Powerwave Technologies KRB1011108 Multi Carrier Power Amplifier User Manual MCPS Subsystem Manual

Powerwave Technologies, Inc. Multi Carrier Power Amplifier MCPS Subsystem Manual

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ERICSSON AMPLIFIER TECHNOLOGIES INC.

49 Wireless Boulevard

Hauppauge, New York 11788

(631) 357-8200

MCPA SUBSYSTEM

ASSEMBLY

Product Number KRB 101 1108

INSTALLATION OPERATION AND

MAINTENANCE INSTRUCTIONS

Ericsson Amplifier Technologies Inc.

Technical Publication SCA

Revision A

PREPARED

May 29, 2001

NOTICE

PROPRIETARY AND PRIVATE

The information contained in this document is the property of Ericsson

Amplifier Technologies Inc., (Company) and shall be kept in strict confidence.

Except with the written permission of the Company, such information shall not

be published, or disclosed to others, or used for manufacture or sale or for

any other purpose. This document shall not be duplicated in whole or in part.

Any recipient so agrees by acceptance of this document.

The following symbols are used throughout this technical manual:

WARNING

THIS SYMBOL INDICATES IMPORTANT INFORMATION THAT IS

EMPHASIZED TO ALERT THE READER TO THE POTENTIAL RISK OF

PERSONAL INJURY TO THE OPERATOR OR OTHER PERSONNEL.

CAUTION

This symbol indicates important information that is emphasized to alert

the reader to the potential risk of damage to the amplifier.

NOTE

This symbol indicates information that is highlighted signifying an

operation or procedural step requiring additional emphasis.

Ericsson Amplifier Technologies Incorporated, provides this technical manual “as is”

without warranty of any kind, either expressed or implied. Ericsson Amplifier

Technologies may make improvements or changes to the product and/or manual at any

time without notice.

Every effort has been made to ensure the accuracy and completeness of this technical

manual, however, it may contain technical inaccuracies or typographical errors.

Changes are made periodically to the information contained herein. These changes will

be incorporated into new editions of this technical manual.

Ericsson Amplifier Technologies is interested in receiving comments from the users of this

manual in order to improve its usefulness. All comments should be directed through

regular mail to the address listed on the title page of this manual. Ericsson Amplifier

Technologies may use or distribute any of the information supplied in any way it believes

appropriate, without incurring any obligations.

All specifications are subject to change without notice.

WARNING

THE USE OF AN EARTH GROUND IS REQUIRED TO

ENSURE SAFETY.

IF THE EQUIPMENT APPEARS TO BE DAMAGED IN ANY

WAY, REMOVE ALL POWER TO THE UNIT, AND HAVE IT

SERVICED AS SOON AS POSSIBLE.

WARRANTY

Unless otherwise specified, Ericsson Amplifier Technologies provides a Limited

Warranty of 12 months from the date of original shipment unless otherwise agreed to in

writing.

This warranty is void (1) if the equipment has been subject to unauthorized alteration,

modification or repair or, (2) due to defects or failures resulting from improper handling,

storage, operation, interconnection or installation; failure to continually provide a

suitable installation and operational environment; or any other cause beyond the range

of normal usage for the equipment (except, in all of the foregoing cases, when caused

by Ericsson Amplifier Technologies).

LIMITATION OF LIABILITY

In no event will Ericsson Amplifier Technologies be liable to customer or anyone else

for special collateral, exemplar, indirect, incidental or consequential damages, loss of

goodwill, loss of profits or revenues, loss of savings, loss of life, interruptions of

business, and claims of customers, whether such damages occur prior or subsequent

to or are alleged as a result of tortuous conduct, even if Ericsson Amplifier

Technologies has been advised of the possibility of such damages.

COMMENTS ON FILTER FUNCTIONS

To fulfil the cellular standard (e.g. IS-138-A) it is necessary to use a bandpass filter to

restrict spurious emissions outside the TX-band. This filter is included in the normal

base station structure.

In order to fulfil §2.1051. Spurious emission at the antenna terminal a Low Pass Filter

MUST be inserted between the subsystem output and the antenna

The filter attenuation must be greater or equal to:

Frequency

Range (Mhz) Attenuation

(dB)

910 – 1788 45

1788 - 2700 20

Modifications to the subsystem, MCPA module or subrack shall not be made without

written permission from Ericsson Amplifier Technologies Inc. Unauthorized

modifications may void the authority granted under Federal Communications Rules

permitting the operation of this device.

In order not to violate the FCC certification for this device, a filter must be used

between the subsystem output and the antenna. The filter attenuation characteristics

must be greater or equal to the filter performance shown above. When the subsystem

is properly installed in its normal working environment the filter requirement is

automatically fulfilled.

RETURN FOR REPAIR

FIELD OPERATION SUMMARY SHEET

Please make a copy of this sheet, and complete the following questionnaire. If necessary, attach

additional sheets. This information will assist in expediting repairs to the equipment, and is used for fault

trend analyses and ongoing product improvement.

FIELD TECH NAME:_______________________________ DATE: _____________________________

EQUIPMENT LOCATION (CELL SITE NUMBER): ________________________________ ___________

________________________________ ________________________________ ____________________

MODEL NUMBER: ________________________________ ________________________________ ____

SERIAL NUMBER: ________________________________ ________________________________ ____

FREQUENCY OF OPERATION: A:__________________________ B: _________________________

CARRIER POWER:________________________________ ________________________________ ____

MAXIMUM NUMBER OF CARRIERS: ________________________________ _____________________

LED INDICATOR STATUS:

LED DESCRIPTION LED ON

Check þ

LED OFF

Check þ

DC ON: o o

ENABLE: o o

FAN ALARM: o o

LOOP ALARM: o o

VSWR ALARM: o o

POWER SUPPLY

ALARM:

o o

TEMPERATURE ALARM: o o

OVER POWER ALARM: o o

MINOR: o o

MAJOR: o o

CRITICAL: o o

ALC: o o

UNIT SURFACE TEMPERATURE: ________________________________ _______________________

POWER SUPPLY MODEL OR CAPABILITY: ________________________________ _______________

________________________________ ________________________________ ____________________

OTHER DETAILS OF PROBLEM REPORTED:________________________________ ______________

________________________________ ________________________________ ____________________

Table of Contents

1. GENERAL DESCRIPTION..................................................................................... 1

1.1 Introduction ............................................................................................................................. 1

1.2 Related Publications ............................................................................................................... 1

1.3 General Description................................ ................................................................ ................. 1

1.4 Equipment Specifications.......................................................................................................3

2. INSTALLATION.....................................................................................................6

2.1 Introduction ............................................................................................................................. 6

2.2 Electrical Service Recommendations..................................................................................... 6

2.3 Receiving, Unpacking and Inspection.................................................................................... 7

2.4 Repackaging for Shipment .....................................................................................................7

2.5 Environmental Limitations......................................................................................................7

2.6 Installation ............................................................................................................................... 8

2.7 Cable Interconnections .........................................................................................................11

2.7.1 TB1 – DC Power Terminal Block.......................................................................................12

2.7.2 J4 - I/O Connector ............................................................................................................14

2.7.3 J1, J10, J17 – RF Input, RF Output and RF Sample connectors .......................................14

2.8 Verify Connections................................................................................................................ 14

2.9 Verify DC Supply Voltage...................................................................................................... 15

3. OPERATING INSTRUCTIONS.............................................................................16

3.1 Safety Precautions ................................................................................................................ 16

3.2 Controls and Indicators ........................................................................................................ 18

3.2.1 Local Controls and Indicators ............................................................................................18

3.2.2 Remote Control/Status Interface .......................................................................................19

3.3 Initial Turn On Procedure......................................................................................................19

3.4 Normal Operation.................................................................................................................. 20

3.5 Shut Down Procedure ................................................................ ........................................... 20

4. PRINCIPLES OF OPERATION............................................................................21

4.1 Introduction ........................................................................................................................... 21

4.2 RF Input Signal...................................................................................................................... 22

4.3 RF Output Load..................................................................................................................... 22

5. MAINTENANCE ...................................................................................................24

5.1 Introduction ........................................................................................................................... 24

5.2 Periodic Maintenance................................................................ ............................................ 24

5.2.1 Cleaning Air Inlets/Outlets ................................................................................................25

5.2.2 Test Equipment Required .................................................................................................25

5.2.3 Performance Tests ...........................................................................................................25

5.3 Troubleshooting Procedures................................................................................................ 26

List of Appendices

Appendix A - Ericsson MCPA Module Controls and Indicators.......................................29

Appendix B - Ericsson MCPA Module Power On/Off Sequence......................................32

List of Figures

Figure 1. MCPA Subrack Assembly......................................................................................... 2

Figure 2. Recommended Circuit Breaker Configurations..................................................... 7

Figure 3. Outline and Installation Drawing,

Ericsson Amplifier Technologies MCPA Subrack Assembly............................... 10

Figure 4. Detail View, DC Power Terminal Block TB1 .......................................................... 13

Figure 5. Detail View, MCPA Local Controls and Indicators ................................................18

Figure 6. Power Saving Regions, MCPA Subrack Assembly ...............................................22

Figure 7. Block Diagram, MCPA Subrack Assembly............................................................ 24

Figure 8. Subrack Assembly Troubleshooting Flow Chart..................................................28

List of Tables

Table 1. Specifications for Ericsson MCPA Subrack Assembly ............................................3

Table 2. Nominal Gain for Installed Configuration..................................................................5

Table 3. Power Saving Operating Regions .............................................................................5

Table 4. DC Power Consumption versus Operating Status................................................... 6

Table 5. TB1 Power Terminal Block Connector....................................................................13

Table 6. I/O Connector Wiring................................................................................................ 14

Table 7. Subrack Assembly Local Controls and Indicators................................................. 18

Table 8. Nominal Gain for Amplifier Installed Configuration................................................22

Table 9. Periodic Maintenance Tasks................................ .................................................... 25

Table 10. Test Equipment Required ...................................................................................... 26

1. GENERAL DESCRIPTION

1.1 Introduction

This manual provides information for the installation, operation and maintenance of

Ericsson Amplifier Technologies MCPA Subsystem. The subrack is specifically

designed for use with Ericsson Amplifier Technologies Multicarrier Power Amplifiers

(MCPAs). Refer to the separate Ericsson Amplifier Technologies Technical Manual

that accompanied the MCPA power amplifier, for specific installation, operation and

maintenance instructions for the MCPA(s). In addition, refer to the specification limits

contained in Table 1.

This manual is organized in 5 sections as follows:

• Section 1. General Description of the subrack assembly

• Section 2. Installation

• Section 3. Operating Instructions

• Section 4. Principles of Operation

• Section 5. Maintenance

1.2 Related Publications

Multicarrier Power Amplifier MCPA

Installation, Operation and Maintenance Instructions.

1.3 General Description

The MCPA subrack (Figure 1) is a microprocessor-controlled RF amplifier subrack

assembly that operates over the frequency range of 869 to 894 MHz. It is specifically

designed for use with up to four companion Ericsson Amplifier Technologies Multi-

Carrier Power Amplifiers (MCPAs). The subrack assembly contains an active combiner,

which automatically reconfigures itself to effectively combine the individual modules.

The active combiner uses blind mate connectors, allowing MCPA installation and

removal as needed with the subrack power on. The vertical subrack mounts in a 24-

inch rack.

User I/O is provided through the subrack assembly. The control and status of each

module is sent to the subrack assembly from the individual modules and converted into

a format suitable for the user. Local operating status is provided via front panel LED

indicators. The subrack assembly is powered by an external (customer supplied) 26-28

VDC power supply. A microprocessor board in the subrack assembly handles all the

necessary control between the individual modules, the subrack and the user. The

firmware resident in all assemblies can be updated through the subrack RS-232 port

using custom software and a laptop.

Figure 1. MCPA Subsystem Assembly

(Shown with four Ericsson Amplifier Technologies MCPA’s installed)

1.4 Equipment Specifications

Table 1 lists the specifications of the MCPA subsystem assembly.

Table 1. Specifications

for Ericsson MCPA Subsystem Assembly

PERFORMANCE CHARACTERISTICS

Parameter Specification

Frequency 869 – 894 MHz

Active Combined RF Output Power,

2-32 Carriers:

Normal VIN= 26-28V:

Exceptional VIN= 21-26V, 28-30V:

(1x MCPA any combination) 100 Watts Minimum

(2x MCPA any combination) 200 Watts Minimum

(3x MCPA any combination) 300 Watts Minimum

(4x MCPA any combination) 400 Watts Minimum

(1x MCPA any combination) 50 Watts Minimum

(2x MCPA any combination) 100 Watts Minimum

(3x MCPA any combination) 150 Watts Minimum

(4x MCPA any combination) 200 Watts Minimum

IMD, 869-894MHz: -63 dBc minimum

when measured with 50 random phase sets.

Spurious: -63 dBc minimum

when measured with 50 random phase sets.

Pilot Tone Level: -20 dBm with 4 MCPAs installed.

Harmonics: 2nd:40 dBc minimum

3RD and higher: 60 dBc minimum

Noise Receive Band: -35 dBm maximum / 30 kHz RBW per MCPA,

-40 dBm typical / 30 kHz RBW at 824-849 MHz

Gain Flatness: ±0.5 dB maximum (all conditions)

Gain Variation: ±0.5 dB over nominal operating range

with respect to 25ºC and 27 volt operation

Gain: 54.5 dB nominal;

Adjustable from 0 – 15 dB through front panel recessed

momentary switches.

Gain is managed in the event of a problem with an

installed MCPA, to reduce gain and permit continued

operation at reduced output. Gain is determined by

operating vs. non-operating MCPAs installed, as shown

in Table 2.

Table 1. (Continued)

Specifications for Ericsson MCPA Subsystem Assembly

PERFORMANCE CHARACTERISTICS

Parameter Specification

Input VSWR: 1.5:1 maximum

Input Power: 3 dBm maximum (over full attenuator range)

Sample Port Coupling: 50 dB ±0.5 dB from main output level

Output VSWR: 2:1 Maximum

Load Stability: VSWR ∞ : 1, all phases

DC Input; Normal Conditions:

Exceptional Conditions:

26 to 28 VDC, full operation without performance

degradation; 27V @ 200.0 A typical @ 400 W (Refer to

Table 4)

21-26VDC, 28-30VDC with degraded performance.

Operating Temperature;

Normal:

Exceptional:

+5° to +40°C

5°C above and below normal limits,

with degraded performance.

Storage Temperature: -40° to +70°C

Humidity: 5% to 95% RH, non-condensing

Operating Altitude: 61 M below sea level to 3,000 M above sea level.

Vibration: 1 G/Hz from 20 to 50 Hz

Dimensions: 23” rack wide x 19” high x 18” deep

58.42 cm rack wide x 48.26 cm high x 45.72 cm deep

Subrack Main RF Input connector: J1, SMA female

Subrack Main RF Output connector: J10, N female

Subrack RF FWD Sample J17, SMA female

Subrack DC PWR Interface 8 Position Terminal Block (see Table 5)

Subrack I/O Interface 15 Pin D subminiature female connector (see Table 6);

8-bit asynchronous serial bus, which complies with the

EIA/TIA-422-A Standard for interfacing digital equipment

using differential balanced voltages.

LED Status Monitoring Low Power MCPA1 through MCPA4, and DC On

Table 2. Nominal Gain for Installed Configuration

Operational

Modules less

Non-Operational

Modules*

1 module

System 2 module

System 3 module

System 4 module

System

154.5 dB 51.5 dB 49.7 dB 48.5 dB

2-54.5 dB 52.7 dB 51.5 dB

3- - 54.5 dB 53.2 dB

4---54.5 dB

*Non-operational modules refer to modules which have been disabled due to alarms.

Above values valid during normal operation (26-28VDC input). Reduce above values by

1 dB during exceptional operating conditions (21-26VDC, 28-30VDC input).

Table 4. DC Power Consumption versus Operating Status

Ericsson MCPA Subsytem Assembly

Operating Status DC

LED

Status

Enable

LED

Status

DC Power (W)

@ 27V

1 module

DC Power (W)

@ 27V

2module

DC Power (W)

@ 27V

3 module

DC Power (W)

@ 27V

4 module

Prime Power Applied

Internal DC Status

OFF

OFF OFF 15.0 typ

17.3 max.

30.0 typ.

34.5 max.

45.0 typ.

51.8 max.

60.0 typ.

69.0 max

Bias On

(no RF)

ON ON 615.0 typ.

707.0 max.

1230.0 typ.

1415.0 max

1845.0 typ.

2122.0 max.

2460.0 typ.

2829.0 max.

Forward Power 100 W ON ON 1350.0 typ.

1553.0 max.

Forward Power 200 W ON ON 2700.0 typ.

3105.0 max.

Forward Power 300 W ON ON 4050.0 typ.

4660.0 max.

Forward Power 400 W ON ON 5400.0 typ

6210.0 max

2. INSTALLATION

2.1 Introduction

This section contains receiving, unpacking and installation recommendations for the

Ericsson Amplifier Technologies MCPA subrack assembly. Carefully read and review

all of the information contained in this section before attempting to install or operate the

subrack assembly. In addition, read and review the operating instructions contained in

Section 3 before operating the equipment.

CAUTION

The subrack assembly is specifically designed for use with

Ericsson Amplifier Technologies Multicarrier Power

Amplifiers (MCPAs). Refer to the Installation, Operation and

Maintenance instructions included with the companion

MCPA before operating this equipment. Improper operation

of this equipment may cause damage to it, or to the

equipment connected to it.

2.2 Electrical Service Recommendations

It is recommended that each 400-Watt subsystem power source be equipped with one

of the circuit breaker configurations shown in Figure 2, installed in a load center with a

master mains switch or breaker. This arrangement permits service and maintenance of

the subrack assembly without the necessity for removing power to the entire site, and

ensures continuous coverage in the event that one of the two circuit breakers should

trip.

Figure 2. Recommended Circuit Breaker Configurations

75 A 75 A 75 A 75 A

150 A

300 A

150 A

2.3 Receiving, Unpacking and Inspection

The subrack assembly has been tested and calibrated at the factory prior to shipment.

No additional readjustment is required prior to installation.

The subrack assembly is shipped in a single container. Check the exterior of the

shipping container for any visible signs of damage. If possible, open the container in

the presence of the delivery agent. Carefully unpack the subrack assembly and save

all packing material for possible reshipment. After removal from the container, check

the subrack assembly for physical damage such as scratched panels, damaged

connectors, etc. If damage is noted, immediately file claim with the delivery agent or

freight carrier.

2.4 Repackaging for Shipment

Should it ever become necessary to return the subrack assembly for service or repair,

the following procedure should be followed.

a. Use the original container, if possible.

b. Wrap the item in heavy paper or plastic before placing it in the shipping container.

c. Use packing material around all sides of the item.

d. Use a heavy cardboard box or a wooden container to house the item. Seal the

container with heavy-duty tape (Fiberglas) or strap the container with metal bands.

e. Mark the container: "FRAGILE - DELICATE INSTRUMENT".

2.5 Environmental Limitations

The subrack assembly is designed to operate in an environment as noted in Table 1 of

this manual. The subrack assembly must be installed in an area where an adequate

and unrestricted supply of air is available for cooling. Adequate clearance must be

provided to prevent obstruction of airflow. Confirm that proper DC power is available

for the equipment.

2.6 Installation

The subrack is designed for installation into a standard 24-inch rack or enclosure.

Installation procedures vary based on site structure; however, it is recommended that

an open frame rack be used where possible. This will ensure adequate airflow for the

amplifier system. Proceed to install the subrack as follows:

WARNING

INSTALL RACK OR FRAME TO BE USED IN

ACCORDANCE WITH THE MANUFACTURER’S

INSTALLATION RECOMMENDATIONS. ENSURE THAT

THE RACK OR FRAME HAS BEEN PROPERLY AND

SECURELY FASTENED TO PREVENT IT FROM FALLING

AS THE EQUIPMENT IS INSTALLED. PERSONAL

INJURY AND EQUIPMENT DAMAGE CAN RESULT FROM

IMPROPER RACK OR FRAME INSTALLATION.

a. Refer to the Outline and Installation drawing of Figure 3, and determine where the

subrack will be positioned in the rack or frame. Four mounting brackets are located

at the sides of the assembly for securing to the rack or frame.

b. With the amplifier modules removed, lift the subrack to the desired location in the

rack or frame, aligning the eight cutouts with the screw holes of the rack.

c. Mount the subrack assembly to the rack through the eight mounting holes (two per

bracket) using eight (8) ½-inch, 10-24 threaded screws with washers. Hand tighten

hardware; do not over tighten.

d. Install the individual MCPA amplifier modules into the subrack, beginning from the

left. Use firm, but not excessive force when installing the MCPA amplifiers to

ensure a good connection is made.

e. Hand tighten the retaining screws on the front panels of the MCPAs. Do not over

tighten.

Front View, Subsystem Assembly

Side View, Subsystem Assembly

Figure 3. Outline and Installation Drawing, Ericsson Amplifier Technologies MCPA

Subrack Assembly

(Shown with four Ericsson Amplifier Technologies MCPA’s Installed)

(Sheet 1 of 2)

Rear View of Subsystem Assembly

Figure 3. Outline and Installation Drawing, Ericsson Amplifier Technologies MCPA

Subrack Assembly

(Shown with four Ericsson Amplifier Technologies MCPA’s Installed)

(Sheet 2 of 2)

2.7 Cable Interconnections

WARNING

ENSURE THAT ALL DC AND RF POWER TO THE

SYSTEM IS DISABLED BEFORE MAKING ANY

CONNECTIONS. OPERATOR INJURY AND/OR

EQUIPMENT DAMAGE CAN RESULT FROM CARELESS

ERRORS DURING WIRING.

All DC cable interconnections are accomplished at the front of the subrack. Affix the

DC cable lugs onto the terminal block studs. Note that the positive terminal blocks

have 3/8” studs and the negative terminal blocks have ¼” studs.

NOTE

DC cables should be a minimum of 6 AWG.

Using a 9/16” wrench for the positive connections and a 7/16” wrench for the ground

connections, tighten each nut until the DC cables are securely in place. Note that the

maximum torque rating for the positive (3/8” stud) blocks are 150 lb in and 80 lb in for

the negative (1/4” stud) blocks. See Figure 4 and Table 5 for proper cable positioning

on the terminal block.

Connect the RF input to the SMA female connector located on the left of the front

plane. Using a 5/16”, open ended wrench, tighten the connection until it is snug.

Connect the RF output cable to the N female connector located to the right of the RF

input connector. Using a set of connector pliers, tighten the connection until it is snug.

Connect the 15 pin male connector to the I/O interface located on the rear of the

subrack. Using a small flat head screw driver, tighten the two retaining screws on the

sides of the I/O connector.

CAUTION

Do not connect dc power to the subrack assembly until

proper DC supply voltages have been verified. Damage

to the subrack assembly can occur if improper voltages

are applied.

2.7.1 DC Power Terminal Block

The DC interface is a single column of 8 terminal blocks, as shown in the detail view of

Figure 4. TB1 through TB4 are the positive connections and TB5 through TB8 are the

ground connections.

NOTE

It is recommended that each 400-Watt Sub-system power

source be equipped with two, 125 amp circuit breakers,

installed in a load center with a master switch or breaker.

This arrangement permits service and maintenance of the

subsystem without the necessity for removing power to the

entire site, and ensures continuous coverage in the event

that one of the two circuit breakers should trip

Using the appropriate wrench, tighten each of the terminals (TB1-TB8) making sure not

to exceed the respective maximum torque rating of the blocks. Connections are as

shown in Figure 4 and Table 5.

TB1

TB2

TB3

TB4

TB5

TB6

TB7

TB8

Figure 4. Detail View, DC Power Terminal Blocks TB1-TB8

Table 5. TB1-TB8 Power Terminal Block Connectors

TERMINAL DC SUPPLY CIRCUIT DESCRIPTION

TB1 125A CIRCUIT 1 + DC Power Input for

Amplifier Module 1 and

Subrack.

TB2 125A CIRCUIT 2 + DC Power Input for

Amplifier Module 2.

TB3 125A CIRCUIT 3 + DC Power Input for

Amplifier Module 3.

TB4 125A CIRCUIT 4 + DC Power Input for

Amplifier Module 4.

TB5 CIRCUIT 1 RETURN - DC Power Return for

Amplifier Module 1 and

Subrack.

TB6 CIRCUIT 2 RETURN - DC Power Return for

Amplifier Module 2.

TB7 CIRCUIT 3 RETURN - DC Power Return for

Amplifier Module 3.

TB8 CIRCUIT 4 RETURN - DC Power Return for

Amplifier Module 4.

2.7.2 J4 - I/O Connector

The I/O connector is a 15 Pin D subminiature female type. The I/O Control and Status

interface is detailed in Table 6. Tighten the two retaining screws on the sides of the I/O

connector at J4, using a small flat-head screwdriver.

Table 6. I/O Connector Wiring

Pin Interface Description Subrack

I/O Electrical Protocol

1Minor (Fan Failure) OOpen = Alarm, Closed = OK

2Minor common OOpen = Alarm, Closed = OK

4Major (Single MCPA Module failure) OOpen = Alarm, Closed = OK

5Major common OOpen = Alarm, Closed = OK

6Critical (All MCPA Module Failure) OOpen = Alarm, Closed = OK

7ALC Alarm OOpen = Alarm, Closed = OK

8ALC common OOpen = Alarm, Closed = OK

9Critical common OOpen = Alarm, Closed = OK

10 Control (All modules On/Off) IOpen to Closed Edge = All modules On

Closed to Open Edge = All modules Off

Note low current 5 vdc potential is on this pin

11 Control common IGND Potential

12 Pwr On OOpen = No DC Pwr, Closed = DC Pwr on

13 Pwr On common OOpen = No DC Pwr, Closed = DC Pwr on

2.7.3 J1, J10, J17 – RF Input, RF Output and RF Sample connectors

a. Connect the system RF input cable to the subrack assembly at SMA connector J1.

Tighten the connection using a 5/16”, open ended wrench until secure.

b. Connect the system RF output cable to the subrack assembly at type N connector

J10. Tighten the connection using connector pliers until secure.

c. Connect the system RF sample output to the subrack assembly at SMA connector

J17. Tighten the connection using a 5/16”, open ended wrench until secure. This

sample port is 50 ±1 dB below the main RF output at J10.

2.8 Verify Connections

Recheck all connections. Make certain that all connections are correct and secure.

2.9 Verify DC Supply Voltage

Measure the DC supply voltage that will power the subrack assembly. The voltage

must be 26 to 28 VDC (27VDC optimum). Degraded operation will result with DC input

of 21-26VDC and 28-30VDC. Never operate the system outside of these limits. Refer

to Section 3 for operating instructions.

CAUTION

DO NOT OPERATE SUBRACK ASSEMBLY WITH A DC

SUPPLY VOLTAGE OUTSIDE OF THESE LIMITS.

DAMAGE WILL OCCUR TO THE SUBRACK AND MCPAS

DUE TO APPLICATION OF IMPROPER POWER SUPPLY

VOLTAGES.

CAUTION

REFER TO THE ACCOMPANYTING TECHNICAL

MANUAL FOR THE MCPA USED WITH THE SUBRACK.

THE MCPA REQUIRES A SPECIFIC VOLTAGE. DO NOT

OPERATE MCPA AND SUBRACK ASSEMBLY WITH A DC

SUPPLY VOLTAGE OUTSIDE OF THE RANGES

SPECIFIED FOR THE MCPA. DAMAGE WILL OCCUR TO

THE MCPA DUE TO APPLICATION OF IMPROPER

POWER SUPPLY VOLTAGES.

3. OPERATING INSTRUCTIONS

3.1 Safety Precautions

During normal operation, personnel must be cognizant of the intrinsic hazards related

to electronic equipment in general, and RF power amplifiers in particular. This

subsystem processes high RF power (up to 400 watts) which is dangerous and can

cause serious RF burns if contacted. Caution must be exercised when working with this

subrack assembly and related amplifier(s). While every practicable safety precaution

has been incorporated into this subrack assembly, the following rules must be strictly

observed:

WARNING

KEEP AWAY FROM LIVE CIRCUITS

Operating personnel must observe all safety regulations at

all times. Do not make adjustments inside equipment with

hazardous voltages present. Do not operate the amplifier

without proper RF termination.

DO NOT SERVICE OR ADJUST ALONE

Under no circumstances should any person reach within or

enter any enclosure for purposes of servicing or adjustment

without the immediate presence and assistance of another

person capable of rendering aid. Knowledge of first aid for

electrical shock and burns is necessary.

PERSONNEL

Only trained personnel are to service and adjust the

amplifier. Personnel must be trained in the maintenance of

equipment with hazardous RF power, and must be familiar

with this amplifier. In addition, the following precautions

must be observed during operation.

WARNING

MAINTAIN PROPER TERMINATION AT THE OUTPUT

PORT OF THE SUBSYSTEM. DO NOT REMOVE OR

EXCHANGE RF CABLES OF THE OUTPUT LOAD

CIRCUIT WHILE THE SUBSYSTEM IS IN OPERATION.

DANGEROUS RF VOLTAGE MAY EXIST AT THE

FOREMOST TERMINAL OF THE INTERRUPTED LOAD

CIRCUIT DURING OPERATION.

CAUTION

All interconnecting cables must be connected prior to

application of RF power. Although the subsystem is

designed to withstand all output load conditions including

open and short circuit conditions, it is recommended to

connect an appropriate RF load to the output port of the

subsystem prior to application of RF power.

CAUTION

Maintain proper RF input to the amplifier. Damage to the

amplifier may occur if excessive RF input is applied.

3.2 Controls and Indicators

The subrack assembly is equipped with a local DC ON/OFF control, and status

indicators on the front panel. A rear panel I/O interface is provided for remote status

monitoring and control. The following paragraphs detail these features.

3.2.1 Local Controls and Indicators

Figure 5 is a detail view of the front panel of the subrack assembly, showing the local

controls and indicators area. Table 7 describes the controls and indicators. Refer also

to Appendix A, which contains a description of the controls and indicators provided on

the individual Ericsson MCPA amplifier modules.

Figure 5. Detail View, MCPA Subrack Local Controls and Indicators

Table 7.

Subrack Assembly Local Controls and Indicators

CONTROL/INDICATOR FUNCTION

POWER ON/OFF - Line switch (with switch cover guard) and integral

green DC ON LED indicator, enables the high power

+27V power supply circuitry.

MCPA1 through MCPA4 -Yellow LED indicating a low power output condition

from the monitored MCPA. The associated indicator is

activated when 1 or more MCPA outputs is 10 dB or

more below the others.

LOW POWER

MCPA1 MCPA2 MCPA3 MCPA4

DC ON

ALARMS

MINOR MAJOR CRITICAL ALC

3.2.2 Remote Control/Status Interface

The subrack assembly is equipped with a control input as well as built-in-test (BIT)

status outputs at I/O Control and Status connector J4. The I/O Control and Status

interface is detailed in Table 6.

3.3 Initial Turn On Procedure

The following procedure is intended to verify operation of the subrack assembly

following installation, repair or replacement. Refer to the companion MCPA

Installation, Operation and Maintenance Manual for additional instructions regarding

MCPA turn on.

WARNING

EQUIPMENT OPERATORS MUST BE FAMILIAR WITH

ALL SAFETY PRECAUTIONS OUTLINED AT THE

BEGINNING OF THIS SECTION PRIOR TO OPERATING

THE SUBRACK. OPERATOR INJURY AND/OR

EQUIPMENT DAMAGE WILL RESULT FROM IMPROPER

OPERATION.

a. Verify that all connections to the subrack assembly have been properly made in

accordance with Section 2 of this manual, and the outline and installation drawing,

Figure 3.

b. With no RF applied to the subrack assembly, depress the POWER ON/OFF switch.

Depress ON/OFF switch on each MCPA module. The DC ON LED and ENABLE LED

will be illuminated.

c. Apply reduced RF input (-60 dBm) to the subrack assembly’s RF IN connector, J1

within the 869-894 MHz frequency range.

CAUTION

Maintain proper RF input level within the 869-894 MHz

operating band. Improper RF input may cause severe

subrack assembly damage.

d. Increase input level to between -15 and -11 dBm, and observe that only the DC ON

and ENABLE LEDs are illuminated.

3.4 Normal Operation

The subrack assembly requires minimum attention during normal operation. Monitoring

of the BIT status outputs and RF sample output provides an overall indication of

subrack assembly health.

3.5 Shut Down Procedure

a. Reduce RF input signal level to minimum (-60 dBm).

b. Depress the ON/OFF switch to shut down the subrack assembly. Depress the

ON/OFF switch of each MCPA module to turn each off.

c. If maintenance or service is to be performed on the subrack assembly, or any of the

MCPAs, deactivate prime dc power to the subrack assembly.

WARNING

THE DC ON/OFF SWITCH DOES NOT CONTROL THE

MAIN +27 VDC FEED TO THE SUBRACK ASSEMBLY. IF

MAINTENANCE OR SERVICE IS TO BE PERFORMED ON

THE SUBRACK ASSEMBLY OR MCPAS, DEACTIVATE

PRIME DC POWER AT ITS SOURCE.

4. PRINCIPLES OF OPERATION

4.1 Introduction

The subrack assembly and up to four individual Multicarrier Power Amplifier (MCPA)

modules comprise the Ericsson Amplifier Technologies MCPA subsystem. The

resulting multicarrier amplifier subsystem is capable of linearly amplifying AMPS,

TDMA and CDMA carriers at rated power. Extensive design and testing has been

accomplished to ensure proper operation with all aspects of carrier count, carrier type

and downlink power control in all of the standards. Additional standards such as EDGE

and GSM can be supported at lower power levels.

This section contains a functional description of the subrack assembly. Refer to the

block diagram of the subrack, Figure 7, located at the end of this section. The subrack

assembly contains an active combiner, which automatically reconfigures to effectively

combine the individual modules. Coupling the active combiner with blind mate

connectors allows the user to hot swap modules as needed. User I/O is provided

through the subrack assembly. The control and status of each module is sent to the

subrack assembly from the individual modules, and is converted into a format suitable

for the user. A microprocessor board in the subrack assembly handles all of the

necessary control between the individual modules, the subrack and the user. The

firmware resident in all assemblies can be updated through the subrack RS-232 port,

using custom software and a laptop.

Table 8 shows how the gain varies with installed but non-operating modules. When the

installed but non-operating module is replaced with an operational module, the

subsystem gain is restored to 54.5 dB.

Table 8.

Nominal Gain for Amplifier Installed Configuration

Operational

Amplifiers 1 module

Subsystem 2 module

Subsystem 3 module

Subsystem 4 module

Subsystem

147.5 dB 47.5 dB 47.5 dB 47.5 dB

2-50.5 dB 50.5 dB 50.5 dB

3- - 52.2 dB 52.2 dB

4---53.5 dB

User connections to the subsystem include:

DC inputs for the subrack assembly

One Subrack RF input

One Subrack RF output

One Subrack RF forward output sample

One Subrack I/O interface

4.2 RF Input Signal

The maximum input signal for all carrier frequencies should not exceed the limits

specified in the electrical specifications. The input VSWR should be 2:1 maximum (or

better).

4.3 RF Output Load

The load impedance should be as close as possible to 50 ohms (VSWR of 1.5:1 or

less) over the 869-894 MHz operating frequency band to ensure maximum RF power

transfer to the load.

Figure 7. Block Diagram, MCPA Subsystem Assembly

INPUT

RF POWER

DIVIDER

RF INPUT

MCPA 1

MCPA 2

POWER LEVEL

SENSOR

POWER LEVEL

SENSOR

MCPA 3

MCPA 4

POWER LEVEL

SENSOR

POWER LEVEL

SENSOR

RECONFIGURABLE

OUTPUT

RF POWER

COMBINER

RF OUTPUT

POWER LEVEL

SENSOR

TB1

DC INPUT

MICROPROCESSOR

DC ON/OFF SWITCH

AND INDICATOR

FUSE

RF SAMPLE

I/O

CONTROL

& STATUS

INTERFACE

LOW POWER

MCPA1 - MCPA4

LED

INDICATORS

5. MAINTENANCE

5.1 Introduction

This section provides information for periodic maintenance of the subrack assembly, as

well as tests which are recommended in order to evaluate its performance. Refer to

paragraph 5.3 for troubleshooting procedures for the subrack assembly.

CAUTION

Do not attempt to repair the subrack assembly. The

equipment contains no user-serviceable components, with

the exception of the fuse. Further damage will result from

improper repairs.

NOTE

Do not break the seals on the equipment, as this will void

the warranty.

5.2 Periodic Maintenance

Periodic maintenance tasks and recommended intervals are listed in Table 9.

Table 9. Periodic Maintenance Tasks

CATEGORY TASK RECOMMENDED

INTERVAL MAINTENANCE ACTION

Cleaning Air

Inlets/Outlets 30 Days Inspect and clean in accordance

with paragraph 5.2.1.

Inspection Cables and

Connectors 12 Months Inspect all cables for any signs of

damage or wear. Check and

verify that all connections are

secure.

Performance

Tests 12 Months Perform tests as outlined in

paragraph 5.2.3.

5.2.1 Cleaning Air Inlets/Outlets

The air inlets and outlets are located at the front and rear of the unit. Air is drawn in

from the front, and exhausted through the rear of the subrack. These areas should be

cleaned at 30 day intervals, or sooner, if the equipment is operated in a severe dust

environment. Use dry, low-pressure compressed air, or a brush with soft bristles to

loosen, remove and clean off any accumulated dust from the air inlet and outlet areas.

5.2.2 Test Equipment Required

Table 10 lists the test equipment required for evaluating the subrack performance.

Suitable equivalents may be substituted.

Table 10. Test Equipment Required

NOMENCLATURE QTY MANUFACTURER MODEL

Signal Generator 1 H/P ESG

Attenuator, 40 dB, 250 Watt 1 Weinschel S3-40-43

Attenuator, 20 dB, 20 Watt 2 Weinschel AT20

Spectrum Analyzer 1 H/P 8560E

Directional Coupler, 30 dB 1 RF Power DDC-901-931-R5-30

Power Meter/Sensor 1 H/P 437B/8481A

Power Supply 1 H/P 6673A

5.2.3 Performance Tests

Performance tests should be performed at 12-month intervals, or as directed by the

resident maintenance authority, to ensure that the subrack assembly is functioning

properly and within expected specification limits.

5.3 Troubleshooting Procedures

Figure 8 is the troubleshooting flow chart for the subrack assembly.

CAUTION

Do not attempt to repair the subrack assembly. The

equipment contains no user-serviceable components, with

the exception of the fuse. Further damage will result from

improper repairs.

NOTE

Do not break the seals on the equipment, as this will void

the warranty

Begin Here

Is the DC ON

LED illuminated Is the fuse on the

front panel blown?

Replace fuse with another of exactly the same rating

so as to prevent further damage to equipment and to

ensurew continued protection.

Yes

Verify connections and DC power to the Surack. If

secure, return Subrack for repair.

Yes

Reset Power to the individual MCPAs. Refer to

Appendix B to reset power to each MCPA.

Are any of the LOW

POWER LEDs active? No

Follow path for

Type of Alarm.

Yes

Minor Alarm Major Alarm Critical Alarm ALC Alarm

See Sheet 2 See Sheet 3

Figure:8 Subrack Troubleshooting Flow Chart.

Minor Alarm Major Alarm

Identify and

Reset Faultly

MCPA

Identify and

Reset Faultly

MCPA(s) Reset

Subrack

Alarm Cleared

Return to Service

Yes

Alarm Cleared

Return to Service

Yes

SHEET. 2

From Sheet 1 From Sheet 1

Replace MCPA and

return for repair.

Replace MCPA and

return for repair.

Critical Alarm

Identify and

Reset Faultly

MCPAs Reset

Subrack

Alarm Cleared

Return to Service

ALC Alarm

Identify and

Reset Faultly

MCPAs

Return to Service

Alarm Cleared No

Yes

Alarm Cleared

Yes

Verify Drive

level to subrack

& VSWR

Alarm Cleared Yes

Yes

Adjust Drive

level or correct

VSWR.

Alarm

Cleared

Yes

Return Subrack for

repair

Sheet 3

From Sheet 1 From Sheet 1

Replace MCPA(s) and

return for repair

If MCPAs show

Over Pwr alarm,

check & adjust subrack drive

level

Alarm cleared

Return to service

Yes

Replace MCPA(s) and return

for repair.

APPENDIX A

Ericsson MCPA Module

Controls and Indicators

MCPA Local Controls and Indicators

ENABLE LED

FAN LED

LOOP LED

VSWR LED

PWR SPLY LED

OVER PWR LED

DC ON/OFF SWITCH

AND INDICATOR

TEMP/WARN LED

ENABLE

SWITCH

MCPA Local Controls and Indicators

CONTROL/INDICATOR FUNCTION

DC ON - Power Supply switch and integral DC ON green LED indicator, enables

the external high power +27V power supply circuitry.

ENABLE ON - Green LED indicates unit is ENABLED, biased on and the amplifier is

ready to amplify signals.

FAN ALARM - Yellow LED indicating a blocked or non-functioning fan.

LOOP ALARM

(Steady On)- Steady (not blinking) Red LED indicating internal control loops can no

longer minimize IMD performance. The sequence of disable and

enable commands may be used to reset the loops to their normal

conditions.

LOOP ALARM –

(Blinking On/Off, indicates

Locking Mode)

Blinking red LED indicating Locking Mode has been entered. The

locking mode is used to indicate when the module is unable to

minimize IMD performance and is attempting to adjust loop

coefficients. During this mode, IMD performance may not meet

specified values. The module will attempt to improve performance for

1 minute. If unable to improve performance during this period, the

module will indicate a loop alarm and enter the shutdown mode, and

will require power to be reset in order to clear the fault.

VSWR ALARM - Red LED indicating load VSWR is greater than 3.0:1. Amplifier will

enter shutdown mode, and will require power to be reset in order to

clear the fault.

POWER SUPPLY ALARM - Red LED indicating a power supply generated voltage is out of range.

Amplifier will enter shutdown mode, and will require power to be reset

in order to clear the fault.

TEMP WARNING/ALARM -

Dual color (Yellow/Red) LED. TEMP WARNING: Yellow color indicates approach of excessive

operating temperature of approximately +80°C as monitored on the

heatsink. Operation of the MCPA can continue uninterrupted during

this warning condition.

TEMP ALARM: Red color indicates excessive operating temperature

of approximately +90°C as monitored on the heatsink. Operation of

the MCPA is disabled until the heatsink has cooled to a safe operating

temperature, at which point, operation will automatically resume.

OVERPOWER ALARM - Red LED indicating that the RF output power from the MCPA is greater

than 2 dB above nominal output power. Amplifier will enter shutdown

mode, and will require power to be reset in order to clear the fault.

NOTE

Activation of the LOOP ALARM, VSWR ALARM, POWER SUPPLY

ALARM, TEMP ALARM or OVERPOWER ALARM will cause the

Amplifier to enter shutdown mode. The amplifier will attempt to auto

recover up to three times within 24 hours. If the alarm is still present, the

amplifier will continue to shutdown. The amplifier may also be manually

reset using the front panel button. Refer to Figure 4, which details the

ON/OFF sequence of the MCPA.

APPENDIX B

Ericsson MCPA Module

Power On/Off Sequence

Power Amplifier Module Power ON/OFF Sequence

Initial state.

MCPA is shut down.

Minimal current draw.

Module bias is

applied. MCPA is

enabled as indicated

by front panel

ENABLE LED.

Current draw

approximately 18

amps.

OFF OFF OFF DISABLED

DC ON LED

STATUS ENABLE LED

STATUS

INTERNAL

POWER SUPPLY

STATUS

MCPA

STATUS

DC ON/OFF

DEPRESS

ON ON ON ENABLED

DC ON LED

STATUS ENABLE LED

STATUS

INTERNAL

POWER SUPPLY

STATUS

MCPA

STATUS

DC ON/OFF

DEPRESS

OPERATING

STATUS

OPERATING

STATUS

NOTE:

If resetting power to the MCPA does not clear the fault condition, contact Ericsson Amplifier Technologies,

or return MCPA for service.

Powerwave Technologies KRB1011108 Multi Carrier Power Amplifier User Manual MCPS Subsystem Manual

Powerwave Technologies, Inc. Multi Carrier Power Amplifier MCPS Subsystem Manual

Contents

QANKRB1011108 User Information

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