Quectel Wireless Solutions 201807EG95NA LTE Module User Manual

Quectel Wireless Solutions Company Limited LTE Module Users Manual

Users Manual

EG95 Hardware Design LTE Module Series Rev. EG95_Hardware_Design_V1.2 Date: 2018-03-14 Status: Released www.quectel.com
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 1 / 81 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 2 / 81 About the Document History Revision Date Author Description 1.0 2017-03-22 Felix YIN/ Yeoman CHEN/ Jackie WANG Initial 1.1 2018-01-04 Yeoman CHEN/ Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated the conducted RF receiving sensitivity in Table 28. 7. Updated the GPRS multi-slot classes in Table 33. 8. Added thermal consideration in Chapter 5.8 9. Added a GND pad in each of the four corners of the module’s footprint in Chapter 6.2. 10. Added packaging information in Chapter 7.3. 1.2 2018-03-14 Felix YIN/ Rex WANG 1. Added the description of EG95-NA. 2. Updated the functional diagram in Figure 1. 3. Updated pin assignment in Figure 2. 4. Updated GNSS function in Table 1. 5. Updated GNSS Features in Table 2. 6. Updated reference circuit of USB interface in Figure 21. 7. Added description of GNSS receiver in Chapter 4. 8. Updated pin definition of RF antenna in Table 21.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 3 / 81 9. Updated module operating frequencies in Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 4 / 81 Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 4 Table Index ................................................................................................................................................... 6 Figure Index ................................................................................................................................................. 7 1 Introduction .......................................................................................................................................... 9 1.1. Safety Information.................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description ................................................................................................................. 11 2.2. Key Features ........................................................................................................................... 12 2.3. Functional Diagram ................................................................................................................. 14 2.4. Evaluation Board ..................................................................................................................... 15 3 Application Interfaces ....................................................................................................................... 16 3.1. General Description ................................................................................................................. 16 3.2. Pin Assignment ........................................................................................................................ 17 3.3. Pin Description ......................................................................................................................... 18 3.4. Operating Modes ..................................................................................................................... 24 3.5. Power Saving ........................................................................................................................... 24 3.5.1. Sleep Mode .................................................................................................................... 24 3.5.1.1. UART Application ................................................................................................. 25 3.5.1.2. USB Application with USB Remote Wakeup Function ........................................ 25 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 26 3.5.1.4. USB Application without USB Suspend Function ................................................ 27 3.5.2. Airplane Mode ................................................................................................................ 27 3.6. Power Supply ........................................................................................................................... 28 3.6.1. Power Supply Pins ......................................................................................................... 28 3.6.2. Decrease Voltage Drop .................................................................................................. 29 3.6.3. Reference Design for Power Supply .............................................................................. 30 3.6.4. Monitor the Power Supply .............................................................................................. 30 3.7. Turn on and off Scenarios ....................................................................................................... 30 3.7.1. Turn on Module Using the PWRKEY ............................................................................. 30 3.7.2. Turn off Module .............................................................................................................. 32 3.7.2.1. Turn off Module Using the PWRKEY Pin ............................................................. 32 3.7.2.2. Turn off Module Using AT Command ................................................................... 33 3.8. Reset the Module..................................................................................................................... 33 3.9. (U)SIM Interfaces..................................................................................................................... 35 3.10. USB Interface .......................................................................................................................... 38 3.11. UART Interfaces ...................................................................................................................... 40 3.12. PCM and I2C Interfaces .......................................................................................................... 42 3.13. SPI Interface ............................................................................................................................ 45 3.14. Network Status Indication ........................................................................................................ 45
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 5 / 81 3.15. STATUS ................................................................................................................................... 46 3.16. Behaviors of RI ........................................................................................................................ 47 4 GNSS Receiver ................................................................................................................................... 48 4.1. General Description ................................................................................................................. 48 4.2. GNSS Performance ................................................................................................................. 48 4.3. Layout Guidelines .................................................................................................................... 49 5 Antenna Interfaces ............................................................................................................................. 50 5.1. Main/Rx-diversity Antenna Interfaces...................................................................................... 50 5.1.1. Pin Definition .................................................................................................................. 50 5.1.2. Operating Frequency ..................................................................................................... 50 5.1.3. Reference Design of RF Antenna Interface ................................................................... 51 5.1.4. Reference Design of RF Layout..................................................................................... 52 5.2. GNSS Antenna Interface ......................................................................................................... 54 5.3. Antenna Installation ................................................................................................................. 55 5.3.1. Antenna Requirement .................................................................................................... 55 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 56 6 Electrical, Reliability and Radio Characteristics ............................................................................ 58 6.1. Absolute Maximum Ratings ..................................................................................................... 58 6.2. Power Supply Ratings ............................................................................................................. 58 6.3. Operation and Storage Temperatures ..................................................................................... 59 6.4. Current Consumption .............................................................................................................. 60 6.5. RF Output Power ..................................................................................................................... 63 6.6. RF Receiving Sensitivity .......................................................................................................... 64 6.7. Electrostatic Discharge ............................................................................................................ 65 6.8. Thermal Consideration ............................................................................................................ 66 7 Mechanical Dimensions .................................................................................................................... 68 7.1. Mechanical Dimensions of the Module.................................................................................... 68 7.2. Recommended Footprint ......................................................................................................... 70 7.3. Design Effect Drawings of the Module .................................................................................... 71 8 Storage, Manufacturing and Packaging .......................................................................................... 72 8.1. Storage .................................................................................................................................... 72 8.2. Manufacturing and Soldering .................................................................................................. 73 8.3. Packaging ................................................................................................................................ 74 9 Appendix A References ..................................................................................................................... 75 10 Appendix B GPRS Coding Schemes ............................................................................................... 78 11 Appendix C GPRS Multi-slot Classes .............................................................................................. 79 12 Appendix D EDGE Modulation and Coding Schemes ................................................................... 81
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 6 / 81 Table Index TABLE 1: FREQUENCY BANDS OF EG95 MODULE ....................................................................................... 11 TABLE 2: KEY FEATURES OF EG95 MODULE ............................................................................................... 12 TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 18 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 18 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 24 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 28 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 31 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 33 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 35 TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 38 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................. 40 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 40 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 41 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 44 TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 45 TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 46 TABLE 17: WORKING STATE OF THE NETWORK STATUS INDICATOR ...................................................... 46 TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 46 TABLE 19: DEFAULT BEHAVIORS OF RI ........................................................................................................ 47 TABLE 20: GNSS PERFORMANCE ................................................................................................................. 48 TABLE 21: PIN DEFINITION OF RF ANTENNA ............................................................................................... 50 TABLE 22: MODULE OPERATING FREQUENCIES ........................................................................................ 50 TABLE 23: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 54 TABLE 24: GNSS FREQUENCY ...................................................................................................................... 54 TABLE 25: ANTENNA REQUIREMENTS .......................................................................................................... 55 TABLE 26: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 58 TABLE 27: POWER SUPPLY RATINGS ........................................................................................................... 58 TABLE 28: OPERATION AND STORAGE TEMPERATURES .......................................................................... 59 TABLE 29: EG95-E CURRENT CONSUMPTION ............................................................................................. 60 TABLE 30: EG95-NA CURRENT CONSUMPTION........................................................................................... 62 TABLE 31: GNSS CURRENT CONSUMPTION OF EG95-NA ......................................................................... 63 TABLE 32: RF OUTPUT POWER ..................................................................................................................... 63 TABLE 33: EG95-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 64 TABLE 34: EG95-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 65 TABLE 35: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 65 TABLE 36: RELATED DOCUMENTS ................................................................................................................ 75 TABLE 37: TERMS AND ABBREVIATIONS ...................................................................................................... 75 TABLE 38: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 78 TABLE 39: GPRS MULTI-SLOT CLASSES ...................................................................................................... 79 TABLE 40: EDGE MODULATION AND CODING SCHEMES ........................................................................... 81
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 7 / 81 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 17 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 25 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 26 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 26 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 27 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 29 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 29 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 30 FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 31 FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 31 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 32 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 33 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 34 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 34 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 34 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM1 INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR ................................................................................................................................................................... 36 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM1 INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 36 FIGURE 19: REFERENCE CIRCUIT OF (U)SIM2 INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR ................................................................................................................................................................... 37 FIGURE 20: REFERENCE CIRCUIT OF (U)SIM2 INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 37 FIGURE 21: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 39 FIGURE 22: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 41 FIGURE 23: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 42 FIGURE 24: PRIMARY MODE TIMING ............................................................................................................ 43 FIGURE 25: AUXILIARY MODE TIMING .......................................................................................................... 43 FIGURE 26: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 44 FIGURE 27: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 45 FIGURE 28: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR ........................................... 46 FIGURE 29: REFERENCE CIRCUIT OF STATUS ........................................................................................... 47 FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 51 FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 52 FIGURE 32: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 52 FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .................................................................................................................................................. 53 FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .................................................................................................................................................. 53 FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 54 FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 56 FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 56
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 8 / 81 FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 57 FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 66 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 67 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 68 FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 69 FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 70 FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 71 FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 71 FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 73 FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 74 FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 74
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 9 / 81 1 Introduction This document defines the EG95 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG95 module. Associated with application note and user guide, customers can use EG95 module to design and set up mobile applications easily.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 10 / 81 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG95 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid (U)SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 11 / 81 2 Product Concept 2.1. General Description EG95 module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality1) to meet customers’ specific application demands. The following table shows the frequency bands of EG95 module. Table 1: Frequency Bands of EG95 Module 1. 1) EG91 contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 2. 2) GNSS function is optional. 3. “*” means under development. With a compact profile of 29.0mm × 25.0mm × 2.25mm, EG95 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG95 is an SMD type module which can be embedded into applications through its 106 LGA pads. EG95 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. Module LTE Bands (with Rx-diversity) WCDMA (with Rx-diversity) GSM GNSS2) EG95-E FDD: B1/B3/B7/B8/B20/B28A B1/B8 900/1800MHz Not supported EG95-NA* FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported GPS, GLONASS, BeiDou/Compass, Galileo, QZSS NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 12 / 81 2.2. Key Features The following table describes the detailed features of EG95 module. Table 2: Key Features of EG95 Module Feature Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands LTE Features Support up to non-CA Cat 4 FDD Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction FDD: Max 150Mbps (DL)/50Mbps (UL) UMTS Features Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/384Kbps (UL) GSM Features R99: CSD: 9.6kbps GPRS: Support GPRS multi-slot class 33 Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE: Support EDGE multi-slot class 33 Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Internet Protocol Features Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/CMUX*/HTTPS*/ SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 13 / 81 PPP connections SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIM Interfaces Support 1.8V and 3.0V (U)SIM cards Audio Features Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization USB Interface Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB* Support USB serial drivers for Windows XP, Windows Vista, Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.0/7.x UART Interface Main UART: Used for AT command communication and data transmission Baud rate reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART: Used for Linux console and log output 115200bps baud rate Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication NETLIGHT pin for network activity status indication Antenna Interface Including main antenna interface (ANT_MAIN), Rx-diversity antenna (ANT_DIV) interface and GNSS antenna interface (ANT_GNSS)1) Physical Characteristics Size: (29.0±0.15)mm × (25.0±0.15)mm × (2.25±0.2)mm Package: LGA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 14 / 81 Weight: approx. 3.8g Temperature Range Operation temperature range: -35°C ~ +75°C 2) Extended temperature range: -40°C ~ +85°C 3) Storage temperature range: -40°C ~ +90°C Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive 1. 1) GNSS antenna interface is only supported on EG95-NA. 2. 2) Within operating temperature range, the module is 3GPP compliant. 3. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module will meet 3GPP specifications again. 4. “*” means under development. 2.3. Functional Diagram The following figure shows a block diagram of EG95 and illustrates the major functional parts.  Power management  Baseband  DDR+NAND flash  Radio frequency  Peripheral interfaces NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 15 / 81 BasebandPMICTransceiver NANDDDR2SDRAMPAPAM SwitchANT_MAIN ANT_DIVVBAT_BBVBAT_RFPWRKEYVDD_EXT USB PCM UARTI2CRESET_N19.2MXOSTATUSGPIOsControlIQ ControlDuplexerSAWTxPRx DRx(U)SIM2 SPI(U)SIM1SAWLNAANT_GNSS1)SAWGPS Figure 1: Functional Diagram 1) GNSS antenna interface is only supported on EG95-NA. 2.4. Evaluation Board In order to help customers develop applications conveniently with EG95, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 16 / 81 3 Application Interfaces 3.1. General Description EG95 is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:  Power supply  (U)SIM interfaces  USB interface  UART interfaces  PCM and I2C interfaces  SPI interface  Status indication
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 17 / 81 3.2. Pin Assignment The following figure shows the pin assignment of EG95 module. RESERVEDPCM_SYNCPCM_CLKPCM_DINPCM_DOUTRESERVEDRESERVEDPWRKEY1)RESERVEDRESET_NRESERVED123456711121314151617185051525354555859606162USB_DMAP_READYSTATUSNETLIGHTDBG_RXDDBG_TXDRESERVEDCLK_OUTSPI_CLKSPI_MOSISPI_MISOVDD_EXTDTRGNDUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDRIDCDCTSTXDRXDVBAT_BBVBAT_BBUSIM_GNDGNDRESERVED (EG95-E)3130292827262322212019109USB_DPUSB_VBUSRESERVEDGNDRESERVEDRESERVEDRTSI2C_SCLI2C_SDA8494847464544434041423938373635343332245756GNDGNDANT_MAINGNDGNDRESERVEDVBAT_RFVBAT_RFGNDGNDANT_DIV (EG95-E)RESERVEDGNDUSIM1_PRESENCE63646566676883848586878898979695949378777675747391 9289 9071 7269 7080 7982 81100 99102 101POWER USB UART (U)SIM OTHERSGND RESERVEDPCM ANT25USIM2_PRESENCEUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDSPIUSB_BOOT103104 105106ANT_GNSS (EG95-NA)/ANT_DIV (EG95-NA)/ Figure 2: Pin Assignment (Top View)
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 18 / 81 1. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 2. Keep all RESERVED pins and unused pins unconnected. 3. GND pads should be connected to ground in the design. 4. Please note that the definition of pin 49 and 56 are different between EG95-E and EG95-NA. 3.3. Pin Description The following tables show the pin definition and description of EG95. Table 3: IO Parameters Definition Type Description IO Bidirectional DI Digital input DO Digital output PI Power input PO Power output AI Analog input AO Analog output OD Open drain Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for module’s baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 0.8A. VBAT_RF 52, 53 PI Power supply for module’s RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 1.8A in a NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 19 / 81 transmitting burst. VDD_EXT 29 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Ground Turn on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. RESET_N 17 DI Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO Indicate the module’s operation status VOin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep this pin open. NETLIGHT 21 DO Indicate the module’d network activity status VOin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB detection Vnorm=5.0V USB_DP 9 IO USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. USB_DM 10 IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 20 / 81 (U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified ground for (U)SIM card USIM1_VDD 43 PO Power supply for (U)SIM card For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3.0V is supported by the module automatically. USIM2_VDD 87 USIM1_DATA 45 IO Data signal of (U)SIM card For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOin=2.55V USIM2_DATA 86 USIM1_CLK 46 DO Clock signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOin=2.55V USIM2_CLK 84 USIM1_RST 44 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOin=2.55V USIM2_RST 85 USIM1_ PRESENCE 42 DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USIM2_ PRESENCE 83
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 21 / 81 Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 39 DO Ring indicator VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. DCD 38 DO Data carrier detection VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. CTS 36 DO Clear to send VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. RTS 37 DI Request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DTR 30 DI Data terminal ready. Sleep mode control. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. TXD 35 DO Transmit data VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. RXD 34 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. DBG_RXD 22 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 22 / 81 PCM_DIN 6 DI PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM_DOUT 7 DO PCM data output VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. PCM_SYNC 5 IO PCM data frame synchronization signal VOLmax=0.45V VOin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. PCM_CLK 4 IO PCM clock VOLmax=0.45V VOin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. I2C_SDA 41 OD I2C serial data. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. SPI Interface Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK 26 DO Clock signal of SPI interface VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it open. SPI_MOSI 27 DO Master output slave input of SPI interface VOLmax=0.45V VOin=1.35V 1.8V power domain. If unused, keep it
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 23 / 81 open. SPI_MISO 28 DI Master input slave output of SPI interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment ANT_GNSS 49 (EG95- NA) AI GNSS antenna pad 50Ω impedance. If unused, keep it open. Pin 49 is defined as ANT_DIV on EG95-E. ANT_DIV 49 (EG95-E) AI Receive diversity antenna pad 50Ω impedance. If unused, keep it open. ANT_DIV 56 (EG95- NA) AI Receive diversity antenna pad 50Ω impedance. If unused, keep it open. Pin 56 is reserved on EG95-E. ANT_MAIN 60 IO Main antenna pad Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment CLK_OUT 25 DI Clock output Provide a digital clock output for an external audio codec. If unused, keep this pin open. AP_READY 19 DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USB_BOOT 75 DI Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 24 / 81 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. 3.5. Power Saving 3.5.1. Sleep Mode EG95 is able to reduce its current consumption to a minimum value during the sleep mode. The following sections describe the power saving procedures of EG95 module. RESERVED 1, 2, 11~14, 16, 18, 49, 51, 57, 63~66, 76~78, 88, 92~99 Reserved Keep these pins unconnected.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 25 / 81 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level. The following figure shows the connection between the module and the host. RXDTXDRIDTRAP_READYTXDRXDEINTGPIOGPIOModule HostGND GND Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module.  When EG95 has a URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details about RI behavior.  AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"* command for details. “*” means under development. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable the sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 26 / 81 The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostGND GND Figure 4: Sleep Mode Application with USB Remote Wakeup  Sending data to EG95 through USB will wake up the module.  When EG95 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter into the sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostGND GNDRI EINT Figure 5: Sleep Mode Application with RI
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 27 / 81  Sending data to EG95 through USB will wake up the module.  When EG95 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an external control circuit to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable the sleep mode.  Ensure the DTR is held at high level or keep it open.  Disconnect USB_VBUS. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostRI EINTPower SwitchGPIOGND GND Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host. Refer to document [1] for more details about EG95 power management application. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware: The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 28 / 81 Software: AT+CFUN command provides the choice of functionality levels as shown below:  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG95 provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part.  Two VBAT_BB pins for module’s baseband part. The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 Power supply for module’s RF part. 3.3 3.8 4.3 V VBAT_BB 32, 33 Power supply for module’s baseband part. 3.3 3.8 4.3 V GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Ground - 0 - V NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 29 / 81 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. VBATMin.3.3VRippleDropBurst TransmissionBurst Transmission Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to get a stable power source, it is suggested that a zener diode whose dissipation power is more than 0.5W should be used. The following figure shows the star structure of the power supply. ModuleVBAT_RFVBAT_BBVBATC1100uFC6100nFC733pFC810pF++C2100nFC5100uFC333pFC410pFD1 Figure 8: Star Structure of the Power Supply
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 30 / 81 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3A. DC_INMIC29302WUIN OUTENGNDADJ2 4135VBAT 100nF 470uF 100nF100K47K470uF470R51K 1%1%4.7K47KVBAT_EN Figure 9: Reference Circuit of Power Supply In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 31 / 81 Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EG95 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Turn on pulsePWRKEY4.7K47K≥ 500ms Figure 10: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. PWRKEYS1Close to S1TVS Figure 11: Turn on the Module Using Button
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 32 / 81 The turn on scenario is illustrated in the following figure. VIL ≤ 0.5VVIH ≥ 1.3VVBATPWRKEY≥ 500msRESET_NSTATUSInactive ActiveUARTNOTEInactive ActiveUSB≥ 10s≥ 12s≥ 13s Figure 12: Timing of Turning on Module Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 3.7.2. Turn off Module Either of the following methods can be used to turn off the module:  Normal power down procedure: Turn off the module using the PWRKEY pin.  Normal power down procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 33 / 81 VBATPWRKEY≥ 30s≥ 650msRUNNING Power-down procedure OFFModuleStatusSTATUS Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about the AT+QPOWD command. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for 150ms ~ 460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 34 / 81 The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Reset pulseRESET_N4.7K47K150ms~460ms Figure 14: Reference Circuit of RESET_N by Using Driving Circuit RESET_NS2Close to S2TVS Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. VIL ≤ 0.5VVIH ≥ 1.3VVBAT≥ 150msResettingModule Status RunningRESET_NRestart≤ 460ms Figure 16: Timing of Resetting Module
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 35 / 81 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG95 provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM 1 and (U)SIM 2 cards can be switched by AT+QDSIM command. For more details, please refer to document [2]. The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO Power supply for (U)SIM1 card Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 45 IO Data signal of (U)SIM1 card USIM1_CLK 46 DO Clock signal of (U)SIM1 card USIM1_RST 44 DO Reset signal of (U)SIM1 card USIM1_ PRESENCE 42 DI (U)SIM1 card insertion detection USIM_GND 47 Specified ground for (U)SIM card USIM2_VDD 87 PO Power supply for (U)SIM2 card Either 1.8V or 3.0V is supported by the module automatically. USIM2_DATA 86 IO Data signal of (U)SIM2 card USIM2_CLK 84 DO Clock signal of (U)SIM2 card USIM2_RST 85 DO Reset signal of (U)SIM2 card USIM2_ PRESENCE 83 DI (U)SIM2 card insertion detection NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 36 / 81 EG95 supports (U)SIM card hot-plug via the USIM1_PRESENCE and USIM2_PRESENCE pins. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design for (U)SIM1 interface with an 8-pin (U)SIM card connector. ModuleUSIM1_VDDUSIM_GNDUSIM1_RSTUSIM1_CLKUSIM1_DATAUSIM1_PRESENCE0R0R0RVDD_EXT51K100nF (U)SIM Card ConnectorGNDGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGNDUSIM1_VDD15K Figure 17: Reference Circuit of (U)SIM1 Interface with an 8-Pin (U)SIM Card Connector If (U)SIM1 card detection function is not needed, please keep USIM1_PRESENCE unconnected. A reference circuit of (U)SIM1 interface with a 6-pin (U)SIM card connector is illustrated in the following figure. ModuleUSIM1_VDDUSIM_GNDUSIM1_RSTUSIM1_CLKUSIM1_DATA 0R0R0R100nF (U)SIM Card ConnectorGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGND15KUSIM1_VDD Figure 18: Reference Circuit of (U)SIM1 Interface with a 6-Pin (U)SIM Card Connector
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 37 / 81 The following figure shows a reference design of (U)SIM2 interface with an 8-pin (U)SIM card connector. ModuleUSIM2_VDDUSIM_GNDUSIM2_RSTUSIM2_CLKUSIM2_DATAUSIM2_PRESENCE0R0R0RVDD_EXT51K100nF (U)SIM Card ConnectorGNDGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGNDUSIM2_VDD15K Figure 19: Reference Circuit of (U)SIM2 Interface with an 8-Pin (U)SIM Card Connector If (U)SIM2 card detection function is not needed, please keep USIM2_PRESENCE unconnected. A reference circuit of (U)SIM2 interface with a 6-pin (U)SIM card connector is illustrated in the following figure. ModuleUSIM2_VDDUSIM_GNDUSIM2_RSTUSIM2_CLKUSIM2_DATA 0R0R0R100nF (U)SIM Card ConnectorGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGND15KUSIM2_VDD Figure 20: Reference Circuit of (U)SIM2 Interface with a 6-Pin (U)SIM Card Connector
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 38 / 81 In order to enhance the reliability and availability of the (U)SIM cards in customers’ applications, please follow the criteria below in the (U)SIM circuit design:  Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible.  Keep (U)SIM card signals away from RF and VBAT traces.  Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.  To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.  In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not exceed 15pF. The 0Ω resistors should be added in series between the module and the (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.  The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EG95 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 9 IO USB differential data bus (+) Require differential impedance of 90Ω. USB_DM 10 IO USB differential data bus (-) Require differential impedance of 90Ω. USB_VBUS 8 PI USB detection Typically 5.0V GND 3 Ground More details about the USB 2.0 specifications, please visit http://www.usb.org/home.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 39 / 81 The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The following figure shows a reference circuit of USB interface. USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModule MCUUSB_VBUSVDD Figure 21: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification.  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω.  Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides.  Pay attention to the influence of junction capacitance of ESD protection component on USB data lines. Typically, the capacitance value should be less than 2pF.  Keep the ESD protection components to the USB connector as close as possible. 1. EG95 module can only be used as a slave device. 2. “*” means under development. NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 40 / 81 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. The interface can be used for data transmission and AT command communication.  The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment RI 39 DO Ring indicator 1.8V power domain DCD 38 DO Data carrier detection CTS 36 DO Clear to send RTS 37 DI Request to send DTR 30 DI Sleep mode control TXD 35 DO Transmit data RXD 34 DI Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD 23 DO Transmit data 1.8V power domain DBG_RXD 22 DI Receive data 1.8V power domain
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 41 / 81 The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VCCA VCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTRIDCDRTSRXDDTRCTSTXD51K 51K0.1uF 0.1uFRI_MCUDCD_MCURTS_MCURXD_MCUDTR_MCUCTS_MCUTXD_MCUVDD_MCUTranslator Figure 22: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the circuit design of solid line section, in terms of both module input and output circuit design. Please pay attention to the direction of connection.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 42 / 81 MCU/ARMTXDRXDVDD_EXT10KVCC_MCU 4.7K10KVDD_EXTTXDRXDRTSCTSDTRRIRTSCTSGNDGPIO DCDModuleGPIOEINTVDD_EXT 4.7KGND1nF1nF Figure 23: Reference Circuit with Transistor Circuit Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG95 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:  Primary mode (short frame synchronization, works as both master and slave)  Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC. EG95 supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 43 / 81 PCM_CLKPCM_SYNCPCM_DOUTMSB LSB MSB125us1 2 256255PCM_DINMSBLSBMSB Figure 24: Primary Mode Timing PCM_CLKPCM_SYNCPCM_DOUTMSB LSBPCM_DIN125usMSB1 2 3231LSB Figure 25: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 44 / 81 Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 6 DI PCM data input 1.8V power domain PCM_DOUT 7 DO PCM data output 1.8V power domain PCM_SYNC 5 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 4 IO PCM data bit clock 1.8V power domain I2C_SCL 40 OD I2C serial clock Require an external pull-up to 1.8V I2C_SDA 41 OD I2C serial data Require an external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] about AT+QDAI command for details. The following figure shows a reference design of PCM interface with external codec IC. PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec Figure 26: Reference Circuit of PCM Application with Audio Codec 1. It is recommended to reserve RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK. 2. EG95 works as a master device pertaining to I2C interface. NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 45 / 81 3.13. SPI Interface SPI interface of EG95 acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip select. Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK 26 DO Clock signal of SPI interface 1.8V power domain SPI_MOSI 27 DO Master output slave input of SPI interface 1.8V power domain SPI_MISO 28 DI Master input slave output of SPI interface 1.8V power domain The following figure shows a reference design of SPI interface with peripherals. SPI_MISOSPI_MOSISPI_CLKModuleSPI_CLKSPI_MISOSPI_MOSI Peripherals Figure 27: Reference Circuit of SPI Interface with Peripherals 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 46 / 81 Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’s network activity status 1.8V power domain Table 17: Working State of the Network Status Indicator Pin Name Logic Level Changes Network Status NETLIGHT Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. 4.7K47KVBAT2.2KModuleNETLIGHT Figure 28: Reference Circuit of the Network Status Indicator 3.15. STATUS The STATUS pin is set as the module status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the module’s operating status 1.8V power domain
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 47 / 81 A reference circuit is shown as below. 4.7K47KVBAT2.2KModule STATUS Figure 29: Reference Circuit of STATUS 3.16. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI are shown as below. Table 19: Default Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns The default RI behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 48 / 81 4 GNSS Receiver 4.1. General Description EG95 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG95 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG95 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EG95. Table 20: GNSS Performance Parameter Description Conditions Typ. Unit Sensitivity (GNSS) Cold start Autonomous TBD dBm Reacquisition Autonomous TBD dBm Tracking Autonomous TBD dBm TTFF (GNSS) Cold start @open sky Autonomous TBD s XTRA enabled TBD s Warm start @open sky Autonomous TBD s XTRA enabled TBD s Hot start Autonomous TBD s
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 49 / 81 @open sky XTRA enabled TBD s Accuracy (GNSS) CEP-50 Autonomous @open sky TBD m 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers’ design.  Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.  Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas.  Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection.  Keep the characteristic impedance for ANT_GNSS trace as 50Ω. Please refer to Chapter 5 for GNSS reference design and antenna installation information. NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 50 / 81 5 Antenna Interfaces EG95 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG95-NA. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 21: Pin Definition of RF Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN 60 IO Main antenna pad 50Ω impedance ANT_DIV (EG95-E) 49 AI Receive diversity antenna pad 50Ω impedance ANT_DIV (EG95-NA) 56 AI Receive diversity antenna pad 50Ω impedance 5.1.2. Operating Frequency Table 22: Module Operating Frequencies 3GPP Band Transmit Receive Unit EGSM900 880~915 925~960 MHz DCS1800 1710~1785 1805~1880 MHz WCDMA B1 1920~1980 2110~2170 MHz WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 51 / 81 WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE FDD B4 1710~1755 2110~2155 MHz LTE FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE FDD B12 699~716 729~746 MHz LTE FDD B13 777~787 746~756 MHz LTE-FDD B20 832~862 791~821 MHz LTE-FDD B28A 703~733 758~788 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. ANT_MAINR1 0RC1Module MainantennaNMC2NMR2 0RC3Diversity antennaNMC4NMANT_DIV Figure 30: Reference Circuit of RF Antenna Interface
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 52 / 81 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. 3. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures. . Figure 31: Microstrip Line Design on a 2-layer PCB Figure 32: Coplanar Waveguide Line Design on a 2-layer PCB NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 53 / 81 Figure 33: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.  The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.  The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones.  There should be clearance area under the signal pin of the antenna connector or solder joint.  The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [4].
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 54 / 81 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG95-NA.The following tables show pin definition and frequency specification of GNSS antenna interface. Table 23: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS (EG95-NA) 49 AI GNSS antenna 50Ω impedance Table 24: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098±2.046 MHz A reference design of GNSS antenna is shown as below. GNSS AntennaVDDModuleANT_GNSS47nH10R0.1uF0RNM NM100pF Figure 35: Reference Circuit of GNSS Antenna 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 55 / 81 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 25: Antenna Requirements Type Requirements GNSS1) Frequency range: 1561MHz ~ 1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB GSM/WCDMA/LTE VSWR: ≤ 2 Efficiency : > 30% Max Input Power: 50 W Input Impedance: 50Ω Cable insertion loss: < 1dB (EGSM900,WCDMA B5/B8, LTE B5/B8/B12/B13/B20/B28A) Cable Insertion Loss: < 1.5dB (DCS1800, WCDMA B1/B2/B4, LTE B1/B2/B3/B4) Cable insertion loss: < 2dB (LTE B7) 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 56 / 81 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by HIROSE. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 57 / 81 The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 58 / 81 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 26: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Ratings Table 27: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 59 / 81 Voltage drop during burst transmission Maximum power control level on EGSM900 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 1.8 2.0 A USB_VBUS USB connection detection 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 28: Operation and Storage Temperatures Parameter Min. Typ. Max. Unit Operation Temperature Range 1) -35 +25 +75 ºC Extended Temperature Range 2) -40 +85 ºC Storage Temperature Range -40 +90 ºC 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. NOTES
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 60 / 81 6.4. Current Consumption The values of current consumption are shown below. Table 29: EG95-E Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 15 uA Sleep state AT+CFUN=0 (USB disconnected) 1.3 mA GSM DRX=2 (USB disconnected) 2.3 mA GSM DRX=5 (USB suspend) 2.0 mA GSM DRX=9 (USB disconnected) 1.6 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=64 (USB suspend) 2.1 mA WCDMA PF=512 (USB disconnected) 1.3 mA LTE-FDD PF=64 (USB disconnected) 2.3 mA LTE-FDD PF=64 (USB suspend) 2.6 mA LTE-FDD PF=256 (USB disconnected) 1.5 mA Idle state GSM DRX=5 (USB disconnected) 21.0 mA GSM DRX=5 (USB connected) 31.0 mA WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 21.0 mA LTE-FDD PF=64 (USB connected) 31.0 mA GPRS data transfer EGSM900 4DL/1UL @32.35dBm 268 mA EGSM900 3DL/2UL @32.16dBm 459 mA EGSM900 2DL/3UL @30.57dBm 547 mA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 61 / 81 EGSM900 1DL/4UL @29.45dBm 631 mA DCS1800 4DL/1UL @29.14dBm 177 mA DCS1800 3DL/2UL @29.07dBm 290 mA DCS1800 2DL/3UL @28.97dBm 406 mA DCS1800 1DL/4UL @28.88dBm 517 mA EDGE data transfer EGSM900 4DL/1UL PCL=8 @26.88dBm 167 mA EGSM900 3DL/2UL PCL=8 @26.84dBm 278 mA EGSM900 2DL/3UL PCL=8 @26.76dBm 385 mA EGSM900 1DL/4UL PCL=8 @26.54dBm 492 mA DCS1800 4DL/1UL PCL=2 @25.66dBm 169 mA DCS1800 3DL/2UL PCL=2 @25.59dBm 256 mA DCS1800 2DL/3UL PCL=2 @25.51dBm 341 mA DCS1800 1DL/4UL PCL=2 @25.38dBm 432 mA WCDMA data transfer WCDMA B1 HSDPA @22.48dBm 586 mA WCDMA B1 HSUPA @22.29dBm 591 mA WCDMA B8 HSDPA @22.24dBm 498 mA WCDMA B8 HSUPA @21.99dBm 511 mA LTE data transfer LTE-FDD B1 @23.37dBm 736 mA LTE-FDD B3 @22.97dBm 710 mA LTE-FDD B7 @23.17dBm 775 mA LTE-FDD B8 @23.04dBm 651 mA LTE-FDD B20 @23.21dBm 699 mA LTE-FDD B28A @22.76dBm 714 mA GSM voice call EGSM900 PCL=5 @32.36dBm 271 mA DCS1800 PCL=0 @29.19dBm 181 mA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 62 / 81 WCDMA voice call WCDMA B1 @22.91dBm 632 mA WCDMA B8 @23.14dBm 546 mA Table 30: EG95-NA Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down TBD uA Sleep state AT+CFUN=0 (USB disconnected) TBD mA WCDMA PF=64 (USB disconnected) TBD mA WCDMA PF=64 (USB suspend) TBD mA WCDMA PF=512 (USB disconnected) TBD mA LTE-FDD PF=64 (USB disconnected) TBD mA LTE-FDD PF=64 (USB suspend) TBD mA LTE-FDD PF=256 (USB disconnected) TBD mA Idle state WCDMA PF=64 (USB disconnected) TBD mA WCDMA PF=64 (USB connected) TBD mA LTE-FDD PF=64 (USB disconnected) TBD mA LTE-FDD PF=64 (USB connected) TBD mA WCDMA data transfer WCDMA B2 HSDPA @ TBD dBm TBD mA WCDMA B2 HSUPA @ TBD dBm TBD mA WCDMA B4 HSDPA @ TBD dBm TBD mA WCDMA B4 HSUPA @ TBD dBm TBD mA WCDMA B5 HSDPA @ TBD dBm TBD mA WCDMA B5 HSUPA @ TBD dBm TBD mA LTE data transfer LTE-FDD B2 @ TBD dBm TBD mA LTE-FDD B4 @ TBD dBm TBD mA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 63 / 81 LTE-FDD B5 @ TBD dBm TBD mA LTE-FDD B12 @ TBD dBm TBD mA LTE-FDD B13 @ TBD dBm TBD mA WCDMA voice call WCDMA B2 @ TBD dBm TBD mA WCDMA B4 @ TBD dBm TBD mA WCDMA B5 @ TBD dBm TBD mA Table 31: GNSS Current Consumption of EG95-NA 6.5. RF Output Power The following table shows the RF output power of EG95 module. Table 32: RF Output Power Frequency Max. Min. EGSM900 33dBm±2dB 5dBm±5dB DCS1800 30dBm±2dB 0dBm±5dB EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB <-49dBm Parameter Description Conditions Typ. Unit IVBAT (GNSS) Searching (AT+CFUN=0) Cold start @Passive Antenna TBD mA Lost state @Passive Antenna TBD mA Tracking (AT+CFUN=0) Instrument Environment TBD mA Open Sky @Passive Antenna TBD mA Open Sky @Active Antenna TBD mA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 64 / 81 LTE-FDD B1/B2/B3/B4/B5/B7/ B8/B12/B13/B20/B28A 23dBm±2dB <-39dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG95 module. Table 33: EG95-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900 -108.6dBm NA NA -102dBm DCS1800 -109.4 dBm NA NA -102dbm WCDMA B1 -109.5dBm -110dBm -112.5dBm -106.7dBm WCDMA B8 -109.5dBm -110dBm -112.5dBm -103.7dBm LTE-FDD B1 (10M) -97.5dBm -98.3dBm -101.4dBm -96.3dBm LTE-FDD B3 (10M) -98.3dBm -98.5dBm -101.5dBm -93.3dBm LTE-FDD B7 (10M) -96.3dBm -98.4dBm -101.3dBm -94.3dBm LTE-FDD B8 (10M) -97.1dBm -99.1dBm -101.2dBm -93.3dBm LTE-FDD B20 (10M) -97dBm -99dBm -101.3dBm -93.3dBm LTE-FDD B28A (10M) -98.3dBm -99dBm -101.4dBm -94.8dBm NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 65 / 81 Table 34: EG95-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 TBD TBD TBD -104.7dBm WCDMA B4 TBD TBD TBD -106.7dBm WCDMA B5 TBD TBD TBD -104.7dBm LTE-FDD B2 (10M) TBD TBD TBD -94.3dBm LTE-FDD B4 (10M) TBD TBD TBD -96.3dBm LTE-FDD B5 (10M) TBD TBD TBD -94.3dBm LTE-FDD B12 (10M) TBD TBD TBD -93.3dBm LTE-FDD B13 (10M) TBD TBD TBD -93.3dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module’s electrostatic discharge characteristics. Table 35: Electrostatic Discharge Characteristics Tested Points Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 KV All Antenna Interfaces ±4 ±8 KV Other Interfaces ±0.5 ±1 KV
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 66 / 81 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:  On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc.  Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.  The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation.  Make sure the ground pads of the module and PCB are fully connected.  According to customers’ application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them.  The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB.  The size of the heatsink should be larger than that of the module’s shielding cover to avoid the deformation of the shielding cover. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. HeatsinkEG95 ModuleApplication Board Application BoardHeatsinkThermal PadShielding Cover Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 67 / 81 Thermal PadHeatsinkApplication Board Application BoardHeatsinkThermal PadEG95 ModuleShielding Cover Figure 40: Referenced Heatsink Design (Heatsink at the Bottom of Customers’ PCB) The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 68 / 81 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module 25±0.1529±0.15 2.25±0.2 Figure 41: Module Top and Side Dimensions
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 69 / 81 Figure 42: Module Bottom Dimensions (Top View)
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 70 / 81 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 71 / 81 7.3. Design Effect Drawings of the Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module These are design effect drawings of EG95 module. For more accurate pictures, please refer to the module that you get from Quectel. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 72 / 81 8 Storage, Manufacturing and Packaging 8.1. Storage EG95 is stored in a vacuum-sealed bag. The storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:  Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.  Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs.  When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH. 4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC. As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120ºC ) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. NOTE
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 73 / 81 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to document [3]. It is suggested that the peak reflow temperature is 235ºC~245ºC (for SnAg3.0Cu0.5 alloy). The absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below: Time50 100 150 200 250 30050100150200250 160 ºC 200 ºC217070s~120s40s~60sBetween 1~3 ºC/sPreheat Heating CoolingºCsLiquids Temperature Temperature Figure 46: Reflow Soldering Thermal Profile
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 74 / 81 8.3. Packaging EG95 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the packaging details, measured in mm. Figure 47: Tape Dimensions Direction of feedCover tape1310044.5+0.20-0.0048.5 Figure 48: Reel Dimensions
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 75 / 81 9 Appendix A References Table 36: Related Documents SN Document Name Remark [1] Quectel_EC2x&EG9x&EM05_Power_Management_Application_Note Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EM05 [2] Quectel_EG9x_AT_Commands_Manual AT Commands Manual for EG95 and EG91 [3] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide [4] Quectel_RF_Layout_Application_Note RF Layout Application Note Table 37: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 76 / 81 EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long Term Evolution MIMO Multiple Input Multiple Output MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 77 / 81 RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SMS Short Message Service TDD Time Division Duplexing TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOax Maximum Output High Level Voltage Value VOin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 78 / 81 10 Appendix B GPRS Coding Schemes Table 38: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.4
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 79 / 81 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 39: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5 13 3 3 NA 14 4 4 NA
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 80 / 81 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6
LTE Module Series EG95 Hardware Design EG95_Hardware_Design 81 / 81 12 Appendix D EDGE Modulation and Coding Schemes Table 40: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps MCS-8 8-PSK A 54.4kbps 108.8kbps 217.6kbps MCS-9 8-PSK A 59.2kbps 118.4kbps 236.8kbps
FCC Certification Requirements.According to the definition of mobile and fixed device is described in Part 2.1091(b), thisdevice is a mobile device.And the following conditions must be met:1. This Modular Approval is limited to OEM installation for mobile and fixed applicationsonly. The antenna installation and operating configurations of this transmitter, includingany applicable source-based time- averaging duty factor, antenna gain and cable lossmust satisfy MPE categorical Exclusion Requirements of 2.1091.2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT andthe user’s body and must not transmit simultaneously with any other antenna ortransmitter.3.A label with the following statements must be attached to the host end product: Thisdevice contains FCC ID: XMR2010E*1A.4.To comply with FCC regulations limiting both maximum RF output power and humanexposure to RF radiation, maximum antenna gain (including cable loss) must notexceed:WCDMA/LTE: <4dBi5. This module must not transmit simultaneously with any other antenna ortransmitter6. The host end product must include a user manual that clearly defines operatingrequirements and conditions that must be observed to ensure compliance with currentFCC RF exposure guidelines.For portable devices, in addition to the conditions 3 through 6 described above, aseparate approval is required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all otheroperating configurations, including portable configurations with respect to 2.1093 anddifferent antenna configurations.For this device, OEM integrators must be provided with labeling instructions of finishedproducts. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last twoparagraphs:A certified modular has the option to use a permanently affixed label, or an electroniclabel. For a permanently affixed label, the module must be labelled withan FCC ID -Section 2.926 (see 2.2 Certification (labelling requirements) above). The OEM manualmust provide clear instructions explaining to the OEM the labellingrequirements,options and OEM user manual instructions that are required (see nextparagraph).For a host using a certified modular with a standard fixed label, if (1) the module’s FCCID is notvisible when installed in the host, or (2) if the host is marketed so that end usersdo not havestraightforward commonly used methods for access to remove the moduleso that the FCC ID ofthe module is visible; then an additional permanent label referringto the enclosed module:“Contains Transmitter Module FCC ID:;05(*1$” or“Contains FCC ID: XMR201807EG95NA” mustbe used. The host OEM user manual mustalso contain clear instructions on how end users can find and/or access the module andthe FCC ID.The final host / module combination may also need to be evaluated against the FCCPart 15B criteria for unintentional radiators in order to be properly authorized foroperation as a Part 15 digital device.The user’s manual or instruction manual for an intentional or unintentional radiator shallcaution the user that changes or modifications not expressly approved by the partyresponsible for compliance could void the user's authority to operate the equipment. Incases where the manual is provided only in a form other than paper, such as on a
computer disk or over the Internet, the information required by this section may beincluded in the manual in that alternative form, provided the user can reasonably beexpected to have the capability to access information in that form.This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2)this device must accept any interference received, including interference that maycause undesired operation.Changes or modifications not expressly approved by the manufacturer could void theuser’s authority to operate the equipment.To ensure compliance with all non-transmitter functions the host manufacturer isresponsible for ensuring compliance with the module(s) installed and fully operational. Forexample, if a host was previously authorized as an unintentional radiator under theDeclaration of Conformity procedure without a transmitter certified module and a moduleis added, the host manufacturer is responsible for ensuring that the after the module isinstalled and operational the host continues to be compliant with the Part 15Bunintentional radiator requirements.
The host product shall be properly labelled to identify the modules within the hostproduct.The Innovation, Science and Economic Development Canada certification label of amodule shall be clearly visible at all times when installed in the host product; otherwise,the host product must be labelled to display the Innovation, Science and EconomicDevelopment Canada certification number for the module, preceded by the word“Contains” or similar wording expressing the same meaning, as follows:“Contains IC: 10224A-2018EG95NA” or “where: 10224A-2018EG95NA is the module’scertification number”.Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'unmodule doit être clairement visible en tout temps lorsqu'il est installé dans le produit hôte; sinon,le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation,Sciences et Développement économique Canada pour le module, précédé du mot «Contient» oud'un libellé semblable exprimant la même signification, comme suit:"Contient IC: 10224A-2018EG95NA" ou "où: 10224A-2018EG95NA est le numéro de certificationdu module".
A label with the following statements must be attached to the host end product: This devicecontains IC:10224A-2018EG95NA.The manual provides guidance to the host manufacturer will be included in the documentationthat will be provided to the OEM.The module is limited to installation in mobile or fixed applications.The separate approval is required for all other operating configurations, including portableconfigurations and different antenna configurations.The OEM integrators are responsible for ensuring that the end-user has no manual or instructionsto remove or install module.The module is limited to OEM installation ONLY.Une étiquette avec les instructions suivantes doit être attachée au produit final hôte:Cet appareil contient IC: 10224A-2018EG95NA.Le manuel fournit des conseils au fabricant hôte sera inclus dans la documentation qui serafournie à l'OEM.Le module est limité à l'installation dans des applications mobiles ou fixes.L'approbation distincte est requise pour toutes les autres configurations de fonctionnement, ycompris les configurations portables et différentes configurations d'antenne.Les intégrateurs OEM sont responsables de s'assurer que l'utilisateur n'a pas de manuel oud'instructions pour retirer ou installer le module.Le module est limité à l'installation OEM SEULEMENT.

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