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ESP32-PICO-D4 Datasheet
Espressif Systems
August 31, 2017
About This Guide
This document provides an introduction to the specifications of the ESP32-PICO-D4 module.
The document structure is as follows:
Chapter Title Subject
Chapter 1 Overview An overview of the ESP32-PICO-D4 module.
Chapter 2 Pin Definitions Pinout and pin descriptions.
Chapter 3 Functional Description Description of functional modules and protocols.
Chapter 4 Electrical Characteristics Electrical characteristics and specifications of ESP32-PICO-D4.
Chapter 5 Schematics Schematics of ESP32-PICO-D4.
Chapter 6 Package Information Package information of ESP32-PICO-D4.
Chapter 7 Learning Resources ESP32-related must-read materials and must-have resources.
Release Notes
Date Version Release notes
2017.08 V1.0 First release.
Documentation Change Notification
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2017 Espressif Inc. All rights reserved.
Contents
1 Overview 1
2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 3
2.3 Strapping Pins 5
3 Functional Descriptions 7
3.1 CPU and Internal Memory 7
3.2 External Flash and SRAM 7
3.3 Crystal Oscillators 7
3.4 Peripherals and Sensors 8
3.5 RTC and Power Consumption 8
4 Electrical Characteristics 10
4.1 Absolute Maximum Ratings 10
4.2 Wi-Fi Radio 10
4.3 Bluetooth LE Radio 11
4.3.1 Receiver 11
4.3.2 Transmit 11
4.4 Reflow Profile 12
5 Schematics 13
6 Peripheral Schematics 14
7 Package Information 15
8 Learning Resources 16
8.1 Must-Read Documents 16
8.2 Must-Have Resources 16
1. OVERVIEW
1. Overview
The ESP32-PICO-D4 is a System-in-Package (SIP) module that is based on ESP32, providing complete Wi-Fi
and Bluetooth functionalities. The module has a size as small as 7.0±0.1 mm×7.0±0.1 mm×0.94±0.1 mm, thus
requiring minimal PCB area. The module integrates a 4-MB SPI flash.
At the core of this module is the ESP32 chip*, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip designed
with TSMC’s 40 nm ultra-low power technology. ESP32-PICO-D4 integrates all peripheral components seamlessly,
including a crystal oscillator, flash, filter capacitors and RF matching links in one single package. Given that no other
peripheral components are involved, module welding and testing is not required either. As such, ESP32-PICO-D4
reduces the complexity of supply chain and improves control efficiency.
With its ultra-small size, robust performance and low-energy consumption, ESP32-PICO-D4 is well suited for any
space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors and
other IoT products.
Note:
* For details on ESP32, please refer to the document ESP32 Datasheet.
Table 1provides the specifications of the ESP32-PICO-D4 module.
Table 1: ESP32-PICO-D4 Specifications
Categories Items Specifications
Wi-Fi Protocols
802.11 b/g/n/e/i (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard interval
support
Frequency range 2.4 ~2.5 GHz
Bluetooth
Protocols Bluetooth V4.2 BR/EDR and BLE specification
Radio
NZIF receiver with -97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
Hardware
Module interface
ADC, LNA pre-amplifier, DAC, touch sensor, SD/SDIO/MMC
Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, mo-
tor PWM, LED PWM, UART, I2C, I2S, infrared remote con-
troller, GPIO
On-chip sensor Hall sensor, temperature sensor
On-board clock 40 MHz crystal
Operating voltage/Power supply 2.3 ~3.6V
Operating current Average: 80 mA
Minimum current delivered by
power supply 500 mA
Operating temperature range -40°C ~85°C
Ambient temperature range Normal temperature
Package size 7.0±0.1 mm x 7.0±0.1 mm x 0.94±0.1 mm
Espressif Systems 1 ESP32-PICO-D4 Datasheet V1.0
1. OVERVIEW
Categories Items Specifications
Software
Wi-Fi mode Station/SoftAP/SoftAP+Station/P2P
Wi-Fi security WPA/WPA2/WPA2-Enterprise/WPS
Encryption AES/RSA/ECC/SHA
Firmware upgrade UART Download / OTA (via network / download and write
firmware via host)
Software development Supports Cloud Server Development / SDK for custom
firmware development
Network protocols IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT
User configuration AT instruction set, cloud server, Android/iOS app
Espressif Systems 2 ESP32-PICO-D4 Datasheet V1.0
2. PIN DEFINITIONS
2. Pin Definitions
2.1 Pin Layout
IO32 12
IO35 11
10
9
8
7
6
5
4
3
2
1
IO34
EN
SENSOR_VN
SENSOR_CAPN
SENSOR_CAPP
SENSOR_VP
VDDA3P3
VDDA3P3
LNA_IN
VDDA
25
26
27
28
29
30
31
32
33
34
35
36
IO16
VDD_SDIO_NC
IO5
VDD3P3_CPU37
IO1938
39
40
41
42
43
44
45
46
47
48
IO22
U0RXD
U0TXD
IO21
XTAL_N_NC
XTAL_P_NC
VDDA
CAP2_NC
CAP1_NC
IO2
24
IO15
23
22
21
20
19
18
17
16
15
14
13
IO13
VDD3P3_RTC
IO12
IO14
IO27
IO26
IO25
IO33
ESP32-PICO
49: GND
SD2
SD3
CMD
CLK
SD0
SD1
IO4
IO0
IO23
IO18
VDDA
IO17
Figure 1: ESP32-PICO-D4 Pin Layout
2.2 Pin Description
The ESP32-PICO-D4 module has 49 pins. See pin definitions in Table 2.
Table 2: Pin Description
Name No. Type Function
Analog
VDDA 1 P Analog power supply (2.3V ~3.6V)
LNA_IN 2 I/O RF input and output
VDDA3P3 3 P Power supply amplifier (2.3V ~3.6V)
VDDA3P3 4 P Power supply amplifier (2.3V ~3.6V)
Espressif Systems 3 ESP32-PICO-D4 Datasheet V1.0
2. PIN DEFINITIONS
Name No. Type Function
SENSOR_VP 5 I
GPIO36, ADC_PRE_AMP, ADC1_CH0, RTC_GPIO0
Note: Connects a 270 pF capacitor from SENSOR_VP to SEN-
SOR_CAPP, when used as ADC_PRE_AMP.
SENSOR_CAPP 6 I
GPIO37, ADC_PRE_AMP, ADC1_CH1, RTC_GPIO1
Note: Connects a 270 pF capacitor from SENSOR_VP to SEN-
SOR_CAPP, when used as ADC_PRE_AMP.
SENSOR_CAPN 7 I
GPIO38, ADC1_CH2, ADC_PRE_AMP, RTC_GPIO2
Note: Connects a 270 pF capacitor from SENSOR_VN to SEN-
SOR_CAPN, when used as ADC_PRE_AMP.
SENSOR_VN 8 I
GPIO39, ADC1_CH3, ADC_PRE_AMP, RTC_GPIO3
Note: Connects a 270 pF capacitor from SENSOR_VN to SEN-
SOR_CAPN, when used as ADC_PRE_AMP.
EN 9 I
Chip Enable (Active High)
High: On; chip works properly
Low: Off; chip works at the minimum power
Note: Do not leave CHIP_PU pin floating
IO34 10 I ADC1_CH6, RTC_GPIO4
IO35 11 I ADC1_CH7, RTC_GPIO5
IO32 12 I/O 32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 13 I/O 32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5,
TOUCH8, RTC_GPIO8
IO25 14 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 15 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 16 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 17 I/O ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
IO12 18 I/O ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
VDD3P3_RTC 19 P RTC IO power supply input (1.8V ~3.6V)
IO13 20 I/O ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
IO15 21 I/O ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0,
HS2_CMD, SD_CMD, EMAC_RXD3
IO2 22 I/O ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 23 I/O ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
IO4 24 I/O ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16 25 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
VDD_SDIO_NC 26 - NC
IO17 27 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
SD2 28 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SD3 29 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
Espressif Systems 4 ESP32-PICO-D4 Datasheet V1.0
2. PIN DEFINITIONS
Name No. Type Function
CMD 30 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
CLK 31 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SD0 32 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SD1 33 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO5 34 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 35 I/O GPIO18, VSPICLK, HS1_DATA7
IO23 36 I/O GPIO23, VSPID, HS1_STROBE
VDD3P3_CPU 37 P CPU IO power supply input (1.8V ~3.6V)
IO19 38 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
IO22 39 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
U0RXD 40 I/O GPIO3, U0RXD, CLK_OUT2
U0TXD 41 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO21 42 I/O GPIO21, VSPIHD, EMAC_TX_EN
VDDA 43 P Analog power supply (2.3V ~3.6V)
XTAL_N_NC 44 - NC
XTAL_P_NC 45 - NC
VDDA 46 P Digital power supply for PLL (2.3V ~3.6V)
CAP2_NC 47 - NC
CAP1_NC 48 - NC
GND 49 P Ground
Note:
Pins IO16, IO17, CMD, CLK, SD0 and SD1 are used for connecting the embedded flash, and are not recommended for
other uses.
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Section 5Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the value of these five bits from the register ”GPIO_STRAPPING”.
During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device
boot mode, the operating voltage of VDD_SDIO and other system initial settings.
Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strap-
ping pin is unconnected or the connected external circuit is high-impendence, the internal weak pull-up/pull-down
will determine the default input level of the strapping pins.
Espressif Systems 5 ESP32-PICO-D4 Datasheet V1.0
2. PIN DEFINITIONS
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset, the strapping pins work as the normal functions pins.
Refer to Table 3for detailed boot modes’ configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3V 1.8V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Debugging Log on U0TXD During Booting
Pin Default U0TXD Toggling U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default Falling-edge Input
Falling-edge Output
Falling-edge Input
Rising-edge Output
Rising-edge Input
Falling-edge Output
Rising-edge Input
Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO
Slave”, after booting.
Espressif Systems 6 ESP32-PICO-D4 Datasheet V1.0
3. FUNCTIONAL DESCRIPTIONS
3. Functional Descriptions
This chapter describes the modules integrated in ESP32-PICO-D4, and their functions.
3.1 CPU and Internal Memory
ESP32 contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB (8 KB RTC FAST Memory included) of on-chip SRAM for data and instruction.
–8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is
accessed by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the
remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID.
3.2 External Flash and SRAM
ESP32 supports up to four 16-MB of external QSPI flash and SRAM with hardware encryption based on AES to
protect developers’ programs and data.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit
access. Code execution is supported.
• Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and
32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM.
The ESP32-PICO-D4 module integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped
onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported.
Note:
The operating voltage of ESP32-PICO-D4’s integrated external SPI flash is 3.3V. Therefore, the strapping pin MTDI should
hold bit ”0” during the module power-on reset.
3.3 Crystal Oscillators
ESP32-PICO-D4 integrates a 40 MHz crystal oscillator.
Espressif Systems 7 ESP32-PICO-D4 Datasheet V1.0
3. FUNCTIONAL DESCRIPTIONS
3.4 Peripherals and Sensors
Please refer to Section 4 Peripherals and Sensors in ESP32 Datasheet.
Note:
Users should note that pins of the embedded ESP32 chip, that are used for connecting peripherals, such as the flash or
PSRAM, are not recommended for other uses. For details, please see Section 5Schematics.
3.5 RTC and Power Consumption
With the use of advanced power management technologies, ESP32 can switch between different power modes
(see Table 4).
• Power modes
–Active mode: The chip radio is powered on. The chip can receive, transmit, or listen.
–Modem-sleep mode: The CPU is operational and the clock is configurable. The Wi-Fi/Bluetooth base-
band and radio are disabled.
–Light-sleep mode: The CPU is paused. The RTC memory and RTC peripherals, as well as the ULP
co-processor are running. Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake
up the chip.
–Deep-sleep mode: Only the RTC memory and RTC peripherals are powered on. Wi-Fi and Bluetooth
connection data are stored in the RTC memory. The ULP co-processor can work.
–Hibernation mode: The internal 8-MHz oscillator and ULP co-processor are disabled. The RTC recovery
memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs are active.
The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode.
• Sleep Patterns
–Association sleep pattern: The power mode switches between the Active mode, Modem- and Light-
sleep mode during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radio are woken up at predeter-
mined intervals to keep Wi-Fi/BT connections alive.
–ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP co-processor takes
sensor measurements and wakes up the main system, based on the data collected from sensors.
Table 4: Functionalities Depending on the Power Modes
Power mode Active Modem-sleep Light-sleep Deep-sleep Hibernation
Sleep pattern Association sleep pattern ULP sensor-
monitored pattern -
CPU ON ON PAUSE OFF OFF
Wi-Fi/BT baseband and radio ON OFF OFF OFF OFF
RTC memory and RTC pe-
ripherals ON ON ON ON OFF
ULP co-processor ON ON ON ON/OFF OFF
Espressif Systems 8 ESP32-PICO-D4 Datasheet V1.0
3. FUNCTIONAL DESCRIPTIONS
The power consumption varies with different power modes/sleep patterns and work statuses of functional modules.
Please see Table 5for details.
Table 5: Power Consumption by Power Modes
Power mode Description Power consumption
Active (RF working)
Wi-Fi Tx packet 14 dBm ~19.5 dBm
Please refer to ESP32 Datasheet.Wi-Fi / BT Tx packet 0 dBm
Wi-Fi / BT Rx and listening
Association sleep pattern (by Light-sleep) 1 mA ~4 mA @DTIM3
Modem-sleep The CPU is powered on.
Max speed 240 MHz: 30 mA ~50 mA
Normal speed 80 MHz: 20 mA ~25 mA
Slow speed 2 MHz: 2 mA ~4 mA
Light-sleep - 0.8 mA
Deep-sleep
The ULP co-processor is powered on. 150 µA
ULP sensor-monitored pattern 100 µA @1% duty
RTC timer + RTC memory 10 µA
Hibernation RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off 0.1 µA
Note:
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to
work.
• When the system works in the ULP sensor-monitored pattern, the ULP co-processor works with the ULP sensor
periodically; ADC works with a duty cycle of 1%, so the power consumption is 100 µA.
Espressif Systems 9 ESP32-PICO-D4 Datasheet V1.0
4. ELECTRICAL CHARACTERISTICS
4. Electrical Characteristics
Note:
The specifications in this chapter have been tested under the following general condition: VDD = 3.3V, TA= 27°C, unless
otherwise specified.
4.1 Absolute Maximum Ratings
Table 6: Absolute Maximum Ratings
Parameter Symbol Min Typ Max Unit
Power supply1VDD 2.3 3.3 3.6 V
Minimum current delivered by
power supply IV DD 0.5 - - A
Input low voltage VIL -0.3 - 0.25×VIO
2V
Input high voltage VIH 0.75×VIO
2- VIO
2+0.3 V
Input leakage current IIL - - 50 nA
Input pin capacitance Cpad - - 2 pF
Output low voltage VOL - - 0.1×VIO
2V
Output high voltage VOH 0.8×VIO
2- - V
Maximum output drive capability IMAX - - 40 mA
Storage temperature range TST R -40 - 85 °C
Operating temperature range TOP R -40 - 85 °C
1. The power supplies include VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO. The VDD_SDIO also supports
1.8V mode.
2. VIO is the power supply for a specific pad. More details can be found in the ESP32 Datasheet, Appendix IO_MUX. For
example, the power supply for SD_CLK is the VDD_SDIO.
4.2 Wi-Fi Radio
Table 7: Wi-Fi Radio Characteristics
Description Min Typical Max Unit
Input frequency 2412 - 2484 MHz
Output impedance - 50 - Ω
Input reflection - - -10 dB
Tx power
Output power of PA for 72.2 Mbps 13 14 15 dBm
Output power of PA for 11b mode 19.5 20 20.5 dBm
Sensitivity
DSSS, 1 Mbps - -98 - dBm
CCK, 11 Mbps - -91 - dBm
OFDM, 6 Mbps - -93 - dBm
Espressif Systems 10 ESP32-PICO-D4 Datasheet V1.0
4. ELECTRICAL CHARACTERISTICS
Description Min Typical Max Unit
OFDM, 54 Mbps - -75 - dBm
HT20, MCS0 - -93 - dBm
HT20, MCS7 - -73 - dBm
HT40, MCS0 - -90 - dBm
HT40, MCS7 - -70 - dBm
MCS32 - -89 - dBm
Adjacent channel rejection
OFDM, 6 Mbps - 37 - dB
OFDM, 54 Mbps - 21 - dB
HT20, MCS0 - 37 - dB
HT20, MCS7 - 20 - dB
4.3 Bluetooth LE Radio
4.3.1 Receiver
Table 8: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - -97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - -5 - dB
F = F0 - 1 MHz - -5 - dB
F = F0 + 2 MHz - -25 - dB
F = F0 - 2 MHz - -35 - dB
F = F0 + 3 MHz - -25 - dB
F = F0 - 3 MHz - -45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz -10 - - dBm
2000 MHz ~2400 MHz -27 - - dBm
2500 MHz ~3000 MHz -27 - - dBm
3000 MHz ~12.5 GHz -10 - - dBm
Intermodulation - -36 - - dBm
4.3.2 Transmit
Table 9: Transmit Characteristics - BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - ±3 - dBm
RF power control range - -12 - +12 dBm
Espressif Systems 11 ESP32-PICO-D4 Datasheet V1.0
4. ELECTRICAL CHARACTERISTICS
Parameter Conditions Min Typ Max Unit
Adjacent channel transmit power
F = F0 + 1 MHz - -14.6 - dBm
F = F0 - 1 MHz - -12.7 - dBm
F = F0 + 2 MHz - -44.3 - dBm
F = F0 - 2 MHz - -38.7 - dBm
F = F0 + 3 MHz - -49.2 - dBm
F = F0 - 3 MHz - -44.7 - dBm
F = F0 + > 3 MHz - -50 - dBm
F = F0 - > 3 MHz - -50 - dBm
∆f1avg - - - 265 kHz
∆f2max - 247 - - kHz
∆f2avg/∆f1avg - - -0.92 - -
ICFT - - -10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
4.4 Reflow Profile
Temperature (℃)
Soldering time
> 30s
Ramp-up zone
Time (sec.)
50 150
0
25
1 ~ 3℃/s
0
200
250
200
Peak Temp.
235 ~ 250℃
3 ~ 5℃/s
Cooling down zone
Preheating zone
150 ~ 200℃ 60 ~ 120s
100
217
50
100 250
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow soldering zone — Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling down zone — Temp.: 217 ~ 170℃ Ramp-down rate: 3 ~ 5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 12 ESP32-PICO-D4 Datasheet V1.0
5. SCHEMATICS
5. Schematics
EN
GPIO35
SENSOR_VP
SENSOR_CP
SENSOR_CN
SENSOR_VN
GPIO34
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO16
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO5
GPIO18
GPIO23
GPIO17
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
LNA_IN
GPIO32
GPIO33
U0RXD
GPIO22
GPIO21
GPIO19
U0TXD
SD_CLK
GPIO16
SD_CMD SD_DATA_0
SD_DATA_1
GPIO17
GND
VDDA1
GND
GND GND
GND
VDD_SDIO
GND
GND
VDD3P3_RTC
GND
GND
GND
VDD3P3_CPU
GND
GND
VDDA
VDD3P3
GND
GND
GND GND
GND
VDD_SDIO
GND
VDDA2
GND
GND
Pin Mapping
No. ESP32
VDDA
LNA_IN
VDDA3P3
VDDA3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
EN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
VDD3P3_RTC
IO13
IO15
IO2
IO0
IO4
IO16
VDD_SDIO_NC
IO17
SD2
SD3
CMD
CLK
SD0
SD1
IO5
IO18
IO23
VDD3P3_CPU
IO19
IO22
U0RXD
U0TXD
IO21
VDDA
XTAL_N_NC
XTAL_P_NC
VDDA
CAP2_NC
CAP1_NC
GND
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GPIO16
VDD_SDIO
GPIO17
SD_DATA_2
SD_DATA_3
SD_CMD
SD_CLK
SD_DATA_0
SD_DATA_1
GPIO5
GPIO18
GPIO23
VDD3P3_CPU
GPIO19
GPIO22
U0RXD
U0TXD
GPIO21
VDDA
XTAL_N
XTAL_P
VDDA
CAP2
CAP1
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
ESP32-PICO-D4
R9
NC
R14 51R(5%)
C20
1uF/16V(10%)
L4
1.5pF±0.25pF
C12
0.1uF/6.3V(10%)
R1 20K(5%)
C13
NC
C3
100pF/6.3V(10%)
C19
0.1uF/6.3V(10%)
C2
18pF/6.3V(10%)
C10
0.1uF/6.3V(10%)
U2ESP32
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP247
VDDA 43
XTAL_N44
XTAL_P45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP148
VDDA 46
U0RXD 40
U1
40MHz±10ppm
XIN
1
GND
2XOUT 3
GND 4
C14 1.8nH±0.1nH
C1
18pF/6.3V(10%)
C6
10nF/6.3V(10%)
D1
NC
C5
3.3nF/6.3V(10%)
C11
1uF/16V(10%)
C9
0.1uF/6.3V(10%)
C18
1uF/16V(10%)
C4
0.1uF/6.3V(10%)
C15
1.2pF±0.25pF
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
C24
0.1uF/6.3V(10%)
Figure 3: ESP32-PICO-D4 Module Schematics
Espressif Systems 13 ESP32-PICO-D4 Datasheet V1.0
6. PERIPHERAL SCHEMATICS
6. Peripheral Schematics
FLASH_CS
SENSOR_VP
FLASH_SD2
IO10
IO9
SENSOR_CP
IO25
IO26
IO27
IO14
IO12
IO15
IO13
IO2
IO0
IO4
IO32
U0RXD
IO22
IO23
IO21
IO19
U0TXD
EN
IO33
IO35
IO34
EN
SENSOR_VN
SENSOR_CN
IO18
IO5
FLASH_SD1
FLASH_SD3
FLASH_CLK
FLASH_SD0
VDD33
GND
VDD33
VDD33
GND
VDD33
GND
VDD33
GND GND
GND
VDD33
GND
GND
GND
VDD33
Reset Button
R3 0R(5%)
C26
10uF/16V(10%)
JP3
JTAG
11
22
33
44
JP2
UART
1
1
2
2
3
3
4
4
R2
10K(5%)
JP1
Boot Option
11
22
C29
0.1uF/6.3V(10%)
U4ESP32_SIP
VDDA
1
LNA_IN
2
VDDA3P3
3
VDDA3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
EN
9
IO34
10
IO35
11
IO32
12
IO33
13
IO25
14
IO26
15
IO27
16
IO14
17
IO12
18
VDD3P3_RTC
19
IO13
20
IO15
21
IO2
22
IO0
23
IO4
24
VDD_SDIO_NC 26
IO16(FLASH_CS) 25
IO17(FLASH_SD0) 27
SD2/IO9 28
SD3/IO10 29
CMD(FLASH_SD2) 30
CLK(FLASH_CLK) 31
SD0(FLASH_SD3) 32
GND 49
SD1(FLASH_SD1) 33
IO5 34
IO18 35
IO19 38
CAP2_NC 47
VDDA 43
XTAL_N_NC 44
XTAL_P_NC 45
IO23 36
U0TXD 41
IO22 39
IO21 42
VDD3P3_CPU 37
CAP1_NC 48
VDDA 46
U0RXD 40
C27
TBD
ANT
1
2
SW1
C25
0.1uF/6.3V(10%)
C28
TBD
L5 TBD
Figure 4: ESP32-PICO-D4 Module Peripheral Schematics
Espressif Systems 14 ESP32-PICO-D4 Datasheet V1.0
7. PACKAGE INFORMATION
7. Package Information
Figure 5: ESP32-PICO-D4 Package
Espressif Systems 15 ESP32-PICO-D4 Datasheet V1.0
8. LEARNING RESOURCES
8. Learning Resources
8.1 Must-Read Documents
The following link provides documents related to ESP32.
•ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including ESP32, the ESP-WROOM-32 module, and ESP32-
DevKitC—the development board.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
8.2 Must-Have Resources
Here are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
•ESP32 Github
ESP32 development projects are freely distributed under Espressif’s MIT license on Github. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
•ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.
•ESP32 IDF
This webpage links users to the official IoT development framework for ESP32.
•ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������
Espressif Systems 16 ESP32-PICO-D4 Datasheet V1.0
