RAKwireless Technology RAK833 LoRa Concentrator Gateway Module User Manual 1 User Manual 12 28x

Shenzhen Rakwireless Technology Co., Ltd. LoRa Concentrator Gateway Module 1 User Manual 12 28x

User Manual

Download: RAKwireless Technology RAK833 LoRa Concentrator Gateway Module User Manual 1 User Manual 12 28x
Mirror Download [FCC.gov]RAKwireless Technology RAK833 LoRa Concentrator Gateway Module User Manual 1 User Manual 12 28x
Document ID4121434
Application IDobycI72HLvAMkXvFJW+47g==
Document DescriptionUser Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize141.43kB (1767899 bits)
Date Submitted2018-12-28 00:00:00
Date Available2018-12-28 00:00:00
Creation Date2018-12-28 13:15:02
Producing SoftwareAcrobat Distiller 9.0.0 (Windows)
Document Lastmod2018-12-28 11:25:17
Document TitleMicrosoft Word - 1.User_Manual-12.28.docx
Document CreatorPScript5.dll Version 5.2.2
Document Author: SZ062

RAK833 DataSheeet
RAK
K833Lo
oRa Gatew
G way
MiniPCIemo
odules
swith SPI and
a US
SBinte
erface
D sheet V1.3
Datas
© 2018 Rakw
wireless all riights reserve
ed.
Mentioned
in
n this docume
ent, the actual company and product
names,
trade
emarks are th
heir respective owners.
After
updatin
ng new versio
on, this docu
ument withou
ut prior notice
e.
ShenzhenRak
kwirelessTechno
ologyCo.,LtdCo
opyright©
www.rakwiresle
ess.comETDX1770224
RAK833 DataSheeet
Conten
nts
Contents
................................................................................................................................. 2
1.
Functtional desc
cription ................................................................................................... 4
1.1.
Ov
verview .................................................................................................................. 4
1.2. Produ
uct Parameters ...................................................................................................... 4
1.3.
2.
Orrder NO. ................................................................................................................. 5
Interfa
aces ........................................................................................................................ 5
2.1.
Ov
verview .................................................................................................................. 5
2.2.
Interface ................................................................................................................... 6
2.3.
Pin definitio
on with mini-PCIE ................................................................................. 6
2.3.1.
Module supply input ......................................................................................... 7
2.3.2.
Antenna
a RF interffaces ...................................................................................... 8
2.3.3.
SPI interface ...................................................................................................... 8
2.3.4.
erface .................................................................................................... 8
USB inte
2.3.5.
RESET ................................................................................................................ 8
2.3.6.
SPDT_S
SEL ......................................................................................................... 8
3.
Electrrical speciffications ................................................................................................. 9
3.1.
Ab
bsolute maximum
rating
...................................................................................... 9
3.2.
Ma
aximum ESD
......................................................................................................... 9
3.3.
Op
perating Conditions
s ........................................................................................... 10
3.3.1.
3.3.2.
3.3.3.
3.3.4.
Op
perating temp
perature rang
ge .................................................................................................................10
Su
upply/power pins
p ..................................................................................................................................10
Cu
urrent consum
mption ..............................................................................................................................10
Lo
oRa RF chara
acteristics .........................................................................................................................10
ShenzhenRak
kwirelessTechno
ologyCo.,LtdCo
opyright©
www.rakwiresle
ess.comETDX1770224
RAK833 DataSheeet
4.
Mecha
anical specifications
s .............................................................................................11
5.
RAK833 Module
e schematiic .......................................................................................... 12
6.
Refere
ence Appliication .................................................................................................. 15
7.
Conta
act ......................................................................................................................... 16
8.
Chang
ge Note ................................................................................................................. 17
ShenzhenRak
kwirelessTechno
ologyCo.,LtdCo
opyright©
www.rakwiresle
ess.comETDX1770224
RAK833 DataSheeet
1. Func
ctional descrription
1.1. Overv
view
The RA
AK833 is a family of LoRa conccentrator cards
with mini PCIe form facto
or based on
SX
X1301, which enabless an easy integration into an existing routers and othe
ers networkk equipmen
nt
with Lora Ga
ateway capabilities.
The card can be used
in anyy embedded
d platform offering a free
mini-P
PCIe slot with USB and
SP
PI connectiivity.
RA
AK833area
acompletea
andcostefficcientLoRa gateway
sollutionofferin
ngupto10 p
programma
able paralle
el
de
emodulatio
on paths. It targeted
d at smarrt metering
g fixed ne
etworks an
nd Internett of Things
ap
pplicationss
with
up
to
500
nodes
pe
er
km2
in
mo
oderately
interfered
en
nvironment.Themodu
uleshavethe
eindustrysta
andardPCIE
ExpressMin
niCardformffactor,which
henablesea
syyintegration
nintoanapplicationboarrdandisalso
oidealforma
anufacturing
gofsmallserries.
1.2.
Produ
uct Parameters
Module
Protocol
Lora Chip
pset
Dual-Ban
nd
Frequenccy Range
Frequency
LoRaW
WAN 1.0.2
SX13011
868MH
Hz,915MHz
EU 8633‐870MHz
US 9233.3‐927.5 MH
Hz
Power Inp
put
Hardware
e Interface
Software
e Interface
Multichan
nnel
LEDs
USB
Node Nu
umbers
Range
Power Consumption
DC 3.3
3 ± 5%
Mini-PC
CIE
USB/SPI
RX Senssitivity
Up to -136.5dBm@
@SF12
Up to +9
+ dBm
Up to +9
+ dBm
Max RF Output
Mean RF
F Output
Operation Temperatu
ure
8uplinkks、1downlin
nk
2*LEDss for PA_EN and LNA_EN
USB2.0
0, USB-to-SP
PI bridge FT2
2232H
500 no
odes/km
Urban2
2~4km/Subur5~10km/Op
pen Area>15kkm
TX (ma
ax): 135 mA
RX(all channels):26
60mA
Ldle:71
1mA
‐48 to +85°
Table1
1: Module Pa
arameters
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
RAK833 DataSheeet
As desccribed in Fiigure 1, the
e RAK833 card integ
grates one SX1301 ch
hip and two
o SX1255//7
an
nd other ch
hip for RF signal,
whicch represents the corre of the de
evice, providing the re
elated LoR
Ra
modem and processing
g functiona
allilies. Add
ditional sign
nal conditio
oning circuiitry is imple
emented fo
or
PC
CI Expresss Mini Card compliancce, and one
e U. FL con
nnectors arre available
e for extern
nal antenna
as
integration.
1.3. Orderr NO.
Paart Numberr
Description
RAK833-SPI/USB-915
USB and
d SPI, 923.3MHz-9277.5 MHz
RAK833-SPI/USB-868
USB and
a SPI, 863MHz-8700 MHz
RAK833-SPI-915
SPI, 923.3MHHz-927.5 MMHz
RAK833-SPI-868
SPI, 863MHHz-870 MHzz
Tablle2: Module Number
2 Interrfaces
2.
2.1. Overv
view
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
RAK833 DataSheeet
Figu
ure2:Module View
2.2. Interfface
Figure
e3:Module Interface
2.3. Pin definition with mini-PCIE
No
Mini PC
CIEx PIN
Re
ev.2.0
RAK833 PIN
Power
I/O
Descrription
N/A
Remarks
WAKE#
NC
3.3Vaux
3.3Vaux
COEX1
NC
GND
GND
COEX2
NC
N/A
Internallyn
notconnected
1.5V
NC
N/A
Internallyn
notconnected
CLKREQ
Q#
NC
N/A
Internallyn
notconnected
UIM_PW
WR
NC
N/A
Internallyn
notconnected
GND
GND
10
UIM_DA
ATA
NC
N/A
Internallyn
notconnected
11
REFCLK-
NC
N/A
Internallyn
notconnected
12
UIM_CLK
NC
N/A
Internallyn
notconnected
13
REFCLK++
NC
N/A
Internallyn
notconnected
14
UIM_RES
SET
NC
N/A
Internallyn
notconnected
15
GND
GND
16
UIM_SPU
NC
N/A
Internallyn
notconnected
17
UIM_IC_
_DM
SPDT_SEL
N/A
Internal 1
10K ohm pull-up
18
GND
GND
19
N/A
N/A
20
W_DISABLE1#
NC
21
GND
GND
22
PERST#
23
PERn0
24
3.3Vaux
3.3Vaux
25
PERp0
NC
3.3Vaux
N/A
Internallyn
notconnected
RAK
K833supply input
Internallyn
notconnected
N/A
GND
GND
GND
GND
N/A
N/A
N/A
N/A
Gro
ound
Gro
ound
Gro
ound
Gro
ound
ConnectttoGround
Connectttoground
Connectttoground
Connectttoground
N/A
N/A
Internallyn
notconnected
N/A
GND
Connectto
o3.3V
N/A
Gro
ound
Connectttoground
RESET
K833resetinput
RAK
Active hig
gh(≥100ns) for SX1301
NC
N/A
3.3Vaux
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
Internallyn
notconnected
K833supply input
RAK
N/A
Connectto
o3.3V
Internallyn
notconnected
RAK833 DataSheeet
26
GND
GND
GND
N/A
27
GND
GND
GND
N/A
Connectttoground
28
1.5V
NC
N/A
Internallyn
notconnected
29
GND
GND
30
SMB_CL
LK
NC
N/A
31
PETn0
NC
N/A
Internallyynotconnected
32
SMB_DA
ATA
NC
N/A
Internallyynotconnected
33
PETp0
NC
N/A
Internallyynotconnected
34
GND
GND
GND
N/A
Gro
ound
Connectttoground
35
GND
GND
GND
N/A
Gro
ound
Connectttoground
36
USB_D-
USB_D-
USB
I/O
USB
BDataLineD-
37
GND
GND
GND
N/A
Gro
ound
90-ohm nominal differen
ntial
impedan
nce.
Pull-up,p
pulldownand
dseriesresistorsa
asrequiredbyU
SB2.0specificationsare partof
pin driverand
theUSBp
Connectttoground
38
USB_D+
USB_D+
USB
I/O
USB
BDataLineD+
90-ohm nominal differen
ntial
nce.
impedan
Pull-up,p
pulldownand
dseriesresistorsa
asrequiredbyU
SB2.0specificationsare partof
pin driverand
theUSBp
neednotb
beprovidedextern
nally.
39
3.3Vaux
3.3Vaux
3.3Vaux
K833supply input
RAK
Connecttto3.3V
40
GND
GND
GND
N/A
Gro
ound
Connectttoground
41
3.3Vaux
3.3Vaux
3.3Vaux
K833supply input
RAK
Connecttto3.3V
42
LED_WW
WAN#
NC
43
GND
GND
44
LED_WL
LAN#
NC
N/A
45
Reserved
PCIe_SCK
I/O
46
LED_WP
PAN#
NC
N/A
GND
N/A
GND
N/A
Reserved
PCIe_MISO
I/O
48
1.5V
NC
N/A
Reserved
PCIe_MOSI
50
GND
GND
51
W_DISABLE2#
PCIe_CSN
52
3.3Vaux
3.3Vaux
Gro
ound
GND
3.3Vaux
Connectttoground
Connectttoground
Internallyn
notconnected
Internallyynotconnected
N/A
47
49
Gro
ound
Gro
ound
Connectttoground
Internallyynotconnected
Hos
st SPI CLK
Max 10M
MHz clock
Internallyynotconnected
Hos
st SPI MISO
Internallyynotconnected
I/O
Hos
st SPI MOSI
N/A
Gro
ound
I/O
Hos
st SPI CS
K833supply input
RAK
Connectttoground
Connecttto3.3V
Tab
ble3: Pin Deffinition
2.3.1. Mod
dule supp
ply inputt
RAK833
3 card must be supplied through
h the 3.3Vaux pins by a DC pow
wer supply. The voltage
must be stab
ble, becausse during th
his operation the current drawn frrom 3.3Vau
ux can vary significantly,
ba
ased on the
e power con
nsumption profile of th
he SX1301 chip (see SX1301
DS
S).
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
RAK833 DataSheeet
2.3.2.Ante
enna RF interface
es
The mod
dules have
e one RF interfaces ovver a standard U. FL connectors
(Hirose U. FL-R-SMT
T)
with a characteristic impedance of 50. The RF
R port (AN
NT1) suppo
orts both Txx and Rx, providing
the
an
ntenna interface.
2.3.3. SPI interface
A SPI in
nterface is provided on
o the PCIe
e_SCK, PC
CIe_MISO, PCIe_MOSI, PCIe_C
CSN pins of
the system connector.
T SPI intterface give
The
es access to
t the configuration re
egister of SX
X1301 via a
syynchronouss full-duplexx protocol. Only the slave side is implementted.
2.3.4. USB
B interfac
ce
No
ote: RAK833
3‐SPI don’t have this featture
RAK833
3 card can support the high spe
eed USB to
o SPI by FT
T2232H, it includes a high-speed
USB 2.0 com
mpliant inte
erface with maximum 480 Mb/s data
rate, representin
ng the interfface for an
ny
co
ommunicatiion with an external ho
ost application processsor. The module
itselff acts as a USB devicce
an
nd can be connected to any US
SB host equipped with
h compatib
ble drivers. For more information
n,
please refer to the data
a sheet of FT2232H.
2.3.5. RES
SET
RAK833
3 card inclu
udes the RESET
active-high input signal to reset th
he radio op
perations as
sp
pecified by the SX1301 Specifica
ation.
2.3.6.SPD
DT_SEL
RAK833
3 card in
ncludes the SPDT_SEL inputt for sele
ecting SPI or USB
B interface
e.
SP
PDT_SEL=
="H", USB Port Enab
ble, SPDT_
_SEL="L", SPI Port Enable.
Inte
ernal Pull UP, Defau
ult
USB Port.
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
RAK833 DataSheeet
3 Electtrical specifi
3.
cation
ns
Stre
essingthede
eviceaboveo
oneormoreo
oftheratingslistedintheA
AbsoluteMax
ximumRatin
ngsectionm
ayc
causeperma
anentdamage.Theseares
stressrating
gsonly.Opera
atingthemod
duleatthese
eoratanycon
ditionsothertha
anthosespecifiedintheO
OperatingCo
onditionssec
ctions(chap
pter4.1)ofthe
especificati
shouldbeavo
oided.Expos
suretoAbso
oluteMaximu
umRatingconditionsfore
extendedperriodsmayaf
ons
fectdevicerelia
ability.
Th
he Operating
gconditionra
angedefineth
hoselimitwitthinwhichthe
efunctionalityofthedevic
ceisguaranteed.
Whereap
pplicationinfformationisg
given,itisadv
visoryonlyan
nddoesnotfo
ormpartofthespecificatio
on.
3.1. Abso
olute max
ximum ra
ating
Limitingvvaluesgivenb
belowareinaccordancewith
htheAbsolute
eMaximumRatingSystem
m(IEC134).
Symbol
3.3Vaux
USB
SPDT SEL
RESET
SPI
Descripttion
Modulesu
upplyvoltag
USBD+/D
D-pins
Port sele
ect
RAK833rresetinput
SPI interfface
Condition
InputDCvo
oltageat3.3Va
auxpins
InputDCvo
oltageatUSBinterfacepinss
InputDCvo
oltageatSPDT
T SELinputp
pins
InputDCvo
oltageat RESET inputpin
InputDCvo
oltageat SPI interfacepin
Rho ANT
Tstg
Antennarruggednes
StorageT
Temperatur
OutputRFloadmismatchruggednesssatANT
Miin.
–0.3
–0.3
–0.3
–0.3
Max.
3.
3.
3.
3.
3.
Unit
–40
10:1
85
VSWR
°C
Table4:Ab
bsolutemax
ximumrating
gs
Theproduc
ctisnotprote
ectedagains
stovervoltag
georreversed
dvoltages.If
necessary
y,
vo
oltagespikes
sexceedingtthepowersupplyvoltage
especificatio
on,giveninta
ableabove,m
mustbelimite
edtovaluesw
wi
thinthespecifiedboundarriesbyusinga
appropriatep
protectiondevices.
3.2. Maxim
mum ESD
Parameter
Min
Typic
cal
Max
Unit
Re
emarks
ESDsensitivittyforallpinse
xceptANT1
ESDsensitivittyforANT1
1000
Hu
umanBodyModelaccordingtoJESD22-A114
1000
Hu
umanBodyModelaccordingtoJESD22-A114
ESDimmunityyforANT1
4000
Co
ontactDischargea
accordingtoIEC6
61000-4-2
8000
Airr DischargeaccorrdingtoIEC61000
0-4-2
Table5:MaximumE
ESDratings
RA
AK833cardare
eElectrostaticSensitiveD
Devicesandre
equirespecia
alprecautions
swhenhandling.Seesect
ion7.2forESDha
andlinginstru
uctions.
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
RAK833 DataSheeet
3.3. Opera
ating Co
onditions
Unlessoth
herwiseindica
ated,alloperattingconditionsspecificationssareatanambie
enttemperatu
ureof25°C.
Operation
n beyondth
he operating
g conditions
s is not reco
ommended and
a extende
ed exposure
bey
yondthemmayaffectdev
vicereliability
y.
3..3.1. Operrating temperature range
Paramete
er
Min.
Typic
cal Max.
Unit
Rem
marks
Normalope
eratingtempera
ature
–
–20
+25
+65
°C
Extendedo
operatingtempe
erature
–
–40
+85
°C
Norm
maloperatingte
emperaturerang
ge
(fullyyfunctionalandmeet3GPPspe
ecifications)
Exte
endedoperating
gtemperaturera
ange
(RFp
performancemaybeaffectedoutside
norm
maloperatingrange,thoughmo
oduleisfullyfun
Table6:E
Environmenta
alconditions
3..3.2. Supp
ply/power pins
Symbo
ol
3.3Vauxx
Para
ameter
Mod
dulesupplyo
operatingin
nputvol
Min.
3.00
Typica
al
3.30
Max.
3.60
Unit
Table7:In
nputchara
acteristics
sofSupply//Powerpin
ns
Inputtvoltageat3
3.3Vauxmu
ustbeabove
ethenorma
aloperating
grangeminiimumlimitto
oswitcho
onthemodu
ule.
3..3.3. Curre
ent consu
umption
Mode
Condition
Min
Type
Idle-Mo
ode
All of the chip
p on the board enter idle
mode or shuttdown.
60
100
Active-Mode
(TX)
The power of
o TX channel is 23dBm and
3.3V supply.
TBD
mA
Active-Mode
(RX )
TX disabled and shutdown
n PA.
TBD
mA
Tablle8:Module3.3
3Vauxsupplycurrentconsum
mption
3..3.4. LoRa
a RF chara
acteristics
The follow
wing table gives
typicallly sensitivityy level of the
e RAK833 ca
ard
Sign
nal
Bandwidth/[KHz]
500
500
Spreading Factor
Sensitiv
vity/[dBm]
12
-134
-120
Table9:LoR
Ra RF Chara
acteristics
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
10
Max
Unit
uA
RAK833 DataSheeet
4 Mech
4.
hanica
al spec
cificatio
ons
RAK833
3 card are fully
compliant to the 52-pin
PCI Express Fu
ull-Mini Carrd Type F2 form factor,
with top-side
e and botto
om-side ke
eep-out are
eas, with 50.95
mm nominal le
ength, 30 mm
m nomina
al
width and alll the otherr dimension
ns as defin
ned by the PCI Expre
ess Mini Card Electro
omechanica
al
Sp
pecification
n [9] exceptt for the card thicknesss (nominal value is 3.7 mm), as described in Figure 2.
Th
he weight of
o the RAK8
833 card is about 9.7 g.
Figure4:RA
AK833cardmechanica
aldimensio
ons(topvie
ew,sideview
w,bottomv
view)
Forfurthe
erdetailsreg
gardingmecchanicalspe
ecificationssseethePCIE
ExpressMin
niCardElectt
romecha
anicalSpeciification[9].
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
11
RAK833 DataSheeet
5 RAK833 Mo
5.
odule schem
matic
RAK833
3 card referr Semtech’ss reference
e design of SX1301,
ad
dd a 4 chan
ncel SPDT to switch
SP
PI of SX130
01 to PCI edge
conne
ector or FT2
2232H whicch convert SPI to USB
B2.0 interface.
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
12
RAK833 DataSheeet
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
13
RAK833 DataSheeet
Fig
gure5:RAK
K833cardin nerschem
matic.
Forfurth
herdetailsre
egardingsch
hematic ple
ease refer “S
SX1301DV
VK_e286v02
2a_sch_layyout” from
Semtech.
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
14
RAK833 DataSheeet
6 Reference Applic
6.
cation
Figure
e 4 shows the minimu
um applicattion schema
atic of RAK
K833 card. U
Uses at lesst 3.3V/1A
DC power, co
onnect SPII interface or
o USB inte
erface to the
e main proccessor. If use SPI inte
erface
SP
PDT_SEL should
be tied
to GND
D otherwise
e just let thiss pin open.
Figure6::RAK833card
dreference minimum schematic.
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
15
RAK833 DataSheeet
CC Warnin
ng
FC
Th
his device complies
w part 15 of the FCC
with
C Rules. Op
peration is subject
to th
he following
g two
co
onditions:
(1) This device may nott cause harrmful interfe
erence, and
d (2) this de
evice must accept anyy
interference received, in
ncluding intterference that may ca
ause undessired opera
ation.
An
ny Changes or modificcations nott expressly approved by
b the partyy responsib
ble for comp
pliance
co
ould void th
he user's au
uthority to operate
the equipmentt.
When
the mo
odule is insstalled in the host deviice, the FCC ID label must be vissible throug
gh a
window on th
he final devvice or it mu
ust be visib
ble when an
n access pa
anel, door o
or cover is easily
emoved.
re
If not, a seco
ond label must
be placced on the outside of the
t final device that co
ontains the
fo
ollowing texxt: ―Contain
ns FCC ID: 2AF6B-RA
AK833.
Maximum an
ntenna gain
n allowed fo
or use with this device
e is 2 dBi.
Th
his module complies with
w FCC ra
adiation exp
posure limitts set forth for an unco
ontrolled
en
nvironmentt .This equip
pment shou
uld be insta
alled and op
perated witth minimum
m distance 20
2 cm
be
etween the radiator& your
body.
7 Conttact
7.
Sh
henzhenBu
usiness
E--Mail: ken.yyu@rakwireless.com
Ad
ddress: Rm. 506, Bldg. 3,Minqi Tecchnology Pa
ark,No. 65 LiShan Road
Xili Block, Nanshan Distriict, Shenzhe
en,Guangdo
ong Province
e,China
henzhenTech
hnical
Sh
E‐Mail: farce.cchen@rakwirreless.com
Te
el : 0755-86
6108311
Ad
ddress: Rm. 506, Bldg. 3,Minqi Tecchnology Pa
ark,No. 65 LiShan Road
Xili Block, Nanshan Distriict, Shenzhe
en,Guangdo
ong Province
e,China
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
16
RAK833 DataSheeet
8 Chan
8.
nge No
ote
Versio
on
Date
Chan
nge
V1.0
201
18-01-11
Draft
V1.1
201
18-03-11
Addmodulepicture an
nd fix some mistakes
V1.2
201
18-05-11
Fix some description
n mistake fo
or Part NO a
and parame
eters
V1.3
201
18-06-19
Adjust the
e RF parameters and the content for reading.
Manufactur
re name and address:
SShenzhen Rakwireless Technology Co
o., Ltd.
Room
506, Bldg B, New Compark,
Pin
ngshan First Road,
Taoyuaan Street, Naanshan District, Shenzhen
ShenzhenRakw
wirelessTechnolo
ogyCo.,LtdCop
pyright©
ww
ww.rakwireslesss.comETDX1702224
17

Source Exif Data:
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Author                          : SZ062
Create Date                     : 2018:12:28 13:15:02+08:00
Modify Date                     : 2018:12:28 11:25:17-08:00
XMP Toolkit                     : Adobe XMP Core 5.2-c001 63.139439, 2010/09/27-13:37:26
Format                          : application/pdf
Creator                         : SZ062
Title                           : Microsoft Word - 1.User_Manual-12.28.docx
Creator Tool                    : PScript5.dll Version 5.2.2
Metadata Date                   : 2018:12:28 11:25:17-08:00
Producer                        : Acrobat Distiller 9.0.0 (Windows)
Document ID                     : uuid:0640cb7f-e1a0-4c89-9d38-726462986130
Instance ID                     : uuid:78762c03-a400-48be-877e-84cc7f096e57
Page Count                      : 17
EXIF Metadata provided by EXIF.tools
FCC ID Filing: 2AF6B-RAK833

Navigation menu