SENA TECHNOLOGIES IW02 BLUETOOTH MODULE User Manual ds parani bcd110 v1 0 0 20120210

Sena Technologies,Inc. BLUETOOTH MODULE ds parani bcd110 v1 0 0 20120210

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Bluetooth Class 1 OEM Module Parani-BCD110 Product Datasheet Version 1.0.0 February 9, 2012 Sena Technologies, Inc.

PARANI-BCD110 Page 2 of 26 Copyright Copyright 2012, Sena Technologies, Inc. All rights reserved. Sena Technologies reserves the right to make changes and improvements to its product without providing notice. Trademark Parani™ is a trademark of Sena Technologies, Inc. Windows® is a registered trademark of Microsoft Corporation. Notice to Users When a system failure may cause serious consequences, protecting life and property against such consequences with a backup system or safety device is essential. The user agrees that protection against consequences resulting from system failure is the user's responsibility. This device is not approved for life-support or medical systems. Changes or modifications to this device not explicitly approved by Sena Technologies will void the user's authority to operate this device. Precautions and Safety Do not drop or subject the device to impact. Damage to your products may result from improper use. Keep away from harsh environments including humid, dusty, and smoky areas. Damage to your products may result from improper use. Do not use excessive force on the buttons or attempt to disassemble the device. Damage to your products may result from improper use. Do not place heavy objects on the product. Damage to your products may result from improper use. Contact Information Technical support email: support@sena.com Company website: http://www.sena.com

PARANI-BCD110 Page 3 of 26 Contents 1. General .......................................................................................................................................................... 4 1.1 Features ............................................................................................................................................... 4 1.2 Applications .......................................................................................................................................... 4 1.3 Device Diagram .................................................................................................................................... 5 1.4 Pin Diagram .......................................................................................................................................... 5 1.5 Pin Descriptions.................................................................................................................................... 6 1.6 Dimensions and PCB land pattern ....................................................................................................... 8 2. Electrical characteristics ............................................................................................................................... 11 2.1 Absolute maximum ratings .................................................................................................................. 11 2.2 Recommended operating conditions ................................................................................................... 11 2.3 Power Consumptions .......................................................................................................................... 11 3. RF Characteristics ....................................................................................................................................... 12 3.1 Basic Data Rate .................................................................................................................................. 12 3.1.1 Transmitter Performance .......................................................................................................... 12 3.1.2 Transceiver ............................................................................................................................... 12 3.1.3 Receiver Performance ............................................................................................................. 12 3.2 Enhanced Data Rate .......................................................................................................................... 13 3.2.1 Transmitter performance .......................................................................................................... 13 3.2.2 Receiver performance .............................................................................................................. 14 4. Device Terminal Descriptions ...................................................................................................................... 15 4.1 UART Interface ................................................................................................................................... 15 4.2 USB Interface ..................................................................................................................................... 15 4.3 I2C Interface ....................................................................................................................................... 16 4.4 PCM CODEC Interface ...................................................................................................................... 16 4.5 I/O Parallel Ports ................................................................................................................................ 16 4.6 Reset Interface ................................................................................................................................... 17 5. Application Schematic.................................................................................................................................. 18 6. Software Stack ............................................................................................................................................. 21 7. Solder Profiles ............................................................................................................................................. 22 8. Packaging Information ................................................................................................................................. 23 9. Certificate Information ................................................................................................................................. 25 9.1 FCC .................................................................................................................................................... 25 9.1.1 FCC Compliance Statement ............................................................................................... 25 9.1.2 RF Exposure Statement ..................................................................................................... 25 9.1.3 Do not ................................................................................................................................. 25 9.2 CE .................................................................................................................................................. 26 9.3 IC ................................................................................................................................................... 26 9.4 KC .................................................................................................................................................. 26 9.5 TELEC ........................................................................................................................................... 26 9.6 SIG ................................................................................................................................................. 26

PARANI-BCD110 Page 5 of 26 1.3 Device Diagram Parani-BCD110Interface Pador connectorCrystal26MHzBlueCore4 ExternalFlash Memory8MbSPIVCC 3.3VRF AmplifierCircuitLNAPA PIOPCMUARTUSBRF_IN/OUT2.4GHzRadioIORAMBasebandDSPMCUVoltageRegulator1.8V core2.4GHzAntenna5dBi dipole3dBi dipole1dBi stub0dBi chip2402 ~ 2480MHz Figure 1-1 Device Diagram 1.4 Pin Diagram Figure 1-2 Pin diagram

PARANI-BCD110 Page 6 of 26 1.5 Pin Descriptions Table 1-1 Pin descriptions Function Pin Name Pin Number Description USB Interface USB_DP 11 USB data plus USB_DN 10 USB data minus UART Interface UART_TXD 8 UART data output UART_RXD 7 UART data input UART_RTS 6 UART request to send active low UART_CTS 9 UART clear to send active low PCM Interface PCM_OUT 15 Synchronous data output PCM_IN 12 Synchronous data input PCM_SYNC 13 Synchronous data sync PCM_CLK 14 Synchronous data clock SPI Interface SPI_MISO 20 SPI data output SPI_MOSI 23 SPI data input SPI_CSB 22 Chip select for SPI, active low SPI_CLK 21 SPI clock PIO Interface PIO_2 29 Programmable input/output line PIO_3 28 Programmable input/output line PIO_4 24 Programmable input/output line PIO_5 25 Programmable input/output line PIO_6 26 Programmable input/output line PIO_7 27 Programmable input/output line PIO_8 30 Programmable input/output line PIO_9 31 Programmable input/output line PIO_10 32 Programmable input/output line PIO_11 33 Programmable input/output line AIO AIO_0 4 Analogue programmable input/output line AIO_1 5 Analogue programmable input/output line Power PVCC 3 Power supply for power amplifier, 3.3V +3V3 16 Power supply for system, 3.3V GND 1, 2, 17, 19 34, 35, 36 Ground Others RESETB 18 Reset, active low, > 5ms to cause a reset

PARANI-BCD110 Page 7 of 26 Table 1-2 Pin States on Reset (SPP) Function Pin Name STATE Define (SPP) Direction Pull-up/down USB USB_DP - Input Weak pull-up USB_DN - Input Weak pull-up UART UART_TXD UART_TXD Output Tri-stated with weak pull-up UART_RXD UART_RXD Input Weak pull-down UART_RTS UART_RTS Output Tri-stated with weak pull-up UART_CTS UART_CTS Input Weak pull-down PCM PCM_OUT - Output Tri-stated with weak pull-down PCM_IN - Input Weak pull-down PCM_SYNC - Input Weak pull-down PCM_CLK - Input Weak pull-down SPI SPI_MISO - Output Tri-stated with weak pull-down SPI_MOSI - Input Weak pull-down SPI_CSB - Input Weak pull-up SPI_CLK - Input Weak pull-down PIO PIO_2 UART_DCD Output Weak pull-down PIO_3 UART_DTR Output Weak pull-down PIO_4 UART_DSR Input Weak pull-up PIO_5 FACTORY_RESET Input Weak pull-up PIO_6 BT_MODE Input Weak pull-up PIO_7 F/C_CTRL Output Weak pull-up PIO_8 - Input Weak pull-down PIO_9 - Input Weak pull-down PIO_10 STATUS_LED0 Output Weak pull-down PIO_11 STATUS_LED1 Output Weak pull-down AIO AIO_0 - Output Driving low AIO_1 - Output Driving low Others RESETB RESETB Input Weak pull-up

PARANI-BCD110 Page 8 of 26 1.6 Dimensions and PCB land pattern Figure 1-3 BCD110SU Dimensions Figure 1-4 BCD110DU Dimensions Figure 1-5 BCD110SC Dimensions Figure 1-6 BCD110DC Dimensions

PARANI-BCD110 Page 9 of 26 Figure 1-7 BCD110DS Dimensions [SMD Type] [DIP Type] Figure 1-8 Recommended Land Pattern

PARANI-BCD110 Page 10 of 26 Figure 1-4 Recommended Board Layout *BCD110SU, DU, DS has no keep-out area. Model despription Model name Interface ConnectorAntenna Type1 Type2 Type3 Parani-BCD110DU DIP, pin U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DS DIP, pin RPSMA 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DC DIP, pin CHIP 0dBi Chip Parani-BCD110SU SMD, pad U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110SC SMD, pad CHIP 0dBi Chip

PARANI-BCD110 Page 11 of 26 2. Electrical characteristics 2.1 Absolute maximum ratings Ratings Min Max Unit Storage Temperature -40 +85 °C Operating Temperature -40 +85 °C Supply voltage PVCC -0.4 3.6 V +3V3 -0.4 3.6 V Other terminal voltages GND – 0.4 +3V3 +0.4 V Table 2-1 Absolute maximum ratings 2.2 Recommended operating conditions Ratings Min Typ Max Unit Operating Temperature -40 25 +85 °C Supply voltage PVCC 2.7 3.3 3.6 V +3V3 2.7 3.3 3.6 V UART 3.0 3.3 3.6 V USB 3.1 3.3 3.6 V Supply current PVCC 100 150 200 mA +3V3 40 50 100 mA Table 2-2 Recommended operating conditions * Total current consumption = operating mode: max 100mA, test mode: max. 200mA 2.3 Power Consumptions Role Operation Mode UART Rate(kbps) Current Unit - Inquiry and page Scan 115.2 76 mA - Power on (Standby) 115.2 2 mA Connectable Mode(Mode3) 115.2 18 mA Connected (No data) 115.2- 15 mA Connected (file transfer) 115.2 45 mA Connected (file transfer) 9.6 55 mA Table 2-3 Power consumptions (SPP)

PARANI-BCD110 Page 12 of 26 3. RF Characteristics 3.1 Basic Data Rate 3.1.1 Transmitter Performance RF Characteristics PVCC = 3.3V, 25°C Min Typ Max Bluetooth Specification Unit Output power 16 18 19 ≤ 20 dBm Power Density 16 18 19 ≤ 20 dBm Power Control 3 4 6 2 ≤ step ≤ 8 dB TX Output Spectrum-Frequency range 2402 - 2480 2400 ~2483.5 MHz TX Output Spectrum-20dB Bandwidth - 900 - ≤ 1000 kHz Adjacent Channel Power F = F0 ± 2MHz - - -20 ≤ -20 dBm F = F0 ± 3MHz - - -40 ≤ -40 dBm F = F0 ± > 3MHz - - -40 ≤ -40 dBm Modulation Characteristics ∆f1avg 145 165 175 140 ≤ ∆f1avg ≤ 175 kHz ∆f2avg 115 155 - ∆f2avg ≥ 115 kHz ∆f2avg/∆f1avg 0.8 0.95 - (∆f1avg/∆f2avg) ≥ 0.8 - Initial Carrier Frequency Tolerance -20 - 20 ≤ ±75 kHz Carrier Frequency Drift Drift rate -20 - 20 ≤ ±20 kHz/50µs1 slot Freq Drift -25 - 25 ≤ ±25 kHz 5 slot Freq Drift -40 - 40 ≤ ±40 kHz Table 3-1 Transmitter performance at basic data rate 3.1.2 Transceiver RF Characteristics PVCC = 3.3V, 25°C Min Typ Max Bluetooth Specification Unit Out of band Spurious Emissions 0.030-1.000GHz -36 - - ≤ -36 dBm 1.000-12.75GHz -30 - - ≤ -30 dBm 1.800-5.100GHz -47 - - ≤ -47 dBm 5.100-5.300GHz -47 - - ≤ -47 dBm Table 3-2 Transceiver at basic data rate 3.1.3 Receiver Performance RF Characteristics Temperature 25°C Min Typ Max Bluetooth Specification Unit Sensitivity - Single slot packets (0.1%) - -90 -70 ≤ -70 dBm Sensitivity - Multi slot packets (0.1%) - -90 -70 ≤ -70 dBm C/I performance at 0.1% BER co-channel - - -11 ≤ -11 dB F = F0 + 1MHz - - 0 ≤ 0 kHz F = F0 – 1MHz - - 0 ≤ 0 dB

PARANI-BCD110 Page 13 of 26 F = F0 + 2MHz - - -20 ≤ -20 dB F = F0 – 2MHz - - -30 ≤ -30 dB F = F0 – 3MHz - - -40 ≤ -40 dB F = F0 + 5MHz - - -40 ≤ -40 dB F = FImage - -9 ≤ -9 dB Blocking performance 0.030-2.000GHz -10 - - ≥ -10 dBm 2.000-2.400GHz -27 - - ≥ -27 dBm 2.500-3.000GHz -27 - - ≥ -27 dBm 3.000-12.75GHz -10 - - ≥ -10 dBm Inter-modulation performance -39 - - ≥ -39 dBm Maximum input level at 0.1% BER -20 0 - ≥ -20 dBm Table 3-3 Receiver Performance at basic data rate 3.2 Enhanced Data Rate 3.2.1 Transmitter performance RF Characteristics PVCC = 3.3V, Temperature 25°C Min Typ Max Bluetooth Specification UnitMaximum RF Transmit Power -2 2 - -6 to +4 dB Relative Transmit Power -4 - 1 -4 to +1 dB Carrier Frequency Stability π/4 DQPSK | ω0 | -10 - 10 ≤ ±10 for all blocks kHz| ωi | -75 - 75 ≤ ±75 for all packets kHz| ω0 + ωi | -75 - 75 ≤ ±75 for all blocks kHz8DPSK | ω0 | -10 - 10 ≤ ±10 for all blocks kHz| ωi | -75 - 75 ≤ ±75 for all packets kHz| ω0 + ωi | -75 - 75 ≤ ±75 for all blocks kHzModulation Accuracy π/4 DQPSK RMS DEVM - - 20 ≤ 20 % 99% DEVM - - 30 ≤ 30 % Peak DEVM - - 35 ≤ 35 % 8DPSK RMS DEVM - - 13 ≤ 13 % 99% DEVM - - 20 ≤ 20 % Peak DEVM - - 25 ≤ 25 % EDR Differential Phase Encoding 99 - - ≥ 99 % In-band Spurious Emissions (8DPSK) F ≥ F0 + 3MHz - - -40 ≥ -40 dBmF < F0 + 3MHz - - -40 ≥ -40 dBmF = F0 – 3MHz - - -40 ≥ -40 dBmF = F0 – 2MHz - - -20 ≥ -20 dBmF = F0 – 1MHz - - -26 ≥ -26 dB F = F0 + 1MHz - - -26 ≥ -26 dB F = F0 + 2MHz - - -20 ≥ -20 dBmF = F0 + 3MHz - - -40 ≥ -40 dBmTable 3-4 Transmitter performance at enhanced data rate

PARANI-BCD110 Page 14 of 26 3.2.2 Receiver performance RF Characteristics Temperature 25°C Min Typ Max Bluetooth Specification UnitSensitivity at 0.01% BER π/4 DQPSK - -88 -70 ≤ -70 dBm8DPSK - -85 -70 ≤ -70 dBmBER floor performance - - -60 ≤ -60 dBmC/I Performance (co-channel at 0.1% BER) π/4 DQPSK - - 13 ≤ +13 dB 8DPSK - - 21 ≤ +21 dB C/I Performance (Adjacent Channel Selectivity) F = F0 + 1MHz π/4 DQPSK - - 0 ≤ 0 dB 8DPSK - - 5 ≤ +5 dB F = F0 – 1MHz π/4 DQPSK - - 0 ≤ 0 dB 8DPSK - - 5 ≤ +5 dB F = F0 + 2MHz π/4 DQPSK - - -30 ≤ -30 dB 8DPSK - - -25 ≤ -25 dB F = F0 – 2MHz π/4 DQPSK - - -20 ≤ -20 dB 8DPSK - - -13 ≤ -13 dB F ≥ F0 + 3MHz π/4 DQPSK - - -40 ≤ -40 dB 8DPSK - - -33 ≤ -33 dB F ≤ F0 – 5MHz π/4 DQPSK - - -40 ≤ -40 dB 8DPSK - - -33 ≤ -33 dB F = FImage π/4 DQPSK - - -7 ≤ -7 dB 8DPSK - - 0 ≤ 0 dB Maximum input level at 0.1% BER π/4 DQPSK -20 - - ≥ -20 dBm8DPSK -20 - - ≥ -20 dBmTable 3-5 Receiver performance at enhanced data rate

PARANI-BCD110 Page 15 of 26 4. Device Terminal Descriptions 4.1 UART Interface UART (Universal Asynchronous Receiver and Transmitter) interface provides a simple mechanism for communicating with other serial device using the RS232 protocol. When BCD110 is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS, UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signaling levels of 0V and 3.3V Parameter Possible Values Baud Rate Minimum 1200 baud (2%Error) Maximum 3M baud (1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Channel 8 Table 4-1 Possible UART Settings 4.2 USB Interface BCD110 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving of a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented behave as specified in the USB section of the Bluetooth specification v2.0+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a Master/Slave oriented system (in common with other USB peripherals), BCD110 only supports USB slave operation. The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the BCD110, therefore, have low output impedance. To match the connection to the characteristic of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. BCD110 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when BCD110 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15KΩ±5% pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This presents a Thevenin resistance to the host of at least 900Ω.

PARANI-BCD110 Page 16 of 26 4.3 I2C Interface PIO[8:6] can be used to form a mater I2C interface. The interface is formed using software to drive these lines. Therefore, it is suited only to relatively slow functions such as driving a dot matrix LCD (Liquid Crystal Display), keyboard scanner or EEPROM. Notes: PIO lines need to be pull-up through 2.2KΩ resistors. PIO[7:6] dual functions, UART bypass and EEPROM support, therefore, devices using an EEPROM cannot support UART bypass mode. For connection to EEPROMs, refer to CSR documentation on I2C EEPROM for use with BlueCore. This provides information on the type of devices currently supported. 4.4 PCM CODEC Interface PCM (Pulse Code Modulation) is a standard method used to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BCD110 has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BCD110 offers a bi-directional digital audio interface that route directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BCD110 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any on time. BCD110 can operate as PCM interface Master generating an output clock of 128, 256, or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. BCD110 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. BCD110 interfaces directly to PCM audio devices including the following:  Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices  OKI MSM7705 four channel A-raw and u-law CODEC  Motorola MC145481 8-bit A-law and u-law CODEC  Motorola MC145483 13-bit linear CODEC  STW 5093 and 5094 14-bit linear CODECs  BCD110 is also compatible with the Motorola SSITM interface 4.5 I/O Parallel Ports PIO lines can be configured through software to have either weak or strong pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. PIO_6 or PIO_2 can be configured as a request line for an external clock source. This is useful when the clock to BCD110 is provided from a system ASIC (Application Specific Integrated Circuit). Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), this terminal can be configured to be low when BCD110 is in Deep Sleep and high when a clock is required. The clock must be supplied within 4ms of the rising edge of PIO_6 or PIO_2 to avoid losing timing accuracy in certain Bluetooth operating modes.

PARANI-BCD110 Page 17 of 26 BCD110 has three general purpose analogue interface pins, AIO_0 and AIO_1. These are used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip band gap reference voltage, the other two may be configured to provide additional functionality. 4.6 Reset Interface BCD110 may be reset from several sources: RESETB pin, power on reset, a UART break character or via a software configured watchdog timer. The RESETB pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-downs.

PARANI-BCD110 Page 18 of 26 5. Application Schematic Figure 5-1 BT Module Interface Figure 5-2 Power Supply and Reset Interface

PARANI-BCD110 Page 19 of 26 Figure 5-3 RS232 Serial Interface Figure 5-4 MICOM UART Interface

PARANI-BCD110 Page 20 of 26 Figure 5-5 USB Interface Figure 5-6 I2C Interface Figure 5-7 PCM Interface

PARANI-BCD110 Page 23 of 26 8. Packaging Information Figure 8-1 Tape Information

PARANI-BCD110 Page 24 of 26 TBD Figure 8-2 Reel Information

PARANI-BCD110 Page 25 of 26 9. Certificate Information 9.1 FCC FCC Rule: Part 15 Subpart C Section 15.247 FCCID: S7AIW02 9.1.1 FCC Compliance Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, Including interference that may cause undesired operation Information to User This equipment has been tested and found to comply with limits for a Class B digital device, Pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by on or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver-Connect the equipment into an outlet a circuit different form that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. 9.1.2 RF Exposure Statement The equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. 9.1.3 Do not Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter.” As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements). In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW02”. The radio component is an integral part of the Parani-BCD110DU and cannot be removed.

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