Contents
- 1. user manual
- 2. User Manual
User Manual
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| Mirror Download [FCC.gov] | |
| Document ID | 2564217 |
| Application ID | yvU4kVVeMMuygNMpXgQriQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 159.89kB (1998682 bits) |
| Date Submitted | 2015-03-24 00:00:00 |
| Date Available | 2015-05-08 00:00:00 |
| Creation Date | 2015-03-23 16:38:02 |
| Producing Software | Acrobat Distiller 11.0 (Windows) |
| Document Lastmod | 2015-03-23 16:38:02 |
| Document Title | untitled |
Version No.：3 Issued Date: 2015/2/25 勁達國際電子有限公司 新北市中和區建康路 3 號 5 樓 Tel: +886-2-32340208 Fax: +886-2-32340547 Approval Sheet (產品承認書) 產品名稱 ： BT 4.0 Module (Nordic nRF51822) 產品型號 ： MDBT40-P128 (128K) / MDBT40-P256 (256K) Approved Checked Designed The Merit of Raytac MDBT40-P Module 1. Long Working Distance (Over 60M in open space) 2. Declaration ID includes all Nordic applied profiles. 3. FCC (USA), Telec (Japan), NCC (Taiwan) certificate & CE(EU) report granted. Index 1. Overall Introduction ................................................................................................................... 3 1.1 Applications ........................................................................................................................... 3 1.2 Features .................................................................................................................................. 4 1.3 Profile & Service Information ............................................................................................ 5 2. Product Dimension .................................................................................................................... 6 2.1 PCB Dimensions, & Pin Indication & Layout Guide.................................................... 6 2.2 Pin Assignment ..................................................................................................................... 8 3. Main Chip Solution ................................................................................................................... 10 4. Shipment Packaging Information ......................................................................................... 10 5. Specification .............................................................................................................................. 11 5.1 Absolute Maximum Ratings............................................................................................. 11 5.2 Operation Conditions ........................................................................................................ 11 5.3 Electrical Specifications ................................................................................................... 12 6. Block Diagram ........................................................................................................................... 18 7. Reference Circuit ...................................................................................................................... 19 7.1 nRF51822 Schematic with Internal LDO ....................................................................... 19 7.2 nRF51822 Schematic with 1.8V Low Voltage Mode................................................... 20 7.3 nRF51822 Schematic with Internal DC/DC Converter .............................................. 21 8. Carrier Keep-Out Area ............................................................................................................. 22 9. Certification ................................................................................................................................ 23 9.1 EPL Certification ................................................................................................................. 23 9.2 FCC Certification ................................................................................................................ 24 9.3 Telec Certification............................................................................................................... 26 9.4 End-Product Label ............................................................................................................. 27 9.5 CE Test Report .................................................................................................................... 30 10. Current Consumption Reference Data (BT3.0 VS BT4.0) ............................................ 31 1. Overall Introduction Raytac’s MDBT40-P is a BT4.0 & BT4.1 stack (Bluetooth low energy or BLE) module designed based on Nordic nRF518xx SoC solution which incorporates: GPIO, UART, I2C and ADC interfaces for connecting peripherals and sensors. The features of the module: 1. Dual Transmission Mode of BLE & RF 2.4G upon customer preference. 2. Compact size with (L) 18 x (W) 10 x (H) 3.2 mm 3. Low power requirements, ultra-low peak, average and idle mode power consumption. 4. Compatible with a large installed based of mobile phones, tablets and computers. 5. Fully coverage of BLE software stack including: Proximity Profile; Heart Rate Profile; Health Thermometer Profile; Blood Pressure Profile; Running Speed & Cadence Profile; HID Over GATT Profile; Alert Notification Profile; Glucose Profile; Cycling Speed & Cadence Profile Fully support customers to suit the needs of any application! 6. BLE & RF transmission switching may help products fit all operation system 7. BLE & RF transmission switching may help products fit all kinds of hardware. 1.1 Applications . Computer peripherals and I/O devices . Mouse . Keyboard . Multi-touch track pad . Interactive entertainment devices . Remote control . 3D Glasses . Gaming controller . Personal Area Networks . Health/fitness sensor and monitor devices . Medical devices . Key-fobs + wrist watch . Remote control toys 1.2 Features . 2.4GHZ transceiver . -93dbm sensitivity in Bluetooth low energy mode . TX Power -20 to +4dbm . RSSI (1db resolution) . ARM Cortex – M0 32 bit processor .Serial Wire Debug (SWD) . S100 series SoftDevice ready . Memory . 256kb or 128kb embedded flash program, memory . 16kb RAM . Support for non-concurrent multiprotocol operation . On-air compatibility with nRF24L series . Flexible Power Management . Supply voltage range 1.8V to 3.6V . 2.5us wake-up using 16MHz RCOSC . 0.6uA @ 3V mode . 1.2uA @ 3V in OFF mode + 1 region RAM retention . 2.6uA @ 3V ON mode, all blocks IDLE . 8/9/10 bit ADC- 8 configurable channels . 31 General Purpose I/O Pins . One 32 bit and two 16 bit timers with counter mode . SPI Master . Two-wire Master (I2C compatible) . UART (CTS/RTS) . CPU independent Programmable Peripheral Interconnect (PPI) . Quadrature Decoder (QDEC) . AES HW encryption . Real Timer Counter (RTC) 1.3 Profile & Service Information Profile & Service below are supported by MDBT40-P. Profile Description Service Description Alert Notification Profile Alert Notification Service Blood Pressure Service Blood Pressure Profile Device Information Service Cycling Speed & Cadence Service Cycling Speed & Cadence Profile Device Information Service Glucose Service Glucose Profile Device Information Service Health Thermometer Service Health Thermometer Profile Device Information Service Heart Rate Service Heart Rate Profile Device Information Service HID Service HID over GATT Profile Battery Service Link Loss Service Proximity Profile Immediate Alert Service TX Power Service Running Speed & Cadence Service Running Speed & Cadence Profile Device Information Service 2. Product Dimension 2.1 PCB Dimensions, & Pin Indication & Layout Guide PCB SIZE：10 x18 (mm) 7 2.2 Pin Assignment Pin No. Name Pin function (1)(2) GND Ground The pad must be connected to a solid ground plane (3) AVDD Power Analog power supply (4) P0.21 Digital I/O General-purpose digital I/O (5) P0.22 Digital I/O General-purpose digital I/O (6) P0.23 Digital I/O General-purpose digital I/O (7) P0.24 Digital I/O General-purpose digital I/O (8) P0.25 Digital I/O General-purpose digital I/O P0.26 Digital I/O General-purpose digital I/O AIN0 Analog input (9) XL2 Description ADC input 0 Analog output Connector for 32.768KHz crystal P0.27 Digital I/O AIN1 Analog input XL1 Analog input (11) P0.28 Digital I/O General-purpose digital I/O (12) P0.29 Digital I/O General-purpose digital I/O (13) GND Ground The pad must be connected to a solid ground plane (14) VDD Power Power supply (15) DCC Power DC/DC output voltage to external LC filter (16) P0.30 Digital I/O General-purpose digital I/O P0.00 Digital I/O General-purpose digital I/O AREF0 Analog input P0.01 Digital I/O AIN2 Analog input P0.02 Digital I/O AIN3 Analog input P0.03 Digital I/O AIN4 Analog input ADC input 4 P0.04 Digital Input General-purpose digital I/O AIN5 Analog input ADC input 5 P0.05 Digital I/O AIN6 Analog input (10) General-purpose digital I/O ADC input 1 Connector for 32.768KHz crystal or external 32.768KHz clock reference (17) ADC Reference voltage General-purpose digital I/O (18) ADC input 2 General-purpose digital I/O (19) ADC input 3 General-purpose digital I/O (20) (21) General-purpose digital I/O (22) ADC input 6 Pin No. Name Pin function P0.06 Digital I/O AIN7 Analog input ADC input 7 AREF1 Analog input ADC Reference voltage (24) P0.07 Digital I/O (25) GND Ground (26) P0.08 Digital I/O General-purpose digital I/O (27) P0.09 Digital I/O General-purpose digital I/O (28) P0.10 Digital I/O General-purpose digital I/O (29) P0.11 Digital I/O General-purpose digital I/O (30) P0.12 Digital I/O General-purpose digital I/O (31) P0.13 Digital I/O General-purpose digital I/O (32) P0.14 Digital I/O General-purpose digital I/O (33) P0.15 Digital I/O General-purpose digital I/O (34) P0.16 Digital I/O General-purpose digital I/O (35) SWDIO/RESET Digital I/O (36) SWDCLK Digital input (37) P0.17 Digital I/O General-purpose digital I/O (38) P0.18 Digital I/O General-purpose digital I/O (39) P0.19 Digital I/O General-purpose digital I/O (40) P0.20 Digital I/O General-purpose digital I/O (41) DEC2 Power Power supply decoupling. Low voltage mode VCC (42) GND Ground The pad must be connected to a solid ground plane (23) Description General-purpose digital I/O General-purpose digital I/O The pad must be connected to a solid ground plane System reset(active low).Also HW debug and flash Programming HW debug and flash programming. Connect a 12K ohm resister to GND for flash programming . Digital I/O pad with 5mA source/sink capability. 3. Main Chip Solution RF IC Crystal Frequency Nordic NRF51822/QFN48 16MHZ 4. Shipment Packaging Information Model Marking (in Dot) MDBT40-P128 Black MDBT40-P256 Red Photo - Packaging Type: Tray - Minimum Package Quantity (MPQ): 88 pcs per Tray - Contents in Carton: 1760 pcs per Carton (20 Full Tray + 1 Empty Tray) - Dimension of Carton: 37.5*21*13 cm (±1 cm) Remark: Packing may be subject to change without further notice. 10 5. Specification 5.1 Absolute Maximum Ratings 5.2 Operation Conditions 11 5.3 Electrical Specifications 5.3.1 Radio Transceiver . General Radio Characteristics . Radio Current Consumption 12 5.3.2 Transmitter Specifications 13 5.3.3 Receiver Specifications 14 15 5.3.4 Radio Timing Parameters 5.3.5 RSSI Specifications 5.3.6 CPU 16 5.3.7 Power Management 17 6. Block Diagram nRF51822 block diagram 18 7. Reference Circuit 7.1 nRF51822 Schematic with Internal LDO 19 7.2 nRF51822 Schematic with 1.8V Low Voltage Mode 20 7.3 nRF51822 Schematic with Internal DC/DC Converter 21 8. Carrier Keep-Out Area Carrier Board Keep Out Area 22 9. Certification 9.1 EPL Certification 23 9.2 FCC Certification 24 25 9.3 Telec Certification 26 9.4 End-Product Label Customers are suggested using following label content for FCC and TELEC certification. FCC Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 27 IMPORTANT NOTE: FCC Radiation Exposure Statement: The product comply with the US portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter This device is intended only for OEM integrators under the following conditions: 1) The transmitter module may not be co-located with any other transmitter or antenna, As long as 1 condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be respon sible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains FCC ID: SH6MDBT40”. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 28 TELEC NCC 29 9.5 CE Test Report 30 10. Current Consumption Reference Data (BT3.0 VS BT4.0) Mouse Power Consumption BT4.0 (Based on nRF51822) BT3.0 BT4.0 Mode RF2.4GHz 2 x AAA 9.5 Months 10 Months 2.9 Months 2 x AA 21 Months 22 Months 6.2 Months Including Sensor BT4.0 (Based on nRF51822) BT3.0 @3V BT4.0 Mode @ 1.5V RF2.4GHz @1.5V Active-Mouse moving (4.3%) (7.5ms report rate) 5.4 mA 8.1 mW 5.8 mA 8.7 mW 8.7 mA 26.1 mW Rest 1>1s (4.1%) Link maintained Sensor latency: 20ms 900 uA 1.35 mW 350 uA No link 1.05 mW 1.24 mA 3.72 mW Rest 2>10 sec (4.9%) Link maintained Sensor latency: 100ms 680 uA 1.02 mW 120 uA 198 uW 900 uA 2.7 mW Rest 2d>60 sec Link maintained Sensor latency: 100ms 120 uA 180 uW 120 uA 198 uW 900 uA 2.7 mW Rest 3>600s (86.3) Link disconnected Sensor latency: 500ms 90 uA 135 uW 90 uA 135 uW 797 uA 2.3 mW Keyboard Power Consumption BT4.0 (Based on nRF51822) BT3.0 @3V BT4.0 Mode @3V RF2.4GHz @3V 200 uA 5.8 mA 8.7 mW 8.7 mA 26.1 mW Rest 1 Maintain link 20 - 40 uA NA 20 - 40 uA Rest 2 after>1min, disconnected 0.8 uA 0.8 uA 2 uA Only when PC is off Active 6 letters/s 31
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