Particle PHOTON PHOTON User Manual photon datasheet v011 FCC md
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| Document ID | 2659044 |
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| Document Description | Users Manual |
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| Date Submitted | 2015-06-26 00:00:00 |
| Date Available | 2015-06-29 00:00:00 |
| Creation Date | 2015-06-22 15:26:35 |
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Photon Datasheet
Model number: PHOTONH
void setup() {
Spark.publish("my-event","The internet just got smarter!");
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Photon Datasheet v011
Contents
Photon Datasheet
Contents
1. Functional description
1.1 Overview
1.2 Features
2. Interf aces
2.1 Power
2.2 RF
2.3 FCC Approved Antennas
2.4 Peripherals and GPIO
2.5 JTAG
2.6 External Coexistence Interf ace
3. Pin and button def inition
3.1 Pin marking s
3.2 Pin description
3.3 Pin out diag rams
4 . Technical specif ication
4 .1 Absolute maximum ratings
4 .2 Recommended operating conditions
4 .3 Wi-Fi Specif ications
4 .4 I/O Characteristics
5. Mechanical specif ications
5.1 Dimensions and Weig ht
5.2 Mating connectors
5.3 Recommended pcb land pattern (Photon with headers)
5.4 Recommended pcb land pattern (Photon without headers)
6. Layout
6.1 Photon v1.0.0 Top Layer (GTL)
6.2 Photon v1.0.0 GND Layer (G2L)
6.3 Photon v1.0.0 3V3 Layer (G15L)
6.4 Photon v1.0.0 Bottom Layer (GBL)
7. Recommended solder ref low prof ile
8. Bill of Materials
Build your own desig n based on the Photon!
9. Ordering inf ormation
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10. Qualif ication and approvals
11. Product handling
11.1 Packag ing
11.2 Moisture sensitivity levels
11.3 ESD Precautions
12. Def ault setting s
13. Glossary
14 . FCC IC CE Warnings and End Product Labeling Requirements
15. Revision history
16. Contact
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Photon Datasheet v011
1. Functional description
1.1 Overview
Particle’s Internet of Thing s hardware development kit, the Photon, provides everything you need to build a
connected product. Particle combines a powerf ul ARM Cortex M3 micro-controller with a Broadcom Wi-Fi chip in a tiny
thumbnail-sized module called the PØ (P-zero).
To g et you started quickly, Particle adds a rock solid 3.3VDC SMPS power supply, RF and user interf ace components to
the PØ on a small single-sided PCB called the Photon. The design is open source, so when you’re ready to integrate
the Photon into your product, you can.
The Photon comes in two physical f orms: with headers and without. Prototyping is easy with headers as the Photon
plug s directly into standard breadboards and perf boards, and may also be mounted with 0.1” pitch f emale headers on
a PCB. To minimize space required, the Photon f orm f actor without headers has castellated edges. These make it
possible to surf ace mount the Photon directly onto your PCB.
1.2 Features
Particle PØ Wi-Fi module
Broadcom BCM4 3362 Wi-Fi chip
802.11b/g /n Wi-Fi
STM32F205 120Mhz ARM Cortex M3
1MB f lash, 128KB RAM
On-board RGB status LED (ext. drive provided)
18 Mixed-signal GPIO and advanced peripherals
Open source desig n
Real-time operating system (FreeRTOS)
Sof t AP setup
FCC, CE and IC certif ied
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Photon Datasheet v011
2. Interfaces
2.1 Power
Power to the Photon is supplied via the on-board USB Micro B connector or directly via the VIN pin. If power is supplied
directly to the VIN pin, the voltag e should be regulated between 3.6VDC and 5.5VDC. When the Photon is powered via
the USB port, VIN will output a voltag e of approximately 4 .8VDC due to a reverse polarity protection series schottky
diode between V+ of USB and VIN. When used as an output, the max load on VIN is 1A.
Typical current consumption is 80mA with a 5V input. Deep sleep quiescent current is 160uA. When powering the
Photon f rom the USB connector, make sure to use a quality cable to minimize IR drops (current x resistance = voltage)
in the wiring. If a hig h resistance cable (i.e., low current) is used, peak currents drawn f rom the Photon when
transmitting and receiving will result in voltage sag at the input which may cause a system brown out or intermittent
operation. Likewise, the power source should be suf f icient enough to source 1A of current to be on the saf e side.
2.2 RF
The RF section of the Photon is a f inely tuned impedance controlled network of components that optimize the
ef f iciency and sensitivity of the Wi-Fi communications.
An RF f eed line runs f rom the PØ module into a SPDT RF-switch. Logic level control lines on the PØ module select which
of the two ports of the RF-switch is connected to the RF f eed line. A 100pF decoupling capacitor is located on each
control line. One port is connected to a PCB ceramic chip antenna, and the other is connected to a u.FL connector f or
external antenna adaptation. The def ault port will be set to the chip antenna.
Additionally, a user API is available to switch between internal, external and even an automatic mode which
continuously switches between each antenna and selects the best signal. All three RF ports on the RF-switch have a
10pF RF quality DC-blocking capacitor in series with them. These ef f ectively pass 2.4 GHz f requencies f reely while
blocking unwanted DC voltag es f rom damaging the RF-switch. All RF traces are considered as tiny transmission lines
that have a controlled 50 ohm impedance.
The chip antenna is impedance matched to the 50 ohm RF f eed line via a Pi network comprised of three RF inductors (1
series, 2 shunt). These values are quite specif ic to the Photon due to the PCB construction and layout of the RF
section. Even if the Photon’s layout desig n is copied exactly, to achieve the best perf ormance it would be worth reexamining the Pi network values on actual samples of the PCB in question.
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Photon Datasheet v011
2.3 FCC Approved Antennas
Antenna T ype
Manuf acturer
MFG. Part #
Gain
Dipole antenna
LumenRadio
104 -1001
2.15dBi
Chip antenna
Advanced Ceramic X
AT7020-E3R0HBA
1.3dBi
2.4 Peripherals and GPIO
The Photon has ton of capability in a small f ootprint, with analog, digital and communication interf aces.
Peripheral T ype
Qty
Input(I) / Output(O)
FT [1] / 3V3[2 ]
Dig ital
18
I/O
FT/3V3
Analog (ADC)
3V3
Analog (DAC)
3V3
SPI
I/O
3V3
I2S
I/O
3V3
I2C
I/O
FT
CAN
I/O
FT
USB
I/O
3V3
PWM
93
3V3
Notes:
[1]
FT = 5.0V tolerant pins. All pins except A3 and DAC are 5V tolerant (when not in analog mode). If used as a 5V input
the pull-up/pull-down resistor must be disabled.
[2]
3V3 = 3.3V max pins.
[3]
PWM is available on D0, D1, D2, D3, A4 , A5, WKP, RX, TX with a caveat: PWM timer peripheral is duplicated on two pins
(A5/D2) and (A4 /D3) f or 7 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as a
GPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independently
controlled PWM outputs at the same time.
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Photon Datasheet v011
2.5 JTAG
Pin D3 throug h D7 are JTAG interf ace pins. These can be used to reprogram your Photon bootloader or user f irmware
image with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX ARM-USB-TINI-H, and also the FTDI-based
Particle JTAG Prog rammer.
PØ Pin Name
Def ault Internal[1]
Photon Pin
Description
ST M32 Pin
PØ Pin #
D7
JTAG_TMS
PA13
44
MICRO_JTAG_TMS
~4 0k pull-up
D6
JTAG_TCK
PA14
40
MICRO_JTAG_TCK
~4 0k pull-down
D5
JTAG_TDI
PA15
43
MICRO_JTAG_TDI
~4 0k pull-up
D4
JTAG_TDO
PB3
41
MICRO_JTAG_TDO
Floating
D3
JTAG_TRST
PB4
42
MICRO_JTAG_TRSTN
3V3
Power
GND
Ground
RST
Reset
~4 0k pull-up
Notes:
[1] Def ault state af ter reset f or a short period of time bef ore these pins are restored to GPIO (if JTAG debugging is not
required, i.e. USE_SWD_JTAG=y is not specif ied on the command line.
A standard 20-pin 0.1” shrouded male JTAG interf ace connector should be wired as f ollows:
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Photon Datasheet v011
2.6 External Coexistence Interface
The Photon supports coexistence with Bluetooth and other external radios via the three gold pads on the top side of
the PCB near pin A3. These pads are 0.035” square, spaced 0.04 9” apart. This spacing supports the possibility of
tacking on a small 1.25mm - 1.27mm pitch 3-pin male header to make it somewhat easier to interf ace with.
When two radios occupying the same f requency band are used in the same system, such as Wi-Fi and Bluetooth, a
coexistence interf ace can be used to coordinate transmit activity, to ensure optimal perf ormance by arbitrating
conf licts between the two radios.
Pad #
PØ Pin Name
PØ Pin #
I/O
Description
BTCX_RF_ACTIVE
Signals Bluetooth is active
BTCX_STATUS
10
Signals Bluetooth priority status and TX/RX direction
BTCX_TXCONF
11
Output giving Bluetooth permission to TX
When these pads are prog rammed to be used as a Bluetooth coexistence interf ace, they’re set as high impedance on
power up and reset. Alternatively, they can be individually programmed to be used as GPIOs through sof tware control.
They can also be programmed to have an internal pull-up or pull-down resistor.
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Photon Datasheet v011
3. Pin and button definition
3.1 Pin markings
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3.2 Pin description
Pin
Description
VIN
This pin can be used as an input or output. As an input, supply 3.6 to 5.5VDC to power the Photon. When the
Photon is powered via the USB port, this pin will output a voltage of approximately 4 .8VDC due to a
reverse polarity protection series schottky diode between VUSB and VIN. When used as an output, the max
load on VIN is 1A.
RST
Active-low reset input. On-board circuitry contains a 1k ohm pull-up resistor between RST and 3V3, and
0.1uF capacitor between RST and GND.
VBAT
Supply to the internal RTC, backup registers and SRAM when 3V3 not present (1.65 to 3.6VDC).
3V3
This pin is the output of the on-board regulator and is internally connected to the VDD of the WiFi module.
When powering the Photon via VIN or the USB port, this pin will output a voltage of 3.3VDC. This pin can
also be used to power the Photon directly (max input 3.3VDC). When used as an output, the max load on
3V3 is 100mA. NOTE: When powering the Photon via this pin, ensure power is disconnected f rom VIN and
USB.
WKP
Active-high wakeup pin, wakes the module f rom sleep/standby modes. When not used as a WAKEUP, this
pin can also be used as a dig ital GPIO, ADC input or PWM.
D0~D7
Digital only GPIO pins.
A0~A9
12-bit Analog-to-Dig ital (A/D) inputs (0-4 095), and also digital GPIOs. A6 and A7 are code convenience
mappings, which means pins are not actually labeled as such but you may use code like analogRead(A7) .
A6 maps to the DAC pin and A7 maps to the WKP pin.
DAC
12-bit Digital-to-Analog (D/A) output (0-4 095), and also a digital GPIO. DAC is used as DAC1 in sof tware,
and A5 is a second DAC output used as DAC2 in sof tware.
RX
Primarily used as UART RX, but can also be used as a digital GPIO or PWM.
TX
Primarily used as UART TX, but can also be used as a digital GPIO or PWM.
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Photon Datasheet v011
3.3 Pin out diagrams
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4. Technical specification
4.1 Absolute maximum ratings
Parameter
Symbol
Min
Supply Input Voltag e
VIN-MAX
+6.5
Supply Output Current
IIN-MAX-L
Supply Output Current
I3V3-MAX-L
100
mA
Storage Temperature
T s tg
+85
°C
Enable Voltage
VEN
VIN+0.6
ESD Susceptibility HBM (Human Body Mode)
VES D
kV
-4 0
T yp
Max
Unit
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Photon Datasheet v011
4.2 Recommended operating conditions
Parameter
Symbol
Min
T yp
Supply Input Voltag e
VIN
+3.6
Supply Input Voltag e
V3V3
+3.0
Supply Output Voltage
VIN
+4 .8
Supply Output Voltage
V3V3
+3.3
Supply Input Voltag e
VVBAT
Supply Input Current (VBAT)
IVBAT
Operating Current (Wi-Fi on)
IIN avg
Operating Current (Wi-Fi on)
IIN pk
Operating Current (Wi-Fi on, w/powersave)
IIN avg
Operating Current (Wi-Fi of f )
+3.3
Unit
+5.5
+3.6
+3.6
19
uA
100
mA
4 30 [1]
mA
18
100 [2]
mA
IIN avg
30
40
mA
Sleep Current (5V @ VIN)
IQs
mA
Deep Sleep Current (5V @ VIN)
IQds
80
100
uA
Operating Temperature
T op
+60
°C
95
Humidity Rang e Non condensing , relative humidity
+1.65
Max
80
235[1]
-20
Notes:
[1]
These numbers represent the extreme rang e of short peak current bursts when transmitting and receiving in
802.11b/g/n modes at dif f erent power levels. Average TX current consumption in will be 80-100mA.
[2] These are very short averag e current bursts when transmitting and receiving. On average if minimizing f requency
of TX/RX events, current consumption in powersave mode will be 18mA
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Photon Datasheet v011
4.3 Wi-Fi Specifications
Feature
Description
WLAN Standards
IEEE 802 11b/g/n
Antenna Port
Single Antenna
Frequency Band
2.4 12GHz – 2.4 62GHz (United States of America and Canada)
2.4 12GHz – 2.4 72GHz (EU)
Sub Channels
1 – 11 (United States of America and Canada)
1 – 13 (EU)
Modulation
DSSS, CCK, OFDM, BPSK, QPSK,16QAM, 64 QAM
PØ module Wi-Fi output power
RF Average Output Power, 802.11b CCK Mode
RF Average Output Power, 802.11g OFDM Mode
RF Average Output Power, 802.11n OFDM Mode
T yp.
T ol.
Unit
1M
Avail. upon request
+/- 1.5
dBm
11M
+/- 1.5
dBm
6M
+/- 1.5
dBm
54 M
+/- 1.5
dBm
MCS0
+/- 1.5
dBm
MCS7
+/- 1.5
dBm
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Photon Datasheet v011
4.4 I/O Characteristics
These specif ications are based on the STM32F205RG datasheet, with ref erence to Photon pin nomenclature.
Parameter
Symbol
Conditions
Min
T yp
Max
Unit
Standard I/O input low level voltage
VIL
-0.3
0.28*(V3V3 2)+0.8
I/O FT [1] input low level voltag e
VIL
-0.3
0.32*(V3V3 2)+0.75
Standard I/O input hig h level voltag e
VIH
0.4 1*(V3V3 2)+1.3
V3V3 +0.3
I/O FT [1] input high level voltage
VIH
V3V3 > 2V
0.4 2*(V3V3 2)+1
5.5
VIH
V3V3 ≤ 2V
0.4 2*(V3V3 2)+1
5.2
Standard I/O Schmitt trig g er voltage
hysteresis [2]
Vhys
200
mV
I/O FT Schmitt trigger voltag e
hysteresis [2]
Vhys
5% V3V3 [3]
mV
Input leakag e current [4]
Ilkg
GND ≤ Vio ≤ V3V3
GPIOs
Input leakag e current [4]
Ilkg
RPU
Vio = 5V, I/O
FT
Weak pull-up equivalent resistor[5]
RPU
Vio = GND
30
Weak pull-down equivalent resistor[5]
RPD
Vio = V3V3
30
I/O pin capacitance
C IO
±1
µA
µA
40
50
kΩ
40
50
kΩ
pF
Notes:
FT = Five-volt tolerant. In order to sustain a voltage higher than V3V3 +0.3 the internal pull-up/pull-down resistors
must be disabled.
[2] Hysteresis voltage between Schmitt trig g er switching levels. Based on characterization, not tested in production.
[3] With a minimum of 100mV.
[4] Leakage could be hig her than max. if neg ative current is injected on adjacent pins.
[1]
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Photon Datasheet v011
Pull-up and pull-down resistors are designed with a true resistance in series with switchable PMOS/NMOS. This
PMOS/NMOS contribution to the series resistance is minimum (~10% order).
[5]
5. Mechanical specifications
5.1 Dimensions and Weight
Headers
Dimensions in inches (mm)
Weight
With
1.4 4 x 0.8 x 0.27 (36.58 x 20.32 x 6.86)
5 grams
Without
1.4 4 x 0.8 x 0.17 (36.58 x 20.32 x 4 .32)
3.7 grams
5.2 Mating connectors
The Photon (with headers) can be mounted with (qty 2) 12-pin single row 0.1” f emale headers. Typically these are
0.335” (8.5mm) tall, but you may pick a taller one if desired. When you search f or parts like these it can be dif f icult to
navigate the thousands of parts available.
On Dig ikey.com, this section Rectangular Connectors - Headers, Receptacles, Female Sockets
contains 36,000 of them. Narrow the search with: 12 positions, 1 row, 0.1” (2.54 mm) pitch, Through Hole mounting
types (unless you want SMT), and sort by Price Ascending. You may f ind something like this:
Description
MFG
MFG Part Number
12-pin 0.1” Female Header (Tin)
Sullins Connector Solutions
PPTC121LFBN-RC
12-pin 0.1” Female Header (Gold)
Sullins Connector Solutions
PPPC121LFBN-RC
You may also search f or other types, such as reverse mounted (bottom side SMT) f emale headers, low prof ile types,
machine pin, etc..
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Photon Datasheet v011
5.3 Recommended pcb land pattern (Photon with headers)
The Photon (with headers) can be mounted with 0.1” 12-pin f emale header receptacles using the f ollowing PCB land
pattern:
This land pattern can be f ound in the Spark.lbr Eagle library, as a Device named PHOTON . Note: Clone or Download
the complete repository as a ZIP f ile to avoid corrupted data in Eagle f iles.
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Photon Datasheet v011
5.4 Recommended pcb land pattern (Photon without headers)
The Photon (without headers) can be surf ace mounted directly in an end application PCB using the f ollowing PCB land
pattern:
Solder mask around exposed copper pads should be 0.1mm (4 mils) larger in all directions. E.g., a 0.08” x 0.10” pad
would have a 0.088” x 0.108” solder mask.
This land pattern can be f ound in the Spark.lbr Eagle library, as a Device named PHOTON_SMD . Note: Clone or
Download the complete repository as a ZIP f ile to avoid corrupted data in Eagle f iles.
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Photon Datasheet v011
6. Layout
6.1 Photon v1.0.0 Top Layer (GTL)
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6.2 Photon v1.0.0 GND Layer (G2L)
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6.3 Photon v1.0.0 3V3 Layer (G15L)
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6.4 Photon v1.0.0 Bottom Layer (GBL)
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7. Recommended solder reflow profile
Phase
T emperatures and Rates
A-B.
Ambient~150°C, Heating rate: < 3°C/s
B-C.
150~200°C, soak time: 60~120 s
C-D.
200~24 5°C, Heating rate: < 3°C/s
D.
D-E.
Peak temp.: 235~24 5°C, Time above 220°C: 4 0~90 s
24 5~220°C, Cooling rate: < 1°C/s
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Photon Datasheet v011
8. Bill of Materials
Build your own design based on the Photon!
Qty
Device
Minimum
Specif ication
Package/Case
Part Designator
MFG.
MFG. PN
ANTENNA
2.4 GHz
Ceramic
5.0mm ×
2.0mm x
2.6mm
ANT1
Advanced
Ceramic X
AT7020-E3R0HBA
CERAMIC
CAPACITOR
22uF Ceramic
6.3V 10% X5R
0603
C4 ,C5
Samsung
CL10A226MQ8NRNC
CERAMIC
CAPACITOR
0.1uF Ceramic
6.3V 10% X5R
04 02
C6,C7,C8,C11,C12,C16
RongFu
04 02B104 K01A
CERAMIC
CAPACITOR
100pF
Ceramic 6.3V
10% X5R
04 02
C2,C3
Fenghua
04 02CG101J500NT
CERAMIC
CAPACITOR
10uF Ceramic
6.3V 10% X5R
0603
C9,C11,C13,C15
Sumsung
CL10A106MQ8NNNC
CERAMIC
CAPACITOR
(RF)
10pF Ceramic
6.3V 10% X5R
04 02
C1,C14 ,C17
Murata
GJM1555C1HR80BB01D
CONNECTOR
USB Micro-B
w/tabs & slots
USB-MICROB
X1
Kaweei
CMCUSB-5BFM2G-01-D
CONNECTOR
uFL
Connector
SMD
X2
Kaweei
P1163-014 0R
HEADER
Sing le String
1.2” Mating
Length
0.1” 12-pin
JP1,JP2
Kaweei
CP254 11-12G-S116-A
DIODE
Diode
Schottky 30V
3A
DO-220AA
D1
Vishay
SS3P3-M3/84 A
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Qty
Device
Minimum
Specif ication
Package/Case
Part Designator
MFG.
MFG. PN
DIODE (LED)
Blue
SMD 0603
LED1
Everlight
19-217/BHCZL1M2RY/3T
DIODE (LED)
LED RGB
Common
Anode
Dif f used SMD
4 -PLCC
(2.0mm x
2.0mm)
LED2
Cree
CLVBA-FKACAEDH8BBB7A363
INDUCTOR
2.2uH 1.5A
3mm x 3mm
L4
Taiyo
Yuden
NR3015T2R2M
INDUCTOR
(RF)
3.9nH RF
inductor
04 02
L3
Johanson
L-07C3N9SV6T
INDUCTOR
(RF)
4 .7nH RF
inductor
04 02
L1
Johanson
L-07C4 N7SV6T
INDUCTOR
(RF)
6.8nH RF
inductor
04 02
L2
Johanson
L-07C6N8JV6T
WI-FI + MCU
Broadcom WiFI + STM32
MCU
Custom USI
SMD
U1
USI
WM-N-BM-09-S
RF SWITCH
RF Switch
SPDT
UQFN-6
(1x1mm)
U3
Skyworks
SKY13350-385LF
POWER
REGULATOR
3.3V 1.5MHz
600mA High
Ef f iciency
PWM StepDown DC/DC
Converter
SOT23-5
U2
Richtek
RT8008-33GB
RESISTOR
100k 5%
04 02
R4
Fenghua
RC-02W104 FT
RESISTOR
22R 5%
04 02
R5,R6
Fenghua
RC-02W220JT
RESISTOR
10k 5%
04 02
R8
Fenghua
RC-02W103JT
RESISTOR
1k 5%
04 02
R1,R2,R3,R7
Fenghua
RC-02W102JT
SWITCH
Button 160g f
3.6mm x
3.1mm
SETUP,RESET
Haoyu
TS-1185A-C
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Photon Datasheet v011
9. Ordering information
Photons are available f rom store.particle.io in single quantities with and without headers, and also included in
dif f erent maker kits.
10. Qualification and approvals
Model number: PHOTONH
RoHS
CE
FCC ID: 2AEMI-PHOTON
IC: 20127-PHOTON
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Photon Datasheet v011
11. Product handling
11.1 Packaging
The Photon comes in two primary styles of packaging: Matchbox and Kit Box. The Matchbox contains the bare
essentials to g et you started, while the kit box contains a breadboard, Micro B USB cable, sticker, prototyping card and
a couple sensors to build your f irst internet connected project!
Photons without headers are also available in JEDEC style trays f or automated pick and place machines. Request
more details f rom us on this in the Contact section below.
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Photon Datasheet v011
11.2 Moisture sensitivity levels
The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. The PØ module on
the Photons dominate the MSL requirements and are rated level 3. In general, this precaution applies f or Photons
without headers. If ref lowing a Photon directly onto an application PCB, increased moisture levels prior to ref low can
damag e sensitive electronics on the Photon. A bake process to reduce moisture may be required.
For more inf ormation regarding moisture sensitivity levels, labeling, storage and drying see the MSL standard see
IPC/JEDEC J-STD-020 (can be downloaded f rom www.jedec.org).
11.3 ESD Precautions
The photon contains highly sensitive electronic circuitry and is an Electrostatic Sensitive Device (ESD). Handling a
photon without proper ESD protection may destroy or damage it permanently. Proper ESD handling and packag ing
procedures must be applied throug hout the processing, handling and operation of any application that incorporates
photons. ESD precautions should be implemented on the application board where the photon is mounted. Failure to
observe these precautions can result in severe damage to the photon!
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12. Default settings
The Photon comes preprogrammed with a bootloader and a user application called Tinker. This application works
with an iOS and Android app also named Tinker that allows you to very easily toggle digital pins, take analog and
digital readings and drive variable PWM outputs.
The bootloader allows you to easily update the user application via several dif f erent methods, USB, OTA, Serial YModem, and also internally via the Factory Reset procedure. All of these methods have multiple tools associated with
them as well.
You may use the online Web IDE Particle Build to code, compile and f lash a user application OTA (Over The Air). Particle
Dev is a local tool that uses the Cloud to compile and f lash OTA as well. There is also a package Spark DFU-UTIL f or
Particle Dev that allows f or Cloud compiling and local f lashing via DFU over USB. This requires dfu-util to be
installed on your system. ‘df u-util’ can also be used with Particle CLI f or Cloud compiling and local f lashing via the
command line. Finally the lowest level of development is available via the GNU GCC toolchain f or ARM, which of f ers
local compile and f lash via df u-util. This g ives the user complete control of all source code and f lashing methods. This
is an extensive list, however not exhaustive.
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Photon Datasheet v011
13. Glossary
SMPS
Switched-Mode Power Supply
RF
Radio Frequency
Castellated
The edg e of the PCB has plated holes that are cut in half which resemble the top of a castle. These make it
easy to solder the Photon down to another PCB with a SMT ref low process.
SMT
Surf ace Mount Technology (of ten associated with SMD which is a surf ace mount device).
AP
Access Point
LED
Light-Emitting Diode
RGB LED
Red green and blue LEDs combined and dif f used in one package.
USB
Universal Serial Bus
Quiescent current
Current consumed in the deepest sleep state
FT
Five-tolerant; Ref ers to a pin being tolerant to 5V.
3V3
+3.3V; The reg ulated +3.3V supply rail. Also used to note a pin is only 3.3V tolerant.
RT C
Real Time Clock
OT A
Over The Air; describing how f irmware is transf erred to the device.
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Photon Datasheet v011
14. FCC IC CE Warnings and End Product
Labeling Requirements
Federal Communication Commission Interf erence Statement
This equipment has been tested and f ound to comply with the limits f or a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are desig ned to provide reasonable protection against harmf ul interf erence in a residential
installation. This equipment generates, uses and can radiate radio f requency energy and, if not installed and used in
accordance with the instructions, may cause harmf ul interf erence to radio communications. However, there is no
guarantee that interf erence will not occur in a particular installation. If this equipment does cause harmf ul
interf erence to radio or television reception, which can be determined by turning the equipment of f and on, the user is
encouraged to try to correct the interf erence by one of the f ollowing measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit dif f erent f rom that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician f or help.
FCC Caution:
Any changes or modif ications not expressly approved by the party responsible f or compliance could void the user’s
authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the f ollowing two conditions:
1. This device may not cause harmf ul interf erence, and
2. This device must accept any interf erence received, including interf erence that may cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set f orth f or an uncontrolled environment. This
transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. This
End equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and
your body.
IMPORT ANT NOT E:
In the event that these conditions can not be met (f or example certain laptop conf igurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the
f inal product. In these circumstances, the OEM integrator will be responsible f or re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
(continued on next page)
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Photon Datasheet v011
End Product Labeling
The f inal end product must be labeled in a visible area with the f ollowing:
Contains FCC ID: 2AEMI-PHOTON
Manual Inf ormation to the End User
The OEM integrator has to be aware not to provide inf ormation to the end user regarding how to install or remove
this RF module in the user’s manual of the end product which integrates this module.
Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the f ollowing two
conditions:
1. This device may not cause interf erence; and
2. This device must accept any interf erence, including interf erence that may cause undesired operation of the
device.
Le présent appareil est conf orme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’ exploitation est autorisée aux deux conditions suivantes:
1. l’appareil ne doit pas produire de brouillage;
2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d’en compromettre le f onctionnement.
Caution Exposure:
This device meets the exemption f rom the routine evaluation limits in section 2.5 of RSS102 and users can obtain
Canadian inf ormation on RF exposure and compliance.
Le dispositif répond à l’exemption des limites d’évaluation de routine dans la section 2.5 de RSS102 et les utilisateurs
peuvent obtenir des renseig nements canadiens sur l’exposition aux RF et le respect.
T he f inal end product must be labelled in a visible area with the f ollowing:
The Industry Canada certif ication label of a module shall be clearly visible at all times when installed in the host device,
otherwise the host device must be labelled to display the Industry Canada certif ication number of the module,
preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the
same meaning, as f ollows:
Contains transmitter module IC: 20127-PHOTON
(continued on next page)
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Photon Datasheet v011
This End equipment should be installed and operated with a minimum distance of 20 centimeters between the
radiator and your body.
Cet équipement devrait être installé et actionné avec une distance minimum de 20 centimètres entre le radiateur et
votre corps.
The end user manual shall include all required regulatory inf ormation/warning as shown in this manual.
15. Revision history
Revision
Date
Author
Comments
30Mar2015
BW
Initial release
v003
7-Apr2015
BW
Updated template
v004
8-Apr2015
BW
Updated Overview, Block diagram, Power, RF, and Pin markings sections
v005
9-Apr2015
BW
Updated BOM
v006
21Apr2015
BW
Added JTAG, BT CO-EX, I/O Characteristics, Schematic, Layout, Ref low Prof ile,
Glossary, Updated Operating Conditions
v007
28Apr2015
BW
Added Layout, Updated analog pins, Land patterns, Packaging, Mating Connectors
v008
11May2015
BW
Updated BT CO-EX, PWM inf o, Qualif ications
v009
31May2015
BW
Updated Pinouts, DAC inf o, Height dimensions, Solder mask inf o, Recommended
operating conditions
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Revision
Date
Author
Comments
v010
1June2015
BW
Updated VBAT inf o
v011
22June2015
BW
Added FCC IC CE Warnings and End Product Labeling Requirements, Updated power
output, removed block diagram and schematics, added approved antennas
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Photon Datasheet v011
16. Contact
Web
https://www.particle.io
Community Forums
https://community.particle.io
Email
hello@particle.io
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