SENA TECHNOLOGIES IW02 BLUETOOTH MODULE User Manual ds parani bcd110 v1 0 0 20120210
Sena Technologies,Inc. BLUETOOTH MODULE ds parani bcd110 v1 0 0 20120210
USERS MANUAL
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 1640943 |
| Application ID | wwGbppn0H21/JLx5mMon9A== |
| Document Description | USERS MANUAL |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 45.4kB (567540 bits) |
| Date Submitted | 2012-02-21 00:00:00 |
| Date Available | 2012-08-19 00:00:00 |
| Creation Date | 2012-02-14 09:22:04 |
| Producing Software | Acrobat Distiller 9.5.0 (Windows) |
| Document Lastmod | 2012-02-14 17:46:13 |
| Document Title | Microsoft Word - ds_parani-bcd110_v1.0.0_20120210 |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | C1B6B1E2C8C6 |
Bluetooth Class 1 OEM Module Parani-BCD110 Product Datasheet Version 1.0.0 February 9, 2012 Sena Technologies, Inc. PARANI-BCD110 Copyright Copyright 2012, Sena Technologies, Inc. All rights reserved. Sena Technologies reserves the right to make changes and improvements to its product without providing notice. Trademark Parani™ is a trademark of Sena Technologies, Inc. Windows® is a registered trademark of Microsoft Corporation. Notice to Users When a system failure may cause serious consequences, protecting life and property against such consequences with a backup system or safety device is essential. The user agrees that protection against consequences resulting from system failure is the user's responsibility. This device is not approved for life-support or medical systems. Changes or modifications to this device not explicitly approved by Sena Technologies will void the user's authority to operate this device. Precautions and Safety Do not drop or subject the device to impact. Damage to your products may result from improper use. Keep away from harsh environments including humid, dusty, and smoky areas. Damage to your products may result from improper use. Do not use excessive force on the buttons or attempt to disassemble the device. Damage to your products may result from improper use. Do not place heavy objects on the product. Damage to your products may result from improper use. Contact Information Technical support email: support@sena.com Company website: http://www.sena.com Page 2 of 26 PARANI-BCD110 Contents 1. General .......................................................................................................................................................... 4 1.1 Features ............................................................................................................................................... 4 1.2 Applications .......................................................................................................................................... 4 1.3 Device Diagram .................................................................................................................................... 5 1.4 Pin Diagram .......................................................................................................................................... 5 1.5 Pin Descriptions.................................................................................................................................... 6 1.6 Dimensions and PCB land pattern ....................................................................................................... 8 2. Electrical characteristics ............................................................................................................................... 11 2.1 Absolute maximum ratings .................................................................................................................. 11 2.2 Recommended operating conditions ................................................................................................... 11 2.3 Power Consumptions .......................................................................................................................... 11 3. RF Characteristics ....................................................................................................................................... 12 3.1 Basic Data Rate.................................................................................................................................. 12 3.1.1 Transmitter Performance.......................................................................................................... 12 3.1.2 Transceiver ............................................................................................................................... 12 3.1.3 Receiver Performance ............................................................................................................. 12 3.2 Enhanced Data Rate .......................................................................................................................... 13 3.2.1 Transmitter performance .......................................................................................................... 13 3.2.2 Receiver performance .............................................................................................................. 14 4. Device Terminal Descriptions ...................................................................................................................... 15 4.1 UART Interface ................................................................................................................................... 15 4.2 USB Interface ..................................................................................................................................... 15 4.3 I2C Interface ....................................................................................................................................... 16 4.4 PCM CODEC Interface ...................................................................................................................... 16 4.5 I/O Parallel Ports ................................................................................................................................ 16 4.6 Reset Interface ................................................................................................................................... 17 5. Application Schematic.................................................................................................................................. 18 6. Software Stack ............................................................................................................................................. 21 7. Solder Profiles ............................................................................................................................................. 22 8. Packaging Information ................................................................................................................................. 23 9. Certificate Information ................................................................................................................................. 25 9.1 FCC .................................................................................................................................................... 25 9.1.1 FCC Compliance Statement ............................................................................................... 25 9.1.2 RF Exposure Statement ..................................................................................................... 25 9.1.3 Do not ................................................................................................................................. 25 9.2 CE .................................................................................................................................................. 26 9.3 IC ................................................................................................................................................... 26 9.4 KC .................................................................................................................................................. 26 9.5 TELEC ........................................................................................................................................... 26 9.6 SIG................................................................................................................................................. 26 Page 3 of 26 PARANI-BCD110 1. General The Parani-BCD110 is a Bluetooth Class 1 OEM module for OEM manufacturers who want to implement Bluetooth Class 1 functionality with their products cost effectively and also in timely manner. Users can build their own antenna circuit around the BCD110 to lower the overall cost while benefit from the BCD110’s fieldproven standard SPP (Serial Port Profile) firmware provided with no additional cost. The BCD110 supports Class 1 Bluetooth transmission level for longer communication distance typically ranges from 100 m up to 1 km. The BCD110 supports UART, USB, I2C, PCM, PIO interfaces for the communication with the OEM products. The BCD110 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The SPP firmware supports up to 4 simultaneous multiple connections and is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. Optionally, the BCD110 can be supplied with only software stack up to HCI level so entire Bluetooth stack runs on the host side for the application such as USB dongles for computers, or OEM manufacturers can even develop and embed their own firmware into the BCD110. The BCD110 is fully qualified with Bluetooth v.2.0+EDR specification so OEM manufacturers can save cost and time for overall OEM product certifications, which makes the BCD110 ideal solution for larger volume and cost sensitive applications. 1.1 Features Bluetooth Class 1 Fully qualified with Bluetooth v2.0 + EDR specification Transmit Power: max. +20dBm Receive sensitivity: -90dBm (0.1% BER) Size: DIP type 16.8 x 34.6 x 7.5mm - with shield can SMD type 14.8 x 34.6 x 3.0mm - with shield can Extended operating temperature range: -40˚C ~ +85˚C Integrated variable antennas Integrated 8Mbit Flash Memory USB, Dual UART, I2C, PCM, PIO interfaces 802.11 co-existence Field-proven SPP (Serial Port Profile) firmware supporting up to 4 simultaneous multiple connections RoHS Compliant 1.2 Applications High-speed data transceiver systems for long distance communication PCs/Personal Digital Assistants (PDA) Bluetooth USB dongle Bluetooth serial dongle Bluetooth access points Industrial automation devices Remote metering devices POS (Point-of-sales) devices Page 4 of 26 PARANI-BCD110 1.3 Device Diagram Parani-BCD110 2402 ~ 2480MHz USB 2.4GHz Antenna 5dBi dipole 3dBi dipole 1dBi stub 0dBi chip RF_IN/OUT RF Amplifier Circuit RAM UART 2.4GHz Radio Baseband DSP LNA IO SPI Voltage Regulator 1.8V core Interface Pad or connector MCU PA PIO BlueCore4 External PCM Crystal 26MHz Flash Memory 8Mb Figure 1-1 Device Diagram 1.4 Pin Diagram Figure 1-2 Pin diagram Page 5 of 26 VCC 3.3V PARANI-BCD110 1.5 Pin Descriptions Function Pin Name Pin Number USB Interface USB_DP 11 USB data plus USB_DN 10 USB data minus UART_TXD UART data output UART_RXD UART data input UART_RTS UART request to send active low UART_CTS UART clear to send active low PCM_OUT 15 Synchronous data output PCM_IN 12 Synchronous data input PCM_SYNC 13 Synchronous data sync PCM_CLK 14 Synchronous data clock SPI_MISO 20 SPI data output SPI_MOSI 23 SPI data input SPI_CSB 22 Chip select for SPI, active low SPI_CLK 21 SPI clock PIO_2 29 Programmable input/output line PIO_3 28 Programmable input/output line PIO_4 24 Programmable input/output line PIO_5 25 Programmable input/output line PIO_6 26 Programmable input/output line PIO_7 27 Programmable input/output line PIO_8 30 Programmable input/output line PIO_9 31 Programmable input/output line PIO_10 32 Programmable input/output line PIO_11 33 Programmable input/output line AIO_0 Analogue programmable input/output line AIO_1 Analogue programmable input/output line PVCC Power supply for power amplifier, 3.3V +3V3 16 Power supply for system, 3.3V GND 1, 2, 17, 19 UART Interface PCM Interface SPI Interface PIO Interface AIO Power Description Ground 34, 35, 36 Others RESETB 18 Reset, active low, > 5ms to cause a reset Table 1-1 Pin descriptions Page 6 of 26 PARANI-BCD110 Function USB UART PCM SPI PIO AIO Others Pin Name STATE Define (SPP) Direction Pull-up/down USB_DP Input Weak pull-up USB_DN Input Weak pull-up UART_TXD UART_TXD Output Tri-stated with weak pull-up UART_RXD UART_RXD Input Weak pull-down UART_RTS UART_RTS Output Tri-stated with weak pull-up UART_CTS UART_CTS Input Weak pull-down PCM_OUT Output Tri-stated with weak pull-down PCM_IN Input Weak pull-down PCM_SYNC Input Weak pull-down PCM_CLK Input Weak pull-down SPI_MISO Output Tri-stated with weak pull-down SPI_MOSI Input Weak pull-down SPI_CSB Input Weak pull-up SPI_CLK Input Weak pull-down PIO_2 UART_DCD Output Weak pull-down PIO_3 UART_DTR Output Weak pull-down PIO_4 UART_DSR Input Weak pull-up PIO_5 FACTORY_RESET Input Weak pull-up PIO_6 BT_MODE Input Weak pull-up PIO_7 F/C_CTRL Output Weak pull-up PIO_8 Input Weak pull-down PIO_9 Input Weak pull-down PIO_10 STATUS_LED0 Output Weak pull-down PIO_11 STATUS_LED1 Output Weak pull-down AIO_0 Output Driving low AIO_1 Output Driving low RESETB RESETB Input Weak pull-up Table 1-2 Pin States on Reset (SPP) Page 7 of 26 PARANI-BCD110 1.6 Dimensions and PCB land pattern Figure 1-3 BCD110SU Dimensions Figure 1-4 BCD110DU Dimensions Figure 1-5 BCD110SC Dimensions Figure 1-6 BCD110DC Dimensions Page 8 of 26 PARANI-BCD110 Figure 1-7 BCD110DS Dimensions [SMD Type] [DIP Type] Figure 1-8 Recommended Land Pattern Page 9 of 26 PARANI-BCD110 Figure 1-4 Recommended Board Layout *BCD110SU, DU, DS has no keep-out area. Model despription Antenna Model name Interface Connector Type1 Type2 Type3 Parani-BCD110DU DIP, pin U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DS DIP, pin RPSMA 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110DC DIP, pin CHIP 0dBi Chip Parani-BCD110SU SMD, pad U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD110SC SMD, pad CHIP 0dBi Chip Page 10 of 26 PARANI-BCD110 2. Electrical characteristics 2.1 Absolute maximum ratings Ratings Min Max Unit Storage Temperature -40 +85 °C Operating Temperature -40 +85 °C Supply voltage PVCC -0.4 3.6 +3V3 -0.4 3.6 GND – 0.4 +3V3 +0.4 Other terminal voltages Table 2-1 Absolute maximum ratings 2.2 Recommended operating conditions Ratings Min Typ Max Unit Operating Temperature -40 25 +85 °C Supply voltage PVCC 2.7 3.3 3.6 +3V3 2.7 3.3 3.6 UART 3.0 3.3 3.6 USB 3.1 3.3 3.6 PVCC 100 150 200 mA +3V3 40 50 100 mA Supply current Table 2-2 Recommended operating conditions * Total current consumption = operating mode: max 100mA, test mode: max. 200mA 2.3 Power Consumptions Role Operation Mode UART Rate(kbps) Current Unit Inquiry and page Scan 115.2 76 mA Power on (Standby) 115.2 mA Connectable Mode(Mode3) 115.2 18 mA Connected (No data) 115.2- 15 mA Connected (file transfer) 115.2 45 mA Connected (file transfer) 9.6 55 mA Table 2-3 Power consumptions (SPP) Page 11 of 26 PARANI-BCD110 3. RF Characteristics 3.1 Basic Data Rate 3.1.1 Transmitter Performance RF Characteristics Min Typ Max Bluetooth PVCC = 3.3V, 25°C Unit Specification Output power 16 18 19 ≤ 20 dBm Power Density 16 18 19 ≤ 20 dBm Power Control 2 ≤ step ≤ 8 dB TX Output Spectrum-Frequency range 2402 2480 2400 ~2483.5 MHz TX Output Spectrum-20dB Bandwidth 900 ≤ 1000 kHz Adjacent F = F0 ± 2MHz -20 ≤ -20 dBm Channel Power F = F0 ± 3MHz -40 ≤ -40 dBm F = F0 ± > 3MHz -40 ≤ -40 dBm Modulation ∆f1avg 145 165 175 140 ≤ ∆f1avg ≤ 175 kHz Characteristics ∆f2avg 115 155 ∆f2avg ≥ 115 kHz ∆f2avg/∆f1avg 0.8 0.95 (∆f1avg/∆f2avg) ≥ 0.8 Initial Carrier Frequency Tolerance -20 20 ≤ ±75 kHz Carrier Drift rate -20 20 ≤ ±20 kHz/50µs Frequency Drift 1 slot Freq Drift -25 25 ≤ ±25 kHz 5 slot Freq Drift -40 40 ≤ ±40 kHz Table 3-1 Transmitter performance at basic data rate 3.1.2 Transceiver RF Characteristics Min Typ Max PVCC = 3.3V, 25°C Bluetooth Unit Specification Out of band 0.030-1.000GHz -36 ≤ -36 dBm Spurious 1.000-12.75GHz -30 ≤ -30 dBm Emissions 1.800-5.100GHz -47 ≤ -47 dBm 5.100-5.300GHz -47 ≤ -47 dBm Bluetooth Unit Table 3-2 Transceiver at basic data rate 3.1.3 Receiver Performance RF Characteristics Min Typ Max Temperature 25°C Specification Sensitivity - Single slot packets (0.1%) -90 -70 ≤ -70 dBm Sensitivity - Multi slot packets (0.1%) -90 -70 ≤ -70 dBm C/I performance co-channel -11 ≤ -11 dB at 0.1% BER F = F0 + 1MHz ≤0 kHz F = F0 – 1MHz ≤0 dB Page 12 of 26 PARANI-BCD110 F = F0 + 2MHz -20 ≤ -20 dB F = F0 – 2MHz -30 ≤ -30 dB F = F0 – 3MHz -40 ≤ -40 dB F = F0 + 5MHz -40 ≤ -40 dB -9 ≤ -9 dB F = FImage Blocking 0.030-2.000GHz -10 ≥ -10 dBm performance 2.000-2.400GHz -27 ≥ -27 dBm 2.500-3.000GHz -27 ≥ -27 dBm 3.000-12.75GHz -10 ≥ -10 dBm Inter-modulation performance -39 ≥ -39 dBm Maximum input level at 0.1% BER -20 ≥ -20 dBm Table 3-3 Receiver Performance at basic data rate 3.2 Enhanced Data Rate 3.2.1 Transmitter performance RF Characteristics Min Typ Max PVCC = 3.3V, Temperature 25°C Bluetooth Unit Specification Maximum RF Transmit Power -2 -6 to +4 dB Relative Transmit Power -4 -4 to +1 dB Carrier π/4 | ω0 | -10 10 ≤ ±10 for all blocks kHz Frequency DQPSK | ωi | -75 75 ≤ ±75 for all packets kHz | ω0 + ωi | -75 75 ≤ ±75 for all blocks kHz | ω0 | -10 10 ≤ ±10 for all blocks kHz | ωi | -75 75 ≤ ±75 for all packets kHz | ω0 + ωi | -75 75 ≤ ±75 for all blocks kHz Stability 8DPSK Modulation π/4 RMS DEVM 20 ≤ 20 Accuracy DQPSK 99% DEVM 30 ≤ 30 Peak DEVM 35 ≤ 35 RMS DEVM 13 ≤ 13 99% DEVM 20 ≤ 20 Peak DEVM 25 ≤ 25 99 ≥ 99 8DPSK EDR Differential Phase Encoding In-band F ≥ F0 + 3MHz -40 ≥ -40 dBm Spurious F < F0 + 3MHz -40 ≥ -40 dBm Emissions F = F0 – 3MHz -40 ≥ -40 dBm (8DPSK) F = F0 – 2MHz -20 ≥ -20 dBm F = F0 – 1MHz -26 ≥ -26 dB F = F0 + 1MHz -26 ≥ -26 dB F = F0 + 2MHz -20 ≥ -20 dBm F = F0 + 3MHz -40 ≥ -40 dBm Table 3-4 Transmitter performance at enhanced data rate Page 13 of 26 PARANI-BCD110 3.2.2 Receiver performance RF Characteristics Min Typ Max Temperature 25°C Bluetooth Unit Specification Sensitivity π/4 DQPSK -88 -70 ≤ -70 dBm at 0.01% BER 8DPSK -85 -70 ≤ -70 dBm -60 ≤ -60 dBm BER floor performance C/I Performance π/4 DQPSK 13 ≤ +13 dB (co-channel at 0.1% BER) 8DPSK 21 ≤ +21 dB C/I π/4 DQPSK ≤0 dB 8DPSK ≤ +5 dB π/4 DQPSK ≤0 dB 8DPSK ≤ +5 dB π/4 DQPSK -30 ≤ -30 dB 8DPSK -25 ≤ -25 dB π/4 DQPSK -20 ≤ -20 dB 8DPSK -13 ≤ -13 dB π/4 DQPSK -40 ≤ -40 dB 8DPSK -33 ≤ -33 dB π/4 DQPSK -40 ≤ -40 dB 8DPSK -33 ≤ -33 dB π/4 DQPSK -7 ≤ -7 dB 8DPSK ≤0 dB F = F0 + 1MHz Performance (Adjacent F = F0 – 1MHz Channel Selectivity) F = F0 + 2MHz F = F0 – 2MHz F ≥ F0 + 3MHz F ≤ F0 – 5MHz F = FImage Maximum input level π/4 DQPSK -20 ≥ -20 dBm at 0.1% BER 8DPSK -20 ≥ -20 dBm Table 3-5 Receiver performance at enhanced data rate Page 14 of 26 PARANI-BCD110 4. Device Terminal Descriptions 4.1 UART Interface UART (Universal Asynchronous Receiver and Transmitter) interface provides a simple mechanism for communicating with other serial device using the RS232 protocol. When BCD110 is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS, UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signaling levels of 0V and 3.3V Parameter Baud Rate Possible Values Minimum 1200 baud (2%Error) Maximum 3M baud (1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Channel Table 4-1 Possible UART Settings 4.2 USB Interface BCD110 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving of a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented behave as specified in the USB section of the Bluetooth specification v2.0+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a Master/Slave oriented system (in common with other USB peripherals), BCD110 only supports USB slave operation. The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the BCD110, therefore, have low output impedance. To match the connection to the characteristic of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. BCD110 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when BCD110 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15KΩ±5% pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This presents a Thevenin resistance to the host of at least 900Ω. Page 15 of 26 PARANI-BCD110 4.3 I2C Interface PIO[8:6] can be used to form a mater I2C interface. The interface is formed using software to drive these lines. Therefore, it is suited only to relatively slow functions such as driving a dot matrix LCD (Liquid Crystal Display), keyboard scanner or EEPROM. Notes: PIO lines need to be pull-up through 2.2KΩ resistors. PIO[7:6] dual functions, UART bypass and EEPROM support, therefore, devices using an EEPROM cannot support UART bypass mode. For connection to EEPROMs, refer to CSR documentation on I2C EEPROM for use with BlueCore. This provides information on the type of devices currently supported. 4.4 PCM CODEC Interface PCM (Pulse Code Modulation) is a standard method used to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BCD110 has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BCD110 offers a bi-directional digital audio interface that route directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BCD110 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any on time. BCD110 can operate as PCM interface Master generating an output clock of 128, 256, or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. BCD110 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. BCD110 interfaces directly to PCM audio devices including the following: Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices OKI MSM7705 four channel A-raw and u-law CODEC Motorola MC145481 8-bit A-law and u-law CODEC Motorola MC145483 13-bit linear CODEC STW 5093 and 5094 14-bit linear CODECs BCD110 is also compatible with the Motorola SSITM interface 4.5 I/O Parallel Ports PIO lines can be configured through software to have either weak or strong pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. PIO_6 or PIO_2 can be configured as a request line for an external clock source. This is useful when the clock to BCD110 is provided from a system ASIC (Application Specific Integrated Circuit). Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), this terminal can be configured to be low when BCD110 is in Deep Sleep and high when a clock is required. The clock must be supplied within 4ms of the rising edge of PIO_6 or PIO_2 to avoid losing timing accuracy in certain Bluetooth operating modes. Page 16 of 26 PARANI-BCD110 BCD110 has three general purpose analogue interface pins, AIO_0 and AIO_1. These are used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip band gap reference voltage, the other two may be configured to provide additional functionality. 4.6 Reset Interface BCD110 may be reset from several sources: RESETB pin, power on reset, a UART break character or via a software configured watchdog timer. The RESETB pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-downs. Page 17 of 26 PARANI-BCD110 5. Application Schematic Figure 5-1 BT Module Interface Figure 5-2 Power Supply and Reset Interface Page 18 of 26 PARANI-BCD110 Figure 5-3 RS232 Serial Interface Figure 5-4 MICOM UART Interface Page 19 of 26 PARANI-BCD110 Figure 5-5 USB Interface Figure 5-6 I2C Interface Figure 5-7 PCM Interface Page 20 of 26 PARANI-BCD110 6. Software Stack BCD110 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The firmware is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. The SPP firmware can be configured and controlled by typical AT commands. Users can easily configure BCD110 by using a terminal program such as HyperTerminal and can use Bluetooth wireless communication without modifying user’s existing serial communication program. In addition to the basic AT commands, BCD110 provides some expanded AT commands for various functions. User friendly ParaniWizard and ParaniWIN are also provided for easy setup on Microsoft Windows. To run AT commands on the BCD110, the BCD110 should be connected to the serial port of the user’s own board or equivalent to carry the BCD110. The SPP firmware provided with the BCD110 is identical to the firmware of the Parani-ESD100V2 and Parani-ESD110V2. To shorten the overall development cycle or for quick verification during or before own development work, users might want to try ESD100V2/110V2 starter kits first for convenience. Also, please refer to the ESD100V2/110V2 user’s manual for overall concept, configuration and complete AT commands list of the SPP firmware. The ESD100V2/110V2 user’s manual can be downloaded from Sena support home page at http://www.sena.com/support/downloads/. Optionally, the BCD110 can be supplied with only software stack up to HCI level so users can develop and embed their own firmware version into the BCD110 or entire Bluetooth stack runs on the host side for the application such as USB dongle for computers. Regarding these custom firmware options, please contact a Sena representative for more detail. UART SPP Firmware RFCOMM Host Host L2CAP HCI PCM I/O USB UART HCI Link Manager Link Manager Baseband/Link Control Baseband/Link Control Radio Radio Figure 6-1 SPP Firmware Bluetooth software stack Figure 6-2 HCI firmware Bluetooth Software Stack Page 21 of 26 PARANI-BCD110 7. Solder Profiles The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones: Preheat Zone – This zone raises the temperature at a controlled rate, typically 1-2.5°C /s Equilibrium Zone – This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out gassing of the flux. Reflow Zone – The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. Cooling Zone – The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5°C/s Figure 7-1 Typical Lead-Free Re-flow Solder Profile Key features of the profile: Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium Equilibrium time = 60 to 180 seconds Ramp to Maximum temperature (245°C) = 3°C/sec max. Time above liquids temperature (217°C): 45~90 seconds Device absolute maximum reflow temperature: 260°C The BCD110 will withstand the specified profile up to two reflows to a maximum temperature of 260°C Page 22 of 26 PARANI-BCD110 8. Packaging Information Figure 8-1 Tape Information Page 23 of 26 PARANI-BCD110 TBD Figure 8-2 Reel Information Page 24 of 26 PARANI-BCD110 9. Certificate Information 9.1 FCC FCC Rule: Part 15 Subpart C Section 15.247 FCCID: S7AIW02 9.1.1 FCC Compliance Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, Including interference that may cause undesired operation Information to User This equipment has been tested and found to comply with limits for a Class B digital device, Pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by on or more of the following measures: 9.1.2 Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver-Connect the equipment into an outlet a circuit different form that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. RF Exposure Statement The equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. 9.1.3 Do not Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter.” As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements). In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW02”. The radio component is an integral part of the Parani-BCD110DU and cannot be removed. Page 25 of 26 PARANI-BCD110 9.2 CE 1177 Declare under our own responsibility that the product Bluetooth Module Brand name: SENA Model No.: Parani-BCD110DU / Parani-BCD110DC / Parani-BCD110DS Parani-BCD110SU / Parani-BCD110SC To which this declaration refers conforms with the relevant standards or other standardizing documents EN 60950-1 ETSI EN 301 489-1 ETSI EN 301 489-17 ETSI EN 300 328 According to the regulations in Directive 1999/5/EC 9.3 IC “This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.” Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Radio Cert. No.: IC: 8154A-IW02 9.4 KC Type Registration Certification No: KCC-CRM-SNA-IW02 9.5 TELEC Technical Regulations for Specified Radio Equipment Article 2, Section 1 (19) Certification No: 9.6 SIG QDID: B016862 Model Name: Parani-BCD110 Core Version: 2.0+EDR Product Type: End Product Declared Specifications: Baseband Conformance, Radio, Service Discovery Protocol, Logical Link Control and Adaption Protocol, Generic Access Profile, Link Manager, RFCOMM, Serial Port Profile, Host Controller Interface, Summary ICS, Product Type Page 26 of 26
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : Yes Encryption : Standard V2.3 (128-bit) User Access : Print, Extract, Print high-res Author :EXIF Metadata provided by EXIF.toolsCreate Date : 2012:02:14 09:22:04+09:00 Modify Date : 2012:02:14 17:46:13+09:00 XMP Toolkit : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04 Format : application/pdf Creator : Title : Microsoft Word - ds_parani-bcd110_v1.0.0_20120210 Creator Tool : PScript5.dll Version 5.2.2 Metadata Date : 2012:02:14 17:46:13+09:00 Producer : Acrobat Distiller 9.5.0 (Windows) Document ID : uuid:5ee26f07-ddf7-48db-a678-56e5e30fe206 Instance ID : uuid:26e25d15-c0ec-40f7-99ed-9a6b874338e0 Page Count : 26