Pmc Sierra Pm25Lv010 Users Manual SPI Data Sheets
Pm25LV010 Pm25LV512-010
Pm25LV010 to the manual 3e67cf7b-3cbf-41ef-873d-2bd92dca3466
2015-02-06
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PMC Pm25LV512 / Pm25LV010 512 Kbit / 1 Mbit 3.0 Volt-only, Serial Flash Memory With 25 MHz SPI Bus Interface FEATURES Block Write Protection - The Block Protect (BP1, BP0) bits allow part or entire of the memory to be configured as read-only. Single Power Supply Operation - Low voltage range: 2.7 V - 3.6 V • Memory Organization - Pm25LV512: 64K x 8 (512 Kbit) - Pm25LV010: 128K x 8 (1 Mbit) Hardware Data Protection - Write Protect (WP#) pin will inhibit write operations to the status register Cost Effective Sector/Block Architecture - Uniform 4 Kbyte sectors - Uniform 32 Kbyte blocks (8 sectors per block) - Two blocks with 32 Kbytes each (512 Kbit) - Four blocks with 32 Kbytes each (1 Mbit) - 128 pages per block • Page Program (up to 256 Bytes) - Typical 2 ms per page program time • Sector, Block and Chip Erase - Typical 40 ms sector/block/chip erase time Single Cycle Reprogramming for Status Register - Build-in erase before programming Serial Peripheral Interface (SPI) Compatible - Supports SPI Modes 0 (0,0) and 3 (1,1) High Product Endurance - Guarantee 100,000 program/erase cycles per single sector (preliminary) - Minimum 20 years data retention High Performance Read - 25 MHz clock rate (maximum) Page Mode for Program Operations - 256 bytes per page Industrial Standard Pin-out and Package - 8-pin JEDEC SOIC - 8-contact WSON - Optional lead-free (Pb-free) packages GENERAL DESCRIPTION The Pm25LV512/010 are 512 Kbit/1 Mbits 3.0 Volt-only serial Flash memories. These devices are designed to use a single low voltage, range from 2.7 Volt to 3.6 Volt, power supply to perform read, erase and program operations. The devices can be programmed in standard EPROM programmers as well. The device is optimized for use in many commercial applications where low-power and low-voltage operation are essential. The Pm25LV512/010 is enabled through the Chip Enable pin (CE#) and accessed via a 3-wire interface consisting of Serial Data Input (Sl), Serial Data Output (SO), and Serial Clock (SCK). All write cycles are completely self-timed. Block Write protection for top 1/4, top 1/2 or the entire memory array (1M) or entire memory array (512K) is enabled by programming the status register. Separate write enable and write disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts to the status register. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. The Pm25LV512/010 are manufactured on PMC’s advanced nonvolatile CMOS technology, P-FLASH™. The devices are offered in 8-pin JEDEC SOIC and 8-contact WSON packages with operation frequency up to 25 MHz. Programmable Microelectronics Corp. 1 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 CONNECTION DIAGRAMS CE# 1 8 Vcc SO 2 7 HOLD# CE# 1 SO 2 Top View 8 Vcc 7 HOLD# WP# 3 6 SCK WP# 3 6 SCK GND 4 5 SI GND 4 5 SI 8-Pin SOIC 8-Contact WSON PIN DESCRIPTIONS SYMB OL TYPE D ESC R IPTION C E# INPUT C hi p Enable: C E# goes low acti vates the devi ce's i nternal ci rcui tri es for devi ce operati on. C E# goes hi gh deselects the devi ce and swi tches i nto standby mode to reduce the power consumpti on. When the devi ce i s not selected, data wi ll not be accepted vi a the seri al i nput pi n (Sl), and the seri al output pi n (SO) wi ll remai n i n a hi gh i mpedance state. SC K INPUT Seri al D ata C lock SI INPUT Seri al D ata Input SO OUTPUT Seri al D ata Output GND Ground V cc D evi ce Power Supply WP# INPUT Wri te Protect: When the WP# pi n brought to low and WPEN bi t i s "1", all wri te operati ons to the status regi ster are i nhi bi ted. HOLD # INPUT Hold: Pause seri al communi cati on wi th the master devi ce wi thout resetti ng the seri al sequence. Programmable Microelectronics Corp. 2 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 PRODUCT ORDERING INFORMATION Pm25LVxxx -25 S C E Environmental Attribute E = Lead-free (Pb-free) Package Blank = Standard Package Temperature Range C = Commercial (0°C to +85°C) Package Type S = 8-pin SOIC (8S) Q = 8-contact WSON (8Q) Operating Speed 25 MHz PMC Device Number Pm25LV512 (512 Kbit) Pm25LV010 (1 Mbit) Part Number Operating Frequency (MHz) Pm25LV512-25SCE Pm25LV512-25SC 8S 8Q Pm25LV010-25SCE Commercial o o (0 C to + 85 C) 8S 25 8Q Pm25LV010-25QCE Programmable Microelectronics Corp. Temperature Range 25 Pm25LV512-25QCE Pm25LV010-25SC Package 3 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 BLOCK DIAGRAM SPI Chip Block Diagram High Voltage Generator Control Logic Instruction Decoder Serial /Parallel convert Logic Y-DECODER Address Latch & Counter 2KBit Page Buffer Status Register Memory Array X-DECODER Programmable Microelectronics Corp. 4 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 SERIAL INTERFACE DESCRIPTION Pm25LV512/010 can be driven by a microcontroller on the SPI bus as shown in Figure 1. The serial communication term definitions are in the following section. MASTER: The device that generates the serial clock. SLAVE: Because the Serial Clock pin (SCK) is always an input, the Pm25LV512/010 always operates as a slave. TRANSMITTER/RECEIVER: The Pm25LV512/010 has separate pins designated for data transmission (SO) and reception (Sl). MSB: The Most Significant Bit (MSB) is the first bit transmitted and received. SERIAL OP-CODE: After the device is selected with CE# going low, the first byte will be received. This byte contains the op-code that defines the operations to be performed. INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the Pm25LV512/010, and the serial output pin (SO) will remain in a high impedance state until the falling edge of CE# is detected again. This will reinitialize the serial communication. Figure 1. Bus Master and SPI Memory Devices SDO SPI Interface with (0, 0) or (1, 1) SDI SCK SCK SO SI SCK SO SI SCK SO SI Bus Master SPI Memory Device CS3 SPI Memory Device SPI Memory Device CS2 CS1 CE# WP# HOLD# CE# WP# HOLD# CE# WP# HOLD# Note: 1. The Write Protect (WP#) and Hold (HOLD#) si gnals should be driven, High or Low as appropriate. Programmable Microelectronics Corp. 5 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 SERIAL INTERFACE DESCRIPTION (CONTINUED) SPI MODES These devices can be driven by microcontroller with its SPI peripheral running in either of the two following modes: Mode 0 = (0, 0) Mode 3 = (1, 1) available from the falling edge of Serial Clock (SCK). For these two modes, input data is latched in on the rising edge of Serial Clock (SCK), and output data is The difference between the two modes, as shown in Figure 2, is the clock polarity when the bus master is in Stand-by mode and not transfering data: - Clock remains at 0 (SCK = 0) for Mode 0 (0, 0) - Clock remains at 1 (SCK = 1) for Mode 3 (1, 1) Figure 2. SPI Modes Mode 0 (0 0) S C K Mode 3 (1 1) S C K SI SO Programmable Microelectronics Corp. 6 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 DEVICE OPERATION The Pm25LV512/010 is designed to interface directly with the synchronous serial peripheral interface (SPI) of the 6800 type series of microcontrollers. The Pm25LV512/010 utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in Table 1. All instructions, addresses, and data are transferred with the MSB first and start with a highto-low transition. Write is defined as program and/or erase in this specification. The following commands, PAGE PROGRAM, SECTOR ERASE, BLOCK ERASE, CHIP ERASE, and WRSR are write instructions for Pm25LV512/010. Table 1. Instruction Set for the Pm25LV512/010 Instruction N ame Instruction Format H ex C o d e Operation WREN 0000 0110 06h Set Wri te Enable Latch WRD I 0000 0100 04h Reset Wri te Enable Latch RD SR 0000 0101 05h Read Status regi ster WRSR 0000 0001 01h Wri te Status Regi ster READ 0000 0011 03h Read D ata from Memory Arrary FAST_READ 0000 1011 0B h Read D ata from Memory at Hi gher Speed PG_ PROG 0000 0010 02h Program D ata Into Memory Array SEC TOR_ERASE 1101 0111 D 7h Erase One Sector i n Memory Array BLOC K_ERASE 1101 1000 D 8h Erase One Block i n Memory Array C HIP_ERASE 1100 0111 C 7h Erase Enti re Memory Array RD ID 1010 1011 ABh Read Manufacturer and Product ID READ PRODUCT ID (RDID): The RDID instruction allows the user to read the manufacturer and product ID of the device. The instruction code is followed by three dummy bytes, each bit being latched-in on Serial Data Input (SI) during the rising edge of Serial Clock (SCK). Then the first manufacturer ID (9Dh) is shifted out on Serial Data Output (SO), followed by the device ID (7Bh = Pm25LV512; 7Ch = Pm25LV010) and the second manufacturer ID (7Fh), each bit been shifted out during the falling edge of Serial Clock (SCK). Table 2. Product Identification Product Identification Data Manufacturer ID 9D h Device ID: Pm25LV512 7B h Pm25LV010 7C h Programmable Microelectronics Corp. 7 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 WRITE ENABLE (WREN): The device will power up in the write disable state when Vcc is applied. All write instructions must therefore be preceded by the WREN instruction. WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the WRDI instruction disables all write commands. The WRDI instruction is independent of the status of the WP# pin. READ STATUS REGISTER (RDSR): The RDSR instruction provides access to the status register. The READY/ BUSY and write enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction. During internal write cycles, all other commands will be ignored except the RDSR instruction. Table 3. Status Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 WPEN X X X BP1 BP0 WEN RDY Table 4. Read Status Register Bit Definition Bit Definition Bit 0 (RDY) Bit 0 = 0 indicates the device is READY. Bit 0 = 1 indicates the write cycle is in progress and the device is BUSY. Bit 1 (WEN) Bit 1 = 0 indicates the device is not WRITE ENABLED. Bit 1 = 1 indicates the device is WRITE ENABLED. Bit 2 (BP0) See Table 5. Bit 3 (BP1) See Table 5. Bits 4-6 are 0s when device is not in an internal write cycle. Bit 7 (WPEN) WPEN = 0 blocks the function of Write Protect pin (WP#). WPEN = 1 activates the Write Protect pin (WP#). See Table 6 for details. Bits 0-7 are 1s during an internal write cycle. WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select one of four levels of protection for the Pm25LV010. The Pm25LV010 is divided into four blocks where the top quarter (1/4), top half (1/2), or all of the memory blocks can be protected (locked out) from write. The Pm25LV512 is divided into 2 blocks where all of the memory blocks can be protected (locked out) from write. Any of the locked-out blocks will therefore be READ only. The locked-out block and the corresponding status register control bits are shown in Table 5. The three bits, BP0, BP1, and WPEN, are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, RDSR). Programmable Microelectronics Corp. 8 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 Table 5. Block Write Protect Bits Status Register Bits L evel B P1 B P0 0 0 0 1(1/4) 0 1 2(1/2) 1 0 3(All) 1 1 Pm25LV512 Array Addresses Locked Out Pm25LV010 Locked-out Block(s) None None All Blocks (1 - 2) 000000-00FFFF Array Addresses Locked Out Locked-out Block(s) None None 018000 - 01F F F F Block 4 010000 - 01F F F F Block 3, 4 000000 - 01F F F F All Blocks (1 - 4) The WRSR instruction also allows the user to enable or disable the Write Protect (WP#) pin through the use of the Write Protect Enable (WPEN) bit. Hardware write protection is enabled when the WP# pin is low and the WPEN bit is "1". Hardware write protection is disabled when either the WP# pin is high or the WPEN bit is "0." When the device is hardware write protected, writes to the Status Register, including the Block Protect bits and the WPEN bit, and the locked-out blocks in the memory array are disabled. Write is only allowed to blocks of the memory which are not locked out. The WRSR instruction is self-timed to automatically erase and program BP0, BP1, and WPEN bits. In order to write the status register, the device must first be write enabled via the WREN instruction. Then, the instruction and data for the three bits are entered. During the internal write cycle, all instructions will be ignored except RDSR instructions. The Pm25LV512/010 will automatically return to write disable state at the completion of the WRSR cycle. Note: When the WPEN bit is hardware write protected, it cannot be changed back to "0", as long as the WP# pin is held low. Table 6. WPEN Operation WPEN WP WEN ProtectedBlocks UnprotectedBlocks Status Register 0 X 0 Protected Protected Protected 0 X 1 Protected Writable Writable 1 Low 0 Protected Protected Protected 1 Low 1 Protected Writable Protected X High 0 Protected Protected Protected X High 1 Protected Writable Writable Programmable Microelectronics Corp. 9 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 READ: Reading the Pm25LV512/010 via the SO (Serial Output) pin requires the following sequence. After the CE# line is pulled low to select a device, the READ instruction is transmitted via the Sl line followed by the byte address to be read (Refer to Table 7). Upon completion, any data on the Sl line will be ignored. The data (D7-D0) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CE# line should be driven high after the data comes out. The READ instruction can be continued since the byte address is automatically incremented and data will continue to be shifted out. For the Pm25LV512/010, when the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one continuous READ instruction. FAST_READ: The device is first selected by driving CE# low. The FAST READ instruction is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of SCK (Serial Clock). Then the memory contents, at that address, is shifted out on SO (Serial Output), each bit being shifted out, at a maximum frequency fFR, during the falling edge of SCK (Serial Clock). The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read with a single FAST READ instruction. The FAST READ instruction is terminated by driving CE# high. PAGE PROGRAM (PG_PROG): In order to program the Pm25LV512/010, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then the PAGE PROGRAM instruction can be executed. Also, the address of the memory location(s) to be programmed must be outside the protected address field location selected by the Block Write Protection Level. During an internal self-timed programming cycle, all commands will be ignored except the RDSR instruction. The PAGE PROGRAM instruction requires the following sequence. After the CE# line is pulled low to select the device, the PAGE PROGRAM instruction is transmitted via the Sl line followed by the address and the data (D7-D0) to be programmed (Refer to Table 7). Programming will start after the CE# pin is brought high. The low-to-high transition of the CE# pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data bit. The READY/BUSY status of the device can be determined by initiating a RDSR instruction. If Bit 0 = 1, the program cycle is still in progress. If Bit 0=0, the program cycle has ended. Only the RDSR instruction is enabled during the program cycle. A single PROGRAM instruction programs 1 to 256 consecutive bytes within a page if it is not write protected. The starting byte could be anywhere within the page. When the end of the page is reached, the address will wrap around to the beginning of the same page. If the data to be programmed are less than a full page, the data of all other bytes on the same page will remain unchanged. If more than 256 bytes of data are provided, the address counter will roll over on the same page and the previous data provided will be replaced. The same byte cannot be reprogrammed without erasing the whole sector/block first. The Pm25LV512/010 will automatically return to the write disable state at the completion of the PROGRAM cycle. Note: If the device is not write enabled (WREN) the device will ignore the Write instruction and will return to the standby state, when CE# is brought high. A new CE# falling edge is required to re-initiate the serial communication. Table 7. Address Key Address Pm25LV512 Pm25LV010 AN A 15 - A 0 A 16 - A 0 Don't Care Bits A 23 - A 16 A 23 - A 17 Programmable Microelectronics Corp. 10 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 SECTOR_ERASE, BLOCK_ERASE: Before a byte can be reprogrammed, the sector/block which contains the byte must be erased. In order to erase the Pm25LV512/010, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then the SECTOR ERASE or BLOCK ERASE instruction can be executed. Table 8. Block Addresses Block Address Pm25LV512 Block Pm25LV010 Block 000000 to 007FFF Block 1 Block 1 008000 to 00FFFF Block 2 Block 2 010000 to 017FFF N/A Block 3 018000 to 01FFFF N/A Block 4 The BLOCK ERASE instruction erases every byte in the selected block if the block is not locked out. Block address is automatically determined if any address within the block is selected. The BLOCK ERASE instruction is internally controlled; it will automatically be timed to completion. During this time, all commands will be ignored, except RDSR instruction. The Pm25LV512/010 will automatically return to the write disable state at the completion of the BLOCK ERASE cycle. CHIP_ERASE: As an alternative to the SECTOR and BLOCK ERASE, the CHIP ERASE instruction will erase every byte in all blocks that are not locked out. First, the device must be write enabled via the WREN instruction. Then the CHIP ERASE instruction can be executed. The CHIP ERASE instruction is internally controlled; it will automatically be timed to completion. The CHIP ERASE cycle time maximum is 100 miliseconds. During the internal erase cycle, all instructions will be ignored except RDSR. The Pm25LV512/010 will automatically return to the write disable state at the completion of the CHIP ERASE. HOLD: The HOLD# pin is used in conjunction with the CE# pin to select the Pm25LV512/010. When the device is selected and a serial sequence is underway, HOLD# pin can be used to pause the serial communication with the master device without resetting the serial sequence. To pause, the HOLD# pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD# pin is brought high while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the Sl pin will be ignored while the SO pin is in the high impedance state. HARDWARE WRITE PROTECT: The Pm25LV512/010 has a write lockout feature that can be activated by asserting the write protect pin (WP#). When the lockout feature is activated, locked-out sectors will be READ only. The write protect pin will allow normal read/write operations when held high. When the WP# is brought low and WPEN bit is "1", all write operations to the status register are inhibited. WP# going low while CE# is still low will interrupt a write to the status register. If the internal status register write cycle has already been initiated, WP# going low will have no effect on any write operation to the status register. The WP# pin function is blocked when the WPEN bit in the status register is "0". This will allow the user to install the Pm25LV512/010 in a system with the WP# pin tied to ground and still be able to write to the status register. All WP# pin functions are enabled when the WPEN bit is set to "1". Programmable Microelectronics Corp. 11 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 ABSOLUTE MAXIMUM RATINGS (1) Temperature Under Bias -65oC to +125oC Storage Temperature -65oC to +125oC Standard Package 240oC 3 Seconds Lead-free Package 260oC 3 Seconds Surface Mount Lead Soldering Temperature Input Voltage with Respect to Ground on All Pins (2) -0.5 V to VCC + 0.5 V All Output Voltage with Respect to Ground VCC -0.5 V to VCC + 0.5 V (2) -0.5 V to +6.0 V Notes: 1. Stresses under those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device or any other conditions under those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condition for extended periods may affected device reliability. 2. Maximum DC voltage on input or I/O pins are VCC + 0.5 V. During voltage transitioning period, input or I/O pins may overshoot to VCC + 2.0 V for a period of time up to 20 ns. Minimum DC voltage on input or I/O pins are -0.5 V. During voltage transitioning period, input or I/O pins may undershoot GND to -2.0 V for a period of time up to 20 ns. DC AND AC OPERATING RANGE Part Number Pm25LV512/010 Operating Temperature 0o C to 85o C Vcc Power Supply 2.7 V - 3.6 V Programmable Microelectronics Corp. 12 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 DC CHARACTERISTICS Applicable over recommended operating range from: TAC = 0°C to +85°C, VCC = +2.7 V to +3.6 V (unless otherwise noted). Symbol Parameter Condition Min Typ Max Units ICC1 Vcc Active Read Current VCC = 3.6V at 25 MHz, SO = Open 10 15 mA ICC2 Vcc Program/Erase Current VCC = 3.6V at 25 MHz, SO = Open 15 30 mA ISB1 Vcc Standby Current CMOS VCC = 3.6V, CE# = VCC 0.1 5 µA ISB2 Vcc Standby Current TTL VCC = 3.6V, CE# = VIH to VCC 0.05 3 mA ILI Input Leakage Current VIN = 0V to VCC 1 µA 1 µA o o VIN = 0V to VCC, TAC = 0 C to 85 C ILO Output Leakage Current VIL Input Low Voltage -0.5 0.8 V VIH Input HIgh Voltage 0.7VCC VCC + 0.3 V VOL Output Low Voltage 0.45 V VOH Output High Voltage Programmable Microelectronics Corp. 2.7V < VCC < 3.6V 13 IOL = 2.1 mA IOH = -100 µA VCC - 0.2 V Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 AC CHARACTERISTICS Applicable over recommended operating range from TA = 0°C to +85°C, VCC = +2.7 V to +3.6 V CL = 1TTL Gate and 30 pF (unless otherwise noted). Symbol Parameter fFR Clock Frequency for FAST_READ fR Clock Frequency for READ instructions tRI Max Units 0 25 MHz 0 20 MHz Input Rise Time 20 ns tFI Input Fall Time 20 ns tCKH SCK High Time 20 ns tCKL SCK Low Time 20 ns tCEH CE High Time 25 ns tCS CE Setup Time 25 ns tCH CE Hold Time 25 ns tDS Data In Setup Time 5 ns tDH Data in Hold Time 5 ns tHS Hold Setup Time 15 ns tHD Hold Time 15 ns tV Output Valid tOH Output Hold Time tLZ Hold to Output Low Z 200 ns tHZ Hold to Output High Z 200 ns tDIS Output Disable Time 100 ns tEC Secter/Block/Chip Erase Time 40 100 ms tpp Page Program Time 2 5 ms tw Write Status Register time 40 100 ms Programmable Microelectronics Corp. Min Typ 15 0 14 ns ns Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 AC CHARACTERISTICS (CONTINUED) AC WAVEFORMS(1) tC E H V IH CE# V IL tC S tC H V IH SCK tC K H V IL tD S tC K L tD H V IH SI VALID IN V IL tV V OH SO tO H tD I S HI-Z HI-Z V OL Note: 1. For SPI Mode 0 (0,0) OUTPUT TEST LOAD INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL 3.3 V 3.0 V 1.8 K Input OUTPUT PIN 1.5 V AC Measurement Level 0.0 V 1.3 K Programmable Microelectronics Corp. 30 pF 15 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 AC CHARACTERISTICS (CONTINUED) HOLD Timing CE# tH D tH D SCK tH S tH S HOLD# tH Z SO tL Z PIN CAPACITANCE ( f = 1 MHz, T = 25°C ) Typ Max Units Conditions CIN 4 6 pF VIN = 0 V C OUT 8 12 pF VOUT = 0 V Note: These parameters are characterized but not 100% tested. Programmable Microelectronics Corp. 16 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 TIMING DIAGRAMS RDID Timing CE# 0 1 7 8 9 38 31 46 39 47 54 SCK INSTRUCTION SI 3 Dummy Bytes 1010 1011b HIGH IMPEDANCE SO Manufacture ID1 Device ID Manufacture ID2 WREN Timing CE# SCK SI INSTRUCTION = 0000 0110b HI-Z SO WRDI Timing CE# SCK SI INSTRUCTION = 0000 0100b HI-Z SO nnnnnnN Programmable Microelectronics Corp. 17 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 RDSR Timing CE# 1 0 2 3 5 4 7 6 9 8 10 11 12 13 14 3 2 1 13 14 15 2 1 0 SCK SI INSTRUCTION = 0000 0101b DATA OUT HIGH IMPEDANCE SO 7 6 5 4 0 MSB WRSR Timing CE# 0 SCK 1 2 3 4 5 6 7 8 9 10 11 12 DATA IN SI INSTRUCTION = 0000 0001b 7 6 5 3 4 HIGH IMPEDANCE SO READ Timing CE# 0 1 2 3 4 5 6 7 8 9 10 11 28 29 30 31 32 33 34 1 0 35 36 37 38 SCK 3-BYTE ADDRESS SI SO INSTRUCTION = 0000 0011b 23 22 21 ... HIGH IMPEDANCE Programmable Microelectronics Corp. 3 2 7 18 6 5 4 3 2 1 0 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 FAST READ Timing CE# 0 1 2 3 4 5 6 7 8 9 10 11 28 29 30 31 1 0 SCK 3-BYTE ADDRESS SI 23 22 21 INSTRUCTION = 0000 1011b ... 3 2 HIGH IMPEDANCE SO CE# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCK DUMMY BYTE 7 SI 6 5 3 4 2 1 0 DATA OUT 1 HIGH IMPEDANCE SO 7 6 5 4 3 DATA OUT 2 2 1 0 7 6 5 4 3 2 1 0 PAGE PROGRAM Timing 4 5 6 7 8 9 10 11 28 29 30 31 32 33 34 2079 3 2078 2 2077 1 2076 0 2075 CE# SCK 256th BYTE DATA-IN 1st BYTE DATA-IN 3-BYTE ADDRESS SI INSTRUCTION = 0000 0010b 23 22 21 3 2 1 0 7 6 5 4 3 2 1 0 HIGH IMPEDANCE SO Programmable Microelectronics Corp. 19 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 SECTOR ERASE Timing CE# 0 1 2 3 4 5 6 7 8 9 10 11 28 29 30 31 SCK 3-BYTE ADDRESS SI SO INSTRUCTION = 1101 0111b 23 22 8 9 21 ... 3 2 1 0 28 29 30 31 1 0 HIGH IMPEDANCE BLOCK ERASE Timing CE# 0 1 2 3 4 5 6 7 10 11 SCK 3-BYTE ADDRESS SI SO INSTRUCTION = 1101 1000b 23 22 21 ... 3 2 HIGH IMPEDANCE CHIP ERASE Timing CE# 0 1 2 3 4 5 6 7 SCK SI SO Programmable Microelectronics Corp. INSTRUCTION = 1100 0111b HIGH IMPEDANCE 20 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 PROGRAM/ERASE PERFORMANCE Parameter Unit Typ Max Remarks Sector Erase Time ms 40 100 From writing erase command to erase completion Block Erase Time ms 40 100 From writing erase command to erase completion Chip Erase Time ms 40 100 From writing erase command to erase completion Page Programming Time ms 2 5 From writing program command to program completion Note: These parameters are characterized and are not 100% tested. RELIABILITY CHARACTERISTICS (1) Parameter Endurance Data Retention ESD - Human Body Model ESD - Machine Model Latch-Up Min 100,000 Typ (2) Unit Test Method Cycles JEDEC Standard A117 20 Years JEDEC Standard A103 2,000 Volts JEDEC Standard A114 200 Volts JEDEC Standard A115 100 + ICC1 mA JEDEC Standard 78 Note: 1. These parameters are characterized and are not 100% tested. 2. Preliminary specification only and will be formalized after cycling qualification test. Programmable Microelectronics Corp. 21 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 PACKAGE TYPE INFORMATION 8S 8-Pin JEDEC Small Outline Integrated Circuit (SOIC) Package (measure in millimeters) Top View Side View 0.51 0.33 5.00 4.80 1.27 BSC 4.00 3.80 0.25 0.10 6.20 5.80 1.75 1.35 End View 45º 0.25 0.19 1.27 0.40 Programmable Microelectronics Corp. 22 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 PACKAGE TYPE INFORMATION (CONTINUED) 8Q 8-Contact Ulta-Thin Small Outline No-Lead (WSON) Package (measure in millimeters) Top View Side View 5.00 BSC 6.00 BSC Bottom View 0.25 0.19 Pin 1 0.80 0.70 1.27 BSC 3.40 4.00 0.48 0.35 0.75 0.50 Programmable Microelectronics Corp. 23 Issue Date: February, 2004, Rev: 1.4 PMC Pm25LV512/010 REVISION HISTORY D ate R evision N o. D escription of C hanges P ag e N o . October, 2002 1.0 New publi cati on, Preli mi nary Spec All D ecember, 2002 1.1 Formal Release All Jun, 2003 1.2 Added WSON package opti on 1, 2, 3, 23 Added Lead-free package opti ons D ecember, 2003 1.3 Upgraded guranteed program/erase cycles from 50,000 to 100,000 (preli mi nary) Updated and redrawed package di mensi on February, 2004 1.4 Programmable Microelectronics Corp. 1, 3, 12 Improve operati on temperature range 24 1, 21 22, 23 All Issue Date: February, 2004, Rev: 1.4
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