Panasonic Devices Europe 1761 Bluetooth Smart Module User Manual TABLE OF CONTENTS

Panasonic Industrial Devices Europe GmbH Bluetooth Smart Module TABLE OF CONTENTS

Contents

UserMan

CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
1 of 29
PANASONIC’S CODE
ENW89848A1KF
DATE
23.03.2017
Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
Product Specification
Applicant / Manufacturer
Hardware
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Toshiba
Software Version
Please refer to chapter 19
By purchase of any of products described in this document the customer accepts the
document's validity and declares their agreement and understanding of its contents and
recommendations. Panasonic reserves the right to make changes as required without
notification.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
2 of 29
PANASONIC’S CODE
ENW89848A1KF
DATE
23.03.2017
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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TABLE OF CONTENTS
1. Scope of this Document ................................................................................................ 4
2. Key Features ................................................................................................................. 4
3. Bluetooth Low Energy ................................................................................................... 5
4. Applications for the Module ........................................................................................... 5
5. Description for the Module ............................................................................................. 5
6. PAN1761 Detailed Description ...................................................................................... 6
6.1. PIN Assignment ................................................................................................... 6
6.2. PIN Functions ...................................................................................................... 7
6.3. Block Diagram ...................................................................................................... 8
7. Test Conditions ............................................................................................................. 9
8. General Device Requirements and Operation ............................................................... 9
8.1. Absolute Maximum Ratings .................................................................................. 9
8.2. Recommended Operating Conditions ................................................................... 9
8.4. Power up sequence ........................................................................................... 10
8.5. PAN1761 Current Consumption ......................................................................... 10
9. Bluetooth RF Performance .......................................................................................... 11
9.1. PAN1761 Bluetooth Characteristics ................................................................... 11
9.2. PAN1761 NFC tag Interface ............................................................................... 11
9.3. NFC Operational Sequence ............................................................................... 12
10. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13
10.1. For lead solder ................................................................................................... 13
10.2. For leadfree solder ............................................................................................. 13
11. PAN1761 Module Dimension ...................................................................................... 14
12. Footprint of the Module ............................................................................................... 15
13. Case Marking .............................................................................................................. 16
13.1. Example for Marking .......................................................................................... 16
13.2. Marking Definition .............................................................................................. 16
14. Mechanical Requirements ........................................................................................... 16
15. Development of Applications ....................................................................................... 17
16. Reliability Tests ........................................................................................................... 17
17. Cautions ...................................................................................................................... 17
17.1. Design Notes ..................................................................................................... 17
17.2. Installation Notes ................................................................................................ 18
17.3. Usage Conditions Notes ..................................................................................... 18
17.4. Storage Notes .................................................................................................... 19
17.5. Safety Cautions .................................................................................................. 19
17.6. Other cautions .................................................................................................... 19
18. Packaging ................................................................................................................... 21
18.1. PAN1761 Tape Dimension ................................................................................. 21
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
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DATE
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18.2. Packing in Tape ................................................................................................. 22
18.3. Component Direction ......................................................................................... 22
18.4. Reel Dimension .................................................................................................. 23
18.5. Label for Package .............................................................................................. 24
18.6. Total Package .................................................................................................... 24
19. Ordering Information ................................................................................................... 25
20. RoHS and REACH Declaration ................................................................................... 25
21. Data Sheet Status ....................................................................................................... 25
22. History for this Document ............................................................................................ 25
23. Related Documents ..................................................................................................... 26
24. Radiation Pattern of Antenna ...................................................................................... 27
25. General Information ..................................................................................................... 29
26. Life Support Policy ...................................................................................................... 29
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
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PANASONIC’S CODE
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DATE
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1. SCOPE OF THIS DOCUMENT
This product specification applies to Panasonic’s, Class 2, Bluetooth®
1
low energy single mode module with
NFC , series number: PAN1761
2. KEY FEATURES
Same form factor and footprint as PAN1760
Bluetooth 4.1 (LE) embedded GATT profile with high level API commands, compatible to Toshiba
reference BLE profiles
Surface mount type 15.6 x 8.7 x 1.8 mm³
Tx power 0 dBm, Rx sensitivity -90 dBm
Compliant to BT 4.1
32kB on-chip RAM for application software and driver
512kBit eeprom to download user program during start up
Operation with external host or as host-less ( stand alone)
Standard SIG BLE and “SPP over BLE” profiles available
Temperature Range from -30°C to +85°C
NFC Forum Tag Type 3 wired interface
1520kB built-in EEPROM NFC memory
1
Bluetooth is a registered trademark of the Bluetooth Special Interest Group.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
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3. BLUETOOTH LOW ENERGY
Bluetooth Low Energy (BLE), part of Bluetooth Ver. 4.0, specifies two types of implementation: Single mode
and dual mode. Single mode devices implement the low energy specification and consume just a fraction of
the power of classic Bluetooth, allowing the short-range wireless standard to extend to coin cell battery
applications for the first time. Dual mode devices combine Bluetooth Low Energy and classic Bluetooth and
are likely to become a de facto feature in almost all new Bluetooth enabled cellular phones and computers.
Single mode Bluetooth 4.0 Low Energy is not backwards compatible with previous Bluetooth classic
standards. Dual mode Bluetooth 4.0 is backwards compatible to Bluetooth classic and well suited for
gateway applications, but is not practical for low power devices.
4. APPLICATIONS FOR THE MODULE
All Embedded Wireless Applications
Wearable Devices
Health Care, Medical Diagnostic Systems
Mobile phone accessories
Industrial Measurement and Diagnostics
Devices where Power Consumption is critical
5. DESCRIPTION FOR THE MODULE
The PAN1761 is a short-range, Class 2, BLE single mode module for implementing Bluetooth functionality
into various electronic devices. A block diagram can be found in chapter 6.3.
The PAN1761 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy
applications. It enables robust BLE central and peripheral nodes to be built with very low total bill-of-material
costs. The PAN1761 combines an excellent RF transceiver programmable EEPROM memory, 32-KB RAM,
and many other powerful supporting features and peripherals. The PAN1761 is suitable for systems where
very low power consumption is required. Very low-power sleep modes are available. Short transition times
between operating modes further enable low power consumption.
Panasonic PAN1761 offers an embedded and certified Bluetooth low energy protocol stack and BLE GATT
profile inside the silicon device from Toshiba. The Bluetooth low energy protocol stack from Toshiba, is a
flexible and cost-effective single-mode Bluetooth low energy solution. Standard BLE or proprietary profiles
are available for seamless integration into the application code.
Please contact your local Panasonic Sales office for details on additional product options and services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit
https://na.industrial.panasonic.com/distributors
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
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6. PAN1761 DETAILED DESCRIPTION
6.1. PIN ASSIGNMENT
Top View, Application PCB
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
CLASSIFICATION
PRODUCT SPECIFICATION
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REV.
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SINGLE MODE MODULE
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6.2. PIN FUNCTIONS
No
PIN Name
Alternative PIN
Pin Type
Description
A1
GND
Ground Pin
Connect to Ground
A2
NC
Not Connected
A3
Reset
Digital Input
Reset, active-low
A4
VCC
Power
2V – 3.6V analog/digital power supply connection
A5
VCC
Power
2V – 3.6V analog/digital power supply connection
A6
VCC
Power
2V – 3.6V analog/digital power supply connection
A7
GND
Ground Pin
Connect to Ground
A8
NC
Not Connected
A9
GND
Ground Pin
Connect to Ground
A11
GND
Ground Pin
Connect to Ground
A12
GND
Ground Pin
Connect to Ground
B1
NC
Not Connected
B2
TAG_L0
NFC_Antenna
B3
TAG_SCL
NFC_I2C
B4
NC
Not Connected
B5
NC
Not Connected
B6
NC
Not Connected
B7
NC
Not Connected
B8
NC
Not Connected
B9
NC
Not Connected
C1
NC
Not Connected
C2
TAG_L1
NFC_Antenna
C3
TAG_RFDET
Digital Out
C4
NC
Not Connected
C5
NC
Not Connected
C6
TAG_READYX
Digital Out
C7
TAG_SDA
PWM2
NFC_I2C
C8
GND
Ground Pin
Connect to Ground
C9
GND
Ground Pin
Connect to Ground
D1
NC
Not Connected
D2
NC
Not Connected
D3
GPIO1
AIN0
Digital I/O
D4
Wakup
GPIO0
Digital I/O
D5
NC
Not Connected
D6
TAG_PONX
Digital In
D7
GND
Ground Pin
Connect to Ground
D8
GND
Ground Pin
Connect to Ground
D9
NC
Not Connected/Placeholder for Antenna
E1
GPIO8
SDA
Digital I/O
Connected to internal EEPROM
E2
GPIO7
SCL
Digital I/O
Connected to internal EEPROM
E3
NC
Not Connected
E4
NC
Not Connected
E5
TAG_RECTOUT
E6
UART_RXD
GPIO4
Digital In
E7
GPIO2
PWM0/AIN1
Digital I/O
E8
GND
Ground Pin
Connect to Ground
E9
GND
Ground Pin
Connect to Ground
F1
GND
Ground Pin
Connect to Ground
F2
EEPROM_WP
Digital In
EEPROM write protect /active low
F3
NC
Not Connected
F4
NC
Not Connected
F5
GPIO6
UART_1-CTS/
UART2-RX
Digital In
Can be configured to UART2_RXD
F6
SLEEPXCLKIN
Clock
32.768 KHz sleep clock input
F7
UART_TXD
GPIO3
Digital Out
F8
GPIO5
UART1_RTS/
UART2-TX
Digital I/O
Can be configured to UART2_TXD
F9
GND
Ground Pin
Connect to Ground
F11
GND
Ground Pin
Connect to Ground
F12
GND
Ground Pin
Connect to Ground
CLASSIFICATION
PRODUCT SPECIFICATION
No.
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REV.
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SINGLE MODE MODULE
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6.3. BLOCK DIAGRAM
Toshiba
Single Mode
Bluetooth LSI
EEPROM
Crystal
26
MHz
Filter
VCC
/
VSS
Slow
Clock
32
.
768
kHz
UART
GPIO
Wake Up Input
/
Output
NFC Wake Up
BLE Antenna
Toshiba
NFC
–
TAG
I
2
C Tag Memory
PAN
1761
External NFC Antenna
CLASSIFICATION
PRODUCT SPECIFICATION
No.
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REV.
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SINGLE MODE MODULE
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7. Test Conditions
Measurements shall be made under operating free-air temperature range unless otherwise specified.
Temperature 25 ± 10°C
Humidity 40 to 85%RH
Supply Voltage 3.3V
8. GENERAL DEVICE REQUIREMENTS AND OPERATION
All specifications are over temperature and process, unless indicated otherwise.
8.1. ABSOLUTE MAXIMUM RATINGS
No
See 2
Value
Unit
Ratings Over Operating Free-Air Temperature Range
1
Voltage on any digital pin
–0.3 to
VDD+0.3
V
2
Operating ambient temperature range
–30 to 85
°C
3
Storage temperature range
–30 to 125
°C
4
Bluetooth RF inputs
10
dBm
5
ESD:
All pads, according to human-body model, JEDEC STD 22, method A114
According to charged-device model, JEDEC STD 22, method C101
1000
500
V
8.2. RECOMMENDED OPERATING CONDITIONS
No
Rating
Min
Typ
Max
Unit
1
Power supply voltage
2.0
3.3
3.6
V
2
Maximum ambient operating temperature
-30
85
C
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
CLASSIFICATION
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SINGLE MODE MODULE
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8.4. POWER UP SEQUENCE
When the power is turned on, set reset signal to low (RESET=Low). After OSC is stable,
release reset (RESET=High).
Crystal oscillator stabilizing time is about 2 msec, so define release time after sufficient
evaluation.
When the power is turned off, set reset signal to low (RESET=Low).
8.5. PAN1761 CURRENT CONSUMPTION
The current consumption is dependent on the user scenario and the setup and timing in the
low power modes. The total power consumption can be optimized by adjusting advertising
and connection intervals. It also depends on the system configuration of the central device
(typically mobile phone or BLE hub).
VDD power supply
Reset signal
DCDC / LDO output
Power off
OSC boot timer
Operation
Power on
voltage
detection
RC delay
Reference clock
Stable
Unstable
CLASSIFICATION
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9. BLUETOOTH RF PERFORMANCE
9.1. PAN1761 BLUETOOTH CHARACTERISTICS
No
Characteristics
Condition
Min
Typ
Max
Unit
1
Operation frequency range
2402
2480
MHz
2
Channel spacing
2
MHz
3
Output Power
Maximum setting, measured at single
ended 50ohm.
0
dBm
4
Sensitivity, High Gain Mode
High-gain mode, measured at single
ended 50ohm.
-90.0
dBm
9.2. PAN1761 NFC TAG INTERFACE
PAN1761 has a NFC Forum Type 3 Tag (NFC Tag) function built-in.
Features of PAN1761 NFC interface:
Built-in Contactless IC Card Technology
Wireless interface:Automatic detection of transmission speed 212kbps and 424kbps
I2C interface: Maximum operational clock 400kHz
Built-in EEPROM: General user area 1520 bytes, Protecting against defective data
Writing time:5ms(typ.),1bit error automatic correction , CRC automatic addition, and
error detection of read data.
Security:Mutual authentication with Message authentication code (MAC), Variety
access attributes can be set. Writing prohibition, reading after authentication, writing
after authentication, writing with MAC
Technology refers to the following standards : JIS X 6319-4, ISO/IEC 18092
Basic technical characteristics are in table below:
No
Item
Remarks
1
Data transmission format
Half Duplex,synchronization
2
Carrier Frequency
13.56MHz
2
Data transmission speed
212,424 Kbit/s (Automatic detection)
3
Modulation
ASK
4
Coding
Manchester
5
Bit order
MSBF
CLASSIFICATION
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9.3. NFC OPERATIONAL SEQUENCE
If a wireless carrier is detected, TAG_RFDET pin outputs high level. If the wireless carrier
disappears, TAG_RFDET pin turns back to low level due to pull-down resistance. Set
VDDIO and VDD pin to output high (power supply).. At Write without Encryption or Read
without Encryption, if IDm stored in PAN1761 chip and iDm with command are consistent,
TAG_READYX pin outputs high level. After that, during supply of internal power source,
the high is kept. VDDIO and VDD pin needs power supply for TAG_READYX pin to output
high.
By becoming high in TAG_READYX pin, HOST can get to know that wireless reader
writer accesses PAN1761 module.
Sequence example of operation over the wireless TAG interface
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10. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
10.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
Temp.[°C]
Time [s]
235°C max.
220 5°C
200°C
150 10°C
90 30s
10 1s
30 +20/-10s
10.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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11. PAN1761 MODULE DIMENSION
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
0.30
2
Length
15.60
0.30
3
Height
1.80
0.20
With case
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12. FOOTPRINT OF THE MODULE
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.3mm.
Top view, Application PCB
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
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13. CASE MARKING
13.1. EXAMPLE FOR MARKING
13.2. MARKING DEFINITION
(1) Pin1 marking
(2) 2D code (Serial number)
(3) Marking:
PAN1761 (Model Name), HW/SW (Hardware/Software version)
ENW89848A1KF (Part Number, refer to chapter 19 Ordering Information)
Lot code (YearYear, WeekWeek, Day, LotLot)
ES (Engineering Sample marking)
Note: For available Software Versions, refer to [1] PAN1761ETU Design-Guide.
and chapter 19 Ordering Information.
14. MECHANICAL REQUIREMENTS
No.
Item
Limit
Condition
1
Solderability
More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature profile
2
Resistance to soldering
heat
It shall be satisfied electrical requirements and not
be mechanical damage
See chapter 10.2
No.
Remark
1
Marking for Pin 1 (Circle 0,15 mm)
2
2D-Code, for internal usage only and
can be change without any notice
3
Marking definition see below
P A N 1 7 6 1 H W / S W
E N W 8 9 8 4 8 A 1 K F
Y Y W W D L L
1
2
3
CLASSIFICATION
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15. DEVELOPMENT OF APPLICATIONS
For development support please refer to [1] PAN1761ETU Design-Guide.
16. RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1 hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
3
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4
Moisture test
the same as above
+60°C, 90% RH, 300h
5
Low temp. test
the same as above
-40°C, 300h
6
High temp. test
the same as above
+85°C, 300h
17. CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions
and damage to the product.
17.1. DESIGN NOTES
(1) Follow the conditions written in this specification, especially the control signals of
this module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery
or a low noise regulator output). For noisy supply voltages, provide a decoupling
circuit (for example a ferrite in series connection and a bypass capacitor to ground
of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life
of these products.
(5) Avoid assembly and use of the target equipment in conditions where the products'
temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry
noise and/or spikes.
(7) Keep this product away from other high frequency circuits.
CLASSIFICATION
PRODUCT SPECIFICATION
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17.2. INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the temperature at the soldering portion of this product according to this
reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to
the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact between
the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair the board by hand soldering, follow the conditions set forth in this
chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause
damage to the unit.
(10) For more details on LGA (Land Grid Arrey) soldering processes refer to the
application note.
17.3. USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, check and evaluate their operation befor assembly on the final
products.
(2) Do not use dropped products.
(3) Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this
product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered
on PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will
cause damage.
(7) These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information and
communication equipment.
CLASSIFICATION
PRODUCT SPECIFICATION
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17.4. STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C
to 35°C range, or where the humidity may be outside the 45 to 85% range.
Storage of the products for more than one year after the date of delivery Storage
period: Please check the adhesive strength of the embossed tape and soldering
after 6 months of storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
17.5. SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and
individual components.
Before use, check and evaluate the operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may short-
circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
17.6. OTHER CAUTIONS
(1) This specification sheet is copyrighted. Please do not disclose it to a third party.
(2) Please do not use the products for other purposes than those listed.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of
the product.
(4) This product has been manufactured without any ozone chemical controlled under
the Montreal Protocol.
(5) These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special conditions
carefully to determine whether or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs.
In an environment with a high concentration of harmful gas (e.g. salty air, HCl,
CLASSIFICATION
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Cl2, SO2, H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other components
or circuits, replace these products with new products because they may not be
able to provide normal performance even if their electronic characteristics and
appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Panasonic.
CLASSIFICATION
PRODUCT SPECIFICATION
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www.pideu.panasonic.de
18. PACKAGING
If the product has mass production status, indicated in chapter 21, we will deliver the module in the package
which are described below.
18.1. PAN1761 TAPE DIMENSION
CLASSIFICATION
PRODUCT SPECIFICATION
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18.2. PACKING IN TAPE
Empty spaces in component packed area shall be less than two per reel and those spaces
shall not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
18.3. COMPONENT DIRECTION
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
100730-PAN1720.vsd
Direction of
unreeling
(for customer)
Pin 1 Marking
(Top Side)
Pin 1 Marking
(Bottom Side)
Square Pin, all the
others are round.
CLASSIFICATION
PRODUCT SPECIFICATION
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18.4. REEL DIMENSION
CLASSIFICATION
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18.5. LABEL FOR PACKAGE
The picture shows an example from similar product.
(1T) Lot code [YYWWDLL] Example from above:
YY year printed 08
WW normal calendar week printed 01
D day printed 5 (Friday)
L line identifier, if more as one printed 1
L lot identifier per day printed 1
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code: ENW89848A1KF
(9D) Date code as [YYWW]
(Q) Quantity [XXXX], variable max. 1500
(HW/SW) Hardware /Software Release
Hardware 01 Indicates the HW revision.
Software 01 Indicates the SW revision.
18.6. TOTAL PACKAGE
PAN1315
Customer Code ENW89818C2JF
105 mm
51 mm
barcode
label
moisture-sensitive print
(already exist on barrier bag) barcode
label
desiccant 1) 2)
moisture indicator
barrier bag
sealed
inner carton box
size 340 x 340 x 41 mm³
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
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CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
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DATE
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www.pideu.panasonic.de
19. ORDERING INFORMATION
Ordering part number
Description
MOQ (1)
ENW89848A1KF (2)
PAN1761
CLASS 2 Bluetooth single mode Module according BT-4.1.
Bluetooth® low energy device + NFC
1500
Notes:
(1) Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 1500
pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity
via the distribution channels.
(2) Samples are available on customer demand.
20. ROHS AND REACH DECLARATION
Hereby we declare to our best present knowledge based on declaration of our suppliers that this product
follows the latest official RoHS and REACH Directive.
For the most updated one, please refer to [3].
21. DATA SHEET STATUS
This data sheet contains the final specification.
Panasonic reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
22. HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
0.1
November 2015
1st preliminary version.
0.2
January 2016
PIN Table correction.
0.3
February 2016
Minor changes.
0.6
23.08.2016
Bluetooth 4.1
0.7
3.11.2016
Changes in power supply values and conditions during measurement of output power and
sensitivity
1.0
January 2017
Final version
1.1
March 2017
Updated temperature range
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www.pideu.panasonic.de
23. RELATED DOCUMENTS
For an update, please search in the suitable homepage.
[1] PAN1761ETU Design-Guide
http://www.pideu.panasonic.de
[2] Application Note Land Grid Array
http://www.pideu.panasonic.de/pdf/184ext.pdf
[3] Toshiba Product Page – General information
http://toshiba.semicon-storage.com/eu/product/wireless-communication/bluetooth.html
[4] Toshiba SDK and Developer Zone
https://apps.toshiba.de/web/SDKRegistration/
[5] REACH and RoHS Certificate
http://www.pideu.panasonic.de/pdf/182ext2.jpg
CLASSIFICATION
PRODUCT SPECIFICATION
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24. RADIATION PATTERN OF ANTENNA
CLASSIFICATION
PRODUCT SPECIFICATION
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SINGLE MODE MODULE
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DATE
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www.pideu.panasonic.de
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1761-2400-102
REV.
1.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY + NFC
SINGLE MODE MODULE
PAGE
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DATE
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PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
25. GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH 2012.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver ES samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
deviation or lapse in function of Engineering Sample,
improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages.
In case of any questions, please contact your local sales partner or the related product
manager.
26. LIFE SUPPORT POLICY
This Panasonic product is not designed for use in life support appliances, devices, or systems
where malfunction can reasonably be expected to result in a significant personal injury to the
user, or as a critical component in any life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness. Panasonic customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Panasonic for any damages
resulting.

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