Panasonic Devices Europe PAN10 Bluetooth Smart Module User Manual
Panasonic Industrial Devices Europe GmbH Bluetooth Smart Module
Contents
- 1. 15_ENW89837AxKF UserMan
- 2. User manual
User manual
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| Document ID | 3510531 |
| Application ID | 1gSU23VA1EPORXRnc7G7UQ== |
| Document Description | User manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 78.33kB (979146 bits) |
| Date Submitted | 2017-08-14 00:00:00 |
| Date Available | 2017-08-14 00:00:00 |
| Creation Date | 2017-07-28 11:00:28 |
| Document Lastmod | 2017-07-28 13:10:11 |
| Document Title | User manual |
| Document Author: | DH |
PAN1026A Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev. 0.1 Wireless Modules PAN1026A Bluetooth Module New Features Overview The PAN1026A is a Class 2 Bluetooth 4.2 Basic Data Rate and Low Energy module for easy implementation of Bluetooth functionality into various electronic devices. • • • Features • Bluetooth 4.2 Basic Data Rate (BR) and Low • • • • • • • • • Energy (LE) • • • • • • • Embedded SPP profile Embedded GATT profile High-level API commands Bluetooth 4.2 (LE) embedded GATT profile with high-level API commands, compatible with Toshiba reference BLE profiles Operational temperature range -40 to +85 °C Operational voltage 2.7 V to 3.6 V +/- 10 % Power consumption Tx: 46 mA Dimensions 15.6 x 8.7 x 1.9 mm Increased (2.5 x) BLE data transfer rates through extended MTU size (64 bytes to 160 bytes) More complex BLE profiles possible through extended GATT functionality Data base pool, number of services and characteristics, data flow control Fast SPP classic connection/disconnection times Interlaced inquiry/page scan & extended inquiry response Transmission (Tx) power control Improved PER (peak-error-rate) for BLE traffic Integration of BT 4.2 secure connecting feature implementing ECDH technology Bluetooth • • • • GAP support for SPP GAP Peripheral and Broadcast support for LE GATT server and client mode support for LE GAP Central and Observer not supported for LE Output power 4 dBm Interfaces -88 dBm sensitivity Integrated high speed crystal oscillator (26 MHz) • UART, GPIO (10 input/output pins), wake-up control pins Block Diagram PAN1026A Bluetooth 4.2 Module Vcc 3.3 V EEPROM 32 kbit UART Crystal 26 MHz GPIOs Chip antenna Host wake up Toshiba TC35661 Reset 32 kHz input Wake up Product Specification Rev. 0.1 LPF Page 2 PAN1026A Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2017. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 0.1 Page 3 PAN1026A Bluetooth Module Table of Contents About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Pin Configuration ....................................................................................................................... 8 2.3 UART Interface ........................................................................................................................ 10 2.4 Bluetooth Features .................................................................................................................. 10 Detailed Description ......................................................................................................................... 11 3.1 Dimensions .............................................................................................................................. 11 3.2 Footprint .................................................................................................................................. 12 3.3 Packaging ................................................................................................................................ 13 3.4 Case Marking .......................................................................................................................... 16 Specification ..................................................................................................................................... 17 4.1 Default Test Conditions ........................................................................................................... 17 4.2 Absolute Maximum Ratings ..................................................................................................... 17 4.3 Recommended Operating Conditions ...................................................................................... 18 4.4 Current Consumption............................................................................................................... 18 4.5 Bluetooth ................................................................................................................................. 19 4.6 Reliability Tests ....................................................................................................................... 19 4.7 Recommended Soldering Profile ............................................................................................. 20 Cautions ............................................................................................................................................ 21 5.1 Design Notes ........................................................................................................................... 21 5.2 Installation Notes ..................................................................................................................... 21 5.3 Usage Condition Notes ............................................................................................................ 22 5.4 Storage Notes .......................................................................................................................... 22 5.5 Safety Cautions ....................................................................................................................... 22 5.6 Other Cautions ........................................................................................................................ 23 5.7 Life Support Policy ................................................................................................................... 23 Regulatory and Certification Information ....................................................................................... 24 6.1 RoHS and REACH Declaration ............................................................................................... 24 6.2 Federal Communications Commission (FCC) for US .............................................................. 24 6.3 Industry Canada Certification .................................................................................................. 26 6.4 European Conformity According to RED (2014/53/EU) ........................................................... 29 6.5 Japanese Radio Law Compliance ........................................................................................... 29 Appendix ........................................................................................................................................... 30 7.1 Ordering Information ................................................................................................................ 30 7.2 Contact Details ........................................................................................................................ 31 Product Specification Rev. 0.1 Page 4 PAN1026A Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1026A module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN1026A” or “the module” within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 0.1 23.03.2017 1st preliminary version. Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk. [chapter number] [chapter title] Cross reference Indicates crossreferences within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents 7.2.2 Product Information. Product Specification Rev. 0.1 Page 5 PAN1026A Bluetooth Module 2 Overview 2 Overview The PAN1026A is based on Toshiba´s single-chip TC35661 Bluetooth semiconductor device with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external component count and power consumption in applications requiring support of Bluetooth 4.2 standards. EDR (Enhanced Data Rate) or Central Mode are not supported. Details about iAP integration can be provided on request. The integrated EEPROM has a Panasonic MAC address and it can be used to store link keys. The module allows for serving both legacy Bluetooth Classic and Bluetooth Low Energy connections with rapid connection and disconnection, needed by a wide range of applications, all at a small form factor. Compared to the PAN1026, the PAN1026A has additional features for secure connections via Bluetooth LE and it is fully backwards compatible. Next to increased low energy transfer speed, transmission power can also be controlled. The PAN1026A module is manufactured in a small 15.6 x 8.7 x 1.9 mm SMD package with a shielded case and it is qualified according to the Bluetooth 2.1 and 4.2 standards. Please refer to the Panasonic website for related documents 7.2.2 Product Information. Further information on the variants and versions 7.1 Ordering Information. Product Specification Rev. 0.1 Page 6 PAN1026A Bluetooth Module 2 Overview 2.1 Block Diagram PAN1026A Bluetooth 4.2 Module Vcc 3.3 V EEPROM 32 kbit UART Crystal 26 MHz GPIOs Chip antenna Host wake up Toshiba TC35661 Reset 32 kHz input LPF Wake up Total capacitor value: 6.7 µF +/-10 % Total inductance: 2 NH +/-10 % Total resistance: 220 KΩ +/-10 % Product Specification Rev. 0.1 Page 7 PAN1026A Bluetooth Module 2 Overview 2.2 Pin Configuration Pin Assignment Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Pin Functions No Pin Name Pin Type Description A1 GND Ground Pin Connect to ground A2 NC NC Not connected, leave open A3 Reset Digital Input Reset, active low A4 VCC Power analog/digital power supply connection A5 VCC Power analog/digital power supply connection A6 VCC Power analog/digital power supply connection A7 GND Ground Pin Connect to ground A8 NC NC Not connected A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground A12 GND Ground Pin Connect to ground Product Specification Rev. 0.1 GPIO No Page 8 PAN1026A Bluetooth Module 2 Overview No Pin Name GPIO No Pin Type Description NC Not connected, leave open B4 NC NC Not connected, leave open B5 NC NC Not connected, leave open B6 NC NC Not connected, leave open B7 NC NC Not connected, leave open B8 NC NC Not connected, leave open B9 NC NC Not connected, leave open C4 NC NC Not connected, leave open C5 NC NC Not connected, leave open B1 NC B2 BTS GPIO 11 B3 BTA GPIO 10 C1 CS0X GPIO 17 C2 BTI GPIO 13 C3 WIA GPIO 12 C6 PCMCLK GPIO 04 Digital I/O PCM clock C7 FSYNC GPIO 05 Digital I/O PCM synchronization C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 CS1X GPIO 18 D2 DIN GPIO 16 D3 GPIO1 GPIO 01 Digital I/O D4 GPIO0 Digital I/O D5 NC NC Not connected, leave open Digital Input PCM In: Not supported D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 ANT RF-Signal Antenna pin (not connected for standard version) D6 PCMIN GPIO 03 E1 SDA GPIO 15 Digital I/O I2C interface (only internal), connect to test pin E2 SCL GPIO 14 Digital I/O I2C interface (only internal), connect to test pin Ground Pin Connect to ground E3 GND E4 USB USB direct is not supported by the IC. Leave this pin open. E5 CLKREQ Digital Output Active high once crystal frequency is stable E6 UART RXD Digital Input UART RXD Product Specification Rev. 0.1 Page 9 PAN1026A Bluetooth Module 2 Overview No Pin Name GPIO No Pin Type Description GPIO 02 Digital Output PCM Output: not supported E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 EEPROM_WP Digital Input Internal EEPROM Write Protect (active high) F3 GND Ground Pin Connect to ground F4 GND Ground Pin Connect to ground F5 UART CTS Digital Input UART CTS F6 SLEEPCLK Digital Input Input clock for 32.768 KHz F7 UARTTXD Digital Output UART TX F8 UARTRTS Digital Output UART RTS F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground E7 PCMOUT 2.3 UART Interface • • • • • 2.4 Full-duplex 4-wire data transfer: RX, TX, RTS, CTS Programmable baud rate: 2 400 bps to 4.33 Mbps Default baud rate: 115 200 bps Data format: 8N1, LSB first Error detection: Character timeout, Overrun error, Framing error Bluetooth Features • • • • • • Bluetooth 4.0 with SPP & GATT GAP support for SPP GATT server and client mode supported for LE Class 2 TX power w/o external PA (improved link robustness) Excellent link budget (up to 91 dB), enabling long-range applications GAP peripheral support for LE Product Specification Rev. 0.1 Page 10 PAN1026A Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 8.70 ± 0.20 2 Length 15.60 ± 0.20 3 Height 1.80 Product Specification Rev. 0.1 ± 0.20 With case Page 11 PAN1026A Bluetooth Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.3 mm. Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Product Specification Rev. 0.1 Page 12 PAN1026A Bluetooth Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 100730-PAN1720.vsd The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 0.1 Page 13 PAN1026A Bluetooth Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 0.1 Page 14 PAN1026A Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example (1T) (1P) (2P) (9D) (Q) (HW/SW) 3.3.6 Lot code Customer order number, if applicable Order number Date code Quantity Hardware/software version Total Package Product Specification Rev. 0.1 Page 15 PAN1026A Bluetooth Module 3 Detailed Description 3.4 Case Marking Example Product Specification Rev. 0.1 MIC ID Brand name Hardware/software version Order number FCC ID Lot code Engineering Sample marking, if applicable Marking for Pin 1 2D barcode, for internal usage only Page 16 PAN1026A Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 ± 10 °C 40 to 85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter TSTOR Storage temperature VESD ESD robustness Condition Min. Typ. -40 All pads, according to human body model (HBM), JEDEC STD 22, method A114 According to charged device model (CDM), JEDEC STD 22, method C101 PRF RF input level VDIG Voltage on any digital pins Product Specification Rev. 0.1 -0.3 Max. Units +125 °C 1 000 500 +10 dBm VDD + 0.3 Page 17 PAN1026A Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 4.4 Symbol Parameter Condition Min. Typ. TA Ambient operating temperature range -40 VDD 3V3 Supply voltage 2.7 Max. Units +85 °C 3.6 3.3 Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. Parameter Condition Idle Current After reset was pulled down. Connected Peak Power Sending DH5 packets. Max. output power. 62 mA Connected Peak Power Sending DH3 packets. Max. output power. 61 mA Connected Peak Power Sending DH1 packets. Max. output power. 55 mA Sleep mode activated Sniff mode/not connected/BLE Advertising Product Specification Rev. 0.1 Min. Typ. Max. Units mA 7.8 mA Page 18 PAN1026A Bluetooth Module 4 Specification 4.5 Bluetooth Parameter Condition Min. Operation frequency range Channel spacing Typ. 2 402 2 480 BT-Classic/BLE Output Power Maximum setting, measured at dual ended 50 ohm. Sensitivity 4.6 Max. Symbol Parameter Condition Spurious emissions Conducted measurement with a 50 Ω dual-ended load. Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STDT-66. Min. Units MHz 1/2 MHz dBm -88 dBm Typ. Max. <-30 Units dBm Reliability Tests The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item 1 Vibration test Limit Electrical parameter should be in specification Condition • • Freq.: 10~50 Hz; Amplitude: 1.5 mm; 20 min./cycle, 1 hrs. each of XYZ axis Freq.: 30~100 Hz, 6G; 20 min./cycle, 1 hrs. each of XYZ axis 2 Shock test See above Dropped onto hard wood from a height of 50 cm for 3 times 3 Heat cycle test See above -40 °C for 30 min. and +85 °C for 30 min.; each temperature 300 cycles 4 Moisture test See above +60 °C, 90 % RH, 300 h 5 Low temperature test See above -40 °C, 300 h 6 High temp. test See above +85 °C, 300 h Product Specification Rev. 0.1 Page 19 PAN1026A Bluetooth Module 4 Specification 4.7 Recommended Soldering Profile • • • • Reflow permissible cycle: 2 • Soldering profile assumes lead-free soldering Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Product Specification Rev. 0.1 Page 20 PAN1026A Bluetooth Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions and damage to the product. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.7 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Product Specification Rev. 0.1 Page 21 PAN1026A Bluetooth Module 5 Cautions 5.3 Usage Condition Notes 1. Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: – Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, – Storage in direct sunlight, – Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 to 85 percent range, – Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: Product Specification Rev. 0.1 Page 22 PAN1026A Bluetooth Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: – In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. – In direct sunlight, outdoors, or in a dusty environment. – In an environment where condensation occurs. – In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. When you have any question or uncertainty, contact Panasonic. 5.7 Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. Product Specification Rev. 0.1 Page 23 PAN1026A Bluetooth Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 RoHS and REACH Declaration The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation, and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the “Downloads” section of the respective product 7.2.2 Product Information. 6.2 6.2.1 Federal Communications Commission (FCC) for US FCC Notice The PAN1026A including the antennas, which are listed in 6.2.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 6.2.2 Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Product Specification Rev. 0.1 Page 24 PAN1026A Bluetooth Module 6 Regulatory and Certification Information However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 6.2.3 • • • Reorient or relocate the receiving antenna. • Consult the dealer or an experienced radio/TV technician for help Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Label Requirements The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7VPAN10. This FCC identifier is valid for the PAN1026A. The end product must in any case be labelled on the exterior with: "Contains FCC ID: T7VPAN10" 6.2.4 Antenna Warning This antenna warning refers to the test device with the model number PAN1026A Chapter 7.1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEM’s product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in 6.2.5 Approved Antenna List is the same (FCC ID: T7VPAN10). 6.2.5 Approved Antenna List Item Part Number Manufacturer Frequency Band Type Gain (dBi) LDA212G3110K Murata 2.4 GHz Chip antenna +0.9 ANT2012 Yageo 2.4GHz Chip-Antenna +0.9 Product Specification Rev. 0.1 Page 25 PAN1026A Bluetooth Module 6 Regulatory and Certification Information 6.2.6 RF Exposure To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.2.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1026A with a mounted ceramic antenna (FCC ID: T7VPAN10) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1026A shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. 6.3 Industry Canada Certification English The PAN1026A is licensed to meet the regulatory requirements of Industry Canada (IC). License ID: IC: 216Q-PAN10 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 6.2.5 Approved Antenna List, having a maximum gain of +0.9 dBi. Antennas not included in this list or having a gain greater than +0.9 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the module’s label due to the limited size. Product Specification Rev. 0.1 Page 26 PAN1026A Bluetooth Module 6 Regulatory and Certification Information French PAN1026A est garanti conforme aux dispositions règlementaires d’Industry Canada (IC). License: IC: 216Q-PAN10 Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique maximum autorisé. Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le tableau 6.2.5 Approved Antenna List, présentant un gain maximum de 0.9 dBi. Des antennes autres que celles listées ici, ou présentant un gain supérieur à 0.9 dBi ne doivent en aucune circonstance être utilisées en combinaison avec ce produit. L’impédance des antennes compatibles est 50 Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autre antenne ou un autre émetteur. En raison de la taille du produit, l’identifiant IC est fourni dans le manuel d’installation. 6.3.1 IC Notice English The device PAN1026A ( 7.1 Ordering Information), including the antennas ( 6.2.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le présent appareil PAN1026A ( 7.1 Ordering Information), les antennes y compris ( 6.2.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Product Specification Rev. 0.1 Page 27 PAN1026A Bluetooth Module 6 Regulatory and Certification Information 6.3.2 Labeling Requirements English Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is: IC: 216Q-PAN10 This IC identifier is valid for all PAN1026A modules 7.1 Ordering Information. In any case, the end product must be labelled on the exterior with: "Contains IC: 216Q-PAN10”. French Obligations d’étiquetage Les fabricants d’équipements d’origine (FEO) – en anglais Original Equipment Manufacturer (OEM) – doivent s’assurer que les obligations d’étiquetage IC du produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L’ identifiant IC est: IC: 216Q-PAN10 Cet identifiant est valide pour tous les modules PAN1026A 7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante: "Contient IC: 216Q-PAN10”. Product Specification Rev. 0.1 Page 28 PAN1026A Bluetooth Module 6 Regulatory and Certification Information 6.4 European Conformity According to RED (2014/53/EU) All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with the RED (2014/53/EU) articles: 3.1a Safety/Health: EN60950-1:2006+A11:2009+A1:2010+A12:2011+AC:2011+A2:2013 EN62311:2008 3.1b EMC: EN 301 489-1 V2.1.1:2017-02 EN 301 489-17 V3.1.1:2017-02 3.2 Radio: EN 300 328 V2.1.1:2016-11 As a result of the conformity assessment procedure described in the 2014/53/EU Directive, the end customer equipment should be labelled as follows: PAN1026A in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra and Turkey. 6.5 Japanese Radio Law Compliance This device is granted pursuant to the Japanese Radio Law (電波法). This device should not be modified (otherwise the granted designation number will become invalid). Product Specification Rev. 0.1 Page 29 PAN1026A Bluetooth Module 7 Appendix 7 Appendix 7.1 Ordering Information Variants and Versions Order Number ENW89837A5KF Brand Name Description PAN1026A Bluetooth BT4.2 Basic Data Rate and Low Energy module MOQ 1 500 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. Samples are available on customer demand. Product Specification Rev. 0.1 Page 30 PAN1026A Bluetooth Module 7 Appendix 7.2 7.2.1 Contact Details Contact Us Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 0.1 Page 31
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