Panasonic Devices Europe 1316 Bluetooth Module User Manual TABLE OF CONTENTS
Panasonic Industrial Devices Europe GmbH Bluetooth Module TABLE OF CONTENTS
15_PAN1316 UserMan
CLASSIFICATION PRODUCT SPECIFICATION
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DS-13xx-2400-102
REV.
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CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
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Specification for Production
Panasonic Industrial Devices Europe GmbH
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Applicant / Manufacturer
Software
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Contents Approval for Mass Production
Customer
Bluetooth QDL ID Qualified Design Listing (QDL) ID: B019784
As Controller Sub-System Listing for PAN13xx Series.
By purchase of any products described in this document the customer accepts the
document's validity and declares their agreement and understanding of its contents
and recommendations. Panasonic reserves the right to make changes as required
without notification.
CLASSIFICATION PRODUCT SPECIFICATION
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DS-13xx-2400-102
REV.
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CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
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TABLE OF CONTENTS
1 Scope of this Document..................................................................................................5
1.1 New PAN1315A, PAN1325A .................................................................................5
2 Key Features...................................................................................................................6
2.1 Software Block Diagram ........................................................................................6
3 Applications for the Module.............................................................................................7
4 Description for the Module ..............................................................................................7
5 Detailed Description........................................................................................................8
5.1 Terminal Layout .....................................................................................................8
5.1.1 5.1.1. Terminal Layout PAN131x without antenna ................................... 8
5.1.2 5.1.2. Terminal Layout PAN132x with antenna ........................................ 9
5.2 Pin Description.....................................................................................................10
5.3 Device Power Supply........................................................................................... 11
5.4 Clock Inputs ......................................................................................................... 12
6 Bluetooth Features........................................................................................................ 12
7 Block Diagram............................................................................................................... 13
8 Test Conditions .............................................................................................................14
9 General Device Requirements and Operation .............................................................. 14
9.1 Absolute Maximum Ratings ................................................................................. 14
9.2 Recommended Operating Conditions.................................................................. 15
9.3 Current Consumption........................................................................................... 16
9.4 General Electrical Characteristics........................................................................17
9.5 nSHUTD Requirements .......................................................................................17
9.6 External Digital Slow Clock Requirements ..........................................................17
10 Host Controller Interface ...............................................................................................18
11 Audio/Voice Codec Interface.........................................................................................19
11.1 PCM Hardware Interface .....................................................................................19
11.2 Data Format.........................................................................................................19
11.3 Frame Idle Period ................................................................................................20
11.4 Clock-Edge Operation .........................................................................................21
11.5 Two-Channel PCM Bus Example ........................................................................ 21
11.6 Audio Encoding....................................................................................................21
11.7 Improved Algorithm For Lost Packets.................................................................. 22
11.8 Bluetooth/PCM Clock Mismatch Handling ...........................................................22
11.9 Bluetooth Inter-IC Sound (I2S) ............................................................................22
11.10 Current Consumption for Different Bluetooth Scenarios...................................... 23
12 Bluetooth RF Performance............................................................................................23
13 Soldering Temperature-Time Profile (for reflow soldering) ...........................................26
13.1 For lead solder.....................................................................................................26
13.2 For leadfree solder...............................................................................................27
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14 Module Dimension ........................................................................................................ 28
14.1 Module Dimensions PAN131X without Antenna.................................................. 28
14.2 Module Dimensions PAN132X with Antenna....................................................... 29
15 Footprint of the Module .................................................................................................30
15.1 Footprint PAN131x without antenna ....................................................................30
15.2 Footprint PAN132x with antenna .........................................................................31
16 Labeling Drawing .......................................................................................................... 32
17 Mechanical Requirements............................................................................................. 32
18 Recommended Foot Pattern .........................................................................................33
18.1 recommended foot pattern PAN131x without antenna ........................................33
18.2 recommended foot pattern PAN132x with antenna .............................................34
19 Layout Recommendations with Antenna (PAN132x) .................................................... 35
20 Bluetooth LE (LOW ENERGY) PAN1316/26 ................................................................35
20.1 Network Topology................................................................................................35
20.2 module features ...................................................................................................36
20.3 Current consumption for different LE scenarios ..................................................37
21 ANT PAN1317/27..........................................................................................................37
21.1 Network topology .................................................................................................37
21.2 module features ..................................................................................................38
21.3 ANT Current consumption ................................................................................... 38
22 Triple mode (BR/EDR + Bluetooth low energy + ANT) PAN1323................................39
22.1 Triple Mode Current consumption .......................................................................39
23 Development of Applications.........................................................................................40
23.1 Tools to be needed .............................................................................................. 40
24 List of Profiles ...............................................................................................................41
25 Reliability Tests.............................................................................................................41
26 Cautions........................................................................................................................ 42
26.1 Design Notes .......................................................................................................42
26.2 Installation Notes .................................................................................................42
26.3 Usage Conditions Notes ......................................................................................43
26.4 Storage Notes......................................................................................................43
26.5 Safety Cautions ...................................................................................................44
26.6 Other cautions ..................................................................................................... 44
27 Packaging .....................................................................................................................45
27.1 Packaging of PAN131x without antenna .............................................................45
27.2 Packaging for PAN132x with antenna .................................................................48
28 Ordering Information ..................................................................................................... 49
29 RoHS Declaration ......................................................................................................... 50
30 Data Sheet Status.........................................................................................................50
31 History for this Document..............................................................................................51
32 Related Documents.......................................................................................................51
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33 General Information ...................................................................................................... 53
34 Regulatory Information..................................................................................................53
34.1 FCC for US ..........................................................................................................53
34.1.1 FCC Notice............................................................................................. 53
34.1.2 Caution ...................................................................................................54
34.1.3 Labeling Requirements ..........................................................................54
34.1.4 Antenna Warning.................................................................................... 54
34.1.5 Approved Antenna List (PAN1315, PAN1325)....................................... 55
34.1.6 Approved Antenna List (PAN1316, PAN1317, PAN1326, PAN1327) ....55
34.1.7 RF Exposure PAN13xx ..........................................................................55
34.2 Industry Canada Certification ..............................................................................56
34.3 European R&TTE Declaration of Conformity....................................................... 56
34.4 NCC for Taiwan ...................................................................................................58
34.4.1 Labeling Requirements ..........................................................................58
34.4.2 NCC Statement ...................................................................................... 58
34.5 Bluetooth SIG Statement .....................................................................................58
35 Life Support Policy ........................................................................................................59
CLASSIFICATION PRODUCT SPECIFICATION
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1 SCOPE OF THIS DOCUMENT
This product specification describes Panasonic’s HCI, Class 1.5 , TI based,
Bluetooth®1 modules, series number 13xx.
For detailed family overview that includes part numbers see Chapter 28,
Ordering Information.
Non-antenna versions will be refered to as PAN131x, versions with antenna will
be refered to as PAN132x in this document.
For information and features on Bluetooth Low Energy 4.0 refer to Chapter 19,
for information on ANT refer to Chapter 21.
1.1 NEW PAN1315A, PAN1325A
The PAN1315A/1325A Series is based on Texas Instruments’ NEW CC2560A
controller. A ROM update from Texas Instruments to the CC2560 IC has
allowed Panasonic to improve PAN1315/1325 Series. The NEW
PAN1315A/1325A Series Modules has increased power and system efficiency
resulting from reduced initialization script size, start-up time and decreased
system memory requirements.
Compatibility:
PAN1315, PAN1315A, PAN1316 and PAN1317 are 100% footprint compatible
PAN1325, PAN1325A, PAN1326 and PAN1327 are 100% footprint compatible
As an updated initialization script resident on the application microcontroller is
required for modules based on the CC2560A, compatibility between the
PAN1315/PAN1325 and PAN1315A/PAN1325A is dependant on the Bluetooth
stack. Stacks are available that will operate with all PAN1315/1325 variations.
BT-Stack solutions provided by software development partners are available for
most processors, including linux based host systems..
For detailed family overview that includes part numbers see Chapter 28 Ordering
Information.
Contact your stack provider or local Panasonic sales company for currently
available Bluetooth Profiles.
1 Bluetooth is a registered trademark of the Bluetooth Special Interest Group.
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2 KEY FEATURES
• Bluetooth specification v2.1 + EDR (Enhanced Data Rate)
• Surface mount type 6.5(9.5 w. Ant.) x 9.0 x 1.8 mm³
• Up to 10.5dBm Tx power (typical) with transmit power control
• High sensitivity (-93 dBm typ.)
• Texas Instrument’s CC256X BlueLink 7.0 inside
• Fast Connection Setup
• Extended SCO Link
• Supports convenient direct connection to battery (2.2-4.8 V),
or connect to DC/DC (1.7-1.98 V) for improved power efficiency
• Internal crystal oscillator (26MHz)
• Fully shielded for immunity
• Full Bluetooth data rate up to 2,178kbps asymmetric
• Support for Bluetooth power saving modes (Sniff, Hold)
• Support for very low-power modes (deep sleep and power down)
• Optional support for ultra-low-power mode. Standby with Battery-Backup
• PCM Interface Master / Slave supporting 13 or 16 bit linear, 8 bit µ-law or A-law
Codecs and CVSD transcoders on up to 3 SCO channels
• Full 8- to 128-bit encryption
• UART, I²C and PCM Interface
• IO operating voltage = 1.8 V nominal
• 3 Channel ADC and 1 Channel DAC
• Bluetooth profiles such as SPP, A2DP and others are available. Refer to
Panasonic’s RF module website for a listing of the most current releases.
• Manufactured in conformance with RoHS
2.1 SOFTWARE BLOCK DIAGRAM
PAN13xx
Host Processor
Application
BD/EDR BLE ANT
HCI
L2CAP
HCI
RF Block
PAN13xx
Host Processor
Application
BD/EDR BLE ANT
HCI
L2CAP
HCI
RF Block
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3 APPLICATIONS FOR THE MODULE
All Embedded Wireless Applications
• Smart Phones • Cable Replacement
• Industrial Control • Automotive
• Medical • Access Points
• Scanners • Consumer Electronics
• Wireless Sensors • Monitoring and Control
• Low Power • Access Points
4 DESCRIPTION FOR THE MODULE
The PAN1315 and PAN1315A are short-range, Class 1 or 2, HCI modules for
implementing Bluetooth functionality into various electronic devices. A block
diagram can be found in Chapter 7.
Communication between the module and the host controller is carried out via
UART.
New designs can be completed quickly by mating the PAN13xx series modules with Texas
Instruments’ MSP430BT5190 that contains Mindtree’s EtherMind Bluetooth Protocol Stack
and serial port profile, additional computing power can be achieved by choosing TI’s
Stellaris ARM7 controller that includes StoneStreet One's A2DP profile. Other BT profiles
are available on custom development basis.
Additional controllers are also supported by the PAN13xx series by using a TI/Panasonic
software development partner to port the Bluetooth stack and profiles. Mindtree's Software
Development Kit (SDK) is available on TI's website -- www.ti.com/connectivity.com
Contact your local sales office for further details on additional options and
services, by visiting www.panasonic.com/rfmodules or write an e-mail to
wireless@eu.panasonic.com.
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5 DETAILED DESCRIPTION
5.1 TERMINAL LAYOUT
5.1.1 5.1.1. Terminal Layout PAN131x without antenna
No Pin Name Pull at
Reset Def.
Dir. 2 I/O Type 3Description of Options (Common)
1 GND Connect to Ground
2 TX_DBG PU O 2 mA Logger output
3 HCI_CTS PU I 8 mA HCI UART clear-to-send.
4 HCI_RTS PU O 8 mA HCI UART request-to-send.
5 HCI_RX PU I 8 mA HCI UART data receive
6 HCI_TX PU O 8 mA HCI UART data transmit
7 AUD_FSYNC PD IO 4 mA PCM frame synch. (NC if not used) Fail safe4
8 SLOW_CLK_IN I 32.768-kHz clock in Fail safe
9 NC IO Not connected
10 MLDO_OUT O Main LDO output (1.8 V nom.)
11 CL1.5_LDO_IN I PA LDO input
12 GND Connect to Ground
13 RF IO Bluetooth RF IO
14 GND Connect to Ground
15 MLDO_IN I Main LDO input
16 nSHUTD PD I Shutdown input (active low).
17 AUD_OUT PD O 4 mA PCM data output. (NC if not used) Fail safe
18 AUD_IN PD I 4 mA PCM data input. (NC if not used) Fail safe
19 AUD_CLK PD IO HY, 4 mA PCM clock. (NC if not used) Fail safe
20 GND Connect to Ground
21 NC EEPROM I²C SDA (Internal)
22 VDD_IO PI I/O power supply 1.8 V Nom
23 NC EEPROM I²C SCL (Internal)
24 NC IO Not connected
2 I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
3 I/O Type: Digital I/O cells. HY = input hysteresis, current = typ. output current
4 No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.
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5.1.2 5.1.2. Terminal Layout PAN132x with antenna
No Pin Name Pull at
Reset Def.
Dir. 5 I/O Type 6Description of Options (Common)
A GND Connect to Ground
B GND Connect to Ground
C GND Connect to Ground
D GND Connect to Ground
No 1-24 see above in Chapter 5.1.1. Except PIN 13 is not connected. For RF conducted
measurements, either use the PAN1323ETU or de-solder the antenna and solder an
antenna connector to the hot pin.
5 I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
6 I/O Type: Digital I/O cells. HY = input hysteresis, current = typ. output current
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5.2 PIN DESCRIPTION
Pin Name No ESD 7
(V)
Pull at
Reset
Def.
Dir. 8 I/O Type 9 Description of Options
Bluetooth IO SIGNALS
HCI_RX 5 750 PU I 8 mA HCI UART data receive
HCI_TX 6 750 PU O 8 mA HCI UART data transmit
HCI_RTS 4 750 PU O 8 mA HCI UART request-to-send.
HCI_CTS 3 750 PU I 8 mA HCI UART clear-to-send.
AUD_FYSNC 7 500 PD IO 4 mA PCM frame synch (NC if not used) Fail safe
AUD_CLK 19 500 PD IO HY, 4 mS PCM clock (NC if not used) Fail safe
AUD_IN 18 500 PD I 4 mA PCM data input (NC if not used) Fail safe
AUD_OUT 17 500 PD O 4 mA PCM data output (NC if not used) Fail safe
Logger output
TX_DBG 2 1000 PU O 2 mA
OPTION: nTX_DBG – logger out (low = 1)
CLOCK SIGNALS
SLOW_CLK_IN 8 1000 I 32.768-kHz clock in Fail safe
Bluetooth ANALOG SIGNALS
RF 13 1000 IO Bluetooth RF IO (not connected with antenna)
nSHUTD 16 1000 PD I Shutdown input (active low).
Bluetooth POWER AND GND SIGNALS
VDD_IO 22 1000 PI I/O power supply 1.8 V Nom
MLDO_IN 15 1000 I Main LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
MLDO_OUT 10 1000 O Main LDO output (1.8 V nom.) Can not be used as 1.8V supply
due to internal connection to the RF part.
CL1.5_LDO_IN 11 1000 I PA LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
GND 1 P Connect to Ground
GND 12 P Connect to Ground
GND 14 P Connect to Ground
GND 20 P Connect to Ground
EEPROM IO SIGNALS (EEPROM is optional in PAN13x product line)
NC 23 1000 PU/PD I HY, 4mA EEPROM I²C SCL (Internal)
NC 21 1000 PU/PD IO HY, 4mA EEPROM I²C IRQ (Internal)
Remark:
HCI_CTS is an input signal to the CC256X device:
- When HCI_CTS is low, then CC256X is allowed to send data to Host device.
- When HCI_CTS is high, then CC256X is not allowed to send data to Host device.
7 ESD: Human Body Model (HBM). JEDEC 22-A114
8 I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
9 I/O Type: Digital I/O cells. HY = input hysteresis, current = typ output current
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5.3 DEVICE POWER SUPPLY
The PAN13XX Bluetooth radio solution is intended to work in devices with a limited
power budget such as cellular phones, headsets, hand-held PC’s and other battery-
operated devices. One of the main differentiators of the PAN13XX is its power
management – its ability to draw as little current as possible.
The PAN13XX device requires two kinds of power sources:
• Main power supply for the Bluetooth - VDD_IN = VBAT
• Power source for the 1.8 V I/O ring - VDD_IO
The PAN13XX includes several on-chip voltage regulators for increased noise immunity.
The PAN13XX can be connected either directly to the battery or to an external 1.8-V DC
to DC converter.
There are three ways to supply power:
• Full-VBAT system:
Maximum RF output power, but not optimum system power:
• Full-DC2DC system:
Lower RF output power, but optimum system power:
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• Mixed DC2DC-VBAT system:
Maximum RF output power and optimum system power, but requires routing of VBAT:
5.4 CLOCK INPUTS
The slow clock is always supplied from an external source. It is connected to the
SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0-1.8 V.
The slow clock's frequency accuracy must be 32.768 kHz ±250 ppm for Bluetooth
usage (according to the Bluetooth specification).
The Slow Clock 32.768 kHz is mandatory to start the internal controller,
otherwise the module does not start up.
6 BLUETOOTH FEATURES
• Support of Bluetooth2.1+EDR (Lisbon Release) up to HCI level.
• Very fast AFH algorithm for both ACL and eSCO.
• Supports typically 4 dBm Class 2 TX power w/o external PA, improving Bluetooth
link robustness. Adjusting the host settings, the TX power can be increased to 10
dBm. However it is important, that the national regulations and Bluetooth
specification are met.
• Digital Radio Processor (DRP) single-ended 50 ohm.
• Internal temperature detection and compensation ensures minimal variation in the
RF performance over temperature.
• Flexible PCM and I2S digital audio/voice interfaces: Full flexibility of data-format
(Linear, a-Law, µ-Law), data-width, data order, sampling and slot positioning,
master/slave modes, high clock rates up to 15 MHz for slave mode (or 4.096 MHz for
Master Mode). Lost packet concealment for improved audio.
• Proprietary low-power scan method for page and inquiry scans, achieves page and
inquiry scans at 1/3rd normal power.
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7 BLOCK DIAGRAM
Note: The Slow Clock 32.768 kHz is mandatory, otherwise the module does not
start up, refer to Chapter 5.4 for additional information.
Note: The IO are 1.8V driven and might need external level shifter and LDO. The
MLDO_OUT PIN can not be used as reference due to RF internal connection.
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8 TEST CONDITIONS
Measurements shall be made under room temperature and humidity unless
otherwise specified.
9 GENERAL DEVICE REQUIREMENTS AND OPERATION
Temperature 25 ± 10°C
Humidity 40 to 85%RH
SW-Patch V2.30
Supply Voltage 3.3V
All specifications are over temperature and process, unless indicated otherwise.
9.1 ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
Note
All parameters are measured as follows unless stated
otherwise:
VDD_IN 10 = 3.3 V, VDD_IO = 1.8 V.
No See 11 Value Unit
Ratings Over Operating Free-Air Temperature Range
1 VDD_IN Supply voltage range –0.5 to 5.5 V 12
2 VDDIO_1.8V –0.5 to 2.145 V
3 Input voltage to RF (Pin 13) –0.5 to 2.1 V
4 Operating ambient temperature range –40 to 8513 °C
5 Storage temperature range –40 to 125 °C
10 VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11), other options are described in Chapter 5.3.
11 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
12 Maximum allowed depends on accumulated time at that voltage: VDD_IN is defined in Reference schematics. When DC2DC supply is
used, maximum voltage into MLDO_OUT and LDO_IN = 2.145 V.
13 Older generation parts, which are not recommended for new designs, will support a temperature range -20 to 70. See chapter 28,
ordering information, for details.
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No See 11 Value Unit
6 Bluetooth RF inputs (Pin 13) 10 dBm
7 ESD: Human Body Model (HBM). JEDEC 22-A114 500 V
9.2 RECOMMENDED OPERATING CONDITIONS
No Rating Condition Symbol Min Max Unit
1 Power supply voltage 14 VDD_IN 1.7 4.8 V
2 IO power supply voltage VDD_IO 1.62 1.92 V
3 High-level input voltage Default VIH 0.65 x VDD_IO VDD_IO V
4 Low-level input voltage Default VIL 0 0.35 x VDD_IO V
5 IO Input rise/fall times, 10% to 90%
15 Tr/Tf 1 10 ns
0 to 0.1 MHz 60
0.1 to 0.5 MHz 50
0.5 to 2.5 MHz 30
2.5 to 3.0 MHz 15
6 Maximum ripple on VDD_IN (Sine wave) for
1.8 V (DC2DC) mode
> 3.0 MHz 5
mVp-p
7
Voltage dips on VDD_IN (VBAT) (duration =
577 μs to
2.31 ms, period = 4.6 ms)
400 mV
8 Maximum ambient operating temperature 16 85 °C
9 Minimum ambient operating temperature 17 -40 ðC
14 Excluding 1.98 < VDD_IN < 2.2 V range – not allowed.
15 Asynchronous mode.
16 The device can be reliably operated for 7 years at Tambient of 85°C, assuming 25% active mode and 75% sleep
mode (15,400 cumulative active power-on hours).
Older generation parts, which are not recommended for new designs, will support a temperature range -20 to
70. See chapter 28, ordering information, for details.
17 The device can be reliably operated for 7 years at Tambient of 85°C, assuming 25% active mode and 75% sleep
mode (15,400 cumulative active power-on hours).
Older generation parts, which are not recommended for new designs, will support a temperature range -20 to
70. See chapter 28, ordering information, for details.
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PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
9.3 CURRENT CONSUMPTION
No Characteristics Min
25°C
Typ
25°C
Max
25°C
Min
-40°C
Typ
-40°C
Max
-40°C
Min
+85°C
Typ
+85°C
Max
+85°C Unit
1 Current consumption in
shutdown mode 18 1 3 7 μA
2 Current consumption in deep
sleep mode 19 40 105 700
μA
3 Total IO current consumption
for active mode 1 1 1 mA
4 Current consumption during
transmit DH5 full throughput 40 mA
18 Vbat + Vio
19 Vbat + Vio + Vsd (shutdown)
CLASSIFICATION PRODUCT SPECIFICATION
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DS-13xx-2400-102
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9.4 GENERAL ELECTRICAL CHARACTERISTICS
No Rating Condition Min Max Value
at 2/4/8 mA 0.8 x VDD_IO VDD_IO V
1 High-level output voltage, VOH
at 0.1 mA VDD_IO – 0.2 VDD_IO V
at 2/4/8 mA 0 0.2 x VDD_IO V
2 Low-level output voltage, VOL
at 0.1 mA 0 0.2 V
Resistance 1 MΩ
3 IO input impedance
Capacitance 5 pF
4 Output rise/fall times,10% to 90% (Digital pins) CL = 20 pF 10 Ns
PU typ = 6.5 3.5 9.7
TX_DBG,
us PCM b PD typ = 27 9.5 55
µA
PU typ = 100 100 300
5 IO pull
currents
All others
PD typ = 100 100 360
µA
9.5 NSHUTD REQUIREMENTS
No Parameter Symbol Min Max Unit
1 Operation mode level 20 V
IH 1.42 1.98 V
2 Shutdown mode level VIL 0 0.4 V
3 Minimum time for nSHUT_DOWN low to reset the device 5 ms
4 Rise/fall times Tr/Tf 20 µs
9.6 EXTERNAL DIGITAL SLOW CLOCK REQUIREMENTS
No Characteristics Condition Symbol Min Typ Max Unit
1 Input slow clock frequency 32768 Hz
2 Input slow clock accuracy
(Initial + temp + aging) Bluetooth ±250 Ppm
3 Input transition time Tr/Tf –
10% to 90% Tr/Tf 100 Ns
4 Frequency input duty cycle 15% 50% 85%
5 Phase noise at 1 kHz -125 dBc/Hz
6 Jitter Integrated over 300 to
15000 Hz 1 Hz
VIH 0.65 x
VDD_IO VDD_IO
7 Slow clock input voltage
limits Square wave, DC coupled
VIL 0 0.35 x
VDD_IO
V peak
8 Input impedance 1 MΩ
9 Input capacitance 5 pF
20 Internal pull down retains shut down mode when no external signal is applied to this pin.
CLASSIFICATION PRODUCT SPECIFICATION
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10 HOST CONTROLLER INTERFACE
The CC256X incorporates one UART module dedicated to the host controller
interface (HCI) transport layer. The HCI interface transports commands, events,
ACL, and synchronous data between the Bluetooth device and its host using
HCI data packets.
The UART module supports H4 (4-wires) protocol with maximum baud rate of 4
Mbps for all fast clock frequencies.
After power up the baud rate is set for 115.2 kbps, irrespective of fast clock
frequency. The baud rate can thereafter be changed with a vendor specific
command. The CC256X responds with a Command Complete Event (still at
115.2 kbps), after which the baud rate change takes place. HCI hardware
includes the following features:
• Receiver detection of break, idle, framing, FIFO overflow, and parity error
conditions
• Transmitter underflow detection
• CTS/RTS hardware flow control
The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control
between the host and the CC256X is byte-wise by hardware.
Flow control is obtained by the following:
When the UART RX buffer of the CC256X passes the “flow control” threshold, it
will set the UART_RTS signal high to stop transmission from the host.
When the UART_CTS signal is set high, the CC256X will stop its transmission
on the interface. In case HCI_CTS is set high in the middle of transmitting a
byte, the CC256X will finish transmitting the byte and stop the transmission.
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11 AUDIO/VOICE CODEC INTERFACE
The codec interface is a fully-dedicated programmable serial port that provides the logic
to interface to several kinds of PCM or I2S codec’s. PAN13XX supports all voice coding
schemes required by Bluetooth specification – Log PCM (A-Law or μ-Law) and Linear (CVSD). In
addition, module also supports transparent scheme:
• Two voice channels
• Master / slave modes
• µ-Law, A-Law, Linear, Transparent coding schemes
• Long and short frames
• Different data sizes, order, and positions.
• High rate PCM interface for EDR
• Enlarged interface options to support a wider variety of codecs
• PCM bus sharing
11.1 PCM HARDWARE INTERFACE
The PCM interface is one implementation of the codec interface. It contains the
following four lines:
• Clock—configurable direction (input or output)
• Frame Sync—configurable direction (input or output)
• Data In—Input
• Data Out—Output/3-state
The Bluetooth device can be either the master of the interface where it generates the
clock and the frame-sync signals, or slave where it receives these two signals. The
PCM interface is fully configured by a vendor specific command.
For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates
above 12 MHz, the maximum data burst size is 32 bits. For master mode, the CC256X
can generate any clock frequency between 64 kHz and 6 MHz.
Please contact your sales representative if using the I2S bus over PCM. We strongly
recommend adding a low pass filter (series resistor and capacitor to GND) to the bus for
better noise suppression. It is not recommended to directly contact the host
µController/DSP with the PCM interface.
11.2 DATA FORMAT
The data format is fully configurable:
• The data length can be from 8 to 320 bits, in 1-bit increments, when working with two
channels, or up to 640 bits when using 1 channel. The Data length can be set
independently for each channel.
• The data position within a frame is also configurable in with 1 clock (bit) resolution and
can be set independently (relative to the edge of the Frame Sync signal) for each
channel.
• The Data_In and Data_Out bit order can be configured independently. For example;
Data_In can start with the MSB while Data_Out starts with LSB. Each channel is
separately configurable. The inverse bit order (that is, LSB first) is supported only for
sample sizes up to 24 bits.
• It is not necessary for the data in and data out size to be the same length.
CLASSIFICATION PRODUCT SPECIFICATION
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• The Data_Out line is configured to ‘high-Z’ output between data words. Data_Out can
also be set for permanent high-Z, irrespective of data out. This allows the CC256X to be
a bus slave in a multi-slave PCM environment. At powerup, Data Out is configured as
high-Z.
11.3 FRAME IDLE PERIOD
The codec interface has the capability for frame idle periods, where the PCM clock can
“take a break” and become ‘0’ at the end of the PCM frame, after all data has been
transferred.
The CC256X supports frame idle periods both as master and slave of the PCM bus.
When CC256X is the master of the interface, the frame idle period is configurable.
There are two configurable parameters:
• Clk_Idle_Start – Indicates the number of PCM clock cycles from the beginning of the
frame until the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock
will become ‘0’.
• Clk_Idle_End – Indicates the time from the beginning of the frame till the end of the
idle period. This time is given in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
For example, for PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start =
60, Clk_Idle_End = 90.
Between each two frame syncs there are 70 clock cycles (instead of 100). The clock idle
period starts 60 clock cycles after the beginning of the frame, and lasts 90 – 60 = 30
clock cycles. This means that the idle period ends 100 – 90 = 10 clock cycles before the
end of the frame. The data transmission must end prior to the beginning of the idle
period.
CLASSIFICATION PRODUCT SPECIFICATION
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11.4 CLOCK-EDGE OPERATION
The codec interface of the CC256X can work on the rising or the falling edge of the
clock. It also has the ability to sample the frame sync and the data at inversed polarity.
This is the operation of a falling-edge-clock type of codec. The codec is the master of
the PCM bus. The frame sync signal is updated (by the codec) on the falling clock edge
and therefore shall be sampled (by the CC256X) on the next rising clock. The data from
the codec is sampled (by the CC256X) on the clock falling edge.
11.5 TWO-CHANNEL PCM BUS EXAMPLE
In below figure, a 2-channel PCM bus is shown where the two channels have different
word sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer)
11.6 AUDIO ENCODING
The CC256X codec interface can use one of four audio-coding patterns:
• A-Law (8-bit)
• µ-Law (8-bit)
• Linear (8- or 16-bit)
CLASSIFICATION PRODUCT SPECIFICATION
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11.7 IMPROVED ALGORITHM FOR LOST PACKETS
The CC256X features an improved algorithm for improving voice quality when received
voice data packets are lost. There are two options:
• Repeat the last sample – possible only for sample sizes up to 24 bits. For sample
sizes >24 bits, the last byte is repeated.
• Repeat a configurable sample of 8 to 24 bits (depends on the real sample size), in
order to simulate silence (or anything else) in the PCM bus. The configured sample will
be written in a specific register for each channel.
The choice between those two options is configurable separately for each channel.
11.8 BLUETOOTH/PCM CLOCK MISMATCH HANDLING
In Bluetooth RX, the CC256X receives RF voice packets and writes these to the codec
I/F. If the CC256X receives data faster than the codec I/F output allows, an overflow will
occur. In this case, the Bluetooth has two possible behaviour modes: ‘allow overflow’
and ‘don’t allow overflow’.
• If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any
data not yet sent to the codec.
• If overflow is not allowed, RF voice packets received when buffer is full will be
discarded.
11.9 BLUETOOTH INTER-IC SOUND (I2S)
The CC256X can be configured as an Inter-IC Sound (I2S) serial interface to an I2S
codec device. In this mode, the CC256X audio codec interface is configured as a bi-
directional, full-duplex interface, with two time slots per frame: Time slot 0 is used for the
left channel audio data and time slot 1 for the right channel audio data. Each time slot is
configurable up to 40 serial clock cycles in length and the frame is configurable up to 80
serial clock cycles in length.
Do not connect the the microcontroller/DSP directly to the module's PCM interface, a
simple RC low pass filter is recommended to improve noise suppression.
CLASSIFICATION PRODUCT SPECIFICATION
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DS-13xx-2400-102
REV.
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11.10 CURRENT CONSUMPTION FOR DIFFERENT BLUETOOTH SCENARIOS
The following table gives average current consumption for different Bluetooth scenarios.
Conditions: VDD_IN = 3.6 V, 25°C, 26-MHz fast clock, nominal unit, 4 dBm output
power.
12 BLUETOOTH RF PERFORMANCE
No Characteristics Typ
BT Spec
Max
BT Spec
Min
Class1 Class1
1 Average Power Hopping DH5 [dBm] 22, 23 7.2 20 4
2 Average Power: Ch0 [dBm] 22, 23 7.5 20 4
3 Peak Power: Ch0 [dBm] 22, 23 7.7 23
4 Average Power: Ch39 [dBm] 22, 23 7.0 20 4
5 Peak Power: Ch39 [dBm] 22, 23 7.2 23
6 Average Power: Ch78 [dBm] 22, 23 6.7 20 4
7 Peak Power: Ch78 [dBm] 22, 23 7.0 23
8 Max. Frequency Tolerance: Ch0 [kHz] -2.6 75 -75
9 Max. Frequency Tolerance: Ch39 [kHz] -2.2 75 -75
10 Max. Frequency Tolerance: Ch78 [kHz] -2.1 75 -75
11 Max. Drift: Ch0_DH1 [kHz] 3.6 25 -25
12 Max. Drift: Ch0_DH3 [kHz] 3.7 40 -40
13 Max. Drift: Ch0_DH5 [kHz] 4.0 40 -40
14 Max. Drift Rate: Ch0_DH1 [kHz] -2.6 20 -20
15 Max. Drift Rate: Ch0_DH3 [kHz] -3.2 20 -20
16 Max. Drift Rate: Ch0_DH5 [kHz] -3.3 20 -20
17 Max. Drift: Ch39_DH1 [kHz] 4.0 25 -25
18 Max. Drift: Ch39_DH3 [kHz] 4.3 40 -40
19 Max. Drift: Ch39_DH5 [kHz] 4.3 40 -40
20 Max. Drift Rate: Ch39_DH1 [kHz] -3.1 20 -20
21 Max. Drift Rate: Ch39_DH3 [kHz] -3.6 20 -20
22 Max. Drift Rate: Ch39_DH5 [kHz] -3.7 20 -20
CLASSIFICATION PRODUCT SPECIFICATION
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No Characteristics Typ
BT Spec
Max
BT Spec
Min
Class1 Class1
23 Max. Drift: Ch78_DH1 [kHz] 4.1 25 -25
24 Max. Drift: Ch78_DH3 [kHz] 4.5 40 -40
25 Max. Drift: Ch78_DH5 [kHz] 4.4 40 -40
26 Max. Drift Rate: Ch78_DH1 [kHz] -3.4 20 -20
27 Max. Drift Rate: Ch78_DH3 [kHz] -3.9 20 -20
28 Max. Drift Rate: Ch78_DH5 [kHz] -4.1 20 -20
29 Delta F1 Avg: Ch0 [kHz] 159.5 175 140
30 Delta F2 Max.: Ch0 [%] 100.0 99.9
31 Delta F2 Avg/Delta F1 Avg: Ch0 0.9 0.8
32 Delta F1 Avg: Ch39 [kHz] 159.8 175 140
33 Delta F2 Max.: Ch39 [%] 100.0 99.9
34 Delta F2 Avg/Delta F1 Avg: Ch39 0.9 0.8
35 Delta F1 Avg: Ch78 [kHz] 159.1 175 140
36 Delta F2 Max.: Ch78 [%] 100.0 99.9
37 Delta F2 Avg/Delta F1 Avg: Ch78 0.9 0.8
45 Sensitivity -93.0 -81
46 f(H)-f(L): Ch0 [kHz] 918.4 1000
47 f(H)-f(L): Ch39 [kHz] 918.3 1000
48 f(H)-f(L): Ch78 [kHz] 918.2 1000
49 ACPower -3: Ch3 [dBm] -51.5 -40
50 ACPower -2: Ch3 [dBm] -50.4 -40
51 ACPower -1: Ch3 [dBm] -18.5
52 ACPower Center: Ch3 [dBm] 8.1 20 4
53 ACPower +1: Ch3 [dBm] -19.2
54 ACPower +2: Ch3 [dBm] -50.7 -40
55 ACPower +3: Ch3 [dBm] -53.3 -40
56 ACPower -3: Ch39 [dBm] -51.6 -40
57 ACPower -2: Ch39 [dBm] -50.7 -40
58 ACPower -1: Ch39 [dBm] -19.0
59 ACPower Center: Ch39 [dBm] 7.7 20 4
60 ACPower +1: Ch39 [dBm] -19.7
61 ACPower +2: Ch39 [dBm] -50.9 -40
62 ACPower +3: Ch39 [dBm] -53.2 -40
63 ACPower -3: Ch75 [dBm] -51.7 -40
64 ACPower -2: Ch75 [dBm] -50.7 -40
65 ACPower -1: Ch75 [dBm] -19.2
66 ACPower Center: Ch75 [dBm] 7.5 20 4
67 ACPower +1: Ch75 [dBm] -20.0
68 ACPower +2: Ch75 [dBm] -51.0 -40
69 ACPower +3: Ch75 [dBm] -53.4 -40
70 omega i 2-DH5: Ch0 [kHz] -4.7 75 -75
71 omega o + omega i 2-DH5: Ch0 [kHz] -6.0 75 -75
72 omega o 2-DH5: Ch0 [kHz] -1.5 10 -10
73 DEVM RMS 2-DH5: Ch0 [%] 0.0 0.2
74 DEVM Peak 2-DH5: Ch0 [%] 0.1 0.35
CLASSIFICATION PRODUCT SPECIFICATION
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No Characteristics Typ
BT Spec
Max
BT Spec
Min
Class1 Class1
75 DEVM 99% 2-DH5: Ch0 [%] 100.0 99
76 omega i 3-DH5: Ch0 [kHz] -3.7 75 -75
77 omega o + omega i 3-DH5: Ch0 [kHz] -5.8 75 -75
78 omega o 3-DH5: Ch0 [kHz] -2.6 10 -10
79 DEVM RMS 3-DH5: Ch0 [%] 0.0 0.13
80 DEVM Peak 3-DH5: Ch0 [%] 0.1 0.25
81 DEVM 99% 3-DH5: Ch0 [%] 100.0 99
82 omega i 2-DH5: Ch39 [kHz] -4.8 75 -75
83 omega o + omega i 2-DH5: Ch39 [kHz] -6.1 75 -75
84 omega o 2-DH5: Ch39 [kHz] -1.4 10 -10
85 DEVM RMS 2-DH5: Ch39 [%] 0.0 0.2
86 DEVM Peak 2-DH5: Ch39 [%] 0.1 0.35
87 DEVM 99% 2-DH5: Ch39 [%] 100.0 99
88 omega i 3-DH5: Ch39 [kHz] -3.8 75 -75
89 omega o + omega i 3-DH5: Ch39 [kHz] -5.9 75 -75
90 omega o 3-DH5: Ch39 [kHz] -2.6 10 -10
91 DEVM RMS 3-DH5: Ch39 [%] 0.0 0.13
92 DEVM Peak 3-DH5: Ch39 [%] 0.1 0.25
93 DEVM 99% 3-DH5: Ch39 [%] 100.0 99
94 omega i 2-DH5: Ch78 [kHz] -4.9 75 -75
95 omega o + omega i 2-DH5: Ch78 [kHz] -6.2 75 -75
96 omega o 2-DH5: Ch78 [kHz] -1.4 10 -10
97 DEVM RMS 2-DH5: Ch78 [%] 0.0 0.2
98 DEVM Peak 2-DH5: Ch78 [%] 0.1 0.35
99 DEVM 99% 2-DH5: Ch78 [%] 100.0 99
100 omega i 3-DH5: Ch78 [kHz] -3.8 75 -75
101 omega o + omega i 3-DH5: Ch78 [kHz] -6.0 75 -75
102 omega o 3-DH5: Ch78 [kHz] -2.7 10 -10
103 DEVM RMS 3-DH5: Ch78 [%] 0.0 0.13
104 DEVM Peak 3-DH5: Ch78 [%] 0.1 0.25
105 DEVM 99% 3-DH5: Ch78 [%] 100.0 99
No Characteristics Condition Min Typ Max BT Spec Unit
1 Operation frequency range 2402 2480 MHz
2 Channel spacing 1 MHz
3 Input impedance 50 Ω
GFSK, BER = 0.1% -93.0 -70
Pi/4-DQPSK, BER = 0.01% -92.5 -70
4 Sensitivity, Dirty Tx on
8DPSK, BER = 0.01% -85.5 -70
dBm
CLASSIFICATION PRODUCT SPECIFICATION
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No Characteristics Condition Typ Max Unit
30 kHz to 1 GHz 21 , 22, 23 -30
1 Tx and Rx out-of-band emissions
Output signal = 7dBm 1 to 12.75 GHz 21, 22, 23 -30
dBm
2 2nd harmonic at 7dBm output power 21, 22, 23 -30 dBm
3 3rd harmonic at 7dBm output power 21, 22, 23 -30 dBm
The values are measured conducted. Better suppression of the spurious emissions with
an antenna can be expected as, antenna frequently have band pass filter
characteristics.
13 SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
13.1 FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
Tem
p
.
[
°C
]
Time [s]
235°C max.
220
±
5°C
200°C
150 ±10°C
90 ±30s
10 ±1s
30 +20/-10s
21 Includes effects of frequency hopping
22 Average according FCC, IC and ETSI requirements. Above +7dBm output power (refer also to 23) the
customer has to verify the final product against national regulations.
23 +7dBm related to power register value 18, according to TI service pack 2.30
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13.2 FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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14 MODULE DIMENSION
14.1 MODULE DIMENSIONS PAN131X WITHOUT ANTENNA
No. Item Dimension Tolerance Remark
1 Width 6.50 ± 0.20
2 Lenght 9.00 ± 0.20
3 Height 1.80 ± 0.20 With case
PAN131X Module Drawing
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14.2 MODULE DIMENSIONS PAN132X WITH ANTENNA
No. Item Dimension Tolerance Remark
1 Width 9.50 ± 0.20
2 Lenght 9.00 ± 0.20
3 Height 1.80 ± 0.20 With case
PAN132X Module Drawing
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15 FOOTPRINT OF THE MODULE
15.1 FOOTPRINT PAN131X WITHOUT ANTENNA
All dimensions are in millimeters.
The outer dimensions have a tolerance of ± 0.2mm.
The layout is symetric to center. The inner pins (2,4,6,9,11,14,16,18,21,23) are
shifted to the center by 1mm.
0.90
1.70
6,50
0.90
1.80
9,00
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 24 x 0.60mm x 0.60mm
Top View
1.80
2.70
2.95
3.95
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15.2 FOOTPRINT PAN132X WITH ANTENNA
All dimensions are in millimeters.
The outer dimensions have a tolerance of ± 0.2mm.
The layout is symetric to center. The inner pins (2,4,6,9,11,14,16,18,21,23) are
shifted to the center by 1mm.
2.70
0.90
1.70
9.50
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
1.80
A
C
B
D
1.80
0.55
1.00 1.80
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 32 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
16 LABELING DRAWING
The above pictures show the laser marking on the top case, this is only an example
from PAN1315.
17 MECHANICAL REQUIREMENTS
No. Item Limit Condition
1 Solderability More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature profile
2 Resistance to soldering
heat
It shall be satisfied electrical requirements and not
be mechanical damage See Chapter 13.2
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 33 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
18 RECOMMENDED FOOT PATTERN
18.1 RECOMMENDED FOOT PATTERN PAN131X WITHOUT ANTENNA
Dimensions in mm.
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 24 x 0.60mm x 0.60mm
Top View
9,00
6,50
6,00
8,50
The land pattern dimensions above are meant to serve only as a guide. This
information is provided without any legal liability.
For the solder paste screen, use as a first guideline the same foot print as shown
in the figure above. Solder paste screen cutouts (with slightly different
dimensions) might be optimum depending on your soldering process. For
example, the solder paste screen thickness chosen might have an effect. The
solder screen thickness depends on your production standard 120µm to 150µm
is recommended.
IMPORTANT:
Although the bottom side of PAN131X is fully coated, no copper such as through
hole vias, planes or tracks on the board component layer should be located
below the PAN131X to avoid creating a short. In cases where a track or through
hole via has to be located under the module, it must be kept away from
PAN131X bottom pads. The PAN131X multilayer pcb contains an inner RF
shielding plane, therefore no pcb shielding plane below the module is needed.
When using an onboard ceramic antenna, place the antenna on the edge of your
carrier board (if allowable).
If you have any questions on these points, contact your local Panasonic
representative.
Schematics and layouts may be sent to wireless@eu.panasonic.com for final
review.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 34 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
18.2 RECOMMENDED FOOT PATTERN PAN132X WITH ANTENNA
Dimensions in mm.
The land pattern dimensions above are meant to serve only as a guide.
For the solder paste screen, use as a first guideline the same foot print as shown
in the Figure above. Solder paste screen cutouts (with slightly different
dimensions) might be optimum depending on your soldering process. For
example, the solder paste screen thickness chosen might have an effect. The
solder screen thickness depends on your production standard 120μm to 150μm
is recommended.
IMPORTANT: In cases where a track or through hole via has to be located under
the module, it must be kept away from PAN132X bottom pads. The PAN132X
multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding
plane below the module is needed.
If you have any questions on these points, contact your local Panasonic
representative.
Schematics and layouts may be sent to wireless@eu.panasonic.com for final
review.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 35 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
19 LAYOUT RECOMMENDATIONS WITH ANTENNA (PAN132X)
20 BLUETOOTH LE (LOW ENERGY) PAN1316/26
20.1 NETWORK TOPOLOGY
Bluetooth Low Energy is designed to reduce power consumption. It can be put into a sleep
mode and is only activated for event activities such as sending files to a gateway, PC or
mobile phone. Furthermore the maximum power consumption is set to less than 15 mA
and the average power consumption is about 1 uA. The benefit of low energy consumption
are short messages and establishing very fast connections (few ms). Using these
techniques, energy consumption is reduced to a tenth of a Classic Bluetooth unit. Thus, a
small coin cell – such as a CR2032 – is capable of powering a device for up to 10 years of
operation.
To be backwards compatible with Classic Bluetooth and to be able to offer an affordable
solution for very inexpensive devices, Panasonic Low Energy Bluetooth modules are
offered in two versions:
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 36 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
Dual-mode: Bluetooth Low Energy technology combined with Classic Bluetooth
functionality on a single module. Dual mode devices act as gateways between these two
technologies.
Single Mode: Bluetooth Low Energy technology to optimize power consumption, which is
particularly useful for products powered by small batteries. These modules have
embedded controllers allowing the module to operate autonomously in low cost
applications that lack intelligence.
This data sheet describes dual-mode Bluetooth Low Energy technology
combined with Classic Bluetooth functionality on a single module. Additional
information on Panasonic’s single mode products can be found by visiting
www.panasonic.com/rfmodules or write an e-mail to
wireless@eu.panasonic.com.
20.2 MODULE FEATURES
Fully compliant with Bluetooth 4.0:
• Optimized for proximity and sports use
• Supports up to 10 simultaneous connections
• Multiple sniff instances are tightly coupled to minimize power consumption
• Independent buffering allows a large number of multiple connections without
affecting BR/EDR performance
• Includes built-in coexistence and prioritization handling for BR/EDR and LE
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 37 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
20.3 CURRENT CONSUMPTION FOR DIFFERENT LE SCENARIOS
Conditions: VDD_IN = 3.6 V, 25°C, 26-MHz fast clock, nominal unit, 10 dBm output power
Mode Description Average Current Unit
Advertising, non-connectable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise Data
104 µA
Advertising, discoverable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise Data
121 µA
Scanning
Listening to a single frequency per window
1.28msec scan interval
11.25msec scan window
302 µA
Connected
(master role)
500msec connection interval
0msec Slave connection latency
Empty Tx/Rx LL packets
169 µA
21 ANT PAN1317/27
ANT+ (sometimes ANT + or ANT Plus) is an interoperability function that can be
added to the base ANT protocol (a proprietary wireless sensor network
technology).[
21.1 NETWORK TOPOLOGY
ANT™ is a wireless sensor network protocol operating in the 2.4 GHz spectrum. Designed
for ultra-low power, ease of use, efficiency and scalability, ANT supports peer-to-peer, star,
tree and fixed mesh topologies. It provides reliable data communications, flexible and
adaptive network operation and cross-talk immunity. The ANT protocol stack is compact,
requiring minimal microcontroller resources to reduce system costs, lighten the
computational burden and improve efficiency. Low-level security is implemented to allow
user-defined network security.
PAN1317/1327 provides the first wireless, single-chip solution with dual-mode ANT and
Bluetooth connectivity with inclusion of TI’s CC2567 device. This solution wirelessly
connects 13 million ANT-based devices to the more than 3 billion Bluetooth endpoint
devices used by people every day, creating new market opportunities for companies
building ANT products and Bluetooth products alike. CC2567 requires 80% less board area
than a design with two single-mode solutions (one ANT+, one Bluetooth) and increases the
wireless transmission range up to two times the distance of a single-mode ANT+ solution.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 38 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
21.2 MODULE FEATURES
Fully compliant with ANT protocol:
• ANT solution optimized for fitness, health and consumers use cases
• Supports up to eight simultaneous connections, various network topologies and high-
resolution proximity pairing
• Includes built-in coexistence and prioritization handling for BR/EDR and ANT
Features Benefits
Dual-mode ANT+ and Bluetooth (Bluetooth v2.1 +
EDR) on a single chip
- Requires 80% less board area than any dual module or device
design
- Reduces costs associated with incorporating two wireless
technologies
Fully validated optimized single antenna solution - Enables simultaneous operation of ANT+ and Bluetooth without
the need for two devices or modules
- Includes built-in coexistence
Best-in-class Bluetooth and ANT RF performance:
- +10 dBm Tx power with transmit power control
- -93 dBm sensitivity
- Delivers twice the distance between the aggregator and ANT
sensor device than competitive single-mode ANT solutions
- Enables a robust and high-throughput connection with extended
range
Support for:
- ANT+ ultra low power (master and slave devices)
- Bluetooth power saving modes (park, sniff, hold)
- Bluetooth ultra low power modes (deep sleep,
power down)
- Improves battery life and power efficiency of the finished product
Turnkey solution:
- Fully integrated module
- Complete development kit with software and
documentation
- TI MSP430 hardware and software platform
integration (optional)
- Ease of integration into system allows quick time to market
- Reduces costs and time associated with certification
21.3 ANT CURRENT CONSUMPTION
Mode Description Average Current Unit
Rx message mode 250msec interval 380 µA
Rx message mode 500msec interval 205 µA
Rx message mode 1000msec interval 118 µA
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 39 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
22 TRIPLE MODE (BR/EDR + BLUETOOTH LOW ENERGY + ANT) PAN1323
The PAN1323 has been engineered to give designers the flexibility to implement
Bluetooth Classic (BR/EDR), Bluetooth Low Energy and ANT into an application
using a single module, reducing cost and footprint area. Refer to the paragraphs
above for complete descriptions on each of the three protocols. The module is
fully hardware compatible with the PAN1315, 15A, 16, 17, 25, 25A, 26 and 27. A
highly efficent single RF block serves all three protocols. Protocols access the
RF block using time division multiplexing. The application layer determines the
priority and timing of the RF block.Customers interested in this unique module
are encouraged to contact StoneStreetOne for a Bluetooth SIG certified stack.
22.1 TRIPLE MODE CURRENT CONSUMPTION
The current consumption of the PAN1326 is a function of the protocol that the
module is running at any point in time. Refer to the paragraphs above for details
on current consumption for each of the three protocols or software vendor.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 40 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
23 DEVELOPMENT OF APPLICATIONS
Mindtree Ltd. has developed a Bluetooth SPP freeware for TIs MSP430 and
Panasonics PAN1315(A) and PAN1325(A). For other software refer to Chapter
24 or visit the following link www.panasonic.com/rfmodules.
23.1 TOOLS TO BE NEEDED
PAN1323ETU
Tool Source
TI - MSP-EXP430F5438 - Experimenter Board MSP-EXP430F5438
TI - MSP-FET430UIF430 - Debugging Interface MSP-FET430UIF430
TI PAN1323EMK
PAN1323EMK - Bluetooth Evaluation Module Kit for MSP430
Panasonic PAN1323ETU
CC2567-PAN1327ANT-BTKIT
For information on Bluetooth + ANT kit for PAN1327 CC2567 + PAN1327 wiki
In addition you need the software development environment, e.g. IAR Embedded
Workbench, refer to:
http://wiki.msp430.com/index.php/MSP430_Bluetooth_Platform
Evaluation kits and modules are available through Panasonic’s network of authorized
distributors. For any additional information, please visit www.panasonic.com/rfmodules.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 41 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
24 LIST OF PROFILES
Profile Software Developer Controller Availability
Bluetooth
SPP and others MindTree TI, MSP430 Now
SPP Seeran STM32, MSP430 Now
HDP, SPP Stollmann TI, MSP430 Now
A2DP, AVRCP, SPP StoneStreetOne TI, Stellaris Now
SPP and others ARS Multiple Now
Bluetooth LE
All ARS, MindTree,
StoneStreetOne, Stollmann TI, MSP430 and others Upon request
ANT Protocoll
ANT Dynastream MSP430 and others Now
Triple Mode Stack
SPP StoneStreetOne MSP430 and others Now
For all other profiles contact your local sales representative.
25 RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and
humidity for 1 hour.
No. Item Limit Condition
1 Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2 Shock test the same as above Dropped onto hard wood from height of 50cm for 3 times
3 Heat cycle test the same as above -40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4 Moisture test the same as above +60°C, 90% RH, 300h
5 Low temp. test the same as above -40°C, 300h
6 High temp. test the same as above +85°C, 300h
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 42 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
26 CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading
of the product’s functions and damage to the product.
26.1 DESIGN NOTES
(1) Follow the conditions written in this specification, especially the control
signals of this module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a
battery or a low noise regulator output). For noisy supply voltages, provide a
decoupling circuit (for example a ferrite in series connection and a bypass
capacitor to ground of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the
life of these products.
(5) Avoid assembly and use of the target equipment in conditions where the
products' temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not
carry noise and/or spikes.
(7) Keep this product away from other high frequency circuits.
26.2 INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in Chapter 15.
Set up the temperature at the soldering portion of this product according to
this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed
circuit boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase
due to the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover
will melt and generate toxic gas, damaging the insulation. Never allow contact
between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair a board by hand soldering, keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will
cause damage to the unit.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 43 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
26.3 USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are
applied to the products, check and evaluate their operation befor assembly
on the final products.
(2) Do not use dropped products.
(3) Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to
this product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when
soldered on PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover
will cause damage.
(7) These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment,
information and communication equipment.
26.4 STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely
affected:
• Storage in salty air or in an environment with a high concentration of
corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX
• Storage in direct sunlight
• Storage in an environment where the temperature may be outside the range
of 5°C to 35°C range, or where the humidity may be outside the 45 to 85%
range.
• Storage of the products for more than one year after the date of delivery
Storage period: check the adhesive strength of the embossed tape and
soldering after 6 months of storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 44 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
26.5 SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and
individual components.
Before use, check and evaluate the operation when mounted on your products. Abide
by these specifications, without deviation when using the products. These products may
short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are
anticipated when a short circuit occurs, then provide the following failsafe functions, as a
minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or
another system to prevent a single fault causing an unsafe status.
26.6 OTHER CAUTIONS
(1) This specification sheet is copyrighted.
(2) Do not use the products for other purposes than those listed.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent
an additional damage that may be caused by the abnormal function or the
failure of the product.
(4) This product has been manufactured without any ozone chemical controlled
under the Montreal Protocol.
(5) These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special
conditions carefully to determine whether or not they can be used in such a
manner.
• In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
• In direct sunlight, outdoors, or in a dusty environment
• In an environment where condensation occurs.
• In an environment with a high concentration of harmful gas (e.g. salty air,
HCl, Cl2, SO2, H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other
components or circuits, replace these products with new products because
they may not be able to provide normal performance even if their electronic
characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Panasonic.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 45 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
27 PACKAGING
27.1 PACKAGING OF PAN131X WITHOUT ANTENNA
Tape Dimension
Packing in Tape
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315
Machine
readable
2D-Barc ode
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315
Machine
readable
2D-Barc ode
Empty spaces in component packed area shall be less than two per reel and those
spaces shall not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 46 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
Component direction
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315
Machine
readable
2D-Barcode
Reel dimension
A B D N W2
MAX MIN MIN
±1.0
MAX
13
+0.5
25.0
+2.0
24.4
+3.0
-0.2
-0.0 -0.5
*Latch (2PC)All dimensions in millimeters unless otherwise stated
Assembly
Method
24mm 330.0 1.5 20.2 100.0 30.4 *Latch
TAPE SIZE C W1 W3
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 47 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
Label for Package
PAN1315
Customer Code ENW89818C2JF
105 mm
(1T) Lotcode [YYWWDLL] Example from above:
YY year printed 08
WW normal calendar week printed 01
D day printed 5 (Friday)
L line identifier, if more as one printed 1
L lot identifier per day printed 1
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code refer to chapter 28 Ordering Information
(9D) Datecode as [YYWW]
(Q) Quantity [XXXX], variable max. 1500
(HW/SW) Hardware /Software Release
Total Package
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 48 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
27.2 PACKAGING FOR PAN132X WITH ANTENNA
Tape Dimension
Measured from centreline of sprocket holeMeasured from centreline of sprocket hole
Cumulative tolerance of 10 sprocket
Measured from centreline of sprocket
to centreline of pocket.
holes is ± 0.20 .
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
P1
+/- 0.10
+/- 0.10
+/- 0.30
7.50
12.00
16.00
K1 2.00 +/- 0.10
2.80
+/- 0.10
+/- 0.10
9.40
Bo
Ko
9.90Ao +/- 0.10
Tooling code: Flatbed - 9
Estimated Max Length: 72m per 22B3
Y
Y
X
X
SECTION Y-
Y
SCALE 3.5 :
1
SECTION X-
X
SCALE 3.5 :
1
Packing in Tape
All other packaging information is similar to Chapter 27.1
Pin1 Marking
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 49 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
28 ORDERING INFORMATION
Model Temp. Part Number TI-Device Remark
PAN1315 -20°C to +70°C ENW89818C2JF CC2560 NR for new designs
PAN1315A -20°C to +70°C ENW89829C2JF CC2560A NR for new designs
PAN1315A -40°C to +85°C ENW89829C2KF CC2560A Recommended for new designs
PAN1316 -20°C to +70°C ENW89823C2JF CC2564 NR for new designs
PAN1316 -40°C to +85°C ENW89823C2KF CC2564 Recommended for new designs
PAN1317 -20°C to +70°C ENW89827C2JF CC2567 NR for new designs
PAN1317 -40°C to +85°C ENW89827C2KF CC2567 Recommended for new designs
PAN1323 -20°C to +70°C No CC2567 Ony ETU Module
PAN1323 -20°C to +70°C ENW89842A2JF CC2567 NR for new designs
PAN1323 -40°C to +85°C ENW89842A2KF CC2567 Recommended for new designs
PAN1325 -20°C to +70°C ENW89818A2JF CC2560 NR for new designs
PAN1325A -20°C to +70°C ENW89829A2JF CC2560A NR for new designs
PAN1325A -40°C to +85°C ENW89829A2KF CC2560A Recommended for new designs
PAN1326 -20°C to +70°C ENW89823A2JF CC2564 NR for new designs
PAN1326 -40°C to +85°C ENW89823A2KF CC2564 Recommended for new designs
PAN1327 -20°C to +70°C ENW89827A2JF CC2567 NR for new designs
PAN1327 -40°C to +85°C ENW89827A2KF CC2567 Recommended for new designs
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 50 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
29 ROHS DECLARATION
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our
suppliers that this product do not contain by now the following substances which
are banned by Directive 2002/95/EC (RoHS) or if contain a maximum
concentration of 0,1% by weight in homogeneous materials for
• Lead and lead compounds
• Mercury and mercury compounds
• Chromium (VI)
• PBB (polybrominated biphenyl) category
• PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0,01% by weight in homogeneous materials for
• Cadmium and cadmium compounds
30 DATA SHEET STATUS
This data sheet contains the final specification (RELEASE).
Panasonic reserves the right to make changes at any time without notice in
order to improve design and supply the best possible product.
Supplementary data will be published at a later date.
Consult the most recently issued data sheet before initiating or completing a
design.
Use this URL to search for the most recent version of this data sheet: PAN13xx
Latest Data Sheet!
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 51 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
31 HISTORY FOR THIS DOCUMENT
Revision Date Modification / Remarks
0.90 18.12.2009 1st preliminary version
0.95 01.03.2010 Updated Chapter 14.2 and 28.
0.96 Not released Change ESD Information on foot note 7 in chapter Pin Description
0.97 25.03.2010 Various updates. Deleted links to TI Datasheet.
0.98 21.04.2010
Updated Links Some minor changes in Chapter 8 and 9.1 and change the base for the values
in Chapter 9.
0.99 22.10.2010
Adopted changes according to CC2560 Datasheet. Included Interface Description,
performance values. Not released.
1.00 04.11.2010 1st internal Release.
1.01 03.12.2010 Included reference to PAN1325 Application Note. AN-1325-2420-111.pdf
1.02 10.01.2011 Changed wording in Chapter 34.2 ”Industry Canada Certification”.
1.03 23.05.2011
Included DOC for PAN1315 series. Included PAN13xx ANT and BLE Addendum Rev1.x.pdf
reference. Included Note for IO voltage and MLD_OUT pin.
1.04 02.07.2011 Corrected wording in Chapter 34.3 European R&TTE Declaration of Conformity.
1.05 28.10.2011
Including CC2560A silicon PAN1315A HW40 at Chapter 1.1, Chapter New PAN1315A and
Chapter 0. Deleted ES label in Chapter
1.06 15.11.2011
Added overview for the core specification and their addendums. Updated front page. Updated
Related Documents.
3.00 11.01.2012 Merging PAN13xx documents into this specification and correct some format
3.10 16.01.2012 Minor mistakes fixed
3.20 29.05.2012 DoC replaced with revised version
3.30 11.06.2012
Added triple mode stack Module PAN1323, add PAN1323 to ordering and software information
overview, Software Block Diagram added, Bluetooth Inter IC-Sound chapter information added
Layout Recommandations with Antenna added, Application Note LGA added
3.31 27.06.2012
Added design information to use low pass filter (chapter 11.1 / 11.9) for better noise
surpression when using PCM interface
3.40 18.07.2012
Re-organize chapter Regulatory Information and added 2 chapters
1. NCC Statement (only valid for PAN1325)
2. Bluetooth SIG Statement
3. Chapter 11.9, Second Paragraph was updated
4. Link in Chapter 34.1.1. was fixed
3.50 31.10.2012
Changed the Overview in chapter Ordering Information
Included -40°C to 85°C Version ENW898xxA2KF. So called K-Version.
32 RELATED DOCUMENTS
For an update, search in the suitable homepage.
[1] PAN1323ETU Design-Guide:
http://www.panasonic.com/industrial/includes/pdf/PAN1323ETUDesignGuide.pdf
[2] CC2560 Product Bulletin: http://focus.ti.com/pdfs/wtbu/cc2560_slyt377.pdf
[3] Bluetooth SW for MSP430 is supported by IAR IDE service pack 5.10.6 and
later. Use full IAR version edition (not the kick-start version). You can find info
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 52 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
on IAR at http://www.iar.com/website1/1.0.1.0/3/1/ and www.MSP430.com . Note, that
there is an option for a 30-day free version of IAR evaluation edition.
[4] PAN13xx CAD data: http://www.pedeu.panasonic.de/pdf/174ext.zip
[5] Application Note Land Grid Array: http://www.pedeu.panasonic.de/pdf/184ext.pdf
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 53 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
33 GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH.
All rights reserved.
This document may contain errors. Panasonic reserves the right to make corrections,
modifications, enhancements, improvements, and other changes to its literature at any
time. Customers should obtain the latest relevant information before placing orders and
should verify that such information is current and complete. All products are sold subject to
Panasonic’s terms and conditions of sale supplied at the time of order acknowledgment.
If we deliver ES samples to the customer, these samples have the status Engineering
Samples. This means, the design of this product is not yet concluded. Engineering
Samples may be partially or fully functional, and there may be differences to be published
Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
• the use of the Engineering Sample other than for Evaluation Purposes, particularly
the installation or integration in an other product to be sold by Customer,
• deviation or lapse in function of Engineering Sample,
• improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages. Panasonic
assumes no liability for applications assistance or customer product design. Customers are
responsible for their products and applications using Panasonic components. To minimize
the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards. In case of any questions, contact your local
sales representative.
34 REGULATORY INFORMATION
34.1 FCC FOR US
34.1.1 FCC Notice
The devices PAN13xx, for details refer to Chapter 28 in this document, including the
antennas, which are listed in Chapter 34.1.5 of this data sheet, complies with Part 15
of the FCC Rules. The device meets the requirements for modular transmitter
approval as detailed in FCC public Notice DA00-1407.transmitter. Operation is
subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 54 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
34.1.2 Caution
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Industrial Devices Europe GmbH
may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
34.1.3 Labeling Requirements
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling
requirements are met. This includes a clearly visible label on the outside of the OEM
enclosure specifying the appropriate Panasonic FCC identifier for this product as well as
the FCC Notice above. The FCC identifiers are:
FCC ID: T7V1315 for PAN1315 and PAN1325
FCC ID: T7V1316 for PAN1316, PAN1317, PAN1326 and PAN1327
This FCC identifiers are valid for all PAN13xx modules, for details, see the Chapter 28.
Ordering Information. In any case the end product must be labelled exterior with
"Contains FCC ID: T7V1315" (PAN1315, PAN1325) or
"Contains FCC ID: T7V1316" (PAN1316, PAN1317, PAN1326 and PAN1327).
34.1.4 Antenna Warning
For the related part number of PAN13xx refer to Chapter 28. Ordering Information.
These devices are tested with a standard SMA connector and with the antennas listed
below. When integrated in the OEMs product, these fixed antennas require installation
preventing end-users from replacing them with non-approved antennas. Any antenna
not in the following tables must be tested to comply with FCC Section 15.203 for unique
antenna connectors and Section 15.247 for emissions. The FCC identifier for this device
with the antenna listed below are the same (FCC ID: T7V1315 or T7V1316).
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 55 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
34.1.5 Approved Antenna List (PAN1315, PAN1325)
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item Part Number Manufacturer Frequency Band Type Gain (dBi)
1 2450AT43B100 Johanson Technologies 2.4GHz Chip-Antenna +1.3
2 LDA212G3110K Murata 2.4GHz Chip-Antenna +0.9
3 4788930245 Würth Elektronik 2.4GHz Chip-Antenna +0.5
34.1.6 Approved Antenna List (PAN1316, PAN1317, PAN1326, PAN1327)
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item Part Number Manufacturer Frequency Band Type Gain (dBi)
1 LDA212G3110K Murata 2.4GHz Chip-Antenna +0.9
34.1.7 RF Exposure PAN13xx
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer
(OEM) must ensure that the approved antenna in the previous tables must be installed.
The preceding statement must be included as a CAUTION statement in manuals for
products operating with the approved antennas in the previous table to alert users on
FCC RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the
integrated radio module is not allowed.
The radiated output power of PAN13xx with mounted ceramic antenna
(FCC ID: T7V1315 or T7V1316) is far below the FCC radio frequency exposure limits.
Nevertheless, the PAN13xx shall be used in such a manner that the potential for human
contact during normal operation is minimized.
End users may not be provided with the module installation instructions. OEM
integrators and end users must be provided with transmitter operating conditions for
satisfying RF exposure compliance.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 56 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
34.2 INDUSTRY CANADA CERTIFICATION
This device complies with Industry Canada RSS-210 (Rev.8). Operation is subject to the
following two conditions
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux
appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions
suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
PAN131x is licensed to meet the regulatory requirements of Industry Canada (IC),
license:
IC: 216Q-1315 (PAN1315, PAN1325)
IC: 216Q-1316 (PAN1316, PAN1317, PAN1326, PAN1327)
Manufacturers of mobile, fixed or portable devices incorporating this module are advised
to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure
limits. Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Tables 34.1.5 and
34.1.6 above, having a maximum gain of 1.3 dBi (PAN13x6: 0.9dBi). Antennas not
included in this list or having a gain greater than 1.3 dBi (PAN13x6: 0.9dBi) are strictly
prohibited for use with this device. The required antenna impedance is 50 ohms. The
antenna used for this transmitter must not be co-located or operating in conjunction with
any other antenna or transmitter. Due to the model size the IC identifier is displayed in
the installation instruction.
34.3 EUROPEAN R&TTE DECLARATION OF CONFORMITY
Hereby, Panasonic Industrial Devices Europe GmbH, declares that the Bluetooth
module PAN13xx and their versions is in compliance with the essential requirements
and other relevant provisions of Directive 1999/5/EC. As a result of the conformity
assessment procedure described in Annex III of the Directive 1999/5/EC, the end-
customer equipment should be labelled as follows:
PAN13xx and their versions in the specified reference design can be used in the
following countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia,
Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The
Netherlands, the United Kingdom, Switzerland, and Norway.
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 57 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 58 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
34.4 NCC FOR TAIWAN
34.4.1 Labeling Requirements
Due to the limited size on the module, the NCC ID is not visible on the module.
When the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module.
This exterior label can use wording such as the following:
“Contains Transmitter Module NCC ID:” or “Contains NCC ID:”
CCAJ11LPxxxxTx
Any similar wording that expresses the same meaning may be used.
Panasonic is able to provide the above content from the label as a vector graphic,
please ask at wireless@eu.panasonic.com.
34.4.2 NCC Statement
Due to the national rule from Taiwan we have to print the below statement in Chinese
language.
根據
NCC
低功率電波輻射性電機管理辦法
規定
1.1 第十二條
1.3 第十四條
1.2 經型式認證合格之低功率射頻電機，非經許可，公
司、商號或使用者均不得擅自變更頻率、加大功率或變更
原設計之特性及功能。
1.4 低功率射頻電機之使用不得影響飛航安全及干擾合
法通信；經發現有干擾現象時，應立即停用，並改善至無
干擾時方得繼續使用。
前項合法通信，指依電信法規定作業之無線電通信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電
波輻射性電機設備之干擾。
:
34.5 BLUETOOTH SIG STATEMENT
The Design is listed as Controller Subsystem with QDID: B019784
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=19784
CLASSIFICATION PRODUCT SPECIFICATION
No.
DS-13xx-2400-102
REV.
3.60
SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 59 of 59
CUSTOMER’S CODE
PAN13XX Core Specification
PANASONIC’S CODE
See Chapter 28. Ordering Information DATE 15.04.2013
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de
35 LIFE SUPPORT POLICY
This Panasonic product is not designed for use in life support appliances, devices, or
systems where malfunction can reasonably be expected to result in a significant
personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the
life support device or system, or to affect its safety or effectiveness. Panasonic
customers using or selling these products for use in such applications do so at their own
risk and agree to fully indemnify Panasonic for any damages resulting.