RAKwireless Technology RAK833 LoRa Concentrator Gateway Module User Manual 1 User Manual 12 28x
Shenzhen Rakwireless Technology Co., Ltd. LoRa Concentrator Gateway Module 1 User Manual 12 28x
User Manual
RAK833 DataSheeet RAK K833Lo oRa Gatew G way MiniPCIemo odules swith SPI and a US SBinte erface D sheet V1.3 Datas © 2018 Rakw wireless all riights reserve ed. Mentioned in n this docume ent, the actual company and product names, trade emarks are th heir respective owners. After updatin ng new versio on, this docu ument withou ut prior notice e. ShenzhenRak kwirelessTechno ologyCo.,LtdCo opyright© www.rakwiresle ess.comETDX1770224 RAK833 DataSheeet Conten nts Contents ................................................................................................................................. 2 1. Functtional desc cription ................................................................................................... 4 1.1. Ov verview .................................................................................................................. 4 1.2. Produ uct Parameters ...................................................................................................... 4 1.3. 2. Orrder NO. ................................................................................................................. 5 Interfa aces ........................................................................................................................ 5 2.1. Ov verview .................................................................................................................. 5 2.2. Interface ................................................................................................................... 6 2.3. Pin definitio on with mini-PCIE ................................................................................. 6 2.3.1. Module supply input ......................................................................................... 7 2.3.2. Antenna a RF interffaces ...................................................................................... 8 2.3.3. SPI interface ...................................................................................................... 8 2.3.4. erface .................................................................................................... 8 USB inte 2.3.5. RESET ................................................................................................................ 8 2.3.6. SPDT_S SEL ......................................................................................................... 8 3. Electrrical speciffications ................................................................................................. 9 3.1. Ab bsolute maximum rating ...................................................................................... 9 3.2. Ma aximum ESD ......................................................................................................... 9 3.3. Op perating Conditions s ........................................................................................... 10 3.3.1. 3.3.2. 3.3.3. 3.3.4. Op perating temp perature rang ge .................................................................................................................10 Su upply/power pins p ..................................................................................................................................10 Cu urrent consum mption ..............................................................................................................................10 Lo oRa RF chara acteristics .........................................................................................................................10 ShenzhenRak kwirelessTechno ologyCo.,LtdCo opyright© www.rakwiresle ess.comETDX1770224 RAK833 DataSheeet 4. Mecha anical specifications s .............................................................................................11 5. RAK833 Module e schematiic .......................................................................................... 12 6. Refere ence Appliication .................................................................................................. 15 7. Conta act ......................................................................................................................... 16 8. Chang ge Note ................................................................................................................. 17 ShenzhenRak kwirelessTechno ologyCo.,LtdCo opyright© www.rakwiresle ess.comETDX1770224 RAK833 DataSheeet 1. Func ctional descrription 1.1. Overv view The RA AK833 is a family of LoRa conccentrator cards with mini PCIe form facto or based on SX X1301, which enabless an easy integration into an existing routers and othe ers networkk equipmen nt with Lora Ga ateway capabilities. The card can be used in anyy embedded d platform offering a free mini-P PCIe slot with USB and SP PI connectiivity. RA AK833area acompletea andcostefficcientLoRa gateway sollutionofferin ngupto10 p programma able paralle el de emodulatio on paths. It targeted d at smarrt metering g fixed ne etworks an nd Internett of Things ap pplicationss with up to 500 nodes pe er km2 in mo oderately interfered en nvironment.Themodu uleshavethe eindustrysta andardPCIE ExpressMin niCardformffactor,which henablesea syyintegration nintoanapplicationboarrdandisalso oidealforma anufacturing gofsmallserries. 1.2. Produ uct Parameters Module Protocol Lora Chip pset Dual-Ban nd Frequenccy Range Frequency LoRaW WAN 1.0.2 SX13011 868MH Hz,915MHz EU 8633‐870MHz US 9233.3‐927.5 MH Hz Power Inp put Hardware e Interface Software e Interface Multichan nnel LEDs USB Node Nu umbers Range Power Consumption DC 3.3 3 ± 5% Mini-PC CIE USB/SPI RX Senssitivity Up to -136.5dBm@ @SF12 Up to +9 + dBm Up to +9 + dBm Max RF Output Mean RF F Output Operation Temperatu ure 8uplinkks、1downlin nk 2*LEDss for PA_EN and LNA_EN USB2.0 0, USB-to-SP PI bridge FT2 2232H 500 no odes/km Urban2 2~4km/Subur5~10km/Op pen Area>15kkm TX (ma ax): 135 mA RX(all channels):26 60mA Ldle:71 1mA ‐48 to +85° Table1 1: Module Pa arameters ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 RAK833 DataSheeet As desccribed in Fiigure 1, the e RAK833 card integ grates one SX1301 ch hip and two o SX1255//7 an nd other ch hip for RF signal, whicch represents the corre of the de evice, providing the re elated LoR Ra modem and processing g functiona allilies. Add ditional sign nal conditio oning circuiitry is imple emented fo or PC CI Expresss Mini Card compliancce, and one e U. FL con nnectors arre available e for extern nal antenna as integration. 1.3. Orderr NO. Paart Numberr Description RAK833-SPI/USB-915 USB and d SPI, 923.3MHz-9277.5 MHz RAK833-SPI/USB-868 USB and a SPI, 863MHz-8700 MHz RAK833-SPI-915 SPI, 923.3MHHz-927.5 MMHz RAK833-SPI-868 SPI, 863MHHz-870 MHzz Tablle2: Module Number 2 Interrfaces 2. 2.1. Overv view ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 RAK833 DataSheeet Figu ure2:Module View 2.2. Interfface Figure e3:Module Interface 2.3. Pin definition with mini-PCIE No Mini PC CIEx PIN Re ev.2.0 RAK833 PIN Power I/O Descrription N/A Remarks WAKE# NC 3.3Vaux 3.3Vaux COEX1 NC GND GND COEX2 NC N/A Internallyn notconnected 1.5V NC N/A Internallyn notconnected CLKREQ Q# NC N/A Internallyn notconnected UIM_PW WR NC N/A Internallyn notconnected GND GND 10 UIM_DA ATA NC N/A Internallyn notconnected 11 REFCLK- NC N/A Internallyn notconnected 12 UIM_CLK NC N/A Internallyn notconnected 13 REFCLK++ NC N/A Internallyn notconnected 14 UIM_RES SET NC N/A Internallyn notconnected 15 GND GND 16 UIM_SPU NC N/A Internallyn notconnected 17 UIM_IC_ _DM SPDT_SEL N/A Internal 1 10K ohm pull-up 18 GND GND 19 N/A N/A 20 W_DISABLE1# NC 21 GND GND 22 PERST# 23 PERn0 24 3.3Vaux 3.3Vaux 25 PERp0 NC 3.3Vaux N/A Internallyn notconnected RAK K833supply input Internallyn notconnected N/A GND GND GND GND N/A N/A N/A N/A Gro ound Gro ound Gro ound Gro ound ConnectttoGround Connectttoground Connectttoground Connectttoground N/A N/A Internallyn notconnected N/A GND Connectto o3.3V N/A Gro ound Connectttoground RESET K833resetinput RAK Active hig gh(≥100ns) for SX1301 NC N/A 3.3Vaux ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 Internallyn notconnected K833supply input RAK N/A Connectto o3.3V Internallyn notconnected RAK833 DataSheeet 26 GND GND GND N/A 27 GND GND GND N/A Connectttoground 28 1.5V NC N/A Internallyn notconnected 29 GND GND 30 SMB_CL LK NC N/A 31 PETn0 NC N/A Internallyynotconnected 32 SMB_DA ATA NC N/A Internallyynotconnected 33 PETp0 NC N/A Internallyynotconnected 34 GND GND GND N/A Gro ound Connectttoground 35 GND GND GND N/A Gro ound Connectttoground 36 USB_D- USB_D- USB I/O USB BDataLineD- 37 GND GND GND N/A Gro ound 90-ohm nominal differen ntial impedan nce. Pull-up,p pulldownand dseriesresistorsa asrequiredbyU SB2.0specificationsare partof pin driverand theUSBp Connectttoground 38 USB_D+ USB_D+ USB I/O USB BDataLineD+ 90-ohm nominal differen ntial nce. impedan Pull-up,p pulldownand dseriesresistorsa asrequiredbyU SB2.0specificationsare partof pin driverand theUSBp neednotb beprovidedextern nally. 39 3.3Vaux 3.3Vaux 3.3Vaux K833supply input RAK Connecttto3.3V 40 GND GND GND N/A Gro ound Connectttoground 41 3.3Vaux 3.3Vaux 3.3Vaux K833supply input RAK Connecttto3.3V 42 LED_WW WAN# NC 43 GND GND 44 LED_WL LAN# NC N/A 45 Reserved PCIe_SCK I/O 46 LED_WP PAN# NC N/A GND N/A GND N/A Reserved PCIe_MISO I/O 48 1.5V NC N/A Reserved PCIe_MOSI 50 GND GND 51 W_DISABLE2# PCIe_CSN 52 3.3Vaux 3.3Vaux Gro ound GND 3.3Vaux Connectttoground Connectttoground Internallyn notconnected Internallyynotconnected N/A 47 49 Gro ound Gro ound Connectttoground Internallyynotconnected Hos st SPI CLK Max 10M MHz clock Internallyynotconnected Hos st SPI MISO Internallyynotconnected I/O Hos st SPI MOSI N/A Gro ound I/O Hos st SPI CS K833supply input RAK Connectttoground Connecttto3.3V Tab ble3: Pin Deffinition 2.3.1. Mod dule supp ply inputt RAK833 3 card must be supplied through h the 3.3Vaux pins by a DC pow wer supply. The voltage must be stab ble, becausse during th his operation the current drawn frrom 3.3Vau ux can vary significantly, ba ased on the e power con nsumption profile of th he SX1301 chip (see SX1301 DS S). ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 RAK833 DataSheeet 2.3.2.Ante enna RF interface es The mod dules have e one RF interfaces ovver a standard U. FL connectors (Hirose U. FL-R-SMT T) with a characteristic impedance of 50. The RF R port (AN NT1) suppo orts both Txx and Rx, providing the an ntenna interface. 2.3.3. SPI interface A SPI in nterface is provided on o the PCIe e_SCK, PC CIe_MISO, PCIe_MOSI, PCIe_C CSN pins of the system connector. T SPI intterface give The es access to t the configuration re egister of SX X1301 via a syynchronouss full-duplexx protocol. Only the slave side is implementted. 2.3.4. USB B interfac ce No ote: RAK833 3‐SPI don’t have this featture RAK833 3 card can support the high spe eed USB to o SPI by FT T2232H, it includes a high-speed USB 2.0 com mpliant inte erface with maximum 480 Mb/s data rate, representin ng the interfface for an ny co ommunicatiion with an external ho ost application processsor. The module itselff acts as a USB devicce an nd can be connected to any US SB host equipped with h compatib ble drivers. For more information n, please refer to the data a sheet of FT2232H. 2.3.5. RES SET RAK833 3 card inclu udes the RESET active-high input signal to reset th he radio op perations as sp pecified by the SX1301 Specifica ation. 2.3.6.SPD DT_SEL RAK833 3 card in ncludes the SPDT_SEL inputt for sele ecting SPI or USB B interface e. SP PDT_SEL= ="H", USB Port Enab ble, SPDT_ _SEL="L", SPI Port Enable. Inte ernal Pull UP, Defau ult USB Port. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 RAK833 DataSheeet 3 Electtrical specifi 3. cation ns Stre essingthede eviceaboveo oneormoreo oftheratingslistedintheA AbsoluteMax ximumRatin ngsectionm ayc causeperma anentdamage.Theseares stressrating gsonly.Opera atingthemod duleatthese eoratanycon ditionsothertha anthosespecifiedintheO OperatingCo onditionssec ctions(chap pter4.1)ofthe especificati shouldbeavo oided.Expos suretoAbso oluteMaximu umRatingconditionsfore extendedperriodsmayaf ons fectdevicerelia ability. Th he Operating gconditionra angedefineth hoselimitwitthinwhichthe efunctionalityofthedevic ceisguaranteed. Whereap pplicationinfformationisg given,itisadv visoryonlyan nddoesnotfo ormpartofthespecificatio on. 3.1. Abso olute max ximum ra ating Limitingvvaluesgivenb belowareinaccordancewith htheAbsolute eMaximumRatingSystem m(IEC134). Symbol 3.3Vaux USB SPDT SEL RESET SPI Descripttion Modulesu upplyvoltag USBD+/D D-pins Port sele ect RAK833rresetinput SPI interfface Condition InputDCvo oltageat3.3Va auxpins InputDCvo oltageatUSBinterfacepinss InputDCvo oltageatSPDT T SELinputp pins InputDCvo oltageat RESET inputpin InputDCvo oltageat SPI interfacepin Rho ANT Tstg Antennarruggednes StorageT Temperatur OutputRFloadmismatchruggednesssatANT Miin. –0.3 –0.3 –0.3 –0.3 Max. 3. 3. 3. 3. 3. Unit –40 10:1 85 VSWR °C Table4:Ab bsolutemax ximumrating gs Theproduc ctisnotprote ectedagains stovervoltag georreversed dvoltages.If necessary y, vo oltagespikes sexceedingtthepowersupplyvoltage especificatio on,giveninta ableabove,m mustbelimite edtovaluesw wi thinthespecifiedboundarriesbyusinga appropriatep protectiondevices. 3.2. Maxim mum ESD Parameter Min Typic cal Max Unit Re emarks ESDsensitivittyforallpinse xceptANT1 ESDsensitivittyforANT1 1000 Hu umanBodyModelaccordingtoJESD22-A114 1000 Hu umanBodyModelaccordingtoJESD22-A114 ESDimmunityyforANT1 4000 Co ontactDischargea accordingtoIEC6 61000-4-2 8000 Airr DischargeaccorrdingtoIEC61000 0-4-2 Table5:MaximumE ESDratings RA AK833cardare eElectrostaticSensitiveD Devicesandre equirespecia alprecautions swhenhandling.Seesect ion7.2forESDha andlinginstru uctions. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 RAK833 DataSheeet 3.3. Opera ating Co onditions Unlessoth herwiseindica ated,alloperattingconditionsspecificationssareatanambie enttemperatu ureof25°C. Operation n beyondth he operating g conditions s is not reco ommended and a extende ed exposure bey yondthemmayaffectdev vicereliability y. 3..3.1. Operrating temperature range Paramete er Min. Typic cal Max. Unit Rem marks Normalope eratingtempera ature – –20 +25 +65 °C Extendedo operatingtempe erature – –40 +85 °C Norm maloperatingte emperaturerang ge (fullyyfunctionalandmeet3GPPspe ecifications) Exte endedoperating gtemperaturera ange (RFp performancemaybeaffectedoutside norm maloperatingrange,thoughmo oduleisfullyfun Table6:E Environmenta alconditions 3..3.2. Supp ply/power pins Symbo ol 3.3Vauxx Para ameter Mod dulesupplyo operatingin nputvol Min. 3.00 Typica al 3.30 Max. 3.60 Unit Table7:In nputchara acteristics sofSupply//Powerpin ns Inputtvoltageat3 3.3Vauxmu ustbeabove ethenorma aloperating grangeminiimumlimitto oswitcho onthemodu ule. 3..3.3. Curre ent consu umption Mode Condition Min Type Idle-Mo ode All of the chip p on the board enter idle mode or shuttdown. 60 100 Active-Mode (TX) The power of o TX channel is 23dBm and 3.3V supply. TBD mA Active-Mode (RX ) TX disabled and shutdown n PA. TBD mA Tablle8:Module3.3 3Vauxsupplycurrentconsum mption 3..3.4. LoRa a RF chara acteristics The follow wing table gives typicallly sensitivityy level of the e RAK833 ca ard Sign nal Bandwidth/[KHz] 500 500 Spreading Factor Sensitiv vity/[dBm] 12 -134 -120 Table9:LoR Ra RF Chara acteristics ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 10 Max Unit uA RAK833 DataSheeet 4 Mech 4. hanica al spec cificatio ons RAK833 3 card are fully compliant to the 52-pin PCI Express Fu ull-Mini Carrd Type F2 form factor, with top-side e and botto om-side ke eep-out are eas, with 50.95 mm nominal le ength, 30 mm m nomina al width and alll the otherr dimension ns as defin ned by the PCI Expre ess Mini Card Electro omechanica al Sp pecification n [9] exceptt for the card thicknesss (nominal value is 3.7 mm), as described in Figure 2. Th he weight of o the RAK8 833 card is about 9.7 g. Figure4:RA AK833cardmechanica aldimensio ons(topvie ew,sideview w,bottomv view) Forfurthe erdetailsreg gardingmecchanicalspe ecificationssseethePCIE ExpressMin niCardElectt romecha anicalSpeciification[9]. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 11 RAK833 DataSheeet 5 RAK833 Mo 5. odule schem matic RAK833 3 card referr Semtech’ss reference e design of SX1301, ad dd a 4 chan ncel SPDT to switch SP PI of SX130 01 to PCI edge conne ector or FT2 2232H whicch convert SPI to USB B2.0 interface. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 12 RAK833 DataSheeet ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 13 RAK833 DataSheeet Fig gure5:RAK K833cardin nerschem matic. Forfurth herdetailsre egardingsch hematic ple ease refer “S SX1301DV VK_e286v02 2a_sch_layyout” from Semtech. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 14 RAK833 DataSheeet 6 Reference Applic 6. cation Figure e 4 shows the minimu um applicattion schema atic of RAK K833 card. U Uses at lesst 3.3V/1A DC power, co onnect SPII interface or o USB inte erface to the e main proccessor. If use SPI inte erface SP PDT_SEL should be tied to GND D otherwise e just let thiss pin open. Figure6::RAK833card dreference minimum schematic. ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 15 RAK833 DataSheeet CC Warnin ng FC Th his device complies w part 15 of the FCC with C Rules. Op peration is subject to th he following g two co onditions: (1) This device may nott cause harrmful interfe erence, and d (2) this de evice must accept anyy interference received, in ncluding intterference that may ca ause undessired opera ation. An ny Changes or modificcations nott expressly approved by b the partyy responsib ble for comp pliance co ould void th he user's au uthority to operate the equipmentt. When the mo odule is insstalled in the host deviice, the FCC ID label must be vissible throug gh a window on th he final devvice or it mu ust be visib ble when an n access pa anel, door o or cover is easily emoved. re If not, a seco ond label must be placced on the outside of the t final device that co ontains the fo ollowing texxt: ―Contain ns FCC ID: 2AF6B-RA AK833. Maximum an ntenna gain n allowed fo or use with this device e is 2 dBi. Th his module complies with w FCC ra adiation exp posure limitts set forth for an unco ontrolled en nvironmentt .This equip pment shou uld be insta alled and op perated witth minimum m distance 20 2 cm be etween the radiator& your body. 7 Conttact 7. Sh henzhenBu usiness E--Mail: ken.yyu@rakwireless.com Ad ddress: Rm. 506, Bldg. 3,Minqi Tecchnology Pa ark,No. 65 LiShan Road Xili Block, Nanshan Distriict, Shenzhe en,Guangdo ong Province e,China henzhenTech hnical Sh E‐Mail: farce.cchen@rakwirreless.com Te el : 0755-86 6108311 Ad ddress: Rm. 506, Bldg. 3,Minqi Tecchnology Pa ark,No. 65 LiShan Road Xili Block, Nanshan Distriict, Shenzhe en,Guangdo ong Province e,China ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 16 RAK833 DataSheeet 8 Chan 8. nge No ote Versio on Date Chan nge V1.0 201 18-01-11 Draft V1.1 201 18-03-11 Addmodulepicture an nd fix some mistakes V1.2 201 18-05-11 Fix some description n mistake fo or Part NO a and parame eters V1.3 201 18-06-19 Adjust the e RF parameters and the content for reading. Manufactur re name and address: SShenzhen Rakwireless Technology Co o., Ltd. Room 506, Bldg B, New Compark, Pin ngshan First Road, Taoyuaan Street, Naanshan District, Shenzhen ShenzhenRakw wirelessTechnolo ogyCo.,LtdCop pyright© ww ww.rakwireslesss.comETDX1702224 17
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