PixArt Imaging PAJ2801UA-40 PAJ2801UA-40 Wireless BLE 4.0 Module User Manual PAC7640 Datasheet

PixArt Imaging Inc. PAJ2801UA-40 Wireless BLE 4.0 Module PAC7640 Datasheet

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PAJ2801UA 40 User Manual

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Low Power Heart Rate MonitorLow Preliminary: This product is still under product development where the product specifications are subjected to change upon product release 1 PixArt Imaging Inc. Version 0.34 | 29 Jul 2016 PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module PAJ2801UA-40: Low Power Bluetooth 4.0 Module General Description PAJ2801UA-40 is a low power and high performance BLE module with embedded antenna. It integrates all the needs as a Bluetooth smart device which includes the maximum of 30 of GPIOs, PWM, I2C, UART, ADC and SPI. Key Features  Based on PixArt’s PAR2801 BLE SoC  Fully qualified Bluetooth Low Energy 4.0 peripheral device  Cortex M0 32-bit MCU with max. 32MHz clock rate  Low power and excellent performance 2.4GHz transceiver with built-in balun  Integrate 1Mbit Flash and 80kB SRAM  2 channel 10-bit SAR ADC  Highly integrated SOC with128kB Flash and 80kB SRAM  16MHz and 32.768kHz crystal oscillator circuit and loading capacitors, no external loading capacitors needed  Quadrature Decoder  DCDC converter, Boost or Buck Mode  Built in 32MHz and 32.768kHz RC oscillator  Communication interface options  Master I2C x2  Master Two/Four-Wire SPI x2  UART x2  Digital peripherals  LED x3  PWM x3  Support Serial Wire (SW) debug mode Applications  IoT Devices  HID peripherals  Health and Fitness wearable device  Interactive entertainment device  Home and industrial automation  Security/Proximity applications Key Parameters Parameter Value Max. TX Power +4 dBm RX Sensitivity -93 dBm Carrier frequency 2402 ~ 2480 Modulation GFSK Antenna type Printed Monopole DTM TX Current @ 0dBm* 10.0 mA DTM RX Current* 13.5 mA Sleep Mode Current <8 µA Deep Sleep Mode Current <3 µA RF Input Impedance 50 Ω ROM Size 24 kB Internal Flash 128 kB SRAM 80 kB Supply Voltage Buck Mode: 1.9~3.6 V GPIO 30 Operating Temperature, Tj -20~+85 °C Module Size 11.5 x 18.0 x 2.6 mm Measured under DC-to-DC Buck Mode Ordering Information PA Number Module Size PAJ2801UA-40 11.5 x 18.0 x 2.6 mm For any additional inquiries, please contact us at http://www.pixart.com/contact.asp

2 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 Contents PAJ2801UA-40: Low Power Bluetooth 4.0 Module ................................................................................................................... 1 General Description ............................................................................................................................................................ 1 Key Features ....................................................................................................................................................................... 1 Applications ........................................................................................................................................................................ 1 Key Parameters ................................................................................................................................................................... 1 Ordering Information .......................................................................................................................................................... 1 List of Figures ........................................................................................................................................................................... 3 List of Tables ............................................................................................................................................................................ 4 1.0 Introduction ................................................................................................................................................................. 5 1.1 Overview ................................................................................................................................................................. 5 1.2 Terminology ............................................................................................................................................................ 5 1.3 Pin Assignment and Signal Description .................................................................................................................... 5 2.0 Mechanical Specifications ............................................................................................................................................ 9 2.1 Mechanical Dimension ............................................................................................................................................ 9 2.2 Module Case Marking .............................................................................................................................................. 9 2.3 Main Board PCB ..................................................................................................................................................... 10 3.0 Design References ...................................................................................................................................................... 11 3.1 Layout Design Guidelines ...................................................................................................................................... 11 4.0 Power States & Sequence .......................................................................................................................................... 12 4.1 Operation Mode .................................................................................................................................................... 12 5.0 System Description .................................................................................................................................................... 13 5.1 ARM Cortes M0 ..................................................................................................................................................... 13 5.2 Bluetooth Low Energy Core ................................................................................................................................... 13 5.3 Radio Transceiver .................................................................................................................................................. 14 5.4 General Purpose ADC ............................................................................................................................................ 14 5.5 Power Management .............................................................................................................................................. 14 6.0 Interfaces ................................................................................................................................................................... 15 6.1 UART ...................................................................................................................................................................... 16 6.2 I2C ......................................................................................................................................................................... 16 6.3 SPI .......................................................................................................................................................................... 16 7.0 End-Product Label ...................................................................................................................................................... 25 Document Revision History .................................................................................................................................................. 176

3 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 List of Figures Figure 1. Pin Configuration ...................................................................................................................................................... 5 Figure 2. Module PCB Top View ............................................................................................................................................... 9 Figure 3. Module PCB Bottom View ........................................................................................................................................ 9 Figure 4. Module Case Marking ............................................................................................................................................... 9 Figure 5. Module Placement and Keep-out Region ............................................................................................................... 10 Figure 6. Recommended Module Footprint .......................................................................................................................... 10 Figure 7. Label (Laser Marking) ............................................................................................................................................. 16

4 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 List of Tables Table 1. Signal Pins Description ............................................................................................................................................... 6 Table 2. IO Mode Selection ...................................................................................................................................................... 8 Table 3. Code Identification ..................................................................................................................................................... 9

5 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 1.0 Introduction 1.1 Overview The PAR2801QN-GH chip is highly integrated with ARM® Cortex®-M0 processor, Bluetooth Low Energy v4.0 baseband control core, ROM, Flash, Bluetooth Modem, Radio Transceiver, on-chip Balun and digital interfaces for the BLE application. The Cortex M0 can operate at 32MHz clock rate for heavy thread computing application, and can also operate at lower clock rate for simple data communication purpose. PAR2801QN-GH has DCDC converter built-in to provide full-solution SoC for stand-alone applications such as HID and Wearable devices. 1.2 Terminology Term Description GND Ground BiDir Bi-Directional PWM Pulse Width Modulation HID Human Interface Device GPIO General Purpose Input / Output 1.3 Pin Assignment and Signal Description 天線淨空區Antenna keep-out regionXTAL11.5mm18mmP1P13P28P40PAR2801Shielding Case3mm Figure 1. Pin Configuration

6 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 Table 1. Signal Pins Description Pin No. Signal Name Type Description 1 GND Power Ground 2 ICE_DATA BiDir Serial debug port interface – DATA GPO 3 ICE_CLK BiDir Serial debug port interface – Clock GPO 4 GPIO27 BiDir GPIO, PWM2, or LED2 I2C: Data IO, as I2C_SDA0 UART: UART_TXD0 5 GPIO26 BiDir GPIO, PWM0, or LED0 I2C:Clock output, as I2C_SCL0, UART: UART_RXD0 6 GPIO25 BiDir GPIO, Key_T2, PWM1, or LED1 UART: UART_RTS0 7 GPIO24 BiDir GPIO, Key_T1, PWM2, or LED2 UART: UART_CTS0 8 GPIO23 BiDir GPIO, or Key_Z2 I2C: Data IO,as I2C_SDA1 UART: UART_TXD1 9 GPIO22 BiDir GPIO, or Key_Z1 I2C:Clock output, I2C_SCL1 UART: UART_RXD1 10 GPIO21 BiDir GPIO, PWM1, or LED1 11 GPIO20 BiDir GPIO, PWM2, or LED2 UART: UART_TXD0 12 GPIO19 BiDir GPIO, PWM0, or LED0 UART: UART_RXD0 13 GPIO18 BiDir GPIO, PWM1, or LED1 UART: UART_RTS0 14 GPIO17 BiDir GPIO, PWM2, or LED2 UART: UART_CTS0 15 GPIO16 BiDir GPIO, MouseKey_B5, PWM0, or LED0 I2C:Data IO, I2C_SDA1 16 GPIO15 BiDir GPIO, MouseKey_B4, PWM1, or LED1 I2C:Clock output, I2C_SCL1 17 GPIO14 BiDir GPIO, MouseKey_CPI, PWM2, or LED2 18 VDDIO Power Power for IO 19 GPIO13 BiDir GPIO, MouseKey_Middle 20 GPIO12 BiDir GPIO, MouseKey_Right 21 GPIO11 BiDir GPIO, MouseKey_Left 22 GPIO10 BiDir GPIO, Motion_Wake_Up as motion detect for external sensor, Active_Low 23 GPIO9 BiDir GPIO SPI4W: Master, Data output, SPI_DO

7 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 Pin No. Signal Name Type Description 24 GPIO8 BiDir GPIO SPI4W:Master, Chip Select, SPI_CSN SPI3W:Master, Chip Select, SPI_CSN 25 GPIO7 BiDir GPIO SPI4W:Master, Data input, SPI_DI SPI3W:Master, Data IO, SPI_DIO I2C:Data IO, I2C_SDA0 26 GPIO6 BiDir GPIO SPI4W:Master, Clock output, SPI_CLK SPI3W:Master, Clock output, SPI_CLK I2C:Clock output, I2C_SCL0 27 GPIO5 BiDir GPIO SPI4W: Master, Data output, SPI_DO_1 I2C:Data IO, I2C_SDA1 UART: UART_TXD0 28 GPIO4 BiDir GPIO SPI4W: Master, Chip Select, SPI_CSN_1 I2C: Clock output, I2C_SCL1 UART: UART_RXD0 29 GPIO3 BiDir GPIO SPI4W:Master, Data input, SPI_DI_1 UART: UART_RTS0 30 GPIO2 BiDir GPIO, PWM0, or LED0 SPI4W: Master, Clock output, SPI_CLK_1 UART: UART_CTS0 31 GPIO1 BiDir GPIO, PWM1, or LED1 Analog Input_1 I2C:Data IO, I2C_SDA1 UART: UART_TXD1 32 GPIO0 BiDir GPIO, PWM2, or LED2 Analog Input_0 I2C: Clock output, I2C_SCL0 UART: UART_RXD0 33 GND Power Ground 34 DVDD2 Power DCDC power output 35 VBAT Power Input Power pin, connect to battery or external power source. Recommend to add de-coupling cap, 10uF. Keep PCB trace as short and as wide as possible. 36 GND Power Ground 37 XTAL1_32k In Crystal input for 32.768kHz XTAL 38 XTAL2_32k Out Crystal output for 32.768kHz XTAL 39 RF_RSTB In Active Low signal for HW reset. Need to add a series Resistor at VDDIO power domain to establish RC POR circuit (R=100k, C= 100nF). 40 GND Power Ground

8 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 Table 2. IO Mode Selection GPIO_# 0 1 2 3 4 5 GPIO0 GPIO0 Analog Input 0 I2C_SCL1 UART_RXD1 PWM2/LED2 GPIO1 GPIO1 Analog Input 1 I2C_SDA1 UART_TXD1 PWM1/LED1 GPIO2 GPIO2 M_SPICK_1 UART_CST0 PWM0/LED0 GPIO3 GPIO3 M_SPIDI_1 UART_RTS0 GPIO4 GPIO4 M_SPICSN_1 I2C_SCL1 UART_RXD0 GPIO5 GPIO5 M_SPIDO_1 I2C_SDA1 UART_TXD0 GPIO6 GPIO6 M_SPICK_0 M_SPICK_0 I2C_SCL0 GPIO7 GPIO7 M_SPIDI_0 M_SPI_IO_0 I2C_SDA0 GPIO8 GPIO8 M_SPICSN_0 M_SPICSN_0 GPIO9 GPIO9 M_SPIDO_0 GPIO10 GPIO10 MOTION_Wake_UP GPIO11 GPIO11 Mouse Key (BL) GPIO12 GPIO12 Mouse Key (BR) GPIO13 GPIO13 Mouse Key (BM) GPIO14 GPIO14 Mouse Key (CPI) PWM2/LED2 GPIO15 GPIO15 Mouse Key (B4) I2C_SCL1 PWM1/LED1 GPIO16 GPIO16 Mouse Key (B5) I2C_SDA1 PWM0/LED0 GPIO17 GPIO17 UART_CST0 PWM2/LED2 GPIO18 GPIO18 UART_RTS0 PWM1/LED1 GPIO19 GPIO19 UART_RXD0 PWM0/LED0 GPIO20 GPIO20 UART_TXD0 PWM2/LED2 GPIO21 GPIO21 PWM1/LED1 GPIO22 GPIO22 Mouse Key (Z1) I2C_SCL1 UART_RXD1 GPIO23 GPIO23 Mouse Key (Z2) I2C_SDA1 UART_TXD1 GPIO24 GPIO24 Mouse Key (T1) UART_CST0 PWM2/LED2 GPIO25 GPIO25 Mouse Key (T2) UART_RTS0 PWM1/LED1 GPIO26 GPIO26 I2C_SCL0 UART_RXD0 PWM0/LED0 GPIO27 GPIO27 I2C_SDA0 UART_TXD0 PWM2/LED2 ICE - CLK ICE - CLK PWM1/LED1 ICE - SDA ICE - SDA PWM0/LED0

9 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 2.0 Mechanical Specifications 2.1 Mechanical Dimension 18mm11.5mm Figure 2. Module PCB Top View Figure 3. Module PCB Bottom View 2.2 Module Case Marking Refer to Figure 4 for the code marking location on the module case. Figure 4. Module Case Marking Table 3. Code Identification Marking Description XXXX PixArt Code

10 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 2.3 Main Board PCB The Figure 7 describes the module placement on the Main board PCB. Do ensure that no user’s hand or metal screw is over the antenna area. The main board also need to conserve a keep-out region which is at least 5mm surrounding the module antenna region, and no trace, power and ground in the antenna keep-out region is allowed. Main Board PCBAntenna Keep-out Region Figure 5. Module Placement and Keep-out Region Figure 6. Recommended Module Footprint

11 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 3.0 Design References 3.1 Layout Design Guidelines Precaution: PCB layout is extremely important to minimize parasitical capacitance and line inductance. The following layout guidelines are recommended to achieve optimum performance. 1. Place ceramic bypass capacitors near the input/output pins. 2. All feedback signals must go through the regulator capacitors first. 3. Place the crystal and its components close to the oscillator side and near the oscillator pins. 4. Ensure that the ground plane under the module, oscillator and its components are in good quality. 5. Avoid long connections to the crystal and also to the load capacitor which may create a large loop on the PCB. 6. Do not route any digital-signal lines under the module, antenna keep-out region and crystal area. 7. Keep other digital signal lines, especially clock lines and frequently switching signal lines, as far away from the module as possible.

12 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 4.0 Power States & Sequence 4.1 Operation Mode State Functional Description Power Down All power supplies are off except I/O for pin wake-up. All clocks are gated. System can be woken up by configured external pin. When it happens, PAR2801 resets from boot-up state. Sleep Active clocks (16MHz or 32MHz) are off, and the sleep clock remain working. Certain engines’ power are off. Two types of sleep modes are provided in PAJ2801. When CPU uses 16MHz crystal clock together with Bluetooth, it follows Bluetooth sleep mode aligning to connection interval. When CPU uses internal 32MHz RC clock, it can set CPU sleep mode independently and woken up by timer or Bluetooth interrupts. Standby This is the default state after power-up. All clocks are working but the RF is inactive. TX This mode is entered when Bluetooth link-layer determines to send transmission packets. RX This mode is entered when Bluetooth link-layer determines to receive an incoming packet.

14 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 5.3 Radio Transceiver The PAR2801QN-GH integrates high performance 2.4GHz radio transceiver for Bluetooth radio specification. With built-in on-chip balun, PAR2801QN-GH does not need external balun circuit to minimize BOM. The integrated high efficiency PA can transmit up to +4dBm RF power for class 2 operation, while the integrated low-IF receiver can provide excellent sensitivity up to -93dBm and outstanding interference rejection capability. 5.4 General Purpose ADC The PAR2801QN-GH integrates a low power 10-bit general purpose Analog-to-Digital Converter (GPADC) with 32kHz sampling rate. For each one shot measurement, it takes 150us for data acquisition. It can operate as a 4-channel ADC by switching the GPADC input. Two channels for internal Battery Voltage detection (VBAT3V, VBAT1V), while the other two are configured to monitor GPIO0 or GPIO1. For better accuracy, internal reference voltage calibration is preferred. Sensing applications as battery monitoring, temperature resister, analog signal sampling could be applied with this GPADC. 5.5 Power Management The PAR2801QN-GH integrates an power management unit for handheld or wearable devices with DC/DC(Buck or Boost) converter. No external Schottky diode is needed for minimal layout area. The DC/DC converter transforms battery voltage to a lower/higher internal voltage with minimal power loss. The DC/DC converter could provide excellent power efficiency with adaptive loading current setting. The DC/DC converter can be bypassed when the supply voltage drops to the lower limit of the voltage range, external DC/DC converter is also supported. It can provide power solution for one-cell Lithium-Ion, one-cell or multi-cell alkaline battery applications where the output voltage is adjustable. 5.5.1 Buck Converter Higher performance DC/DC Buck converter would bring up better battery life time. To ensure longest battery life, Buck converter has an optional bypass mode under light load current. The reduction in supply voltage level from a high voltage to a low voltage reduces the peak power drain from the battery. 5.5.2 GPIO PAJ2801UA-40 module offer 28 GPIOs and 2 output only ports (ICE_CLK, ICE_DATA). ICE_CLK and ICE_DATA pins should be make sure that keep Low during PAR2801 booting procedure. ICE_CLK and ICE_DATA could be configured as output pin after system boot up. 5.5.3 Timer PAR2801QN-GH provide 4 timers with 32-bit width. Timer0~Timer4 are running with 32.768kHz clock from 32.768kHz XTAL or LPO. Timer interrupt can wakeup CPU from sleep or power down mode. Timer3 is reserved for Rom Code. 5.5.4 Watch Dog Timer (WDT) PAR2801QN-GH offer one 16-bit countdown watchdog timer for supervisor purpose. It also runs at 32.768kHz clock for maximum 2sec supervisor time to execute system reset due to a hardware fault or program error. 5.5.5 PWM PAR2801QN-GH integrates three adjustable PWM generators, could be mux out at three different GPIO. The minimum positive or negative width of PWM is 1/32ms and flexible setting range from 1 to 255 steps. 5.5.6 LED Controller PAR2801QN-GH integrate LED controller which provide general On-OFF mode and breathe mode. The minimum LED on width is 1/32s with max 255 steps. LED ON-OFF repetition could be configured as continuous or 1~127 times. Register table has setting description details.

15 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 6.0 Interfaces 6.1 UART The PAR2801QN-GH has two sets of UART interface (UART0, UART1) for serial asynchronous communication between devices.UART-0 has CTS/RTS hard flow control for option. 8-n-1 is standard data frame configuration as eight (8) data bits, no (N) PAJity bit, and one (1) stop bit shown figure below. 6.2 I2C The PAR2801QN-GH has two sets of I2C interface (I2C_0, I2C_1) for 2-wire bi-directional communication between devices. The I2C supports wide range of data rate from 31.25kHz to 1000kHz in register controls. Multiple Read modes are supported as current read, random read, and sequential read. Write mode also support byte write and page write. 6.3 SPI The PAR2801QN-GH provides two configurations of SPI interfaces. One is four wire SPI, as CSN (chip select), SCLK (clock), SDI (MOSI data) and SDO (MISO data)and the other is two or three wire SPI interface as CSN (chip select) – optional, SCLK (clock), SDIO (bi-directional Data). These two configurations are for master operation only, slave mode is not supported. 6.3.1 Packet Formats The transmission protocol consists of the two operation modes:  Write Operation.  Read Operation. Both of the two operation modes consist of two bytes. The first byte contains the address (seven bits) and has bit-7 as its MSB to indicate data direction. The second byte contains the data.

16 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 7.0 End-Product Label 7.1 FCC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC ID: 2AIPB-PAJ2801UA-40 Figure 7. Label (Laser Marking)

17 PixArt Imaging Inc. PixArt Imaging Inc. http://www.pixart.com All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. PAJ2801UA-40 User’s Manual Low Power Bluetooth 4.0 Module Version 0.34 |29 Jul 2016 Document Revision History Revision Number Date Description 0.1 26 Mar 2016 1st draft 0.2 16 Jun 2016 2nd draft 0.3 06 Jul 2016 1. Modify the PA no. 2. Modify the Figure 8. Recommended Module Footprint 0.31 06 Jul 2016 3. Add the chapter 8: End-Product Label 0.32 25 Jul 2016 1. Add the chapter 8: End-Product Label 2. Modify the Key parameters 0.33 25 July 2016 1. Add the Figure 14. Label (Laser Marking) 0.34 29 July 2016 1. Modify the Figure 14. Label (Laser Marking)