Panasonic Devices Europe 4561HM 802.15.4-Modem PAN4561 User Manual 1

Panasonic Industrial Devices Europe GmbH 802.15.4-Modem PAN4561 1

UserMan

CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   1  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY  Product Specification  Applicant / Manufacturer Hardware Panasonic Electronic Devices Europe GmbH Zeppelinstrasse 19 21337 Lüneburg Germany   Applicant / Manufacturer Software Synapse Wireless Inc. SNAP Software        or E-Senza Technologies GmbH SN55 AT Command Set   or Freescale based SMAC test software for production    or your own written software Software Version  Contents Approval from customer by signature   Customer       By signing this document, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein.   CHECKED / APPROVED: DATE: NAME: SIGNATURE:  NOTE: AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO THE ADDRESS OF THE ISSUING PARTY.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   2  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY TABLE OF CONTENTS  1. Key Features ................................................................................................................... 4 2. Applications for the Module ............................................................................................. 4 3. Description of the Module ................................................................................................ 5 4. Scope of this Document .................................................................................................. 6 5. History for this Document ................................................................................................ 6 6. Terminal Layout ............................................................................................................... 7 7. Block diagram .................................................................................................................. 9 7.1. Software differences ............................................................................................ 10 7.1.1. Test / Demo software .............................................................................. 10 7.1.2. E-Senza software .................................................................................... 10 7.1.3. Synapse software ................................................................................... 10 8. Key Parts List ................................................................................................................ 11 9. Test Conditions ............................................................................................................. 11 10. Absolut maximum ratings .............................................................................................. 12 11. Operating Conditions ..................................................................................................... 12 12. DC electrical characeristics ........................................................................................... 13 13. A/D converter Characteristics ........................................................................................ 14 14. AC Electrical Characteristics ......................................................................................... 14 15. Soldering Temperature - Time Profile (for reflow soldering) ......................................... 16 15.1. For lead solder ..................................................................................................... 16 15.2. For lead free solder .............................................................................................. 16 16. Module Dimensions ....................................................................................................... 17 17. FootPrint of the Module ................................................................................................. 17 18. Laser marking ................................................................................................................ 18 19. Mechanical Requirements ............................................................................................. 18 20. Recommended Land Pattern ........................................................................................ 19 21. Reliability Tests ............................................................................................................. 20 22. Cautions ........................................................................................................................ 20 22.1. Design Notes........................................................................................................ 20 22.2. Installation Notes .................................................................................................. 20 22.3. Usage Conditions Notes ...................................................................................... 21 22.4. Storage Notes ...................................................................................................... 22 22.5. Safety Cautions .................................................................................................... 22 22.6. Other cautions ...................................................................................................... 22 23. Packaging ...................................................................................................................... 24 23.1. Tape Dimension ................................................................................................... 24 23.2. Packing in Tape ................................................................................................... 24 23.3. Component direction ............................................................................................ 25 23.4. Reel Dimension .................................................................................................... 25
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   3  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 23.5. Label for Package ................................................................................................ 26 23.6. Total Packing Handling ........................................................................................ 27 23.7. Cover tape reel strength ....................................................................................... 27 24. Ordering Information ..................................................................................................... 28 24.1. PAN4561H ........................................................................................................... 28 24.2. PAN4561M ........................................................................................................... 29 24.3. PAN4561L ............................................................................................................ 29 25. RoHS Declaration .......................................................................................................... 30 26. Data Sheet Status ......................................................................................................... 30 27. Regulatory Information .................................................................................................. 30 27.1. FCC Notice ........................................................................................................... 30 27.2. Caution ................................................................................................................. 31 27.3. Labeling Requirements ........................................................................................ 31 27.4. Antenna Warning ................................................................................................. 31 27.5. Approved Antenna List ......................................................................................... 32 27.6. RF Exposure PAN4561 ........................................................................................ 32 28. Related Documents ....................................................................................................... 33 29. General Information ....................................................................................................... 34 30. Life Support Policy ........................................................................................................ 34
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   4  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 1.  KEY FEATURES    Short range 2.4GHz ISM band transceiver with microcontroller and reference oscillator   Provides complete hardware for a wireless node using IEEE802.15.4 packet structure   Compact size (35.0mm x 15.0mm x 3.8mm)   3 antenna options: ceramic antenna onboard, ext. antenna connected to Single port 50Ω or antenna plug   16 selectable Channels with 250 kbps in the 2.4 GHz band   Low power modes for increased battery life   High sensitivity of -102 dBm typ. at 1% Packet Error Rate (PAN4561H /M)  +20 dBm max. output power (PAN4561H)   Programmable output power over a 30 dB range    Low supply voltage (2.7V to 3.4 V, 3.0 V typ.)   Operating temperature range -40°C to +85°C   Link Quality and Clear Channel Assessment capability   60k Flash and 4k RAM memory   8 channel A/D converter with 10 Bit for fast and easy conversion from analog inputs -such as temperature, pressure and fluid levels- to digital values.   5 channel 16 Bit timer/pulse width modulation (TPM) outputs   BDM port for direct download programming   In total 39 digital I/O lines most with programmable pull-ups and few with high-current driver.   Low power modes for increased battery life   Low battery warning   Low voltage detect/reset   Complies to FCC Part 15   2.  APPLICATIONS FOR THE MODULE     Wireless sensor and actuator networks   Remote control and wire replacement in industrial systems   Factory and home automation and control   Inventory and logistics management   HID (Human Interface Devices)   Toys   Home gateways   Proprietary networking solutions using IEEE802.15.4
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   5  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 3.  DESCRIPTION OF THE MODULE  The PAN4561with  module is a short range, low power, 2.4 GHz ISM band transceiver which includes a complete 802.15.4 physical layer (PHY) modem, designed for the IEEE 802.15.4 wireless standard and an appropriate microcontroller (MCU) with reference oscillator which provides a cost effective solution for short-range data links and networks. There are three versions of PAN4561 available, identified by an H, M or L at the end of series number i.e. PAN4561H, PAN4561M, PAN4561L. The addional letter stands for High, Mid and Low range.  All modules in the PAN4561 series are based on the FreeScale MC13213 SOC, fully featured with 39 I/O lines, interchangeable and share a common footprint and software.  Mixed node networks can be implemented to conserve power while maximizing range. The PAN4561L is a cost optimized module designed for standard range applications of less than 30 meters.  For medium range applications the PAN4561M, is optimized to deliver longer range and conserve power consumption, using a low noise amplifier and 10dBm power amplifier.  The PAN4561H is designed for extended range applications, using a low noise amplifier and 20dBm power amplifier.   In this document when mentioned PAN4561 the information refers to all three module types. Data which apply only to a specific module (PAN4561 H /M /L) will be marked accordingly. Software solutions available for the PAN4561 are SNAP software from Synapse Wireless Inc. and SN55 software from E-Senza Technologies GmbH which are very easy to use. For detailed information refer to SNAP [9] and and to SN55 [8]. In addition, you are free to develop also your own application on the software package from Freescale™, e.g. SMAC, for details please refer to [4], [5], [6] and [7]. For the Integrated Development Environment (IDE) the MetrowerksPTM PCodeWarrior IDE from Hwww.metrowerks.com is required. For device flash programming via the BDM port of PAN4561 the USB HCS08/HCS12 Multilink from www.pemicro.com is recommended.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   6  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 4.  SCOPE OF THIS DOCUMENT  This product specification applies to the IEEE 802.15.4 Standard modem ENWC9A22xxEF. The xx is the indicator for different versions (refer to chapter 25 Ordering Information). The platform used is the MC13213 from the US company Freescale Semiconductor www.freescale.com/ [2], [3]  5.  HISTORY FOR THIS DOCUMENT  Revision Date Modification / Remarks A 09.03.2009 Initial draft version B 20.03.2009 Some minor changes, regarding the specification wording C 29.04.2009 Change chapter 24, ordering code for Synapse software. Change the crystal value from 26MHz to 16MHz in chapter block diagram, as it was a mistake in this document. D 08.09.2009 Change chapter 7, regarding hardware dependent software. E 06.04.2010 Datasheet updated for 4561 PCB revision C (Prelimenary) F 31.05.2010 Added chapter 27 Regulatory Information. Minor changes of module parameters.  G 06.08.2010 Added data for PAN4561M and  PAN4561L H 17.09.2010 Changed receive current consumption values.  I 28.01.2014 Add FCC marking
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   7  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 6.  TERMINAL LAYOUT Antenna35.0 mm15.0 mmHeight3.8 mmTop View2232Pad 1 =   4 x 1.30mm x 1.30mmPad 2 = 58 x 0.60mm x 1.30mm153 Please refer also to the MC1321x technical data sheet and reference manual, which is given in [2] and [3] in the chapter “Related Documents”.  Pin No. Pin Pin Type Description 1 GND I/O Ground 2 PTD4 / TPM2CH1 Dig. I/O MCU Port D Bit 4 / TPM2 Channel 1 3 PTD5 / TPM2CH2 Dig. I/O MCU Port D Bit 5 / TPM2 Channel 2 4 PTD6 / TPM2CH3 Dig. I/O MCU Port D Bit 6 / TPM2 Channel 3 5 PTD7 / TPM2CH4 Dig. I/O MCU Port D Bit 7 / TPM2 Channel 4 6 PTD2 / TPM1CH2 Dig. I/O MCU Port D Bit 2 / TPM1 Channel 2 7 NC  Not connected – leave open 8 PTC0 / TXD2 Dig. I/O MCU Port C Bit 0 / SCI2 TX data out (UART2) 9 PTC1 / RXD2 Dig. I/O MCU Port C Bit 1 / SCI2 RX data in (UART2) 10 PTC2 / SDA1 Dig. I/O MCU Port C Bit 1/ IIC bus data (I²C) 11 PTC3 / SCL1 Dig. I/O MCU Port C Bit 1/ IIC bus clock (I²C) 12 PTB0 / AD1P0 I/O MCU Port B Bit 0 / ATD analog Channel 0 13 PTB1 / AD1P1 I/O MCU Port B Bit 1 / ATD analog Channel 1 14 PTB2 / AD1P2 I/O MCU Port B Bit 2 / ATD analog Channel 2 15 PTB3 / AD1P3 I/O MCU Port B Bit 3 / ATD analog Channel 3 16 PTB4 / AD1P4 I/O MCU Port B Bit 4 / ATD analog Channel 4 17 PTB5 / AD1P5 I/O MCU Port B Bit 5 / ATD analog Channel 5 18 PTB6 / AD1P6 I/O MCU Port B Bit 6 / ATD analog Channel 6 19 PTB7 / AD1P7 I/O MCU Port B Bit 7 / ATD analog Channel 7 20 VREFH I MCU high reference voltage for ATD 21 VREFL I MCU low reference voltage for ATD 22 GND I/O Ground 23 Vcc Power I Modem voltage regulators’ input 24 Vcc Power I Modem voltage regulators’ input 25 PTG1 / XTAL Dig. I/O / O MCU Port G Bit 1 / Crystal oscillator output P(2)P
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   8  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY Pin No. Pin Pin Type Description 26 PTG2 / EXTAL Dig. I/O / I MCU Port G Bit 2 / Crystal oscillator input P(2)P (3).(4)  27 RESET Dig. I MCU reset. Active low 28 CLKO Dig. O Programmable Clock Output (default: 32,768 kHz)P (3) 29 GPIO2 Dig. I/O GPIO2 from RF transceiver unit 30 PTG0 / BKGND / MS Dig. I/O MCU Port G Bit 0 / Background / Mode Select P(1)P 31 GPIO1 Dig. I/O GPIO1 from RF transceiver unit 32 GND I/O Ground 33 VDDA Power O Modem analog regulated supply output - leave open 34 PTA7 / KBI1P7 Dig. I/O MCU Port A Bit 7 / Keyboard Input Bit 7 35 PTA6 / KBI1P6 Dig. I/O MCU Port A Bit 6 / Keyboard Input Bit 6 36 PTA5 / KBI1P5 Dig. I/O MCU Port A Bit 5 / Keyboard Input Bit 5 37 PTA4 / KBI1P4 Dig. I/O MCU Port A Bit 4 / Keyboard Input Bit 4 38 PTA3 / KBI1P3 Dig. I/O MCU Port A Bit 3 / Keyboard Input Bit 3 39 PTA2 / KBI1P2 Dig. I/O MCU Port A Bit 2 / Keyboard Input Bit 2 40 PTA1 / KBI1P1 Dig. I/O MCU Port A Bit 1 / Keyboard Input Bit 1 41 PTA0 / KBI1P0 Dig. I/O MCU Port A Bit 0 / Keyboard Input Bit 0 42 PTC7 / GPIO Dig. I/O MCU Port C Bit 7 (GPIO) 43 PTC6 / GPIO Dig. I/O MCU Port C Bit 6 (GPIO) 44 PTC5 / GPIO Dig. I/O MCU Port C Bit 5 (GPIO) 45 PTC4 / GPIO Dig. I/O MCU Port C Bit 4 (GPIO) 46 PTE0 / TXD1 Dig. I/O MCU Port E Bit 0 / SCI1 TX data out (UART1) 47 PTE1 / RXD1 Dig. I/O MCU Port E Bit 1/ SCI1 RX data in (UART1) 48 GPIO5 Dig. I/O GPIO5 from RF transceiver unit 49 GPIO6 Dig. I/O GPIO6 from RF transceiver unit 50 GPIO7 Dig. I/O GPIO7 from RF transceiver unit 51 NC  Not connected – leave open 52 NC  Not connected – leave open 53 - 54 GND I/O Ground 55 EXANT I/O Pin for external antenna (50 ) 56 - 62 GND I/O Ground  Note: (1)  PTG0 is output only. Pin is I/O when used as BDM function. (2)  Full I/O when not used as clock source. Please refer also to [2]. (3)  CLKO (Pin 28) and PTG2/EXTAL (Pin 26) must be connected when the programmable clock derived from the internal 16 MHz crystal. Do not connect when the clock derived from Internal Reference Generator in MC13213. (4)  PTG2 / EXTAL is not accessible with E-Senza software  Port PTA, PTB, PTC, PTD, PTE, PTG have internal software controlled pull-up resistors. For detailed information refer to [3]. All I/O pins of port PTC are high current pins. The maximum current for all pins together must not exceed 60mA. A continuous current of 7mA, and 25mA burst for each port pin must not be exceeded. For detailed information refer to [3].
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   9  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 7.  BLOCK DIAGRAM  PAN4561H / PAN4561M  Crystal16 MHzserialcommunicationRx / TxMatchingBP- FilterBottomPadHirosePlugCeramicAntennaTimer/PWMA/DBKGDSCI1 & 2Port A ... E, GLogic IOsActuatorsSensorsResetWake UpProgrammingEXANTPIN55MC13213RF Transceiver& µCGPIO4LNA H/L gainPA/LNA EnableGPIO3  RF TransceiverCC2591-CC2590RF Frontend(LNA & PA)PAENENHGMRF transceiver GPIOs GPIO1,2,5,6,7CT_BiasRXTXRX/TX The RF frontend IC CC2591 / CC2590 is controlled with GPIO3, GPIO4 and CT_Bias from RF transceiver unit (see above block diagram).  PAN4561L Crystal16 MHzserialcommunicationRx / TxMatchingBalunBottomPadHirosePlugCeramicAntennaTimer/PWMA/DBKGDSCI1 & 2Port A ... E, GLogic IOsActuatorsSensorsResetWake UpProgrammingEXANTPIN55MC13213RF Transceiver& µCGPIO4GPIO3  RF TransceiverRF transceiver GPIOs GPIO1,2,5,6,7CT_Bias The MC13213 is used in single port configuration with its internal Tx/Rx switch. For more details refer to chapter 7.1.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   10  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 7.1.  SOFTWARE DIFFERENCES 7.1.1.  Test / Demo software Modules with Test / Demo software are intended for customer writing their own software for the module. The module contains software but only with a small instruction set. The front end IC CC2591 / CC2590 is enabled and disabled with RF transceiver GPIO4. Set high to enable and low to disable the chip. Please refer to appendix [10]. The LNA has two modes, high and low gain. This mode is controlled with RF transceiver GPIO3. Set it high for high gain and low for low gain mode. Please refer to appendix [10]. The RXTX signal on CC2591 and CC2590 is controlled by CT_Bias pin. Please refer to appendix [10]. 7.1.2.  E-Senza software Modules with E-Senza software can be used to set up a measurement system easily with a GUI.  With this software it is not possible to set the modules into energy saving sleep mode. 7.1.3.  Synapse software With Synapse software the customer writes his own scripts based on easy to learn, Phyton based, programming language. This software is very flexible and can be used for multiple applications. The control of PA/LNA is primary supported from version SNAPv2.2.15 or newer. The Synapse software on the module provides several initializing parameters called NV-parameters. These are already set. For detailed information refer to SNAP Reference Manual [9]. To comply to FCC regulation the power level has to be reduced to txPwr(14) for PAN4561H. For detailed information on FCC compliance refer to chapter 27. Regulatory Information. Synapse Wireless Inc. probably releases two to three times a year a new SNAP release. PAN4561 modules will always be shipped with the newest SNAP version.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   11  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 8.  KEY PARTS LIST  Part Name Material P.W.Board Glass cloth epoxide resin with gold plating Casing Material: BZn15-20, thickness 0.15mm IC part name MC13213 (Freescale www.freescale.com/) All information are based on [2] chapter 28 CC2591 / CC2590 (Texas Instruments www.ti.com) All information are based on [10] chapter 27.  9.  TEST CONDITIONS  Measurements are made under room temperature and humidity unless otherwise specified. Temperature 25 ± 10°C  Humidity    40 to 85%RH Supply voltage  3.0V
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   12  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 10. ABSOLUT MAXIMUM RATINGS  The maximum ratings may not be exceeded under any circumstances (not even momentarily) as permanent damage to the module will result. No. Item Symbol Absolute Maximum Ratings Unit 1 Supply voltage VBCCB -0.3 to +3.6 Vdc 2 Ripple on VBCCB VccBripB tbd (2) (ripple frequency ≥200kHz) mVpp 3 Digital input voltages VBinB -0.3 to VBCCB+0.3 Vdc 4 Instantaneous maximum current Single pin limit for all digital I/O pins P(1)P IBDB 25 mAdc 5 Storage temperature range TBstgB -40 to +105 °C 6 Operating temperature range TBopB -40 to +85 °C 7 RF Input Power PBmaxB 10 dBm 8 ESD on any pin except for pin 32 EXANT. Human Body Model (HBM) VBTHHBMB 2 kV 9 Moisture Sensitivity Level MSL 3 (168 hours)  Notes: (1)  Input must be current limited to the value specified. Please refer also to [2]. (2)  The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, please provide a decoupling circuit (for example a ferrite in series connection and a blocking capacitor to ground of at least 47µF directly at the module). The exact ripple tolerance will be published in a later revision.  11. OPERATING CONDITIONS No. Item Condition / Remark Symbol Value Unit     Min Typ Max  1 Supply voltage The typical value is recommended  VBCCB 2.7 3.0 3.4 Vdc 2 RF Input Frequency   fBinB 2400  2483.5 MHz 3 Return loss of load at pin 55 EXANT Receive/Transmit Mode to 50Ω reference load a -9.5   dB 4 Logic Input Voltage Low  VBILB 0  0.3xVBCCB V 5 Logic Input Voltage High  VBIHB 0.7xVBCCB  VBCCB V 6 SPI clock rate The typical value is  recommended fBSPIB - - 8.0 MHz 7 Operating temperature range  TBopB -40   +85 °C
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   13  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 12. DC ELECTRICAL CHARACERISTICS Assume VBCCB = 3.0V, TBambB = 25°C if nothing else stated No. Item Condition / Remark Symbol  Module type Value Unit           Min Typ Max   1 Transmit current consumption Transmit Mode(8) IBCCTB PAN4561H @ 20dBm(1) - 200 240 mA  PAN4561M @ 10dBm - 72 80 PAN4561L @ 0dBm - 43 50 2 Receive current consumption Receive Mode(8)(8) IBCCRB PAN4561H - 60 70 mA  PAN4561M - 60 70 PAN4561L - 60 70 3 Low power current consumption Off(2)(4)(4) IBleakageB PAN4561H - 0.55 ‘- µA  PAN4561M - 0.55 ‘- PAN4561L - 0.55 ‘- Sleep(2)(5)(9) IBCCHB PAN4561H - 2.2 ‘- µA  PAN4561M - 2.2 ‘- PAN4561L - 2.2 ‘- Standby(2)(3)(6)(9) IBCCDB PAN4561H - 36,3 ‘- µA  PAN4561M - 36,3 ‘- PAN4561L - 36,3 ‘- Idle(7)(7) IBCCIB PAN4561H - 1.6 ‘- mA  PAN4561M - 1.6 ‘- PAN4561L - 1.6 ‘- 4 digital I/O pin characteristics Please refer to [2] 6.3.1 MCU DC Characteristics 6 Low voltage warning/detection Please refer to [2] 6.3.1 MCU DC Characteristics Power on reset re-arm voltage  Notes: (1)  SPI Register 12 has a value of 0xDC which sets output power to nominal value. (2)  To attain specified low power current, all GPIOs and other digital IO must be handled properly. Set all port pins as output low when left open or as input when connected to defined level.  Detailed descriptions can be found at [2] at section 7.2 Low Power Considerations. (3)  CLKO frequency is set to a default value of 32.786 kHz. (4)  Off mode: Stop1 on µC, Modem off [3]. Wakeup by IRQ or Reset (5)  Sleep mode: Stop2 + RTC on µC, Modem Hibernate [3]. Wakeup by IRQ, Reset or Real-Time-Interrupt (6)  Standby mode: Stop3 + RTC on µC, Modem Doze [3]. Wakeup by IRQ, Reset, RTI or Keyboard Interrupt (7)  Idle mode: µC runs at reduced 2 MHz clock, Modem is in Idle state [3] (8)  µC runs in full speed mode (16 MHz clock) (9)  RTC requires external 32 kHz crystal. Without RTC 300nA less current
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   14  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 13. A/D CONVERTER CHARACTERISTICS  No Item Remark 1 ATD characteristics Please refer to [2] 6.3.3 MCU ATD Characteristics 2 ATD timing/performance characteristics Please refer to [2] 6.3.3 MCU ATD Characteristics  The A/D high reference voltage VREFH is connected to pin 20 (VREFH). Connect this signal primarily to Vcc. The A/D low reference voltage VREFL is connected to pin 21 (VREFL). Connect this signal primarily to GND  14. AC ELECTRICAL CHARACTERISTICS VBCC B= 3.0V, TBambB = 25°C, 50 load at EXANT, for all channel numbers 11,12,..., 26 according to [1] No Receiver Module type Limit Unit       Min Typ Max   1 Sensitivity for 1% Packet Error Rate (PER),  -85dBm required by [1] PAN4561H -85 -102 -105 dBm PAN4561M -85 -102 -105 PAN4561L -85 -92 - 2 Saturation (maximum input level) All - 10 - dBm 3 Adjacent Channel Interference for 1% PER All - 29 - dB (5MHz; desired signal -82dBm) 4 Alternate Channel Interference for 1% PER All - 40 - dB (10MHz; desired signal -82dBm) 5 Frequency Error Tolerance All - - 200 kHz 6 Symbol Rate Error Tolerance All -  80 ppm 8 Spurious Emissions <1GHz All - - -57 dBm 9 Spurious Emissions >1GHz All - - -47 dBm
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   15  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY  No Transmitter Module type Limit Unit       Min Typ Max   1 Maximum Output Power (1) PAN4561H - 20(3)  22(3)  dBm PAN4561M - 10 - PAN4561L - 0 - 2 Nominal Output Power (2) PAN4561H - 18.5 - dBm PAN4561M - 9.5 - PAN4561L - 0 - 3 Error Vector Magnitude (EVM)   - 25 35 % 4 Power Control Range    - 30 - dB 5 Over the Air Data Rate   - 250 - kbps 6 2PndP harmonic @ maximum output power   - -45 -35 dBm 7 3PrdP harmonic @ maximum output power   - -45 -35 dBm 8 Spurious Emissions <1GHz   - < -40 -36 dBm 9 Spurious Emissions >1GHz   - < -40 -30 dBm    No Stand By Limit Unit   Min Typ Max  1 Spurious Emissions <1GHz - < -60 -57 dBm 2 Spurious Emissions >1GHz - < -50 -47 dBm  Notes: (1)  SPI Register 12 programmed to 0xFF which sets output power to maximum. Measured at pin EXANT for the SMD pad version. (2)  SPI Register 12 programmed to 0xDC which sets output power to nominal value (maximum allowed value to comply with FCC regulation).  Measured at pin EXANT for the SMD pad version. (3)  You have to follow your own national regulation, please check before finalizing the max. output power by setting the right register value.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   16  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 15. SOLDERING TEMPERATURE - TIME PROFILE (FOR REFLOW SOLDERING)  15.1.  FOR LEAD SOLDER          Recommended temp. profile for reflow soldering Temp.[°C] Time [s] 235°C max. 220 5°C 200°C 150 10°C 90 30s 10 1s 30 +20/-10s   15.2.  FOR LEAD FREE SOLDER          Our used temp. profile for reflow soldering Temp.[°C] Time [s] 230°C -250°C max. 220°C 150°C – 190°C 90 30s 30 +20/-10s  Reflow permissible cycles:  2 Opposite side reflow is prohibited due to the module weight.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   17  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 16. MODULE DIMENSIONS  No. Item Dimension Tolerance Remark 1 Width 15.00  0.25  2 Lenght 35.00  0.25  3 Height   3.80  0.25 With case   17. FOOTPRINT OF THE MODULE  0.250.251.552.202.803.45 14.7515.00 mm1.552.202.803.4528.5035.00 mmAntennaTop View2232153Pad 1 =   4 x 1.30mm x 1.30mmPad 2 = 58 x 0.60mm x 1.30mm All dimensions are in millimeters. The outer dimensions have a tolerance of  0.25mm.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   18  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 18. LASER MARKING  Antenna35.0 mm15.0 mm2232531ENWC9A2xxxEFPAN4561v ESyy     Serial-No.zz     Date-codeFCC ID: T7V4561HM  The 2D-Barcode contains the following information separated by a semicolon:  Value Description Date-code Date code in the format Year-Month-Day [YYMMDD] Serial-No. Serial number [7 signs, here 0000000] ENWC9A2xxxEF Ordering number [8 signs; without ENW and F, please refer also to chapter 24] v Module type: H, M or L (for High, Mid and Low power) yy The identifier for the hardware release [2 signs, here yy] zz The identifier for the software release [2 signs, here zz] The point on the marking (below left) is the identifier for pin 1 of the module.   19. MECHANICAL REQUIREMENTS  No. Item Limit Condition 1 Solderability More than 75% of the soldering area shall be coated by solder Reflow soldering with recommendable temperature profile
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   19  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 20. RECOMMENDED LAND PATTERN  Antenna35.0 mm15.0 mmTop View2232Pad 1 =   4 x 1.40mm x 1.40mmPad 2 = 58 x 0.70mm x 1.40mm15314.628.35When using the ceramic antenna, this minimum area is restricted, means no ground, no line and in general no metal, e.g. screwsmin. 5.0min. 5.0In comparison to the module, we recommend to use 50µm bigger pad size to each direction! Dimensions in millimeters. The land pattern dimensions above are meant to serve only as a guid. This information is provided without any legal liability. For the footprint, it is recommended to incorporate a 50µm bigger size for the pads in each direction compared to the module footprint. Please refer to chapter 17. Foot Print of the Module. For the solder paste screen, please use the same screen for the module. Solder paste screen cutouts (with slightly different dimensions) might be optimum depending on your soldering process For example, the chosen solder paste screen thickness might havean effect. The solder screen thickness depends on your production standard. We recommend 120µm to 150µm. IMPORTANT:  Although the bottom side of PAN4561 is fully coated, no copper such as through hole vias, planes or tracks on the board component layer should be located below the PAN4561 to avoid creating a short. In cases where a track or through hole via has to be located under the module, please make a note that it has to be kept away from PAN4561 bottom pads. The PAN4561 multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding plane below the module is needed. When using the antenna pad version, place the antenna on the edge of your carrier board (if allowable). If you have any questions on these points, please contact your local Panasonic representative. Before releasing the layout, we recommend to sent the schematic and layout for final check to wireless@eu.panasonic.com.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   20  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 21. RELIABILITY TESTS  The measurement should be done after being exposed to room temperature and humidity for 1 hour. Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen. No. Item Limit Condition 1 Vibration test Electrical parameter should be in specification a) Freq.:10~50Hz,Amplitude:1.5mm a) 20min. / cycle,1hrs. each of XYZ axis b) Freq.:30~100Hz, 6G b) 20min. / cycle,1hrs. each of XYZ axis 2 Shock test the same as above Dropped onto hard wood from height of 50cm for 3 times 3 Heat cycle test the same as above -40°C for 30min. and  +85°C for 30min.;  each temperature 300 cycles 4 Moisture test the same as above +60°C, 90% RH, 300h 5 Low temp. test the same as above -40°C, 300h 6 High temp. test the same as above +85°C, 300h   22. CAUTIONS  Failure to do so may result in degrading of the product’s functions and damage to the product. 22.1.  DESIGN NOTES  (1)  Please follow the conditions written in this specification, especially the control signals of this module. (2)  The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a blocking capacitor to ground of at least 47uF directly at the module). (3)  This product should not be mechanically stressed when installed. (4)  Heat is the major cause of shortening the life of these products. Please keep this product away from heat. Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance. (5)  The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. (6)  Please keep this product away from other high frequency circuits.  22.2.  INSTALLATION NOTES  (1)  Reflow soldering is possible twice based on the conditions in chapter 15. Please set up the temperature at the soldering portion of this product according to this reflow profile. (2)  Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. (3)  Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   21  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY (4)  If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. (5)  This product should not be mechanically stressed or vibrated when reflowed. (6)  If you want to repair your board by hand soldering, please keep the conditions of this chapter. (7)  Please do not wash this product. (8)  Please refer to the recommended pattern when designing a board. (9)  Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.  22.3.  USAGE CONDITIONS NOTES  (1)  Please take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. (2)  Please do not use dropped products. (3)  Please do not touch, damage or place dirt on the pins. (4)  Please follow the recommended condition ratings about the power supply applied to this product. (5)  Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB. (6)  Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. (7)  These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information and communication equipment.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   22  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 22.4.  STORAGE NOTES  (1)  The module may not be stressed mechanically during storage. (2)  Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected:   Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX   Storage in direct sunlight   Storage in an environment where the temperature may be outside the range of 5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.   Storage of the products for more than one year after the date of delivery at your company if the avoidance all the above conditions (1) to (3) have been met. (3)  Storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. (4)  Please keep this product away from water, poisonous gas and corrosive gas. (5)  This product should not be stressed or shocked when transported. (6)  Please follow the specification when stacking packed crates (max. 10).  22.5.  SAFETY CAUTIONS   These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum. (1)  Ensure the safety of the whole system by installing a protection circuit and a protection device. (2)  Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.  22.6.  OTHER CAUTIONS  (1)  This specification sheet is copyrighted. Please do not disclose it to a third party. (2)  Please do not use the products for other purposes than those listed. (3)  Be sure to provide an appropriate fail-safe function on your product to prevent an additional damage that may be caused by the abnormal function or the failure of the product. (4)  This product has not been manufactured with any ozone chemical controlled under the Montreal Protocol. (5)  These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner.   In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   23  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY where liquid may splash.   In direct sunlight, outdoors, or in a dusty environment   In an environment where condensation occurs.   In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX) (6)  If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. (7)  When you have any question or uncertainty, both of you and Panasonic sincerely cope with it.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   24  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 23. PACKAGING  23.1.  TAPE DIMENSION    23.2.  PACKING IN TAPE  trailer (empty)1 x circumference /hub(min 160mm)component packed areastandard 500pcsleader (empty)minimum 10 pitchTop cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules.Antenna2232531Antenna2232531Direction of unreeling (for customer) Empty spaces in component packed area shall be less than two per reel and those spaces shall not be consecutive. Top cover tape shall not be found on reel holes and shall not stick out from reel.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   25  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 23.3.  COMPONENT DIRECTION  Antenna1PAN4561 ES03 00000105 081211ENWC9A22A4EFDirection of unreeling(for customer) Pin 1 Marking(Top Side)Pin 1(Bottom Side)  Please refer also to chapter 18. Labeling Drawing   23.4.  REEL DIMENSION  A  BD  NW2MAX MIN MIN ±1.0 MAX13 +0.5 25.0 +2.0 24.4 +3.0     -0.2          -0.0          -0.5*Latch (2PC)All dimensions in millimeters unless otherwise stated Assembly Method24mm330.01.520.2100.030.4*LatchTAPE SIZECW1W3
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   26  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 23.5.  LABEL FOR PACKAGE  The label below shows only an example.   (1T):    Lotcode [YYWWDLL]        YY  year          today 10       WW  normal calendar week    today 01       D  day          today  5 (Friday)       L  line identifier, if more as one    actual  1       L  lot identifier per day      e.g. 1, 2, 3… (1P)    Customer Order Code, if any, otherwise put company name on it. (2P)    Panasonic Part Number  (3P)    Module type [PAN4561H, PAN4561M or PAN4561L] (9D)    Datecode as [2xYear, 2xMonth, 2xDay] (Q)     Quantity [XXXX], variable (HW/SW)    Hardware /Software Release identifier [[G]]    Identifier that the product is RoHS conform, please refer to chapter 25.           ENWC9A22xxEF Customer Code (3P):PAN4561v
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   27  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 23.6.  TOTAL PACKING HANDLING     23.7.  COVER TAPE REEL STRENGTH     Force direction Speed = 300mm/min. Cover tape reel strength           =0.098~0.68N (10~70g) θ= 10deg  barcodelabelmoisture-sensitive print(already exist on barrier bag) barcodelabeldesiccant 1) 2)moisture indicatorbarrier bagsealedinner carton boxsize 340 x 340 x 41 mm³1) quantity of desiccant according    to calculation2) optional: desiccant placed into     the corner of the barrier bag
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   28  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 24. ORDERING INFORMATION  24.1.  PAN4561H No. Ordering part number Description 1 ENWC9A22A4EF Engineering Sample PAN4561H 802.15.4 Mesh Network Module, which includes Ceramic Antenna, Low Noise Amplifier, up to +20dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 2 ENWC9A22B4EF Engineering Sample PAN4561H 802.15.4 Mesh Network Module, which includes UFL connector, Low Noise Amplifier, up to +20dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 3 ENWC9A22C4EF Engineering Sample PAN4561H 802.15.4 Mesh Network Module, which includes RF out on SMD pad, Low Noise Amplifier, up to +20dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 4 ENWC9A22A2EF Same as number 1, but with Software: SN55 from E-Senza, please refer also to [8] 5 ENWC9A22B2EF Same as number 2, but with Software: SN55 from E-Senza, please refer also to [8] 6 ENWC9A22C2EF Same as number 3, but with Software: SN55 from E-Senza, please refer also to [8] 7 ENWC9A22A1EF Same as number 1, but with Freescale based SMAC test software. 8 ENWC9A22B1EF Same as number 2, but with Freescale based SMAC test software. 9 ENWC9A22C1EF Same as number 3, but with Freescale based SMAC test software.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   29  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 24.2.  PAN4561M No. Ordering part number Description 1 ENWC9A25A4EF Engineering Sample PAN4561M 802.15.4 Mesh Network Module, which includes Ceramic Antenna, Low Noise Amplifier, up to +10dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 2 ENWC9A25B4EF Engineering Sample PAN4561M 802.15.4 Mesh Network Module, which includes UFL connector, Low Noise Amplifier, up to +10dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 3 ENWC9A25C4EF Engineering Sample PAN4561M 802.15.4 Mesh Network Module, which includes RF out on SMD pad, Low Noise Amplifier, up to +10dBm Power Amplifier and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 4 ENWC9A25A2EF Same as number 1, but with Software: SN55 from E-Senza, please refer also to [8] 5 ENWC9A25B2EF Same as number 2, but with Software: SN55 from E-Senza, please refer also to [8] 6 ENWC9A25C2EF Same as number 3, but with Software: SN55 from E-Senza, please refer also to [8] 7 ENWC9A25A1EF Same as number 1, but with Freescale based SMAC test software. 8 ENWC9A25B1EF Same as number 2, but with Freescale based SMAC test software. 9 ENWC9A25C1EF Same as number 3, but with Freescale based SMAC test software.  24.3.  PAN4561L No. Ordering part number Description 1 ENWC9A21A4EF Engineering Sample PAN4561L 802.15.4 Mesh Network Module, which includes Ceramic Antenna, up to 0dBm output power and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 2 ENWC9A21B4EF Engineering Sample PAN4561L 802.15.4 Mesh Network Module, which includes UFL connector, up to 0dBm output power and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 3 ENWC9A21C4EF Engineering Sample PAN4561L 802.15.4 Mesh Network Module, which includes RF out on SMD pad, up to 0dBm output power and 60kBit Flash Memory. Synapse SNAP software included, please refer also to [9]. 4 ENWC9A21A2EF Same as number 1, but with Software: SN55 from E-Senza, please refer also to [8] 5 ENWC9A21B2EF Same as number 2, but with Software: SN55 from E-Senza, please refer also to [8] 6 ENWC9A21C2EF Same as number 3, but with Software: SN55 from E-Senza, please refer also to [8] 7 ENWC9A21A1EF Same as number 1, but with Freescale based SMAC test software. 8 ENWC9A21B1EF Same as number 2, but with Freescale based SMAC test software. 9 ENWC9A21C1EF Same as number 3, but with Freescale based SMAC test software.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   30  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 25. ROHS DECLARATION  Declaration of environmental compatibility for supplied products: Hereby we declare to our best present knowledge based on declaration of our suppliers that this product does not contain the following substances which are banned by Directive 2002/95/EC (RoHS) or contains a maximum concentration of 0.1% by weight in homogeneous materials for  Lead and lead compounds   Mercury and mercury compounds   Chromium (VI)   PBB (polybrominated biphenyl) category   PBDE (polybrominated biphenyl ether) category  And a maximum concentration of 0.01% by weight in homogeneous materials for   Cadmium and cadmium compounds   26. DATA SHEET STATUS  This data sheet contains data from the PRELIMINARY specification. Supplementary data will be published at a later date. Panasonic Electronic Devices Europe GmbH reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. If there is an update, please download under: PAN4561 Latest Data Sheet!  27. REGULATORY INFORMATION  27.1. FCC NOTICE The device PAN4561, including the ceramic antenna (ENWC9A2xAxEF) and also the SMD type (ENWC9A2xCxEF), including with the antennas, which are listed in 27.5, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter under following restrictions:  PAN4561H 1) Channel 26, according to [1] IEEE 802.15.4, must not be used 2) Maximum output power of 18.5dBm allowed. This level refers to the value 0xDC in SPI register 12 of  MC13213 (refer to [2] and [3]). 3) Duty cycle of 1% allowed  PAN4561M 1) Channel 26, according to [1] IEEE 802.15.4, must not be used
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   31  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY PAN4561L No restrictions  Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.  27.2. CAUTION The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Electronic Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:   Reorient or relocate the receiving antenna.   Increase the separation between the equipment and receiver.   Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   Consult the dealer or an experienced radio/TV technician for help   27.3. LABELING REQUIREMENTS The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label (laser marking) on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V4561HM. In any case end product must be labelled exterior with "Contains FCC ID: T7V4561HM"   27.4. ANTENNA WARNING The related part number for this device is ENWC9A2xBxEF (PAN4561 with U.FL connector) and ENWC9A2xCxEF (PAN4561 with SMD pad). For details, please see the chapter 24. Ordering Information. This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for this device with the antenna listed in item 1 are the same (FCC ID: T7V4561HM).
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   32  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 27.5. APPROVED ANTENNA LIST          Note: We are able to qualify your antenna and will add to this list as that process is completed. Item Part Number Manufacturer Frequency Band Type Gain (dBi) 1      2        27.6. RF EXPOSURE PAN4561 To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure that the approved antenna in the previous table must be installed. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of PAN4561 with mounted ceramic antenna (FCC ID: T7V4561HM) is below the FCC radio frequency exposure limits. Nevertheless, the PAN4561 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance.
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   33  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 28. RELATED DOCUMENTS  For an update, please search in the suitable homepage. [1]  IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2]  Technical Data MC1321x Document Number: MC1321x  Rev. 1.1, 03/2007 Freescale Semiconductor [3]  MC1321x Reference Manual Document Number: MC1321xRM Rev. 1.1, 10/2006 Freescale Semiconductor [4]  Handling MAC Address erasure, AN2825, Rev. 0.0 10/2004, Freescale Semiconductor [5]  802154MPSUG 802.15.4 MAC/PHY Software User´s Guide, Rev 1.1, Freescale Semiconductor [6]  802154EBRM.pdf 802.15.4 Embedded Bootloader Reference Manual Rev. 0.0 09/2004 [7]  AN2771 802.15.4 PHY Protocol Test Client (PTC) Rev. 0.0 Freescale Semiconductor [8]  Manual to the E-Senza SN55 Programmer Interface Manual [Download] [9]  Manual to the Evaluation Kit from Synapse, which fits to module hardware from Panasonic [Downloads: SNAP Reference Manual Updated 10/2/2008; SNAP Hardware Technical Manual Updated 10/2/2008] Each new release from Synapse, will be posted here. Be sure to be registered free under http://forums.synapse-wireless.com. [10]  Technical Data CC2591 (2.4-GHz RF Front End) from Texas Instruments CC2591 2.4 GHz RF Front End (Rev. A; 10. Juni 2008) [11]  Question and Answer Sheet for CC2590 and CC2591 CC2590 and CC2591 Q&A Sheet (Rev. D; 26. January 2010)
CLASSIFICATION  PRODUCT SPECIFICATION  No. DS-4561-2400-102 REV. I SUBJECT  MODEM FOR 802.15.4 IEEE STANDARD  PAGE   34  of  34 CUSTOMER’S CODE PAN4561H /M /L PANASONIC PART NUMBER ENWC9A22xxEF / .25xx. / .21xx. DATE   28.01.2014   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.pansonic.de  PRELIMINARY 29. GENERAL INFORMATION  © Panasonic Electronic Devices Europe GmbH 2009. All rights reserved. This product description does not claim to be complete and free of mistakes. Please contact the related product manager with any errata inquries.  If we deliver samples to the customer, these samples have the status Engineering Samples. This  means,  the  design  of  this  product  is  not  yet  completed.  Engineering  Samples  may  be partially or fully functional, and there may be differences published in the Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production.  UDisclaimer: Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic  Electronic  Devices  Europe  GmbH  disclaims  any  liability  or  product  warranty  for Engineering  Samples.  In  particular,  Panasonic  Electronic  Devices  Europe  GmbH  disclaims liability for damages caused by   the use of the Engineering Sample other than for Evaluation Purposes, particularly the installation or integration in an other product to be sold by Customer,   deviation or lapse in function of Engineering Sample,   improper use of Engineering Samples. Panasonic  Electronic  Devices  Europe  GmbH  disclaimes  any  liability  for  consequential  and incidental damages. In case of any questions, please contact your local sales partner or the related product manager.   30. LIFE SUPPORT POLICY  This  Panasonic  Electronic  Devices  Europe  GmbH  product  is  not  designed  for  use  in  life support  appliances,  devices,  or  systems  where  malfunction  can  reasonably  be  expected  to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Electronic Devices Europe GmbH for any damages resulting.

Navigation menu