(Metal: Steel) 0% -1% -6% -15% --: The measurement is no possible because the Tag comes in contact with the Antenna.• V680-HS52 & V680-D1KP66MT(Metal: Steel)• V680-HS63 & V680-D1KP66MT(Metal: Steel)• V680-HS65 & V680-D1KP66MT(Metal: Steel)ID TagθAntennaAntennaID TagNon-metallic materialθAntennaID TagθMetal
162Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D1KP66T-SP Tag angle (θ°)010 20 30 40V680-HS52 and V680-D1KP66T-SP 0% -1% -2% -4% -7%V680-HS63 and V680-D1KP66T-SP 0% -2% -3% -5% -9%V680-HS65 and V680-D1KP66T-SP 0% -1% -3% -6% -11%• V680-HS52 & V680-D1KP66T-SP • V680-HS63 & V680-D1KP66T-SP• V680-HS65 & V680-D1KP66T-SPID TagθAntennaAntennaID TagNon-metallic materialθAntennaID TagθMetal
163RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D2KF52M Tag angle (θ°)010 20 30 40V680-HS51 and V680-D2KF52M 0% -2% -6% -12% -22%V680-HS51 and V680-D2KF52M(Metal: Steel) 0% 0% 0% -7% -30%V680-HS52 and V680-D2KF52M 0% 0% 0% -2% -5%V680-HS52 and V680-D2KF52M(Metal: Steel) 0% -2% -7% - -V680-HS63 and V680-D2KF52M 0% 0% -1% -4% -9%-: The measurement is no possible because the Tag comes in contact with the Antenna.• V680-HS51 & V680-D2KF52M • V680-HS51 & V680-D2KF52M(Metal: Steel)• V680-HS52 & V680-D2KF52M • V680-HS52 & V680-D2KF52M(Metal: Steel)• V680-HS63 & V680-D2KF52MID TagθAntennaNutsSteelToothed washer Non-metallic materialID TagθAntennaNutsSteelToothed washer Non-metallic materialID TagθAntenna Non-metallicmaterialID TagAntenna SteelθID TagθNon-metallic materialAntennaSteel
164Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D2KF67 Tag angle (θ°)010 20 30 40V680-HS52 and V680-D2KF67 0% -0% 0% -1% -2%V680-HS63 and V680-D2KF67 0% -1% -2% -3% -6%V680-HS65 and V680-D2KF67 0% -1% -3% -7% -11%• V680-HS52 & V680-D2KF67 • V680-HS63 & V680-D2KF67• V680-HS65 & V680-D2KF67ID TagθAntennaAntennaID TagNon-metallic materialθID TagθMetalAntenna
165RFID SystemUser's ManualSection 7 Reference DataSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D2KF67M Tag angle (θ°)010 20 30 40V680-HS52 and V680-D2FKP67M(Metal: Steel) 0% -1% -2% -4% -6%V680-HS63 and V680-D2FKP67M(Metal: Steel) 0% -2% -5% -8% -14%V680-HS65 and V680-D2FKP67M(Metal: Steel) 0% -2% -7% -16% -31%• V680-HS52 & V680-D2KF67M(Metal: Steel)• V680-HS63 & V680-D2KF67M(Metal: Steel)• V680-HS65 & V680-D2KF67M(Metal: Steel)ID TagθAntennaAntennaID TagNon-metallic materialθID TagθMetalAntenna
166Section 7 Reference DataRFID SystemUser's ManualSection 7Chemical ResistancePercentage Drop in Communications Distance According to Angle of V680-D8KF68, V680-D32KF68 Tag angle (θ°)010 20 30 40V680-HS63 and V680-D8KF68 or V680-D32KF68(Horizontal-facing ID Tag) 0% 0% 0% 0% 0%V680-HS63 and V680-D8KF68 or V680-D32KF68(Vertical-facing ID Tag) 0% -1% -2% -3% -5%V680-HS65 and V680-D8KF68 or V680-D32KF68(Horizontal-facing ID Tag) 0% -1% -2% -4% -6%V680-HS65 and V680-D8KF68 or V680-D32KF68(Vertical-facing ID Tag) 0% -1% -3% -6% -10%• V680-HS63 & V680-D8KF68 or V680-D32KF68(Horizontal-facing ID Tag)• V680-HS63 & V680-D8KF68 or V680-D32KF68(Vertical-facing ID Tag)• V680-HS65 & V680-D8KF68 or V680-D32KF68(Horizontal-facing ID Tag)• V680-HS65 & V680-D8KF68 or V680-D32KF68(Horizontal-facing ID Tag)ID TagθMetalAntennaID TagθMetalAntennaID TagθMetalAntennaID TagθMetalAntenna
167RFID SystemUser's ManualSection 7 ID Tag MemorySection 7Chemical ResistanceID Tag MemoryV680-D1KP□□V680-D2KF□□V680-D8KF□□V680-D32KF□□メ モ リ へのア ク セスは16 ビ ッ ト 単位(2バイ ト 単位)に行われます。 ただ し、 1バイ ト ラ イ ト モー ド 指定の場合は、 8ビ ッ ト 単位(1バイ ト単位)となります。Address Data0000Hex0001Hex0002Hex0003Hex User area03E6Hex03E7Hex：：1 byteEEPROM is used as memory in the Tags.The memory capacity available to the user is 1,000 bytes,including 0000H to 0003H (the Write Protection Setting Area).Address Data0000Hex0001Hex0002Hex0003Hex User area07CEHex07CFHex：：1 byteFRAM is used as memory in the Tags.The memory capacity available to the user is 1,000 bytes,including 0000H to 0003H (the Write Protection Setting Area)Address Data0000Hex0001Hex0002Hex0003Hex User area1FFEHe1FFFHe：：1 byteFRAM is used as memory in the Tags.The memory capacity available to the user is 8,192 bytes,including 0000H to 0003H (the Write Protection Setting Area)Address Data0000Hex0001Hex0002Hex0003Hex User area7FFEHe7FFFHe：：1 byteFRAM is used as memory in the Tags.The memory capacity available to the user is 32,744 bytes,including 0000H to 0003H (the Write Protection Setting Area)
168Section 7 ID Tag Memory Capacities and Memory Types (V680 Series)RFID SystemUser's ManualSection 7Chemical ResistanceID Tag Memory Capacities and Memory Types (V680 Series)(As of December 2007)Model Memory capacity (user memory) Memory type Life expectancyV680-D1KP52MT1,000 bytes EEPROMOverwrite operations: 100,000 times for each address at 25°CData retention: 10 years (up to 85°C)V680-D1KP66TV680-D1KP66MTV680-D1KP66T-SPV680-D2KF52M2,000 bytesFRAMNumber of accesses: 10 billion timesData retention: 10 years (up to 55°C)V680-D2KF67V680-D2KF67MV680-D8KF68 8,192 bytesV680-D32KF68 32,744 bytes
173RFID SystemUser's ManualSection 7 Chemical Resistance of the Antennas, and TagsSection 7Chemical ResistanceChemical Resistance of the Antennas, and TagsChemical Resistance of the AntennasApplicable ModelsABS resin is used for case material and epoxy resin for filling material. Refer to the following lists and do notuse chemicals that affect ABS and epoxy resin.Chemicals That Cause Deformations, Cracks, Etc.Chemicals That May Cause Discoloration, Swelling, Etc.Chemicals That Do Not Affect PPS Resin or Epoxy ResinNote: The above results are from tests conducted a room temperature (23°C). Even if the chemicalsdo not affect the ABS or epoxy resins at room temperature, they may affect the resins at higher orlower temperatures. Check the chemicals carefully in advance.V680-HS51 V680-HS52-W/R V680-HS63-W/R V680-HS65-W/RABS resin Epoxy resinTrichlene, acetone, xylene, toluene, gasoline, creosol, methylene chloride, phenol, cyclohexane, aqua regia, chromic acid, sulfuric acid (90% RT), methyl ethyl ketone, aniline, nitrobenzine, monochlorobenzine, pyridine, nitric acid (60% RT), formic acid (80% RT)Aqua regia, chromic acid, sulfuric acid (90% RT), nitric acid (60% RT), ammonia solution, acetone, methylene chloride, phenolABS resin Epoxy resinHydrochloric acid, alcohol, Freon, sodium hydroxide, hydrogen peroxide, benzine, sulfuric acid (10% RT), nitric acid (10% RT), phosphoric acid (85% RT), ammonia solutionSulfuric acid (10% RT), nitric acid (10% RT), hydrochlo-ric acid (30% RT), acetic acid (50% RT), oxalic acid, calcium hydroxide, benzine, creosol, alcohol, cyclohex-ane, toluene, xylene, benzine, greaseABS resin Epoxy resinAmmonia, kerosine, mineral oil, developer, Yushiroken S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y, petroleum, grease, acetic acid, oxalic acid, cal-cium hydroxide, phosphoric acid (30% RT), hydrochlo-ric acid (10% RT), potassium hydroxideAmmonia, hydrochloric acid (10% RT), potassium hydroxide, petroleum, gasoline, Yushiroken S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y
174Section 7 Chemical Resistance of the Antennas, and TagsRFID SystemUser's ManualSection 7Chemical ResistanceChemical Resistance of TagsApplicable ModelPPS resin is used for case material and epoxy resin for filling material. Refer to the following lists and do notuse chemicals that affect PPS and epoxy resin.Tags cannot be used in applications with explosion-proof specifications.Chemicals That Cause Deformations, Cracks, Etc.Chemicals That May Cause Discoloration, Swelling, Etc.Chemicals That Do Not Affect PPS Resin or Epoxy ResinNote: The above results are from tests conducted a room temperature (23°C). Even if the chemicalsdo not affect the PPS or epoxy resins at room temperature, they may affect the resins at higheror lower temperatures. Check the chemicals carefully in advance.V680-D1KP52MT V680-D2KF52MPPS resin Epoxy resinAqua regia Aqua regia, chromic acid, sulfuric acid (90% RT), nitric acid (60% RT), ammonia solution, acetone, methylene chloride, phenolPPS resin Epoxy resinNitric acid (60% RT) Sulfuric acid (10% RT), nitric acid (10% RT), hydrochlo-ric acid (30% RT), acetic acid (50% RT), oxalic acid, calcium hydroxide, benzine, creosol, alcohol, cyclohex-ane, toluene, xylene, benzine, greasePPS resin Epoxy resinHydrochloric acid (37%RT), sulfuric acid (98%RT), nitric acid (40%RT), Hydrogen fluoride solution (40%RT), chromic acid (40%RT), hydrogen peroxide (28%RT), sodium hydroxide solution (60%RT), ammonia solution (28%RT), sodium chloride (10%RT), sodium carbonate (20%RT), sodium hypochlorite, phenol solution (5%RT), glacial acetic acid, acetic acid, oleic acid, Methyl alcohol (95%RT), ethyl alcohol (95%RT), Ethyl acetate, sebacic acid, diethylhexyl, acetone, diethyl ether, n-heptane, 2-2-4 trimethylpen-tane, benzine, toluene, aniline, mineral oil, gasoline, insulating oil, dichloroethylene, carbon tetrachlorideAmmonia, hydrochloric acid (10% RT), potassium hydroxide, petroleum, gasoline, Yushiroken S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y, methyl ethyl ketone, sodium hydroxide (10%RT)
175RFID SystemUser's ManualSection 7 Chemical Resistance of the Antennas, and TagsSection 7Chemical ResistanceApplicable ModelsThe above table shows the extent of changes in PPS resin exposed to each chemical at room temperatureand at 90°C. If actual chemicals, concentrations, and temperatures are different from those shown in thetables, always conduct tests under the actual conditions in which the Tags are to be used.V680-D1KP66T/66MTChemical At room tempera-tureAt 90°CChemical At room tempera-tureAt 90°CHydrochloric acid 37% A A Sodium hypochlorite AA10% A A Phenol solution 5% A ASulfuric acid 98% A B Glacial acetic acid AA50% A A Acetic acid AA30% A A Oleic acid AA3% A A Methyl alcohol 95% A ANitric acid 60% B C Ethyl alcohol 95% A A40% A B Ethyl acetate AA10% A A Sebacic acid diethylhexyl AAHydrogen fluoride solution 40% A A Acetone AAChromic acid 40% A A Diethyl ether AAHydrogen peroxide solu-tion 28% A B n-heptane AA3% A A 2-2-4 trimethylpentane AASodium hydroxide solution 60% A A Benzene AA10% A A Toluene AA1% A A Aniline AAAmmonia solution 28% A B Mineral oil AA10% A B Gasoline AASodium chloride 10% A A Insulating oil AASodium carbonate 20% A A Dichloroethylene AA2% A A Carbon tetrachloride AAA: Has no adverse effect, B: May cause discoloration, swelling, etc., C: Causes deformation, cracks, etc.
176Section 7 Chemical Resistance of the Antennas, and TagsRFID SystemUser's ManualSection 7Chemical ResistanceApplicable ModelsChemical Resistance of Fluoroplastic PFA (Reference)PFA: Tetrafluorethylene-Perfluoroalkylvinyletheir CopolymerFluoroplastic PFA does not react with most chemicals except molten alkali metal, hot pressurizedfluorine (F2), and some halogen derivatives. The following tables show the results of tests in which PFAwas soaked in or exposed to commonly used organic and inorganic chemicals. In these tests, acompression-molded test piece (1.3 mm thick) was soaked in the chemical at a specified temperaturefor a week (168 houre) and taken out of the chemical, then the weight change, tensile strength, andelongation of the test piece were immediately measured. If the change in the tensile strength is 15 % orless, the cange in the elongation is 10 % or less, and the increase in the weight is less than 0.5 %, theresults of the test can be considered normal.If PFA is exposed to trichloroacetic acid, tri-n-butyl phosphate, perchloroethylene, carbon thtrachloride,and other liquids (which easily make resin surfaces wet) at a high temperature, it tends to increase itsweight due to absorption and reduce its tensile strength. Even when PFA absorbs chemicals and sol-vents, its molecular structure will not change, If, however, PFA is subject to temperature or pressurechanges or mechanical damage when it has absorbed chemicals, the chemicals will repeatedlyexpand and contract inside pfa, causing mechanical problems such as cracks and bulging. In fact, thisproblem occurs with any kind of plastic.Inorganic ChemicalsV680-D1KP66T-SPChemical nameTest temperature(°C)Resulting characteristics(%) Weight increase rate (%)Tensile strength Elongationconcentrated hydrochloric acid 120 98 100 0.0Concentrated sulfuric acid 120 95 98 0.0Hydrofluoric acid (60%) 23 99 99 0.0Fuming sulfuric acid 23 95 96 0.0Aqua regia 120 99 100 0.0Chromic acid (50%) 120 93 97 0.0Consentrated nitric acid 120 95 98 0.0Fuming nitric acid 23 99 99 0.0Concentrated ammonia solution 66 98 100 0.0Caustic soda (50%) 120 93 99 0.4Hydrogen peroxide solution (30%) 23 93 95 0.0Bromine 23 99 100 0.5Chlorine 120 92 100 0.5Ferrous chloride (25%) 100 93 98 0.0Zinc chloride (25%) 100 96 100 2.7Chlorosulfonic acid 151 91 100 2.7Concentrated phosphoric acid 100 93 100 0.0
177RFID SystemUser's ManualSection 7 Chemical Resistance of the Antennas, and TagsSection 7Chemical ResistanceOrganic ChemicalsChemical nameTest temperature(°C)Resulting characteristics(%) Weight increase rate (%)Tensile strength ElongationGlacial acetic acid 118 95 100 0.4Acetic anhydride 139 91 99 0.3Trichloroacetic acid 196 90 100 2.2Isooctane 99 94 100 0.7Naphtha 100 91 100 0.5Mineral oil 180 87 95 0.0Toluene 110 88 100 0.7o-creosol 191 92 96 0.2Nitrobenzene 210 90 100 0.3Benzyl alcohol 205 93 99 0.3Aniline 185 94 100 0.3n-butylamine 78 86 97 0.4Ethylenediamine 117 96 100 0.1Tetrahydrofuran 66 88 100 0.1Benzaldehyde 179 90 99 0.5Cyclohexane 156 92 100 0.4Methyl ethyl ketone 80 90 100 0.4Acetophenone 202 90 100 0.6Dimethylphtalate 200 98 100 0.3n-butyl acetate 125 93 100 0.5Tri-n-butyl phosphate 200 91 100 2.0Methylene chloride 40 94 100 0.8Perchloroethylene 121 86 100 2.0Carbon tetrachloride 77 87 100 2.3Dimethyl formamide 154 96 100 0.2Dimethyl sulfoxide 189 95 100 0.1Dioxane 101 92 100 0.6Reference: Fluoroplastics Handbook, The Nikkan Kogyo Shimbun Ltd. (Takaomi Satogawa)
178Section 7 Chemical Resistance of the Antennas, and TagsRFID SystemUser's ManualSection 7Chemical ResistanceSubstances Extracted from Tag (Reference)If chemicals penetrate into a Tag through PFA, ions may be extracted from the Tag.Results of Ion-exchange ChromatographyA built-in Tag was soaked in hot water (100°C for 16 houres), and extracted ions were analyzed. Theresults are shown below.Extracted Ions (Concentration)Cl: 0.5 ppm, Na+: 10 ppm, NH4+: 11 ppm, K+: 1.0 ppmResults of ICP Emission Spectral AnalysisThe V680-D1KP66T-SP Tag was soaked in condentrated hydrochloric acid (which can easily penetratethrough PFA) at 80°C fo 300 hours, then extracted substances were analyzed.Extracted Substances (Concentration)Si: 700 ng/ml, S: 1,000 ng/ml, Ca: 30 ng/mlThe chemical resistance and extracted substances presented here should be used for reference only. Therates of change in Tag characteristics and the amounts of substances extracted will vary with temperaturesand chemical concentrations. Before using Tags under actual production environment, always conduct tests tocheck for any problems
179RFID SystemUser's ManualSection 7 Chemical Resistance of the Antennas, and TagsSection 7Chemical ResistanceApplicable ModelsChemicals that affect Tags are shown below.ABS resin is used for case material and epoxy resin for filling material. Refer to the following lists and do notuse chemicals that affect ABS and epoxy resin.Tags cannot be used in applications with explosion-proof specifications.Chemicals That Cause Deformations, Cracks, Etc.Chemicals That May Cause Discoloration, Swelling, Etc.Chemicals That Do Not Affect PPS Resin or Epoxy ResinNote: The above results are from tests conducted a room temperature (23°C). Even if the chemicalsdo not affect the ABS or epoxy resins at room temperature, they may affect the resins at higheror lower temperatures. Check the chemicals carefully in advance.V680-D2KF67/67MABS resin Epoxy resinTrichlene, acetone, xylene, toluene, gasoline, creosol, methylene chloride, phenol, cyclohexane, aqua regia, chromic acid, sulfuric acid (90% RT), methyl ethyl ketone, aniline, nitrobenzine, monochlorobenzine, pyridine, nitric acid (60% RT), formic acid (80% RT)Aqua regia, chromic acid, sulfuric acid (90% RT), nitric acid (60% RT), ammonia solution, acetone, methylene chloride, phenolABS resin Epoxy resinHydrochloric acid, alcohol, Freon, sodium hydroxide, hydrogen peroxide, benzine, sulfuric acid (10% RT), nitric acid (10% RT), phosphoric acid (85% RT), ammonia solutionSulfuric acid (10% RT), nitric acid (10% RT), hydrochlo-ric acid (30% RT), acetic acid (50% RT), oxalic acid, calcium hydroxide, benzine, creosol, alcohol, cyclohex-ane, toluene, xylene, benzine, greaseABS resin Epoxy resinAmmonia, kerosine, mineral oil, developer, Yushiroken S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y, petroleum, grease, acetic acid, oxalic acid, cal-cium hydroxide, phosphoric acid (30% RT), hydrochlo-ric acid (10% RT), potassium hydroxideAmmonia, hydrochloric acid (10% RT), potassium hydroxide, petroleum, gasoline, Yushiroken S50, Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y
180Section 7 Chemical Resistance of the Antennas, and TagsRFID SystemUser's ManualSection 7Chemical ResistanceApplicable ModelChemicals that affect Tags are shown below.Polybutylene terephthalate (PBT) resin is used for case material and epoxy resin for filling material. Refer tothe following lists and do not use chemicals that affect PBT and epoxy resins.Tags cannot be used in applications with explosion-proof specifications.Chemicals That Cause Deformations, Cracks, Etc.Chemicals That May Cause Discoloration, Swelling, Etc.Chemicals That Do Not Affect PPS Resin or Epoxy ResinNote: The above results are from tests conducted at room temperature (23°C). Even if the chemicalsdo not affect the PPS or epoxy resins at room temperature, they may affect the resins at higher or lowertemperatures. Check the chemicals carefully in advance.V680-D8KF68/D32KF68PBT resin Epoxy resinAcetone, trichloroethylene, ethylene dichloride, sodium hydroxide, and other alkaline substancesAqua regia, chromic acid, sulfuric acid (90% RT), nitric acid (60% RT), liquid ammonia, acetone, methylene chloride, phenolPBT resin Epoxy resinHydrochloric acid (10% RT), acetic acid (5% RT), ben-zeneSulfuric acid (10% RT), nitric acid (10% RT), concen-trated hydrochloric acid, acetic acid (50% RT), nitric acid, calcium hydroxide, benzene, cresol, alcohol, microhexanon, toluene, xylene, benzene, greasePBT resin Epoxy resinNitric acid (30% RT), concentrated hydrochloric acid, acetic acid, ethyl acetate (100% RT), potassium perma-ganate (5% RH), ethyl acetate, carbon tetrachloride, methanol, ethanol, gasolineAmmonia, hydrochloric acid (10% RT), calcium hydrox-ide, petroleum, gasoline, Yushiroken S50, Chemi-cool Z, Velocity No. 3, Yushiroken EEE-30Y, methyl ethyl ketone, sodium hydroxide
182Section 7 Degree of ProtectionRFID SystemUser's ManualSection 7Chemical ResistanceDegree of ProtectionIngress protection degrees (IP-@@) are determined by the following tests. Be sure to check the sealing capa-bility under the actual operating environment and conditions before actual use.IP indicates the ingress protection symbol.IEC (International Electrotechnical Commission) StandardsIEC 60529: 1989-11(A) First Digit: Degree of Protection from Solid Materials(B) Second Digit: Degree of Protection Against WaterDegree Degree0No protection1Protects against penetration of any solid object such as a hand that is 50 mm or more in diameter.2Protects against penetration of any solid object, such as a finger, that is 12.5 mm or more in diame-ter.3Protects against penetration of any solid object, such as a wire, that is 2.5 mm or more in diameter.4Protects against penetration of any solid object, such as a wire, that is 1 mm or more in diameter.5Protects against penetration of dust of a quantity that may cause malfunction or obstruct the safe operation of the product.6Protects against penetration of all dust.Degree Protection Test method (with pure water)0 No protection Not protected against water. No test1 Protection against water dropsProtects against vertical drops of water towards the product.Water is dropped vertically towards the product from the test machine for 10 min.2 Protection against water dropProtects against drops of water approaching at a maxi-mum angle of 15°to the left, right, back, and front from ver-tical towards the product.Water is dropped for 2.5 min each (i.e., 10 min in total) towards the product inclined 15° to the left, right, back, and front from the test machine.50 mm dia.12.5 mm dia.2.5 mm1 mm200 mm200 mm15˚
183RFID SystemUser's ManualSection 7 Degree of ProtectionSection 7Chemical ResistanceOil resistance (OMRON in-house standard)Note: This OMRON in-house standard confirms resistance to cutting and other oils. It is equivalent to the former JEM standard.3 Protection against sprin-kled waterProtects against sprinkled water approaching at a maxi-mum angle of 60° from verti-cal towards the product.Water is sprinkled for 10 min at a maximum angle of 60° to the left and right from vertical from the test machine. 4 Protection against water sprayProtects against water spray approaching at any angle towards the product.Water is sprayed at any angle towards the product for 10 min from the test machine.5 Protection against water jet sprayProtects against water jet spray approaching at any angle towards the product.Water is jet sprayed at any angle towards the product for 1 min per square meter for at least 3 min in total from the test machine.6 Protection against high pressure water jet sprayProtects against high-pres-sure water jet spray approach-ing at any angle towards the product.Water is jet sprayed at any angle towards the product for 1 min per square meter for at least 3 min in total from the test machine.7 Protection underwater Resists the penetration of water when the product is placed underwater at speci-fied pressure for a specified time.The product is placed 1 m deep in water (if the product is 850 mm max. in height) for 30 min.8(See Note)Protection underwater Can be used continuously underwater.The test method is determined by the manufacturer and user.ProtectionOil-resistant No adverse affect from oil drops or oil spray approaching from any direction.Oil-proof Protects against penetration of oil drops or oil spray approaching from any direction.Degree Protection Test method (with pure water)Water rate is 0.07 liter/min per hole.Water rate is 0.07 liter/min per hole.2.5 to 3 m12.5 liter/minDischarging nozzle: 6.3 dia.2.5 to 3 m 100 liter/minDischarging nozzle: 6.3 dia.1 m
184 RFID SystemUser's ManualRevision HistoryA manual revision code appears as a suffix to the catalog number at the bottom of the front and rear pages.Revision code Date Revised contents01 October 2006 Original production02 May 2007 Added items for V680-D8KF68/-D32KF68 ID Tags. 03 July 2007 Added items for V680-A81, V680-HS65 Antenna, and the overseas regulations and standards.03A September 2007 Added information on metal on back surface of the V680-HS65, corrected Tag specifications, and made other minor corrections. 04 December 2007 Added item for V680-HS51 Antenna, the overseas regulations and standards, , and made other minor corrections.Cat. No.: Z248-E1-04Revision code
Authorized Distributor:OMRON CorporationIndustrial Automation CompanySensing Devices Division H.Q.Industrial Sensors DivisionShiokoji Horikawa, Shimogyo-ku,Kyoto, 600-8530 JapanTel: (81)75-344-7022/Fax: (81)75-344-7107Regional HeadquartersOMRON EUROPE B.V.Sensor Business UnitCarl-Benz-Str. 4, D-71154 Nufringen,GermanyTel: (49) 7032-811-0/Fax: (49) 7032-811-199OMRON ELECTRONICS LLCOne Commerce Drive Schaumburg, IL 60173-5302 U.S.A.Tel: (1) 847-843-7900/Fax: (1) 847-843-7787OMRON ASIA PACIFIC PTE. LTD.No. 438A Alexandra Road # 05-05/08 (Lobby 2), Alexandra Technopark, Singapore 119967Tel: (65) 6835-3011/Fax: (65) 6835-2711OMRON (CHINA) CO., LTD. Room 2211, Bank of China Tower, 200 Yin Cheng Zhong Road, Pu Dong New Area, Shanghai, 200120, ChinaTel: (86) 21-5037-2222/Fax: (86) 21-5037-2200Cat. No. Z279-E1-01In the interest of product improvement, specifications are subject to change without notice.Printed in Japan0308-0.3C (1006)

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