Pycom G01R G01 User Manual

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Datasheet
Version 1.0
1.0
Overview
03
13.0
Bluetooth
14
2.0
Features
03
3.0
Specifications
04
3.1
CPU
Memory
WiFi
Bluetooth
LTE CAT–M1
Supported features
Specification
Receiver – Basic Data Rate
Receiver – Enhanced Data Rate
Receiver – Bluetooth LE
Transmitter – Basic Data Rate
Transmitter – Enhanced Data Rate
Transmitter – Bluetooth LE
14
14
14
15
16
17
18
19
14.0
LTE CAT–M1
20
3.7
3.8
RTC
Security
Hash / encryption
04
04
04
04
04
04
04
04
13.1
13.2
13.2.1
13.2.2
13.2.3
13.2.4
13.2.5
13.2.6
4.0
Block Diagram
04
5.0
Pinout
05
14.1
14.2
14.2.1
14.3
14.4
Supported features
Specifications
Supported LTE bands
SIM Card requirements
Certified carriers
20
20
20
20
20
6.0
Pin Details
06
15.0
Electrical Characteristics
21
6.1
Remapping Pins
08
15.1
15.2
Absolute maximum ratings
Input/Output characteristics
21
21
7.0
ESP32 Peripherals
09
16.0
Minimum Recommended Circuit
22
7.1
RTC
09
8.0
Programming the device
10
17.0
Mechanical Specifications
23
8.1
8.2
8.2.1
8.2.2
UART
Wi–Fi
10
10
18.0
Recommended Land Patterns
23
Telnet
FTP
10
10
19.0
Design Considerations
24
9.0
Boot modes
10
19.1
19.2
19.3
Antenna Impedance
Deep sleep power
Reference layout
24
24
25
9.1
9.2
Bootloader mode
Safe boot
10
10
20.0
Soldering Profile
26
10.0
Power
11
21.0
Ordering Information
27
10.1
Current consumption by power
modes/features running at 3.7V
11
11.0
Memory Map
12
11.1
11.2
11.3
Flash
RAM
12
12
ROM and eFuses
12
12.0
WiFi
13
12.1
12.2
Supported features
Specifications
13
13
3.2
3.3
3.4
3.5
3.6
Version 1.0
22.0 Packaging
27
22.1
22.2
22.3
Reel
Tape
27
27
Box
27
23.0
Certification
28
02
1.0
Overview
	With WiFi, BLE and cellular LTE–CAT M1, the
G01 OEM Module is the latest Pycom triple–bearer
MicroPython enabled micro controller on the market
today – the perfect enterprise grade platform for your
connected things. Create and connect your
things everywhere, fast.
Version 1.0
2.0
Features
–– Powerful CPU, BLE and state of the art WiFi radio. 1KM
Wifi Range
–– MicroPython enabled
–– Can be directly surface mount inside your product like
a regular component
–– Ultra–low power usage: a fraction compared to other
connected micro controllers
03
3.0
Specifications
3.1
CPU
–– Xtensa® dual–core 32–bit LX6 microprocessor(s), up
to 600 DMIPS
–– Hardware floating point acceleration
–– Python multi–threading
–– An extra ULP–coprocessor that can monitor GPIOs,
the ADC channels and control most of the internal
peripherals during deep–sleep mode while only
consuming 25uA.
3.2
Memory
–– RAM: 520KB + 4MB
–– External flash: 8MB
3.3
WiFi
–– 802.11b/g/n 16mbps
3.4
Bluetooth
–– Low energy and classic
4.0
3.5
LTE CAT–M1
–– One single chip for CAT M1
–– 3GPP release 13 LTE Advanced Pro
–– Supports narrowband LTE UE categories M1
–– Integrated baseband, RF, RAM memory and power
management
–– Reduced TX power class option
–– Peak power estimations:
TX current = 420mA peak @1.5Watt
RX current = 330mA peak @1.2Watt
–– Extended DRX (eDRX) and PSM features for long
sleep duration use cases
3.6
RTC
–– Running at 150kHz
3.7
Security
–– SSL/TLS support
–– WPA Enterprise security
3.8
Hash / encryption
–– SHA
–– MD5
–– DES
–– AES
Block Diagram
Figure 1 – System block diagram
Version 1.0
04
Version 1.0
ADC2_7
RTCIO17
Touch7
16
EMACRXDV
GPIO27
LTE_WAKE
P8
Touch1
P9
GPIO12
GPIO2
GPIO19
EMACTXD0 ADC2_2 EMACTXD3
RTCIO12 ADC2_5
U0CTS
Touch2
VSPIQ
RTCIO15
Touch5
HSPIWP
38
MTDI
SDDATA0
HSPIQ
22
SDDATA2
HS2DATA2
SDA
18
LTE_CTS
23
CLKOUT1
GND
GND
WiFi / Bluetooth
Antenna
3V3
GND
GND
1V8
GND
ADCPA
ADC1_0
RTCIO0
SensVP
P13
GPIO36
ADC1_1
RTCIO1
MISO
P14
GPIO37
14
15
DAC_1
DAC_2
RTCIO6
RTCIO7
RTCIO16
ADC2_6 ADC2_8 ADC2_9
EMACTXD2 EMACRXD0 EMACRXD1
GPIO25
GPIO26
GPIO14
P22
P23
P21
Touch6
MTMS
HSPICLK
SDCLK
HS2CLK
17
P2
+ GND
ADC1_7
RTCIO5
VDET2
11
P17
GPIO35
ADC1_6
RTCIO4
VDET1
10
P18
GPIO34
Safe boot, latest firmware is selected
Safe boot, previous user update selected
Safe boot, the factory firmware is selected
4-6 sec
7-9 sec
+ 3V3
Only Input pins!
No pullup/pulldown
internal resistance
1-3 sec
P12
Boot modes and safe boot
ADCPA
ADC1_3
RTCIO3
SensVN
P16
GPIO39
Touch9
RTCIO9
ADC1_4
GPIO32
P19
12
XTAL32
23/01/18
To order contact sales@pycom.io
embodied in critical reviews and certain other noncommercial
uses permitted by copyright law.
ADC1_2
RTCIO2
P15
GPIO38
Touch8
RTCIO8
ADC1_5
GPIO33
P20
13
XTAL32
Supply with a stable 3V3 power source
capable of delivering at least 950mA
Outputs 1V8 while the module
is in active mode, and drops
to 0V during deep sleep
Absolute MAX per pin 12mA
recommended 6mA
Low Level Bootloader
document may be reproduced, distributed, or transmitted in any form
or by any means, including photocopying, recording, or other
electronic or mechanical methods, without the prior written
permission of Pycom Ltd, except in the case of brief quotations
GND
ChipPU
RST
GND
GND
SIM_RESET
SIM_DATA
GND
VSIM
SIM_CLK
GND
GND
P10
GPIO13
EMACRXER
P11
P12
ADC2_4 GPIO22 GPIO21
RTCIO14 EMACTXD1 EMACTXEN
Touch4
U0RTS
VSPIHD
MTCK
VSPIWP
MOSI
HSPIID
42
39
SDDATA3
HS2DATA3
SCL
CLK
20
41
TX0
40
SDDATA1 RTCIO11 CLKOUT3
RX0
ADC2_1
HSPIHD
U0TXD
CLKOUT2
Touch0 EMACTXCLK EMACRXD2
U0RXD
GPIO0
RTCIO10
GPIO1
GPIO3
ADC2_0
P0
P1
P2
EMACTXER
GPIO4
P3
24
TX1
HS2DATA1
PROGRAM
Port
Distributed and manufactured by Pycom Ltd.
Registered oce:
High Point, 9 Sydenham Road, Guildford, Surrey GU1 3RX, UK
Copyright Š 2017 by Pycom Ltd. All rights reserved. No part of this
Power
GND
Serial Pin
Analog Pin
Control
Physical Pin
Port Pin
Touch Pin
DAC Pin
PMW Pin
Connected to
the LTE radio
LTE_RX
GPIO5
EMACRXCLK
34
HS1DATA6
VSPICS0
21
RX1
HS2CMD
SDCMD
HSPICS0
MTD0
Touch3
RTCIO13
ADC2_3
EMACRXD3
GPIO15
P4
3.2-5.5V
GND
GND
GND
LTE CAT M1 Antenna
Pinout diagram
5.0
Pinout
Note: The ESP32 supports remapping its peripherals to alternative pins. See below for a detailed list.
Figure 2 – Module pinout diagram
05
6.0
Pin Details
Table 1 – Module pinout
Module
Pin
ESP32
GPIO
Pin
Name
–
–
Ground
–
–
Ground
–
–
Ground
–
–
USIM Clock
–
–
USIM I/O
–
–
Ground
–
–
Ground
–
–
Ground
–
–
Reset
Active Low
10
P0
RX0
(Programming)
Used by the bootloader and to program
the module
11
P1
TX0
(Programming)
Used by the bootloader and to program
the module
12
P2
13
P3
TX1
2*
14
15
P4
RX1
2*
15
–
Sequans modem
RX
16
27
–
Sequans modem
Interrupt
17
19
–
Sequans modem
CTS
18
P8
19
12
P9
Version 1.0
Default Function
ADC
2*
SDA
PWM
RTC†
Notes
If tied to GND during boot the device will
enter bootloader mode
JTAG TDO, SD card CMD
Not recommended for external use
2*
Not recommended for external use
Not recommended for external use
2*
SD card DAT0
2*
JTAG TDI
06
6.0
Pin Details
Table 1 – Module pinout
Module
Pin
ESP32
GPIO
Pin
Name
Default Function
ADC
20
13
P10
SCL (I2C) / CLK
(SPI)
2*
21
22
P11
MOSI
22
21
P12
23
–
–
Ground
24
–
–
Ground
25
–
–
WiFi/BT antenna
26
–
–
Ground
27
–
–
Ground
28
–
–
Ground
29
36
P13
Input only
30
37
P14
Input only
31
38
P15
Input only
32
39
P16
Input only
33
35
P17
Input only
34
34
P18
Input only
35
32
P19
36
33
P20
Connected to the on–board RGB LED
37
26
P21
2*
DAC
38
25
P22
2*
DAC
39
14
P23
2*
JTAG TMS, SD card SCLK
Version 1.0
PWM
RTC†
Notes
JTAG TCK
If tied to 3.3V during boot the device
enters safe boot mode, JTAG MISO
50 Ohm impedance required
07
6.0
Pin Details
Table 1 – Module pinout
Module
Pin
ESP32
GPIO
Pin
Name
40
–
–
3.3V input
41
–
–
Ground
42
–
–
1.8V Output
43
–
–
Ground
44
–
–
Ground
49
–
–
3.2–5.5V input
50
–
–
Ground
51
–
–
LTE CAT–M1
antenna
52
–
–
Ground
–
23
–
Sequans modem
TX
–
18
–
Sequans modem
RTS
Default Function
ADC
PWM
RTC†
Notes
This supply should be able to source
650mA
Only when the device is active, during
deep sleep this drops to 0V
Powers the Sequans cellular modem
50 Ohm
impedance required
† The pins on the RTC power domain can be used during deep sleep, specifically GPIO pins will maintain their state while in deep sleep.
* ADC2 is currently not supported in the micropython firmware
6.1
Remapping Pins
	The ESP32 features comprehensive pin remapping
functionality. This allows peripherals to be mapped onto
almost any available GPIO pins. The above table merely
shows the default assignments. For example, the
default mapping has the SPI and I2C clocks overlapping,
meaning both cannot be used simultaneously without
Version 1.0
remapping one to a different pin. For a detailed guide
of what peripheral can be assigned to what pins please
read “Appendix A – ESP32 Pin Lists” of the ESP32
datasheet.
08
7.0
ESP32 Peripherals
Table 2 – Peripherals
Peripheral
Count
Pins
UART
Remappable to any GPIO.
Note: P13–18 can only be mapped to RX or CTS since they are input only.
I2C
Remappable to any GPIO except P13–18 since they are input only and I2C is bi–directional.
SPI
Remappable to any GPIO.
Note: P13–18 can only be mapped to MISO since they are input only.
CAN*
Remappable to any GPIO.
Note: P13–18 can only be mapped to RX since they are input only.
JTAG
TDO = P4, TDI = P9, TCK = P10, TMS = P24
PWM
All GPIO except P13–18 which are input only
ADC
18
Fixed mapping, see Table 1, Only ADC 1 is supported in our micropython firmware.
DAC
Only available on P21 and P22
SD
DAT0 = P8, SCLK = P23, CMD = P4
* Requires an external CAN bus transceiver, we recommend the SN65HVD230 from Texas Instruments.
	For a more detailed description of the ESP32 peripherals
along with peripherals not currently supported by our
firmware, please check the ESP32 datasheet.
7.1
RTC
	Our modules by default all use the internal RC oscillator
at 150kHz for the RTC. If you require better accuracy/
stability you can connect a 32.768 kHz crystal (or TCXO)
externally on pins P19 and P20 (or P19 for a TXCO)
Figure 3 – External RTC crystal circuits
Version 1.0
09
8.0
Programming the device
8.1
UART
	By default, the modules run an interactive python
REPL on UART0 which is connected to P0 (RX) and P1
(TX) running at 115200 baud. Code can be run via this
interactive REPL or you can use our PyMakr plugin for
Atom or Visual Studio Code to upload code to the board.
8.2
Wi–Fi
	By default, the G01 also acts as a Wi–Fi access point
SSID: gpy–wlan–XXXX
Password: www.pycom.io
Once connected to the G01’s Wi–Fi network you can
access it in two ways.
9.0
8.2.1 Telnet
	Running on port 23 is a telnet server. This acts in a
very similar way to the UART. It presents you with an
interactive REPL and can also be used to upload code
via PyMakr.
8.2.2 FTP
	The G01 also runs a FTP server that allows you to copy
files to and from the device, include an SD card if one is
connected. To connect to this FTP server, you need to use
plain FTP (un–encrypted) with the following credentials:
User: micro
Password: python
Boot modes
9.1
Bootloader mode
	In order to update the firmware of the G01 device, it
needs to be placed into bootloader mode. In order to
do this, P2 needs to be connected to ground when the
device reboots. Once in bootloader mode you can use
the Pycom firmware update tool to update to the latest
official firmware. If you are developing your own firmware
based on our open–source firmware, a flashing script is
provided with the source code.
9.2
Safe boot
	The micropython firmware features a safe boot feature
that skips the boot.py and main.py scripts and goes
straight to the REPL. This is useful if the device is
programmed with code that causes the device to crash or
become inaccessible. To access this mode, you need to
connect P12 to 3.3V and reset the device. Upon entering
safe boot mode, the on–board LED will begin to blink
orange. Depending on the duration the pin is held at 3.3V,
a different firmware will be run.
Table 3 – Boot modes
0–3 Seconds
3–6 Seconds
Current firmware without running
boot.py or main.py
Previous firmware if the firmware was uploaded via OTA
(without running boot.py and main.py)
Version 1.0
10
10.0
Power
The G01 features an on–board voltage regulator that
takes 3.5V – 5.5V from the VIN pin and regulates it to
3.3V. It is important to only use the 3.3V as an output
and not try to feed 3.3V into this pin as this could
damage the regulator.
10.1
Current consumption by power modes/features running at 3.3V
Table 4 – Power consumption by feature
Mode
Min
Avg.
Max
Units
Idle (no radios)
–
37
–
mA
LTE Transmit
–
173
285
mA
LTE Attached
–
75
–
mA
WiFi AP
–
117
–
mA
WiFi client
–
130
–
mA
Bluetooth
–
113
–
mA
Deep sleep
–
13.5
–
mA
Version 1.0
11
11.0
Memory Map
11.1
Flash
Table 5 – Flash memory map
Name
Description
Start address
Size
NVS
Non–volatile RAM area. Used by the NVS API
0x9000
0x7000
Firmware Slot 0
First firmware slot. Factory firmware is flashed here
0x10000
0x180000
OTA info
Information about the current active firmware
0x190000
0x1000
Firmware Slot 1
Second firmware slot
0x1A0000
0x180000
File system
504KB file system on devices with 4MB flash
0x380000
0x7F000
Config
Config area for LoRa, Sigfox and LTE
0x3FF000
0x1000
File system (2)
4MB file system on devices with 8MB flash
0x400000
0x400000
11.2
RAM
Table 6 – RAM memory map
Name
Description
On–chip SRAM
Internal RAM memory used by the 2 xtensa CPUs
Fast RTC RAM
Fast RAM area accessible by the xtensa cores during
boot and sleep modes
8KB
Slow RTC RAM
Slow RAM area accessible by the Ultra–Low Power
Coprocessor during deep sleep
8KB
External pSRAM
External QSPI RAM memory clocked @ 40MHz
4MB
Name
Description
Size
On–chip ROM
Contains core functions and boot code.
eFuse
256 bits are used for the system (MAC address and
chip configuration) and the remaining 768 bits are
reserved for customer applications, including Flash–
Encryption and Chip–ID
11.3
Size
520KB
ROM and eFuses
Table 7 – Miscellaneous memory
Version 1.0
448KB
1kbit
12
12.0
WiFi
12.1
Supported features
–– 802.11 b/g/n
–– 802.11 n (2.4 GHz), up to 150 Mbps
–– 802.11 e: QoS for wireless multimedia technology
–– WMM–PS, UAPSD
–– A–MPDU and A–MSDU aggregation
–– Block ACK
–– Fragmentation and defragmentation
12.2
–– Automatic Beacon monitoring/scanning
–– 802.11 i security features: pre–authentication and TSN
–– Wi–Fi Protected Access (WPA/WPA2/WPA2–
Enterprise/Wi–Fi Protected Setup (WPS)
–– Infrastructure BSS Station mode/SoftAP mode
–– Wi–Fi Direct (P2P), P2P Discovery, P2P Group Owner
mode and P2P Power Management
Specifications
Table 8 – WiFi specifications
Description
Min
Typ.
Max
Unit
Input Frequency
2412
–
2462
MHz
Output power of PA for 11b mode
20.48
21.31
22.13
dBm
Sensitivity
DSSS, 1Mbps
–
–
98
dBm
CCK, 11 Mbps
–
–
91
dBm
OFDM, 6 Mbps
–
–
93
dBm
OFDM, 54 Mbps
–
–
75
dBm
HT20, MCS0
–
–
93
dBm
HT20, MCS7
–
–
73
dBm
HT40, MCS0
–
–
90
dBm
HT40, MCS7
–
–
70
dBm
MCS32
–
–
89
dBm
Adjacent channel rejection
OFDM, 6 Mbps
–
37
–
dB
OFDM, 54 Mbps
–
21
–
dB
HT20, MCS0
–
37
–
dB
HT20, MCS7
–
20
–
dB
Version 1.0
13
13.0
Bluetooth
13.1
Supported features
–– Compliant with Bluetooth v4.2 BR/EDR and BLE
specification
–– class–2 transmitter without external power amplifier
––
––
––
––
––
––
––
––
––
––
––
– Enhanced power control
–
– NZIF receiver with –97 dBm sensitivity
–
– Adaptive Frequency Hopping (AFH)
–
– Standard HCI based on SDIO/SPI/UART
–
– High–speed UART HCI, up to 4 Mbps
–
– BT 4.2 controller and host stack
–
–
13.2
Service Discover Protocol (SDP)
General Access Profile (GAP)
Security Manage Protocol (SMP)
ATT/GATT
HID
All GATT–based profile supported
SPP–like GATT–based profile
BLE Beacon
A2DP/AVRCP/SPP, HSP/HFP, RFCOMM
CVSD and SBC for audio codec
Bluetooth Piconet and Scatternet
Specification
13.2.1 Receiver – Basic Data Rate
Table 9 – Receiver (basic data rate) specifications
Parameter
Min
Typ.
Max
Unit
Sensitivity @0.1% BER
–
–94
–
dBm
Maximum received signal @0.1% BER
–
–
dBm
Co–channel C/I
–
+7
–
dB
F = F0 + 1 MHz
–
–
–6
dB
F = F0 – 1 MHz
–
–
–6
dB
F = F0 + 2 MHz
–
–
–25
dB
F = F0 – 2 MHz
–
–
–33
dB
F = F0 + 3 MHz
–
–
–25
dB
F = F0 – 3 MHz
–
–
–45
dB
30Mhz ~ 2000MHz
–10
–
–
dBm
2000MHz ~
2400MHz
–27
–
–
dBm
2500MHz ~
3000MHz
–27
–
–
dBm
3000MHz ~
12.5GHz
–10
–
–
dBm
–36
–
–
dBm
Adjacent channel selectivity C/I
Out–of–band blocking performance
Intermodulation
Version 1.0
14
13.2.2 Receiver – Enhanced Data Rate
Table 10 – Receiver (basic data rate) specifications
Parameter
Min
Typ.
Max
Unit
Sensitivity @0.1% BER
–
–90
–
dBm
Maximum received signal @0.1% BER
–
–
dBm
Co–channel C/I
–
11
–
dB
F = F0 + 1 MHz
–
–7
–
dB
F = F0 – 1 MHz
–
–7
–
dB
F = F0 + 2 MHz
–
–25
–
dB
F = F0 – 2 MHz
–
–35
–
dB
F = F0 + 3 MHz
–
–25
–
dB
F = F0 – 3 MHz
–
–45
–
dB
–
–84
–
dBm
Maximum received signal @0.1% BER
–
–5
–
dBm
C/I c–channel
–
18
–
dB
F = F0 + 1 MHz
–
–
dB
F = F0 – 1 MHz
–
–
dB
F = F0 + 2 MHz
–
–25
–
dB
F = F0 – 2 MHz
–
–25
–
dB
F = F0 + 3 MHz
–
–25
–
dB
F = F0 – 3 MHz
–
–38
–
dB
π/4 DQPSK
Adjacent channel selectivity C/I
8DPSK
Sensitivity @0.1% BER
Adjacent channel selectivity C/I
Version 1.0
15
13.2.3 Receiver – Bluetooth LE
Table 11 – Receiver (BLE) specifications
Parameter
Min
Typ.
Max
Unit
Sensitivity @30.8% PER
–
–97
–
dBm
Maximum received signal @30.8% PER
–
–
dBm
Co–channel C/I
–
+10
–
dB
F = F0 + 1MHz
–
–5
–
dB
F = F0 – 1MHz
–
–5
–
dB
F = F0 + 2MHz
–
–25
–
dB
F = F0 – 2MHz
–
–35
–
dB
F = F0 + 3MHz
–
–35
–
dB
F = F0 – 3MHz
–
–45
–
dB
30MHz ~
2000MHz
–10
–
–
dB
2000MHz ~
2400MHz
–27
–
–
dBm
2500MHz ~
3000MHz
–27
–
–
dBm
3000MHz ~
12.5GHZ
–10
–
–
dBm
–36
–
–
dBm
Adjacent channel selectivity C/I
Out–of–band blocking performance
Intermodulation
Version 1.0
16
13.2.4 Transmitter – Basic Data Rate
Table 12 – Transmitter (basic data rate) specifications
Parameter
RF transmit power
RF power control range
Min
Typ.
--
–
+20 dB bandwidth
Max
Unit
dBm
dBm
–
0.9
–
MHz
F = F0 + 1 MHz
–
–24
–
dBm
F = F0 – 1 MHz
–
–16.1
–
dBm
F = F0 + 2 MHz
–
–40.8
–
dBm
F = F0 – 2 MHz
–
–35.6
–
dBm
F = F0 + 3 MHz
–
–45.7
–
dBm
F = F0 – 3 MHz
–
–40.2
–
dBm
F = F0 + >3 MHz
–
45.6
–
dBm
F = F0 – >3 MHz
–
44.6
–
dBm
Δf1avg
–
–
155
KHz
Δf2 max
133.7
Adjacent channel transmit power
KHz
Δf2 avg /Δf1avg
–
0.92
–
–
ICFT
–
–7
–
KHz
Drift rate
–
0.7
–
KHz/50Îźs
Drift (1 slot packet)
–
–
KHz
Drift (5 slot packet)
–
–
KHz
Version 1.0
17
13.2.5 Transmitter – Enhanced Data Rate
Table 13 – Transmitter (enhanced data rate) specifications
Parameter
Min
RF transmit power
–
Gain control step
–
RF power control range
Typ.
Max
Unit
6.5
–
dBm
–
dBm
–
dBm
π/4 DQPSK max w0
–
–0.72
–
KHz
π/4 DQPSK max wi
–
–6
–
KHz
π/4 DQPSK max |wi + w0|
–
–7.42
–
KHz
8DPSK max w0
–
0.7
–
KHz
8DPSK max wi
–
–9.6
–
KHz
8DPSK max |wi + w0|
π/4 DQPSK modulation accuracy
8 DPSK modulation accuracy
In–band spurious emissions
EDR differential phase coding
Version 1.0
–10
KHz
RMS DEVM
–
4.28
–
99% DEVM
–
–
30
Peak DEVM
–
13.3
–
RMS DEVM
–
5.8
–
99% DEVM
–
20
Peak DEVM
–
14
–
F = F0 + 1MHz
–
–34
–
dBm
F = F0 – 1MHz
–
–40.2
–
dBm
F = F0 + 2MHz
–
–34
–
dBm
F = F0 – 2MHz
–
–36
–
dBm
F = F0 + 3MHz
–
–38
–
dBm
F = F0 – 3MHz
–
–40.3
–
dBm
F = F0 Âą >3MHz
–
–
–41.5
dBm
–
100
–
18
13.2.6 Transmitter – Bluetooth LE
Table 14 – Transmitter (BLE) specifications
Parameter
Min
Typ.
Max
Unit
RF transmit power
–
3.5
–
dBm
Gain control step
–
--
–
dBm
RF power control range
–
dBm
F = F0 + 1MHz
–
–14.6
–
dBm
F = F0 – 1MHz
–
–12.7
–
dBm
F = F0 + 2MHz
–
–44.3
–
dBm
F = F0 – 2MHz
–
–38.7
–
dBm
F = F0 + 3MHz
–
–49.2
–
dBm
F = F0 – 3MHz
–
–44.7
–
dBm
F = F0 + >3MHz
–
–50
–
dBm
F = F0 – >3MHz
–
–50
–
dBm
Δf1avg
–
–
265
KHz
Δf2 max
247
–
–
KHz
Δf2 avg /Δf1avg
–
–0.92
–
–
ICFT
–
–10
–
KHz
Drift rate
–
0.7
–
KHz/50Îźs
Drift
–
–
KHz
Adjacent channel transmit power
Version 1.0
19
14.0
LTE CAT–M1
14.1
Supported features
–
– 3GPP release 13 LTE Advanced Pro
– Supports narrowband LTE UE categories M1
–
–
–– Integrated baseband, RF, RAM memory and power
management
–– Reduced TX power class option
–– Extended DRX (eDRX) and PSM features for long
sleep duration use cases
Table 15 – LTE modem performance
Parameter
Min
Typ.
Max
Unit
LTE Cat M1 in 1.4 Mhz, HD–FDD – DL
–
300
–
kbps
LTE Cat M1 in 1.4 Mhz, HD–FDD – UP
–
375
–
kbps
Data rate
14.2.1 Supported LTE bands
Table 16 – Supported LTE bands
Bands
TX/RX Frequencies
LTE BAND 4:1710-1755MHz(TX);2110-2155(RX)
Low Bands 4, 12, 13
LTE BAND 12:699-716MHz(TX);729-746(RX)
LTE BAND 13:777-787MHz(TX);746-756(RX)
14.3
SIM Card requirements
Table 17 – SIM card specificiations
Parameter
Min
Typ.
Max
Unit
Form factor
–
Nano–SIM
–
–
Variant
–
USIM
–
–
Supply Voltage
–
1.8
–
14.4
Certified carriers
Table 18 – Certified carriers
Carrier
Country
Network
Verizon US
United States
LTE CAT–M1
Version 1.0
20
15.0
Electrical Characteristics
15.1
Absolute maximum ratings
Table 19 – Absolute maximum ratings
Parameter
Symbol
Min
Typ.
Max
Unit
Supply Input Voltage
VIN
3.5
–
5.5
Supply Output Current
I OUT
–
–
1.2
Supply Output Voltage
V3V3
–
3.3
–
Storage Temperature
TSTR
–
–
–
°C
Operating Temperature
TOPR
–40
–
85
°C
Moisture Sensitivity Level
MSL
–
–
–
Symbol
Min
Typ.
Max
Unit
Input low voltage
VIL
–0.3
–
0.25×V3V3
Input high voltage
VIH
0.75×V3V3
–
V3V3 +0.3
Max Input sink current
I SINK
–
12
mA
Input leakage current
I IL
–
–
50
nA
Input pin capacitance
C pin
–
–
pF
Output low voltage
VOL
0.1×V3V3
–
–
Output high voltage
VOH
0.8×V3V3
–
–
I SOURCE
–
12
mA
15.2
Input/Output characteristics
Table 20 – Input/Output characteristics
Parameter
Max Output source current
Version 1.0
21
16.0
Minimum Recommended Circuit
Figure 4 – Minimum required circuit
Version 1.0
22
17.0
Mechanical Specifications
Figure 5 – Mechanical drawing (top down view)
18.0
Recommended Land Patterns
Figure 6 – Recommended land pattern
Version 1.0
23
19.0
Design Considerations
19.1
Antenna Impedance
	Our OEM modules are intended to be used with a 50–ohm
antenna. They are also required to be connected to the
antenna by a 50–ohm grounded co–planar waveguide (as
shown in the reference design below with the yellow lines)
or a microstrip.
Figure 7 – 50–ohm impedance antenna connections
19.2
Deep sleep power
	When selecting a voltage regulator for your application
ensure that it has a low power mode, and that this is
enabled when the device enters deep sleep. We also
recommend cutting off power to all non–essential
components such as LEDs, logic gates, sensors etc.
when the device is in deep sleep. This can be done
using the circuit shown right:
	This circuit uses the 1.8V output of the module to cut off
supply to non–essential circuitry. The 1.8V output is only
active when the module is running, when it goes to deep
sleep it drops to 0V. The non–essential circuitry is then
powered from the “ACTIVE_POWER” bus
Figure 8 – Power switch for deep sleep mode
Version 1.0
24
19.3
Reference layout
	Below you will find the designs for our universal reference
board that fits all of our OEM modules. The design files can
be downloaded from our website.
Figure 9 – PCB layers for reference design – Units: mm
Version 1.0
25
20.0
Soldering Profile
Figure 10 – Reflow soldering temperature profile
Table 21– Soldering profile temperatures
Stage
Ramp to soak
Soak
Ramp to peak
Reflow
Cool down
Duration/Rate
Temperature
2°C/s
Ambient – 185°C
60s
185°C
1°C/s
240°C
45s
>225°C
2°C/s
The above profile is based on Alpha CVP–390 solder paste, which has been successfully tested with our devices.
Version 1.0
26
21.0
Ordering Information
Table 22 – Ordering information
Product EAN
Description
0700461341598
G01 – OEM version of GPy 1.0
0700461908845
Reel of 250 G01 OEM modules
0700461908968
Reel of 500 G01 OEM modules
22.0 Packaging
22.1
Reel
Figure 11 – Mechanical drawing of reel – Units: mm
22.2
22.3
Box
Figure 13 – Mechanical drawing of reel box – Units: mm
Tape
Figure 12 – Mechanical drawing of reel tape – Units: mm
Version 1.0
27
23.0
Certification
FCC
IC
2AJMTG01R
22263–G01R
Copies of the certificates can be found on our website.
Version 1.0
28
;7;u-Ѵoll†mb1-ঞomollbvvbomm|;u=;u;m1;
Statement
$_bv7;ˆb1;1olrѴb;v‰b|_-u|ƐƔo=|_; !†Ѵ;vĺr;u-ঞombv
v†0f;1||o|_;=oѴѴo‰bm]|‰o1om7bঞomvĹ
ŐƐő$_bv7;ˆb1;l-‹mo|1-†v;_-ul=†Ѵbm|;u=;u;m1;ĺ
(2) This device must accept any interference received, including
bm|;u=;u;m1;|_-|l-‹1-†v;†m7;vbu;7or;u-ঞomĺ
&$Ĺ_-m];voulo7bC1-ঞomvmo|;Šru;vvѴ‹-rruoˆ;70‹|_;
party responsible for compliance could void the user's authority to
or;u-|;|_;;t†brl;m|ĺ
NOTE: This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to Part 15 of
|_; !†Ѵ;vĺ$_;v;Ѵblb|v-u;7;vb]m;7|oruoˆb7;u;-vom-0Ѵ;
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This equipment generates uses and can radiate radio frequency
energy and, if not installed and used in accordance with
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encouraged to try to correct the interference by one or more of the
following measur
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;1;bˆbm]-m|;mm-ĺ
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RF Warning Statement
This equipment complies with FCC radiation exposure
limits set forth for an uncontrolled environment .
This equipment should be installed and operated with
minimum distance 20cm between the radiator& your body.
This device is intended only for OEM integrators
†m7;u|_;=oѴѴo‰bm]1om7bঞomvĹ
1) The antenna must be installed such that 20 cm is maintained
between the antenna and users, and
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1olrѴb-m1;u;t†bu;l;m|vu;t†bu;7‰b|_|_bvlo7†Ѵ;bmv|-ѴѴ;7ĺ$o
;mv†u;1olrѴb-m1;‰b|_-ѴѴmomŊ|u-mvlb‚;u=†m1ঞomv|_;_ov|
manufacturer is responsible for ensuring compliance with the
lo7†Ѵ;Ővőbmv|-ѴѴ;7-m7=†ѴѴ‹or;u-ঞom-Ѵĺ ou;Š-lrѴ;ķb=-_ov|‰-v
ru;ˆbo†vѴ‹-†|_oubŒ;7-v-m†mbm|;mঞom-Ѵu-7b-|ou†m7;u|_;
;1Ѵ-u-ঞomo=om=oulb|‹ruo1;7†u;‰b|_o†|-|u-mvlb‚;u1;uঞC;7
module and a module is added, the host manufacturer is responsible
=ou;mv†ubm]|_-||_;-[;u|_;lo7†Ѵ;bvbmv|-ѴѴ;7-m7or;u-ঞom-Ѵ
|_;_ov|1omঞm†;v|o0;1olrѴb-m|‰b|_|_;-u|ƐƔ†mbm|;mঞom-Ѵ
u-7b-|ouu;t†bu;l;m|vĺ
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$_;lo7†Ѵ;bvѴblb|;7|obmv|-ѴѴ-ঞombmlo0bѴ;ouCŠ;7-rrѴb1-ঞomĺ
We hereby acknowledge our responsibility to provide guidance to
the host manufacturer in the event that they require assistance for
;mv†ubm]1olrѴb-m1;‰b|_|_;-u|ƐƔ"†0r-u|u;t†bu;l;m|vĺ
!$$$ Ĺm|_;;ˆ;m||_-||_;v;1om7bঞomv1-mmo|
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‰b|_-mo|_;u|u-mvlb‚;uőķ|_;m|_; -†|_oubŒ-ঞombvmo
longer considered valid and the FCC ID cannot be used on the
Cm-Ѵruo7†1|ĺm|_;v;1bu1†lv|-m1;vķ|_; bm|;]u-|ou‰bѴѴ
0;u;vromvb0Ѵ;=ouu;;ˆ-Ѵ†-ঞm]|_;;m7ruo7†1|Őbm1Ѵ†7bm]|_;
|u-mvlb‚;uő-m7o0|-bmbm]-v;r-u-|; -†|_oubŒ-ঞomĺ
End Product Labeling
The outside of final products that contains this
module device must display a label referring to theenclosed
module. This exterior label can use wording such as: "Contains
Transmitter Module FCC ID:2AJMTG01R,&*5 or
“Contains FCC ID:2AJMTG01R,&*5 , Any similar
wording that expresses the same meaning may be used.
-m†-Ѵm=oul-ঞom|o|_; m7&v;u
$_; bm|;]u-|ou_-v|o0;-‰-u;mo||oruoˆb7;bm=oul-ঞom|o
|_;;m7†v;uu;]-u7bm]_o‰|obmv|-ѴѴouu;loˆ;|_bv! lo7†Ѵ;bm
|_;†v;uĽvl-m†-Ѵo=|_;;m7ruo7†1|‰_b1_bm|;]u-|;v|_bvlo7†Ѵ;ĺ
In the user manual of the end product, the end user has to be
informed that the equipment complies with FCC radio-frequency
;Šrov†u;]†b7;Ѵbm;vv;|=ou|_=ou-m†m1om|uoѴѴ;7;mˆbuoml;m|ĺ
The end user has to also be informed that any changes or
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|_;†v;uŝv-†|_oub|‹|oor;u-|;|_bv;t†brl;m|ĺ
The end user manual shall include all required regulatory
bm=oul-ঞomņ‰-umbm]-vv_o‰bm|_bvl-m†-Ѵĺ
ISED RSS Warning/ISED RF Exposure Statement
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UDGLRH[HPSWVGHOLFHQFH/ H[SORLWDWLRQHVWDXWRULVpHDX[GHX[FRQGLWLRQV
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,6('5)H[SRVXUHVWDWHPHQW
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The product only use ceramic antenna for Bluetooth and wifi which the antenna gain is 1.3 dBi integration in a host
6LQJOH0RGXODU$SSURYDO2XWSXWSRZHULVFRQGXFWHG7KLVGHYLFHLVWREHXVHGLQPRELOHRUIL[HG
DSSOLFDWLRQVRQO\$QWHQQDJDLQLQFOXGLQJFDEOHORVVPXVWQRWH[FHHG7 G%L@ FDD (Band 4),
10.51 @ FDD (Band 12) and 10.94 @ FDD (Band 13) IRUWKHSXUSRVHRIVDWLVI\LQJWKHUHTXLUHPHQWVRI&)5
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For IC , to meet RF exposure & ERP/ERIP, the maximum net gain of antennas allowed are 5.96 dBi @ FDD (Band 4),
7.14 @ FDD (Band 12) and 7.46 @ FDD (Band 13). The antenna(s) used for this transmitter must be installed to
provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter.

---

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