Discovery Kit For LoRaWAN™ And LPWAN Protocols With STM32L0 B L072Z LRWAN1 User Manual

• Figure 1. B-L072Z-LRWAN1 LoRa® Discovery kit
• 1 Features
• 2 Product marking
• 3 Conventions
  • Table 1. ON/OFF conventions
• 4 System requirements
• 5 Development toolchains
• 6 Demonstration software
• 7 Ordering and product information
  • Table 2. Ordering information
• 8 Hardware layout and configuration
  • Figure 2. Hardware block diagram
  • Figure 3. B-L072Z-LRWAN1 top layout
  • Figure 4. B-L072Z-LRWAN1 bottom layout
  • 8.1 B-L072Z-LRWAN1 Discovery kit mechanical drawing
    • Figure 5. B-L072Z-LRWAN1 mechanical drawing
  • 8.2 Embedded ST-LINK/V2-1
    • 8.2.1 Drivers
      • Figure 6. USB composite device
    • 8.2.2 ST-LINK/V2-1 firmware upgrade
  • 8.3 Power supply
  • 8.4 IDD measurements
    • Table 3. IDD measurements and solder-bridge settings
  • 8.5 Clock sources
  • 8.6 Reset sources
  • 8.7 Antenna and RF connection
    • Figure 7. RF signal path and connectors
  • 8.8 Virtual COM port
  • 8.9 Buttons and LEDs
    • Table 4. Assignment of the control ports
  • 8.10 USB FS
• 9 Connectors
  • 9.1 Arduino Uno V3 connectors
    • Table 5. Arduino Uno V3 connectors
  • 9.2 B-L072Z-LRWAN1 Discovery kit CN2 and CN3 connectors
    • Table 6. Connector CN2
    • Table 7. Connector CN3
  • 9.3 Other connectors
    • 9.3.1 Debug connector SWD
      • Table 8. Debug connector SWD (CN12)
    • 9.3.2 SWD Interface
    • 9.3.3 External +3.3 V
      • Table 9. External +3.3 V (CN13)
  • 9.4 Description of the jumpers
    • Table 10. Description of the jumpers
  • 9.5 Configuration of the solder bridges
    • Table 11. Configuration of the solder bridges
    • Figure 8. B-L072Z-LRWAN1: location of the solder bridges (top view)
    • Figure 9. B-L072Z-LRWAN1: location of the solder bridges (bottom view)
• 10 B-L072Z-LRWAN1 Discovery kit information
  • 10.1 Identification
  • 10.2 Board revision history
  • 10.3 Known limitations
• Appendix A Schematic diagrams
  • Figure 10. B-L072Z-LRWAN1 Discovery kit, Top view
  • Figure 11. Power
  • Figure 12. ST-LINK/V2-1
  • Figure 13. LoRa module
  • Figure 14. USB 2.0 FS and antenna
  • Figure 15. Connectors
• Appendix B Federal Communications Commission (FCC), Industry Canada (IC) Compliance and other Certifications
  • B.1 FCC Compliance Statement
    • B.1.1 ANSI C63.4 (2014) American National Standard for Methods of Measurement of Radio-Noise Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz
  • B.2 IC Compliance Statement
    • B.2.1 Industry Canada Licence-Exempt Radio Apparatus
    • B.2.2 Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus
  • B.3 Other certifications
    • B.3.1 EN 55032 (2012) / EN 55024 (2010) ETSI EN 301 489-1 (v1.9.2) / ETSI EN 301 489-3 (v1.6.1) EN 60950-1 (2006+A11/2009+A1/2010+A12/2011+A2/2013) CFR 47, FCC Part 15,Subpart B (Class B Digital Device) and Industry Canada ICES-003 (Issue 6/2016)
    • B.3.2 Electrical Safety qualification for CE marking: EN 60950-1 (2006+A11/2009+A1/2010+A12/2011+A2/2013) IEC 60650-1 (2005+A1/2009+A2/2013)
    • B.3.3 EMC qualification accordingly to standard CFR 47, FCC Part 15, Subpart B & Industry Canada ICES-003 (Issue 6/2016) Class B Digital Device
    • B.3.4 CE qualification according to standards: ETSI EN 300 220-1 V2.4.1 (2012) / V3.1.1 (2017) ETSI EN 300 220-2 V2.4.1 (2012) / V3.1.1 (2017) RF Module already certified – Partial test only
• Revision history
  • Table 12. Document revision history