Quectel Wireless Solutions 201607EC25V LTE Module User Manual

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EC25 Hardware DesignLTE Module SeriesRev. EC25_Hardware_Design_V1.5Date: 2018-04-20Status: Releasedwww.quectel.com

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 1/ 112Our aim is to provide customers with timely and comprehensive service. For anyassistance, please contact our company headquarters:Quectel Wireless Solutions Co., Ltd.7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, ChinaTel: +86 21 5108 6236Email: info@quectel.comOr our local office. For more information, please visit:http://quectel.com/support/sales.htmFor technical support, or to report documentation errors, please visit:http://quectel.com/support/technical.htmOr Email to: support@quectel.comGENERAL NOTESQUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATIONPROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORTTO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOTMAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPTANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF ORRELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TOCHANGE WITHOUT PRIOR NOTICE.COPYRIGHTTHE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OFQUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATIONAND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT AREFORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OFDAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT ORREGISTRATION OF A UTILITY MODEL OR DESIGN.Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2/ 112About the DocumentHistoryRevisionDateAuthorDescription1.02016-04-01Woody WUInitial1.12016-09-22Lyndon LIU/Frank WANG1. Updated EC25 series frequency bands in Table 1.2. Updated transmitting power, supported maximumbaud rate of main UART/internal protocols/USBdrivers of USB interface, firmware upgrade andtemperature range in Table 2.3. Updated timing of turning on module in Figure 12.4. Updated timing of turning off module in Figure 13.5. Updated timing of resetting module in Figure 16.6. Updated supported baud rates of main UART inChapter 3.11.7. Added notes for ADC interface in Chapter 3.13.8. Updated GNSS performance in Table 21.9. Updated operating frequencies of module in Table 23.10. Added current consumption in Chapter 6.4.11. Updated RF output power in Chapter 6.5.12. Added RF receiving sensitivity in Chapter 6.6.1.22016-11-04Lyndon LIU/Michael ZHANG1. Added SGMII and WLAN interfaces in Table 2.2. Updated function diagram in Figure 1.3. Updated pin assignment (Top View) in Figure 2.4. Added description of SGMII and WLAN interfaces inTable 4.5. Added SGMII interface in Chapter 3.17.6. Added WLAN interface in Chapter 3.18.7. Added USB_BOOT interface in Chapter 3.19.8. Added reference design of RF layout in Chapter 5.1.4.9. Added note about SIMO in Chapter 6.6.1.32017-01-24Lyndon LIU/Frank WANG1. Updated function diagram in Figure 1.2. Updated pin assignment (top view) in Figure 2.3. Added BT interface in Chapter 3.18.2.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3/ 1124. Updated GNSS performance in Table 24.5. Updated reference circuit of wireless connectivityinterfaces with FC20 module in Figure 29.6. Updated current consumption of EC25-E module inTable 33.7. Updated EC25-A conducted RF receiving sensitivityin Table 38.8. AddedEC25-J conducted RF receiving sensitivity inTable 40.1.42018-03-05AnniceZHANG/Lyndon LIU/Frank WANG1. Updated functional diagram in Figure 1.2. Updated frequency bands in Table 1.3. Updated LTE, UMTS and GSM features in Table 2.4. Updated description of pin 40/136/137/138.5. Updated PWRKEY pulled down time to 500ms inChapter 3.7.1 and reference circuit in Figure 10.6. Updated reference circuit of (U)SIM interface inFigure 17&18.7. Updated reference circuit of USB interface in Figure19.8. Updated PCM mode in Chapter 3.12.9. Added SD card interface in Chapter 3.13.10. Updated USB_BOOT reference circuit in Chapter3.20.11. Updated module operating frequencies in Table 26.12. Updated antenna requirements in Table 30.13. Updated EC25 series module current consumption inChapter 6.4.14. Updated EC25 series module conducted RF receivingsensitivity in Chapter 6.6.15. Added thermal consideration description in Chapter6.8.16. Added dimension tolerance information in Chapter 7.17. Added storage temperature range in Table 2 andChapter 6.3.18. Updated RF output power in Table 41.19. Updated GPRS multi-slot classes in Table 53.20. Updated storage information in Chapter 8.1.1.52018-04-20Kinsey ZHANG1. Added information of EC25-AF in Table 1.2. Updated module operating frequencies in Table 27.3. Added current consumption of EC25-AF module inTable 40.4. Changed GNSS current consumption of EC25 seriesmodule into Table 41.5. Added EC25-AF conducted RF receiving sensitivity in

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 4/ 112Table 50.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5/ 112ContentsAbout the Document..................................................................................................................................................2Contents........................................................................................................................................................................5Table Index................................................................................................................................................................... 8Figure Index............................................................................................................................................................... 101 Introduction....................................................................................................................................................... 121.1. Safety Information.................................................................................................................................132 Product Concept...............................................................................................................................................142.1. General Description..............................................................................................................................142.2. Key Features......................................................................................................................................... 152.3. Functional Diagram.............................................................................................................................. 182.4. Evaluation Board...................................................................................................................................193 Application Interfaces.....................................................................................................................................203.1. General Description..............................................................................................................................203.2. Pin Assignment..................................................................................................................................... 213.3. Pin Description...................................................................................................................................... 223.4. Operating Modes.................................................................................................................................. 343.5. Power Saving........................................................................................................................................ 343.5.1. Sleep Mode................................................................................................................................. 343.5.1.1. UART Application............................................................................................................343.5.1.2. USB Application with USB Remote Wakeup Function.............................................353.5.1.3. USB Application with USB Suspend/Resume and RI Function..............................363.5.1.4. USB Application without USB Suspend Function..................................................... 373.5.2. Airplane Mode.............................................................................................................................373.6. Power Supply........................................................................................................................................ 383.6.1. Power Supply Pins.....................................................................................................................383.6.2. Decrease Voltage Drop.............................................................................................................393.6.3. Reference Design for Power Supply.......................................................................................403.6.4. Monitor the Power Supply.........................................................................................................403.7. Turn on and off Scenarios...................................................................................................................403.7.1. Turn on Module Using the PWRKEY......................................................................................403.7.2. Turn off Module...........................................................................................................................423.7.2.1. Turn off Module Using the PWRKEY Pin................................................................... 423.7.2.2. Turn off Module Using AT Command..........................................................................433.8. Reset the Module..................................................................................................................................433.9. (U)SIM Interface....................................................................................................................................453.10. USB Interface........................................................................................................................................ 473.11. UART Interfaces................................................................................................................................... 493.12. PCM and I2C Interfaces...................................................................................................................... 513.13. SD Card Interface.................................................................................................................................533.14. ADC Interfaces......................................................................................................................................56

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6/ 1123.15. Network Status Indication....................................................................................................................573.16. STATUS................................................................................................................................................. 583.17. Behaviors of RI......................................................................................................................................593.18. SGMII Interface.....................................................................................................................................593.19. Wireless Connectivity Interfaces........................................................................................................613.19.1. WLAN Interface.......................................................................................................................... 633.19.2. BT Interface*............................................................................................................................... 643.20. USB_BOOT Interface.......................................................................................................................... 644 GNSS Receiver..................................................................................................................................................664.1. General Description..............................................................................................................................664.2. GNSS Performance..............................................................................................................................664.3. Layout Guidelines.................................................................................................................................675 Antenna Interfaces...........................................................................................................................................685.1. Main/Rx-diversity Antenna Interfaces............................................................................................... 685.1.1. Pin Definition...............................................................................................................................685.1.2. Operating Frequency.................................................................................................................685.1.3. Reference Design of RF Antenna Interface.......................................................................... 705.1.4. Reference Design of RF Layout.............................................................................................. 705.2. GNSS Antenna Interface.....................................................................................................................725.3. Antenna Installation..............................................................................................................................745.3.1. Antenna Requirement................................................................................................................745.3.2. Recommended RF Connector for Antenna Installation.......................................................756 Electrical, Reliability and Radio Characteristics.....................................................................................776.1. Absolute Maximum Ratings................................................................................................................ 776.2. Power Supply Ratings..........................................................................................................................786.3. Operation and Storage Temperatures.............................................................................................. 786.4. Current Consumption...........................................................................................................................796.5. RF Output Power.................................................................................................................................. 906.6. RF Receiving Sensitivity......................................................................................................................916.7. Electrostatic Discharge........................................................................................................................956.8. Thermal Consideration........................................................................................................................ 957 Mechanical Dimensions................................................................................................................................. 987.1. Mechanical Dimensions of the the Module...................................................................................... 987.2. Recommended Footprint...................................................................................................................1007.3. Design Effect Drawings of the Module............................................................................................1018 Storage, Manufacturing and Packaging.................................................................................................. 1028.1. Storage.................................................................................................................................................1028.2. Manufacturing and Soldering........................................................................................................... 1038.3. Packaging............................................................................................................................................ 1049 Appendix A References............................................................................................................................... 10510 Appendix B GPRS Coding Schemes........................................................................................................109

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 7/ 11211 Appendix C GPRS Multi-slot Classes...................................................................................................... 11012 Appendix D EDGE Modulationand Coding Schemes.......................................................................... 112

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 8/ 112Table IndexTABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE................................................................................14TABLE 2: KEY FEATURES OF EC25 MODULE......................................................................................................... 15TABLE 3: I/O PARAMETERS DEFINITION..................................................................................................................22TABLE 4: PIN DESCRIPTION........................................................................................................................................ 22TABLE 5: OVERVIEW OF OPERATING MODES....................................................................................................... 34TABLE 6: VBAT AND GND PINS................................................................................................................................... 38TABLE 7: PIN DEFINITION OF PWRKEY.................................................................................................................... 41TABLE 8: RESET_N PIN DESCRIPTION..................................................................................................................... 43TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE........................................................................................45TABLE 10: PIN DESCRIPTION OF USB INTERFACE.............................................................................................. 47TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE..................................................................................... 49TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE................................................................................. 49TABLE 13: LOGIC LEVELS OF DIGITAL I/O............................................................................................................... 50TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES............................................................................... 52TABLE 15: PIN DEFINITION OF SD CARD INTERFACE......................................................................................... 54TABLE 16: PIN DEFINITION OF ADC INTERFACES................................................................................................ 56TABLE 17: CHARACTERISTIC OF ADC...................................................................................................................... 56TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR........................57TABLE 19: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR........... 57TABLE 20: PIN DEFINITION OF STATUS................................................................................................................... 58TABLE 21: BEHAVIOR OF RI......................................................................................................................................... 59TABLE 22: PIN DEFINITION OF THE SGMII INTERFACE....................................................................................... 60TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES..................................................... 61TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE......................................................................................64TABLE 25: GNSS PERFORMANCE..............................................................................................................................66TABLE 26: PIN DEFINITION OF RF ANTENNA..........................................................................................................68TABLE 27: MODULE OPERATING FREQUENCIES..................................................................................................68TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE............................................................................72TABLE 29: GNSS FREQUENCY.................................................................................................................................... 73TABLE 30: ANTENNA REQUIREMENTS..................................................................................................................... 74TABLE 31: ABSOLUTE MAXIMUM RATINGS.............................................................................................................77TABLE 32: THE MODULE POWER SUPPLY RATINGS........................................................................................... 78TABLE 33: OPERATION AND STORAGE TEMPERATURES..................................................................................78TABLE 34: EC25-E CURRENT CONSUMPTION........................................................................................................79TABLE 35: EC25-A CURRENT CONSUMPTION........................................................................................................81TABLE 36: EC25-V CURRENT CONSUMPTION........................................................................................................82TABLE 37: EC25-J CURRENT CONSUMPTION........................................................................................................ 83TABLE 38: EC25-AU CURRENT CONSUMPTION.....................................................................................................84TABLE 39: EC25-AUT CURRENT CONSUMPTION.................................................................................................. 87TABLE 40: EC25-AF CURRENT CONSUMPTION..................................................................................................... 88TABLE 41: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE...................................................... 90

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 9/ 112TABLE 42: RF OUTPUT POWER.................................................................................................................................. 90TABLE 43: EC25-E CONDUCTED RF RECEIVING SENSITIVITY..........................................................................91TABLE 44: EC25-A CONDUCTED RF RECEIVING SENSITIVITY..........................................................................91TABLE 45: EC25-V CONDUCTED RF RECEIVING SENSITIVITY..........................................................................92TABLE 46: EC25-J CONDUCTED RF RECEIVING SENSITIVITY.......................................................................... 92TABLE 47: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY.......................................................................93TABLE 48: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY.................................................................... 93TABLE 49: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY.................................................................. 94TABLE 50: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY....................................................................... 94TABLE 51: ELECTROSTATICS DISCHARGE CHARACTERISTICS......................................................................95TABLE 52: RELATED DOCUMENTS..........................................................................................................................105TABLE 53: TERMS AND ABBREVIATIONS.............................................................................................................. 105TABLE 54: DESCRIPTION OF DIFFERENT CODING SCHEMES........................................................................109TABLE 55: GPRS MULTI-SLOT CLASSES............................................................................................................... 110TABLE 56: EDGE MODULATION AND CODING SCHEMES................................................................................ 112

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 10 / 112Figure IndexFIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................................18FIGURE 2: PIN ASSIGNMENT (TOP VIEW)................................................................................................................21FIGURE 3: SLEEP MODE APPLICATION VIA UART................................................................................................ 35FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP.......................................................... 36FIGURE 5: SLEEP MODE APPLICATION WITH RI................................................................................................... 36FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION......................................................37FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION............................................................ 39FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY....................................................................................39FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY....................................................................................... 40FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT.................................................................. 41FIGURE 11: TURN ON THE MODULE BY USING BUTTON....................................................................................41FIGURE 12: TIMING OF TURNING ON MODULE......................................................................................................42FIGURE 13: TIMING OF TURNING OFF MODULE....................................................................................................43FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT........................................... 44FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON............................................................. 44FIGURE 16: TIMING OF RESETTING MODULE........................................................................................................ 44FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR..................................................................................................................................................................................... 46FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR.46FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION................................................................................. 48FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP........................................................................... 50FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT..................................................................... 51FIGURE 22: PRIMARY MODE TIMING........................................................................................................................ 52FIGURE 23: AUXILIARY MODE TIMING......................................................................................................................52FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC........................................ 53FIGURE 25: REFERENCE CIRCUIT OF SD CARD................................................................................................... 55FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR................................................................ 58FIGURE 27: REFERENCE CIRCUITS OF STATUS...................................................................................................59FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION.................................................. 60FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION.................. 61FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE..................................................................................................................................................................................... 63FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE........................................................................65FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE....................................................................70FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB............................................................................. 71FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB.......................................................71FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCEGROUND).................................................................................................................................................................. 71FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCEGROUND).................................................................................................................................................................. 72FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA......................................................................................73

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 1-12 / 1121IntroductionThis document defines the EC25 module and describes its air interface and hardware interface which areconnected with customers’ applications.This document can help customers quickly understand module interface specifications, electrical andmechanical details, as well as other related information of EC25 module. Associated with application noteand user guide, customers can use EC25 module to design and set up mobile applications easily.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 1-13 / 1121.1. Safety InformationThe following safety precautions must be observed during all phases of the operation, such as usage,service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellularterminal should send the following safety information to users and operating personnel, and incorporatethese guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for thecustomers’ failure to comply with these precautions.Full attention must be given to driving at all times in order to reduce the risk of anaccident. Using a mobile while driving (even with a hands free kit) causesdistraction and can lead to an accident. You must comply with laws and regulationsrestricting the use of wireless devices while driving.Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it isswitched off. The operation of wireless appliances in an aircraft is forbidden, so asto prevent interference with communication systems. Consult the airline staff aboutthe use of wireless devices on boarding the aircraft, if your device offers anAirplane Mode which must be enabled prior to boarding an aircraft.Switch off your wireless device when in hospitals,clinics or other health carefacilities. These requests are designed to prevent possible interference withsensitive medical equipment.Cellular terminals or mobiles operating over radio frequency signal and cellularnetwork cannot be guaranteed to connect in all conditions, for example no mobilefee or with an invalid (U)SIM card. While you are in this condition and needemergent help, please remember using emergency call. In order to make orreceive a call, the cellular terminal or mobile must be switched on and in a servicearea with adequate cellular signal strength.Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,it receives and transmits radio frequency energy. RF interference can occur if it isused close to TV set, radio, computer or other electric equipment.In locations with potentially explosive atmospheres, obey all posted signs to turnoff wireless devices such as your phone or other cellular terminals. Areas withpotentially explosive atmospheres include fuelling areas, below decks on boats,fuel or chemical transfer or storage facilities, areas where the air containschemicals or particles such as grain, dust or metal powders, etc.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2-14 / 1122Product Concept2.1. General DescriptionEC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receivediversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’specific application. EC25 contains seven variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU,EC25-AUT, EC25-AF and EC25-AUTL. Customers can choose a dedicated type based on the region oroperator. The following table shows the frequency bands of EC25 series module.Table 1: Frequency Bands of EC25 Series ModuleModules2)LTE BandsWCDMABandsGSM BandsRx-diversityGNSS1)EC25-EFDD: B1/B3/B5/B7/B8/B20TDD: B38/B40/B41B1/B5/B8900/1800MHzYGPS,GLONASS,BeiDou/Compass,Galileo,QZSSEC25-AFDD: B2/B4/B12B2/B4/B5NYEC25-VFDD: B4/B13NNYEC25-JFDD: B1/B3/B8/B18/B19/B26TDD: B41B1/B6/B8/B19NYEC25-AU3)FDD: B1/B2/B3/B4/B5/B7/B8/B28TDD: B40B1/B2/B5/B8850/900/1800/1900MHzYEC25-AUTFDD: B1/B3//B5/B7/B28B1/B5NYEC25-AFFDD: B2/B4//B5/B12/B13/B14/B66/B71B2/B4/B5NYEC25-AUTLFDD: B3/B7/B28NNYN

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2-16 / 112LTE-TDD: Max 130Mbps (DL)/30Mbps (UL)UMTS FeaturesSupport 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMASupport QPSK, 16-QAM and 64-QAM modulationDC-HSDPA: Max 42Mbps (DL)HSUPA: Max 5.76Mbps (UL)WCDMA: Max 384Kbps (DL)/384Kbps (UL)GSM FeaturesGPRS:Support GPRS multi-slot class 33 (33 by default)Coding scheme: CS-1, CS-2, CS-3 and CS-4Max 107Kbps (DL)/85.6Kbps (UL)EDGE:Support EDGE multi-slot class 33 (33 by default)Support GMSK and 8-PSK for different MCS (Modulation and CodingScheme)Downlink coding schemes: CS 1-4 and MCS 1-9Uplink coding schemes: CS 1-4 and MCS 1-9Max 296Kbps (DL)/236.8Kbps (UL)Internet Protocol FeaturesSupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/CMUX*/HTTPS*/SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocolsSupport PAP (Password Authentication Protocol) and CHAP (ChallengeHandshake Authentication Protocol) protocols which are usually used forPPP connectionsSMSText and PDU modePoint to point MO and MTSMS cell broadcastSMS storage: ME by default(U)SIM InterfaceSupport USIM/SIM card: 1.8V, 3.0VAudio FeaturesSupport one digital audio interface: PCM interfaceGSM: HR/FR/EFR/AMR/AMR-WBWCDMA: AMR/AMR-WBLTE: AMR/AMR-WBSupport echo cancellation and noise suppressionPCM InterfaceUsed for audio function with external codecSupport 16-bit linear data formatSupport long frame synchronization and short frame synchronizationSupport master and slave modes, but must be the master in long framesynchronizationUSB InterfaceCompliant with USB 2.0 specification (slave only); the data transfer rate canreach up to 480MbpsUsed for AT command communication, data transmission, GNSS NMEAoutput, software debugging, firmware upgrade and voice over USB*

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2-17 / 1121. 1) Within operation temperature range, the module is 3GPP compliant.2. 2) Within extended temperature range, the module remains the ability to establish and maintain avoice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. Thereare also no effects on radio spectrum and no harm to radio network. Only one or more parameters likePout might reduce in their value and exceed the specified tolerances. When the temperature returns tothe normal operating temperature levels, the module will meet 3GPP specifications again.3. “*” means under development.Support USB serial drivers for: Windows 7/8/8.1/10,Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.xUART InterfaceMain UART:Used for AT command communication and data transmissionBaud rates reach up to 921600bps, 115200bps by defaultSupport RTS and CTS hardware flow controlDebug UART:Used for Linux console and log output115200bps baud rateSD Card InterfaceSupport SD 3.0 protocolSGMII InterfaceSupport 10M/100M/1000M Ethernet work modeSupport maximum 150Mbps (DL)/50Mbps (UL) for 4G networkWireless ConnectivityInterfacesSupport a low-power SDIO 3.0 interface for WLAN and UART/PCMinterface for Bluetooth*Rx-diversitySupport LTE/WCDMA Rx-diversityGNSS FeaturesGen8C Lite of QualcommProtocol: NMEA 0183AT CommandsCompliant with 3GPP TS 27.007, 27.005 and Quectel enhanced ATcommandsNetwork IndicationTwo pins including NET_MODE and NET_STATUS to indicate networkconnectivity statusAntenna InterfacesIncluding main antenna interface (ANT_MAIN), Rx-diversity antennainterface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)Physical CharacteristicsSize: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mmWeight: approx. 4.9gTemperature RangeOperation temperature range: -35°C ~ +75°C1)Extended temperature range: -40°C ~ +85°C2)Storage temperature range: -40°C~ +90°CFirmware UpgradeUSB interface and DFOTA*RoHSAll hardware components are fully compliant with EU RoHS directiveNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2-18 / 1122.3. Functional DiagramThe following figure shows a block diagram of EC25 and illustrates the major functional parts.Power managementBasebandDDR+NAND flashRadio frequencyPeripheral interfacesFigure 1: Functional Diagram“*” means under development.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 2-19 / 1122.4. Evaluation BoardIn order to help customers develop applications with EC25, Quectel supplies an evaluation board (EVB),USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-20 / 1123Application Interfaces3.1. General DescriptionEC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular applicationplatform. Sub-interfaces included in these pads are described in detail in the following chapters:Power supply(U)SIM interfaceUSB interfaceUART interfacesPCM and I2C interfacesSD card interfaceADC interfacesStatus indicationSGMII interfaceWireless connectivity interfacesUSB_BOOT interface

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-21 / 1123.2. Pin AssignmentThe following figure shows the pin assignment of EC25 module.Figure 2: Pin Assignment (Top View)1. 1) means that these pins cannot be pulled up before startup.2. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.3. 3) means these interface functions are only supported on Telematics version.4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BTfunction is under development.5. Pads 119~126 and 128 are used for SGMII interface.NOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-22 / 1126. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on theBT module.7. Keep all RESERVED pins and unused pins unconnected.8. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should not be designed in schematic and PCB decal, and these pins should be served as a keep outarea.9. “*” means under development.3.3. Pin DescriptionThe following tables show the pin definition of EC25 modules.Table 3: I/O Parameters DefinitionTable 4: Pin DescriptionTypeDescriptionIOBidirectionalDIDigital inputDODigital outputPIPower inputPOPower outputAIAnalog inputAOAnalog outputODOpen drainPower SupplyPin NamePin No.I/ODescriptionDC CharacteristicsCommentVBAT_BB59, 60PIPower supply formodule’s basebandpartVmax=4.3VVmin=3.3VVnorm=3.8VIt must be able toprovide sufficientcurrent up to 0.8A.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-23 / 112VBAT_RF57, 58PIPower supply formodule’s RF partVmax=4.3VVmin=3.3VVnorm=3.8VIt must be able toprovide sufficientcurrent up to 1.8A in aburst transmission.VDD_EXT7POProvide 1.8V forexternal circuitVnorm=1.8VIOmax=50mAPower supply forexternal GPIO’s pull-upcircuits.GND8, 9, 19,22, 36, 46,48, 50~54,56, 72,85~112GroundTurn on/offPin NamePin No.I/ODescriptionDC CharacteristicsCommentPWRKEY21DITurn on/off themoduleVIHmax=2.1VVIHmin=1.3VVILmax=0.5VThe output voltage is0.8V because of thediode drop in theQualcomm chipset.RESET_N20DIReset the moduleVIHmax=2.1VVIHmin=1.3VVILmax=0.5VIf unused, keep itopen.Status IndicationPin NamePin No.I/ODescriptionDC CharacteristicsCommentSTATUS61ODIndicate the moduleoperating statusThe drive currentshould be less than0.9mA.An external pull-upresistor is required. Ifunused, keep it open.NET_MODE5DOIndicate the modulenetwork registrationmodeVOHmin=1.35VVOLmax=0.45V1.8V power domain.Cannot be pulled upbefore startup.If unused, keep itopen.NET_STATUS6DOIndicate the modulenetwork activitystatusVOHmin=1.35VVOLmax=0.45V1.8V power domain.If unused, keep itopen.USB InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentUSB_VBUS71PIUSB detectionVmax=5.25VVmin=3.0VVnorm=5.0VTypical: 5.0VIf unused, keep itopen.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-24 / 112USB_DP69IOUSB differential databus (+)Compliant with USB2.0 standardspecification.Require differentialimpedance of 90Ω.If unused, keep itopen.USB_DM70IOUSB differential databus (-)Compliant with USB2.0 standardspecification.Require differentialimpedance of 90Ω.If unused, keep itopen.(U)SIM InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentUSIM_GND10Specified ground for(U)SIM cardUSIM_PRESENCE13DI(U)SIM cardinsertion detectionVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.USIM_VDD14POPower supply for(U)SIM cardFor 1.8V(U)SIM:Vmax=1.9VVmin=1.7VFor 3.0V(U)SIM:Vmax=3.05VVmin=2.7VIOmax=50mAEither 1.8V or 3.0V issupported by themodule automatically.USIM_DATA15IOData signal of(U)SIM cardFor 1.8V (U)SIM:VILmax=0.6VVIHmin=1.2VVOLmax=0.45VVOHmin=1.35VFor 3.0V (U)SIM:VILmax=1.0VVIHmin=1.95VVOLmax=0.45VVOHmin=2.55VUSIM_CLK16DOClock signal of(U)SIM cardFor 1.8V (U)SIM:VOLmax=0.45VVOHmin=1.35VFor 3.0V (U)SIM:VOLmax=0.45VVOHmin=2.55V

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-25 / 112USIM_RST17DOReset signal of(U)SIM cardFor 1.8V (U)SIM:VOLmax=0.45VVOHmin=1.35VFor 3.0V (U)SIM:VOLmax=0.45VVOHmin=2.55VMain UART InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentRI62DORing indicatorVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.DCD63DOData carrierdetectionVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.CTS64DOClear to sendVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.RTS65DIRequest to sendVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.DTR66DIData terminal ready,sleep mode controlVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.Pulled up by default.Low level wakes upthe module.If unused, keep itopen.TXD67DOTransmit dataVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.RXD68DIReceive dataVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.Debug UART InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentDBG_TXD12DOTransmit dataVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.DBG_RXD11DIReceive dataVILmin=-0.3V1.8V power domain.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-26 / 112VILmax=0.6VVIHmin=1.2VVIHmax=2.0VIf unused, keep itopen.ADC InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentADC045AIGeneral purposeanalog to digitalconverterVoltage range:0.3V to VBAT_BBIf unused, keep itopen.ADC144AIGeneral purposeanalog to digitalconverterVoltage range:0.3V to VBAT_BBIf unused, keep itopen.PCM InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentPCM_IN24DIPCM data inputVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.PCM_OUT25DOPCM data outputVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.PCM_SYNC26IOPCM data framesynchronizationsignalVOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.In master mode, it isan output signal. Inslave mode, it is aninput signal.If unused, keep itopen.PCM_CLK27IOPCM clockVOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.In master mode, it isan output signal. Inslave mode, it is aninput signal.If unused, keep itopen.I2C InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentI2C_SCL41ODI2C serial clock Usedfor external codec.External pull-upresistor is required.1.8V only. If unused,keep it open.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-27 / 112I2C_SDA42ODI2C serial dataUsedfor external codec.External pull-upresistor is required.1.8V only. If unused,keep it open.SD Card InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentSDC2_DATA328IOSD card SDIO busDATA31.8V signaling:VOLmax=0.45VVOHmin=1.4VVILmin=-0.3VVILmax=0.58VVIHmin=1.27VVIHmax=2.0V3.0V signaling:VOLmax=0.38VVOHmin=2.01VVILmin=-0.3VVILmax=0.76VVIHmin=1.72VVIHmax=3.34VSDIO signal level canbe selected accordingto SD card supportedlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.SDC2_DATA229IOSD card SDIO busDATA21.8V signaling:VOLmax=0.45VVOHmin=1.4VVILmin=-0.3VVILmax=0.58VVIHmin=1.27VVIHmax=2.0V3.0V signaling:VOLmax=0.38VVOHmin=2.01VVILmin=-0.3VVILmax=0.76VVIHmin=1.72VVIHmax=3.34VSDIO signal level canbe selected accordingto SD card supportedlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.SDC2_DATA130IOSD card SDIO busDATA11.8V signaling:VOLmax=0.45VVOHmin=1.4VVILmin=-0.3VVILmax=0.58VVIHmin=1.27VSDIO signal level canbe selected accordingto SD card supported

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-28 / 112VIHmax=2.0V3.0V signaling:VOLmax=0.38VVOHmin=2.01VVILmin=-0.3VVILmax=0.76VVIHmin=1.72VVIHmax=3.34Vlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.SDC2_DATA031IOSD card SDIO busDATA01.8V signaling:VOLmax=0.45VVOHmin=1.4VVILmin=-0.3VVILmax=0.58VVIHmin=1.27VVIHmax=2.0V3.0V signaling:VOLmax=0.38VVOHmin=2.01VVILmin=-0.3VVILmax=0.76VVIHmin=1.72VVIHmax=3.34VSDIO signal level canbe selected accordingto SD card supportedlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.SDC2_CLK32DOSD card SDIO busclock1.8V signaling:VOLmax=0.45VVOHmin=1.4V3.0V signaling:VOLmax=0.38VVOHmin=2.01VSDIO signal level canbe selected accordingto SD card supportedlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.SDC2_CMD33IOSD card SDIO buscommand1.8V signaling:VOLmax=0.45VVOHmin=1.4VVILmin=-0.3VVILmax=0.58VVIHmin=1.27VVIHmax=2.0V3.0V signaling:VOLmax=0.38VVOHmin=2.01VVILmin=-0.3VSDIO signal level canbe selected accordingto SD card supportedlevel, please refer toSD 3.0 protocol formore details.If unused, keep itopen.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-29 / 112VILmax=0.76VVIHmin=1.72VVIHmax=3.34VSD_INS_DET23DISD card insertiondetectVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.VDD_SDIO34POSD card SDIO buspull-up powerIOmax=50mA1.8V/2.85Vconfigurable. Cannotbe used for SD cardpower. If unused,keep it open.SGMII InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentEPHY_RST_N119DOEthernet PHY resetFor 1.8V:VOLmax=0.45VVOHmin=1.4VFor 2.85V:VOLmax=0.35VVOHmin=2.14V1.8V/2.85V powerdomain.If unused, keep itopen.EPHY_INT_N120DIEthernet PHYinterruptVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.SGMII_MDATA121IOSGMII MDIO(Management DataInput/Output) dataFor 1.8V:VOLmax=0.45VVOHmin=1.4VVILmax=0.58VVIHmin=1.27VFor 2.85V:VOLmax=0.35VVOHmin=2.14VVILmax=0.71VVIHmin=1.78V1.8V/2.85V powerdomain.If unused, keep itopen.SGMII_MCLK122DOSGMII MDIO(Management DataInput/Output) clockFor 1.8V:VOLmax=0.45VVOHmin=1.4VFor 2.85V:VOLmax=0.35VVOHmin=2.14V1.8V/2.85V powerdomain.If unused, keep itopen.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-30 / 112USIM2_VDD128POSGMII MDIO pull-uppower sourceConfigurable powersource.1.8V/2.85V powerdomain.External pull-up forSGMII MDIO pins.If unused, keep itopen.SGMII_TX_M123AOSGMII transmission- minusConnect with a 0.1uFcapacitor, close to thePHY side.If unused, keep itopen.SGMII_TX_P124AOSGMII transmission- plusConnect with a 0.1uFcapacitor, close to thePHY side.If unused, keep itopen.SGMII_RX_P125AISGMII receiving- plusConnect with a 0.1uFcapacitor, close toEC25 module.If unused, keep itopen.SGMII_RX_M126AISGMII receiving-minusConnect with a 0.1uFcapacitor, close toEC25 module.If unused, keep itopen.Wireless Connectivity InterfacesPin NamePin No.I/ODescriptionDC CharacteristicsCommentSDC1_DATA3129IOWLAN SDIO databus D3VOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.SDC1_DATA2130IOWLAN SDIO databus D2VOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-31 / 112SDC1_DATA1131IOWLAN SDIO databus D1VOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.SDC1_DATA0132IOWLAN SDIO databus D0VOLmax=0.45VVOHmin=1.35VVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.SDC1_CLK133DOWLAN SDIO busclockVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.SDC1_CMD134DOWLAN SDIO buscommandVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.PM_ENABLE127DOExternal powercontrolVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.WAKE_ON_WIRELESS135DIWake up the host(EC25 module) byFC20 moduleVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.Active low.If unused, keep itopen.WLAN_EN136DOWLAN functioncontrol via FC20moduleVOLmax=0.45VVOHmin=1.35V1.8V power domain.Active high.Cannot be pulled upbefore startup.If unused, keep itopen.COEX_UART_RX137DILTE/WLAN&BTcoexistence signalVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.Cannot be pulled upbefore startup.If unused, keep itopen.COEX_UART_TX138DOLTE/WLAN&BTcoexistence signalVOLmax=0.45VVOHmin=1.35V1.8V power domain.Cannot be pulled upbefore startup.If unused, keep itopen.WLAN_SLP_CLK118DOWLAN sleep clockIf unused, keep itopen.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-32 / 112BT_RTS*37DIBT UART request tosendVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.BT_TXD*38DOBT UART transmitdataVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.BT_RXD*39DIBT UART receivedataVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.BT_CTS*40DOBT UART clear tosendVOLmax=0.45VVOHmin=1.35V1.8V power domain.Cannot be pulled upbefore startup.If unused, keep itopen.BT_EN*139DOBT function controlvia the BT moduleVOLmax=0.45VVOHmin=1.35V1.8V power domain.If unused, keep itopen.RF InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentANT_DIV35AIDiversity antennapad50Ω impedanceIf unused, keep itopen.ANT_MAIN49IOMain antenna pad50Ω impedanceANT_GNSS47AIGNSS antenna pad50Ω impedanceIf unused, keep itopen.GPIO PinsPin NamePin No.I/ODescriptionDC CharacteristicsCommentWAKEUP_IN1DISleep mode controlVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.Cannot be pulled upbefore startup.Low level wakes upthe module.If unused, keep itopen.W_DISABLE#4DIAirplane modecontrolVILmin=-0.3VVILmax=0.6VVIHmin=1.2V1.8V power domain.Pull-up by default.At low voltage level,

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-33 / 1121. “*” means under development.2. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on theBT module.VIHmax=2.0Vmodule can enter intoairplane mode.If unused, keep itopen.AP_READY2DIApplicationprocessor sleepstate detectionVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.If unused, keep itopen.USB_BOOT InterfacePin NamePin No.I/ODescriptionDC CharacteristicsCommentUSB_BOOT115DIForce the module toenter intoemergencydownload modeVILmin=-0.3VVILmax=0.6VVIHmin=1.2VVIHmax=2.0V1.8V power domain.Cannot be pulled upbefore startup.It is recommended toreserve test point.RESERVED PinsPin NamePin No.I/ODescriptionDC CharacteristicsCommentRESERVED3, 18, 43,55, 73~84,113, 114,116, 117,140-144.ReservedKeep these pinsunconnected.NOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-34 / 1123.4. Operating ModesThe table below briefly summarizes the various operating modes referred in the following chapters.Table 5: Overview of Operating Modes3.5. Power Saving3.5.1. Sleep ModeEC25 is able to reduce its current consumption to a minimum value during the sleep mode. The followingsection describes power saving procedures of EC25 module.3.5.1.1. UART ApplicationIf the host communicates with module via UART interface, the following preconditions can let the moduleenter into sleep mode.Execute AT+QSCLK=1 command to enable sleep mode.Drive DTR to high level.ModeDetailsNormalOperationIdleSoftware is active. The module has registered on the network, and it isready to send and receive data.Talk/DataNetwork connection is ongoing. In this mode, the power consumption isdecided by network setting and data transfer rate.MinimumFunctionalityModeAT+CFUN command can set the module to a minimum functionality mode withoutremoving the power supply. In this case, both RF function and (U)SIM card will beinvalid.Airplane ModeAT+CFUN command or W_DISABLE# pin can set the module to airplane mode. Inthis case, RF function will be invalid.Sleep ModeIn this mode, the current consumption of the module will be reduced to the minimallevel. During this mode, the module can still receive paging message, SMS, voicecall and TCP/UDP data from the network normally.Power DownModeIn this mode, the power management unit shuts down the power supply. Software isnot active. The serial interface is not accessible. Operating voltage (connected toVBAT_RF and VBAT_BB) remains applied.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-35 / 112The following figure shows the connection between the module and the host.Figure 3: Sleep Mode Application via UARTDriving the host DTR to low level will wake up the module.When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 fordetails about RI behaviors.AP_READY will detect the sleep state of the host (can be configured to high level or low leveldetection). Please refer to AT+QCFG="apready"* command for details.“*” means under development.3.5.1.2. USB Application with USB Remote Wakeup FunctionIf the host supports USB suspend/resume and remote wakeup function, the following three preconditionsmust be met to let the module enter into the sleep mode.Execute AT+QSCLK=1 command to enable sleep mode.Ensure the DTR is held at high level or keep it open.The host’s USB bus, which is connected with the module’s USB interface, enters into suspendedstate.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-36 / 112The following figure shows the connection between the module and the host.Figure 4: Sleep Mode Application with USB Remote WakeupSending data to EC25 through USB will wake up the module.When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as towake up the host.3.5.1.3. USB Application with USB Suspend/Resume and RI FunctionIf the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal isneeded to wake up the host.There are three preconditions to let the module enter into the sleep mode.Execute AT+QSCLK=1 command to enable the sleep mode.Ensure the DTR is held at high level or keep it open.The host’s USB bus, which is connected with the module’s USB interface, enters into suspendedstate.The following figure shows the connection between the module and the host.Figure 5: Sleep Mode Application with RI

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-37 / 112Sending data to EC25 through USB will wake up the module.When EC25 has a URC to report, RI signal will wake up the host.3.5.1.4. USB Application without USB Suspend FunctionIf the host does not support USB suspend function, USB_VBUS should be disconnected via an additionalcontrol circuit to let the module enter into sleep mode.Execute AT+QSCLK=1 command to enable sleep mode.Ensure the DTR is held at high level or keep it open.Disconnect USB_VBUS.The following figure shows the connection between the module and the host.Figure 6: Sleep Mode Application without Suspend FunctionSwitching on the power switch to supply power to USB_VBUS will wake up the module.Please pay attention to the level match shown in dotted line between the module and the host. For moredetails about EC25 power management application, please refer to document [1].3.5.2. Airplane ModeWhen the module enters into airplane mode, the RF function does not work, and all AT commandscorrelative with RF function will be inaccessible. This mode can be set via the following ways.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-38 / 112Hardware:The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplanemode.Software:AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4.AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.AT+CFUN=1: Full functionality mode (by default).AT+CFUN=4: Airplane mode. RF function is disabled.1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled byAT+QCFG="airplanecontrol" command, and this command is under development.2. The execution of AT+CFUN command will not affect GNSS function.3.6. Power Supply3.6.1. Power Supply PinsEC25 provides four VBAT pins to connect with the external power supply, and there are two separatevoltage domains for VBAT.Two VBAT_RF pins for module’s RF partTwo VBAT_BB pins for module’s baseband partThe following table shows the details of VBAT pins and ground pins.Table 6: VBAT and GND PinsPin NamePin No.DescriptionMin.Typ.Max.UnitVBAT_RF57, 58Power supply for module’s RFpart3.33.84.3VVBAT_BB59, 60Power supply for module’sbaseband part3.33.84.3VGND8, 9, 19, 22, 36,46, 48, 50~54,56, 72, 85~112Ground-0-VNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-39 / 1123.6.2. Decrease Voltage DropThe power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage willnever drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2Gnetwork. The voltage drop will be less in 3G and 4G networks.Figure 7: Power Supply Limits during Burst TransmissionTo decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used,and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. Itis recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array,and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an externalapplication has to be a single voltage source and can be expanded to two sub paths with star structure.The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be noless than 2mm. In principle, the longer the VBAT trace is, the wider it will be.In addition, in order to get a stable power source, it is suggested that a zener diode whose reverse zenervoltage is 5.1V and dissipation power is more than 0.5W should be used. The following figure shows thestar structure of the power supply.Figure 8: Star Structure of the Power Supply

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-40 / 1123.6.3. Reference Design for Power SupplyPower design for the module is very important, as the performance of the module largely depends on thepower source. The power supply should be able to provide sufficient current up to 2A at least. If thevoltage drop between the input and output is not too high, it is suggested that an LDO should be used tosupply power for the module. If there is a big voltage difference between the input source and the desiredoutput (VBAT), a buck converter is preferred to be used as the power supply.The following figure shows a reference design for +5V input power source. The typical output of the powersupplyis about 3.8V and the maximum load current is 3A.Figure 9: Reference Circuit of Power SupplyIn order to avoid damaging internal flash, please do not switch off the power supply when the moduleworks normally. Only after the module is shutdown by PWRKEY or AT command, then the power supplycan be cut off.3.6.4. Monitor the Power SupplyAT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer todocument [2].3.7. Turn on and off Scenarios3.7.1. Turn on Module Using the PWRKEYThe following table shows the pin definition of PWRKEY.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-41 / 112Table 7: Pin Definition of PWRKEYWhen EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to alow level for at least 500ms. It is recommended to use an open drain/collector driver to control thePWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can bereleased. A simple reference circuit is illustrated in the following figure.Figure 10: Turn on the Module by Using Driving CircuitThe other way to control the PWRKEY is using a button directly. When pressing the key, electrostaticstrike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby thebutton for ESD protection. A reference circuit is shown in the following figure.Figure 11: Turn on the Module by Using ButtonPin NamePin No.I/ODescriptionCommentPWRKEY21DITurn on/off the moduleThe output voltage is 0.8V because ofthe diode drop in the Qualcomm chipset.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-42 / 112The turn on scenario is illustrated in the following figure.Figure 12: Timing of Turning on ModulePlease make sure that VBAT is stable before pulling down PWRKEY pin. The time between them shouldbe no no less than 30ms.3.7.2. Turn off ModuleThe following procedures can be used to turn off the module:Normal power down procedure: Turn off the module using the PWRKEY pin.Normal power down procedure: Turn off the module using AT+QPOWD command.3.7.2.1. Turn off Module Using the PWRKEY PinDriving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-downprocedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-43 / 112Figure 13: Timing of Turning off Module3.7.2.2. Turn off Module Using AT CommandIt is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off themodule via PWRKEY pin.Please refer to document [2] for details about AT+QPOWD command.1. Inorder to avoid damaging internal flash, please do not switch off the power supply when the moduleworks normally. Only after the module is shut down by PWRKEY or AT command, then the powersupply can be cut off.2. When turn off module with AT command, please keep PWRKEY at high level after the execution ofpower-off command. Otherwise the module will be turned on again after successfully turn-off.3.8. Reset the ModuleThe RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to alow level voltage for time between 150ms and 460ms.Table 8: RESET_N Pin DescriptionPin NamePin No.I/ODescriptionCommentRESET_N20DIReset the module1.8V power domainNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-44 / 112The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or buttoncan be used to control the RESET_N.Figure 14: Reference Circuit of RESET_N by Using Driving CircuitFigure 15: Reference Circuit of RESET_N by Using ButtonThe reset scenario is illustrated inthe following figure.Figure 16: Timing of Resetting Module

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-45 / 1121. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed.2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.3.9. (U)SIM InterfaceThe(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cardsare supported.Table 9: Pin Definition of the (U)SIM InterfaceEC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level andhigh level detections, and it is disabled by default. Please refer to document [2] for more details aboutAT+QSIMDET command.Pin NamePin No.I/ODescriptionCommentUSIM_VDD14POPower supply for (U)SIM cardEither 1.8V or 3.0V is supportedby the module automatically.USIM_DATA15IOData signal of (U)SIM cardUSIM_CLK16DOClock signal of (U)SIM cardUSIM_RST17DOReset signal of (U)SIM cardUSIM_PRESENCE13DI(U)SIM card insertion detectionUSIM_GND10Specified ground for (U)SIM cardNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-46 / 112The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card ConnectorIf (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the followingfigure.Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card ConnectorIn order to enhance the reliability and availability of the (U)SIM card in customers’ applications, pleasefollow the criteria below in (U)SIM circuit design:

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-47 / 112Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace lengthas less than 200mm as possible.Keep (U)SIM card signals away from RF and VBAT traces.Assure the ground between the module and the (U)SIM card connector short and wide. Keep thetrace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it asclose to (U)SIM card connector as possible. If the ground is complete on customers’ PCB,USIM_GND can be connected to PCB ground directly.To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other andshield them with surrounded ground.In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasiticcapacitance should not be more than 15pF. The 0Ω resistors should be added in series between themodule and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filteringinterference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the(U)SIM card connector.The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout traceand sensitive occasion are applied, and it should be placed close to the (U)SIM card connector.3.10. USB InterfaceEC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface isused for AT command communication, data transmission, GNSS NMEA sentences output, softwaredebugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USBinterface.Table 10: Pin Description of USB InterfaceFor more details about the USB 2.0 specifications, please visit http://www.usb.org/home.Pin NamePin No.I/ODescriptionCommentUSB_DP69IOUSB differential data bus (+)Require differentialimpedance of 90ΩUSB_DM70IOUSB differential data bus (-)Require differentialimpedance of 90ΩUSB_VBUS71PIUSB connection detectionTypical 5.0VGND72Ground

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-48 / 112The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. Thefollowing figure shows a reference circuit of USB interface.Figure 19: Reference Circuit of USB ApplicationA common mode choke L1 is recommended to be added in series between the module and customer’sMCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should beadded in series between the module and the test points so as to facilitate debugging, and the resistors arenot mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 componentsmust be placed close to the module, and also these resistors should be placed close to each other. Theextra stubs of trace must be as short as possible.The following principles should be complied with when design the USB interface, so as to meet USB 2.0specification.It is important to route the USB signal traces as differential pairs with total grounding. The impedanceof USB differential trace is 90Ω.Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It isimportant to route the USB differential traces in inner-layer with ground shielding on not only upperand lower layers but also right and left sides.Pay attention to the influence of junction capacitance of ESD protection components on USB datalines. Typically, the capacitance value should be less than 2pF.Keep the ESD protection components to the USB connector as close as possible.1. EC25 module can only be used as a slave device.2. “*” means under development.NOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-49 / 1123.11. UART InterfacesThe module provides two UART interfaces: the main UART interface and the debug UART interface. Thefollowing shows their features.The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps,230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. This interface isused for data transmission and AT command communication.The debug UART interface supports 115200bps baud rate. It is used for Linux console and logoutput.The following tables show the pin definition of the UART interfaces.Table 11: Pin Definition of Main UART InterfaceTable 12: Pin Definition of Debug UART InterfacePin NamePin No.I/ODescriptionCommentRI62DORing indicator1.8V power domainDCD63DOData carrier detectionCTS64DOClear to sendRTS65DIRequest to sendDTR66DIData terminal readyTXD67DOTransmit dataRXD68DIReceive dataPin NamePin No.I/ODescriptionCommentDBG_TXD12DOTransmit data1.8V power domainDBG_RXD11DIReceive data

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-50 / 112The logic levels are described in the following table.Table 13: Logic Levels of Digital I/OThe module provides 1.8V UART interface. A level translator should be used if customers’ application isequipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrumentsis recommended. The following figure shows a reference design.Figure 20: Reference Circuit with Translator ChipPlease visit http://www.ti.com for more information.Another example with transistor translation circuit is shown as below. The circuit design of dotted linesection can refer to the design of solid line section, in terms of both module’s input and output circuitdesigns, but please pay attention to the direction of connection.ParameterMin.Max.UnitVIL-0.30.6VVIH1.22.0VVOL00.45VVOH1.351.8V

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-51 / 112Figure 21: Reference Circuit with Transistor CircuitTransistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.3.12. PCM and I2C InterfacesEC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports thefollowing modes and one I2C interface:Primary mode (short frame synchronization, works as both master and slave)Auxiliary mode (long frame synchronization, works as master only)In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the risingedge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHzPCM_CLK at 16kHz PCM_SYNC.In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the risingedge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC.EC25 supports 16-bit linear data format. The following figures show the primary mode’s timingrelationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary mode’s timingrelationship with 8KHz PCM_SYNC and 256KHz PCM_CLK.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-52 / 112Figure 22: Primary Mode TimingFigure 23: Auxiliary Mode TimingThe following table shows the pin definition of PCM and I2C interfaces which can be applied on audiocodec design.Table 14: Pin Definition of PCM and I2C InterfacesPin NamePin No.I/ODescriptionCommentPCM_IN24DIPCM data input1.8V power domainPCM_OUT25DOPCM data output1.8V power domain

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-53 / 112Clock and mode can be configured by AT command, and the default configuration is master mode usingshort frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer todocument [2] for more details about AT+QDAI command.The following figure shows a reference design of PCM interface with external codec IC.Figure 24: Reference Circuit of PCM Application with Audio Codec1. It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially forPCM_CLK.2. EC25 works as a master device pertaining to I2C interface.3.13. SD Card InterfaceEC25 supports SDIO 3.0 interface for SD card.PCM_SYNC26IOPCM data framesynchronization signal1.8V power domainPCM_CLK27IOPCM data bit clock1.8V power domainI2C_SCL41ODI2C serial clockRequire external pull-up to 1.8VI2C_SDA42ODI2C serial dataRequire external pull-up to 1.8VNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-54 / 112The following table shows the pin definition of SD card interface.Table 15: Pin Definition of SD Card InterfacePin NamePin No.I/ODescriptionCommentSDC2_DATA328IOSD card SDIO bus DATA3SDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.SDC2_DATA229IOSD card SDIO bus DATA2SDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.SDC2_DATA130IOSD card SDIO bus DATA1SDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.SDC2_DATA031IOSD card SDIO bus DATA0SDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.SDC2_CLK32DOSD card SDIO bus clockSDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.SDC2_CMD33IOSD card SDIO bus commandSDIO signal level can beselected according to SDcard supported level,please refer to SD 3.0protocol for more details.If unused, keep it open.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-55 / 112The following figure shows a reference design of SD card.Figure 25: Reference Circuit of SD cardIn SD card interface design, in order to ensure good communication performance with SD card, thefollowing design principles should be complied with:SD_INS_DET must be connected.The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8Ashould be provided. As the maximum output current of VDD_SDIO is 50mA which can only be usedfor SDIO pull-up resistors, an externally power supply is needed for SD card.To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of theseresistors is among 10KΩ~100KΩ and the recommended value is 100KΩ. VDD_SDIO should be usedas the pull-up power.In order to adjust signal quality, it is recommended to add 0Ω resistors R1~R6 in series between themodule and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. Allresistors and bypass capacitors should be placed close to the module.In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins nearthe SD card connector with junction capacitance less than 15pF.Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,etc., as well as noisy signals such as clock signals, DCDC signals, etc.It is important to route the SDIO signal traces with total grounding. The impedance of SDIO datatrace is 50Ω (±10%).VDD_SDIO34POSD card SDIO bus pull up power1.8V/2.85V configurable.Cannot be used for SDcard power. If unused,keep it open.SD_INS_DET23DISD card insertion detection1.8V power domain.If unused, keep it open.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-56 / 112Make sure the adjacent trace spacing is two times of the trace width and the load capacitance ofSDIO bus should be less than 15pF.It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mmand the total routing length less than 50mm. The total trace length inside the module is 27mm, so theexterior total trace length should be less than 23mm.3.14. ADC InterfacesThe module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can beused to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltagevalue on ADC1 pin. For more details about these AT commands, please refer to document [2].In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.Table 16: Pin Definition of ADC InterfacesThe following table describes the characteristic of ADC function.Table 17: Characteristic of ADC1. ADC input voltage must not exceed VBAT_BB.2. It is prohibited to supply any voltage to ADC pins when VBAT is removed.Pin NamePin No.DescriptionADC045General purpose analog to digital converterADC144General purpose analog to digital converterParameterMin.Typ.Max.UnitADC0 Voltage Range0.3VBAT_BBVADC1 Voltage Range0.3VBAT_BBVADC Resolution15BitsNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-57 / 1123. It is recommended to use a resistor divider circuit for ADC application.3.15. Network Status IndicationThe network indication pins can be used to drive network status indication LEDs. The module providestwo pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition andlogic level changes in different network status.Table 18: Pin Definition of Network Connection Status/Activity IndicatorTable 19: Working State of the Network Connection Status/Activity IndicatorA reference circuit is shown in the following figure.Pin NamePin No.I/ODescriptionCommentNET_MODE5DOIndicate the module networkregistration mode.1.8V power domainCannot be pulled upbefore startupNET_STATUS6DOIndicate the module network activitystatus.1.8V power domainPin NameLogic Level ChangesNetwork StatusNET_MODEAlways HighRegistered on LTE networkAlways LowOthersNET_STATUSFlicker slowly (200ms High/1800ms Low)Network searchingFlicker slowly (1800ms High/200ms Low)IdleFlicker quickly (125ms High/125ms Low)Data transfer is ongoingAlways HighVoice calling

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-58 / 112Figure 26: Reference Circuit of the Network Indicator3.16. STATUSThe STATUS pin is an open drain output for indicating the module’s operation status. It can be connectedto a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turnedon normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedancestate.Table 20: Pin Definition of STATUSThe following figure shows different circuit designs of STATUS, and customers can choose either oneaccording to customers’ application demands.Pin NamePin No.I/ODescriptionCommentSTATUS61ODIndicate the module’s operation statusAn external pull-up resistoris required.If unused, keep it open.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-59 / 112Figure 27: Reference Circuits of STATUS3.17. Behaviors of RIAT+QCFG="risignaltype","physical" command can be used to configure RI behavior.No matter on which port URC is presented, URC will trigger the behavior of RI pin.URC can be outputted from UART port, USB AT port and USB modem port through configuration viaAT+QURCCFG command. The default port is USB AT port.In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.Table 21: Behavior of RIThe RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2]for details.3.18. SGMII InterfaceEC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, keyfeatures of the SGMII interface are shown below:IEEE802.3 complianceSupport 10M/100M/1000M Ethernet work modeSupport maximum 150Mbps (DL)/50Mbps (UL) for 4G networkSupport VLAN taggingSupport IEEE1588 and Precision Time Protocol (PTP)Can be used to connect to external Ethernet PHY like AR8033, or to an external switchStateResponseIdleRI keeps at high levelURCRI outputs 120ms low pulse when a new URC returnsNOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-60 / 112Management interfaces support dual voltage 1.8V/2.85VThe following table shows the pin definition of SGMII interface.Table 22: Pin Definition of the SGMII InterfaceThe following figure shows the simplified block diagram for Ethernet application.Figure 28: Simplified Block Diagram for Ethernet ApplicationPin NamePin No.I/ODescriptionCommentControl Signal PartEPHY_RST_N119DOEthernet PHY reset1.8V/2.85V power domainEPHY_INT_N120DIEthernet PHY interrupt1.8V power domainSGMII_MDATA121IOSGMII MDIO (Management DataInput/Output) data1.8V/2.85V power domainSGMII_MCLK122DOSGMII MDIO (Management DataInput/Output) clock1.8V/2.85V power domainUSIM2_VDD128POSGMII MDIO pull-up power sourceConfigurable power source.1.8V/2.85V power domain.External pull-up power source forSGMII MDIO pins.SGMII Signal PartSGMII_TX_M123AOSGMII transmission-minusConnect with a 0.1uF capacitor,close to the PHY side.SGMII_TX_P124AOSGMII transmission-plusConnect with a 0.1uF capacitor,close to the PHY side.SGMII_RX_P125AISGMII receiving-plusConnect with a 0.1uF capacitor,close to EC25 module.SGMII_RX_M126AISGMII receiving-minusConnect with a 0.1uF capacitor,close to EC25 module.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-61 / 112The following figure shows a reference design of SGMII interface with PHY AR8033 application.Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 ApplicationIn order to enhance the reliability and availability in customers’ applications, please follow the criteriabelow in the Ethernet PHY circuit design:Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits,analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc.Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than20mil.The differential impedance of SGMII data trace is 100Ω±10%, and the reference ground of the areashould be complete.Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and thesame to the adjacent signal traces.3.19. Wireless Connectivity InterfacesEC25 supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.The following table shows the pin definition of wireless connectivity interfaces.Table 23: Pin Definition of Wireless Connectivity InterfacesPin NamePin No.I/ODescriptionComment

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-62 / 112WLAN PartSDC1_DATA3129IOWLAN SDIO data bus D31.8V power domainSDC1_DATA2130IOWLAN SDIO data bus D21.8V power domainSDC1_DATA1131IOWLAN SDIO data bus D11.8V power domainSDC1_DATA0132IOWLAN SDIO data bus D01.8V power domainSDC1_CLK133DOWLAN SDIO bus clock1.8V power domainSDC1_CMD134IOWLAN SDIO bus command1.8V power domainWLAN_EN136DOWLAN function control via FC20module.1.8V power domain.Active high.Cannot be pulled upbefore startup.Coexistence and Control PartPM_ENABLE127DOExternal power control1.8V power domainActive high.WAKE_ON_WIRELESS135DIWake up the host (EC25 module) byFC20 module1.8V power domainCOEX_UART_RX137DILTE/WLAN&BT coexistence signal1.8V power domain.Cannot be pulled upbefore startup.COEX_UART_TX138DOLTE/WLAN&BT coexistence signal1.8V power domain.Cannot be pulled upbefore startup.WLAN_SLP_CLK118DOWLAN sleep clockBT Part*BT_RTS*37DIBT UART request to send1.8V power domainBT_TXD*38DOBT UART transmit data1.8V power domainBT_RXD*39DIBT UART receive data1.8V power domainBT_CTS*40DOBT UART clear to send1.8V power domain.Cannot be pulled upbefore startup.PCM_IN1)24DIPCM data input1.8V power domainPCM_OUT1)25DOPCM data output1.8V power domainPCM_SYNC1)26IOPCM data frame synchronizationsignal1.8V power domainPCM_CLK1)27IOPCM data bit clock1.8V power domain

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-63 / 112The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20module.Figure 30: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module1. FC20 module can only be used as a slave device.2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used tooutput signals.3. For more information about wireless connectivity interfaces, please refer to document [5].4. “*” means under development.5. 1) Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BTmodule.3.19.1. WLAN InterfaceEC25 provides a low power SDIO 3.0 interface and control interface for WLAN design.SDIO interface supports the SDR mode (up to 50MHz).As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with theBT_EN*139DOBT function control via BT module.1.8V power domainActive high.NOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-64 / 112SDIO 3.0 specification, please comply with the following principles:It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signaltrace is 50Ω±10%.Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,etc., as well as noisy signals such as clock signals, DCDC signals, etc.It is recommended to keep matching length between CLK andDATA/CMD less than 1mm and totalrouting length less than 50mm.Keep termination resistors within 15Ω~24Ω on clock lines near the module and keep the routedistance from the module clock pins to termination resistors less than 5mm.Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than15pF.3.19.2. BT Interface*EC25 supports a dedicated UART interface and a PCM interface for BT application.Further information about BT interface will be added in future version of this document.“*” means under development.3.20. USB_BOOT InterfaceEC25 provides a USB_BOOT pin. Developers can pull up USB_BOOT to VDD_EXT before powering onthe module, thus the module will enter into emergency download mode when powered on. In this mode,the module supports firmware upgrade over USB interface.Table 24: Pin Definition of USB_BOOT InterfaceThe following figure shows a reference circuit of USB_BOOT interface.Pin NamePin No.I/ODescriptionCommentUSB_BOOT115DIForce the module enter intoemergency download mode1.8V power domain.Active high.It is recommended toreserve test point.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 3-65 / 112Figure 31: Reference Circuit of USB_BOOT Interface

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 4-66 / 1124GNSS Receiver4.1. General DescriptionEC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite ofQualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate viaUSB interface by default.By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For moredetails about GNSS engine technology and configurations, please refer to document [3].4.2. GNSS PerformanceThe following table shows GNSS performance of EC25.Table 25: GNSS PerformanceParameterDescriptionConditionsTyp.UnitSensitivity(GNSS)Cold startAutonomous-146dBmReacquisitionAutonomous-157dBmTrackingAutonomous-157dBmTTFF(GNSS)Cold start@open skyAutonomous35sXTRA enabled18sWarm start@open skyAutonomous26sXTRA enabled2.2sHot startAutonomous2.5s

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 4-67 / 1121. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keepon positioning for 3 minutes.2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module canfix position again within 3 minutes after loss of lock.3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixesposition within 3 minutes after executing cold start command.4.3. Layout GuidelinesThe following layout guidelines should be taken into account in customers’ designs.Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.Digital circuits such as (U)SIM card, USB interface, camera module and display connector should bekept away from the antennas.Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanarisolation and protection.Keep 50Ω characteristic impedance for the ANT_GNSS trace.Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information.@open skyXTRA enabled1.8sAccuracy(GNSS)CEP-50Autonomous@open sky<1.5mNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-68 / 1125Antenna InterfacesEC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which isused to resist the fall of signals caused by high speed movement and multipath effect, and a GNSSantenna interface. The impedance of the antenna port is 50Ω.5.1. Main/Rx-diversity Antenna Interfaces5.1.1. Pin DefinitionThe pin definition of main antenna and Rx-diversityantenna interfaces is shown below.Table 26: Pin Definition of RF Antenna5.1.2. Operating FrequencyTable 27: Module Operating FrequenciesPin NamePin No.I/ODescriptionCommentANT_MAIN49IOMain antenna pad50Ω impedanceANT_DIV35AIReceive diversity antenna pad50Ω impedanceIf unused, keep itopen.3GPP BandTransmitReceiveUnitGSM850824~849869~894MHzEGSM900880~915925~960MHzDCS18001710~17851805~1880MHzPCS19001850~19101930~1990MHzWCDMA B11920~19802110~2170MHz

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-69 / 112WCDMA B21850~19101930~1990MHzWCDMA B41710~17552110~2155MHzWCDMA B5824~849869~894MHzWCDMA B6830~840875~885MHzWCDMA B8880~915925~960MHzWCDMA B19830~845875~890MHzLTE FDD B11920~19802110~2170MHzLTE FDD B21850~19101930~1990MHzLTE FDD B31710~17851805~1880MHzLTE FDD B41710~17552110~2155MHzLTE FDD B5824~849869~894MHzLTE FDD B72500~25702620~2690MHzLTE FDD B8880~915925~960MHzLTE FDD B12699~716729~746MHzLTE FDD B13777~787746~756MHZLTE FDD B14788~798758~768MHZLTE FDD B18815~830860~875MHzLTE FDD B19830~845875~890MHzLTE FDD B20832~862791~821MHzLTE FDD B28703~748758~803MHzLTE TDD B382570~26202570~2620MHzLTE TDD B402300~24002300~2400MHzLTE TDD B412555~26552555~2655MHzLTE TDD B661710~17802100~2200MHzLTE TDD B71663~698617~652MHz

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-70 / 1125.1.3. Reference Design of RF Antenna InterfaceAreference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matchingcircuit should be reserved for better RF performance. The capacitors are not mounted by default.Figure 32: Reference Circuit of RF Antenna Interface1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve thereceiving sensitivity.2. ANT_DIV function is enabled by default.3. Place the π-type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna aspossible.5.1.4. Reference Design of RF LayoutFor user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. Theimpedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,the distance between signal layer and reference ground (H), and the clearance between RF trace andground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristicimpedance control. The following are reference designs of microstrip line or coplanar waveguide line withdifferent PCB structuresNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-71 / 112.Figure 33: Microstrip Line Design on a 2-layer PCBFigure 34: Coplanar Waveguide Line Design on a 2-layer PCBFigure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-72 / 112Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)In order to ensure RF performance and reliability, the following principles should be complied with in RFlayout design:Please use an impedance simulation tool to control the characteristic impedance of RF traces as50Ω.The GND pins adjacent to RF pins should not be designed as thermal relief pads, and they should befully connected to ground.The distance between the RF pins and the RF connector should be as short as possible, and all theright angle traces should be changed to curved ones.There should be clearance area under the signal pin of the antenna connector or solder joint.The reference ground of RF traces should be complete. Meanwhile, adding some ground vias aroundRF traces and the reference ground could help to improve RF performance. The distance betweenthe ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).For more details about RF layout, please refer to document [6].5.2. GNSS Antenna InterfaceThe following tables show pin definition and frequency specification of GNSS antenna interface.Table 28: Pin Definition of GNSS Antenna InterfacePin NamePin No.I/ODescriptionCommentANT_GNSS47AIGNSS antenna50Ω impedanceIf unused, keep it open.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-73 / 112Table 29: GNSS FrequencyA reference design of GNSS antenna is shown as below.Figure 37: Reference Circuit of GNSS Antenna1. An external LDO can be selected to supply power according to the active antenna requirement.2. If the module is designed with a passive antenna, then the VDD circuit is not needed.TypeFrequencyUnitGPS/Galileo/QZSS1575.42±1.023MHzGLONASS1597.5~1605.8MHzBeiDou1561.098±2.046MHzNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-74 / 1125.3. Antenna Installation5.3.1. Antenna RequirementThe following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.Table 30: Antenna Requirements1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use ofactive antenna may generate harmonics which will affect the GNSS performance.TypeRequirementsGNSS1)Frequency range: 1561MHz~1615MHzPolarization: RHCP or linearVSWR: < 2 (Typ.)Passive antenna gain: > 0dBiActive antenna noise figure: < 1.5dBActive antenna gain: > 0dBiActive antenna embedded LNA gain: < 17 dBGSM/WCDMA/LTEVSWR: ≤ 2Efficiency: > 30%Max Input Power: 50WInput Impedance: 50ΩCable Insertion Loss: < 1dB(GSM850, GSM 900, WCDMA B5/B6/B8/B19,LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71)Cable Insertion Loss: < 1.5dB(DCS1800, PCS1900, WCDMA B1/B2/B4,LTE-FDD B1/B2/B3/B4/B66)Cable Insertion loss: < 2dB(LTE-FDD B7, LTE-TDD B38/B40/B41)NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-75 / 1125.3.2. Recommended RF Connector for Antenna InstallationIf RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connectorprovided by Hirose.Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm)U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.Figure 39: Mechanicals of U.FL-LP Connectors

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 5-76 / 112The following figure describes the space factor of mated connector.Figure 40: Space Factor of Mated Connector (Unit: mm)For more details, please visit http://hirose.com.

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-77 / 1126Electrical, Reliability and RadioCharacteristics6.1. Absolute Maximum RatingsAbsolute maximum ratings for power supply and voltage on digital and analog pins of the module arelisted in the following table.Table 31: Absolute Maximum RatingsParameterMin.Max.UnitVBAT_RF/VBAT_BB-0.34.7VUSB_VBUS-0.35.5VPeak Current of VBAT_BB00.8APeak Current of VBAT_RF01.8AVoltage at Digital Pins-0.32.3VVoltage at ADC00VBAT_BBVVoltage at ADC10VBAT_BBV

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-78 / 1126.2. Power Supply RatingsTable 32: The Module Power Supply Ratings6.3. Operation and Storage TemperaturesThe operation and storage temperatures are listed in the following table.Table 33: Operation and Storage Temperatures1. 1) Within operation temperature range, the module is 3GPP compliant.2. 2) Within extended temperature range, the module remains the ability to establish and maintain avoice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. Thereare also no effects on radio spectrum and no harm to radio network. Only one or more parameterslike Pout might reduce in their value and exceed the specified tolerances. When the temperatureParameterDescriptionConditionsMin.Typ.Max.UnitVBATVBAT_BB andVBAT_RFThe actual input voltagesmust stay between theminimum and maximumvalues.3.33.84.3VVoltage drop duringburst transmissionMaximum power controllevel on EGSM900.400mVIVBATPeak supply current(during transmissionslot)Maximum power controllevel on EGSM900.1.82.0AUSB_VBUSUSB detection3.05.05.25VParameterMin.Typ.Max.UnitOperationTemperature Range1)-35+25+75ºCExtended Operation Range2)-40+85ºCStorage Temperature Range-40+90ºCNOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-79 / 112returns to the normal operating temperature levels, the module will meet 3GPP specifications again.6.4. Current ConsumptionThe values of current consumption are shown below.Table 34: EC25-E Current ConsumptionParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down11uASleep stateAT+CFUN=0 (USB disconnected)1.16mAGSM DRX=2 (USB disconnected)2.74mAGSM DRX=9 (USB disconnected)2.0mAWCDMA PF=64 (USB disconnected)2.15mAWCDMA PF=128 (USB disconnected)1.67mALTE-FDD PF=64 (USB disconnected)2.60mALTE-FDD PF=128 (USB disconnected)1.90mALTE-TDD PF=64 (USB disconnected)2.79mALTE-TDD PF=128 (USB disconnected)2.00mAIdle stateGSM DRX=5 (USB disconnected)19.5mAGSM DRX=5 (USB connected)29.5mAWCDMA PF=64 (USB disconnected)21.0mAWCDMA PF=64 (USB connected)31.0mALTE-FDD PF=64 (USB disconnected)20.7mALTE-FDD PF=64 (USB connected)30.8mALTE-TDD PF=64 (USB disconnected)20.8mALTE-TDD PF=64 (USB connected)32.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-80 / 112GPRS datatransfer(GNSS OFF)EGSM900 4DL/1UL @33.22dBm271.0mAEGSM900 3DL/2UL @33.0dBm464.0mAEGSM900 2DL/3UL @30.86dBm524.0mAEGSM900 1DL/4UL @29.58dBm600mADCS1800 4DL/1UL @29.92dBm192.0mADCS1800 3DL/2UL @29.84dBm311.0mADCS1800 2DL/3UL @29.67dBm424.0mADCS1800 1DL/4UL @29.48dBm539.0mAEDGE datatransfer(GNSS OFF)EGSM900 4DL/1UL PCL=8 @27.40dBm174.0mAEGSM900 3DL/2UL PCL=8 @27.24dBm281.0mAEGSM900 2DL/3UL PCL=8 @27.11dBm379.0mAEGSM900 1DL/4UL PCL=8 @26.99dBm480.0mADCS1800 4DL/1UL PCL=2 @25.82dBm159.0mADCS1800 3DL/2UL PCL=2 @25.85dBm251.0mADCS1800 2DL/3UL PCL=2 @25.68dBm340.0mADCS1800 1DL/4UL PCL=2 @25.57dBm433.0mAWCDMAdatatransfer(GNSS OFF)WCDMA B1 HSDPA @22.47dBm613.0mAWCDMA B1 HSUPA @22.44dBm609.0mAWCDMA B5 HSDPA @23.07dBm671.0mAWCDMA B5 HSUPA @23.07dBm669.0mAWCDMA B8 HSDPA @22.67dBm561.0mAWCDMA B8 HSUPA @22.39dBm557.0mALTE datatransfer(GNSS OFF)LTE-FDD B1 @23.27dBm754.0mALTE-FDD B3 @23.54dBm774.0mALTE-FDD B5 @22.83dBm762.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-81 / 112Table 35: EC25-A Current ConsumptionLTE-FDD B7 @23.37dBm842.0mALTE-FDD B8 @23.48dBm720.0mALTE-FDD B20 @22.75dBm714.0mALTE-TDD B38 @23.05dBm481.0mALTE-TDD B40 @23.17dBm431.8mALTE-TDD B41 @23.02dBm480.0mAGSMvoice callEGSM900 PCL=5 @33.08dBm264.0mADCS1800 PCL=0 @29.75dBm190.0mAWCDMA voicecallWCDMA B1 @23.22dBm680.0mAWCDMA B5 @23.18dBm677.0mAWCDMA B8 @23.54dBm618.0mAParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down10uASleep stateAT+CFUN=0 (USB disconnected)1.1mAWCDMA PF=64 (USB disconnected)1.8mAWCDMA PF=128 (USB disconnected)1.5mALTE-FDD PF=64 (USB disconnected)2.2mALTE-FDD PF=128 (USB disconnected)1.6mAIdle stateWCDMA PF=64 (USB disconnected)21.0mAWCDMA PF=64 (USB connected)31.0mALTE-FDD PF=64 (USB disconnected)21.0mALTE-FDD PF=64 (USB connected)31.0mAWCDMAdatatransferWCDMA B2 HSDPA @21.9dBm591.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-82 / 112Table 36: EC25-V Current ConsumptionWCDMA B2 HSUPA @21.62dBm606.0mAWCDMA B4 HSDPA @22.02dBm524.0mAWCDMA B4 HSUPA @21.67dBm540.0mAWCDMA B5 HSDPA @22.71dBm490.0mAWCDMA B5 HSUPA @22.58dBm520.0mALTE datatransfer(GNSS OFF)LTE-FDD B2 @22.93dBm715.0mALTE-FDD B4 @22.96dBm738.0mALTE-FDD B12 @23.35dBm663.0mAWCDMA voicecallWCDMA B2 @22.93dBm646.0mAWCDMA B4 @23dBm572.0mAWCDMA B5 @23.78dBm549.0mAParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down10uASleep stateAT+CFUN=0 (USB disconnected)0.85mALTE-FDD PF=64 (USB disconnected)2.0mALTE-FDD PF=128 (USB disconnected)1.5mAIdle stateLTE-FDD PF=64 (USB disconnected)20.0mALTE-FDD PF=64 (USB connected)31.0mAWCDMA B2 HSUPA @21.62dBm606.0mAWCDMA B4 HSDPA @22.02dBm524.0mAWCDMA B4 HSUPA @21.67dBm540.0mAWCDMA B5 HSDPA @22.71dBm490.0mAWCDMA B5 HSUPA @22.58dBm520.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-83 / 112Table 37: EC25-J Current ConsumptionLTEdatatransfer(GNSS OFF)LTE-FDD B4 @23.14dBm770.0mALTE-FDD B13 @23.48dBm531.0mAParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down10uASleep stateAT+CFUN=0 (USB disconnected)1.1mAWCDMA PF=64 (USB disconnected)1.9mAWCDMA PF=128 (USB disconnected)1.5mALTE-FDD PF=64 (USB disconnected)2.5mALTE-FDD PF=128 (USB disconnected)1.8mALTE-TDD PF=64 (USB disconnected)2.6mALTE-TDD PF=128 (USB disconnected)1.9mAIdle stateWCDMA PF=64 (USB disconnected)21.0mAWCDMA PF=64 (USB connected)31.0mALTE-FDD PF=64 (USB disconnected)21.0mALTE-FDD PF=64 (USB connected)32.0mALTE-TDD PF=64 (USB disconnected)21.0mALTE-TDD PF=64 (USB connected)32.0mAWCDMAdatatransfer(GNSS OFF)WCDMA B1 HSDPA @22.32dBm550.0mAWCDMA B1 HSUPA @22.64dBm516.0mAWCDMA B6 HSDPA @22.02dBm524.0mAWCDMA B6 HSUPA @22.33dBm521.0mAWCDMA B19 HSDPA @22.67dBm517.0mAWCDMA B19 HSUPA @22.33dBm522.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-84 / 112Table 38: EC25-AU Current ConsumptionLTEdatatransfer(GNSS OFF)LTE-FDD B1 @23.16dBm685.0mALTE-FDD B3 @23.22dBm766.0mALTE-FDD B8 @23.22dBm641.0mALTE-FDD B18 @23.35dBm661.0mALTE-FDD B19 @23.16dBm677.0mALTE-FDD B26 @22.87dBm690.0mALTE-TDD B41 @22.42dBm439.0mAWCDMA voicecallWCDMA B1 @22.33dBm605.0mAWCDMA B6 @23.28dBm549.0mAWCDMA B19 @23.28dBm549.0mAParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down11uASleep stateAT+CFUN=01.3mAAT+CFUN=0 (USB disconnected)1.46mAGSM850 DRX=5 (USB disconnected)1.8mAEGSM900 DRX=5 (USB disconnected)2.0mADCS1800 DRX=5 (USB disconnected)1.9mAPCS1900 DRX=5 (USB disconnected)1.9mAWCDMA PF=64 (USB disconnected)2.0mAWCDMA PF=128 (USB disconnected)1.6mALTE-FDD PF=64 (USB disconnected)2.2mALTE-FDD PF=128 (USB disconnected)1.6mALTE-TDD PF=64 (USB disconnected)2.3mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-85 / 112LTE-TDD PF=128 (USB disconnected)1.6mAIdle stateEGSM900 DRX=5 (USB disconnected)22.0mAEGSM900 DRX=5 (USB connected)34.0mAWCDMA PF=64 (USB disconnected)22.0mAWCDMA PF=64 (USB connected)33.0mALTE-FDD PF=64 (USB disconnected)24.0mALTE-FDD PF=64 (USB connected)35.0mALTE-TDD PF=64 (USB disconnected)24.0MaLTE-TDD PF=64 (USB connected)35.0mAGPRS datatransfer(GNSS OFF)GSM850 1UL/4DL @32.53dBm232.0mAGSM850 2UL/3DL @32.34dBm384.0mAGSM850 3UL/2DL @30.28dBm441.0mAGSM850 4UL/1DL @29.09dBm511.0mAEGSM900 1UL/4DL @32.34dBm241.0mAEGSM900 2UL/3DL @32.19dBm397.0mAEGSM900 3UL/2DL @30.17dBm459.0mAEGSM900 4UL/1DL @28.96dBm533.0mADCS1800 1UL/4DL @29.71dBm183.0mADCS1800 2UL/3DL @29.62dBm289.0mADCS1800 3UL/2DL @29.49dBm392.0mADCS1800 4UL/1DL @29.32dBm495.0mAPCS1900 1UL/4DL @29.61dBm174.0mAPCS1900 1UL/4DL @29.48dBm273.0mAPCS1900 1UL/4DL @29.32dBm367.0mAPCS1900 1UL/4DL @29.19dBm465.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-86 / 112EDGE datatransfer(GNSS OFF)GSM850 1UL/4DL @27.09dBm154.0mAGSM850 2UL/3DL @26.94dBm245.0mAGSM850 3UL/2DL @26.64dBm328.0mAGSM850 4UL/1DL @26.53dBm416.0mAEGSM900 1UL/4DL @26.64dBm157.0mAEGSM900 2UL/3DL @26.95dBm251.0mAEGSM900 3UL/2DL @26.57dBm340.0mAEGSM900 4UL/1DL @26.39dBm431.0mADCS18001 UL/4DL @26.03dBm152.0mADCS1800 2UL/3DL @25.62dBm240.0mADCS1800 3UL/2DL @25.42dBm325.0mADCS1800 4UL/1DL @25.21dBm415.0mAPCS1900 1UL/4DL @25.65dBm148.0mAPCS1900 1UL/4DL @25.63dBm232.0mAPCS1900 1UL/4DL @25.54dBm313.0mAPCS1900 1UL/4DL @25.26dBm401.0mAWCDMA data(GNSS OFF)WCDMA B1 HSDPA @22.34dBm625.0mAWCDMA B1 HSUPA @21.75dBm617.0mAWCDMA B2 HSDPA @22.51dBm610.0mAWCDMA B2 HSUPA @22. 14dBm594.0mAWCDMA B5 HSDPA @22.98dBm576.0mAWCDMA B5 HSUPA @22.89dBm589.0mAWCDMA B8 HSDPA @22.31dBm556.0mAWCDMA B8 HSUPA @22.11dBm572.0mALTEdatatransferLTE-FDD B1 @23.28dBm817.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-87 / 112Table 39: EC25-AUT Current ConsumptionLTE-FDD B2 @23.34dBm803.0mALTE-FDD B3 @23.2dBm785.0mALTE-FDD B4 @22.9dBm774.0mALTE-FDD B5 @23.45dBm687.0mALTE-FDD B7 @22.84dBm843.0mALTE-FDD B8 @22.92dBm689.0mALTE-FDD B28 @23.23dBm804.0mALTE-TDD B40 @23.3dBm429.0mAGSM voicecallGSM850 PCL5 @32.66dBm228.0mAEGSM900 PCL5 @32.59dBm235.0mADCS1800 PCL0 @29.72dBm178.0mAPCS1900 PCL0 @29.82dBm170.0mAWCDMAvoice callWCDMA B1 @23.27dBm687.0mAWCDMA B2 @23.38dBm668.0mAWCDMA B5 @23.38dBm592.0mAWCDMA B8 @23.32dBm595.0mAParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down10uASleep stateAT+CFUN=0 (USB disconnected)1.0mAWCDMA PF=64 (USB disconnected)1.9mAWCDMA PF=128 (USB disconnected)1.5mALTE-FDD PF=64 (USB disconnected)2.3mALTE-FDD PF=128 (USB disconnected)1.9mAIdle stateWCDMA PF=64 (USB disconnected)23.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-88 / 112Table 40: EC25-AF Current ConsumptionParameterDescriptionConditionsTyp.UnitIVBATOFF statePower down10uASleep stateAT+CFUN=0 (USB disconnected)1.0mAWCDMA PF=64 (USB disconnected)1.8mAWCDMA PF=128 (USB disconnected)1.4mALTE-FDD PF=64 (USB disconnected)2.2mAWCDMA PF=64 (USB connected)33.0mALTE-FDD PF=64 (USB disconnected)17.0mALTE-FDD PF=64 (USB connected)29.0mALTE-TDD PF=64 (USB disconnected)21.0mALTE-TDD PF=64 (USB connected)32.0mAWCDMAdatatransfer(GNSS OFF)WCDMA B1 HSDPA @22.24dBm500.0mAWCDMA B1 HSUPA @22.05dBm499.0mAWCDMA B5 HSDPA @22.39dBm418.0mAWCDMA B5 HSUPA @22dBm486.0mALTEdatatransfer(GNSS OFF)LTE-FDD B1 @23.28dBm707.0mALTE-FDD B3 @23.36dBm782.0mALTE-FDD B5 @23.32dBm588.0mALTE-FDD B7 @23.08dBm692.0mALTE-FDD B28-A @23.37dBm752.0mALTE-FDD B28-B @23.48dBm770.0mAWCDMA voicecallWCDMA B1 @23.22dBm546.0mAWCDMA B5 @23.01dBm511.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-89 / 112LTE-FDD PF=128 (USB disconnected)1.8mAIdle stateWCDMA PF=64 (USB disconnected)23.3mAWCDMA PF=64 (USB connected)33.4mALTE-FDD PF=64 (USB disconnected)17.6mALTE-FDD PF=64 (USB connected)29.4mAWCDMAdatatransfer(GNSS OFF)WCDMA B2 HSDPA @22.36dBm509.0mAWCDMA B2 HSUPA @22.27dBm511.0mAWCDMA B4 HSDPA @22.22dBm521.0mAWCDMA B4 HSUPA @22.31dBm518.0mAWCDMA B5 HSDPA @22.39dBm496.0mAWCDMA B5 HSUPA @22dBm502.0mALTEdatatransfer(GNSS OFF)LTE-FDD B2 @23.2dBm600.0mALTE-FDD B4 @23.85dBm634.0mALTE-FDD B5 @23.0dBm600.0mALTE-FDD B12 @23.08dBm692.0mALTE-FDD B13 @23.1dBm660.0mALTE-FDD B14 @23.5dBm676.0mALTE-FDD B66 @22.9dBm662.0mALTE-FDD B71 @22.88dBm600.0mAWCDMA voicecallWCDMA B2 @23.24dBm570.0mAWCDMA B4 @23.2dBm581.0mAWCDMA B5 @23.4dBm500.0mA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-90 / 112Table 41: GNSS Current Consumption of EC25 Series Module6.5. RF Output PowerThe following table shows the RF output power of EC25 module.Table 42: RF Output PowerIn GPRS 4 slots TX mode, the maximum output power is reduced by 3dB. The design conforms to theGSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.ParameterDescriptionConditionsTyp.UnitIVBAT(GNSS)Searching(AT+CFUN=0)Cold start @Passive Antenna54.0mALost state @Passive Antenna53.9mATracking(AT+CFUN=0)Instrument Environment30.5mAOpen Sky @Passive Antenna33.2mAOpen Sky @Active Antenna40.8mAFrequencyMax.Min.GSM850/EGSM90033dBm±2dB5dBm±5dBDCS1800/PCS190030dBm±2dB0dBm±5dBGSM850/EGSM900 (8-PSK)27dBm±3dB5dBm±5dBDCS1800/PCS1900 (8-PSK)26dBm±3dB0dBm±5dBWCDMA bands24dBm+1/-3dB<-49dBmLTE-FDD bands23dBm±2dB<-39dBmLTE-TDD bands23dBm±2dB<-39dBmNOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-91 / 1126.6. RF Receiving SensitivityThe following tables show conducted RF receiving sensitivity of EC25 series module.Table 43: EC25-E Conducted RF Receiving SensitivityTable 44: EC25-A Conducted RF Receiving SensitivityFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)EGSM900-109.0dBm//-102.0dBmDCS1800-109.0dBm//-102.0dbmWCDMA B1-110.5dBm//-106.7dBmWCDMA B5-110.5dBm//-104.7dBmWCDMA B8-110.5dBm//-103.7dBmLTE-FDD B1 (10M)-98.0dBm-98.0dBm-101.5dBm-96.3dBmLTE-FDD B3 (10M)-96.5dBm-98.5dBm-101.5dBm-93.3dBmLTE-FDD B5 (10M)-98.0dBm-98.5dBm-101.0dBm-94.3dBmLTE-FDD B7 (10M)-97.0dBm-94.5dBm-99.5dBm-94.3dBmLTE-FDD B8 (10M)-97.0dBm-97.0dBm-101.0dBm-93.3dBmLTE-FDD B20 (10M)-97.5dBm-99.0dBm-102.5dBm-93.3dBmLTE-TDD B38 (10M)-96.7dBm-97.0dBm-100.0dBm-96.3dBmLTE-TDD B40 (10M)-96.3dBm-98.0dBm-101.0dBm-96.3dBmLTE-TDD B41 (10M)-95.2dBm-95.7dBm-99.0dBm-94.3dBmFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)WCDMA B2-110.0dBm//-104.7dBmWCDMA B4-110.0dBm//-106.7dBmWCDMA B5-110.5dBm//-104.7dBm

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-92 / 112Table 45: EC25-V Conducted RF Receiving SensitivityTable 46: EC25-J Conducted RF Receiving SensitivityLTE-FDD B2 (10M)-98.0dBm-98.0dBm-101.0dBm-94.3dBmLTE-FDD B4 (10M)-97.5dBm-99.0dBm-101.0dBm-96.3dBmLTE-FDD B12 (10M)-96.5dBm-98.0dBm-101.0dBm-93.3dBmFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)LTE-FDD B4 (10M)-97.5dBm-99.0dBm-101.0dBm-96.3dBmLTE-FDD B13 (10M)-95.0dBm-97.0dBm-100.0dBm-93.3dBmFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)WCDMA B1-110.0dBm//-106.7dBmWCDMA B6-110.5dBm//-106.7dBmWCDMA B8-110.5dBm//-103.7dBmWCDMA B19-110.5dBm//-106.7dBmLTE-FDD B1 (10M)-97.5dBm-98.7dBm-100.2dBm-96.3dBmLTE-FDD B3 (10M)-96.5dBm-97.1dBm-100.5dBm-93.3dBmLTE-FDD B8 (10M)-98.4dBm-99.0dBm-101.2dBm-93.3dBmLTE-FDD B18 (10M)-99.5dBm-99.0dBm-101.7dBm-96.3dBmLTE-FDD B19 (10M)-99.2dBm-99.0dBm-101.4dBm-96.3dBmLTE-FDD B26 (10M)-99.5dBm-99.0dBm-101.5dBm-93.8dBmLTE-TDD B41 (10M)-95.0dBm-95.7dBm-99.0dBm-94.3dBm

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-93 / 112Table 47: EC25-AU Conducted RF Receiving SensitivityTable 48: EC25-AUT Conducted RF Receiving SensitivityFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)WCDMA B1-110.0dBm//-106.7dBmWCDMA B5-110.5dBm//-104.7dBmLTE-FDD B1 (10M)-98.5dBm-98.0dBm-101.0dBm-96.3dBmFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)GSM850-109.0dBm//-102.0dBmEGSM900-109.0dBm//-102.0dBmDCS1800-109.0dBm//-102.0dBmPCS1900-109.0dBm//-102.0dBmWCDMA B1-110.0dBm//-106.7dBmWCDMA B2-110.0dBm//-104.7dBmWCDMA B5-111.0dBm//-104.7dBmWCDMA B8-111.0dBm//-103.7dBmLTE-FDD B1 (10M)-97.2dBm-97.5dBm-100.2dBm-96.3dBmLTE-FDD B2 (10M)-98.2dBm//-94.3dBmLTE-FDD B3 (10M)-98.7dBm-98.6dBm-102.2dBm-93.3dBmLTE-FDD B4 (10M)-97.7dBm-97.4dBm-100.2dBm-96.3dBmLTE-FDD B5 (10M)-98.0dBm-98.2dBm-101.0dBm-94.3dBmLTE-FDD B7 (10M)-97.7dBm-97.7dBm-101.2dBm-94.3dBmLTE-FDD B8 (10M)-99.2dBm-98.2dBm-102.2dBm-93.3dBmLTE-FDD B28 (10M)-98.6dBm-98.7dBm-102.0dBm-94.8dBmLTE-TDD B40 (10M)-97.2dBm-98.4dBm-101.2dBm-96.3dBm

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-94 / 112LTE-FDD B3 (10M)-98.0dBm-96.0dBm-100.0dBm-93.3dBmLTE-FDD B5 (10M)-98.0dBm-99.0dBm-102.5dBm-94.3dBmLTE-FDD B7 (10M)-97.0dBm-95.0dBm-98.5dBm-94.3dBmLTE-FDD B28 (10M)-97.0dBm-99.0dBm-102.0dBm-94.8dBmTable 49: EC25-AUTL Conducted RF Receiving SensitivityTable 50: EC25-AF Conducted RF Receiving SensitivityFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)LTE-FDD B3 (10M)-98.0dBm-96.0dBm-100.0dBm-93.3dBmLTE-FDD B7 (10M)-97.0dBm-95.0dBm-98.5dBm-94.3dBmLTE-FDD B28 (10M)-97.0dBm-99.0dBm-102.0dBm-94.8dBmFrequencyPrimaryDiversitySIMO1)3GPP (SIMO)WCDMA B2-109.5dBm-111dbm-113dbm-104.7dBmWCDMA B4-108dBm-111dbm-111.5dbm-106.7dBmWCDMA B5-110.5dBm-111.5dbm-114dbm-104.7dBmLTE-FDD B2 (10M)-98.2dBm-99.1dBm-101.7dBm-94.3dBmLTE-FDD B4 (10M)-97.3dBm-98.6dBm-101.1dBm-96.3dBmLTE-FDD B5 (10M)-99dBm-100.3dBm-101.3dBm-94.3BmLTE-FDD B12 (10M)-99dBm-99.2dBm-102.1dBm-93.3dBmLTE-FDD B13 (10M)-98.1dBm-98.4dBm-100.2dBm-93.3dBmLTE-FDD B14 (10M)-97.9dBm-98.6dBm-99.5dBm-93.3dBmLTE-FDD B66 (10M)-96.7dBm-98.1dBm-99.4dBm-96.5dBmLTE-FDD B71 (10M)-99.2dBm-99.4dBm-101.5dBm-94.2dBm

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-95 / 1121) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and twoantennas at the receiver side, which can improve RX performance.6.7. Electrostatic DischargeThe module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subjectto ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling andpackaging procedures must be applied throughout the processing, handling and operation of anyapplication that incorporates the module.The following table shows the module electrostatics discharge characteristics.Table 51: Electrostatics Discharge Characteristics6.8. Thermal ConsiderationIn order to achieve better performance of the module, it is recommended to comply with the followingprinciples for thermal consideration:On customers’ PCB design, please keep placement of the module away from heating sources,especially high power components such as ARM processor, audio power amplifier, power supply,etc.Do not place components on the opposite side of the PCB area where the module is mounted, inorder to facilitate adding of heatsink when necessary.Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so asto ensure better heat dissipation performance.The reference ground of the area where the module is mounted should be complete, and add groundvias as many as possible for better heat dissipation.Make sure the ground pads of the module and PCB are fully connected.Tested PointsContact DischargeAir DischargeUnitVBAT, GND±5±10kVAll Antenna Interfaces±4±8kVOther Interfaces±0.5±1kVNOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-96 / 112According to customers’ application demands, the heatsink can be mounted on the top of the module,or the opposite side of the PCB area where the module is mounted, or both of them.The heatsink should be designed with as many fins as possible to increase heat dissipation area.Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink andmodule/PCB.The following shows two kinds of heatsink designs for reference and customers can choose one or bothof them according to their application structure.Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module)Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 6-97 / 112The module offers the best performance when the internal BB chip stays below 105°C. When themaximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but providesreduced performance (such as RF output power, data rate, etc.). When the maximum BB chiptemperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover tonetwork connected state after the maximum temperature falls below 115°C. Therefore, the thermal designshould be maximally optimized to make sure the maximum BB chip temperature always maintains below105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature fromthe first returned value.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 7-98 / 1127Mechanical DimensionsThis chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.The tolerances for dimensions without tolerance values are ±0.05mm.7.1. Mechanical Dimensions of the the Module32.0±0.1529.0±0.150.82.4±0.2Figure 43: Module Top and Side Dimensions

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 7-99 / 112Figure 44: Module Bottom Dimensions (Bottom View)

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 7-100 / 1127.2. Recommended FootprintFigure 45: Recommended Footprint (Top View)1. The keepout area should not be designed.2. For easy maintenance of the module, please keep about 3mm between the module and othercomponents in thehost PCB.NOTES

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 7-101 / 1127.3. Design Effect Drawings of the ModuleFigure 46: Top View of the ModuleFigure 47: Bottom View of the ModuleThese are design effect drawings of EC25 module. For more accurate pictures, please refer to themodule that you get from Quectel.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 8-102 / 1128Storage, Manufacturing andPackaging8.1. StorageEC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below.1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or otherhigh temperature processes must be:Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.Stored at <10% RH.3. Devices require bake before mounting, if any circumstances below occurs:When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidityis >10% before opening the vacuum-sealed bag.Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.As the plastic packagecannot be subjected to high temperature, it should be removed from devices beforehigh temperature (120ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033for baking procedure.NOTE

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 8-104 / 1128.3. PackagingEC25 is packaged in tap andreel carriers. One reel is 11.88m long and contains 250pcs modules. Thefigure below shows the package details, measured in mm.30.3± 0.1529.3± 0.1530.3± 0.1532.5± 0.1533.5± 0.150.35± 0.054.2± 0.153.1± 0.1532.5± 0.1533.5± 0.154.00± 0.12.00± 0.11.75± 0.120.20± 0.1544.00± 0.344.00± 0.11.50±0.1Direction of feedCover tape1310044.5+0.20-0.0048.5Figure 49: Tape and Reel Specifications

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 9-105 / 1129Appendix A ReferencesTable 52: Related DocumentsTable 53: Terms and AbbreviationsSNDocument NameRemark[1]Quectel_EC2x&EG9x&EM05_Power_Management_Application_NotePower management application noteforEC25, EC21, EC20 R2.0, EC20 R2.1,EG95, EG91 and EM05 modules[2]Quectel_EC25&EC21_AT_Commands_ManualEC25 and EC21 AT commands manual[3]Quectel_EC25&EC21_GNSS_AT_Commands_ManualEC25 and EC21 GNSS AT commandsmanual[4]Quectel_Module_Secondary_SMT_User_GuideModule secondary SMT user guide[5]Quectel_EC25_Reference_DesignEC25 reference design[6]Quectel_RF_Layout_Application_NoteRF layout application noteAbbreviationDescriptionAMRAdaptive Multi-ratebpsBits Per SecondCHAPChallenge Handshake Authentication ProtocolCSCoding SchemeCSDCircuit Switched DataCTSClear To SendDC-HSPA+Dual-carrier High Speed Packet AccessDFOTADelta Firmware Upgrade Over The AirDLDownlink

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 9-106 / 112DTRData Terminal ReadyDTXDiscontinuous TransmissionEFREnhanced Full RateESDElectrostatic DischargeFDDFrequency Division DuplexFRFull RateGLONASSGLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian GlobalNavigation Satellite SystemGMSKGaussian Minimum Shift KeyingGNSSGlobal Navigation Satellite SystemGPSGlobal Positioning SystemGSMGlobal System for Mobile CommunicationsHRHalf RateHSPAHigh Speed Packet AccessHSDPAHigh Speed Downlink Packet AccessHSUPAHigh Speed Uplink Packet AccessI/OInput/OutputInormNormal CurrentLEDLight Emitting DiodeLNALow Noise AmplifierLTELong Term EvolutionMIMOMultiple Input Multiple OutputMOMobile OriginatedMSMobile Station (GSM engine)MTMobile TerminatedPAPPassword Authentication Protocol

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 9-107 / 112PCBPrinted Circuit BoardPDUProtocol Data UnitPPPPoint-to-Point ProtocolQAMQuadrature Amplitude ModulationQPSKQuadrature Phase Shift KeyingRFRadio FrequencyRHCPRight Hand Circularly PolarizedRxReceiveSIMSubscriber Identification ModuleSIMOSingle Input Multiple OutputSMSShort Message ServiceTDDTime Division DuplexingTDMATime Division Multiple AccessTD-SCDMATime Division-Synchronous Code Division Multiple AccessTXTransmitting DirectionULUplinkUMTSUniversal Mobile Telecommunications SystemURCUnsolicited Result CodeUSIMUniversal Subscriber Identity ModuleVmaxMaximum Voltage ValueVnormNormal Voltage ValueVminMinimum Voltage ValueVIHmaxMaximum Input High Level Voltage ValueVIHminMinimum Input High Level Voltage ValueVILmaxMaximum Input Low Level Voltage Value

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 9-108 / 112VILminMinimum Input Low Level Voltage ValueVImaxAbsolute Maximum Input Voltage ValueVIminAbsolute Minimum Input Voltage ValueVOHmaxMaximum Output High Level Voltage ValueVOHminMinimum Output High Level Voltage ValueVOLmaxMaximum Output Low Level Voltage ValueVOLminMinimum Output Low Level Voltage ValueVSWRVoltage Standing Wave RatioWCDMAWideband Code Division Multiple AccessWLANWireless Local Area Network

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 10-109 / 11210 Appendix B GPRS Coding SchemesTable 54: Description of Different Coding SchemesSchemeCS-1CS-2CS-3CS-4Code Rate1/22/33/41USF3333Pre-coded USF36612Radio Block excl.USF and BCS181268312428BCS40161616Tail444-Coded Bits456588676456Punctured Bits0132220-Data Rate Kb/s9.0513.415.621.4

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 11-110 / 11211 Appendix C GPRS Multi-slot ClassesTwenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slotclasses are product dependent, and determine the maximum achievable data rates in both the uplink anddownlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,while the second number indicates the amount of uplink timeslots. The active slots determine the totalnumber of slots the GPRS device can use simultaneously for both uplink and downlink communications.The description of different multi-slot classes is shown in the following table.Table 55: GPRS Multi-slot ClassesMultislot ClassDownlink SlotsUplink SlotsActive Slots1112221332234314522463247334841593251042511435124451333NA1444NA

LTE Module SeriesEC25 Hardware DesignEC25_Hardware_Design 11-111 / 1121555NA1666NA1777NA1888NA1962NA2063NA2164NA2264NA2366NA2482NA2583NA2684NA2784NA2886NA2988NA30516315263253633546

LTE Module SiresEC25Hardware DesignEC25_Hardware_Design 12-112 /12-11212 Appendix D EDGE ModulationandCoding SchemesTable 56: EDGE Modulation and Coding SchemesCoding SchemeModulationCoding Family1 Timeslot2 Timeslot4 TimeslotCS-1:GMSK/9.05kbps18.1kbps36.2kbpsCS-2:GMSK/13.4kbps26.8kbps53.6kbpsCS-3:GMSK/15.6kbps31.2kbps62.4kbpsCS-4:GMSK/21.4kbps42.8kbps85.6kbpsMCS-1GMSKC8.80kbps17.60kbps35.20kbpsMCS-2GMSKB11.2kbps22.4kbps44.8kbpsMCS-3GMSKA14.8kbps29.6kbps59.2kbpsMCS-4GMSKC17.6kbps35.2kbps70.4kbpsMCS-58-PSKB22.4kbps44.8kbps89.6kbpsMCS-68-PSKA29.6kbps59.2kbps118.4kbpsMCS-78-PSKB44.8kbps89.6kbps179.2kbpsMCS-88-PSKA54.4kbps108.8kbps217.6kbpsMCS-98-PSKA59.2kbps118.4kbps236.8kbps

FCC Certification Requirements.According to the definition of mobile and fixed device is described in Part 2.1091(b), thisdevice is a mobile device.And the following conditions must be met:1. This Modular Approval is limited to OEM installation for mobile and fixed applicationsonly. The antenna installation and operating configurations of this transmitter, includingany applicable source-based time- averaging duty factor, antenna gain and cable lossmust satisfy MPE categorical Exclusion Requirements of 2.1091.2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT andthe user’s body and must not transmit simultaneously with any other antenna ortransmitter.3.A label with the following statements must be attached to the host end product: Thisdevice contains FCC ID: XMR201607EC25V.4.To comply with FCC regulations limiting both maximum RF output power and humanexposure to RF radiation, maximum antenna gain (including cable loss) must notexceed:❒GSM/850/GSM1900/ WCDMA B2/B5/LTE B2/B4/B5/B7: <4dBi5. This module must not transmit simultaneously with any other antenna ortransmitter6. The host end product must include a user manual that clearly defines operatingrequirements and conditions that must be observed to ensure compliance with currentFCC RF exposure guidelines.For portable devices, in addition to the conditions 3 through 6 described above, aseparate approval is required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all otheroperating configurations, including portable configurations with respect to 2.1093 anddifferent antenna configurations.For this device, OEM integrators must be provided with labeling instructions of finishedproducts. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last twoparagraphs:A certified modular has the option to use a permanently affixed label, or an electroniclabel. For a permanently affixed label, the module must be labelled withan FCC ID -Section 2.926 (see 2.2 Certification (labelling requirements) above). The OEM manualmust provide clear instructions explaining to the OEM the labellingrequirements,options and OEM user manual instructions that are required (see nextparagraph).For a host using a certified modular with a standard fixed label, if (1) the module’s FCCID is notvisible when installed in the host, or (2) if the host is marketed so that end usersdo not havestraightforward commonly used methods for access to remove the moduleso that the FCC ID ofthe module is visible; then an additional permanent label referringto the enclosed module:“Contains Transmitter Module FCC ID:XMR201605EC25A” or“Contains FCC ID: XMR201607EC25V” mustbe used. The host OEM user manual mustalso contain clear instructions on how end users can find and/or access the module andthe FCC ID.The final host / module combination may also need to be evaluated against the FCCPart 15B criteria for unintentional radiators in order to be properly authorized foroperation as a Part 15 digital device.The user’s manual or instruction manual for an intentional or unintentional radiator shallcaution the user that changes or modifications not expressly approved by the partyresponsible for compliance could void the user's authority to operate the equipment. Incases where the manual is provided only in a form other than paper, such as on a

computer disk or over the Internet, the information required by this section may beincluded in the manual in that alternative form, provided the user can reasonably beexpected to have the capability to access information in that form.This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2)this device must accept any interference received, including interference that maycause undesired operation.Changes or modifications not expressly approved by the manufacturer could void theuser’s authority to operate the equipment.To ensure compliance with all non-transmitter functions the host manufacturer isresponsible for ensuring compliance with the module(s) installed and fully operational. Forexample, if a host was previously authorized as an unintentional radiator under theDeclaration of Conformity procedure without a transmitter certified module and a moduleis added, the host manufacturer is responsible for ensuring that the after the module isinstalled and operational the host continues to be compliant with the Part 15Bunintentional radiator requirements.