SENA TECHNOLOGIES IW03 BLUETOOTH MODULE User Manual

Sena Technologies,Inc. BLUETOOTH MODULE Users Manual

Users Manual

BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 1 of 24 Bluetooth® Serial Module Application Note Bluetooth Class 2 OEM Module Model: Parani-BCD210 Ver 1.0
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 2 of 24 1. General The Parani-BCD210 is a Bluetooth Class 2 OEM module for OEM manufacturers who want to implement Bluetooth Class 2 functionality with their products cost effectively and also in timely manner. Users can build their own antenna circuit around the BCD210 to lower the overall cost while benefit from the BCD210’s field-proven standard SPP (Serial Port Profile) firmware provided with no additional cost. The BCD210 supports Class 1 Bluetooth transmission level for longer communication distance typically ranges from 100 m up to 1 km. The BCD210 supports UART, USB, I2C, PCM, PIO interfaces for the communication with the OEM products. The BCD210 is provided with Bluetooth v2.0 compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The SPP firmware supports up to 4 simultaneous multiple connections and is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. Optionally, the BCD210 can be supplied with only software stack up to HCI level so entire Bluetooth stack runs on the host side for the application such as USB dongles for computers, or OEM manufacturers can even develop and embed their own firmware into the BCD210. The BCD210 is fully qualified with Bluetooth v.2.0+EDR specification so OEM manufacturers can save cost and time for overall OEM product certifications, which makes the BCD210 ideal solution for larger volume and cost sensitive applications. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter.” As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements). In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 3 of 24 authorization. End Product Labeling The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW03”. The radio component is an integral part of the Parani-BCD210DU and cannot be removed. 1.1 Features ■ Fully qualified Bluetooth v2.0 + EDR ■ Full-speed Bluetooth operation ■ Full piconet and scatternet support ■ Minimum external components ■ Low-power 1.8V operation ■ 1.8V core, 1.8 to 3.6V I/O ■ Integrated 1.8V regulator ■ 8 x 8mm, 96-ball TFBGA and 6 x 6mm, 96-ball, VFBGA package options ■ USB v2.0 and dual UART ports ■ Support for IEEE 802.11 coexistence ■ Support for 8Mbit external Flash ■ Green (RoHS and no antimony or halogenated flame retardants) 1.2 Applications ■ PCs ■ PDAs ■ Computer accessories (compact Flash cards, PCMCIA cards, SD cards and USB dongles) ■ Access points ■ Digital cameras
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 4 of 24 Model despription Model name Interface Connector Antenna Type1 Type2 Type3 Parani-BCD210DU DIP, pin U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD210DS DIP, pin RPSMA 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD210DC DIP, pin CHIP 0dBi Chip Parani-BCD210SU SMD, pad U.FL 5dBi dipole 3dBi dipole 1dBi stub Parani-BCD210SC SMD, pad CHIP 0dBi Chip Use Antenna Dipole antenna (M/N: R-AN2400-1901RS) Max Gain 5.37 dBi Dipole antenna (M/N: R-AN2400-5801RS) Max Gain 3.27 dBi Dipole antenna (M/N: AN2400-3306RS) Max Gain 1.40 dBi Chip antenna (SENA_F0615) Max Gain: 0.2dBi
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 5 of 24 1.3 Device Diagram 1.4 Pin Diagram
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 6 of 24 1.5 Pin Descriptions Function Pin Name Pin Number Description USB Interface USB_DP 8 USB data plus USB_DN 7 USB data minus UART Interface UART_TXD 11 UART data output UART_RXD 12 UART data input UART_RTS 10 UART request to send active low UART_CTS 9 UART clear to send active low PCM Interface PCM_OUT 25 Synchronous data output PCM_IN 24 Synchronous data input PCM_SYNC 23 Synchronous data sync PCM_CLK 22 Synchronous data clock SPI Interface SPI_MISO 30 SPI data output SPI_MOSI 32 SPI data input SPI_CSB 29 Chip select for SPI, active low SPI_CLK 31 SPI clock PIO Interface PIO_0 50 Programmable input/output line PIO_1 49 Programmable input/output line PIO_2 52 Programmable input/output line PIO_3 51 Programmable input/output line PIO_4 1 Programmable input/output line PIO_5 20 Programmable input/output line PIO_6 4 Programmable input/output line PIO_7 3 Programmable input/output line PIO_8 19 Programmable input/output line PIO_9 13 Programmable input/output line PIO_10 6 Programmable input/output line PIO_11 14 Programmable input/output line PIO_12 2 Programmable input/output line PIO_13 15 Programmable input/output line PIO_14 5 Programmable input/output line PIO_15 21 Programmable input/output line AIO_0 54 Analogue programmable input/output line
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 7 of 24 AIO_1 55 Analogue programmable input/output line Power VCC 16 Power supply for system, I/O, 3.3V VCHG 35 Lithium ion/polymer battery charger input VBAT 34 Lithium ion/polymer battery positive terminalVREG_EN 33 Take high to enable internal regulators GND 17 Ground GND 18 Ground GND 28 Ground GND 36 Ground GND 46 Ground GND 48 Ground GND 56 Ground LED Drivers LED_0 26 LED driver LED_1 27 LED driver Others RF_I/O 47 Transmitter output/receiver input RESETB 53 Reset, active low, > 5ms to cause a reset
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 8 of 24 2. Electrical characteristics 2.1 Absolute maximum ratings Ratings Min Max Unit Storage Temperature -40 +85 °C Operating Temperature -40 +85 °C Supply voltage VCC -0.4 3.6 V VREG_EN -0.4 4.9 V VBAT -0.4 4.4 V LED[1:0] -0.4 4.4 V VCHG -0.4 6.5 V Other terminal voltages GND – 0.4 VCC + 0.4 V 2.2 Recommended operating conditions Ratings Min Typ Max Unit Operating Temperature -30 20 +70 °C Supply voltage VCC 3.1 3.3 3.5 V VREG_EN 2.8 4.2 4.4 V VBAT 2.8 4.2 4.4 V LED[1:0] 2.8 4.2 4.4 V VCHG 4.5 5.0 5.5 V 2.3 Power Consumption
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 9 of 24 3. RF Characteristics 3.1 Basic Data Rate 3.1.1 Transmitter Performance RF Characteristics VCC = 3.3V, 20°C Min Typ Max Bluetooth Specification Unit Output power 2 4 6 20 dBm Power Density 2 4 6 20 dBm Power Control 2 4 6 2 ≤ step ≤ 8 dB TX Output Spectrum-Frequency range - - - 2400 ~2483.5 MHz TX Output Spectrum-20dB Bandwidth - 940 1000 ≤ 1000 kHz Adjacent Channel Power F = F0 ± 2MHz - -36 -20 ≤ -20 dBm F = F0 ± 3MHz - -45 -40 ≤ -40 dBm F = F0 ± > 3MHz - -50 -40 ≤ -40 dBm Modulation Characteristics ∆f1avg 140 165 175 140 ≤ ∆f1avg ≤ 175 kHz ∆f2avg 115 142 - ∆f2avg ≥ 115 kHz ∆f2avg/∆f1avg 0.80 0.92 - (∆f1avg/∆f2avg) ≥ 0.8 Initial Carrier Frequency Tolerance -75 ±20 75 ≤ ±75 kHz Carrier Frequency Drift Drift rate -20 - 20 ≤ ±20 kHz/50µs1 slot Freq Drift -25 - 25 ≤ ±25 kHz 5 slot Freq Drift -40 - 40 ≤ ±40 kHz
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 10 of 24 3.1.2 Transceiver RF Characteristics VCC = 3.3V, 20°C Min Typ Max Specification Unit Out of band Spurious Emissions 0.030-1.000GHz - - -36 ≤ -36 dBm 1.000-12.75GHz - - -30 ≤ -30 dBm 1.800-5.100GHz - - -47 ≤ -47 dBm 5.100-5.300GHz - - -47 ≤ -47 dBm 3.1.3 Receiver Performance RF Characteristics VCC = 3.3V, 20°C Min Typ Max Bluetooth Specification Unit Sensitivity - Single slot packets (0.1%) -88 -85 -82 ≤ -70 dBm Sensitivity - Multi slot packets (0.1%) -88 -85 -82 ≤ -70 dBm C/I performance at 0.1% BER co-channel - - 11 ≤ -11 dB F = F0 + 1MHz - - 0 ≤ 0 kHz F = F0 – 1MHz - - 0 ≤ 0 dB F = F0 + 2MHz - - -20 ≤ -20 dB F = F0 – 2MHz - - -30 ≤ -30 dB F = F0 – 3MHz - - -40 ≤ -40 dB F = F0 + 5MHz - - -40 ≤ -40 dB F = FImage - - -9 ≤ -9 dB Blocking performance 0.030-2.000GHz -10 - - -10 dBm 2.000-2.400GHz -27 - - -27 dBm 2.500-3.000GHz -27 - - -27 dBm 3.000-12.75GHz -10 - - -10 dBm Inter-modulation performance -39 - - ≥ -39 dBm Maximum input level at 0.1% BER -20 - - ≥ -20 dBm
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 11 of 24 3.2 Enhanced Data Rate 3.2.1 Transmitter performance RF Characteristics VCC = 3.3V, 20°C Min Typ Max Bluetooth Specification UnitMaximum RF Transmit Power 0 2 4 -6 to +4 dB Relative Transmit Power -4 -1 1 -4 to +1 dB Carrier Frequency Stability π/4 DQPSK | ω0 | -10 - 10 ≤ ±10 for all blocks kHz| ωi | -75 - 75 ≤ ±75 for all packets kHz| ω0 + ωi | -75 - 75 ≤ ±75 for all blocks kHz8DPSK | ω0 | -10 - 10 ≤ ±10 for all blocks kHz| ωi | -75 - 75 ≤ ±75 for all packets kHz| ω0 + ωi | -75 - 75 ≤ ±75 for all blocks kHzModulation Accuracy π/4 DQPSK RMS DEVM - - 20 ≤ 20 % 99% DEVM - - 30 ≤ 30 % Peak DEVM - - 35 ≤ 35 % 8DPSK RMS DEVM - - 13 ≤ 13 % 99% DEVM - - 20 ≤ 20 % Peak DEVM - - 25 ≤ 25 % EDR Differential Phase Encoding 99 - - ≥ 99 % In-band Spurious Emissions (8DPSK) F ≥ F0 + 3MHz - - -40 ≥ -40 dBmF < F0 + 3MHz - - -40 ≥ -40 dBmF = F0 – 3MHz - - -40 ≥ -40 dBmF = F0 – 2MHz - - -20 ≥ -20 dBmF = F0 – 1MHz - - -26 ≥ -26 dB F = F0 + 1MHz - - -26 ≥ -26 dB F = F0 + 2MHz - - -20 ≥ -20 dBmF = F0 + 3MHz - - -40 ≥ -40 dBm
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 12 of 24 3.2.2 Receiver performance RF Characteristics VCC = 3.3V, 25°C Min Typ Max Bluetooth Specification UnitSensitivity at 0.01% BER π/4 DQPSK -87 -84 -81 ≤ -70 dBm8DPSK -87 -84 -81 ≤ -70 dBmBER floor performance - - -60 ≤ -60 dBmC/I Performance (co-channel at 0.1% BER) π/4 DQPSK - - 13 ≤ +13 dB 8DPSK - - 21 ≤ +21 dB C/I Performance (Adjacent Channel Selectivity) F = F0 + 1MHz π/4 DQPSK - - 0 ≤ 0 dB 8DPSK - - 5 ≤ +5 dB F = F0 – 1MHz π/4 DQPSK - - 0 ≤ 0 dB 8DPSK - - 5 ≤ +5 dB F = F0 + 2MHz π/4 DQPSK - - -30 ≤ -30 dB 8DPSK - - -25 ≤ -25 dB F = F0 – 2MHz π/4 DQPSK - - -20 ≤ -20 dB 8DPSK - - -13 ≤ -13 dB F ≥ F0 + 3MHz π/4 DQPSK - - -40 ≤ -40 dB 8DPSK - - -33 ≤ -33 dB F ≤ F0 – 5MHz π/4 DQPSK - - -40 ≤ -40 dB 8DPSK - - -33 ≤ -33 dB F = FImage π/4 DQPSK - - -7 ≤ -7 dB 8DPSK - - 0 ≤ 0 dB Maximum input level at 0.1% BER π/4 DQPSK -20 - - ≥ -20 dBm8DPSK -20 - - ≥ -20 dBm
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 13 of 24 4. Device Terminal Descriptions 4.1 UART Interface This is a standard UART interface for communicating with other serial devices. BCD210 UART interface provides a simple mechanism for communicating with other serial device using the RS232 protocol. When BCD210 is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS, UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signaling levels of 0V and 3.3V Parameter Possible Values Baud Rate Minimum 1200 baud (2%Error) Maximum 4M baud (1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Channel 8 [Possible UART Settings] 4.2 USB Interface BCD210 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving of a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented behave as specified in the USB section of the Bluetooth specification v2.0+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers.
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 14 of 24 As USB is a Master/Slave oriented system (in common with other USB peripherals), BCD210 only supports USB slave operation. The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the BCD210, therefore, have low output impedance. To match the connection to the characteristic of the USB cable, resistors must be placed in series with USB_DP/USB_DN and the cable. BCD210 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when BCD210 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15KΩ±5% pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This presents a Thevenin resistance to the host of at least 900Ω. Alternatively, an external 1.5KΩ pull-up resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be alerted to which mode is used by PS key PSKEY_USB_PIO_PULLUP appropriately. The default setting uses the internal pull-up resistor. 4.3 I2C Interface PIO[8:6] can be used to form a mater I2C interface. The interface is formed using software to drive these lines. Therefore, it is suited only to relatively slow functions such as driving a dot matrix LCD (Liquid Crystal Display), keyboard scanner or EEPROM. Notes: PIO lines need to be pull-up through 2.2KΩ resistors. PIO[7:6] dual functions, UART bypass and EEPROM support, therefore, devices using an EEPROM cannot support UART bypass mode. For connection to EEPROMs, refer to CSR documentation on I2C EEPROM for use with BlueCore. This provides information on the type of devices currently supported. 4.4 PCM CODEC Interface PCM (Pulse Code Modulation) is a standard method used to digitize audio (particularly voice)
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 15 of 24 for transmission over digital communication channels. Through its PCM interface, BCD210 has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BCD210 offers a bi-directional digital audio interface that route directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BCD210 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any on time. BCD210 can operate as PCM interface Master generating an output clock of 128, 256, or 512kHz. When configured as PCM interface slave, it can operate with an input clock up to 2048kHz. BCD210 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. It supports 13-bit or 16-bit liner, 8-bit u-law or A-law companied sample formats at 8k samples/s and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PSKEY_PCM_CONFIG32 (0x1b3). BCD210 interfaces directly to PCM audio devices including the following:  Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices  OKI MSM7705 four channel A-raw and u-law CODEC  Motorola MC145481 8-bit A-law and u-law CODEC  Motorola MC145483 13-bit linear CODEC  STW 5093 and 5094 14-bit linear CODECs  BCD210 is also compatible with the Motorola SSITM interface 4.5 I/O Parallel Ports PIO lines can be configured through software to have either weak or strong pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. PIO_6 or PIO_2 can be configured as a request line for an external clock source. This is useful when the clock to BCD210 is provided from a system ASIC (Application Specific
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 16 of 24 Integrated Circuit). Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), this terminal can be configured to be low when BCD210 is in Deep Sleep and high when a clock is required. The clock must be supplied within 4ms of the rising edge of PIO_6 or PIO_2 to avoid losing timing accuracy in certain Bluetooth operating modes. BCD210 has three general purpose analogue interface pins, AIO_0, AIO_1 and AIO_2. These are used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip band gap reference voltage, the other two may be configured to provide additional functionality. 4.6 Reset Interface BCD210 may be reset from several sources: RESETB pin, power on reset, a UART break character or via a software configured watchdog timer. The RESETB pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-downs.
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 17 of 24 5. Application Schematic [Power Supply and Reset Interface] [Serial Interface for Host PC]
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 18 of 24 [USB Interface] [I2C Interface] [PCM Interface]
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 19 of 24 7. Solder Profiles The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones:  Preheat Zone – This zone raises the temperature at a controlled rate, typically 1-2.5°C/s  Equilibrium Zone – This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimize the out gassing of the flux.  Reflow Zone – The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetal growth which can result in a brittle joint.  Cooling Zone – The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5°C/s [Typical Lead-Free Re-flow Solder Profile] Key features of the profile:  Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium  Equilibrium time = 60 to 180 seconds  Ramp to Maximum temperature (245°C) = 3°C/sec max.  Time above liquids temperature (217°C): 45~90 seconds  Device absolute maximum reflow temperature: 260°C Devices will withstand the specified profile. Lead-free devices will withstand up to three reflows to a maximum temperature of 260°C
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 20 of 24 8. Packaging Information TBD
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 21 of 24 9. Contact Information Technical Support Sena Technologies, Inc. 210 Yangjae-dong, Seocho-gu Seoul 137-130, Korea Tel: (+82-2) 573-5422 Fax: (+82-2) 573-7710 E-Mail: support@sena.com Website: http://www.sena.com 11. Document History Date Revision Reason of Change
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 22 of 24 12. Certificate Information 12.1 FCC FCC Rule: Part 15 Subpart C Section 15.247 FCCID: S7AIW03 12.1.1 FCC Compliance Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, Including interference that may cause undesired operation Information to User This equipment has been tested and found to comply with limits for a Class B digital device, Pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by on or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver-Connect the equipment into an outlet a circuit different form that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. 12.1.2 RF Exposure Statement The equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. 12.1.3 Do not Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operate in conjunction with any other antenna or transmitter.” As such, the radio component of this device is intended only for OEM integrators under the following two conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (e.g., digital device emissions, PC peripheral requirements).
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 23 of 24 In the event that these conditions cannot be met (for example, co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following : “Contains Transmitter Module FCC ID: S7AIW03”. The radio component is an integral part of the Parani-BCD210DU and cannot be removed. 12.2 CE 1177 Declare under our own responsibility that the product Bluetooth Module Brand name: SENA Model No.: Parani-BCD210DU / Parani-BCD210DC / Parani-BCD210DS Parani-BCD210SU / Parani-BCD210SC To which this declaration refers conforms with the relevant standards or other standardizing documents EN 60950-1 ETSI EN 301 489-1 ETSI EN 301 489-17 ETSI EN 300 328 According to the regulations in Directive 1999/5/EC 12.3 IC “This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.” Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Radio Cert. No.: IC: 8154A-IW03 12.4 KC Type Registration Certification No: KCC-CRM-SNA-IW03
BBlluueettooootthh MMuullttiimmeeddiiaa MMoodduullee AApppplliiccaattiioonn NNoottee Sena Technologies, Inc. http://www.sena.com Page 24 of 24 12.5 JAPAN MIC Technical Regulations for Specified Radio Equipment Article 2, Section 1 (19) Certification No: 12.6 SIG QDID: B016862 Model Name: Parani-BCD210 Core Version: 2.0+EDR Product Type: End Product Declared Specifications: Baseband Conformance, Radio, Service Discovery Protocol, Logical Link Control and Adaption Protocol, Generic Access Profile, Link Manager, RFCOMM, Serial Port Profile, Host Controller Interface, Summary ICS, Product Type

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