Quectel Wireless Solutions 201709SC20W Smart Module User Manual

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Date Submitted	2017-09-05 00:00:00
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SC20-W Manual
Smart Wi-Fi Module Series
Rev: SC20-W_Manual_R1.0
Date: 2017-08-04
www.quectel.com
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
http://www.quectel.com/support/salesupport.aspx
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx
Or email to: Support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS‟ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS
DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT
PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS
ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL
OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.
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About the Document
History
Revision
Date
Author
Description
1.0
2017-08-04
NINA DOU
SC20-W_Manual_R1.0
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Introduction .......................................................................................................................................... 5
1.1.
Safety Information...................................................................................................................... 5
Product Concept .................................................................................................................................. 7
2.1.
General Description ................................................................................................................... 7
2.2.
Key Features ............................................................................................................................. 8
2.3.
Functional Diagram ................................................................................................................. 10
2.4.
Evaluation Board ..................................................................................................................... 11
Application Interfaces ....................................................................................................................... 12
3.1.
General Description ................................................................................................................. 12
3.2.
Pin Assignment ........................................................................................................................ 13
3.3.
Power Supply........................................................................................................................... 14
3.4.
Turn on and off Scenarios ....................................................................................................... 14
3.4.1. Turn on Module Using the PWRKEY ............................................................................. 14
3.4.2. Turn off Module .............................................................................................................. 15
3.5.
VRTC Interface ........................................................................................................................ 16
3.6.
Power Output ........................................................................................................................... 17
3.7.
Battery Charge and Management ........................................................................................... 17
3.8.
USB Interface .......................................................................................................................... 18
Wi-Fi and BT ....................................................................................................................................... 19
4.1.
Wi-Fi Overview ........................................................................................................................ 19
4.2.
BT Overview ............................................................................................................................ 19
Antenna Interface ............................................................................................................................... 21
5.1.
Wi-Fi/BT Antenna Interface ..................................................................................................... 21
5.1.1. Reference Design of RF Layout..................................................................................... 22
5.2.
Antenna Installation ................................................................................................................. 24
5.2.1. Antenna Requirements .................................................................................................. 24
5.2.2. Recommended RF Connector for Antenna Installation ................................................. 24
Electrical, Reliability and Radio Characteristics ............................................................................ 27
6.1.
Absolute Maximum Ratings ..................................................................................................... 27
6.2.
Power Supply Ratings ............................................................................................................. 27
6.3.
Charging Performance Specifications ..................................................................................... 28
6.4.
Operating Temperature ............................................................................................................ 28
6.5.
Current Consumption .............................................................................................................. 29
6.6.
Electrostatic Discharge ............................................................................................................ 30
Mechanical Dimensions .................................................................................................................... 31
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7.1.
7.2.
7.3.
Mechanical Dimensions of the Module.................................................................................... 31
Recommended Footprint ......................................................................................................... 33
Top and Bottom View of the Module........................................................................................ 34
Storage, Manufacturing and Packaging .......................................................................................... 35
8.1.
Storage..................................................................................................................................... 35
8.2.
Manufacturing and Welding ..................................................................................................... 36
8.3.
Packaging ................................................................................................................................ 37
IC & FCC Requirement ...................................................................................................................... 39
9.1.
FCC Regulations: .................................................................................................................... 39
9.2.
RF Exposure Information......................................................................................................... 39
9.3.
ISED Notice ............................................................................................................................. 39
9.4.
ISED Radiation Exposure Statement ...................................................................................... 40
9.5.
IMPORTANT NOTE: ................................................................................................................ 40
9.6.
USERS MANUAL OF THE END PRODUCT: .......................................................................... 40
9.7.
LABEL OF THE END PRODUCT: ........................................................................................... 41
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1
Introduction
This document defines the SC20-W module and describes its air interface and hardware interface which
are connected with your application.
This document can help you quickly understand module interface specifications, electrical and
mechanical details as well as other related information of SC20-W module. Associated with application
note and user guide, you can use SC20-W module to design and set up mobile applications easily.
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC20-W module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the
customer‟s failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals, clinics or other health care
facilities. These requests are desinged to prevent possible interference with
sensitive medical equipment.
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Cellular terminals or mobiles operating over radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid USIM/SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially exposive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
Please do not discard. Maybe wireless devices have an impact on the environment
so please do not arbitrarily discarded.
The device is restricted to indoor use only when oparating in the 5150 to 5350 Mhz
frequency range.
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2
Product Concept
2.1. General Description
SC20-W is a Smart Wi-Fi module based on Qualcomm platform and Android operating system, and
provides industrial grade performance. It supports Wi-Fi 802.11a/b/g/n and BT4.1 LE standards for
short-range wireless communication. The module also offers multiple audio and video input/output
interfaces as well as abundant GPIO interfaces.
The following table shows the supported Wi-Fi/BT standards and frequency range of SC20-W.
Table 1: SC20-W Frequency Bands
Type
Frequency Range
IEEE 802.11b/g/n
2412-2462MHz
IEEE 802.11a/n
5180~5825MHz
BT4.1 LE
2402-2480MHz
SC20-W is an SMD type module, which can be embedded into applications through its 210-pin pads
including 146 LCC signal pads and 64 other pads. With a compact profile of 40.5mm × 40.5mm × 2.8mm,
SC20-W can meet almost all requirements for M2M applications such as CPE, wireless POS, smart
metering, automotive, digital signage, alarm panel, security and industrial PDA.
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2.2. Key Features
The following table describes the detailed features of SC20-W module.
Table 2: SC20-W Key Features
Feature
Details
Applications Processor
ARM Cortex-A7 microprocessor cores (quad-core) up to 1.1 GHz
512KB L2 cache
Modem DSP
QDSP6 v5 core up to 691.2MHz
768KB L2 cache
Memory
8GB EMMC+8Gb LPDDR3
Operating System
Android OS 5.1
Power Supply
Supply voltage: 3.5V~4.2V
Typical supply voltage: 3.8V
WLAN Features
2.4G and 5G double frequency bands
Support 802.11a/b/g/n standards, with max. data rate up to 150Mbps
Support AP mode
Bluetooth Feature
BT4.1 LE
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands as well as Quectel
enhanced AT commands
LCM Interface
4-lane MIPI_DSI, up to 1.5Gbps for each lane
Support WVGA (2-lane MIPI_DSI), up to 720p (4-lane MIPI_DSI)
24-bit color depth
Camera Interface
Use MIPI_CSI, up to 1.5Gbps per lane
Support two cameras:
2-lane MIPI_CSI for rear camera, max. pixel up to 8MP
1-lane MIPI_CSI for front camera, max. pixel up to 2MP
Audio Interface
Audio input
2 groups of analog microphone input, integrate internal bias voltage
Audio output
Class AB stereo headphone output
Class AB earpiece differential output
Class D speaker differential amplifier output
USB Interface
Compliant with USB 2.0 specification; the data transfer rate can reach up to
480Mbps
Used for AT command communication, data transmission, software
debugging and firmware upgrade
Support USB OTG (Need additional 5V power supply chip)
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USB Driver: Support Windows XP, Windows Vista, Windows 7, Windows 8,
Windows CE5.0/6.0*, Linux 2.6/3.0, Android 2.3/4.0/4.2
UART Interface
2 UART interfaces:
4-wire UART interface with RTS and CTS hardware flow control
2-wire UART interface for software debugging
Baud rate up to 4Mbps
SDIO Interface
Support SD3.0, 4-bit SDIO
Support hot plug
I2C Interface
3 groups of I2C, with max. data rate up to 3.4Mbps (High Speed)
Used for peripherals such as camera, sensor, touch panel, etc.
ADC Interface
Support 3 ADC interfaces;
Used for input voltage sense, battery temperature detection and general
purpose ADC
Real Time Clock
Supported
Physical Characteristics
Size: (40.5±0.15)mm × (40.5±0.15)mm × (2.8±0.2) mm
Interface: LCC
Weight: approx. 9.8g
Temperature Range
Operating temperature range: -35°C~+65°C 1)
Extended temperature range : -40°C~+75°C 2)
Firmware Upgrade
Over USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTE：
1.
2.
3.
1)
Within operation temperature range, the module is IEEE compliant.
Within extended temperature range, the module remains the ability for data transmission. There
is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio
network. Only one or more parameters like Pout might reduce in their value and exceed the specified
tolerances. When the temperature returns to the normal operating temperature levels, the module
will meet IEEE compliant again.
“*” means under development.
2)
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2.3. Functional Diagram
The following figure shows a block diagram of SC20-W and illustrates the major functional parts.





Power management
Radio frequency
Baseband
LPDDR3+EMMC flash
Peripheral interface
-- USB interface
-- UART interface
-- SDIO interface
-- I2C interface
-- ADC interface
-- LCM (MIPI) interface
-- Touch Panel interface
-- Camera (MIPI) interface
-- Audio interface
Figure 1: Functional Diagram
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2.4. Evaluation Board
In order to help you to develop applications with SC20-W, Quectel supplies the evaluation board (SmartEVB), RS-232 to USB cable, USB data cable, power adapter, earphone, antenna and other peripherals to
control or test the module. For more details, please refer to document [1].
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3
Application Interfaces
3.1. General Description
SC20-W is equipped with 146-pin 1.0mm pitch SMT pads plus 64-pin ground pads and reserved pads
that can be embedded into wireless application platforms. The following chapters provide the detailed
description of pins/interfaces listed below.











Power supply
VRTC interface
LCM interface
TP interface
Camera interface
Audio interface
USB interface
UART interface
SDIO interface
I2C interface
ADC interface
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3.2. Pin Assignment
MIC1P
MIC_GND
174
173
192
191
208
207
150
180
196
205
189
167
20
21
151
181
197
204
188
166
22
23
24
25
152
182
198
203
187
165
GND
26
27
153
199
200
201
202
164
VIB_DRV
PWM
28
29
TP_INT
TP_RST
SD_LDO12
30
31
154
184
185
186
163
155
98 GPIO_92
GPIO_31
KEY_VOL_DOWN
95 KEY_VOL_UP
94 UART2_TXD
97
96
93 UART2_RXD
92 SENSOR_I2C_SDA
91 SENSOR_I2C_SCL
90 GPIO_32
89 GND
88 GND
87
86 GND
85 GND
84 CAM_I2C_SDA
83
82
USB
GND
UART
OTHERS
GPIO
AUDIO
TP
CAMERA
LCM
RESERVED
POWER
CAM0_RST
GND
77
76
ANT_WIFI/BT
GND
75
74
CAM1_MCLK
CAM0_MCLK
72
73
79
78
MIPI_CSI1_LN0P
68
69
70
71
66
67
MIPI_CSI0_LN0P
MIPI_CSI0_LN1N
SDC2
CAM_I2C_SCL
CAM1_PWD
81 CAM1_RST
80 CAM0_PWD
MIPI_CSI0_LN1P
GND
MIPI_CSI1_CLKN
MIPI_CSI1_CLKP
MIPI_CSI1_LN0N
64
65
MIPI_CSI0_CLKP
MIPI_CSI0_LN0N
MIPI_DSI_LN3P 61
GND 62
MIPI_CSI0_CLKN 63
MIPI_DSI_LN1P 57
MIPI_DSI_LN2N 58
MIPI_DSI_LN2P 59
MIPI_DSI_LN3N 60
44
45
46
47
SD_DATA3
48
LCD_RST 49
LCD_TE 50
GND 51
MIPI_DSI_CLKN 52
MIPI_DSI_CLKP 53
MIPI_DSI_LN0N 54
MIPI_DSI_LN0P 55
MIPI_DSI_LN1N 56
42
43
SD_DATA1
SD_DATA2
TP_I2C_SDA
40
41
SD_CMD
SD_DATA0
SD_DET
USB_BOOT
TP_I2C_SCL
38
39
UART1_CTS
UART1_RTS
99 GPIO_88
34
35
36
37
SD_LDO11
SD_CLK
UART1_RXD
32
33
158
18
19
102 GPIO_68
101 GPIO_69
100
102 GPIO_89
162
168
161
190
160
206
159
195
157
179
156
149
USB_ID 16
17
106 GPIO_98
105 GPIO_0
104 GPIO_110
103 GPIO_97
171
175
193
209
169
172
176
194
148
177
170
183
GND 12
USB_DM 13
USB_DP 14
GND 15
147
210
107 GPIO_94
EARP 8
EARN 9
SPKP 10
SPKN 11
GPIO_23
UART1_TXD
112 GPIO_58
111 LDO5_1V8
118 GPIO_9
117 GPIO_10
116 GPIO_11
115 GPIO_95
114 PWRKEY
113 GPIO_99
121
120 GND
119 GPIO_8
125 LDO6_1V8
124 GPIO_17
123 GPIO_16
122 GND
126 VRTC
128 ADC
127 CHARGE_SEL
132 GND
131
130 GND
129 LDO17_2V85
135 GND
134 VBAT_THERM
133 VBAT_SNS
138 HPH_L
137 HPH_GND
136 HPH_R
110 GPIO_96
109 GPIO_65
108 GPIO_36
178
MIC2P
GND
141 USB_VBUS
140 GND
139 HS_DET
146
VBAT_BB
VBAT_BB
GND
145
144 GND
143 GND
142 USB_VBUS
The following figure shows the pin assignment of SC20-W module.
ANT
Figure 2: Pin Assignment (Top View)
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3.3. Power Supply
SC20-W provides two VBAT pins dedicated to connection with the external power supply. The two
VBAT_BB pins are used for module baseband part. The power supply range of the module is 3.5V~4.2V,
and the recommended value is 3.8V.
3.4. Turn on and off Scenarios
3.4.1. Turn on Module Using the PWRKEY
The module can be turned on by driving PWRKEY pin to a low level for at least 1.6s. PWRKEY pin is
pulled to 1.8V internally. It is recommended to use an open drain/collector driver to control the PWRKEY.
A simple reference circuit is illustrated in the following figure.
PWRKEY
≥1.6s
R1
Q1
4.7K
Turn on pulse
R2
47K
Figure 3: Turn on the Module Using Driving Circuit
The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be
placed nearby the button for ESD protection. A reference circuit is shown in the following figure.
S1
PWRKEY
TVS
Close to S1
Figure 4: Turn on the Module Using Keystroke
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The turn on scenario is illustrated in the following figure.
VBAT
>1.6s
PWRKEY
173ms
LDO5_1V8
173.5ms
LDO6_1V8
LDO17_2V85
438ms
30s
Others
Active
Figure 5: Timing of Turning on Module
NOTE:
Make sure that VBAT is stable before pulling down PWRKEY pin. The recommended time between them
is no less than 30ms. PWRKEY pin cannot be pulled down all the time.
3.4.2. Turn off Module
Set the PWRKEY pin low for at least 1s, and then choose to turn off the module when the prompt window
comes up.
The other way to turn off the module is to drive PWRKEY to a low level for at least 8s. The module will
execute forced shutdown. The forced power-down scenario is illustrated in the following figure.
VBAT
>8s
PWRKEY
Others
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Figure 6: Timing of Turning off Module
3.5. VRTC Interface
The RTC (Real Time Clock) can be powered by an external power source through VRTC when the
module is powered down and there is no power supply for the VBAT. The external power source can be
capacitor, rechargeable battery or non-rechargeable battery according to application demands. The
following are some reference circuit designs when an external battery or capacitor is utilized for powering
RTC.
If RTC is ineffective, it can be synchronized when the module starts data connection after power on.
VRTC
RTC
Core
Rechargeable
Backup Battery
Module
Figure 7: RTC Powered by Rechargeable Battery
VRTC
Large
Capacitance
Capacitor
RTC
Core
Module
Figure 8: RTC Powered by Capacitor




2.0~3.25V input voltage range and 3.0V typical value for VRTC. When VBAT is disconnected, the
average consumption is 5uA.
When powered by VBAT, the RTC error is 50ppm. When powered by VRTC, the RTC error is
200ppm.
If the rechargeable battery is used, the ESR of the battery should be less than 2K, and it is
recommended to use the MS621FE FL11E of SEIKO.
If a large capacitance capacitor is selected, it is recommended to use a 100uF capacitor with low
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ESR. The capacitor is able to power the real-time clock for 45 seconds.
3.6. Power Output
SC20-W supports output of regulated voltages for peripheral circuits.
Table 3: Power Description
Pin Name
Voltage Range (V)
Default Voltage (V)
Driving Current (mA)
IDLE
LDO5_1V8
1.75~3.337
1.8
20
KEEP
LDO6_1V8
1.75~3.337
1.8
100
No output
LDO17_2V85
1.75~3.337
2.85
300
No output
SD_LDO12
1.75~3.337
2.95
50
SD_LDO11
1.75~3.337
2.95
600
3.7. Battery Charge and Management
SC20-W module can recharge over-discharged batteries. The battery charger in SC20-W module
supports trickle charging, constant current charging and constant voltage charging modes, which
optimizes the charging procedure for Li-ion batteries.



Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8V, a 90mA
trickle charging current is applied to the battery. When the battery voltage is charged up and is
between 2.8V and 3.2V, the charging current can be set to 450mA maximally.
Constant current mode (CC mode): When the battery is increased to between 3.2V and 4.2V, the
system will switch to CC mode. The maximum charging current is 1.44A when adapter is used for
battery charging; and the maximum charging current is 450mA while USB charging.
Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2V, the
system will switch to CV mode and the charging current will decrease gradually. When the battery
level reaches 100%, the charging is completed.
SC20-W module supports battery temperature detection in the condition that the battery integrates a
thermistor (47K 1%, B4050 NTC thermistor by default; SDNT1608X473F4050FTF of SUNLORD is
recommended) and the thermistor is connected to VBAT_THERM pin. The default temperature range is
from -3.0 to 48.5°C. If VBAT_THERM pin is not connected, there will be malfunctions such as battery
charging failure, battery level display error, etc.
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A reference design for battery charging circuit is shown as below.
Adapter or USB
USB_VBUS
VBAT
VBAT
R1 0R
NTC
VBAT_THERM
GND
VBAT_SNS
D1
D2
C1
ESD
ESD
100uF 1uF
C2
GND
Module
Battery
Figure 9: Reference Design for Battery Charging Circuit
Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When
different batteries are utilized, the charging and discharging curve has to be modified correspondingly so
as to achieve the best effect.
If thermistor is not available in the battery, or adapter is utilized for powering module, then there is only a
need for VBAT and GND connection. In this case, the system may mistakenly judge that the battery
temperature is abnormal, which will cause battery charging failure. In order to avoid this, VBAT_THERM
should be connected to GND with a 47KΩ resistor. If VBAT_THERM is unconnected, the system will be
unable to detect the battery, making battery cannot be charged.
VBAT_SNS pin must be connected. Otherwise, the module will have abnormalities in voltage detection,
as well as associated power on/off and battery charging/discharging issues.
3.8. USB Interface
SC20-W contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0
specification and supports high speed (480 Mbps) and full speed (12 Mbps) modes. The USB interface is
used for AT command communication, data transmission, software debugging and firmware upgrade.
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4
Wi-Fi and BT
SC20-W module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT)
functions. The interface impedance is 50Ω. External antennas such as dipole antenna can be connected
to the module via the interface, so as to achieve Wi-Fi and BT functions.
4.1. Wi-Fi Overview
SC20-W module supports 2.4G and 5G double-bands WLAN wireless communication based on IEEE
802.11 a/802.11 b/ 802.11g/ 802.11n standard protocols. The maximum data rate is up to 150 Mbps.
The features are as below:






Support Wake-on-WLAN (WoWLAN)
Support ad hoc mode
Support WAPI SMS4 hardware encryption
Support AP mode
Support Wi-Fi Direct
Support MCS 0-7 for HT20 and HT40
4.2. BT Overview
SC20-W module supports BT4.1 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK
modulation modes.



Maximally support up to 7 wireless connections.
Maximally support up to 3.5 piconets at the same time.
Support one SCO (Synchronous Connection Oriented) or eSCO connection.
The BR/EDR channel bandwidth is 1MHz, and can accommodate 79 channels. The BLE channel
bandwidth is 2MHz, and can accommodate 40 channels.
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Table 4: BT Data Rate and Version
Version
Data rate
Maximum Application Throughput
1.2
1 Mbit/s
>80 Kbit/s
2.0 + EDR
3 Mbit/s
>80 Kbit/s
3.0 + HS
24 Mbit/s
Reference 3.0 + HS
4.0
24 Mbit/s
Reference 4.0 LE
Comment
Referenced specifications are listed below:


Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS,
August 6, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009
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5
Antenna Interface
SC20-W antenna interface includes a Wi-Fi/BT antenna. The antenna interface has an impedance of
50Ω.
5.1. Wi-Fi/BT Antenna Interface
The following tables show the Wi-Fi/BT antenna pin‟s definition and frequency specification.
Table 5: Pin Definition of Wi-Fi/BT Antenna
Pin Name
Pin No.
I/O
Description
Comment
ANT_WIFI/BT
77
IO
Wi-Fi/BT antenna
50Ω impedance
Table 6: Wi-Fi/BT Frequency
Type
Frequency
Unit
Wi-Fi(2.4G)
2412-2462
MHz
Wi-Fi(5G)
5180~5825
MHz
BT4.1 LE
2402~2480
MHz
A reference circuit design for Wi-Fi/BT antenna is shown as below. A π-type matching circuit should be
reserved for better RF performance. The capacitors are not mounted by default.
R1
2.4G/5G
antenna
0R
ANT_WIFI/BT
C1
C2
NM
NM
Module
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Figure 10: Reference Circuit Design for Wi-Fi/BT Anternna
NOTE:
Place the π-type matching components (R1, C1, C2) as close to the antenna as possible.
5.1.1. Reference Design of RF Layout
For user‟s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials‟ dielectric constant,
the distance between signal layer and reference ground (H), and the clearance between RF trace and
ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic
impedance control. The following are reference designs of microstrip line or coplanar waveguide line with
different PCB structures.
Figure 11: Microstrip Line Design on a 2-layer PCB
Figure 12: Coplanar Waveguide Line Design on a 2-layer PCB
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Figure 13: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 14: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:





Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.
The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to
ground.
The distance between the RF pins and the RF connector should be as short as possible, and all the
right angle traces should be changed to curved ones.
There should be clearance area under the signal pin of the antenna connector or solder joint.
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).
For more details about RF layout, please refer to document [3].
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5.2. Antenna Installation
5.2.1. Antenna Requirements
The following table shows the requirements on Wi-Fi/BT antenna.
Table 7: Antenna Requirements
Type
Requirements
Wi-Fi/BT
VSWR: ≤ 2
Max Input Power (W): 50
Input Impedance (Ω): 50
Polarization Type: Vertical
Cable Insertion Loss: < 1dB
The WiFi2.4GHz/WiFi5GHz/Bluetooth dipole antenna information as below:
Manufacturer
Model
Peak gain
INPAQ TECHNOLOGY CO., LTD
DAM-L0-H-N0-000-08-13
WiFi2.4GHz/Bluetooth: 3.0 dBi
WiFi5GHz: 4.0 dBi
5.2.2. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use the UF.L-R-SMT connector
provided by HIROSE.
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Figure 15: Dimensions of the UF.L-R-SMT Connector (Unit: mm)
U.FL-LP serial connector listed in the following figure can be used to match the UF.L-R-SMT.
Figure 16: Mechanical Parameters of UF.L-LP Connectors
The following figure describes the space factor of mated connectors.
Figure 17: Space Factor of Mated Connectors (Unit: mm)
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For more details, please visit http://www.hirose.com.
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6
Electrical, Reliability and Radio
Characteristics
6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
Table 8: Absolute Maximum Ratings
Parameter
Min.
Max.
Unit
VBAT
-0.5
USB_VBUS
-0.5
16
Voltage on Digital Pins
-0.3
2.3
6.2. Power Supply Ratings
Table 9: SC20-W Module Power Supply Ratings
Parameter
Description
Conditions
Min.
Typ.
Max.
Unit
VBAT
VBAT
Voltage must stay within the
min/max values, including
voltage drop, ripple and spikes.
3.5
3.8
4.2
USB_VBUS
USB detection
4.35
5.0
6.3
VRTC
Power supply
voltage of backup
battery
2.0
3.0
3.25
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6.3. Charging Performance Specifications
Table 10: Charging Performance Specifications
Parameter
Min.
Typ.
Max.
Unit
Trickle charging-A current
81
90
99
mA
Trickle charging-A threshold voltage range (15.62mV stepping up)
2.5
2.796
2.984
Trickle charging-B threshold voltage range (18.75mV stepping up)
3.0
3.2
3.581
Charge voltage range (25mV stepping up)
4.2
4.775
+/-2
1440
mA
+/-10
Charge voltage accuracy
Charge current range (90mA stepping up)
90
Charge current accuracy
Charge termination current: when charge current is from 90 to 450mA
Charge termination current: when charge current is from 450 to
1440mA
7.4
6.4. Operating Temperature
The operating temperature is listed in the following table.
Table 11: Operating Temperature
Parameter
Min.
Typ.
Max.
Unit
Operating temperature range 1)
-35
+25
+65
°C
Extended temperature range 2)
-40
+75
°C
NOTE:
1.
2.
1)
Within operation temperature range, the module is IEEE compliant.
Within extended temperature range, the module remains the ability for data transmission. There
is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio
2)
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network. Only one or more parameters like Pout might reduce in their value and exceed the
specified tolerances. When the temperature returns to the normal operating temperature levels, the
module will meet IEEE compliant again.
6.5. Current Consumption
Table 12: SC20-W Current Consumption
Parameter
Description
Conditions
Min.
Typ.
Max.
Unit
OFF state
Power down
68
uA
Sleep state
RF sleep
1.445
mA
Idle state
RF idle
42.759
mA
@1Mbps
298
mA
@11Mbps
281
mA
@6Mbps
286
mA
@54Mbps
188
mA
@6.5Mbps 20Mhz
275
mA
@65Mbps 20Mhz
201
mA
@13.5Mbps 40Mhz
269
mA
@135Mbps 40Mhz
186
mA
Wi-Fi 11b RX
120
mA
Wi-Fi 11g RX
119
mA
Wi-Fi 11n RX
117
mA
BT Tx Channel 0
100
mA
BT Tx Channel 38
100
mA
BT Tx Channel 78
100
mA
BT Rx Channel 38
80
mA
Wi-Fi 11b TX
Wi-Fi 11g TX
IVBAT
Wi-Fi 11n TX
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6.6. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be
subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD
handling and packaging procedures must be applied throughout the processing, handling and operation
of any application that incorporates the module.
The following table shows the electrostatic discharge characteristics of SC20-W module.
Table 13: ESD Characteristics (Temperature: 25°C, Humidity: 45%)
Tested Points
Contact Discharge
Air Discharge
Unit
VBAT, GND
+/-5
+/-10
KV
All Antenna Interfaces
+/-5
+/-10
KV
USB Interfaces
+/-2
+/-4
KV
Other Interfaces
+/-0.5
+/-1
KV
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7
Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.
7.1. Mechanical Dimensions of the Module
Figure 18: Module Top and Side Dimensions
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Figure 19: Module Bottom Dimensions (Top View)
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7.2. Recommended Footprint
Figure 20: Recommended Footprint (Top View)
NOTE:
1.
2.
For easy maintenance of the module, keep about 3mm between the module and other components in
the host PCB.
All RESERVED pins must NOT be connected to GND.
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7.3. Top and Bottom View of the Module
Figure 21: Top View of the Module
Figure 22: Bottom View of the Module
NOTE:
These are design effect drawings of SC20-W module. For more accurate pictures, please refer to the
module that you get from Quectel.
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8
Storage, Manufacturing and
Packaging
8.1. Storage
SC20-W is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1.
Shelf life in the vacuum-sealed bag: 12 months at <40°C/90%RH.
2.
After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:


Mounted within 72 hours at factory conditions of ≤30°C/60%RH.
Stored at <10% RH.
3.
Devices require baking before mounting, if any circumstance below occurs.


Humidity indication card shows the humidity is >10% when ambient temperature is 23°C±5°C.
Mounting cannot be finished within 72 hours at factory conditions of ≤30°C/60% RH.
4.
If baking is required, devices may be baked for 48 hours at 125°C±5°C.
NOTE:
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (125°C) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
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8.2. Manufacturing and Welding
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,
the thickness of stencil for the module is recommended to be 0.18mm, and the following figure is the
recommended stencil design for LGA pads. For more details, please refer to document [2].
0.55mm
0.55mm
1.5mm
1.5mm
Figure 23: Recommended Stencil Design for LGA Pads
It is suggested that the peak reflow temperature is from 235 to 245°C (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260°C. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below.
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ºC
Preheat
Heating
Cooling
250
Liquids Temperature
217
200 ºC
200
40s~60s
Temperature
160 ºC
150
70s~120s
100
Between 1~3 ºC/s
50
50
100
150
200
250
300
Time
Figure 24: Reflow Soldering Thermal Profile
8.3. Packaging
SC20-W is packaged in tape and reel carriers. One reel is 12.32 meters long and contains 200pcs
modules. The following figures show the package details, measured in mm.
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Figure 25: Tape Dimensions
Figure 26: Reel Dimensions
Table 14: Reel Packaging
Model Name
SC20-W
MOQ for MP
Minimum Package: 200pcs
Minimum Package×4=800pcs
200
Size: 370mm × 350mm × 85mm
N.W: 1.92kg
G.W: 3.17kg
Size: 380mm × 365mm × 365mm
N.W: 7.68kg
G.W: 13.63kg
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9
IC & FCC Requirement
9.1. FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) This device must accept any
interference received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital device , pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiated
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will
not occur in a particular installation If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
Caution: Changes or modifications not expressly approved by the party responsible for compliance
could void the user„s authority to operate the equipment.
9.2. RF Exposure Information
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity
to the antenna shall not be less than 20cm (8 inches) during normal operation.
9.3. ISED Notice
This device complies with Innovation, Science and Economic Development Canada license-exempt
RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired
operation of the device.
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Le présent appareil est conforme aux CNR Innovation, Sciences et Développement économique
Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
9.4. ISED Radiation Exposure Statement
This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled
environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits,
human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 définies pour
un environnement non contrôlé. Afin d'éviter la possibilité de dépasser les limites d'exposition aux
fréquences radio de la CNR-102, la proximité humaine à l'antenne ne doit pas être inférieure à 20 cm
(8 pouces) pendant le fonctionnement normal.
9.5. IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
compliance requirement of the end product, which integrates this module. 20cm minimum distance
has to be able to be maintained between the antenna and the users for the host this module is
integrated into. Under such configuration, the FCC radiation exposure limits set forth for an
population/uncontrolled environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment.
9.6. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm
separation with the antenna while this end product is installed and operated. The end user has to be
informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be
satisfied. The end user has to also be informed that any changes or modifications not expressly
approved by the manufacturer could void the user's authority to operate this equipment. If the size of
the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be
available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to
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the following two conditions: (1) this device may not cause harmful interference and (2) this device
must accept any interference received, including interference that may cause undesired operation.
9.7. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains Transmitter
Module FCC ID: XMR201709SC20W". If the size of the end product is larger than 8x10cm, then the
following FCC part 15.19 statement has to also be available on the label: This device complies with
Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful
interference and (2) this device must accept any interference received, including interference that
may cause undesired operation.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host device; otherwise, the host device must be
labeled to display the Innovation, Science and Economic Development Canada certification number
for the module, preceded by the words “Contains transmitter module IC: 10224A-201709SC20W”.
The device is going on be operated in 5150~5250 frequency range. It is restricted indoor
environment only in Canada.
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1、The characteristic impedance depends on the dielectric of PCB, the trace width and the
grand plane spacing, Coated Coplanar Line is required. The detail simulation as below.
2、the RF trace of the test board which was used in the FCC test is defined as below.

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