SOLiD 70L21A Single Carrier DAS User Manual

SOLiD, Inc. Single Carrier DAS Users Manual

Users Manual

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SC‐DAS
Installation and Operation Manual
Document Reference:
Version:
V4.0
Document Status:
Release 3
Issue Date:
January. 07, 2013
Author:
Kyung Eun Han
Department:
R&D Division Team 3
Authorizing Manager:
Young shin Yeo
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REVISION HISTORY
No. of
Pages
Version
Issue Date
Initials
Details of Revision Changes
V 1.0
April. 11, 2011
V 2.0
Dec. 08,2011
Add Sprint band
V 3.0
Jan. 06,2012
Add Sprint band
V 4.0
Jan. 07,2013
Add VzW (MRU MIMO) band
Original
Technical Support
SOLiD serial numbers must be available to authorize technical support and/or to establish a return
authorization for defective units. The serial numbers are located on the back of the unit, as well as on
the box in which they were delivered. Additional support information may be obtained by accessing
the SOLiD, Inc. website at www.st.co.kr or send email at sjkim@st.co.kr
This manual is produced by Global Business Division Business Team 1. Printed in Korea.
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Contents
Section1
Safety & Certification Notice ...................................................................... 11
Section2
System Overview ....................................................................................... 13
2.1
General overview ............................................................................................ 14
2.2 System overview............................................................................................. 16
Section3
3.1
System Specifications ................................................................................ 19
System specifications ...................................................................................... 20
3.1.1
Physical Specifications .............................................................................. 20
3.1.2
Optical wavelength and Laser power......................................................... 21
3.1.3
Environmental specifications .................................................................... 21
3.1.4
Available Frequency Bands ........................................................................ 21
3.1.5
Band Specifications................................................................................... 22
Section4
System Configuration and Functions ........................................................... 23
4.1 BIU (BTS Interface Unit) .................................................................................. 24
4.1.1 BIU Specifications.................................................................................................... 24
4.1.2 BIU block diagram ................................................................................................... 25
4.1.3 BIU assemblies ........................................................................................................ 25
4.1.4 Sub Assembly Description ........................................................................................ 26
4.1.5 BIU front/rear panel overview .................................................................................. 30
4.2 ODU (Optic distribution Unit) .......................................................................... 33
4.2.1 ODU specifications................................................................................................... 33
4.2.2 ODU block diagram ................................................................................................. 34
4.2.3 ODU assemblies ....................................................................................................... 34
4.2.4
Sub Assembly description ......................................................................... 35
4.2.5 ODU front/rear panel overview ................................................................................ 36
4.2.6ODU Interface with BIU ............................................................................................ 38
4.3 OEU (Optic Expansion Unit) ............................................................................. 40
4.3.1 Specifications of OEU ............................................................................................... 40
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4.3.2
OEU block diagram ................................................................................... 41
4.3.3 OEU assemblies ....................................................................................................... 41
4.3.4Sub Assembly description ........................................................................................ 42
4.3.5
OEU front/rear panel overview.................................................................. 45
4.4 ROU (Remote Optic Unit) ................................................................................ 46
4.4.1
ROU specifications .................................................................................... 47
4.4.2
ROU block diagram ................................................................................... 48
4.4.2.1
Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1 ........................... 48
4.4.2.2
Combination of MRU 1900PCS/ARU 900I+800I ........................................... 48
4.4.2.3
Combination of MRU 700LTE+AWS‐1.......................................................... 49
4.4.2.4 Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1 ........................... 49
4.4.2.5
Combination of MRU 1900PCS/ARU 900I+800I ........................................... 50
4.4.2.6 Combination of MRU 700LTE+AWS‐1.......................................................... 51
4.4.3
Sub Assembly description ......................................................................... 53
4.4.4
Bottom of ROU ......................................................................................... 55
4.4.5
Top of ROU ............................................................................................... 57
4.4.5.1
Combination of MRU1900PCS+850C/ARU700LTE+AWS‐1 ............................ 57
4.4.5.2
Combination of MRU1900PCS+850C/ARU700LTE+AWS‐1 ............................ 57
Section5
5.1
System Installation & Operation ................................................................. 59
BIU Installation ............................................................................................... 60
5.1.1 BIU Shelf Installation ....................................................................................... 60
5.1.2 BIU Power Cabling .......................................................................................... 61
5.1.3 BIU/RF interface .............................................................................................. 63
5.1.4 MDBU installation ........................................................................................... 66
5.1.5 ODU Interface ................................................................................................. 67
5.1.6 BIU power consumption .................................................................................. 69
5.2 ODU Installation .............................................................................................. 70
5.2.1 ODU Shelf Installation ..................................................................................... 70
5.2.2 ODU Power Cabling ......................................................................................... 70
5.2.3 ODU Optic Cabling .......................................................................................... 70
5.2.4 DOU installation .............................................................................................. 71
5.2.5 ODU Power consumption ................................................................................ 72
5.3 ROU Installation .............................................................................................. 73
5.3.1 ROU Enclosure installation .............................................................................. 73
5.3.2 ROU Power Cabling ......................................................................................... 80
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5.3.3 Optical Cabling ................................................................................................ 81
5.3.4 GND Terminal Connection ............................................................................... 81
5.3.5 Coaxial cable and Antenna Connection ............................................................ 82
5.3.6 LED explanation on ROU ................................................................................. 83
5.3.7 ROU Power consumption ................................................................................ 83
5.3.8 Cable connection between MRU and ARU ........................................................ 84
5.4 OEU Installation .............................................................................................. 85
5.4.1 OEU chassis installation ................................................................................... 85
5.4.2 OEU Power Cabling ......................................................................................... 85
5.4.3 OEU Optic Cabling ........................................................................................... 86
5.4.4 DOU installation with an OEU .......................................................................... 87
5.4.5 OEU Power Consumption ................................................................................ 88
Section6
Operation .................................................................................................. 89
6.1 BIU Overview .................................................................................................. 90
6.1.1 BIU ................................................................................................................. 90
6.1.2 BIU TX parameters .......................................................................................... 90
6.1.3 BIU RX parameters .......................................................................................... 95
6.1.4 BIU Logic Sequence Diagram ........................................................................... 96
6.1.5 Interaction with the BIU .................................................................................. 98
6.2 ROU Overview ................................................................................................ 99
6.2.1 ROU Operation.............................................................................................. 100
6.3 OEU Operation .............................................................................................. 106
6.3.1 OEU Operation .............................................................................................. 106
Section7
7.1
Additive functions ..................................................................................... 111
Shutdown function (TX output shutdown) .................................................... 112
7.2 Total Power Limit function (TX Output ALC) .................................................. 112
7.3 Automatic Output power setting function (TX Output AGC)........................... 113
7.4 Input power AGC function (TX Input AGC) ..................................................... 113
7.5 Input power limit function (TX Input ALC) ..................................................... 114
7.6 Optical loss compensation............................................................................. 114
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Figures
Figure 1.1 – Basic system topology supporting SISO configuration ..................... 16
Figure 2.2 – Basic system topology supporting MIMO configuration .................. 17
Figure 2.3 – Expansion system topology supporting SISO configuration............. 18
Figure 2.4 – Expansion system topology supporting MIMO configuration .......... 18
Figure 4.1 – BIU front and side views................................................................. 24
Figure 4.2 – BIU block diagram ......................................................................... 25
Figure 4.3 – BIU mounting diagram................................................................... 25
Figure 4.4 – MDBU at a glance .......................................................................... 27
Figure 4.5 – MCDU at a glance .......................................................................... 28
Figure 4.6 – MCPU at a glance .......................................................................... 29
Figure 4.7 – MPSU at a glance .......................................................................... 30
Figure 4.8 – BIU front panel view...................................................................... 30
Figure 4.9 – Rear panel view............................................................................. 32
Figure 4.10 – ODU at a glance ........................................................................... 33
Figure 4.11 – ODU block diagram ....................................................................... 34
Figure 4.12 – ODU Internal View ....................................................................... 34
Figure 4.13 – DOU
at a glance ........................................................................ 36
Figure 4.14 – 2Way Divider at a glance ............................................................... 36
Figure 4.15 – ODU front panel view ................................................................... 36
Figure 4.16 – ODU Rear panel view ................................................................... 37
Figure 4.17 BIU/ODU interface .......................................................................... 38
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Figure 4.18 – BIU/ODU Interface rear view ........................................................ 38
Figure 4.19 – BIU/ODU interface details............................................................. 39
Figure 4.20 – OEU at a glance ........................................................................... 40
Figure 4.21 – OEU block diagram ....................................................................... 41
Figure 4.22 – OEU internal view ........................................................................ 41
Figure 4.23 – DOU at a glance ........................................................................... 42
Figure 4.24 – EWDM at a glance........................................................................ 43
Figure 4.25 – ECPU at a glance .......................................................................... 43
Figure 4.26 – ERFM at a glance ......................................................................... 44
Figure 4.27 – EPSU at a glance .......................................................................... 44
Figure 4.28 – OEU front panel view ................................................................... 45
Figure 4.29 – Rear panel view ........................................................................... 45
Figure 4.30 – ROU at a glance ........................................................................... 46
Figure 4.31 – ROU block diagram for MRU 1900PCS+850C and ARU 700LTE+AWS‐1
................................................................................................................ 48
Figure 4.32 – ROU block diagram for MRU 1900PCS and ARU 900I+800I ............ 48
Figure 4.33 – ROU block diagram for MRU 700LTE+AWS‐1 ................................. 49
Figure 4.34 – ROU internal view for MRU1900PCS+850C and ARU 700LTE+AWS‐1
................................................................................................................ 50
Figure 4.35 – ROU internal view for MRU 1900PCS and ARU 900I+800I .............. 51
Figure 4.36 – ROU internal view for MRU RU 900I+800I .................................... 51
Figure 4.37 – PSU at a glance ............................................................................ 54
Figure 4.38 – ROU Bottom view ....................................................................... 55
Figure 4.39 – ROU Power Port View ................................................................. 56
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Figure 4.40 – ROU Top View for MRU 1900P+850C and ARU 700LTE+AWS‐1 ....... 57
Figure 4.41 – ROU Top View for MRU 1900P+850C and ARU 700LTE+AWS‐1 ....... 57
Figure 5.1 – RACK Installation ........................................................................... 60
Figure 5.2 – Power interface diagrm ................................................................. 61
Figure 5.3 – PSU LED indicator information ....................................................... 62
Figure 5.4 – BIU RF interface diagram ............................................................... 64
Figure 5.5 – BTS /BIU connections ..................................................................... 65
Figure 5.6 –BDA Interface using Circulator ........................................................ 65
Figure 5.7 –BDA Interface using Duplexer ......................................................... 66
Figure 5.8 –MDBU LED indicator information .................................................... 67
Figure 5.9 –Interface port between BIU and ODU ............................................. 68
Figure 5.10 –Cabling interface diagram between BIU and ODU .......................... 69
Figure 5.11 –SC/APC fiber termination ............................................................... 71
Figure 5.12 – ODU rear view with DOUs inserted ............................................... 71
Figure 5.13 – Wall mount dimensions for the ROU ............................................. 73
Figure 5.14 – ROU installation procedure side by side ........................................ 74
Figure 5.15 – ROU installation diagram side by side ............................................ 75
Figure 5.16 – ROU installation procedure for stacked mounting ......................... 75
Figure 5.17 – ROU installation diagram for stacked mounting............................. 76
Figure 5.18 – ROU installation procedure for vertical rack .................................. 77
Figure 5.19 – ROU installation diagram for vertical rack ..................................... 78
Figure 5.20 – ROU installation procedure for horizontal rack ............................. 79
Figure 5.21 – ROU installation diagram for horizontal rack ................................. 79
Figure 5.22 – ROU Power Port view .................................................................. 80
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Figure 5.23 – ROU optical Port view .................................................................. 81
Figure 5.24 – ROU GND Port view ..................................................................... 82
Figure 5.25 – ROU LED indicator information..................................................... 83
Figure 5.26 – OEU Power interface diagram ...................................................... 86
Figure 5.27 – Optical cable with SC/ACP Type Connectors .................................. 87
Figure 5.28 – OEU with DOUs inserted .............................................................. 87
Figure 6.1 – SC‐DAS Link budget for the BIU ...................................................... 90
Figure 6.2 –MDBU information assigned at theBIU ............................................ 92
Figure 6.3 –MDBU menu information at the BIU ............................................... 92
Figure 6.4 –MDBU name assignment at theBIU ................................................. 94
Figure 6.5 –MDBU name assignment at the tree ............................................... 94
Figure 6.6 –MDBU Module Failure information at the BIU ................................. 95
Figure 6.7 –Configuration of BIU‐ODU‐ROU for basic topology .......................... 96
Figure 6.8 –Configuration of BIU‐ODU‐ROU for expansion topology.................. 97
Figure 6.9 –DOU assignment at the BIU ............................................................ 98
Figure 6.10 –ODU Menu information................................................................. 98
Figure 6.11 –SC‐DAS Link budget for ROU .......................................................... 99
Figure 6.12 –Optical information at the ROU ................................................... 102
Figure 6.13 –ROU information assignment ...................................................... 103
Figure 6.14 –ROU Menu information ............................................................... 103
Figure 6.15 –ROU Softkey information ............................................................ 105
Figure 6.16 –SC‐DAS Link Budget for OEU ....................................................... 106
Figure 6.17 –OEU Optical information ............................................................. 108
Figure 7.1 –Shutdown logic diagram................................................................ 112
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Figure 7.2 –Optical loss information ................................................................ 115
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Section1
Safety & Certification Notice
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“Only qualified personnel are allowed to handle this unit. Read and obey all the warning
labels attached in this user manual”
Any personnel involved in installation, operation or service of the SOLiD Technology repeaters
must understand and obey the following:
‐ Obey all general and regional installation and safety regulations relating to work on high voltage
installations, as well as regulations covering correct use of tools and personal protective
equipment.
‐ The power supply unit in repeaters contains dangerous voltage levels which can cause electric
shock. Switch the mains off prior to any work in such a repeater. Any local regulations are to be
followed when servicing repeaters.
‐ The repeater cover (door) should be securely fastened in open position(with a cord), during
outdoor work in order to prevent door from slamming due to wind (which could cause bodily
harm or damage).
‐ Use this unit only for the purpose specified by the manufacturer. Do not carry out any modifications
or replace any parts which are not sold or recommended by the manufacturer. This could cause
fire, electric shock or other injuries.
‐ Repeaters generate radio signals and thereby give rise to electromagnetic fields that may be
hazardous to any person in the immediate proximity of the repeater and the repeater antennas
for an extended period of time.
‐ Due to power dissipation, this repeater may reach a very high temperature. Do not operate this unit
on or close to flammable materials.
‐ Do not use any solvents, chemicals, or cleaning solutions containing alcohol, ammonia, or abrasives.
‐ Certification
z FCC: This equipment complies with the applicable sections of Title 47 CFR Parts 15,22,24 and
90
UL/CUL: This equipment complies with UL and CUL 1950‐1 Standard for safety for information
technology equipment,including electrical business equipment
FDA/CDRH: This equipment uses a Class 1 LASER according to FDA/CDRH Rules.This product
conforms to all applicable standards of 21 CFR Chapter 1, Subchaper J, Part 1040
‐For PLUGGABLE EQUIPMENT, the socket‐outlet shall be installed near the equipment and shall be
easily accessible.
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Section2
System Overview
2.1
General overview
2.2 System overview
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2.1
General overview
SC‐DAS platform is a coverage system for in‐building services delivering seamless, high quality voice
and data As a distributed antenna system, it provides analog and digital phone services in multiple
bands through one antenna.
The system covers public and private venues such as:
Shopping malls
Hotels
Campus areas
Airports
Clinics
Subways
Multi‐use stadiums, convention centers, etc.
The system enhances in‐building radio environments that lack signal quality by improving the RSSI
and Ec/Io. By providing communication services throughout the building, the system enables users to
make a calls anywhere in the coverage area.
The system uses both analog (AMPS) and digital (TDMA, CDMA and WCDMA) methods.
The SC‐DAS system supports communication standards and public interface protocols in worldwide
use.
Frequencies: VHF,UHF, 700MHz, 800MHz,850MHz 900MHz,1900MHz,2100MHz, etc.
Voice protocols: AMPS,TDMA, CDMA,GSM,IDEN, etc.
Data protocols: EDGE,GPRS,WCDMA,CDMA2000,Paging,LTE, etc.
SC‐DAS comprises frequency specific modules. Coverage for a specific frequency band is
accomplished by inserting a corresponding frequency module into each unit. Because it delivers
multiple signals with one strand of single mode fiber, the system, requires no additional hardware
modifications whenever a new frequency is added.
The system is featured with the following:
Flexibiltiy & Scalabiltiy
„
Supports fiber‐optic ports up to 32 or 60(using OEU)
„
Connects multiple‐buildings (campus) as one DAS
Modular structures
„
Modular frequency upgrade
„
Plug‐in type modules
Multi‐Band, Single operator
„
Supports multiple services from one WSP
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„
Support multi‐operator in a band(Max. 2 operator)
Low OPEX / CAPEX
„
Compact design
„
Upgradable design
„
Easy installation and maintenance
„
Adopts auto ID scheme
The SC‐DAS platform will serve two primary segments; first as a carrier deployed coverage
enhancement product for their specific frequencies and second as a low cost, public safety / single
carrier product.
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2.2
System overview
SC‐DAS comprises the components listed below.
The base system consists of a BIU (BTS Interfcace Unit), an ODU (Optic distribution Unit) and a ROU
(Remote Optic Unit). For use with multiple ROU’s, it has OEU (Optic Expansion Unit).
The BIU has two layer which support both SISO and MIMO configuration using separate optical fiber
cable. Fig2.1 shows basic system topology for SISO
Figure 1.1 – Basic system topology supporting SISO configuration
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Figure 2.2 – Basic system topology supporting MIMO configuration
As shown at Fig.’s 2.1 and 2.2, one strand of fiber is needed for SISO configuration but two strands
are needed for MIMO cofiguration when connected with an ROU. Applications requiring up to
32ROU’s for SISO are possible with one BIU. Each SISO ROU will require an additional strand of
fiber and an additional 32 ROU’s can be added to the same system for MIMO applications. MIMO
requires 2 strands of fiber per ROU as well as MIMO specific ODU’s.
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To reduce number of optical cables between multi‐building applications, we can utilize the
OEU(Optical Expansion Unit)
Fig 2.3 shows expansion system topology supporting SISO configuration using OEUs
Figure 2.3 – Expansion system topology supporting SISO configuration
Figure 2.4 – Expansion system topology supporting MIMO configuration
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Fig 2.4 shows expansion system topology supporting MIMO configuration using OEU
Section3
System Specifications
3.1
System specifications
3.1.1
Physical Specifications
3.1.2
Optic wavelength and Laser power
3.1.3
Environmental specifications
3.1.4
Available frequency bands
3.1.5
Band Specifications
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3.1
System specifications
3.1.1
Physical Specifications
Parameter
RF Connectors
External
Alarm
connector
(Dry contacts)
Serial
Interface
connector
Fiber connector
BIU
ODU
OEU
MRU
1 N‐type
4 SMA pairs(TX,RX)
2 SMA
per MDBU
‐
2SMA :optical
2SMA :RF
TB: 4pcs for output
‐
TB: 3pcs for input
1 USB(B) type
‐
ARU
2SMA :optical
2SMA :RF
‐
‐
‐
1 USB(B) type
1 USB(B) type
1 USB(B) type
1 SC/APC for ODU
‐
8pcs, SC/APC for
1 SC/APC for ODU
ROU
8 SC/APC for ROU
EWDM Status
Power status
ALM status
DOU1 Status
MCPU
Status Indicator
LD status
PD status
DOU1 Status
MDBU Status
LED Alarm and
Power status
TX Comm
RX Comm
ALM status
MPSU
Power status
DC ALM status
LD status
PD1/2/3/4
LD status
status
System status
System status
PD1/2/3/4
DOU2 Status
Power status
Power status
status
LD status
TX Comm
TX Comm
DOU2 Status
PD1/2/3/4
RX Comm
RX Comm
status
ALM status
ALM status
Opt status
LD status
PD1/2/3/4
System status
status
Power status
TX1 Comm
RX1 Comm
TX2 Comm
RX2 Comm
ALM status
Normal Range: 120VAC
AC Power
‐
50/60Hz
‐
Operating range
Same to left side
108~132VAC,50/60Hz
Normal range: ‐48
DC Power
VDC
Normal: ‐48 VDC
Operating range:
Be provided by BIU
Operating range:
Same to left side
‐40.8 ~ ‐57.6VDC
‐40.8 ~ ‐57.6VDC
SISO Mode : 162W
(Including SISO ODU
4EA)
MIMO Mode : 315W
consumption
(Including SISO ODU
4EA+MIMO
MRU1900P+850C:50W
28W
Power
ODU
(Including
DOU2EA)
40W
MRU 1900P:45W
ARU700LTE+AWS:40W
(Including DOU2EA)
MRU700LTE+AWS:50W
ARU900I+800I:44W
300 x 200 x 258
300 x 200 x 258
6.6Kg~7.1Kg
6.8Kg
4EA)
Enclosure
482.6(19”)
Dimensions
221.5(5U) x 450
43.6(1U) x 450
Weight[Full Load]
26.2Kg
6Kg
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482.6(19”)
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3.1.2
Optical wavelength and Laser power
Parameter
ODU
OEU
ROU
West optic
TX: 1310nm
TX: 1550nm,
RX: 1550nm
East optic
RX: 1310nm
TX: 1550nm
Optical Wavelength
RX: 1310nm
TX: 1310nm,
RX: 1550nm
1dBm±1dBm to ROU
Output power
1.5dBm±1dBm to ROU,OEU
7dBm±1dBm to ODU
7dBm±1dBm to ODU
Return loss
3.1.3
<45dB
<45dB
Environmental specifications
Parameter
BIU, ODU, OEU
Operating Temperature
‐10
Operating Humidity, non condensing
‐
3.1.4
<45dB
to +50°C
ROU/AOR
‐10 to +50°C
5% to 90%
Available Frequency Bands
Standard
Unit naming
Description
Frequency range
TX(MHz)
RX(MHz)
Status
iDEN
700PS
Public safety
763 to 775
793 to 805
In future
iDEN
800PS
Public safety
851 to 869
806 to 824
Completed
Cellular
850C
Cellular
869 to 894
824 to 849
Completed
iDEN
900I
SMR
935 to 940
896 to 901
Completed
Paging
900 PA
Paging
929 to 930
896 to 902
In future
PCS
1900P
PCS
1930 to 1995
1850 to 1915
Completed
AWS‐1
AWS‐1
AWS‐1
2110 to 2155
1710 to 1755
Completed
VHF
VHF
Public safety
136 to 174
136 to 174
In future
396 to 450
396 to 450
450 to 512
450 to 512
380 to 434
380 to 434
434 to 496
434 to 496
UHF
Public safety(Band1)
In future
UHF
E‐UHF
Public safety(Band2)
In future
698 to 716
LTE
700LTE
Long Term Evolution
728 to 756
Completed
777 to 787
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3.1.5
Band Specifications
SC‐DAS platform allows many band combinations as well as different output power levels
within the band depending on the combination.
1) Output power level
Below table shows Output power level as a function of band combination
Band Combinations
MRU
ARU
700PS
700LTE
800PS/I
850C
900I
1900P
AWS
1900P+850C
700LTE+AWS
‐
24dBm
‐
24dBm
‐
28dBm
28dBm
1900P
900I+800I
‐
‐
26dBm
‐
26dBm
31dBm
‐
700LTE+AWS
‐
‐
28dBm
‐
‐
‐
‐
28dBm‐
1900P+AWS
‐
‐
‐
‐
‐
‐
30dBm
30dBm
1900P+850C
700PS+800PS
21dBm
‐
21dBm
21dBm
‐
30dBm
‐
700PS+800PS
900I+800I
21dBm
‐
21dBm
21dBm
‐
‐
VHF
UHF
24dBm
24dBm
2) General Specifications
Parameter
Specifications
Remark
TX
25dB/step 1dB
ROU
RX
20dB/step 1dB
BIU
Gain Control range
TX input power
‐20dBm~+10dBm
Spurious Emission
< ‐13dBm
Optical Link AGC
>10dB
VSWR
1.8:1
Pass‐band Ripple
4dBp‐p
Max optical Loss
5dBo
Optical wavelength
1310nm/1550nm with WDM
RX output power
0dBm
RX input power
‐50dBm Max
Noise Figure
< 8dB
Excluding
700PS,
800PS
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Section4
System Configuration and Functions
4.1 BIU (BTS Interface Unit)
4.2 ODU (Optic distribution Unit)
4.3 OEU (Optic Expansion Unit
4.4 ROU (Remote Optic Unit)
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4.1
BIU (BTS Interface Unit)
The BIU receives signals from the BTS or BDA through coaxial cable and transmits to four
ODUs (Optic Distribution Unit).and The BIU separates RX signals received from ODUs
according to their frequency band.
Figure 4.1 – BIU front and side views
4.1.1
BIU Specifications
Item
Spec.
Remark
Size
482.6(19”) x 221.5(5U) x 450
mm
Weight
26 Kg
SISO Mode : 168 W(Including SISO ODU 4EA)
Power consumption
MIMO Mode : 315W(Including SISO ODU
Full Load
4EA+MIMO ODU 4EA)
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4.1.2
BIU block diagram
Figure 4.2 – BIU block diagram
4.1.3
BIU assemblies
MCDU’s
MDBU
#1
MDBU
#2
MPSU
MDBU
#3
SISO Side
MDBU
#4
MIMO Side
Figure 4.3 – BIU mounting diagram
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No.
Unit
Description
Remark
Main Drive BTS Unit
MDBU
Amplify & adjust downlink RF signal
Max 4EA
Amplify & adjust uplink RF signal
Main Com/Div Unit
MCDU
Combine 3EA downlink signal and divide 4EA signal to ODU
Combine 4EA uplink signal and divide 3EA signal to MDBU
Support VHF/UHF interface port
Main Central Processor Unit
MCPU
Control and monitoring system status
Control and monitoring with USB(B)
Allows access to upper‐level network through GSM or Ethernet
MPSU
Main Power Supply Unit
Input power: DC ‐48V, Output power: 9V, 6V
Mother Board
Provide signal interface and power for each unit
M/B
Provide four ports for dry contact output
Provide three ports for input
Provide two Aux ports for future usage
4.1.4
Shelf
19 inch, 5U
Sub Assembly Description
1) Main Drive BTS Unit (MDBU)
MDBU delivers TX signals from the BTS or BDA to related devices as well as delivers RX signals from
these devices to the BTS or BDA. This unit also monitors TX input level. Using the input AGC function,
it automatically adjusts input ATT according to input power. It also has an ATT to adjust RX gain. The
MDBU varies per frequency band to including the following:
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No
Unit naming
In/out RF Port
Description
TX
RX
1900P+850C
Dual Band
4 Port
4 Port
700LTE+AWS‐1
Dual Band
4 Port
4 Port
1900P
Single Band
2 Port
2 Port
900I+800I
Dual Band
4 Port
4 Port
1900P+AWS‐1
Dual Band
4 Port
4 Port
700PS+800PS
On
Dual the
Band loadmap
4 Port
4 Port
900I
Dual Band
2 Port
2 Port
Figure 4.4 – MDBU at a glance
2) Main Com/Div Unit (MCDU)
MCDU combines TX signals that are delivered from MDBU per frequency band and delivers them to
four ODUs. It also combines RX signals from up to four ODUs and sends them to up to four
MDBUs.The unit has a port to interface with VHF&UHF signals. It has an ATT for input monitoring and
input control.
The unit has a reserved port for future usage such as LMU interface, additive MDBU interface ,etc,
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Figure 4.5 – MCDU at a glance
VHF+UHF frequency band includes the following: for use in future
No
Unit naming
VHF+UHF
Description
Dual Band
In/out RF Port
TX
RX
1 Port
1 Port
3) Main Central Processor Unit (MCPU)
MCPU can inquire and control the state of the modules that are installed in the BIU.
This unit can inquire and control the state of up to four ODUs. Through communication, it also can
inquire and control ROUs that are connected.
In addition, the unit has USB(B) port for local monitoring so that it can inquire and control state of
devices through a PC. On the front panel, it has communication LED indicators to check
communication state with ROU. It also has ALM LED indicators to show whether a device is faulty.
For access to upper network, it has a port to insert an Ethernet port and GSM modem in it.
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Figure 4.6 – MCPU at a glance
In the Main Central Processor Unit, a lithium battery is installed for RTC (Real Time Control) function.
CAUTION
RISK OF EXPLOSION MAY OCCUR IF BATTERY IS REPLACED BY AN INCORRECT TYPE
DIPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
[INSTRUCTION]
The equipment and accessories including inner lithium battery are to be disposed of safely after the
life span of them according to the national regulation. Do not attempt to replace the lithium battery
unless authorized by a qualified service personnel, to avoid any risk of explosion.
4) Main Power Supply Unit (MPSU)
The MPSU takes a ‐48V input and outputs +6V and +9V DC power.
On the front panel, this unit has an output test port and it also has DC ALM LED Indicator to show
faulty output.
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Figure 4.7 – MPSU at a glance
4.1.5
BIU front/rear panel overview
1) Front panel
Figure 4.8 – BIU front panel view
Item
1. Alarm LED & Reset
Description
Communication state with devices, alarm status of the system and reset
switch
USB port for communication and diagnosis of devices through PC/laptop
2. DEBUG (USB B)
This equipment isfor indoor use only and all the communication wirings are
limited to indoor use as well.
3. NMS(Ethernet port)
Ethernet port for upper network
The supporting network mode is UDP protocol
4. MDBU LED
LED to show whether MDBU is installed and is operating properly
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5. RF Monitor Port
20dB Coupling compared with TX Input Level
20dB Coupling compared with RX Output Level
6. Pwr Test Port & ALM
Output DC power test port and ALM LED to show abnormal state, if any
7. Power switch
Power ON/OFF switch
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2) Rear panel
10
MIMO SIDE
2 1
SISO SIDE
11
Figure 4.9 – Rear panel view
Item
Description
1. DC Input Port
Input terminal for DC ‐48V
2. External ALM Port
Input/output terminal for dry contact
3. GND Port
System ground terminal
4. AUX I/O Port
Reserved Port for future uses
5. MIMO ODU I/O Port
RF signal interface terminal for ODU
6. MIMO ODU signal Port
Power and signal interface terminal for ODU
7. MIMO BTS/BDA I/O Port
Input/output interface terminal of BTS/BDA
8. V/UHF I/O Port
RF signal interface terminal of VHF&UHF
9. SISO ODU I/O Port
RF signal interface terminal for ODU
10. SISO ODU signal Port
Power and signal interface terminal for ODU
11. SISO BTS/BDA I/O Port
Input/output interface terminal of BTS/BDA
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4.2 ODU (Optic distribution Unit)
ODU receives TX RF signals from upper BIU and converts them into optical signals. The optical
signals are sent to ROU through optical cables. This unit converts optical signals from ROU into RF
signals and sends the converted signals to BIU.
For each shelf of the ODU, up to two DOUs (Donor Optic Unit) can be installed in it.
One DOU is supported with four optical ports. Therefore, one ODU can be connected with eight
ROUs.
Up to four ODUs can be connected with BIU each SISO and MIMO path
Figure 4.10 – ODU at a glance
4.2.1
ODU specifications
Item
Spec.
Remark
Size
482.6(19”) x 43.6(1U) x 450
mm
Weight
6 kg
Power consumption
27 W
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4.2.2
ODU block diagram
Figure 4.11 – ODU block diagram
4.2.3
ODU assemblies
Figure 4.12 – ODU Internal View
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No.
Unit
Description
Remark
Donor Optic Unit
DOU
Converts TX RF signals into optical signals;
Converts RX optical signals into RF signals;
Max 2 ea.
Provides up to four optical ports per DOU
2Way Divider
2W
Divides TX RF signals into two;
Combines two RX RF signals into one
DU
Shelf
Accessories
4.2.4
Distribution Unit
Distributes power and signals to DOU
19” rack, 1RU
25PIN DSUB, Male to female 1pcs
RF Coaxial Cable Assembly 2pcs
Sub Assembly description
1) Donor Optic Unit (DOU)
The DOU performs the RF to optical conversion of TX signals as well as the optical to RF conversion
of RX signals.
Using an optical splitter, this unit divides optical signals from a Laser Diode into four and then
distributes them to each optical port. With a total of four Photo Diodes in RX, the DOU performs the
optical to RF conversion of signals received from each optical port. In addition, the unit is equipped
with an ATT to compensate for optical loss in the fiber or fiber connectors.
Since is uses a WDM, it uses only one strand of fiber for each ROU it connects to.
With internal FSK modem, it will allow operation from a remote site.
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Figure 4.13 – DOU
at a glance
2) 2Way Divider (2W)
The 2 way divider is equipped with two 2‐way splitters in a single housing and the splitters work for
TX/RX signals, respectively.
Designed in broadband type, the divider combines and splits signals from/to the BIU
Figure 4.14 – 2Way Divider at a glance
4.2.5
ODU front/rear panel overview
1) Front panel
Figure 4.15 – ODU front panel view
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Item
1,2
Description
LED indicator to check for faulty DOU module.
2) Rear panel
Figure 4.16 – ODU Rear panel view
Item
Description
1. Optic Port
SC/APC optical connector terminal; use one optical cable per ROU.
2. DC I/O Port
Terminal for power and state values
3. RX RF Port
RX RF signal interface terminal
4. TX RF Port
TX RF signal interface terminal
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4.2.6
ODU Interface with BIU
SISO Configuration
MIMO Configuration
Figure 4.17 BIU/ODU interface
For SISO configuration, up to four ODUs can be stacked. above the top of the BIU.
For MIMO configuaration, up to eight ODUs can be stacked above/below the BIU.
In this case, it is recommended to leave a 1RU space between BIU and the ODUs otherwise heat from
BIU may degrade the performance of the ODUs,
Figure 4.18 – BIU/ODU Interface rear view
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As shown in the figure below, connect one coaxial cable for TX and another coaxial cable for RX with
corresponding ports at the rear of BIU. For power supply and communication, connect 25Pin D‐Sub
Connector cable to the corresponding port.
Figure 4.19 – BIU/ODU interface details
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4.3 OEU (Optic Expansion Unit)
OEU is mainly used to remotely deliver signals for Campus clusters. At the upper part, this unit
combines with ODU and receives TX optical signals to convert them into RF signals. Then, it
regenerates the signals to secure SNR and converts them into optical signals. The signals are sent to
ROU through optical cables. When it receives RX optical signals from ROU, the unit converts them
into RF signals to regenerate the signals and then converts them into optical signals to send them to
ODU.
In OEU, one shelf can be equipped with up to two DOUs. The DOU is the same as the module used
for ODU. Up to four OEUs can be connected with ODU.
Figure 4.20 – OEU at a glance
4.3.1
Specifications of OEU
Item
Spec.
Remark
Size
482.6(19”) x 88.1(2RU) x 450
mm
Weight
9.5 kg
Power consumption
40 W
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4.3.2
OEU block diagram
Figure 4.21 – OEU block diagram
4.3.3
OEU assemblies
Figure 4.22 – OEU internal view
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No.
Unit
Description
Remark
Donor Optic Unit
DOU
Convert TX RF signals into optical signals;
Convert RX optical signals into RF signals;
Max 2 ea.
Provide up to four optical ports per DOU
Expansion Wavelength Division Multiplexer
EWDM
Convert TX optical signals into RF signals;
Convert RX RF signals into optical signals;
Compensates for optical cable loss with ODU
Expansion Central Processor Unit
ECPU
Control and monitoring system status
Control and monitoring with RS232
Relays state values of ROU to BIU
EPSU
Expansion Power Supply Unit
Input power: DC ‐48V, Output power: 9V, 6V
Expansion Radio Frequency Module
ERFM
Regenerate TX signals and transmit FSK modem signals;
Regenerate RX signals and receive FSK modem signals
4.3.4
Shelf
19” rack, 2RU
Sub Assembly description
1) Donor Optic Unit (DOU)
The DOU is the same as the module used for the ODU.
Figure 4.23 – DOU at a glance
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2) Expansion Wavelength Division Multiplexer(EWDM)
EWDM module handles the optical to RF conversion of TX signals as well as the RF to optical
conversion of RX signals. This multiplexer communicates with the BIU using the built in FSK modem.
It also has an ATT to compensate for optical cable loss between ODUs.
Finally , it has internal WDM so it needs only one optical cable to work with an ROU.
Figure 4.24 – EWDM at a glance
3) Expansion Central Processor Unit(ECPU)
ECPU can query and control the state of modules installed into the OEU. This unit simultaneoulsy
communicates with the BIU and the ROUas well as acting as communication bridge between BIU and
ROU.
In addition, the unit has a USB port for local communication which enables query and control of
devices thorugh a PC. At the front panel, communication LED indicator indicates communication
with upper BIU and lower ROU. It also has an ALM LED indicator to show fault.
Figure 4.25 – ECPU at a glance
4) Expansion Radio Frequency Module(ERFM)
ERFM repairs Signal to Noise degraded by optical modules.
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Figure 4.26 – ERFM at a glance
5) Expansion Power Supply Unit(EPSU)
As DC/DC Converter, the EPSU receives ‐48VDC input and provides +9V and +6V of DC power
required for OEU.
Figure 4.27 – EPSU at a glance
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4.3.5
1)
OEU front/rear panel overview
Front panel
Figure 4.28 – OEU front panel view
Item
Description
1.EWDM LED
LED indicator to check EWDM state to see if it is abnormal
2.DOU LED
LED indicator to check DOU module state to see if it is abnormal
3.System LED and Reset
Communication state with devices, alarm status of the system and reset
switch
USB port for communication and diagnosis of devices through PC/laptop.
4. NMS(USB Port)
This equipment isfor indoor use only and all the communication wirings are
limited to indoor use as well.
2) Rear panel
Figure 4.29 – Rear panel view
Item
Description
1. GND Port
Terminal for system ground
2. DC Input Port
Input terminal for DC ‐48V
3.power switch
Power ON/OFF switch
4. To/From ODU Optic Port
SC/APC optical connector terminal
5. To/From ROU Optic Port
SC/APC optical connector terminal; use one optical cable per ROU.
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4.4 ROU (Remote Optic Unit)
The ROU consists of two units: the MRU(Main Remote Unit) and the ARU(Add on Remote Unit). The
ROU is considered the combination of MRU and ARU.
The MRU receives TX optical signals from the ODU or the OEU and converts them into RF signals.
The converted RF signals are amplified through a High Power Amp in a corresponding RU, combined
with the Multiplexer and transmitted out the antenna port.
The ROU receives RX signals through the antenna port, filters out‐of‐band signals in a corresponding
RU and sends the results to Remote Optic Module to make RF tooptical conversion of them. After
converted, the signals are sent to a upper device (theODU or OEU).
The MRU and ARU have a maximum of 2 bands.
The main difference between an MRU an ARU is the presence of an optical module .
(a) MRU
(b) ARU
Figure 4.30 – ROU at a glance
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4.4.1
ROU specifications
Item
Band
Band combination
Size
(W x H x D)
MRU 1900P+850C
Combination1 ARU 700LTE+AWS‐1
Band
MRU 1900P
Combination2 ARU 900I+800I
Band
Combination2
Band
200 x 300 x 140
Weight
Power
consumption
6.6kg
50W
6.8kg
40W
6.5kg
45W
6.7kg
44W
7.1kg
50W
mm
MRU 700LTE+AWS‐1
Remark
Full
load
To be developed
Combination4 To be developed
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4.4.2
ROU block diagram
4.4.2.1
Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1
MRU 1900PCS+850C
ARU 700LTE+AWS-1
From/To ODU
ON TXD RXD
V/UHF TX
EX_PORT
SC/APC
V/UHF RX
USB
(B type)
USB
(B type)
ON TXD RXD
WDM
Reset Opt
ALM
RCU
ALM
LD
PD
FSK TX
FSK RX
ARU TX
ARU RX
EX_PORT
Power/
Control/
Status
Power/
Control/
Status
AC/
DC
AC 120V
Or
DC -48V
Reset Opt
RCU
MRU TX
MRU RX
EX_PORT
AC/
DC
Or
AC 120V
Or
DC -48V
MRFM
Or
DC/
DC
ARFM
DC/
DC
Cavity Filter
LOW
LOW
HIGH
HIGH
Cavity Filter
ANT(N-Female)
Figure 4.31 – ROU block diagram for MRU 1900PCS+850C and ARU 700LTE+AWS‐1
4.4.2.2
Combination of MRU 1900PCS/ARU 900I+800I
1900P MRU
800I+900I ARU
From/To ODU
V/UHF RX
ON TXD RXD
ALM
EX_PORT
SC/APC
V/UHF TX
USB
(B type)
USB
(B type)
ON TXD RXD
WDM
ALM
Reset Opt
RCU
LD
PD
ARU TX
FSK TX
FSK RX
ARU RX
OPT SIU
MRU RX
EX_PORT
EX_PORT
Power/
Control/
Status
AC 120V
Or
DC -48V
Reset Opt
RCU
MRU TX
Power/
Control/
Status
AC/
DC
MRFM
Or
AC/
DC
AC 120V
Or
DC -48V
Or
DC/
DC
ARFM
DC/
DC
LOW
LOW
1900P
Cavity Filter
800I/900I
Cavity Filter
ANT(N-Female)
Figure 4.32 – ROU block diagram for MRU 1900PCS and ARU 900I+800I
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4.4.2.3
Combination of MRU 700LTE+AWS‐1
Figure 4.33 – ROU block diagram for MRU 700LTE+AWS‐1
4.4.2.4
Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1
(a) MRU 1900PCS+850C
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(b) ARU 700LTE+AWS‐1
Figure 4.34 – ROU internal view for MRU1900PCS+850C and ARU 700LTE+AWS‐1
4.4.2.5
Combination of MRU 1900PCS/ARU 900I+800I
OPTIC Port
BPF
MRFM
RCPU
RPSU
R-OPTIC
(a) MRU 1900PCS
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BPF
ARFM
RCPU
RPSU
(b) ARU 900I+800I
Figure 4.35 – ROU internal view for MRU 1900PCS and ARU 900I+800I
4.4.2.6
Combination of MRU 700LTE+AWS‐1
(a) MRU 700LTE+AWS‐1
Figure 4.36 – ROU internal view for MRU RU 900I+800I
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Unit
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Remark
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Main/Add on RF Module
MRFM/ARFM
Filter and heavy amplification of TX signals;
+BPF
Filter and amplify RX signals;
Remove other signals through BPF
Remote Power Supply Unit
RPSU
Input power: DC ‐48V or AC120V, Output power: 25V
For 120V input of AC/DC;
For ‐48V input of DC/DC
Remote Optic
Make RF conversion of TX optical signals;
R‐OPT
Convert RX RF signals into optical signals;
Compensates optical loss interval
Communicates with BIU or OEU though the FSK modem
Remote Central Processor Unit
RCPU
Controls signal of each unit
Monitors BIU/ODU/OEU status through FSK modem
communication
Enable Wall Mount;
Enclosure
Check if the system is normal, through the bottom panel
LED
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4.4.3
Sub Assembly description
1) Main RF Module/Add on RF Module (MRFM/ARFM)+BPF
When receiving TX signals from each band through R‐Opt, MRFM/AFRM filters the signals and
amplifies them with the High Power Ampifier. The unit also filters RX signals received through the
antenna port and amplifies them as low noise to send the signals to R‐Opt.
In the unit, there is an ATT to adjust gain. This device
varies for each frequency band, including the
following:
No
Combination
Unit naming
BPF
Description
Cavity Filter
Ceramic Filter
MRU1900P+850C
MRFM 1900P+850C
Dual.
1900PCS
850C
ARU700LTE+AWS‐1
ARFM 700LTE+AWS‐1
Dual.
700LTE
AWS‐1
MRU1900P
MRFM 1900P
Single
1900PCS
‐
ARU900I+800I
ARFM900I+800I
Dual
900IEN/800IDEN
‐
MRU700LTE+AWS‐1
MRU700LTE+AWS‐1
Dual.
700LTE
AWS‐1
To be developed
‐
‐
‐
‐
2) Remote Power Supply Unit (RPSU)
RPSU accepts ‐48VDC input. This unit is configured 2 ways: the DC/DC type outputs +25V of DC power
and AC/DC type takes 120V AC input and outputs +25V of DC power.
Please specify which type when ordering. MS Connector, which uses ports to receive inputs, is
designed for either AC and DC input configuration. The input cable is different depending on input
voltage conditions.
The RPSU doesn’t have a switch to turn the power ON/OFF. Unit is active when power is connected.
Here, you should check for range of input power as follows:
No.
Unit
Range of input power
AC/DC
90 to 264 VAC
DC/DC
‐42V to ‐56VDC
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(a)AC/DC
(b)DC/DC
Figure 4.37 – PSU at a glance
3) Remote Optic(R‐OPT)
The Remote Optic performs the optical to RF signal conversion as well as the RF to optical
conversion. With an FSK modem in it, the unit communicates with the other devices.
It also has an internal ATT to compensate for optical cable loss. The optical wavelength for TX path is
1310nmand 1550nm for the RX path. It is transported by a fiber strand using WDM(Wavelength
Division Multiplexing) technique
4) Remote Central Processor Unit (RCPU)
The RCPU can monitor and control the RU. This unit receives and analyzes upper communication
data from Remote Optic and reports the unit's own value to the upper devices. At the bottom of the
module, it has an LED indicator to show system status, letting you check any fault conditions. The
same panel also has communication LED Indicators to show communication status with upper
devices. Through the USB Port, the unit enables you to check and control device status through a PC
or laptop. This equipment is for indoor use only and all the communication wirings are limited to
indoor use as well.The RCPU of the MRU have two ports to connect exteranl devices (the ARU and
the VHF&UHF ARU). Using an external interface cable, the MRU can communicate with the
ARU/VHF&UHF ARU.
The MRU collects status information from ARU/VHF&UHF ARU and then communicates with the
upper device
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4.4.4
Bottom of ROU
1) Functions
(a) MRU
(b) ARU
Figure 4.38 – ROU Bottom view
Item
1. VHF/UHF ARU Port
2.LED PANEL
3. Power Port
4.ARU/MRU Port
5.GND LUG PORT
Description
Remark
Terminal for TX and RX RF ports of VHF and UHF
Terminal for signal port to interface with VHF and UHF
Visible LED indicator panel for checking fault status USB Port to
check and control device status through PC and laptop
AC 120V input port or DC‐48V input port
Terminal for TX and RX RF ports of MRU/ARU
Terminal for signal port to interface with MRU/ARU
Terminal for system ground
Power Port
A different type of power port is used supplying ‐48V DC or 120V AC, and specific power
cable should be applied to each different type of ROU power supply (AC/DC or DC/DC).
Below figure shows different power connectors.
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(a)AC/DC
(b)DC/DC
Figure 4.39 – ROU Power Port View
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4.4.5
4.4.5.1
Top of ROU
Combination of MRU1900PCS+850C/ARU700LTE+AWS‐1
RF PORT
RF PORT
ANT
Port
Optic Port
(a)MRU
(b)ARU
Figure 4.40 – ROU Top View for MRU 1900P+850C and ARU 700LTE+AWS‐1
4.4.5.2
Combination of MRU1900PCS+850C/ARU700LTE+AWS‐1
RF PORT
ANT
Port
RF PORT
Optic Port
(a)MRU
(b)ARU
Figure 4.41 – ROU Top View for MRU 1900P+850C and ARU 700LTE+AWS‐1
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Modify Date                     : 2013:01:09 14:02:23+09:00
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Title                           : Microsoft Word - SC-DAS Manual_installation_operation_Rev04_20130107_add SP.docx
Creator                         : 
Author                          : 
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