Quectel Wireless Solutions 201404UC15 UMTS/HSDPA Module User Manual

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Document Title	User Manual

UC15 Hardware Design
UMTS/HSDPA Module Series
Rev. UC15_Hardware_Design_V1.3
Date: 2014-04-15
www.quectel.com
UMTS/HSDPA Module Series
UC15 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Mail: info@quectel.com
Or our local office, for more information, please visit:
http://www.quectel.com/support/salesupport.aspx
For technical support, to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx
GENERAL NOTES
QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
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OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2014. All rights reserved.
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About the Document
History
Revision
Date
Author
Description
1.0
2013-11-26
Mountain ZHOU
Initial
1． Modified packaging information of UC15 in the
Chapter 7.3.
1.1
2014-01-15
Huik LI
2． Modified Figure 4 and Figure 11.
3． Modified the description of command AT+CFUN
in the Chapter 3.5.2.
1.2
2014-02-14
Huik LI
Modified the frequency bands of UC15.
1.3
2014-04-15
Huik LI
1.
2.
UC15_Hardware_Design
Modified current consumption in Chapter 5.4.
Added PCM feature in Chapter 3.12.
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UMTS/HSDPA Module Series
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 6
Figure Index ................................................................................................................................................. 7
Introduction .......................................................................................................................................... 9
1.1.
Safety Information...................................................................................................................... 9
Product Concept ................................................................................................................................ 11
2.1.
General Description ................................................................................................................. 11
2.2.
Directives and Standards......................................................................................................... 12
2.2.1. FCC Statement ............................................................................................................... 12
2.2.2. FCC Radiation Exposure Statement .............................................................................. 12
2.3.
Key Features ........................................................................................................................... 12
2.4.
Functional Diagram ................................................................................................................. 15
2.5.
Evaluation Board ..................................................................................................................... 15
Application Interface ......................................................................................................................... 17
3.1.
General Description ................................................................................................................. 17
3.2.
Pin Assignment ........................................................................................................................ 18
3.3.
Pin Description......................................................................................................................... 19
3.4.
Operating Modes ..................................................................................................................... 24
3.5.
Power Saving........................................................................................................................... 25
3.5.1. Sleep Mode .................................................................................................................... 25
3.5.1.1. UART Application ................................................................................................. 25
3.5.1.2. USB Application with Suspend Function ............................................................. 26
3.5.1.3. USB Application without Suspend Function ........................................................ 27
3.5.2. Minimum Functionality Mode ......................................................................................... 27
3.6.
Power Supply........................................................................................................................... 28
3.6.1. Power Supply Pins ......................................................................................................... 28
3.6.2. Decrease Voltage Drop .................................................................................................. 28
3.6.3. Reference Design for Power Supply.............................................................................. 29
3.6.4. Monitor the Power Supply .............................................................................................. 30
3.6.5. VDD_EXT ....................................................................................................................... 30
3.7.
Turn on and off Scenarios ....................................................................................................... 30
3.7.1. Turn on Module by PWRKEY Pin .................................................................................. 30
3.7.2. Turn off Module .............................................................................................................. 32
3.7.2.1. Turn off Module by PWRKEY Pin ........................................................................ 32
3.7.2.2. Turn off Module by AT Command ........................................................................ 33
3.7.2.3. Automatic Shutdown ............................................................................................ 33
3.8.
Reset the Module..................................................................................................................... 34
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3.9.
UART Interface ........................................................................................................................ 35
3.9.1. The Connection of UART ............................................................................................... 36
3.9.2. UART Application ........................................................................................................... 38
3.10. Behavior of the RI .................................................................................................................... 39
3.11. Analog Audio Interface ............................................................................................................ 40
3.11.1. Decrease TDD Noise and Other Noise.......................................................................... 41
3.11.2. Microphone Interfaces Application ................................................................................. 42
3.11.3. Receiver and Speaker Interface Application .................................................................. 43
3.11.4. Earphone Interface Application ...................................................................................... 45
3.12. PCM and I2C Interface ............................................................................................................ 46
3.13. USIM Card Interface ................................................................................................................ 48
3.13.1. USIM Card Application ................................................................................................... 48
3.13.2. Design Considerations for USIM Card Holder ............................................................... 50
3.14. USB Interface .......................................................................................................................... 53
3.15. ADC Function .......................................................................................................................... 54
3.16. Network Status Indication ........................................................................................................ 55
3.17. Operating Status Indication ..................................................................................................... 56
Antenna Interface ............................................................................................................................... 58
4.1.
Antenna Interface .................................................................................................................... 58
4.1.1. Pin Definition .................................................................................................................. 58
4.1.2. Operating Frequency ..................................................................................................... 58
4.1.3. Reference Design .......................................................................................................... 59
4.2.
Antenna Installation ................................................................................................................. 59
4.2.1. Antenna Requirement .................................................................................................... 59
4.2.2. Install the Antenna with RF Connector .......................................................................... 59
Electrical, Reliability and Radio Characteristics ............................................................................ 62
5.1.
Absolute Maximum Ratings ..................................................................................................... 62
5.2.
Power Supply Ratings ............................................................................................................. 63
5.3.
Operating Temperature............................................................................................................ 63
5.4.
Current Consumption .............................................................................................................. 64
5.5.
RF Output Power ..................................................................................................................... 66
5.6.
RF Receiving Sensitivity .......................................................................................................... 66
5.7.
Electrostatic Discharge ............................................................................................................ 67
Mechanical Dimensions .................................................................................................................... 68
6.1.
Mechanical Dimensions of the Module.................................................................................... 68
6.2.
Footprint of Recommendation ................................................................................................. 70
6.3.
Top View of the Module ........................................................................................................... 71
6.4.
Bottom View of the Module...................................................................................................... 71
Storage and Manufacturing .............................................................................................................. 72
7.1.
Storage..................................................................................................................................... 72
7.2.
Manufacturing and Welding ..................................................................................................... 72
7.3.
Packaging ................................................................................................................................ 73
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Appendix A Reference....................................................................................................................... 75
Appendix B GPRS Coding Scheme ................................................................................................. 78
10 Appendix C GPRS Multi-slot Class .................................................................................................. 79
11 Appendix D EDGE Modulation and Coding Scheme ..................................................................... 80
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Table Index
TABLE 1: FREQUENCY BANDS OF UC15 SERIES ......................................................................................... 11
TABLE 2: UC15 KEY FEATURES ..................................................................................................................... 13
TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 19
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 24
TABLE 6: VBAT AND GND PIN ......................................................................................................................... 28
TABLE 7: ELECTRICAL CHARACTERISTICS OF VDD_EXT ......................................................................... 30
TABLE 8: PWRKEY PIN DESCRIPTION .......................................................................................................... 30
TABLE 9: RESET_N PIN DESCRIPTION ......................................................................................................... 34
TABLE 10: PIN DEFINITION OF THE UART INTERFACE ............................................................................... 35
TABLE 11: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 36
TABLE 12: BEHAVIOR OF THE RI ................................................................................................................... 40
TABLE 13: PIN DEFINITION OF THE AUDIO INTERFACE ............................................................................. 40
TABLE 14: MICROPHONE CHARACTERISTICS............................................................................................. 45
TABLE 15: SPEAKER CHARACTERISTICS .................................................................................................... 45
TABLE 16: PIN DEFINITION OF PCM AND I2C INTERFACE.......................................................................... 47
TABLE 17: PIN DEFINITION OF THE USIM INTERFACES ............................................................................. 48
TABLE 18: PIN DESCRIPTION OF MOLEX USIM CARD HOLDER ................................................................ 51
TABLE 19: PIN DESCRIPTION OF AMPHENOL USIM CARD HOLDER ........................................................ 52
TABLE 20: USB PIN DESCRIPTION ................................................................................................................ 53
TABLE 21: PIN DEFINITION OF THE ADC ...................................................................................................... 55
TABLE 22: CHARACTERISTICS OF THE ADC ................................................................................................ 55
TABLE 23: PIN DEFINITION OF NETWORK INDICATOR ............................................................................... 55
TABLE 24: WORKING STATE OF THE NETWORK INDICATOR..................................................................... 55
TABLE 25: PIN DEFINITION OF STATUS ........................................................................................................ 56
TABLE 26: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 58
TABLE 27: MODULE OPERATING FREQUENCIES ........................................................................................ 58
TABLE 28: ANTENNA REQUIREMENTS.......................................................................................................... 59
TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 62
TABLE 30: THE MODULE POWER SUPPLY RATINGS .................................................................................. 63
TABLE 31: OPERATING TEMPERATURE........................................................................................................ 63
TABLE 32: MODULE CURRENT CONSUMPTION .......................................................................................... 64
TABLE 33: MODULE CONDUCTED RF OUTPUT POWER ............................................................................. 66
TABLE 34: MODULE CONDUCTED RECEIVING SENSITIVITY ..................................................................... 66
TABLE 35: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... 67
TABLE 36: RELATED DOCUMENTS ................................................................................................................ 75
TABLE 37: TERMS AND ABBREVIATIONS ...................................................................................................... 75
TABLE 38: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 78
TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 79
TABLE 40: EDGE MODULATION AND CODING SCHEME ............................................................................. 80
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18
FIGURE 3: UART SLEEP APPLICATION ......................................................................................................... 26
FIGURE 4: USB APPLICATION WITH SUSPEND FUNCTION........................................................................ 26
FIGURE 5: USB SLEEP APPLICATION WITHOUT SUSPEND FUNCTION.................................................... 27
FIGURE 6: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 29
FIGURE 7: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 29
FIGURE 8: TURN ON THE MODULE BY DRIVING CIRCUIT.......................................................................... 31
FIGURE 9: TURN ON THE MODULE BY KEYSTROKE .................................................................................. 31
FIGURE 10: TIMING OF TURNING ON MODULE ........................................................................................... 32
FIGURE 11: TIMING OF TURNING OFF MODULE .......................................................................................... 33
FIGURE 12: REFERENCE CIRCUIT OF RESET_N ........................................................................................ 34
FIGURE 13: TIMING OF RESETTING MODULE ............................................................................................. 35
FIGURE 14: CONNECTION OF FULL FUNCTIONAL UART PORT ................................................................ 36
FIGURE 15: CONNECTION OF THREE LINES UART PORT ......................................................................... 37
FIGURE 16: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .................................... 37
FIGURE 17: 3.3V LEVEL MATCH CIRCUIT ..................................................................................................... 38
FIGURE 18: 5V LEVEL MATCH CIRCUIT ........................................................................................................ 38
FIGURE 19: RS232 LEVEL SHIFT CIRCUIT .................................................................................................... 39
FIGURE 20: RI BEHAVIOR ............................................................................................................................... 40
FIGURE 21: MICROPHONE REFERENCE DESIGN FOR AIN1&AIN2 ........................................................... 42
FIGURE 22: REFERENCE DESIGN FOR AOUT1 ........................................................................................... 43
FIGURE 23: REFERENCE DESIGN WITH AN AMPLIFIER FOR AOUT1 ....................................................... 43
FIGURE 24: REFERENCE DESIGN FOR AOUT2 ........................................................................................... 44
FIGURE 25: REFERENCE DESIGN WITH AN AMPLIFIER FOR AOUT2 ....................................................... 44
FIGURE 26: REFERENCE DESIGN FOR AN EARPHONE ............................................................................. 45
FIGURE 27: PRIMARY MODE TIMING ............................................................................................................ 46
FIGURE 28: AUXILIARY MODE TIMING .......................................................................................................... 47
FIGURE 29: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 48
FIGURE 30: REFERENCE CIRCUIT OF THE 8-PIN USIM CARD .................................................................. 49
FIGURE 31: REFERENCE CIRCUIT OF THE 6-PIN USIM CARD .................................................................. 50
FIGURE 32: MOLEX 91228 USIM CARD HOLDER ......................................................................................... 51
FIGURE 33: AMPHENOL C707 10M006 512 2 USIM CARD HOLDER ........................................................... 52
FIGURE 34: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 53
FIGURE 35: TEST POINTS OF FIRMWARE UPGRADE ................................................................................. 54
FIGURE 36: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 56
FIGURE 37: REFERENCE CIRCUIT OF THE STATUS ................................................................................... 57
FIGURE 38: REFERENCE CIRCUIT OF ANTENNA INTERFACE ................................................................... 59
FIGURE 39: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 60
FIGURE 40: MECHANICALS OF UF.L-LP CONNECTORS (UNIT: MM) .......................................................... 60
FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 61
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FIGURE 42: UC15 TOP AND SIDE DIMENSIONS ........................................................................................... 68
FIGURE 43: UC15 BOTTOM DIMENSIONS (BOTTOM VIEW) ....................................................................... 69
FIGURE 44: BOTTOM PADS DIMENSIONS (BOTTOM VIEW) ....................................................................... 69
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 70
FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 71
FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 71
FIGURE 48: REFLOW SOLDERING PROFILE ................................................................................................ 73
FIGURE 49: CARRIER TAPE ............................................................................................................................ 74
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Introduction
This document defines the UC15 module and describes its hardware interface which are connected with
your application and the air interface.
This document can help you quickly understand module interface specifications, electrical and
mechanical details. Associated with application notes and user guide, you can use UC15 module to
design and set up mobile applications easily.
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating UC15 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel and to incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability
for customer failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) cause distraction
and can lead to an accident. You must comply with laws and regulations restricting
the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it
switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers a Airplane
Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care
facilities. These requests are desinged to prevent possible interference with
sentitive medical equipment.
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GSM cellular terminals or mobiles operate over radio frequency signal and cellular
network and cannot be guaranteed to connect in all conditions, for example no
mobile fee or an invalid USIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON ,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potencially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potencially exposive atmospheres including fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders.
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Product Concept
2.1. General Description
UC15 is an embedded UMTS/HSDPA module. Its UMTS-based modem provides data connectivity on
HSDPA, WCDMA, EDGE and GPRS networks. UC15 offers a maximum data rate of 3.6Mbps on
downlink and also supports GPRS/EDGE multi-slot class 12 as well. GPRS supports the coding schemes
CS-1, CS-2, CS-3 and CS-4. EDGE supports CS-1 to CS-4 and MCS-1 to MCS-9 coding schemes. UC15
includes two variants, UC15-A and UC15-E. And both of them are divided into Telematics version and
Data Only version. Telematics version supports voice and data, while Data Only version only supports
data. This is convenient for you to choose the dedicated type based on the wireless network configuration.
The following table shows the entire radio band configuration of UC15 series.
Table 1: Frequency Bands of UC15 Series
Module
UC15
GSM
850
EGSM
900

●
DCS
1800
●
PCS
1900
UMTS
850


UMTS
900
UMTS
1900
UMTS
2100

More details about GPRS/EDGE multi-slot configuration and coding schemes, please refer to Appendix B,
C and D.
With a tiny profile of 29.0mm × 29.0mm × 2.5mm, UC15 can meet almost all requirements for M2M
application such as automotive, metering, tracking system, security solutions, routers, wireless POS,
mobile computing devices, PDA phone and tablet PC, etc.
UC15 is an SMD type module, which can be embedded in your application through its 108-pin pads
including 68 LCC signal pads and 40 other pads.
UC15 is integrated with internet service protocols such as TCP/UDP and PPP. Extended AT commands
have been developed for you to use these internet service protocols easily.
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2.2. Directives and Standards
The UC15 module is designed to comply with the FCC statements. FCC ID: XMR201404UC15
If the FCC ID of the module cannot be seen by the user in the final installation, the host device must show
the statement: “Contains FCC ID: XMR201404UC15” in a visible and permanent location”
2.2.1. FCC Statement
1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions:
a) This device may not cause harmful interference.
b) This device must accept any interference received, including interference that may cause undesired
operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could avoid
the user’s authority to operate the equipment.
2.2.2. FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator and
your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this
module usage. This module should NOT be installed and operating simultaneously with other radio.
The manual of the host system, which uses UC15, must include RF exposure warning statement to
advice user should keep minimum 20cm from the radio antenna of UC15 module depending on the
Mobile status.
Note: If a portable device (such as PDA) uses UC15 module, the device needs to do permissive change
and SAR testing.
The following list of antenna is indicating the maximum permissible antenna gain.
Part Number
Frequency
Range (MHz)
Peak Gain
(XZ-V)
Average Gain
(XZ-V)
VSWR
Impedance
3R007A
GSM850:824-894
PCS1900:1850-1990
UMTS1900:1850~1990
UMTS850:824-894
1 dBi typ.
1 dBi typ.
3 max
50Ω
2.3. Key Features
The following table describes the detailed features of UC15 module.
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Table 2: UC15 Key Features
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Frequency Bands
UC15: GSM850/900/1800/1900, UMTS850/1900
Transmission Data
HSDPA R5: Max 3.6Mbps (DL)
WCDMA R99: Max 384kbps (DL)/Max 384kbps (UL)
EDGE: Max 236.8kbps (DL only)
GPRS: Max 85.6kbps (DL)/Max 85.6kbps (UL)
CSD: 64kbps
Transmitting Power
Class 4 (33dBm±2dB) for GSM850 and EGSM900
Class 1 (30dBm±2dB) for DCS1800 and PCS1900
Class E2 (27dBm±3dB) for GSM850 and EGSM900 8-PSK
Class E2 (26dBm+3/-4dB) for DCS1800 and PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for UMTS850/900/1900/2100
HSDPA and WCDMA
Features
HSDPA data rate is corresponded with 3GPP R5. 3.6Mbps on
downlink.
WCDMA data rate is corresponded with 3GPP R99/R4. 384kbps on
downlink and 384kbps on uplink.
Support both 16-QAM and QPSK modulation.
GSM/GPRS/EDGE
Data Features
GPRS:
Support GPRS multi-slot class 12 (10 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Maximum of four Rx time slots per frame
EDGE:
Support EDGE multi-slot class 12 (12 by default).
Support GMSK and 8-PSK for different MCS (Modulation and Coding
scheme).
Downlink coding schemes: CS 1-4 and MCS 1-9.
CSD:
CSD transmission rates: 64kbps non-transparent.
Support Unstructured Supplementary Services Data (USSD).
Internet Protocol Features
Support TCP/PPP/UDP protocols.
Support the protocols PAP (Password Authentication Protocol) and
CHAP (Challenge Handshake Authentication Protocol) usually used
for PPP connections.
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
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USIM Interface
Support USIM/SIM card: 1.8V, 3.0V
Audio Features
Support two analog input channels and two analog output channels.
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
Echo cancellation and noise suppression.
PCM Interface*
Used for audio function with external codec.
Support 16-bit linear data formats.
Support long frame sync and short frame sync.
Support master and slave mode, but must be the master in long frame
sync.
UART Interface
Seven lines on UART interface.
Support RTS and CTS hardware flow control.
Baud rate can reach up to 921600bps, 115200bps by default.
Used for AT command, data transmission and firmware upgrade.
USB Interface
Compliant with USB 2.0 specification (slave only), the data transfer
rate can reach up to 480 Mbps at high speed mode.
Used for AT command communication, data transmission, software
debug and firmware upgrade.
USB driver: support Windows XP, Windows Vista, Windows 7,
Windows 8, Windows CE5.0/6.0, Windows Mobile 6.1/6.5, Linux 2.6 or
later, Android 2.3 or later.
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands.
Network Indication
Indicate network activity status.
Antenna Interface
Connected via 50ohm antenna pad.
Physical Characteristics
Size: 29.0±0.15 × 29.0±0.15 × 2.5±0.2 mm
Weight: Approx. 4.3g
Temperature Range
Normal operation: -35°C ~ +75°C
Restricted operation: -40°C ~ -35°C and +75°C ~ +85°C 1)
Storage temperature: -45°C ~ +90°C
Firmware Upgrade
USB interface (by default) and UART interface.
RoHS
All hardware components are fully compliant with EU RoHS directive.
NOTES
1.
2.
“1)” means when the module works within this temperature range, RF performance might degrade.
For example, the frequency error or the phase error would increase.
“*” means this feature is under development.
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2.4. Functional Diagram
The following figure shows a block diagram of UC15 and illustrates the major functional parts.





Power management unit
Baseband
DDR+NAND flash
Radio frequency
Peripheral interface
Figure 1: Functional Diagram
2.5. Evaluation Board
In order to help you to develop applications with UC15, Quectel supplies an evaluation board (EVB),
RS-232 to USB cable, USB data cable, power adapter, earphone, antenna and other peripherals to
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control or test the module. For details, please refer to document [2].
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Application Interface
3.1. General Description
UC15 is equipped with a 68-pin 1.3mm pitch SMT pads plus 40-pin ground pads and reserved pads that
connect to cellular application platform. Sub-interfaces included in these pads are described in details in
the following chapters:








Power supply
UART interface
Audio interface
PCM interface
USIM interface
USB interface
ADC interface
Indicator interface
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3.2. Pin Assignment
The following figure shows the pin assignment of the UC15 module.
Figure 2: Pin Assignment (Top View)
NOTES
1.
2.
Keep all RESERVED pins and unused pins unconnected.
GND pads 81~108 should be connected to ground in the design, and RESERVED pads 69~80
should be unconnected.
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3.3. Pin Description
The pin definition of UC15 is shown in table 4.
Table 3: IO Parameters Definition
Type
Description
IO
Bidirectional input/output
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
Table 4: Pin Description
Power Supply
Pin Name
VBAT_BB
VBAT_RF
VDD_EXT
Pin No.
52,53
50,51
UC15_Hardware_Design
I/O
Description
DC Characteristics
Comment
PI
Power supply for
module baseband
part.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current
in
transmitting burst
which
typically
rises to 2.0A.
Vnorm=2.6V
IOmax=100mA
It is recommend to
add a 2.2~4.7uF
bypass capacitor
when using this
pin
for
power
supply.
PI
PO
Power supply for
module RF part.
Provide 2.6V for
external circuit.
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GND
42,44~49
65,67~68
,81~108
Ground.
Turn On/Off
Pin Name
Pin No.
PWRKEY
18
RESET_N
17
I/O
Description
DC Characteristics
Comment
Turn on/off the
module.
RPU≈200kΩ
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Pull-up to 1.8V
internally.
DI
Reset the module.
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Pull-up to 1.8V
internally.
I/O
Description
DC Characteristics
Comment
VOHmax=2.6V
VOHmin=2.15V
VOLmax=0.45V
2.6V power
domain.
DI
Indication
Pin Name
Pin No.
STATUS
54
DO
Indicate the module
operating status.
NETLIGHT
DO
Indicate the module
network activity
status.
VOHmax=2.6V
VOHmin=2.15V
VOLmax=0.45V
2.6V power
domain.
Pin No.
I/O
Description
DC Characteristics
Comment
USB Interface
Pin Name
USB_VBUS
64
PI
USB detection.
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
USB_DP
62
IO
USB differential data
bus.
Compliant with USB 2.0
standard specification.
Require differential
impedance of 90Ω.
USB_DM
63
IO
USB differential data
bus.
Compliant with USB 2.0
standard specification.
Require differential
impedance of 90Ω.
I/O
Description
DC Characteristics
Comment
USIM Interface
Pin Name
Pin No.
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USIM_GND
USIM_VDD
USIM_DATA
USIM_CLK
USIM_RST
USIM_
PRESENCE
Specified ground for
USIM card.
12
13
14
15
PO
IO
DO
DO
Power supply for
USIM card.
Data signal of
USIM card.
Clock signal of
USIM card.
Reset signal of
USIM card.
For 1.8V USIM:
Vmax=1.95V
Vmin=1.65V
For 3.0V USIM:
Vmax=3.0V
Vmin=2.7V
For 1.8V USIM:
VILmax = 0.6V
VIHmin =1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
Either 1.8V or 3.0V is
supported by the
module automatically.
Pull-up to USIM_VDD
with 10k resistor
internally.
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
11
DI
USIM card input
detection.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
Pin No.
I/O
Description
DC Characteristics
2.6V power domain.
Comment
ADC Interface
Pin Name
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ADC0
ADC1
41
40
AI
General purpose
analog to digital
converter.
Voltage range:
0V to 2.1V
AI
General purpose
analog to digital
converter.
Voltage range:
0V to 2.1V
UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RI
55
DO
Ring indicator.
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
DCD
56
DO
Data carrier
detection.
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
CTS
57
DO
Clear to send.
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
Request to send.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
2.6V power domain.
2.6V power domain.
Pull-up by default.
RTS
58
DI
DTR
59
DI
Data terminal ready.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
TXD
60
DO
Transmit data.
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
2.6V power domain.
Comment
61
DI
Receive data.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
Pin Name
Pin No.
I/O
Description
DC Characteristics
RF_ANT
43
IO
RF antenna pad.
50Ω impedance.
DC Characteristics
RXD
RF Interface
Analog Audio Interface
Pin Name
Pin No.
I/O
Description
MIC1P
23
AI
Audio positive input.
MIC1N
24
AI
Audio negative
input.
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MIC2P
25
AI
Auxiliary audio
positive input.
MIC2N
26
AI
Auxiliary audio
negative input.
SPK1P
22
AO
Audio positive
output.
SPK1N
21
AO
Audio negative
output.
SPK2P
20
AO
Auxiliary audio
positive output.
AGND
PCM
19
Analog ground.
Ground.
Separate ground for
external audio
circuits.
Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PCM_DOUT
34
DO
PCM data output.
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
PCM data input.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
2.6V power domain.
2.6V power domain.
PCM_DIN
35
DI
PCM_CLK
36
IO
PCM data bit clock.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
VOLmax=0.45V
VOHmin=2.15V
PCM_SYNC
37
DO
PCM data frame
sync signal
VOLmax=0.45V
VOHmin=2.15V
2.6V power domain.
Pin No.
I/O
Description
DC Characteristics
Comment
External pull-up
resistor is required.
2.6V only.
External pull-up
resistor is required.
I2C Interface
Pin Name
I2C_SDA
38
IO
I2C serial data.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
VOLmax=0.45V
VOHmin=2.15V
I2C_SCL
39
DO
I2C serial clock.
VOLmax=0.45V
VOHmin=2.15V
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2.6V only.
Other Pins
Pin Name
Pin No.
AP_READY
RESERVED
1,3~5,9~
10,16,27
~33,66,
69~80
I/O
Description
DC Characteristics
Comment
DI
Application process
or sleep state
detection.
VILmin=-0.3V
VILmax=0.91V
VIHmin=1.69V
VIHmax=2.9V
2.6V power domain.
Keep these pins
unconnected.
Reserved.
3.4. Operating Modes
The table below briefly summarizes the various operating modes.
Table 5: Overview of Operating Modes
Mode
Details
GSM Idle
Software is active. The module has registered to the GSM network
and is ready to send and receive data.
GSM Talk/Data
GSM connection is ongoing. In this mode, the power consumption
is decided by the configuration of power control level (PCL),
dynamic DTX control and the working RF band.
GPRS Idle
The module is ready for GPRS data transfer, but no data transfer
is going on. In this case, power consumption depends on network
setting and GPRS configuration.
GPRS Data
There is GPRS data in transfer (PPP, TCP or UDP). In this mode,
power consumption is decided by the PCL, working RF band and
GPRS multi-slot configuration.
EDGE Idle
The module is ready for data transfer in EDGE mode, but no data
is currently sent or received. In this case, power consumption
depends on network settings and EDGE configuration.
EDGE Data
There is EDGE data in transfer (PPP, TCP or UDP). In this mode,
power consumption is decided by the PCL, working RF band and
EDGE multi-slot configuration.
Normal Operation
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UMTS Idle
Software is active. The module has registered to the UMTS
network and the module is ready to send and receive data.
UMTS
Talk/Data
UMTS connection is ongoing. In this mode, the power
consumption is decided by network setting (e.g. TPC pattern) and
data transfer rate.
HSDPA Idle
Software is active. The module has registered to the HSDPA
network and the module is ready to send and receive data.
HSDPA Data
HSDPA data transfer is ongoing. In this mode, the power
consumption is decided by network setting (e.g. TPC pattern) and
data transfer rate.
Minimum
Functionality
Mode
AT+CFUN=0 command can set the module entering into a minimum functionality
mode without removing the power supply. In this case, both RF function and USIM
card will be invalid.
Sleep Mode
In this mode, the current consumption of the module will be reduced to the minimal
level. During this mode, the module can still receive paging message, SMS, voice
call and TCP/UDP data from the network normally. Any URC can be output even the
module in Sleep Mode.
Power Down
Mode
In this mode, the power management unit shuts down the power supply for the
baseband part and RF part. Software is not active. The serial interface is not
accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains
applied.
3.5. Power Saving
3.5.1.
Sleep Mode
UC15 is able to reduce its current consumption to a minimum value during the sleep mode. The following
section describes power saving procedure of UC15.
3.5.1.1. UART Application
If application processor communicates with module via UART interface, the following preconditions can
let the module enter into the sleep mode.


Execute AT command AT+QSCLK=1 to enable the sleep mode.
Drive DTR to high level.
The following figure shows the connection between the module and application processor.
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Figure 3: UART Sleep Application
The RI of module is used to wake up the processor, and AP_READY will detect the sleep state of
processor (can be configured to high level or low level detection). You should pay attention to the level
match shown in dotted line between module and processor.
Drive DTR to low level will wake up the module.
3.5.1.2. USB Application with Suspend Function
If application processor communicates with module via USB interface, and processor supports USB
suspend function, following preconditions can let the module enter into the sleep mode.


Execute AT command AT+QSCLK=1 to enable the sleep mode.
The processor’s USB bus which is connected with the module USB interface enters into suspended
state.
The following figure shows the connection between the module and processor.
Figure 4: USB Application with Suspend Function
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When the processor’s USB bus returns to resume state, the module will be woken up.
3.5.1.3. USB Application without Suspend Function
If application processor communicates with module via USB interface, and processor does not support
USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module
enter into sleep mode.


Execute AT command AT+QSCLK=1 to enable the sleep mode.
Disconnect USB_VBUS.
The following figure shows the connection between the module and application processor.
Figure 5: USB Sleep Application without Suspend Function
Supply power to USB_VBUS will wake up the module.
In sleep mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the
network normally, but the UART port is not accessible.
3.5.2.
Minimum Functionality Mode
Minimum functionality mode reduces the functionality of the module to minimum level, thus minimizes the
current consumption at the same time. This mode can be set as below:
Command AT+CFUN provides the choice of the functionality levels: =0, 1, 4.


AT+CFUN=0: Minimum functionality, RF part and USIM card will be closed.
AT+CFUN=1: Full functionality (by default).
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
AT+CFUN=4: Disable RF function (airplane mode). All AT commands related to RF function are not
accessible.
For detailed information about command AT+CFUN, please refer to document [1].
3.6. Power Supply
3.6.1.
Power Supply Pins
UC15 provides four VBAT pins to connect with the external power supply. There are two separate voltage
domains for VBAT.


VBAT_RF with two pads for module RF.
VBAT_BB with two pads for module baseband.
The following table shows the VBAT pins and ground pins.
Table 6: VBAT and GND Pin
Pin Name
Pin No.
Description
Min.
Typ.
Max.
Unit
VBAT_RF
50,51
Power supply for module RF.
3.3
3.8
4.3
VBAT_BB
52,53
Power supply for module
baseband.
3.3
3.8
4.3
GND
42,44~49,65,
67~68,81~108
Ground.
3.6.2.
Decrease Voltage Drop
The power supply range of the module is 3.3~4.3V. Because of the voltage drop during the transmitting
time, a bypass capacitor of about 100µF with low ESR should be used. Multi-layer ceramic chip (MLCC)
capacitor can provide the best combination of low ESR. Three ceramic capacitors (100nF, 33pF, 10pF)
are recommended to be applied to the VBAT pins. The capacitors should be placed close to the VBAT
pins of UC15. The following figure shows star structure of the power supply.
The main power supply from an external application should be a single voltage source and has to be
expanded to two sub paths with star structure. In addition, in order to get a stable power source, it is
suggested to use a zener diode of which reverse zener voltage is 5.1V and dissipation power is more than
0.5W.
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Figure 6: Star Structure of the Power Supply
Please pay special attention to the power supply design for applications. Make sure the input voltage will
never drop below 3.3V. If the voltage drops below 3.3V, the module will turn off automatically. The PCB
traces from the VBAT pins to the power source must be wide enough to ensure that there is not too much
voltage drop occurs in the transmitting procedure. The width of VBAT_BB trace should be no less than
1mm, and the width of VBAT_RF trace should be no less than 2mm, and the principle of the VBAT trace is
the longer, the wider.
3.6.3.
Reference Design for Power Supply
The power design for the module is very important, since the performance of power supply for the module
largely depends on the power source. The power supply is capable of providing the sufficient current up to
2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO
to supply power for module. If there is a big voltage difference between the input source and the desired
output (VBAT), a buck converter is preferred to be used as a power supply.
The following figure shows a reference design for +5V input power source. The designed output for the
power supply is 3.88V and the maximum load current is 3A.
Figure 7: Reference Circuit of Power Supply
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3.6.4.
Monitor the Power Supply
You can use the AT+CBC command to monitor the VBAT_BB voltage value. For more details, please
refer to document [1].
3.6.5.
VDD_EXT
UC15 has a LDO power output, named VDD_EXT. The VDD_EXT is available and output voltage is 2.6V
by default, rated at 100mA.
The following table shows electrical characteristics of VDD_EXT.
Table 7: Electrical Characteristics of VDD_EXT
Symbol
Description
Min.
Typ.
Max.
Unit
VDD_EXT
Output voltage
2.5
2.6
2.7
IOUT
Output current
100
mA
3.7. Turn on and off Scenarios
3.7.1.
Turn on Module by PWRKEY Pin
The following table shows the pin definition of PWRKEY.
Table 8: PWRKEY Pin Description
Pin Name
PWRKEY
Pin No.
18
Description
DC Characteristics
Comment
Turn on/off the module.
VIHmax=2.1V
VIHmin=1.6V
VILmax=0.5V
Pull-up to 1.8V internally
with 200kΩ resistor.
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When UC15 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to
low level at least 0.1s. It is recommended to use an open collector driver to control the PWRKEY. You can
monitor the level of the STATUS pin to judge whether the module is turned on or not. After STATUS pin
outputting a high level, module is turned on. A simple reference circuit is illustrated in the following figure.
Figure 8: Turn on the Module by Driving Circuit
The other way to control the PWRKEY is to use a button directly. A TVS component is indispensable to be
placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate
from finger. A reference circuit is shown in the following figure.
Figure 9: Turn on the Module by Keystroke
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The turn on scenarios is illustrated as the following figure.
Figure 10: Timing of Turning on Module
NOTE
① Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is
recommended to be more than 0.03s.
3.7.2.
Turn off Module
The following procedures can be used to turn off the module:



Normal power down procedure: Turn off the module by PWRKEY pin.
Normal power down procedure: Turn off the module by command AT+QPOWD.
Automatic shutdown: Turn off the module automatically if under-voltage or over-voltage is detected.
3.7.2.1. Turn off Module by PWRKEY Pin
Drive the PWRKEY to low level at least 0.6s, the module will execute power-down procedure after
PWRKEY is released. The power-down scenario is illustrated as the following figure.
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Figure 11: Timing of Turning off Module
During power-down procedure, module will send out URC “NORMAL POWER DOWN” via URC port first,
then log off network and save important data. After logging off, module sends out “POWERED DOWN”
and shuts down the internal power supply. The power on VBAT pins are not allowed to be switched off
before the URC “POWERED DOWN” is output to avoid data loss. If module is not logged off within 60s,
module will force to shut down internal power supply.
After that moment, the module enters into power down mode, no other AT commands can be executed.
The power down mode can also be indicated by the STATUS pin.
3.7.2.2. Turn off Module by AT Command
It is also a safe way to use AT command AT+QPOWD to turn off the module, which is similar to the way of
turning off the module via PWRKEY Pin. Please refer to document [1] for details about the AT command
of AT+QPOWD.
3.7.2.3. Automatic Shutdown
The module will constantly monitor the voltage applied on the VBAT_BB, if the voltage ≤ 3.5V, the
following URC will be presented:
+QIND: “vbatt”,-1
If the voltage ≥ 4.21V, the following URC will be presented:
+QIND: “vbatt”,1
The uncritical voltage is 3.3V to 4.3V, If the voltage > 4.35V or < 3.2V, the module would automatically
shut down itself.
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If the voltage < 3.2V, the following URC will be presented:
+QIND: “vbatt”,-2
If the voltage > 4.35V, the following URC will be presented:
+QIND: “vbatt”,2
NOTE
The value of voltage threshold can be revised by AT command AT+QCFG=“vbatt”, refer to document
[1] for details.
3.8. Reset the Module
The RESET_N can be used to reset the module.
Table 9: RESET_N Pin Description
Pin Name
RESET_N
Pin No.
17
Description
DC Characteristics
Comment
Reset the module.
VIHmax=2.1V
VIHmin=1.6V
VILmax=0.5V
Pull-up to 1.8V internally.
You can reset the module by driving the RESET_N to low level voltage for 0.05~0.2s and then releasing.
A reference circuit is shown in the following figure.
Figure 12: Reference Circuit of RESET_N
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The reset scenario is illustrated as the following figure.
Figure 13: Timing of Resetting Module
NOTE
The low-level pulse through the RESET_N pin cannot last for more than 0.2s, otherwise the module will
be powered off.
3.9. UART Interface
The module provides one 7-wire UART interface, and is designed as the DCE (Data Communication
Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. UART interface
supports 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800 and
921600bps baud rate. The default is 115200bps, while autobauding is not supported. This interface can
be used for data transmission, AT communication and firmware upgrade.
Table 10: Pin Definition of the UART Interface
Pin Name
Pin No.
I/O
Description
Comment
RI
55
DO
Ring indicator.
2.6V power domain.
DCD
56
DO
Data carrier detection.
2.6V power domain.
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CTS
57
DO
Clear to send.
2.6V power domain.
RTS
58
DI
Request to send.
2.6V power domain.
DTR
59
DI
Data terminal ready.
2.6V power domain.
TXD
60
DO
Transmit data.
2.6V power domain.
RXD
61
DI
Receive data.
2.6V power domain.
The logic levels are described in the following table.
Table 11: Logic Levels of Digital I/O
Parameter
Min.
Max.
Unit
VIL
-0.3
0.91
VIH
1.69
2.9
VOL
0.45
VOH
2.15
2.6
3.9.1.
The Connection of UART
The connection between module and host via UART port is very flexible. Three connection ways are
illustrated as below.
UART port connection is shown as below when it is applied in modulation-demodulation.
Module
PC
TXD
RXD
RTS
CTS
DTR
DCD
RI
GND
TXD
RXD
RTS
CTS
DTR
DCD
RING
GND
Figure 14: Connection of Full Functional UART Port
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Three lines connection is shown as below.
Figure 15: Connection of Three Lines UART Port
UART port with hardware flow control is shown as below. This connection will enhance the reliability of the
mass data communication.
Figure 16: Connection of UART Port with Hardware Flow Control
NOTE
The module disables the hardware flow control by default. AT command AT+IFC=2,2 is used to enable
hardware flow control. AT command AT+IFC=0,0 is used to disable the hardware flow control. For more
details, please refer to document [1].
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3.9.2.
UART Application
The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is
3V, the divider resistor should be changed from 3.6K to 6.8K.
Figure 17: 3.3V Level Match Circuit
The reference design of 5V level match is shown as below. The construction of dotted line can refer to the
construction of solid line. Please pay attention to direction of connection. Input dotted line of module
should refer to input solid line of the module. Output dotted line of module should refer to output solid line
of the module.
Figure 18: 5V Level Match Circuit
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The following figure is an example of connection between module and PC. A RS232 level shifter IC or
circuit must be inserted between module and PC, since UART interface do not support the RS232 level,
while support the CMOS level only.
Figure 19: RS232 Level Shift Circuit
NOTES
1.
2.
Rising edge on DTR will let the module exit from the data mode by default. It can be disabled by
command. Refer to document [1] about AT&D and AT&V for details.
DCD is used as data mode indication. Please refer to document [1] about command AT&C and
AT&V for details.
3.10. Behavior of the RI
You can use command AT+QCFG=“risignaltype”, “physical” to configure RI behavior:
No matter which port URC is presented on, URC will trigger the behavior on RI pin.
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NOTE
URC can be output from UART port, USB AT port and USB modem port by command AT+QURCCFG.
The default port is USB AT port.
In additional, RI behavior can be configured flexible. The default behavior of the RI is shown as below.
Table 12: Behavior of the RI
State
Response
Idle
RI keeps in high level.
URC
RI outputs 120ms low pulse when new URC is reported.
Figure 20: RI Behavior
The RI behavior can be changed by command AT+QCFG=“urc/ri/ring”, refer to document [1] for
details.
3.11. Analog Audio Interface
The module provides two analog input channels and two analog output channels.
Table 13: Pin Definition of the Audio Interface
Interface
Pin Name
Pin No.
I/O
Description
Comment
AIN1/
MIC1P
23
AI
Audio positive input.
If it is unused, keep open.
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AOUT1
AIN2/
AOUT2
MIC1N
24
AI
Audio negative input.
If it is unused, keep open.
SPK1P
22
AO
Audio positive output.
If it is unused, keep open.
SPK1N
21
AO
Audio negative output.
If it is unused, keep open.
MIC2P
25
AI
Auxiliary audio positive
input.
If it is unused, keep open.
MIC2N
26
AI
Auxiliary audio negative
input.
If it is unused, keep open.
SPK2P
20
AO
Auxiliary audio positive
output.
If it is unused, keep open.
AGND
19
Analog ground.
Suggested to be used for
audio circuit.

AIN1 and AIN2 may be used for both microphone and line inputs. An electret microphone is usually
recommended. AIN1 and AIN2 are both differential input channels.

AOUT1 and AOUT2 may be used for both receiver and speaker outputs. AOUT1 channel is typically
used for a receiver, while AOUT2 channel is typically used for headset or speaker. AOUT1 channel is
a differential channel and AOUT2 is a single-ended channel. SPK2P and AGND can establish a
pseudo differential mode. Both AOUT1 and AOUT2 support voice and ringtone output, and so on.

These two audio channels can be swapped by AT+QAUDPATH command. For more details, please
refer to document [1].
Use command AT+QAUDPATH to select audio channel:
0: AIN1/AOUT1 (normal audio channel), the default value is 0.
1: AIN2/AOUT2 (auxiliary audio channel).
2: PCM channel.
For each channel, you can use AT+QMIC to adjust the input gain level of microphone. You can also use
AT+CLVL to adjust the output gain level of receiver and speaker. AT+QSIDET is to set the side-tone gain
level. For more details, please refer to document [1].
3.11.1.
Decrease TDD Noise and Other Noise
The 33pF capacitor is applied for filtering out 900MHz RF interference when the module is transmitting at
GSM900/EGSM900MHz. TDD noise could be heard without this capacitor. Moreover, the 10pF capacitor
here is for filtering out 1800/1900MHz RF interference. However, the self-resonant frequency point of a
capacitor largely depends on the material and production technique. Therefore, customer should depend
on its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz,
EGSM900MHz, DCS1800MHz and PCS1900MHz separately.
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The severity degree of the RF interference in the voice channel during GSM transmitting period largely
depends on the application design. In some cases, GSM850/EGSM900 TDD noise is more severe; while
in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer can have a choice
based on test results. Sometimes, even no RF filtering capacitor is required.
The capacitor which is used for filtering out RF noise should be close to audio interface. Audio alignment
should be as short as possible.
In order to decrease radio or other signal interference, the position of RF antenna should be kept away
from audio interface and audio alignment. Power alignment and audio alignment should not be parallel,
and power alignment should be far away from audio alignment.
The differential audio traces should be placed according to the differential signal layout rules.
3.11.2.
Microphone Interfaces Application
AIN1/AIN2 channels come with internal bias supply for external electret microphone. A reference circuit is
shown in the following figure.
Figure 21: Microphone Reference Design for AIN1&AIN2
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3.11.3.
Receiver and Speaker Interface Application
Figure 22: Reference Design for AOUT1
Close to speaker
GND
Differential layout
Module
10pF
0603
33pF
0603
10pF
0603
33pF
0603
10pF
0603
33pF
0603
Amplifier circuit
SPK1P
SPK1N
GND
Figure 23: Reference Design with an Amplifier for AOUT1
Texas Instruments TPA6205A1 is recommended for a suitable differential audio amplifier. There are
plenty of excellent audio amplifiers in the market.
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Figure 24: Reference Design for AOUT2
Close to speaker
GND
Differential layout
Module
C1
10pF
0603
33pF
0603
10pF
0603
33pF
0603
Amplifier circuit
SPK2P
AGND
C2
GND
Figure 25: Reference Design with an Amplifier for AOUT2
NOTE
The value of C1 and C2 depends on the input impedance of audio amplifier.
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3.11.4.
Earphone Interface Application
Figure 26: Reference Design for an Earphone
Table 14: Microphone Characteristics
Parameter
Min.
Typ.
Max.
Unit
Working Voltage
1.65
1.8
1.95
Working Current
20
1000
uA
Table 15: Speaker Characteristics
Parameter
Normal Output
(AOUT1)
Differential
Auxiliary Output
(AOUT2)
Single ended
Min.
Typ.
Max.
Unit
Supply voltage
2.0
2.1
2.2
Load resistance
25.6
32
Supply voltage
2.0
2.1
Load resistance
12
16
ohm
50
mW
Output Power of AOUT1 and AOUT2
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3.12. PCM and I2C Interface
UC15 provides one Pulse Code Modulation (PCM) digital interface for audio design with 16-bit linear data
formats, which supports the following modes:


Primary mode (short sync, works as both master and slave)
Auxiliary mode (long sync, works as master only)
UC15 supports an 8 kHz short sync mode at 2048 kHz, the data is sampled on the falling edge of the
PCM_CLK and transmitted on the rising edge, and the PCM_SYNC falling edge represents the MSB.
UC15 also supports an 8 kHz long sync mode at 128 kHz, the data is sampled on the falling edge of the
PCM_CLK and transmitted on the rising edge, and the PCM_SYNC rising edge represents the MSB.
The following figures show the different timing relationships of these modes.
Figure 27: Primary Mode Timing
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Figure 28: Auxiliary Mode Timing
The following table shows the pin definition of PCM and I2C interface which can be applied on audio
codec design.
Table 16: Pin Definition of PCM and I2C Interface
Pin Name
Pin No.
I/O
Description
Comment
PCM_DOUT
34
DO
PCM data output.
2.6V power domain
PCM_DIN
35
DI
PCM data input.
2.6V power domain
PCM_CLK
36
IO
PCM data bit clock.
2.6V power domain
PCM_SYNC
37
DO
PCM data frame
sync signal
2.6V power domain
I2C_SDA
38
IO
I2C serial data.
External pull-up resistor is
required. 2.6V only.
I2C_SCL
39
DO
I2C serial clock.
External pull-up resistor is
required. 2.6V only.
UC15’s firmware has integrated the configuration on NAU8814 application with I2C interface. The default
configuration is master mode which uses short sync data format with 2048 kHz clock. Please refer to
document [1] for details about the command AT+QDAI.
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The following figure shows the reference design of PCM interface with external codec IC.
Figure 29: Reference Circuit of PCM Application with Audio Codec
NOTES
1.
2.
3.
It is recommended to reserve RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for
PCM_CLK.
I2C bus is the standard interface, which is used with NAU8814 application by default.
The PCM feature is under development.
3.13. USIM Card Interface
3.13.1.
USIM Card Application
The USIM card interface circuitry meets ETSI and IMT-2000 USIM interface requirements. Both 1.8V and
3.0V USIM cards are supported.
Table 17: Pin Definition of the USIM Interfaces
Pin Name
Pin No.
I/O
Description
Comment
USIM_VDD
12
PO
Power supply for USIM card.
Either 1.8V or 3.0V is supported
by the module automatically.
USIM_DATA
13
IO
Data signal of USIM card.
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USIM_CLK
14
DO
Clock signal of USIM card.
USIM_RST
15
DO
Reset signal of USIM card.
USIM_
PRESENCE
11
DI
USIM card detection input.
USIM_GND
2.6V power domain
Specified ground for USIM card.
The following figure shows the reference design of the 8-pin USIM card.
VDD_EXT
USIM_VDD
51K
15K
100nF
USIM_GND
Module
USIM_VDD
USIM_RST
22R
USIM_CLK
USIM_PRESENCE
22R
USIM_DATA
22R
33pF
USIM holder
VCC
RST
CLK
GND
VPP
IO
GND
33pF 33pF
ESDA6V8AV6
GND
GND
Figure 30: Reference Circuit of the 8-Pin USIM Card
NOTE
Some AT commands are invalid when USIM card is not applied.
UC15 supports USIM card hot-plugging via the USIM_PRESENCE pin. For details, refer to document [1]
about the command AT+QSIMDET. If you do not need the USIM card detection function, keep
USIM_PRESENCE unconnected. The reference circuit for using a 6-pin USIM card holder is illustrated as
the following figure.
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Figure 31: Reference Circuit of the 6-Pin USIM Card
In order to enhance the reliability and availability of the USIM card in customer’s application, please follow
the following criterion in the USIM circuit design:






Keep layout of USIM card as close as possible to the module. Assure the possibility of the length of
the trace is less than 200mm.
Keep USIM card signal away from RF and VBAT alignment.
Assure the ground between module and USIM cassette short and wide. Keep the width of ground
and USIM_VDD no less than 0.5mm to maintain the same electric potential. The decouple capacitor
of USIM_VDD should be less than 1uF and must be near to USIM cassette.
To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away with each other and
shield them with surrounded ground.
In order to offer good ESD protection, it is recommended to add TVS such as WILL
(http://www.willsemi.com) ESDA6V8AV6. The capacitance of ESD component is less than 50pF.
The 22Ω resistors should be added in series between the module and the USIM card so as to
suppress the EMI spurious transmission and enhance the ESD protection. The 33pF capacitors are
used for filtering interference of EGSM900. Please note that the USIM peripheral circuit should be
close to the USIM card holder.
The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion is applied.
3.13.2.
Design Considerations for USIM Card Holder
For 8-pin USIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for
more information.
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Figure 32: Molex 91228 USIM Card Holder
Table 18: Pin Description of Molex USIM Card Holder
Name
Pin
Function
VDD
C1
USIM card power supply
RST
C2
USIM card reset
CLK
C3
USIM card clock
C4
Not defined
GND
C5
Ground
VPP
C6
Not connected
DATA I/O
C7
USIM card data
C8
Pull-down GND with external circuit. When the tray is present, C4
is connected to C8.
For 6-pin USIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit
http://www.amphenol.com for more information.
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Figure 33: Amphenol C707 10M006 512 2 USIM Card Holder
Table 19: Pin Description of Amphenol USIM Card Holder
Name
Pin
Function
VDD
C1
USIM card power supply
RST
C2
USIM card reset
CLK
C3
USIM card clock
GND
C5
Ground
VPP
C6
Not connected
DATA I/O
C7
USIM card data
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3.14. USB Interface
UC15 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0
specification and supports high speed (480Mbps), full speed (12Mbps) and low speed (1.5Mbps) mode.
The USB interface is primarily used for AT command, data transmission, software debug and firmware
upgrade. The following table shows the pin definition of USB interface.
Table 20: USB Pin Description
Pin Name
Pin No.
I/O
Description
Comment
USB_DP
62
IO
USB differential data bus (positive).
Require differential
impedance of 90Ω.
USB_DM
63
IO
USB differential data bus (negative).
Require differential
impedance of 90Ω.
USB_VBUS
64
PI
USB detection.
3.0~5.25V.
Typical 5.0V.
More details about the USB 2.0 specifications, please visit http://www.usb.org/home.
The following figure shows the reference circuit of USB interface.
Figure 34: Reference Circuit of USB Application
In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply
with the following principles.

It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90ohm.
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


Keep the ESD components as closer to the USB connector as possible.
Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically,
the capacitance value should be less than 2pF such as ESD9L5.0ST5G.
Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding not only upper and
lower layer but also right and left side.
NOTE
UC15 module can only be used as a slave device.
The USB interface is recommended to be reserved for firmware upgrade in your design. The following
figure shows the recommended test points.
Figure 35: Test Points of Firmware Upgrade
3.15. ADC Function
The module provides two analog-to-digital converters (ADC) to digitize the analog signal to 12-bit digital
data. Using AT command AT+QADC=0 can read the voltage value on ADC0 pin. Using AT command
AT+QADC=1 can read the voltage value on ADC1 pin. For more details of these AT commands, please
refer to document [1].
In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.
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Table 21: Pin Definition of the ADC
Pin Name
Pin NO.
Description
ADC0
41
General purpose analog to digital converter.
ADC1
40
General purpose analog to digital converter.
The following table describes the characteristics of the ADC function.
Table 22: Characteristics of the ADC
Parameter
Min.
ADC0 Voltage Range
Typ.
Sample Rate
Max.
Unit
2.1
2.4
ADC1 Voltage Range
MHz
2.1
ADC Resolution
12
bits
3.16. Network Status Indication
The module provides a pin named NETLIGHT to indicate the module network status which can be used to
drive a LED. The following tables describe pin definition and logic level changes in different network
status.
Table 23: Pin Definition of Network Indicator
Pin Name
Pin No.
I/O
Description
Comment
NETLIGHT
DO
Indicate the module network activity
status.
2.6V power domain.
Table 24: Working State of the Network Indicator
Pin Name
Status
Description
200ms High/1800ms Low.
Network searching.
1800ms High/200ms Low.
Idle.
NETLIGHT
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125ms High/125ms Low.
Data transfer is ongoing.
Always High.
Voice calling.
Always Low.
Sleep.
A reference circuit is shown in the following figure.
Figure 36: Reference Circuit of the Network Indicator
3.17. Operating Status Indication
The STATUS is used to indicate the module operation status. When the module is turned on normally, the
STATUS will output high level.
Table 25: Pin Definition of STATUS
Pin Name
STATUS
Pin No.
54
I/O
Description
Comment
DO
Indicate the module operation status.
2.6V power domain.
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A reference circuit is shown in the following figure.
Figure 37: Reference Circuit of the STATUS
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Antenna Interface
4.1. Antenna Interface
4.1.1.
Pin Definition
Pin definition of RF antenna is shown as below.
Table 26: Pin Definition of the RF Antenna
Pin Name
Pin No.
I/O
Description
Comment
RF_ANT
43
IO
RF antenna pad
50Ω impedance
4.1.2.
Operating Frequency
Table 27: Module Operating Frequencies
Band
Receive
Transmit
Unit
GSM850
869 ~ 894
824 ~ 849
MHz
EGSM900
925 ~ 960
880 ~ 915
MHz
DCS1800
1805 ~ 1880
1710 ~ 1785
MHz
PCS1900
1930 ~ 1990
1850 ~ 1910
MHz
UMTS2100
2110 ~ 2170
1920 ~ 1980
MHz
UMTS1900
1930 ~ 1990
1850 ~ 1910
MHz
UMTS900
925 ~ 960
880 ~ 915
MHz
UMTS850
869 ~ 894
824 ~ 849
MHz
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4.1.3.
Reference Design
The RF interface has an impedance of 50Ω.The reference design of RF antenna is shown as below. It
should reserve a π-type matching circuit for better RF performance. The capacitors are not mounted by
default.
Figure 38: Reference Circuit of Antenna Interface
4.2. Antenna Installation
4.2.1.
Antenna Requirement
The following table shows the requirements on GSM/UMTS antenna.
Table 28: Antenna Requirements
Type
Requirements
GSM850/EGSM900
UMTS850/900
Cable insertion loss < 0.5dB.
DCS1800/PCS1900
UMTS1900/2100
Cable insertion loss < 0.9dB.
4.2.2.
Install the Antenna with RF Connector
The following is the antenna installation with RF connector provided by HIROSE. The recommended RF
connector is UF.L-R-SMT.
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Figure 39: Dimensions of the UF.L-R-SMT Connector (Unit: mm)
You can use U.FL-LP serial connector listed in the following figure to match the UF.L-R-SMT.
Figure 40: Mechanicals of UF.L-LP Connectors (Unit: mm)
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The following figure describes the space factor of mated connector:
Figure 41: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com.
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Electrical, Reliability
Characteristics
and
Radio
5.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in
the following table:
Table 29: Absolute Maximum Ratings
Parameter
Min.
Max.
Unit
VBAT_RF/VBAT_BB
-0.5
4.7
USB_VBUS
-0.5
6.0
Peak Current of VBAT_BB
0.8
Peak Current of VBAT_RF
1.8
Voltage at Digital Pins (1.8V digital I/O)
-0.3
2.1
Voltage at Digital Pins (2.6V digital I/O)
-0.3
2.9
Voltage at ADC0
2.2
Voltage at ADC1
2.2
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5.2. Power Supply Ratings
Table 30: The Module Power Supply Ratings
Parameter
Description
Conditions
Min.
Typ.
Max.
Unit
VBAT_BB and
VBAT_RF
Voltage must stay within the
min/max values, including voltage
drop, ripple, and spikes.
3.3
3.8
4.3
Voltage drop
during
transmitting
burst
Maximum power control level on
GSM850 and EGSM900.
400
mV
IVBAT
Peak supply
current (during
transmission
slot)
Maximum power control level on
GSM850 and EGSM900.
1.8
2.0
USB_VBUS
USB detection
5.0
5.25
VBAT
3.0
5.3. Operating Temperature
The operating temperature is listed in the following table.
Table 31: Operating Temperature
Parameter
Min.
Typ.
Max.
Unit
Normal Temperature
-35
+25
+75
ºC
Restricted Operation1)
-40 ~ -35
+75 ~ +85
ºC
Storage Temperature
-45
+90
ºC
NOTE
“1)” When the module works within the temperature range, the deviations from the RF specification may
occur. For example, the frequency error or the phase error would increase.
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5.4. Current Consumption
The values of current consumption are shown below.
Table 32: Module Current Consumption
Parameter
Description
GSM/GPRS
supply current
WCDMA
supply current
Conditions
Typ.
Unit
Sleep (USB disconnected)
3.6 @DRX=2
2.5 @DRX=5
2.2 @DRX=9
mA
Sleep (USB suspended)
3.8 @DRX=2
2.7 @DRX=5
2.4 @DRX=9
mA
Idle (USB disconnected) @DRX=5
30
mA
Idle (USB connected) @DRX=5
60
mA
Sleep (USB disconnected)
4.0 @DRX=6
3.0 @DRX=7
2.2 @DRX=8
2.1 @DRX=9
mA
Sleep (USB suspended)
4.0 @DRX=6
3.0 @DRX=7
2.5 @DRX=8
2.2 @DRX=9
mA
Idle (USB disconnected) @DRX=6
30
mA
Idle (USB connected) @DRX=6
60
mA
GSM850 1DL/1UL @PCL=5
222
mA
GSM850 4DL/1UL @PCL=5
222
mA
GSM850 3DL/2UL @PCL=5
320
mA
GSM850 2DL/3UL @PCL=5
403
mA
GSM850 1DL/4UL @PCL=5
459
mA
EGSM900 1DL/1UL @PCL=5
216
mA
EGSM900 4DL/1UL @PCL=5
216
mA
EGSM900 3DL/2UL @PCL=5
311
mA
IVBAT
GPRS data
transfer
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WCDMA data
transfer
EGSM900 2DL/3UL @PCL=5
391
mA
EGSM900 1DL/4UL @PCL=5
445
mA
DCS1800 1DL/1UL @PCL=0
176
mA
DCS1800 4DL/1UL @PCL=0
176
mA
DCS1800 3DL/2UL @PCL=0
248
mA
DCS1800 2DL/3UL @PCL=0
307
mA
DCS1800 1DL/4UL @PCL=0
345
mA
PCS1900 1DL/1UL @PCL=0
170
mA
PCS1900 4DL/1UL @PCL=0
170
mA
PCS1900 3DL/2UL @PCL=0
238
mA
PCS1900 2DL/3UL @PCL=0
295
mA
PCS1900 1DL/4UL @PCL=0
331
mA
UMTS2100 HSDPA @max power
398
mA
UMTS1900 HSDPA @max power
441
mA
UMTS850 HSDPA @max power
372
mA
UMTS900 HSDPA @max power
400
mA
GSM850 @PCL=5
239
mA
EGSM900 @PCL=5
233
mA
DCS1800 @PCL=0
191
mA
PCS1900 @PCL=0
183
mA
UMTS2100 @max power
470
mA
UMTS1900 @max power
520
mA
UMTS850 @max power
450
mA
UMTS900 @max power
469
mA
GSM voice call
WCDMA voice
call
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5.5. RF Output Power
Table 33: Module Conducted RF Output Power
Frequency
Max.
Min.
GSM850
33dBm±2dB
5dBm±5dB
EGSM900
33dBm±2dB
5dBm±5dB
DCS1800
30dBm±2dB
0dBm±5dB
PCS1900
30dBm±2dB
0dBm±5dB
GSM850 (8-PSK)
27dBm±3dB
5dBm±5dB
EGSM900 (8-PSK)
27dBm±3dB
5dBm±5dB
DCS1800 (8-PSK)
26dBm+3/-4dB
0dBm±5dB
PCS1900 (8-PSK)
26dBm+3/-4dB
0dBm±5dB
UMTS850
24dBm+1/-3dB
-56dBm±5dB
UMTS900
24dBm+1/-3dB
-56dBm±5dB
UMTS1900
24dBm+1/-3dB
-56dBm±5dB
UMTS2100
24dBm+1/-3dB
-56dBm±5dB
NOTE
In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM
specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
5.6. RF Receiving Sensitivity
Table 34: Module Conducted Receiving Sensitivity
Frequency
Receive Sensitivity (Typ.)
Unit
GSM850
-108.5
dBm
EGSM900
-108.5
dBm
DCS1800
-108.5
dBm
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PCS1900
-108.5
dBm
UMTS850
-110
dBm
UMTS900
-110
dBm
UMTS1900
-110
dBm
UMTS2100
-110
dBm
5.7. Electrostatic Discharge
The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatics discharge characteristics.
Table 35: Electrostatics Discharge Characteristics
Tested Points
Contact Discharge
Air Discharge
Unit
VBAT, GND
±5
±10
kV
Antenna Interface
±4
±8
kV
Other Interfaces
±0.5
±1
kV
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Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.
6.1. Mechanical Dimensions of the Module
29+/-0.15
(2.5+/-0.2)
27.15
29+/-0.15
27.15
(1.0+/-0.1)
Figure 42: UC15 Top and Side Dimensions
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3.2
3.4
3.2
3.4
3.2
3.4
4.8
29
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Figure 43: UC15 Bottom Dimensions (Bottom View)
Figure 44: Bottom Pads Dimensions (Bottom View)
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6.2. Footprint of Recommendation
14.50
9.75
14.50
9.75
0.65
0.65
0.80
1.30
14.50
12.60
9.60
4.80
0.40
4.80
4.80
0.90
9.60
14.50
12.60
0.90
0.70
2.30
3.90
0.10
1.00
3.10 3.50
6.50
9.70
0.80
2.00
0.80
3.00
2.50
1.60
1.60
6.70
0.80
3.00
1.10
1.10
2.00
Figure 45: Recommended Footprint (Top View)
NOTES
1.
2.
3.
Refer to figure 2 about the pin distribution (especially for pin 65, 66, 67, 68).
The pins on area A are reserved, please keep them unconnected.
In order to maintain the module, keep about 3mm between the module and other components in the
host PCB.
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6.3. Top View of the Module
Figure 46: Top View of the Module
6.4. Bottom View of the Module
Figure 47: Bottom View of the Module
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Storage and Manufacturing
7.1. Storage
UC15 is stored in the vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
After this bag is opened, devices that will be subjected to reflow solder or other high temperature process
must be:


Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.
Stored at < 10% RH.
Devices require bake, before mounting, if:


Humidity indicator card is > 10% when read 23ºC±5ºC.
Mounted for more than 72 hours at factory conditions of ≤ 30ºC/60% RH.
If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
NOTE
As plastic container cannot be subjected to high temperature, module needs to be taken out from
container to high temperature (125ºC) bake. If shorter bake times are desired, please refer to
IPC/JEDECJ-STD-033 for bake procedure.
7.2. Manufacturing and Welding
The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.18mm. For details, please refer to document [4].
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It is suggested that peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). Absolute max reflow
temperature is 260ºC. To avoid damage to the module when it was repeatedly heated, it is suggested that
the module should be mounted after the first panel has been reflowed. The following picture is the actual
diagram which we have operated.
Figure 48: Reflow Soldering Profile
7.3. Packaging
UC15 is packaged in the tap and reel carriers. One reel is 12.4m length and contains 250pcs modules.
The following figure shows the package details.
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Cover tape
Direction of feed
Unit: mm
Figure 49: Carrier Tape
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Appendix A Reference
Table 36: Related Documents
SN
Document Name
Remark
[1]
Quectel_UC15_AT_Commands_Manual
UC15 AT commands manual
[2]
Quectel_M10_EVB_User_Guide
M10 EVB user guide
[3]
Quectel_UC15_Reference_Design
UC15 reference design
[4]
Quectel_Module_Secondary_SMT_User_Guide
Module secondary SMT user guide
Table 37: Terms and Abbreviations
Abbreviation
Description
AMR
Adaptive Multi-rate
bps
Bits Per Second
CHAP
Challenge Handshake Authentication Protocol
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear to Send
DRX
Discontinuous Reception
DCE
Data Communications Equipment (typical module)
DTE
Data Terminal Equipment (typical computer, external controller)
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
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EFR
Enhanced Full Rate
EGSM
Extended GSM900 Band (including standard GSM900 band)
ESD
Electrostatic Discharge
FR
Full Rate
GMSK
Gaussian Minimum Shift Keying
GSM
Global System for Mobile Communications
HR
Half Rate
HSDPA
High Speed Down Link Packet Access
IMEI
International Mobile Equipment Identity
Imax
Maximum Load Current
LED
Light Emitting Diode
LSB
Least Significant Bit
ME
Mobile Equipment
MO
Mobile Originated
MS
Mobile Station (GSM Engine)
MT
Mobile Terminated
PAP
Password Authentication Protocol
PBCCH
Packet Broadcast Control Channel
PCB
Printed Circuit Board
PDU
Protocol Data Unit
PPP
Point-to-Point Protocol
PSK
Phase Shift Keying
QAM
Quadrature Amplitude Modulation
QPSK
Quadrature Phase Shift Keying
RF
Radio Frequency
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RMS
Root Mean Square (value)
Rx
Receive
SIM
Subscriber Identification Module
SMS
Short Message Service
TX
Transmitting Direction
UART
Universal Asynchronous Receiver & Transmitter
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
USIM
Universal Subscriber Identity Module
USSD
Unstructured Supplementary Service Data
Vmax
Maximum Voltage Value
Vnorm
Normal Voltage Value
Vmin
Minimum Voltage Value
VIHmax
Maximum Input High Level Voltage Value
VIHmin
Minimum Input High Level Voltage Value
VILmax
Maximum Input Low Level Voltage Value
VILmin
Minimum Input Low Level Voltage Value
VImax
Absolute Maximum Input Voltage Value
VImin
Absolute Minimum Input Voltage Value
VOHmax
Maximum Output High Level Voltage Value
VOHmin
Minimum Output High Level Voltage Value
VOLmax
Maximum Output Low Level Voltage Value
VOLmin
Minimum Output Low Level Voltage Value
WCDMA
Wideband Code Division Multiple Access
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Appendix B GPRS Coding Scheme
Table 38: Description of Different Coding Schemes
Scheme
CS-1
CS-2
CS-3
CS-4
Code Rate
1/2
2/3
3/4
USF
Pre-coded USF
12
Radio Block excl.USF and BCS
181
268
312
428
BCS
40
16
16
16
Tail
Coded Bits
456
588
676
456
Punctured Bits
132
220
Data Rate Kb/s
9.05
13.4
15.6
21.4
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Appendix C GPRS Multi-slot Class
Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot
classes are product dependant, and determine the maximum achievable data rates in both the uplink and
downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,
while the second number indicates the amount of uplink timeslots. The active slots determine the total
number of slots the GPRS device can use simultaneously for both uplink and downlink communications.
The description of different multi-slot classes is shown in the following table.
Table 39: Description of Different Coding Schemes
Multislot Class
Downlink Slots
Uplink Slots
Active Slots
10
11
12
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Appendix D EDGE Modulation and
Coding Scheme
Table 40: EDGE Modulation and Coding Scheme
Coding Scheme
Modulation
Coding Family
1 Timeslot
2 Timeslot
4 Timeslot
CS-1:
GMSK
9.05kbps
18.1kbps
36.2kbps
CS-2:
GMSK
13.4kbps
26.8kbps
53.6kbps
CS-3:
GMSK
15.6kbps
31.2kbps
62.4kbps
CS-4:
GMSK
21.4kbps
42.8kbps
85.6kbps
MCS-1
GMSK
8.80kbps
17.60kbps
35.20kbps
MCS-2
GMSK
11.2kbps
22.4kbps
44.8kbps
MCS-3
GMSK
14.8kbps
29.6kbps
59.2kbps
MCS-4
GMSK
17.6kbps
35.2kbps
70.4kbps
MCS-5
8-PSK
22.4kbps
44.8kbps
89.6kbps
MCS-6
8-PSK
29.6kbps
59.2kbps
118.4kbps
MCS-7
8-PSK
44.8kbps
89.6kbps
179.2kbps
MCS-8
8-PSK
54.4kbps
108.8kbps
217.6kbps
MCS-9
8-PSK
59.2kbps
118.4kbps
236.8kbps
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