RF Link Technology UM01Y WLAN 11n USB module User Manual WL DM01R 7601 V2 0 SPECIFICATIONS 20170316

Shenzhen RF-Link Technology Co.,Ltd WLAN 11n USB module WL DM01R 7601 V2 0 SPECIFICATIONS 20170316

User manual

 http://www.rf-link.com/                     1 / 12        SPECIFICATIONS IEEE 802.11 b/g/n 2.4GHz 1T1R Wi-Fi  1T1R  Module     WL-DM01R-7601-V2.0  (DANGLE module)                                      Version 2.0
http://www.rf-link.com/  2 / 12Contents 1.Change History of Revision.....................................................................................................32.Overview...........................................................................................................................................43.Features...........................................................................................................................................44.Applications........................................................................................................................................55.General Specification..........................................................................................................................56.Block Diagram...............................................................................................................................67.Electrical Specifications.......................................................................................................................68.Pin Definition........................................................................................................................89.Size reference.............................................................................................................................910.USB interface electrical characteristics.....................................................................................1011.Recommended Reflow Profile...............................................................................1112.FCC modular&nbsp................................................................................................................13
 http://www.rf-link.com/                     3 / 12  Change History of Revision Revisio Date Contents of Revision Change Remark 2.0  2017-03-16  首次发布产品规格书 2017-03-16
 http://www.rf-link.com/                     4 / 12  1. Overview The UM01C-7601 is a highly integrated Wi-Fi module which supports 150 Mbps PHY rate. It fully complies with IEEE 802.11n and IEEE 802.11 b/g standards, offering feature-rich wireless connectivity.At high standards,and delivering eliable,cost-effective throughput om an extended distance.Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design deploys a high  efficient DMA engine and hardware data processing accelerators which offloads the host processor.The MT7601 is designed to support standard based features in the areas of security, quality of service and international regulations,giving end users the greatest  performance any time and in any circumstance.  2. Features l IEEE 802.11 b/g/n client  l Embedded high-performance 32-bit RISC microprocessor  l Highly integrated RF with 55nm CMOS technology  l 1T1R mode with support of 150Mbps PHY rate  l Integrate high efficiency switching regulator  l Best-in-class power consumption performance  l Compact 5mm x 5mm QFN40L package  l 1/2/3/4-wire PTA Wi-Fi / Bluetooth coexistence support
http://www.rf-link.com/  5 / 12l 802.11 d/h/k compliant  l Security support for WFA WPA/WPA2 personal, WPS2.0, WAPI  l Supports 802.11w protected managed frames  l QoS support of WFA WMM, WMM PS  l Supports Wi-Fi Direct  l Fully compliance with USB v2.0 High-speed mode  l Per packet transmit power control  l Antenna diversity   l Auto-calibration   3.Applicationsl Desk-Top PC  l TV l Blue-ray Disk  l Set-top box  4.General SpecificationModel  WL-DM01R-7601-V2.0 Product Name   WLAN 11n DANGLE module  Major Chipset  MTK 7601 Standard   802.11b/g/n Data Transfer Rate  1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 150Mbps
http://www.rf-link.com/  6 / 12Modulation Method   BPSK/ QPSK/ 16-QAM/ 64-QAM  Frequency Band 802.11b/g/n(H20)2412-2462MHz,11n(H40)2422-2452MHz  Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing)  Operation Mode  Ad hoc, Infrastructure  Operation Range  Up to 180 meters in open space  OS Support   Windows 2000,XP32-64,Vista 32/64,Win7 32/64,Linux,Mac, Android, WIN CE Security   WEP, TKIP, AES, WPA, WPA2  Interface   USB 2.0  Power Consumption   DC 3.3V  Operating Temperature   0 ~ +70° C ambient temperature  Storage Temperature   -10 ~ 80°C ambient temperature  Humidity   5 to 90 % maximum (non-condensing)  Dimension   40 x 33 x 7.7mm (LxWxH) +-0.2MM 5.Block Diagram6.Electrical Specifications1)DC CharacteristicsCurrent Consumption  Min.  Typ.  Max.  Unit TX Mode   -  110  -  mA
http://www.rf-link.com/  7 / 122)RF Characteristics for IEEE802.11b  ( 11Mbps mode unless otherwise specified)Items  Contents Specification  IEEE802.11b Mode  CCK  Channel frequency  2412MHZ-2462MHZ Data rate  1,2,5.5,11Mbps RX  (per≤85 dBm@8%)  -85 dBm TX Characteristics  Min.  Typ.  Max.  Unit Power Level (17±2dBm)  17  dBm EVM (≤-18)  -18  dB 3)RF Characteristics for IEEE802.11g ( 54Mbps mode unless otherwise specified)Items  Contents Specification  IEEE802.11g Mode  OFDM Channel frequency  2412MHZ-2462MHZ Data rate  6,9,12,18,24,36,48,54Mbps RX (per≤70 dBm@10%)  -70 dBm TX Characteristics  Min.  Typ.  Max.  Unit Power Level  (14±2dBm)  14  dbm EVM (≤-25)  -28  dm 4)RF Characteristics for IEEE802.11n (BW20_MCS7)Items  Contents Specification  IEEE802.11n  Mode  BW20_MCS7 65 Mbps Channel frequency  2412MHZ-2462MHZ RX (per≤65 dBm@10%)  -65 dBm TX Characteristics  Min  Typ  Max  Unit Power Level  (13±2dBm)  13  dbm EVM (≤-28)  -28  dm
http://www.rf-link.com/  8 / 125)RF Characteristics for IEEE802.11n (BW40_MCS7)Items  Contents Specification  IEEE802.11n  Mode  BW40_MCS7 135 Mbps Channel frequency  2422MHZ-2452MHZ RX (per≤65 dBm@10%)  -65 dBm TX Characteristics  Min.  Typ.  Max.  Unit Power Level  (13±2 dBm)  13  dBm EVM (≤-28)  -28  dB 7.Pin DefinitionPin  Definition  Description 1  GND  Ground 2  HSDM  USB D-  3  HSDP  USB D+ 4  5V  VDD3.3V±0.1V  5  NC  NC
 http://www.rf-link.com/                     9 / 12                         The picture of top            The picture of bottom  8.Size reference Dimensions (mm) Length  Width  Height 40  33  7.7 (Tolerance:±0.2mm) (Tolerance:±0.2mm) (Tolerance:±0.2mm)  The PCB tolerances within + / -0.2 or so
 http://www.rf-link.com/                     10 / 12  9.USB interface electrical characteristics    10.Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times :  ≤2 times
 http://www.rf-link.com/                     11 / 12   ENVIRONMENTAL  Operating Operating Temperature:    0°C to +70 °C Relative Humidity:         5-90% (non-condensing)  Storage Temperature:             -10°C to +80°C (non-operating) Relevant Humidity:        5-95% (non-condensing)   11. RoHS compliance. This product is RoHS compliance.    12.Wireless module before the SMT note: 1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. 2.Can't get the wifi module bare hands when needs,must we wear the gloves and static ring. 3.The furnace temperature according to the size of the customer the mainboard ,generally like to stick on a tablet standard temperature of 250 + - 5,can do 260 + - 5. Storage and use Wifi module control should pay attention to the following matters: l Module of the storage life of vacuum packaging: 1-1.Storage life :12 months.  Storage conditions:<40. Relative humidity:<90%R.H.℃ 1-2.After this bag is opened , devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3.Check the humidity card :stored at ≦20%RH.If :30%~40%(pink)or greater than 40%(red).Labeling module has moisture absorption. ① Mounthed within 168 hours at factory 12.Wifi模块贴片装机前注意事项:  1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大,请按 1比1再向外扩大 0.7mm 比例开钢网,厚度按 0.12mm. 2.有需要拿 wifi 模块时不可以光手去拿,一定要戴上手套以及静电环. 3.过炉温度要根据客户主板的大小而定,一般像平板电脑上的标准温度为250+-5°,也可以做到260+-5°  Wifi模块储存及使用管制应注意事项如下:  1.模块的真空包装之储存期限: 1-1.保存期限:12个月,储存环境条件:温度在:<40℃,相对湿度:<90%R.H. 1-2.模块包装被拆后,SMT 组装之时限: 1-3. 检查湿度卡:显示值应小于30% (蓝色),如:30%~40%(粉红色)或者大于40%(红色)表示模块已吸湿气. ① 工厂环境温度湿度管制:≦℃30% ,≦60%R.H。 ② 拆封后,车间的保存寿命为168 小时. 1-4.如在拆封后的168 个小时内未使用完,需要烘烤,烘烤条件如下: ① 模块须重新烘烤,以除去模块吸湿问题. ② 烘烤温度条件:125℃,8小时.
 http://www.rf-link.com/                     12 / 12  ≦℃conditions of: t 30% ,≦60%R.H. ② Once opened, the workshop the preservation of life for 168 hours. 1-4.If baking is required,devices may be baked for: ① Modules must be to remove module moisture problem. ② Baking temperature: 125 , 8 hours.℃ ③ After baking, put proper amount of desiccant to seal packages. 1-5. The actual number of  module vacuum packing which is based on the actual number of packages to the customer requirements, vacuum packing of picture<1> 2.Module reel packaging items as follows. 2-1.Storage life :12 months.  Storage conditions:<40. Relative humidity:<90%R.H.℃ 2-2.Module apart packing after 168 hours,To launch patch need to bake, to remove the module hygroscopic, baking temperature conditions:125℃,8hours. 2-3. The actual number of  module reel packing which is based on the actual number of packages to the customer requirements, Reel packing of picture<2> 3.Module pallet packaging items as follows: 3-1.Storage life:3 months. Storage conditions:<40. ℃Relative humidity:<90%R.H. 3-2.Module if not used within 48 hours, before launch the need for baking, baking temperature: 125 , 8 ℃hours. 3-3. Pallet packaging each plate is 100 PCS.The actual number of  module pallet packing which is based on the actual number of packages to the customer requirements.  ③ 烘烤后,放入适量的干燥剂再密封包装. 1-5.  模块真空包装数量以客户要求的实际包装数量为准,真空包装图片<1>   2.模块卷盘包装事项如下: 2-1.保存期限:12个月,储存环境条件:温度在:<40℃,相对湿度:<90%R.H. 2-2.模块拆开包装168小时后,如要上线贴片需要重新烘烤,以除去模块吸湿问题,烘烤温度条件:125℃,8小时。 2-3.  模块卷盘包装以客户要求的实际包装数量为准,卷盘包装图片<2>  3.模块托盘包装事项如下: 3-1.保存期限:3个月,储存环境条件:温度在:<40℃,相对湿度:<90%R.H. 3-2.模块如在48 小时内未使用,在上线之前需要进行烘烤,烘烤温度条件:125℃,8小时。 3-3.  托盘包装每盘为 100pcs,模块托盘包装以客户要求的实际包装数量为准.  注:以上包装方式根据客户要求而定,包装以实际出货为准。
http://www.rf-link.com/12. FCC modular&nbspThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.  The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden.FCC Radiation Exposure StatementThis modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.     If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AGQ3UM01Y Or Contains FCC ID: 2AGQ3UM01Y”When the module is installed inside another device, the user manual of the host must contain below warning statements;1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following twoconditions:(1) This device may not cause harmful interference.(2) This device must accept any interference received, including interference that may cause undesired operation.2. Changes or modifications not expressly approved by the party responsible for compliancecould void the user's authority to operate the equipment.The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.Any company of the host device which install this modular with limit modular approval should perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement,then the host can be sold legally.

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