AN551 Crystal Selection Guide For Si5351
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AN551 C R YS TA L S ELECTION G UIDE FOR Si5350/51 D EVICES 1. Introduction The Si5350/51 Any-Frequency CMOS Clock Generator + VCXO features an onboard crystal oscillator and VCXO that utilizes a standard, non-pullable 25/27 MHz crystal, PLLs, and MultiSynth fractional dividers to generate up to eight unique non-integer-related frequencies with exact frequency (0 ppm error). The Si5350/51 also features onboard crystal load capacitors ranging from 6 to 10 pF selectable through factory programming on the pincontrolled Si5350 or via an I2C interface available on the Si5351. This application note provides guidance on the selection of crystals that use the internal load capacitors or a combination of internal and external load capacitors and describes the operation of the crystal oscillator and the VCXO. XA CL1 PLLA Multi Synth 1 OSC XB Multi Synth 0 PLLB CL2 Multi Synth N I2C Si5351A SSEN OEB Figure 1. Si5351A Driven by a Standard, Non-Pullable Crystal Rev. 0.3 3/12 Copyright © 2012 by Silicon Laboratories AN551 AN551 2. Crystal Selection, Load Capacitors, and Layout Guidelines 2.1. Crystal Selection and Load Capacitors The Si5350/51 supports both 25 MHz and 27 MHz crystals and has integrated crystal load capacitors, eliminating the need for external components. Alternatively, the Si5350/51 can be configured to use a combination of internal and external load capacitors. 2.1.1. Internal Load Capacitors Since the Si5350/51 has onboard load capacitors, it is recommended to select crystals with load capacitance specifications supported by the Si5350/51. For ease of use, Silicon Labs has qualified a number of crystals for use with the Si5350/51. Table 1 lists the crystals that have been qualified for use with the Si5350/51. The Si5350/51, however, can also function with crystals that are not listed. In this case, select crystals with a load capacitance specification meeting the Si5350/51 data sheet specifications, with an ESR rating less than 150, and housed in a 5x7 mm2 or smaller package. Crystals packaged in an HC-49 metal can are not recommended for use with the Si5350/51. Table 1. Si5350/51 Qualified Crystals MFR PN Freq (MHz) CL (pF) Accuracy (ppm) Stability over Temp (ppm) Epson FA-238 25.0000MB-K 25 10 ±50 ±30 Kyocera CX3225SB25000D0FLJZ1 25 8 ±10 ±15 Kyocera CX3225SB27000D0FLJZ1 27 8 ±10 ±15 NDK NX3225GA-25.000M-STD-CRG-2 25 8 ±20 ±30 NDK NX3225GA-27.000M-STD-CRG-2 27 8 ±20 ±30 TXC 7M-27.000MEEQ 27 10 ±10 ±10 Sunny SP10115J6-25.000 MHz 25 10 ±15 ±30 Sunny SP10115J6-27.000 MHz 27 10 ±15 ±30 2.1.2. External and Internal Load Capacitors The Si5350/51 can use both internal and external load capacitors simultaneously to meet a crystal's load capacitor requirement. When using both internal and external load capacitors, it is recommended that external load capacitors of less than 2 pF and total load capacitance less than or equal to 12 pF be used to minimize additive jitter associated with larger external capacitors. 2 Rev. 0.3 AN551 2.2. Layout Guidance The Si5350/51's crystal oscillator is an analog circuit; so, layout of the crystal should follow analog rules. The following is a list of general crystal layout guidelines. 1. Since the total load capacitance is the summation of PCB trace capacitance and pin capacitance at the XA and XB pins, it is recommended that a crystal be placed as close to the Si5350/51 as possible to minimize parasitic capacitance. 2. Minimize trace lengths to less than 9 mm. 3. Clocks and frequently switched signals should not be routed close to the crystal. 4. Crystal traces should be protected with ground traces and guard rings. 5. Guard rings should not be connected to other ground connections on the PCB. 6. When two-layer PCBs are used, digital signals should not be routed on the opposite side of the PCB directly under the crystal. 7. It is recommended to fill the opposite side of the PCB under the crystal with a clean ground plane. Board Supply XA 1 XB 2 16 CLK6 5 11 Place crystal close to the Si5350/51 VDD island for the clock 10 P2 17 CLK5 CLK1 9 12 CLK2 4 8 P1 CLK3 CLK0 7 13 P4 3 CLK7 14 GND PAD 6 P0 15 P3 Wide traces 20 XTAL 18 VIAS GND 19 CLK4 VDD Decoupling Cap Figure 2. Si5350/51 Layout Example Rev. 0.3 3 AN551 3. Crystal Oscillator 3.1. Oscillator Model The Si5350/51 crystal oscillator is based on a Pierce Oscillator architecture as shown Figure 3. The oscillator contains an Automatic Gain Control Circuit (AGC), which operates in high-gain and normal-gain modes. Upon startup, the AGC is configured in high-gain mode and the amplifier generates a large negative resistance (–R) to ensure crystal startup. Once a stable frequency of operation is achieved, the AGC is configured in normal gain mode, and (–R) is lowered to maintain oscillation. 180 Amplifier 360 CL1 Loop Gain = 1 CL2 180 Figure 3. Si5350/51 Oscillator Circuit When the crystal oscillator is in high-gain mode, the closed loop gain (GLP) around the loop is greater than 1 to guarantee crystal start up. In normal gain mode, GLP is reduced to 1 to maintain oscillation. Table 2. Crystal Oscillators Modes 4 Mode Gain Loop Gain Startup High Gain, High (–R) GLP ≥ 1 Sustained Oscillation Normal Gain, Normal (–R) GLP = 1 Rev. 0.3 AN551 3.2. Oscillator Accuracy The Si5350/51 output accuracy depends on the reference clock, crystal, and mismatch between the external and internal load capacitance. Accuracy does not depend on the Si5350/51 PLLs since it is able to generate any combination of output frequencies exactly to (0 ppm) frequency synthesis error. The generated output frequency accuracy can be modeled using a simple equivalent electrical circuit. The motional inductance and motional capacitance determine the resonant frequency. Lm C0 R C1 Symbols: Crystal Resistance: R Motional Inductance/Capacitance: LM, C1 Packaging Capacitance: C0 Figure 4. Equivalent Crystal Model From this model, the frequency of the crystal oscillator can be modelled as Equation 1. Equation 1 accounts for the inaccuracy caused by the mismatched capacitor loading and takes into account factors including packaging capacitance and total load capacitance. C1 1 1 f OUTPUT = f CRYSTAL 1 – ------- ------------------------------- + --------------------------- 2 C 0 + C SPEC C 0 + C CTL Symbols: Crystal Oscillator Frequency: f OUTPUT Crystal Frequency: fCRYSTAL Crystal Load Capacitance Specification: C SPEC Total Crystal Load Capacitance: C TL Package Capacitance: C 0 Motional Capacitance: C 1 Equation 1. Crystal Oscillator Frequency Based on this equation, when the total capacitance is less than a crystal’s load specification, the output frequency is less than the target frequency. In addition, when the total capacitance is greater than a crystal’s load specification, the output frequency is greater than its target frequency. Table 3 summarizes the various cases of total load vs. accuracy. Rev. 0.3 5 AN551 Table 3. Crystal Accuracy vs. Load Capacitance Case Accuracy CSPEC = CTL 0 ppm CSPEC > CTL –ppm CSPEC < CTL +ppm The following example illustrates this relationship. Figure 5 summarizes the measured crystal frequency results when an Si5350/51 was tested with a 12 pF crystal. The load was varied, and the crystal frequency was determined. When the total crystal load was 12 pF, the generated frequency was 0 ppm; when the total crystal load was less than 12 pF, the generated frequency was greater than 0 ppm, and when the total crystal load was greater than 12 pF, the generated frequency was less than 0 ppm. Further, it is recommended that crystals with a total crystal load capacitance less than or equal 12 pF be used. ppm vs. CL 250 200 150 100 ppm 50 0 -50 0 10 20 30 40 50 60 70 -100 -150 -200 -250 CL(pF) Figure 5. Crystal Driver Frequency vs. Crystal Load 3.3. Reactance Electrically, a crystal is a series resonant circuit, and the reactance of the crystal is a function of its frequency. A crystal's reactance is 0 at both the series resonant frequency (fS) and parallel resonant frequency (fP). fS depends on C1 and LM, given by Equation 2. 1 f s = --------------------------2 LmC 1 "" Symbols: Series Resonance Frequency: F S Motional Inductance: L M Motional Capacitance: C 1 Equation 2. Series Resonant Frequency 6 Rev. 0.3 AN551 FP is like FS, but FP takes into account the packaging capacitance, C0, and is given by Equation 3. C1 1 f P = f S 1 + ------------------------- , where f S = ------------------------- C0 + CL 2 L M C 1 Symbols: Parallel/Series Resonant Frequency: f P f S Motional Inductance/Capacitance: L M C 1 Packaging Capacitance: C 0 Equation 3. Parallel Resonant Frequency As shown in Figure 6, negative reactance effectively looks inductive, and positive reactance effectively looks capacitive. Figure 6. Crystal Effective Reactance 3.4. ESR Value When selecting a crystal, a crystal’s equivalent series resistance value (ESR) is an important parameter to consider. ESR depends on RM, C0, and CL, where CL is the required load capacitance of a crystal and is calculated by Equation 4. Note that the Si5350/51 can be used with crystals with an ESR greater than 150 . C0 2 ESR = R M 1 + ------- C L Symbols: Electrical Series Resistance: ESR Packaging Resistance: R M Packaging Capacitance: C 0 Specified Load Capacitance: C L Equation 4. Equivalent Series Resistance Rev. 0.3 7 AN551 ESR represents the loss of the crystal oscillator. Smaller crystals (especially crystals housed in SMD packages) tend to have larger ESR values. A higher ESR value represents higher loss. If the ESR value is too high, the crystal oscillator may fail to start, become unstable, or even stop oscillating. The (–R) of the Si5350/51's crystal oscillator is used to overcome the ESR of a crystal. (–R) of the Si5350/51 can be determined by adding a resistor in series with a crystal as show in Figure 7. RQ CL1 CL2 Figure 7. (–R) Test In order to determine the (–R) of the crystal oscillator, the series resistance (RQ) is slowly increased until the oscillator fails to start up or fails to sustain oscillation. RQ can be realized with an SMD potentiometer. The (–R) test is performed by the startup and stop procedures described below. 3.4.1. Test 1: Startup Test Procedure 1. Place an SMD resistor (RQ) in series with the crystal. 2. Power-on the device, and check if oscillation begins. Then, repeat the test by slowly incrementing the resistor value until the Si5350/51 fails to start. 3. The highest value resistor when the Si5350/51 fails to start is the startup value, RQ. 3.4.2. Test 2: Stop Test Procedure 1. While the Si5350/51 is running, increase the resistor value until oscillation stops. 2. Once oscillation stops, reduce RQ until oscillation starts. 3. The highest RQ value with which the oscillator runs is the stop value. 4. The stop value should be equal to the startup value, RQ. Once RQ is determined, the Safety Factor (SF) shown in Equation 5 determines whether the crystal driver has enough (–R) to start the crystal and sustain oscillation. R Q + ESR SF = --------------------------ESR "" Symbols: Safety: SF Critical Resistance: R Q Electrical Series Resistance: ESR Equation 5. Safety Factor Equation 8 Rev. 0.3 AN551 An SF value of (SF > 5) is needed to ensure stable oscillation. In addition, because the Si5350/51 crystal oscillator has an AGC, it is safe to operate the Si5350/51 with (SF >> 10). Table 4 summarizes the various ranges of SF values. Table 4. Safety Factor Values SF Value Qualification SF ≥ 5 Minimum Safe Value SF >> 10 Very Safe Value 3.5. Negative Resistance The (–R) was determined for the Si5350/51 using various crystals with different packaging capacitance (C0). The data below illustrates the (–R) as a function of C0. 3.5.1. CL = 6 pF Table 5. R1, C0 Requirement—27 MHz Crystal (Safety Factor = 1) Startup and Steady State – C0 (pF) ESR () 5 337 4.5 385 4 445 3.5 517 3 606 2.5 716 2 852 Table 6. R1, C0 Requirement—25 MHz Crystal (Safety Factor = 1) Startup and Steady State – C0 (pF) ESR () 5 356 4.5 410 4 476 3.5 557 3 659 2.5 787 2 948 Rev. 0.3 9 AN551 3.5.2. CL = 8 pF Table 7. R1, C0 Requirement—27 MHz Crystal (Safety Factor = 1) Startup and Steady State – C0 (pF) ESR () 5 333 4.5 368 4 409 3.5 455 3 508 2.5 568 2 637 Table 8. R1, C0 Requirement—25 MHz Crystal (Safety Factor = 1) 10 Startup and Steady State – C0 (pF) ESR () 5 367 4.5 408 4 456 3.5 510 3 573 2.5 646 2 730 Rev. 0.3 AN551 3.5.3. CL = 10 pF Table 9. R1, C0 Requirement—27 MHz Crystal (Safety Factor = 1) Startup and Steady State – C0 (pF) ESR () 5 288 4.5 311 4 336 3.5 365 3 396 2.5 430 2 468 Table 10. R1, C0 Requirement—25 MHz Crystal (Safety Factor = 1) Startup and Steady State – C0 (pF) ESR () 5 326 4.5 353 4 384 3.5 418 3 456 2.5 497 2 543 Rev. 0.3 11 AN551 4. VCXO The Si5350/51 VCXO is an advancement in VCXO technology because it modulates the PLL parameters instead of pulling a crystal to generate the VCXO pull curve. Since the Si5350/51’s VCXO does not pull a crystal, the Si5350/51 eliminates the need for high-cost, custom pullable crystals and provides multiple benefits outlined in Table 11. Table 11. Si5350/51 VCXOs vs Conventional VCXOs Conventional VCXOs Si5350/51 VCXO High cost, custom pullable crystal Standard, low cost, non-pullable crystal Vactor-based non-linearity limits operating range Highly linear range: 10–90 VDD Potential crystal startup issues Reliable startup and operation Limited crystal sourcing options Simplified crystal sources With competing VCXOs, the following crystal parameters must be considered: 1. C0/C1 ratio 2. Max drive level 3. Mechanical third overtone and location of associated harmonic spurs It has been determined that, if a crystal does not have an adequate C0/C1 ratio (for competitor’s VCXO), undesirable results can be generated as shown in Figure 8. In contrast, the Si5350/51 makes use of standard, nonpullable, low-cost crystals; therefore, special consideration is not required. In addition, the Si5350/51 VCXO has been designed so that the performance of the pull curve does not vary with temperature, supply voltage, or the model of crystal used. Further, the VCXO pull curve can be generated directly from a clock signal on the Si535xC since the Si5350/51 does not pull a crystal like competing devices. Figure 8. Competitors VCXO “Bump” Further, because the Si5350/51 VCXO function changes the PLL parameters, the resulting VCXO transfer function is substantially more linear than competing devices which "pull" the crystal. Figure 9 shows the actual measured linearity of the Si5350/51 compared to the competition. 12 Rev. 0.3 AN551 Figure 9. KVCO Comparison of the Si5350/51 vs Competing Solutions C L1 C L2 C L = -------------------------C L1 + C L2 Equation 6. Equivalent Crystal Load Capacitance 4.1. Crystal Manufacturers http://www.eea.epson.com http://global.kyocera.com/index.html http://www.ndk.com/en http://www.txc.com.tw http://www.sunny-usa.com Rev. 0.3 13 AN551 DOCUMENT CHANGE LIST Revision 0.1 to Revision 0.2 Added "2.2. Layout Guidance" on page 3. Added "3.1. Oscillator Model" on page 4 to illustrate startup gain vs. sustained oscillation gain. Updated "3.2. Oscillator Accuracy" on page 5. Added "3.4. ESR Value" on page 7. Revision 0.2 to Revision 0.3 14 In “3.5. Negative Resistance” text, replaced “motional” with “packaging.” Rev. 0.3 AN551 NOTES: Rev. 0.3 15 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW Quality Support and Community www.silabs.com/CBPro www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. 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