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ESP32-PICO-D4 Datasheet Espressif Systems August 31, 2017 About This Guide This document provides an introduction to the specifications of the ESP32-PICO-D4 module. The document structure is as follows: Chapter Title Subject Chapter 1 Overview An overview of the ESP32-PICO-D4 module. Chapter 2 Pin Definitions Pinout and pin descriptions. Chapter 3 Functional Description Description of functional modules and protocols. Chapter 4 Electrical Characteristics Electrical characteristics and specifications of ESP32-PICO-D4. Chapter 5 Schematics Schematics of ESP32-PICO-D4. Chapter 6 Package Information Package information of ESP32-PICO-D4. Chapter 7 Learning Resources ESP32-related must-read materials and must-have resources. Release Notes Date Version Release notes 2017.08 V1.0 First release. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe here. Certificates Download certificates for Espressif products from here. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2017 Espressif Inc. All rights reserved. Contents 1 Overview 1 2 Pin Definitions 3 2.1 Pin Layout 3 2.2 Pin Description 3 2.3 Strapping Pins 5 3 Functional Descriptions 7 3.1 CPU and Internal Memory 7 3.2 External Flash and SRAM 7 3.3 Crystal Oscillators 7 3.4 Peripherals and Sensors 8 3.5 RTC and Power Consumption 8 4 Electrical Characteristics 10 4.1 Absolute Maximum Ratings 10 4.2 Wi-Fi Radio 10 4.3 Bluetooth LE Radio 11 4.3.1 Receiver 11 4.3.2 Transmit 11 Reflow Profile 12 5 Schematics 13 6 Peripheral Schematics 14 7 Package Information 15 8 Learning Resources 16 8.1 Must-Read Documents 16 8.2 Must-Have Resources 16 4.4 List of Tables 1 ESP32-PICO-D4 Specifications 1 2 Pin Description 3 3 Strapping Pins 6 4 Functionalities Depending on the Power Modes 8 5 Power Consumption by Power Modes 9 6 Absolute Maximum Ratings 10 7 Wi-Fi Radio Characteristics 10 8 Receiver Characteristics – BLE 11 9 Transmit Characteristics - BLE 11 List of Figures 1 ESP32-PICO-D4 Pin Layout 3 2 Reflow Profile 12 3 ESP32-PICO-D4 Module Schematics 13 4 ESP32-PICO-D4 Module Peripheral Schematics 14 5 ESP32-PICO-D4 Package 15 1. OVERVIEW 1. Overview The ESP32-PICO-D4 is a System-in-Package (SIP) module that is based on ESP32, providing complete Wi-Fi and Bluetooth functionalities. The module has a size as small as 7.0±0.1 mm×7.0±0.1 mm×0.94±0.1 mm, thus requiring minimal PCB area. The module integrates a 4-MB SPI flash. At the core of this module is the ESP32 chip*, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip designed with TSMC’s 40 nm ultra-low power technology. ESP32-PICO-D4 integrates all peripheral components seamlessly, including a crystal oscillator, flash, filter capacitors and RF matching links in one single package. Given that no other peripheral components are involved, module welding and testing is not required either. As such, ESP32-PICO-D4 reduces the complexity of supply chain and improves control efficiency. With its ultra-small size, robust performance and low-energy consumption, ESP32-PICO-D4 is well suited for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors and other IoT products. Note: * For details on ESP32, please refer to the document ESP32 Datasheet. Table 1 provides the specifications of the ESP32-PICO-D4 module. Table 1: ESP32-PICO-D4 Specifications Categories Items Specifications 802.11 b/g/n/e/i (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support Frequency range 2.4 ~ 2.5 GHz Protocols Bluetooth V4.2 BR/EDR and BLE specification NZIF receiver with -97 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Audio CVSD and SBC ADC, LNA pre-amplifier, DAC, touch sensor, SD/SDIO/MMC Module interface Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, infrared remote controller, GPIO Hardware On-chip sensor Hall sensor, temperature sensor On-board clock 40 MHz crystal Operating voltage/Power supply 2.3 ~ 3.6V Operating current Average: 80 mA Minimum current delivered by power supply 500 mA Operating temperature range -40°C ~ 85°C Ambient temperature range Normal temperature Package size 7.0±0.1 mm x 7.0±0.1 mm x 0.94±0.1 mm Espressif Systems 1 ESP32-PICO-D4 Datasheet V1.0 1. OVERVIEW Categories Software Items Specifications Wi-Fi mode Station/SoftAP/SoftAP+Station/P2P Wi-Fi security WPA/WPA2/WPA2-Enterprise/WPS Encryption AES/RSA/ECC/SHA Firmware upgrade Software development UART Download / OTA (via network / download and write firmware via host) Supports Cloud Server Development / SDK for custom firmware development Network protocols IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT User configuration AT instruction set, cloud server, Android/iOS app Espressif Systems 2 ESP32-PICO-D4 Datasheet V1.0 2. PIN DEFINITIONS 2. Pin Definitions CAP1_NC CAP2_NC VDDA XTAL_P_NC XTAL_N_NC VDDA IO21 U0TXD U0RXD IO22 IO19 VDD3P3_CPU 48 47 46 45 44 43 42 41 40 39 38 37 2.1 Pin Layout VDDA 1 36 IO23 LNA_IN 2 35 IO18 VDDA3P3 3 34 IO5 VDDA3P3 4 33 SD1 SENSOR_VP 5 32 SD0 SENSOR_CAPP 6 31 CLK SENSOR_CAPN 7 30 CMD SENSOR_VN 8 29 SD3 EN 9 28 SD2 IO34 10 27 IO17 IO35 11 26 VDD_SDIO_NC IO32 12 25 IO16 19 20 21 22 23 24 IO13 IO15 IO2 IO0 IO4 17 IO14 VDD3P3_RTC 16 IO27 18 15 IO26 IO12 14 IO25 IO33 13 ESP32-PICO 49: GND Figure 1: ESP32-PICO-D4 Pin Layout 2.2 Pin Description The ESP32-PICO-D4 module has 49 pins. See pin definitions in Table 2. Table 2: Pin Description Name No. Type Function Analog VDDA 1 P Analog power supply (2.3V ~ 3.6V) LNA_IN 2 I/O RF input and output VDDA3P3 3 P Power supply amplifier (2.3V ~ 3.6V) VDDA3P3 4 P Power supply amplifier (2.3V ~ 3.6V) Espressif Systems 3 ESP32-PICO-D4 Datasheet V1.0 2. PIN DEFINITIONS Name No. Type Function GPIO36, ADC_PRE_AMP, ADC1_CH0, RTC_GPIO0 SENSOR_VP 5 I Note: Connects a 270 pF capacitor from SENSOR_VP to SENSOR_CAPP, when used as ADC_PRE_AMP. GPIO37, ADC_PRE_AMP, ADC1_CH1, RTC_GPIO1 SENSOR_CAPP 6 I Note: Connects a 270 pF capacitor from SENSOR_VP to SENSOR_CAPP, when used as ADC_PRE_AMP. GPIO38, ADC1_CH2, ADC_PRE_AMP, RTC_GPIO2 SENSOR_CAPN 7 I Note: Connects a 270 pF capacitor from SENSOR_VN to SENSOR_CAPN, when used as ADC_PRE_AMP. GPIO39, ADC1_CH3, ADC_PRE_AMP, RTC_GPIO3 SENSOR_VN 8 I Note: Connects a 270 pF capacitor from SENSOR_VN to SENSOR_CAPN, when used as ADC_PRE_AMP. Chip Enable (Active High) EN 9 I High: On; chip works properly Low: Off; chip works at the minimum power Note: Do not leave CHIP_PU pin floating IO34 10 I ADC1_CH6, RTC_GPIO4 IO35 11 I ADC1_CH7, RTC_GPIO5 IO32 12 I/O IO33 13 I/O IO25 14 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 15 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 16 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 17 I/O IO12 18 I/O VDD3P3_RTC 19 P IO13 20 I/O IO15 21 I/O IO2 22 I/O IO0 23 I/O IO4 24 I/O IO16 25 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT VDD_SDIO_NC 26 - NC IO17 27 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 SD2 28 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SD3 29 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD Espressif Systems 32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, MTCK, HSPID, HS2_DATA2, SD_DATA2, EMAC_TXD3 RTC IO power supply input (1.8V ~ 3.6V) ADC2_CH4, TOUCH4, RTC_GPIO14, HS2_DATA3, SD_DATA3, EMAC_RX_ER ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER 4 ESP32-PICO-D4 Datasheet V1.0 2. PIN DEFINITIONS Name No. Type Function CMD 30 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS CLK 31 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SD0 32 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SD1 33 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO5 34 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK IO18 35 I/O GPIO18, VSPICLK, HS1_DATA7 IO23 36 I/O GPIO23, VSPID, HS1_STROBE VDD3P3_CPU 37 P CPU IO power supply input (1.8V ~ 3.6V) IO19 38 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 IO22 39 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 U0RXD 40 I/O GPIO3, U0RXD, CLK_OUT2 U0TXD 41 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO21 42 I/O GPIO21, VSPIHD, EMAC_TX_EN VDDA 43 P Analog power supply (2.3V ~ 3.6V) XTAL_N_NC 44 - NC XTAL_P_NC 45 - NC VDDA 46 P Digital power supply for PLL (2.3V ~ 3.6V) CAP2_NC 47 - NC CAP1_NC 48 - NC GND 49 P Ground Note: Pins IO16, IO17, CMD, CLK, SD0 and SD1 are used for connecting the embedded flash, and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Section 5 Schematics: • MTDI • GPIO0 • GPIO2 • MTDO • GPIO5 Software can read the value of these five bits from the register ”GPIO_STRAPPING”. During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device boot mode, the operating voltage of VDD_SDIO and other system initial settings. Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impendence, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. Espressif Systems 5 ESP32-PICO-D4 Datasheet V1.0 2. PIN DEFINITIONS To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32. After reset, the strapping pins work as the normal functions pins. Refer to Table 3 for detailed boot modes’ configuration by strapping pins. Table 3: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default MTDI Pull-down 3.3V 1.8V 0 1 Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don’t-care 0 Debugging Log on U0TXD During Booting Pin Default U0TXD Toggling U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave Pin Default MTDO GPIO5 Falling-edge Input Falling-edge Input Rising-edge Input Rising-edge Input Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output Pull-up 0 0 1 1 Pull-up 0 1 0 1 Note: Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO Slave”, after booting. Espressif Systems 6 ESP32-PICO-D4 Datasheet V1.0 3. FUNCTIONAL DESCRIPTIONS 3. Functional Descriptions This chapter describes the modules integrated in ESP32-PICO-D4, and their functions. 3.1 CPU and Internal Memory ESP32 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes: • 448 KB of ROM for booting and core functions. • 520 KB (8 KB RTC FAST Memory included) of on-chip SRAM for data and instruction. – 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID. 3.2 External Flash and SRAM ESP32 supports up to four 16-MB of external QSPI flash and SRAM with hardware encryption based on AES to protect developers’ programs and data. ESP32 can access the external QSPI flash and SRAM through high-speed caches. • Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. • Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and 32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM. The ESP32-PICO-D4 module integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. Note: The operating voltage of ESP32-PICO-D4’s integrated external SPI flash is 3.3V. Therefore, the strapping pin MTDI should hold bit ”0” during the module power-on reset. 3.3 Crystal Oscillators ESP32-PICO-D4 integrates a 40 MHz crystal oscillator. Espressif Systems 7 ESP32-PICO-D4 Datasheet V1.0 3. FUNCTIONAL DESCRIPTIONS 3.4 Peripherals and Sensors Please refer to Section 4 Peripherals and Sensors in ESP32 Datasheet. Note: Users should note that pins of the embedded ESP32 chip, that are used for connecting peripherals, such as the flash or PSRAM, are not recommended for other uses. For details, please see Section 5 Schematics. 3.5 RTC and Power Consumption With the use of advanced power management technologies, ESP32 can switch between different power modes (see Table 4). • Power modes – Active mode: The chip radio is powered on. The chip can receive, transmit, or listen. – Modem-sleep mode: The CPU is operational and the clock is configurable. The Wi-Fi/Bluetooth baseband and radio are disabled. – Light-sleep mode: The CPU is paused. The RTC memory and RTC peripherals, as well as the ULP co-processor are running. Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake up the chip. – Deep-sleep mode: Only the RTC memory and RTC peripherals are powered on. Wi-Fi and Bluetooth connection data are stored in the RTC memory. The ULP co-processor can work. – Hibernation mode: The internal 8-MHz oscillator and ULP co-processor are disabled. The RTC recovery memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs are active. The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode. • Sleep Patterns – Association sleep pattern: The power mode switches between the Active mode, Modem- and Lightsleep mode during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radio are woken up at predetermined intervals to keep Wi-Fi/BT connections alive. – ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP co-processor takes sensor measurements and wakes up the main system, based on the data collected from sensors. Table 4: Functionalities Depending on the Power Modes Power mode Active Modem-sleep Light-sleep Association sleep pattern Sleep pattern Deep-sleep ULP sensor- monitored pattern Hibernation - CPU ON ON PAUSE OFF OFF Wi-Fi/BT baseband and radio ON OFF OFF OFF OFF ON ON ON ON OFF ON ON ON ON/OFF OFF RTC memory and RTC peripherals ULP co-processor Espressif Systems 8 ESP32-PICO-D4 Datasheet V1.0 3. FUNCTIONAL DESCRIPTIONS The power consumption varies with different power modes/sleep patterns and work statuses of functional modules. Please see Table 5 for details. Table 5: Power Consumption by Power Modes Power mode Description Power consumption Wi-Fi Tx packet 14 dBm ~ 19.5 dBm Active (RF working) Wi-Fi / BT Tx packet 0 dBm Please refer to ESP32 Datasheet. Wi-Fi / BT Rx and listening Association sleep pattern (by Light-sleep) 1 mA ~ 4 mA @DTIM3 Max speed 240 MHz: 30 mA ~ 50 mA Modem-sleep Normal speed 80 MHz: 20 mA ~ 25 mA The CPU is powered on. Slow speed 2 MHz: 2 mA ~ 4 mA Light-sleep - 0.8 mA The ULP co-processor is powered on. 150 µA ULP sensor-monitored pattern 100 µA @1% duty RTC timer + RTC memory 10 µA Hibernation RTC timer only 5 µA Power off CHIP_PU is set to low level, the chip is powered off 0.1 µA Deep-sleep Note: • During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to work. • When the system works in the ULP sensor-monitored pattern, the ULP co-processor works with the ULP sensor periodically; ADC works with a duty cycle of 1%, so the power consumption is 100 µA. Espressif Systems 9 ESP32-PICO-D4 Datasheet V1.0 4. ELECTRICAL CHARACTERISTICS 4. Electrical Characteristics Note: The specifications in this chapter have been tested under the following general condition: VDD = 3.3V, TA = 27°C, unless otherwise specified. 4.1 Absolute Maximum Ratings Table 6: Absolute Maximum Ratings Parameter 1 Power supply Minimum current delivered by power supply Input low voltage Symbol Min Typ Max Unit VDD 2.3 3.3 3.6 V IV DD 0.5 - - A VIL -0.3 - 0.25×VIO 2 Input high voltage VIH 0.75×VIO Input leakage current IIL Input pin capacitance Cpad Output low voltage VOL 2 2 V - VIO +0.3 V - - 50 nA - - 2 2 pF 2 - 0.1×VIO V - - V Output high voltage VOH 0.8×VIO Maximum output drive capability IM AX - - 40 mA Storage temperature range TST R -40 - 85 °C Operating temperature range TOP R -40 - 85 °C 1. The power supplies include VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO. The VDD_SDIO also supports 1.8V mode. 2. VIO is the power supply for a specific pad. More details can be found in the ESP32 Datasheet, Appendix IO_MUX. For example, the power supply for SD_CLK is the VDD_SDIO. 4.2 Wi-Fi Radio Table 7: Wi-Fi Radio Characteristics Description Min Typical Max Unit Input frequency 2412 - 2484 MHz Output impedance - 50 - Ω Input reflection - - -10 dB Tx power Output power of PA for 72.2 Mbps 13 14 15 dBm Output power of PA for 11b mode 19.5 20 20.5 dBm Sensitivity DSSS, 1 Mbps - -98 - dBm CCK, 11 Mbps - -91 - dBm OFDM, 6 Mbps - -93 - dBm Espressif Systems 10 ESP32-PICO-D4 Datasheet V1.0 4. ELECTRICAL CHARACTERISTICS Description Min Typical Max Unit OFDM, 54 Mbps - -75 - dBm HT20, MCS0 - -93 - dBm HT20, MCS7 - -73 - dBm HT40, MCS0 - -90 - dBm HT40, MCS7 - -70 - dBm MCS32 - -89 - dBm Adjacent channel rejection OFDM, 6 Mbps - 37 - dB OFDM, 54 Mbps - 21 - dB HT20, MCS0 - 37 - dB HT20, MCS7 - 20 - dB 4.3 Bluetooth LE Radio 4.3.1 Receiver Table 8: Receiver Characteristics – BLE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER - - -97 - dBm Maximum received signal @30.8% PER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0 + 1 MHz - -5 - dB F = F0 - 1 MHz - -5 - dB F = F0 + 2 MHz - -25 - dB F = F0 - 2 MHz - -35 - dB F = F0 + 3 MHz - -25 - dB F = F0 - 3 MHz - -45 - dB 30 MHz ~ 2000 MHz -10 - - dBm 2000 MHz ~ 2400 MHz -27 - - dBm 2500 MHz ~ 3000 MHz -27 - - dBm 3000 MHz ~ 12.5 GHz -10 - - dBm - -36 - - dBm Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 4.3.2 Transmit Table 9: Transmit Characteristics - BLE Parameter Conditions Min Typ Max Unit RF transmit power - - 0 - dBm Gain control step - - ±3 - dBm RF power control range - -12 - +12 dBm Espressif Systems 11 ESP32-PICO-D4 Datasheet V1.0 4. ELECTRICAL CHARACTERISTICS Parameter Conditions Min Typ Max Unit F = F0 + 1 MHz - -14.6 - dBm F = F0 - 1 MHz - -12.7 - dBm F = F0 + 2 MHz - -44.3 - dBm F = F0 - 2 MHz - -38.7 - dBm F = F0 + 3 MHz - -49.2 - dBm F = F0 - 3 MHz - -44.7 - dBm F = F0 + > 3 MHz - -50 - dBm F = F0 - > 3 MHz - -50 - dBm ∆ f 1avg - - - 265 kHz ∆ f 2max - 247 - - kHz ∆ f 2avg /∆ f 1avg - - -0.92 - - ICFT - - -10 - kHz Drift rate - - 0.7 - kHz/50 µs Drift - - 2 - kHz Adjacent channel transmit power Temperature (℃) 4.4 Reflow Profile Peak Temp. 235 ~ 250℃ 250 Preheating zone 150 ~ 200℃ 60 ~ 120s 217 200 Cooling down zone 3 ~ 5℃/s Soldering time > 30s Ramp-up zone 1 ~ 3℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s Reflow soldering zone — Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s Cooling down zone — Temp.: 217 ~ 170℃ Ramp-down rate: 3 ~ 5℃/s Solder — Sn&Ag&Cu Lead-free solder (SAC305) Figure 2: Reflow Profile Espressif Systems 12 ESP32-PICO-D4 Datasheet V1.0 5. SCHEMATICS 5. Schematics 100pF/6.3V(10%) C6 GND 10nF/6.3V(10%) 3.3nF/6.3V(10%) C9 NC 0.1uF/6.3V(10%) 49 C10 1uF/16V(10%) 0.1uF/6.3V(10%) LNA_IN GND 1.8nH±0.1nH 1 2 3 4 L4 SENSOR_VP 5 SENSOR_CP 6 1.5pF±0.25pF SENSOR_CN 7 SENSOR_VN 8 9 EN 10 GPIO34 GND 11 GPIO35 12 GPIO32 GPIO33 C14 C15 1.2pF±0.25pF GND VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP 6 SD_CMD 7 /CS CLK /HOLD FLASH DI DO /WP 5 SD_DATA_1 2 GPIO17 3 SD_DATA_0 ESP32 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 SD_CLK U3 GND VCC 1 4 GPIO16 8 VDD_SDIO 3 13 14 15 16 17 18 19 20 21 22 23 24 GND GND GND GND GND C11 D1 NC VDD3P3_CPU GND VDD3P3 C12 C4 0.1uF/6.3V(10%) 48 47 46 45 44 43 42 41 40 39 38 37 0.1uF/6.3V(10%) GND GPIO21 U0TXD U0RXD GPIO22 GPIO19 CAP1 CAP2 VDDA XTAL_P XTAL_N VDDA GPIO21 U0TXD U0RXD GPIO22 GPIO19 VDD3P3_CPU GND C5 32K_XN GPIO25 GPIO26 GPIO27 MTMS MTDI VDD3P3_RTC MTCK MTDO GPIO2 GPIO0 GPIO4 VDDA 20K(5%) 18pF/6.3V(10%) GND GND 40MHz±10ppm GPIO13 GPIO15 GPIO2 GPIO0 GPIO4 1uF/16V(10%) R1 51R(5%) GND C3 C2 R14 C20 GND 2 1 18pF/6.3V(10%) VDDA2 C13 XIN C1 VDDA1 U1 GND GND GND XOUT 4 GND Pin Mapping GPIO23 GPIO18 GPIO5 SD_DATA_1 SD_DATA_0 SD_CLK SD_CMD SD_DATA_3 SD_DATA_2 GPIO17 VDD_SDIO GPIO16 36 35 34 33 32 31 30 29 28 27 26 25 GPIO23 GPIO18 GPIO5 SD_DATA_1 SD_DATA_0 SD_CLK SD_CMD SD_DATA_3 SD_DATA_2 GPIO17 GPIO16 VDD_SDIO C18 C24 1uF/16V(10%) 0.1uF/6.3V(10%) U2 GND R9 NC C19 0.1uF/6.3V(10%) GND GND Figure 3: ESP32-PICO-D4 Module Schematics VDD3P3_RTC No. ESP32 ESP32-PICO-D4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP 32K_XN GPIO25 GPIO26 GPIO27 MTMS MTDI VDD3P3_RTC MTCK MTDO GPIO2 GPIO0 GPIO4 GPIO16 VDD_SDIO GPIO17 SD_DATA_2 SD_DATA_3 SD_CMD SD_CLK SD_DATA_0 SD_DATA_1 GPIO5 GPIO18 GPIO23 VDD3P3_CPU GPIO19 GPIO22 U0RXD U0TXD GPIO21 VDDA XTAL_N XTAL_P VDDA CAP2 CAP1 GND VDDA LNA_IN VDDA3P3 VDDA3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN EN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 VDD3P3_RTC IO13 IO15 IO2 IO0 IO4 IO16 VDD_SDIO_NC IO17 SD2 SD3 CMD CLK SD0 SD1 IO5 IO18 IO23 VDD3P3_CPU IO19 IO22 U0RXD U0TXD IO21 VDDA XTAL_N_NC XTAL_P_NC VDDA CAP2_NC CAP1_NC GND VDD33 VDD33 VDD33 VDD33 GND C27 C28 SENSOR_VP TBD TBD SENSOR_CP SENSOR_CN GND GND SENSOR_VN EN IO34 IO35 IO32 VDD33 ESP32_SIP R2 SW1 Reset Button 10K(5%) R3 C29 0.1uF/6.3V(10%) GND 48 47 46 45 44 43 42 41 40 39 38 37 VDDA LNA_IN VDDA3P3 VDDA3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN EN IO34 IO35 IO32 FLASH_SD1 IO23 IO18 IO5 SD1(FLASH_SD1) SD0(FLASH_SD3) CLK(FLASH_CLK) CMD(FLASH_SD2) SD3/IO10 SD2/IO9 IO17(FLASH_SD0) VDD_SDIO_NC IO16(FLASH_CS) 36 35 34 33 32 31 30 29 28 27 26 25 FLASH_SD3 FLASH_CLK FLASH_SD2 IO10 IO9 FLASH_SD0 FLASH_CS U4 VDD33 0R(5%) EN JP3 1 1 2 2 3 3 4 4 JTAG 1 2 TBD 1 2 3 4 5 6 7 8 9 10 11 12 1 2 L5 GND IO23 IO18 IO5 IO13 IO15 IO2 IO0 IO4 1 2 GND IO33 IO25 IO26 IO27 IO14 IO12 ANT 0.1uF/6.3V(10%) 13 14 15 16 17 18 19 20 21 22 23 24 10uF/16V(10%) CAP1_NC CAP2_NC VDDA XTAL_P_NC XTAL_N_NC VDDA IO21 U0TXD U0RXD IO22 IO19 VDD3P3_CPU C25 GND IO33 IO25 IO26 IO27 IO14 IO12 VDD3P3_RTC IO13 IO15 IO2 IO0 IO4 C26 GND 49 VDD33 GND 1 2 3 4 IO21 U0TXD U0RXD IO22 IO19 JP1 Boot Option Figure 4: ESP32-PICO-D4 Module Peripheral Schematics GND JP2 1 2 3 4 UART 6. PERIPHERAL SCHEMATICS 6. Peripheral Schematics 7. PACKAGE INFORMATION 7. Package Information Figure 5: ESP32-PICO-D4 Package 8. LEARNING RESOURCES 8. Learning Resources 8.1 Must-Read Documents The following link provides documents related to ESP32. • ESP32 Datasheet This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP32 Technical Reference Manual The manual provides detailed information on how to use the ESP32 memory and peripherals. • ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. • ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including ESP32, the ESP-WROOM-32 module, and ESP32DevKitC—the development board. • ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them, and provides examples of several common AT commands. 8.2 Must-Have Resources Here are the ESP32-related must-have resources. • ESP32 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. • ESP32 Github ESP32 development projects are freely distributed under Espressif’s MIT license on Github. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. • ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certification and Test”. • ESP32 IDF This webpage links users to the official IoT development framework for ESP32. • ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools. ����������� Espressif Systems 16 ESP32-PICO-D4 Datasheet V1.0
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